Wafer positioning device with adsorption fixing structure

Abstract

The invention provides a wafer positioning device with an adsorption fixing structure, and relates to the technical field of wafer processing. A through hole is formed in the positioning seat, a center screw rod is installed in the through hole through a nut, the nut is located below the positioning seat, a movable sleeve is movably arranged on the center screw rod, three sets of through grooves are formed in the positioning seat, hinge plates are hinged to the interiors of the three sets of through grooves, and three sets of first springs are installed between the movable sleeve and the positioning seat. The upper ends of the three groups of hinge plates are connected with the movable sleeve through pin shafts; according to the positioning device, the six groups of arc-shaped grooves in the arc-shaped array on the rotating disc and the embedded blocks, the mounting blocks and the suction cups matched with the arc-shaped grooves, so that the positioning device can adjust the positions of the suction cups by adjusting the positions of the embedded blocks in the arc-shaped grooves, and the positioning device can flexibly adapt to wafers of different sizes and specifications; and the stability of the rotating disc in the rotating process is guaranteed through the design of an auxiliary plate, a mounting screw rod and a stabilizing wheel between the positioning seat and the rotating disc.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer processing, and in particular to a wafer positioning device with an adsorption fixing structure. Background Art

[0002] In the complex and precise process system of semiconductor manufacturing, the coating and developing machine occupies an extremely critical position. It connects the important links before and after the photolithography process. Before photolithography, the photoresist needs to be evenly coated on the surface of the wafer with the help of a coating and developing machine. The coating quality of the photoresist is directly related to the accuracy of the subsequent photolithography pattern. After photolithography, the coating and developing machine must complete the development operation to remove the unexposed or exposed photoresist, so as to clearly present the photolithography pattern and lay the foundation for subsequent etching, ion implantation and other processes. It can be said that the accuracy and efficiency of the coating and developing machine are like the core components of precision instruments, which have a decisive influence on the quality and production efficiency of the chip. As the basic carrier of chip manufacturing, the wafer is like the cornerstone of building a high-rise building. During the entire coating and developing process, it must be accurately positioned and fixed to ensure that each step of the process operation is carried out accurately and without error. Therefore, a wafer positioning device with an adsorption and fixing structure is designed.

[0003] Existing wafer positioning devices cannot adjust the clamping force and position of the wafer through simple operations, making it difficult to achieve multi-directional precise positioning of the wafer, and difficult to adapt to wafers of different sizes through adjustment, which greatly limits the application scope of the coating and developing machine. Summary of the invention

[0004] The disclosed embodiment relates to a wafer positioning device with an adsorption fixing structure to solve the problems raised in the above-mentioned background technology.

[0005] In a first aspect of the present disclosure, there is provided a wafer positioning device with an adsorption fixing structure, specifically comprising: a positioning seat; The positioning seat is provided with a through hole, in which a center screw is installed through a nut, and the nut is located below the positioning seat, and a movable sleeve is movable on the center screw, and three groups of through grooves are provided on the positioning seat, and hinge plates are hinged in the three groups of through grooves, and three groups of No. 1 springs are installed between the movable sleeve and the positioning seat, and the upper ends of the three groups of hinge plates are connected to the movable sleeve through pin shafts, and three groups of hinge arms are hinged on the outer surface of the positioning seat, and the three groups of hinge arms are all arranged in an L-shaped structure, and the lower ends of the three groups of hinge plates are respectively in contact with the three groups of hinge arms, and the upper ends of the three groups of hinge plates are hinged with clamping heads, and conical grooves are provided on the clamping heads, and positioning plates are installed on the clamping heads, and threaded rods are welded on the positioning plates, and bevel gears are fixed on the threaded rods, and the bevel gears are meshed with the conical grooves, and No. 2 springs are sleeved on the threaded rods on the positioning plate, and a first positioning groove is horizontally provided on the positioning plate, and a second positioning groove is longitudinally provided on the positioning plate.

[0006] In at least some embodiments, The positioning seat is provided with a rotatable rotating disk which is an annular structure, an adjusting handle is fixed on the rotating disk, and an arc-shaped through groove is arranged on the positioning seat, the adjusting handle moves in the arc-shaped through groove, and the arc-shaped array on the rotating disk has six groups of arc-shaped grooves.

