Wafer positioning device with adsorption fixing structure

Abstract

The present invention provides a wafer positioning device with an adsorption and fixing structure, which relates to the field of wafer processing technology, including: a positioning seat; a through hole is provided on the positioning seat, and a central screw is installed in the through hole through a nut, the nut is located below the positioning seat, and a movable sleeve is movable on the central screw, and three groups of through grooves are provided on the positioning seat, and hinge plates are hinged in the three groups of through grooves, and three groups of No. 1 springs are installed between the movable sleeve and the positioning seat, and the upper ends of the three groups of hinge plates are connected to the movable sleeve through pins; in the present invention, the six groups of arc grooves in the arc array on the rotating disk and the embedded blocks, mounting blocks and suction cups matched therewith enable the positioning device to adjust the position of the suction cup by adjusting the position of the embedded blocks in the arc grooves, that is, to flexibly adapt to wafers of different sizes and specifications, and the design of the auxiliary plate, mounting screw and stabilizing wheel between the positioning seat and the rotating disk ensures the stability of the rotating disk during rotation.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer processing, and in particular to a wafer positioning device with an adsorption fixing structure. Background Art

[0002] In the complex and precise semiconductor manufacturing process, the photoresist coater and developer plays a crucial role, connecting the key steps before and after the photolithography process. Before photolithography, the photoresist coater and developer are required to evenly coat the wafer surface with photoresist. The quality of the coating directly affects the accuracy of the subsequent photolithography pattern. After photolithography, the photoresist coater and developer are used to develop the photoresist, removing any exposed or unexposed portions. This allows for a clear image of the photolithography pattern, paving the way for subsequent processes like etching and ion implantation. The accuracy and efficiency of the photoresist coater and developer, like the core components of a precision instrument, play a crucial role in chip quality and production efficiency. The wafer, the fundamental carrier of chip manufacturing, is like the cornerstone of a high-rise building. Throughout the photoresist coating and development process, it must be precisely positioned and secured to ensure that each process step is carried out with precision and accuracy. Therefore, a wafer positioning device with an adsorption and fixation structure was designed.

[0003] Existing wafer positioning devices cannot adjust the clamping force and position of the wafer through simple operations, making it difficult to achieve multi-directional precise positioning of the wafer, and difficult to adapt to wafers of different sizes through adjustment, which greatly limits the application scope of the coating and developing machine. Summary of the Invention

[0004] The embodiments of the present disclosure relate to a wafer positioning device with an adsorption fixing structure to solve the problems raised in the above-mentioned background technology.

[0005] In a first aspect of the present disclosure, a wafer positioning device with an adsorption fixing structure is provided, specifically comprising: a positioning seat;

[0006] The cam is provided with a through hole in the positioning seat, and a center screw is installed in the through hole through a nut. The nut is located below the positioning seat, and a movable sleeve is movable on the center screw. Three groups of through slots are provided on the positioning seat, and hinge plates are hinged in the three groups of through slots. Three groups of No. 1 springs are installed between the movable sleeve and the positioning seat, and the upper ends of the three groups of hinge plates are connected to the movable sleeves through pin shafts. The outer surface of the positioning seat is hinged with three groups of hinge arms, and the three groups of hinge arms are all arranged in an L-shaped structure. The lower ends of the three groups of hinge plates are respectively in contact with the three groups of hinge arms. The upper ends of the three groups of hinge plates are hinged with clamping heads, and conical grooves are provided on the clamping heads, and positioning plates are installed on the clamping heads. A threaded rod is welded on the positioning plate, and a bevel gear is fixed on the threaded rod. The bevel gear is meshed with the conical groove. A No. 2 spring is sleeved on the threaded rod on the positioning plate, and a first positioning groove is horizontally provided on the positioning plate, and a second positioning groove is longitudinally provided on the positioning plate.

[0007] In at least some embodiments,

[0008] A rotatable rotating disk is installed on the positioning seat. The rotating disk is an annular structure. An adjusting handle is fixed on the rotating disk. An arc-shaped through groove is provided on the positioning seat. The adjusting handle moves in the arc-shaped through groove. There are six groups of arc-shaped grooves in the arc array on the rotating disk.