[0007] In at least some embodiments, Six groups of circular through holes are arranged on the positioning seat, and embedded blocks are movable in the six groups of arc-shaped grooves on the rotating disk, mounting blocks are installed on the upper ends of the six groups of embedded blocks by bolts, suction cups are fixed on the upper ends of the six groups of mounting blocks, and connecting rods are fixed on the six groups of mounting blocks, and the six groups of connecting rods are movable in the six groups of circular through holes on the positioning seat respectively.

[0008] In at least some embodiments, There are three groups of square through grooves in a circular array on the positioning seat, and auxiliary plates are installed in the three groups of square through grooves. Two groups of waist-shaped grooves are arranged on the auxiliary plates. The auxiliary plates are installed on the positioning seat by two groups of bolts, and the ends of the three groups of auxiliary plates close to the center of the positioning seat are installed with mounting screws through nuts. The lower ends of the three groups of mounting screws are installed with stabilizing wheels through bearings, and the three groups of stabilizing wheels are in contact with the inner wall surface of the rotating disk.

[0009] In at least some embodiments, Four groups of support columns are fixed to the lower end of the positioning seat, and a partition is fixed to the lower end of the four groups of support columns. A flip plate is arranged below the partition, and a center column is fixed to the lower end of the partition. A pulley is fixed on the center column, and the lower end of the center column is mounted on the flip plate through a bearing seat, and a No. 1 motor is mounted on the flip plate through bolts, and a pulley is fixed on the output shaft of the No. 1 motor, and a No. 1 belt is connected between the pulley on the output shaft of the No. 1 motor and the pulley on the center column.

[0010] In at least some embodiments, A No. 1 sliding plate is arranged below the flip plate, and a motor seat and a support plate are installed on the upper end of the No. 1 sliding plate by bolts. The flip plate is installed between the motor seat and the support plate by a bearing, and a No. 2 motor is installed on the motor seat by bolts, and the output shaft of the No. 2 motor is connected to the left end of the flip plate rotating shaft.

[0011] In at least some embodiments, A clamping seat is fixed to the lower end of the No. 1 sliding plate, and two groups of threaded holes are arranged on the clamping seat. A cross plate is arranged below the No. 1 sliding plate, and two groups of rail rods are installed on the cross plate by bolts. The No. 1 sliding plate slides on the two groups of rail rods, and a No. 3 motor is installed on the lower end of the cross plate by bolts.

[0012] In at least some embodiments, A pulley is fixed on the output shaft of the No. 3 motor, and a vertical rod is installed on the horizontal plate by bolts, a pulley is installed on the vertical rod through a bearing, a No. 2 belt is connected between the pulley on the output shaft of the No. 3 motor and the pulley on the vertical rod, and the clamping seat and the No. 2 belt are fixedly connected by bolts.

[0013] In at least some embodiments, A No. 2 sliding plate is fixed to the lower end of the horizontal plate, a threaded hole is arranged at the lower end of the No. 2 sliding plate, a base is arranged below the No. 2 sliding plate, the No. 2 sliding plate slides on the base, and a screw rod is installed on the base through a bearing, and the screw rod is threadedly matched with the threaded hole at the lower end of the No. 2 sliding plate.

[0014] In at least some embodiments, A No. 4 motor is installed on the base through bolts, the output shaft of the No. 4 motor is connected to the rear end of the screw rod, and four sets of casters are installed on the lower end of the base through bolts.

[0015] The present invention provides a wafer positioning device with an adsorption fixing structure, which has the following beneficial effects: In the present invention, through the coordinated action of the center screw, the movable sleeve, the hinged plate, the hinged arm and the clamping head, the multi-directional and precise positioning of the wafer can be achieved. The three groups of through grooves arranged on the positioning seat and the structure of the hinged plate and the hinged arm can control the compression state of the No. 1 spring by rotating the nut at the lower end of the center screw. Under the elastic force of the No. 1 spring, the movable sleeve drives the upper ends of the three groups of hinged plates to move upward. At this time, the lower ends of the three groups of hinged plates push the hinged arms to make the lower ends of the three groups of hinged arms expand outward, so that the upper ends of the three groups of hinged arms move closer to the center of the positioning seat, so as to achieve stable clamping of the wafer, especially the conical groove on the clamping head meshes with the bevel gear on the positioning plate, and cooperates with the first positioning groove and the second positioning groove, so as to accurately calibrate the wafer in the horizontal and vertical directions, which greatly improves the positioning accuracy, ensures uniform glue coating thickness and consistent development effect, and effectively improves the chip yield.

[0016] In addition, in the present invention, the six groups of arc-shaped grooves in the arc-shaped array on the rotating disk and the embedded blocks, mounting blocks and suction cups that match them enable the positioning device to adjust the position of the embedded blocks in the arc-shaped grooves, that is, to adjust the position of the suction cup, so as to flexibly adapt to wafers of different sizes and specifications. The design of the auxiliary plate, mounting screw and stabilizing wheel between the positioning seat and the rotating disk ensures the stability of the rotating disk during rotation.

[0017] In addition, in the present invention, the auxiliary plate, mounting screw and stabilizing wheel are designed between the positioning seat and the rotating disk, thereby ensuring the stability of the rotating disk during the rotation process and reducing the friction and wear between the components. At the same time, bolts, nuts, pins and other connection methods are used between the components, and the connection is firm. During the frequent loading and unloading of wafers, it is not easy to loosen, which significantly enhances the stability and service life of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solution of the embodiment of the present invention, the drawings of the embodiment are briefly introduced below.

[0019] The drawings described below are only related to some embodiments of the present invention, but are not intended to limit the present invention.

[0020] In the attached picture: Figure 1 A schematic diagram showing the overall structure of a wafer positioning device with an adsorption fixing structure of the present application is shown; Figure 2 A schematic structural diagram of the bottom portion of a first sliding plate of a wafer positioning device with an adsorption fixing structure of the present application is shown; Figure 3 The present invention shows a wafer positioning device with an adsorption fixing structure. Figure 1 A schematic diagram of the enlarged structure of part A; Figure 4 A schematic structural diagram of a flip plate portion of a wafer positioning device with an adsorption fixing structure of the present application is shown; Figure 5 A schematic structural diagram of a positioning seat portion of a wafer positioning device with an adsorption fixing structure of the present application is shown; Figure 6 The present invention shows a wafer positioning device with an adsorption fixing structure. Figure 5 A schematic diagram of the enlarged structure of part B; Figure 7 A schematic structural diagram of a hinged plate portion of a wafer positioning device with an adsorption fixing structure of the present application is shown; Figure 8 A schematic structural diagram of a clamping head portion of a wafer positioning device with an adsorption fixing structure of the present application is shown; Fig. 9 A schematic structural diagram of an auxiliary plate portion of a wafer positioning device with an adsorption fixing structure of the present application is shown; Fig.10 A schematic structural diagram of a mounting block portion of a wafer positioning device with an adsorption fixing structure of the present application is shown.

[0021] Reference numerals list 1. Base; 11. Casters; 12. Screw; 121. No. 4 motor; 13. No. 2 sliding plate; 14. Horizontal plate; 141. No. 3 motor; 142. Vertical rod; 143. No. 2 belt; 144. Rail rod; 145. No. 1 sliding plate; 1451. Clamping seat; 146. Support plate; 147. Motor seat; 1471. No. 2 motor; 15. Turning plate; 151. No. 1 motor; 152. Partition plate; 1521. Center column; 1522. No. 1 belt; 2. Positioning seat; 21. Center screw; 22. Movable sleeve; 221. Spring No. 1; 222. Hinge plate; 223. Articulated arm; 23. Clamping head; 231. Conical groove; 24. Positioning plate; 241. Bevel gear; 242. Spring No. 2; 243. First positioning groove; 244. Second positioning groove; 25. Rotating plate; 251. Adjusting handle; 252. Arc groove; 253. Mounting block; 2531. Connecting rod; 2532. Embedded block; 2533. Suction cup; 26. Auxiliary plate; 261. Mounting screw; 262. Stabilizing wheel; 27. Support column; 28. Arc through groove. DETAILED DESCRIPTION