[0009] In at least some embodiments,

[0010] Six groups of circular through holes are provided on the positioning seat, and embedded blocks are movable in the six groups of arc-shaped grooves on the rotating disk. The upper ends of the six groups of embedded blocks are installed with mounting blocks by bolts. The upper ends of the six groups of mounting blocks are fixed with suction cups, and the six groups of mounting blocks are fixed with connecting rods, which respectively move in the six groups of circular through holes on the positioning seat.

[0011] In at least some embodiments,

[0012] There are three groups of square through grooves in a circular array on the positioning seat, and auxiliary plates are installed in the three groups of square through grooves. Two groups of waist-shaped grooves are provided on the auxiliary plates. The auxiliary plates are installed on the positioning seat by two groups of bolts, and the ends of the three groups of auxiliary plates close to the center of the positioning seat are installed with mounting screws through nuts. The lower ends of the three groups of mounting screws are installed with stabilizing wheels through bearings, and the three groups of stabilizing wheels are in contact with the inner wall surface of the rotating disk.

[0013] In at least some embodiments,

[0014] Four groups of support columns are fixed to the lower end of the positioning seat, and a partition is fixed to the lower end of the four groups of support columns. A flip plate is provided below the partition, and a center column is fixed to the lower end of the partition. A pulley is fixed on the center column, and the lower end of the center column is mounted on the flip plate through a bearing seat, and a No. 1 motor is mounted on the flip plate through bolts, and a pulley is fixed on the output shaft of the No. 1 motor, and a No. 1 belt is connected between the pulley on the output shaft of the No. 1 motor and the pulley on the center column.

[0015] In at least some embodiments,

[0016] A No. 1 sliding plate is provided below the flip plate, and a motor seat and a support plate are installed on the upper end of the No. 1 sliding plate by bolts. The flip plate is installed between the motor seat and the support plate by a bearing, and a No. 2 motor is installed on the motor seat by bolts. The output shaft of the No. 2 motor is connected to the left end of the flip plate rotating shaft.

[0017] In at least some embodiments,

[0018] A clamping seat is fixed to the lower end of the No. 1 sliding plate, and two groups of threaded holes are provided on the clamping seat. A cross plate is provided below the No. 1 sliding plate, and two groups of rail rods are installed on the cross plate by bolts. The No. 1 sliding plate slides on the two groups of rail rods, and a No. 3 motor is installed on the lower end of the cross plate by bolts.

[0019] In at least some embodiments,

[0020] A pulley is fixed on the output shaft of the No. 3 motor, and a vertical rod is installed on the horizontal plate through bolts, and a pulley is installed on the vertical rod through a bearing. A No. 2 belt is connected between the pulley on the output shaft of the No. 3 motor and the pulley on the vertical rod, and the clamping seat and the No. 2 belt are fixedly connected by bolts.

[0021] In at least some embodiments,

[0022] A No. 2 sliding plate is fixed to the lower end of the horizontal plate, a threaded hole is provided at the lower end of the No. 2 sliding plate, a base is provided below the No. 2 sliding plate, the No. 2 sliding plate slides on the base, and a screw rod is installed on the base through a bearing, and the screw rod is threadedly matched with the threaded hole at the lower end of the No. 2 sliding plate.

[0023] In at least some embodiments,

[0024] A No. 4 motor is mounted on the base via bolts, the output shaft of the No. 4 motor is connected to the rear end of the lead screw, and four sets of casters are mounted on the lower end of the base via bolts.

[0025] The present invention provides a wafer positioning device with an adsorption fixing structure, which has the following beneficial effects:

[0026] In the present invention, through the coordinated action of the central screw, movable sleeve, hinged plate, hinged arm and clamping head, multi-directional and precise positioning of the wafer can be achieved. The three groups of through grooves and the structure of the hinged plate and hinged arm arranged on the positioning seat can control the compression state of the No. 1 spring by rotating the nut at the lower end of the central screw. Under the elastic force of the No. 1 spring, the movable sleeve drives the upper ends of the three groups of hinged plates to move upward. At this time, the lower ends of the three groups of hinged plates push the hinged arms, causing the lower ends of the three groups of hinged arms to expand outward, so that the upper ends of the three groups of hinged arms move closer to the center of the positioning seat, thereby achieving stable clamping of the wafer, especially the conical groove on the clamping head and the bevel gear on the positioning plate engage with each other, and cooperate with the first positioning groove and the second positioning groove to accurately calibrate the wafer in the horizontal and vertical directions, greatly improving the positioning accuracy, ensuring uniform glue coating thickness and consistent development effect, and effectively improving the chip yield.