[0022] In order to make the purpose, technical solution and advantages of the embodiment of the present invention clearer, the technical solution of the embodiment of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiment of the present invention. Obviously, the described embodiment is a part of the embodiment of the present invention, not all of the embodiments. Based on the described embodiment of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0023] Example 1: Please refer to Figures 1 to 10 : The present invention proposes a wafer positioning device with an adsorption fixing structure, comprising: a positioning seat 2; The positioning seat 2 is provided with a through hole, in which a central screw 21 is installed through a nut, the nut is located below the positioning seat 2, a movable sleeve 22 is movable on the central screw 21, and three groups of through grooves are provided on the positioning seat 2, and hinge plates 222 are hinged in the three groups of through grooves, and three groups of No. 1 springs 221 are installed between the movable sleeve 22 and the positioning seat 2, and the upper ends of the three groups of hinge plates 222 are connected to the movable sleeve 22 through pins, and the outer surface of the positioning seat 2 is hinged with three groups of hinged arms 223, and the three groups of hinged arms 223 are all set to L-shaped structures. The lower ends of the plates 222 are in contact with the three sets of hinged arms 223 respectively. The upper ends of the three sets of hinged plates 222 are hinged with clamping heads 23, on which conical grooves 231 are arranged, and a positioning plate 24 is installed on the clamping head 23. A threaded rod is welded on the positioning plate 24, on which a bevel gear 241 is fixed, which meshes with the conical groove 231, and a No. 2 spring 242 is sleeved on the threaded rod on the positioning plate 24. A first positioning groove 243 is arranged horizontally on the positioning plate 24, and a second positioning groove 244 is arranged longitudinally on the positioning plate 24.

[0024] In the present disclosure, A rotatable rotating disk 25 is installed on the positioning seat 2. The rotating disk 25 is an annular structure. An adjusting handle 251 is fixed on the rotating disk 25. An arc-shaped through groove 28 is provided on the positioning seat 2. The adjusting handle 251 moves in the arc-shaped through groove 28. There are six groups of arc-shaped grooves 252 in an arc-shaped array on the rotating disk 25. Six groups of circular through holes are provided on the positioning seat 2. Embedded blocks 2532 are movable in the six groups of arc-shaped grooves 252 on the rotating disk 25. The upper ends of the six groups of embedded blocks 2532 are all installed with mounting blocks 253 by bolts. Suction cups 2533 are fixed on the upper ends of the six groups of mounting blocks 253. 3 are all fixed with connecting rods 2531, and the six groups of connecting rods 2531 are respectively movable in the six groups of circular through holes on the positioning seat 2, and their functions are: the operator can flexibly adjust the position of the suction cup 2533 by rotating the rotating disk 25. When facing wafers of different shapes and different placement requirements, the rotating disk 25 can be rotated to accurately position them, which greatly improves the flexibility of positioning. The connecting rods 2531 cooperate with the circular through holes on the positioning seat 2. During the rotation of the rotating disk 25, they can play a good supporting and guiding role on the mounting block 253 and the suction cup 2533, further enhancing the stability of wafer fixation.

[0025] In the present disclosure, There are three groups of square through grooves in a circular array on the positioning seat 2, and auxiliary plates 26 are installed in the three groups of square through grooves. Two groups of waist-shaped grooves are provided on the auxiliary plates 26. The auxiliary plates 26 are installed on the positioning seat 2 by two groups of bolts, and the ends of the three groups of auxiliary plates 26 close to the center of the positioning seat 2 are installed with mounting screws 261 through nuts. The lower ends of the three groups of mounting screws 261 are installed with stabilizing wheels 262 through bearings. The three groups of stabilizing wheels 262 are in contact with the inner wall surface of the rotating disk 25. Their function is: when the rotating disk 25 is rotating, the stabilizing wheels 262 are in contact with the inner wall surface of the rotating disk 25, which effectively prevents the rotating disk 25 from shaking or deflecting, thereby ensuring the smoothness of rotation.