[0027] In addition, in the present invention, the six groups of arc-shaped grooves in the arc-shaped array on the rotating disk and the embedded blocks, mounting blocks and suction cups that match them enable the positioning device to adjust the position of the suction cup by adjusting the position of the embedded blocks in the arc-shaped grooves, thereby flexibly adapting to wafers of different sizes and specifications. The design of the auxiliary plate, mounting screw and stabilizing wheel between the positioning seat and the rotating disk ensures the stability of the rotating disk during rotation.

[0028] In addition, in the present invention, the design of the auxiliary plate, mounting screw and stabilizing wheel between the positioning seat and the rotating disk ensures the stability of the rotating disk during the rotation process, reduces the friction and wear between the components, and at the same time, the components are connected by bolts, nuts, pins and other connection methods, and the connection is firm. During the frequent loading and unloading of wafers, it is not easy to loosen, which significantly enhances the stability and service life of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings of the embodiments are briefly introduced below.

[0030] The drawings described below only relate to some embodiments of the present invention, but are not intended to limit the present invention.

[0031] In the attached figure:

[0032] Figure 1 A schematic diagram showing the overall structure of a wafer positioning device with an adsorption fixing structure of the present application is shown;

[0033] Figure 2 A schematic structural diagram of the bottom portion of a first sliding plate of a wafer positioning device with an adsorption fixing structure according to the present application is shown;

[0034] Figure 3 The present invention shows a wafer positioning device with an adsorption fixing structure. Figure 1 Schematic diagram of the enlarged structure of part A;

[0035] Figure 4 A schematic structural diagram of a flip plate portion of a wafer positioning device with an adsorption fixing structure according to the present application is shown;

[0036] Figure 5 A schematic structural diagram of a positioning seat portion of a wafer positioning device with an adsorption fixing structure according to the present application is shown;

[0037] Figure 6 The present invention shows a wafer positioning device with an adsorption fixing structure. Figure 5 Schematic diagram of the enlarged structure of part B;

[0038] Figure 7A schematic structural diagram of a hinged plate portion of a wafer positioning device with an adsorption fixing structure according to the present invention is shown;

[0039] Figure 8 A schematic structural diagram of a clamping head portion of a wafer positioning device with an adsorption fixing structure according to the present application is shown;

[0040] Figure 9 A schematic structural diagram of an auxiliary plate portion of a wafer positioning device with an adsorption fixing structure according to the present application is shown;

[0041] Figure 10 A schematic structural diagram of a mounting block portion of a wafer positioning device with an adsorption fixing structure of the present application is shown.

[0042] Reference Signs List

[0043] 1. Base; 11. Casters; 12. Screw; 121. Motor No. 4; 13. Sliding plate No. 2; 14. Horizontal plate; 141. Motor No. 3; 142. Vertical rod; 143. Belt No. 2; 144. Rail; 145. Sliding plate No. 1; 1451. Clamping seat; 146. Support plate; 147. Motor base; 1471. Motor No. 2; 15. Flip plate; 151. Motor No. 1; 152. Partition; 1521. Center column; 1522. Belt No. 1.

[0044] 2. Positioning seat; 21. Center screw; 22. Movable sleeve; 221. Spring No. 1; 222. Hinge plate; 223. Articulated arm; 23. Clamping head; 231. Conical groove; 24. Positioning plate; 241. Bevel gear; 242. Spring No. 2; 243. First positioning groove; 244. Second positioning groove; 25. Rotating disk; 251. Adjusting handle; 252. Arc groove; 253. Mounting block; 2531. Connecting rod; 2532. Embedded block; 2533. Suction cup; 26. Auxiliary plate; 261. Mounting screw; 262. Stabilizing wheel; 27. Support column; 28. Arc through groove. DETAILED DESCRIPTION

[0045] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the described embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0046] Example 1: Please refer to Figures 1 to 10 :

[0047] The present invention proposes a wafer positioning device with an adsorption fixing structure, comprising: a positioning seat 2;

[0048] The positioning seat 2 is provided with a through hole, and a central screw 21 is installed in the through hole through a nut. The nut is located below the positioning seat 2. A movable sleeve 22 is movable on the central screw 21. The positioning seat 2 is provided with three groups of through slots. The three groups of through slots are hinged with hinge plates 222. Three groups of No. 1 springs 221 are installed between the movable sleeve 22 and the positioning seat 2, and the upper ends of the three groups of hinge plates 222 are connected to the movable sleeve 22 through pins. The outer surface of the positioning seat 2 is hinged with three groups of hinged arms 223. The three groups of hinged arms 223 are all set to L-shaped structures. The three groups of hinges The lower end of the plate 222 contacts the three groups of hinged arms 223 respectively. The upper ends of the three groups of hinged plates 222 are hinged with a clamping head 23. The clamping head 23 is provided with a conical groove 231, and a positioning plate 24 is installed on the clamping head 23. A threaded rod is welded on the positioning plate 24, and a bevel gear 241 is fixed on the threaded rod. The bevel gear 241 is engaged with the conical groove 231. A No. 2 spring 242 is sleeved on the threaded rod on the positioning plate 24. A first positioning groove 243 is horizontally provided on the positioning plate 24, and a second positioning groove 244 is longitudinally provided on the positioning plate 24.

[0049] In the embodiment of the present disclosure,

[0050] The positioning seat 2 is provided with a rotatable rotating disk 25, which is an annular structure. An adjusting handle 251 is fixed on the rotating disk 25, and an arc-shaped through groove 28 is provided on the positioning seat 2. The adjusting handle 251 moves in the arc-shaped through groove 28. There are six groups of arc-shaped grooves 252 in the arc array on the rotating disk 25. The positioning seat 2 is provided with six groups of circular through holes, and the six groups of arc-shaped grooves 252 on the rotating disk 25 are all movable with embedded blocks 2532. The upper ends of the six groups of embedded blocks 2532 are all fixed with mounting blocks 253 by bolts. The upper ends of the six groups of mounting blocks 253 are all fixed with suction cups 2533, and the six groups of mounting blocks 25 3 are all fixed with connecting rods 2531, and the six groups of connecting rods 2531 are respectively movable in the six groups of circular through holes on the positioning seat 2. Their function is: the operator can flexibly adjust the position of the suction cup 2533 by rotating the rotating disk 25. When facing wafers of different shapes and different placement requirements, they can be accurately positioned by rotating the rotating disk 25, which greatly improves the flexibility of positioning. The connecting rods 2531 cooperate with the circular through holes on the positioning seat 2. During the rotation of the rotating disk 25, they can provide good support and guidance for the mounting block 253 and the suction cup 2533, further enhancing the stability of wafer fixation.

[0051] In the embodiment of the present disclosure,

[0052] There are three groups of square through grooves in a circular array on the positioning seat 2, and auxiliary plates 26 are installed in the three groups of square through grooves. Two groups of waist-shaped grooves are provided on the auxiliary plates 26. The auxiliary plates 26 are installed on the positioning seat 2 by two groups of bolts, and the ends of the three groups of auxiliary plates 26 close to the center of the positioning seat 2 are installed with mounting screws 261 through nuts. The lower ends of the three groups of mounting screws 261 are all installed with stabilizing wheels 262 through bearings. The three groups of stabilizing wheels 262 are in contact with the inner wall surface of the rotating disk 25. Their function is: when the rotating disk 25 is rotating, the stabilizing wheels 262 are in contact with the inner wall surface of the rotating disk 25, effectively preventing the rotating disk 25 from shaking or deflecting, thereby ensuring the smooth rotation.