[0026] Embodiment 2, based on embodiment 1, Four groups of support columns 27 are fixed to the lower end of the positioning seat 2, and a partition 152 is fixed to the lower end of the four groups of support columns 27. A flip plate 15 is arranged below the partition 152, and a center column 1521 is fixed to the lower end of the partition 152. A pulley is fixed on the center column 1521, and the lower end of the center column 1521 is installed on the flip plate 15 through a bearing seat. A No. 1 motor 151 is installed on the flip plate 15 by bolts, and a pulley is fixed on the output shaft of the No. 1 motor 151. A No. 1 belt 1522 is connected between the pulley on the output shaft of the No. 1 motor 151 and the pulley on the center column 1521. A No. 1 sliding plate 145 is arranged below the flip plate 15. The upper end of the No. 1 sliding plate 145 is installed with a motor base 147 and a support plate 146 by bolts, and the flip plate 15 is installed between the motor base 147 and the support plate 146 by bearings. The No. 2 motor 1471 is installed on the motor base 147 by bolts, and the output shaft of the No. 2 motor 1471 is connected to the left end of the rotating shaft of the flip plate 15. Its function is: through the cooperation of the No. 1 motor 151, the center column 1521 and the No. 1 belt 1522, it can drive the partition 152 and the positioning seat 2 to flip around the axis of the center column 1521, and then combine with the No. 2 motor 1471 to drive the flip plate 15 to rotate, so that the positioning seat 2 and the wafer thereon can be flipped at multiple angles.

[0027] Embodiment 3, based on Embodiment 1 and Embodiment 2, A clamping seat 1451 is fixed to the lower end of the No. 1 sliding plate 145, and two groups of threaded holes are arranged on the clamping seat 1451. A horizontal plate 14 is arranged below the No. 1 sliding plate 145, and two groups of rail rods 144 are installed on the horizontal plate 14 by bolts. The No. 1 sliding plate 145 slides on the two groups of rail rods 144, and a No. 3 motor 141 is installed on the lower end of the horizontal plate 14 by bolts, and a pulley is fixed on the output shaft of the No. 3 motor 141, and a vertical rod 142 is installed on the horizontal plate 14 by bolts, and a pulley is installed on the vertical rod 142 through a bearing, and a No. 2 belt 143 is connected between the pulley on the output shaft of the No. 3 motor 141 and the pulley on the vertical rod 142, and the clamping seat 1451 and the No. 2 belt 143 are fixedly connected by bolts, and a No. 2 sliding plate 13 is fixed to the lower end of the horizontal plate 14, and the lower end of the No. 2 sliding plate 13 is provided with A threaded hole, a base 1 is arranged below the No. 2 sliding plate 13, the No. 2 sliding plate 13 slides on the base 1, and a screw rod 12 is installed on the base 1 through a bearing, the screw rod 12 is threadedly matched with the threaded hole at the lower end of the No. 2 sliding plate 13, a No. 4 motor 121 is installed on the base 1 through bolts, the output shaft of the No. 4 motor 121 is connected to the rear end of the screw rod 12, and four sets of casters 11 are installed on the lower end of the base 1 through bolts, and their functions are: the No. 3 motor 141 drives the clamping seat 1451 and the No. 1 sliding plate 145 to slide on the rail rod 144 of the cross plate 14 through the pulley and the No. 2 belt 143, thereby realizing the precise displacement control of the positioning device in the horizontal direction, and when the No. 4 motor 121 is driven, its output shaft drives the screw to rotate, and the screw nut moves accordingly, thereby driving the No. 2 sliding plate 13 to move forward and backward along the guide rail.