[0053] Example 2, based on Example 1,

[0054] Four groups of support columns 27 are fixed to the lower end of the positioning seat 2, and a partition 152 is fixed to the lower end of the four groups of support columns 27. A flip plate 15 is provided below the partition 152, and a center column 1521 is fixed to the lower end of the partition 152. A pulley is fixed on the center column 1521, and the lower end of the center column 1521 is mounted on the flip plate 15 through a bearing seat. A No. 1 motor 151 is mounted on the flip plate 15 by bolts, and a pulley is fixed on the output shaft of the No. 1 motor 151. A No. 1 belt 1522 is connected between the pulley on the output shaft of the No. 1 motor 151 and the pulley on the center column 1521. A No. 1 sliding plate 145 is provided below the flip plate 15. The upper end of the No. 1 sliding plate 145 is installed with a motor base 147 and a support plate 146 by bolts, and the flip plate 15 is installed between the motor base 147 and the support plate 146 by bearings. The No. 2 motor 1471 is installed on the motor base 147 by bolts. The output shaft of the No. 2 motor 1471 is connected to the left end of the rotating shaft of the flip plate 15. Its function is: through the cooperation of the No. 1 motor 151, the center column 1521 and the No. 1 belt 1522, it can drive the partition 152 and the positioning seat 2 to flip around the axis of the center column 1521, and then combine with the No. 2 motor 1471 to drive the flip plate 15 to rotate, so that the positioning seat 2 and the wafer thereon can be flipped at multiple angles.

[0055] Example 3, based on Example 1 and Example 2,

[0056] The lower end of the No. 1 sliding plate 145 is fixed with a clamping seat 1451, and two groups of threaded holes are provided on the clamping seat 1451. A horizontal plate 14 is provided below the No. 1 sliding plate 145, and two groups of rail rods 144 are installed on the horizontal plate 14 by bolts. The No. 1 sliding plate 145 slides on the two groups of rail rods 144, and the lower end of the horizontal plate 14 is fixed with a No. 3 motor 141 by bolts. A pulley is fixed on the output shaft of the No. 3 motor 141, and a vertical rod 142 is installed on the horizontal plate 14 by bolts. A pulley is installed on the vertical rod 142 through a bearing. The pulley on the output shaft of the No. 3 motor 141 is connected to the pulley on the vertical rod 142. The clamping seat 1451 and the No. 2 belt 143 are fixedly connected by bolts. The lower end of the horizontal plate 14 is fixed with the No. 2 sliding plate 13, and the lower end of the No. 2 sliding plate 13 is provided with Threaded hole, a base 1 is provided below the No. 2 sliding plate 13, the No. 2 sliding plate 13 slides on the base 1, and a screw rod 12 is installed on the base 1 through a bearing, and the screw rod 12 is threadedly matched with the threaded hole at the lower end of the No. 2 sliding plate 13, and a No. 4 motor 121 is installed on the base 1 through bolts, and the output shaft of the No. 4 motor 121 is connected to the rear end of the screw rod 12, and four sets of casters 11 are installed at the lower end of the base 1 through bolts, whose function is: the No. 3 motor 141 drives the clamping seat 1451 and the No. 1 sliding plate 145 to slide on the rail rod 144 of the cross plate 14 through the pulley and the No. 2 belt 143, thereby realizing the precise displacement control of the positioning device in the horizontal direction. When the No. 4 motor 121 is driven, its output shaft drives the screw to rotate, and the screw nut moves accordingly, thereby driving the No. 2 sliding plate 13 to move back and forth along the guide rail.

[0057] The working principle of this embodiment is as follows: first, the wafer is placed on the positioning seat 2, and the position of the suction cup 2533 is flexibly adjusted by rotating the rotating disk 25, and the bottom of the wafer is adsorbed by the suction cup 2533 to complete the initial fixed positioning of the wafer, and the nut at the lower end of the central screw 21 is rotated to adjust the compression state of the No. 1 spring 221. Under the elastic force of the No. 1 spring 221, the movable sleeve 22 drives the upper ends of the three groups of hinged plates 222 to move upward, and the lower end of the hinged plate 222 pushes the hinged arm 223, so that the lower end of the hinged arm 223 The end expands outward, and the upper end moves toward the center of the positioning seat 2. At this time, the conical groove 231 on the clamping head 23 engages with the bevel gear 241 on the positioning plate 24, and cooperates with the first positioning groove 243 and the second positioning groove 244 on the positioning plate 24 to accurately calibrate and clamp the wafer in the horizontal and vertical directions, further ensuring the accurate positioning of the wafer and completing the stable fixation of the wafer. When it is necessary to move the positioning device in the horizontal direction, start the No. 3 motor 141, and the pulley on the output shaft of the No. 3 motor 141 passes through the No. 2 belt 14 3 drives the pulley on the vertical rod 142 to rotate, thereby driving the clamping seat 1451 and the first sliding plate 145 to slide on the rail rod 144 of the horizontal plate 14, realizing the precise displacement of the positioning device in the horizontal direction, and the wafer can be transferred to different processing stations. To achieve the displacement adjustment in the front and rear directions, the fourth motor 121 is driven, and the output shaft of the fourth motor 121 drives the screw connected to it to rotate. The screw nut is fixed to the second sliding plate 13, and the screw nut moves with the rotation of the screw, thereby driving the second sliding plate 13 along the bottom The guide rail on the seat 1 moves back and forth to achieve position adjustment in the front and rear directions. When performing the flipping operation, the No. 1 motor 151 and the No. 2 motor 1471 work together. The pulley on the output shaft of the No. 1 motor 151 drives the pulley on the center column 1521 to rotate through the No. 1 belt 1522, causing the center column 1521 to rotate, and then drives the partition 152 and the positioning seat 2 to flip around the axis of the center column 1521. At the same time, the No. 2 motor 1471 drives the flip plate 15 to rotate, and together realizes multi-angle flipping of the positioning seat 2 and the wafer.

[0058] In this article, there are several points to note:

[0059] 1. The drawings of the embodiments of the present disclosure only relate to the structures related to the embodiments of the present disclosure. Other structures may refer to conventional designs.

[0060] 2. In the absence of conflict, the embodiments of the present disclosure and the features therein may be combined with each other to form new embodiments.

[0061] The above are only specific implementation methods of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any technician familiar with this technical field can easily think of changes or replacements within the technical scope disclosed in this disclosure, and they should all be covered by the protection scope of the present disclosure.

Claims

1. A wafer positioning device with an adsorption fixing structure, comprising: The positioning seat (2) is characterized in that: The positioning seat (2) is provided with a through hole, a central screw (21) is installed in the through hole through a nut, the nut is located below the positioning seat (2), a movable sleeve (22) is movable on the central screw (21), the positioning seat (2) is provided with three groups of through slots, the three groups of through slots are hinged with hinge plates (222), three groups of No. 1 springs (221) are installed between the movable sleeve (22) and the positioning seat (2), and the upper ends of the three groups of hinge plates (222) are connected to the movable sleeve (22) through a pin shaft, the outer surface of the positioning seat (2) is hinged with three groups of hinge arms (223), the three groups of hinge arms (223) are all set to L-shaped structures, the three groups of hinge plates ( The lower ends of the hinge plates (222) are respectively in contact with the three sets of hinged arms (223), and the upper ends of the three sets of hinged plates (222) are hinged with a clamping head (23), a conical groove (231) is provided on the clamping head (23), and a positioning plate (24) is installed on the clamping head (23), a threaded rod is welded on the positioning plate (24), a bevel gear (241) is fixed on the threaded rod, and the bevel gear (241) is engaged with the conical groove (231), a second spring (242) is sleeved on the threaded rod on the positioning plate (24), a first positioning groove (243) is provided horizontally on the positioning plate (24), and a second positioning groove (244) is provided longitudinally on the positioning plate (24).

2. The wafer positioning device with an adsorption fixing structure according to claim 1, characterized in that: A rotatable rotating disk (25) is mounted on the positioning seat (2). The rotating disk (25) is an annular structure. An adjusting handle (251) is fixed on the rotating disk (25). An arc-shaped through groove (28) is provided on the positioning seat (2). The adjusting handle (251) moves in the arc-shaped through groove (28). The rotating disk (25) has six groups of arc-shaped grooves (252) in an arc array.