[0028] The working principle of this embodiment is as follows: first, place the wafer on the positioning seat 2, rotate the rotating disk 25, and then flexibly adjust the position of the suction cup 2533, and use the suction cup 2533 to adsorb the bottom of the wafer to complete the initial fixed positioning of the wafer, rotate the nut at the lower end of the central screw 21, and adjust the compression state of the No. 1 spring 221. Under the elastic force of the No. 1 spring 221, the movable sleeve 22 drives the upper ends of the three groups of hinged plates 222 to move upward, and the lower end of the hinged plate 222 pushes the hinged arm 223, so that the lower end of the hinged arm 223 The end expands outward, and the upper end moves toward the center of the positioning seat 2. At this time, the conical groove 231 on the clamping head 23 and the bevel gear 241 on the positioning plate 24 are meshed with each other, and cooperate with the first positioning groove 243 and the second positioning groove 244 on the positioning plate 24 to accurately calibrate and clamp the wafer in the horizontal and vertical directions, further ensuring the accurate positioning of the wafer and completing the stable fixation of the wafer. When it is necessary to move the positioning device in the horizontal direction, start the No. 3 motor 141, and the pulley on the output shaft of the No. 3 motor 141 passes through the No. 2 belt 14 3 drives the pulley on the vertical rod 142 to rotate, thereby driving the clamping seat 1451 and the first sliding plate 145 to slide on the rail rod 144 of the horizontal plate 14, realizing the precise displacement of the positioning device in the horizontal direction, and the wafer can be transferred to different processing stations. If the displacement adjustment in the front and rear directions is to be realized, the fourth motor 121 is driven, and the output shaft of the fourth motor 121 drives the lead screw connected thereto to rotate, and the lead screw nut is fixed to the second sliding plate 13, and the lead screw nut moves with the rotation of the lead screw, thereby driving the second sliding plate 13 to move along the bottom The guide rail on the seat 1 moves forward and backward to achieve position adjustment in the forward and backward directions. When performing the flipping operation, the No. 1 motor 151 and the No. 2 motor 1471 work together. The pulley on the output shaft of the No. 1 motor 151 drives the pulley on the center column 1521 to rotate through the No. 1 belt 1522, so that the center column 1521 rotates, and then drives the partition 152 and the positioning seat 2 to flip around the axis of the center column 1521. At the same time, the No. 2 motor 1471 drives the flip plate 15 to rotate, thereby jointly realizing multi-angle flipping of the positioning seat 2 and the wafer.

[0029] In this article, there are a few points to note: 1. The drawings of the embodiments of the present disclosure only involve structures related to the embodiments of the present disclosure, and other structures may refer to general designs.

[0030] 2. In the absence of conflict, the embodiments of the present disclosure and the features therein may be combined with each other to obtain new embodiments.

[0031] The above are only specific implementation methods of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present disclosure, which should be covered by the protection scope of the present disclosure.

Claims

1. A wafer positioning device with an adsorption fixing structure, comprising: The positioning seat (2) is characterized in that: The positioning seat (2) is provided with a through hole, in which a central screw (21) is installed via a nut, the nut being located below the positioning seat (2), a movable sleeve (22) being movable on the central screw (21), the positioning seat (2) being provided with three groups of through slots, in which hinged plates (222) are hingedly connected, three groups of No. 1 springs (221) are installed between the movable sleeve (22) and the positioning seat (2), and the upper ends of the three groups of hinged plates (222) are connected to the movable sleeve (22) via pins, the outer surface of the positioning seat (2) is hinged with three groups of hinged arms (223), the three groups of hinged arms (223) are all arranged in an L-shaped structure, and the three groups of hinged plates (221) are hingedly connected to the movable sleeve (22) and the positioning seat (2). The lower ends of the hinge plates (222) are respectively in contact with the three sets of hinged arms (223), the upper ends of the three sets of hinged plates (222) are hinged with a clamping head (23), the clamping head (23) is provided with a conical groove (231), and a positioning plate (24) is installed on the clamping head (23), a threaded rod is welded on the positioning plate (24), a bevel gear (241) is fixed on the threaded rod, the bevel gear (241) is meshed with the conical groove (231), a second spring (242) is sleeved on the threaded rod on the positioning plate (24), a first positioning groove (243) is transversely provided on the positioning plate (24), and a second positioning groove (244) is longitudinally provided on the positioning plate (24).

2. The wafer positioning device with an adsorption fixing structure according to claim 1, characterized in that: A rotatable rotating disk (25) is mounted on the positioning seat (2). The rotating disk (25) is an annular structure. An adjusting handle (251) is fixed on the rotating disk (25). An arc-shaped through groove (28) is provided on the positioning seat (2). The adjusting handle (251) moves in the arc-shaped through groove (28). The rotating disk (25) has six groups of arc-shaped grooves (252) in an arc array.

3. The wafer positioning device with an adsorption fixing structure according to claim 2, characterized in that: The positioning seat (2) is provided with six groups of circular through holes, and each of the six groups of arc-shaped grooves (252) on the rotating disk (25) has an embedded block (2532) movably disposed therein, and each of the upper ends of the six groups of embedded blocks (2532) is provided with a mounting block (253) mounted thereon via bolts, and each of the upper ends of the six groups of mounting blocks (253) is provided with a suction cup (2533) fixed thereto, and each of the six groups of mounting blocks (253) is provided with a connecting rod (2531) fixed thereto, and the six groups of connecting rods (2531) are respectively movably disposed in the six groups of circular through holes on the positioning seat (2).

4. The wafer positioning device with an adsorption fixing structure according to claim 3, characterized in that: The positioning seat (2) has three groups of square through grooves in an annular array, and auxiliary plates (26) are installed in the three groups of square through grooves. The auxiliary plates (26) are provided with two groups of waist-shaped grooves. The auxiliary plates (26) are installed on the positioning seat (2) by means of two groups of bolts, and the ends of the three groups of auxiliary plates (26) close to the center of the positioning seat (2) are all installed with mounting screws (261) through nuts, and the lower ends of the three groups of mounting screws (261) are all installed with stabilizing wheels (262) through bearings, and the three groups of stabilizing wheels (262) are all in contact with the inner wall surface of the rotating disk (25).

5. The wafer positioning device with an adsorption fixing structure according to claim 4, characterized in that: Four groups of support columns (27) are fixed to the lower end of the positioning seat (2), a partition (152) is fixed to the lower end of the four groups of support columns (27), a flip plate (15) is arranged below the partition (152), a center column (1521) is fixed to the lower end of the partition (152), a belt pulley is fixed on the center column (1521), and the lower end of the center column (1521) is mounted on the flip plate (15) through a bearing seat, a No. 1 motor (151) is mounted on the flip plate (15) through bolts, a belt pulley is fixed to the output shaft of the No. 1 motor (151), and a No. 1 belt (1522) is connected between the belt pulley on the output shaft of the No. 1 motor (151) and the belt pulley on the center column (1521).

6. The wafer positioning device with an adsorption fixing structure according to claim 5, characterized in that: A first sliding plate (145) is provided below the flip plate (15); a motor seat (147) and a support plate (146) are installed on the upper end of the first sliding plate (145) by means of bolts; the flip plate (15) is installed between the motor seat (147) and the support plate (146) by means of a bearing; a second motor (1471) is installed on the motor seat (147) by means of bolts; and an output shaft of the second motor (1471) is connected to the left end of the rotating shaft of the flip plate (15).

7. The wafer positioning device with an adsorption fixing structure according to claim 6, characterized in that: A clamping seat (1451) is fixed to the lower end of the No. 1 sliding plate (145), and two groups of threaded holes are arranged on the clamping seat (1451). A transverse plate (14) is arranged below the No. 1 sliding plate (145), and two groups of rail rods (144) are installed on the transverse plate (14) by bolts. The No. 1 sliding plate (145) slides on the two groups of rail rods (144), and a No. 3 motor (141) is installed on the lower end of the transverse plate (14) by bolts.

8. The wafer positioning device with an adsorption fixing structure according to claim 7, characterized in that: A pulley is fixed on the output shaft of the No. 3 motor (141), and a vertical rod (142) is installed on the horizontal plate (14) via bolts, and a pulley is installed on the vertical rod (142) via a bearing, a No. 2 belt (143) is connected between the pulley on the output shaft of the No. 3 motor (141) and the pulley on the vertical rod (142), and the clamping seat (1451) and the No. 2 belt (143) are fixedly connected via bolts.

9. The wafer positioning device with an adsorption fixing structure according to claim 8, characterized in that: A second sliding plate (13) is fixed to the lower end of the horizontal plate (14), a threaded hole is provided at the lower end of the second sliding plate (13), a base (1) is provided below the second sliding plate (13), the second sliding plate (13) slides on the base (1), and a screw rod (12) is installed on the base (1) via a bearing, and the screw rod (12) is threadedly matched with the threaded hole at the lower end of the second sliding plate (13).

10. The wafer positioning device with an adsorption fixing structure according to claim 9, characterized in that: A No. 4 motor (121) is mounted on the base (1) via bolts, the output shaft of the No. 4 motor (121) is connected to the rear end of the screw rod (12), and four sets of casters (11) are mounted on the lower end of the base (1) via bolts.

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