3. The wafer positioning device with an adsorption fixing structure according to claim 2, characterized in that: The positioning seat (2) is provided with six groups of circular through holes, and the six groups of arc-shaped grooves (252) on the rotating disk (25) are all provided with embedded blocks (2532) that can move. The upper ends of the six groups of embedded blocks (2532) are all provided with mounting blocks (253) by bolts. The upper ends of the six groups of mounting blocks (253) are all fixed with suction cups (2533). The six groups of mounting blocks (253) are all fixed with connecting rods (2531). The six groups of connecting rods (2531) can move in the six groups of circular through holes on the positioning seat (2).

4. The wafer positioning device with an adsorption fixing structure according to claim 3, characterized in that: The positioning seat (2) has three groups of square through grooves in an annular array, and auxiliary plates (26) are installed in the three groups of square through grooves. The auxiliary plates (26) are provided with two groups of waist-shaped grooves. The auxiliary plates (26) are installed on the positioning seat (2) through two groups of bolts, and the ends of the three groups of auxiliary plates (26) close to the center of the positioning seat (2) are all installed with mounting screws (261) through nuts. The lower ends of the three groups of mounting screws (261) are all installed with stabilizing wheels (262) through bearings. The three groups of stabilizing wheels (262) are all in contact with the inner wall surface of the rotating disk (25).

5. The wafer positioning device with an adsorption fixing structure according to claim 4, characterized in that: Four groups of support columns (27) are fixed to the lower end of the positioning seat (2), a partition (152) is fixed to the lower end of the four groups of support columns (27), a flip plate (15) is provided below the partition (152), a center column (1521) is fixed to the lower end of the partition (152), a pulley is fixed on the center column (1521), and the lower end of the center column (1521) is mounted on the flip plate (15) through a bearing seat, a No. 1 motor (151) is mounted on the flip plate (15) through bolts, a pulley is fixed to the output shaft of the No. 1 motor (151), and a No. 1 belt (1522) is connected between the pulley on the output shaft of the No. 1 motor (151) and the pulley on the center column (1521).

6. The wafer positioning device with an adsorption fixing structure according to claim 5, characterized in that: A No. 1 sliding plate (145) is provided below the flip plate (15), and a motor base (147) and a support plate (146) are mounted on the upper end of the No. 1 sliding plate (145) by bolts. The flip plate (15) is mounted between the motor base (147) and the support plate (146) by a bearing. A No. 2 motor (1471) is mounted on the motor base (147) by bolts, and an output shaft of the No. 2 motor (1471) is connected to the left end of the rotating shaft of the flip plate (15).

7. The wafer positioning device with an adsorption fixing structure according to claim 6, characterized in that: A clamping seat (1451) is fixed to the lower end of the No. 1 sliding plate (145), and two groups of threaded holes are provided on the clamping seat (1451). A transverse plate (14) is provided below the No. 1 sliding plate (145), and two groups of rail rods (144) are installed on the transverse plate (14) by bolts. The No. 1 sliding plate (145) slides on the two groups of rail rods (144), and a No. 3 motor (141) is installed on the lower end of the transverse plate (14) by bolts.

8. The wafer positioning device with an adsorption fixing structure according to claim 7, characterized in that: A pulley is fixed on the output shaft of the No. 3 motor (141), and a vertical rod (142) is installed on the horizontal plate (14) by bolts, and a pulley is installed on the vertical rod (142) by a bearing, and a No. 2 belt (143) is connected between the pulley on the output shaft of the No. 3 motor (141) and the pulley on the vertical rod (142), and the clamping seat (1451) and the No. 2 belt (143) are fixedly connected by bolts.

9. The wafer positioning device with an adsorption fixing structure according to claim 8, characterized in that: A second sliding plate (13) is fixed to the lower end of the horizontal plate (14), a threaded hole is provided at the lower end of the second sliding plate (13), a base (1) is provided below the second sliding plate (13), the second sliding plate (13) slides on the base (1), and a screw rod (12) is installed on the base (1) through a bearing, and the screw rod (12) is threadedly matched with the threaded hole at the lower end of the second sliding plate (13).

10. The wafer positioning device with an adsorption fixing structure according to claim 9, characterized in that: A fourth motor (121) is mounted on the base (1) via bolts, an output shaft of the fourth motor (121) is connected to the rear end of the screw rod (12), and four sets of casters (11) are mounted on the lower end of the base (1) via bolts.

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