Heat pipe type heat dissipation device and manufacturing method thereof

Abstract

The invention discloses a heat pipe type heat dissipation device which comprises a base, a plurality of heat pipes and heat dissipation fins. A plurality of heat pipe caulking grooves are formed in the arc bottom face of the base and communicated with the two side faces of the base. The heat pipe is a closed metal pipe body filled with liquid and is divided into a heat conduction section and a heat dissipation section. The heat-conducting section is embedded into the caulking groove of the base and is provided with a heat-conducting cambered surface exposed out of the caulking groove; the heat dissipation section is communicated with the heat conduction section, extends to the upper portion or the side face of the base, and is sleeved with heat dissipation fins to enhance the heat dissipation performance. The heat conduction arc surface at the bottom of the heat conduction section and the arc bottom surface of the base form a downward-protruding full-circumferential-arc convex surface, the center of the full-circumferential-arc convex surface is used for being tightly connected with the surface of the center of the chip, or the surface of the chip is slightly deformed according to the curvature to improve the tightness of tight connection, and therefore the heat contact effect and the heat dissipation efficiency between the chip and the heat dissipation device are improved.

Description

Technical Field

[0001] The present invention relates to the field of heat dissipation technology for electronic products, and more particularly to a heat pipe type heat dissipation device applied to electronic products, which can overcome the problem of poor contact between the heat pipe type heat dissipation device and the electronic products, and make the heat pipe type heat dissipation device fit tightly on the heating surface. Background Art

[0002] The structure of a conventional heat pipe radiator is shown in patent announcements I418290, I573977, I575213, and I604778, and is generally composed of an aluminum base, a plurality of heat pipes, and a group of heat dissipation fins. The bottom surface of the aluminum base is a plane, which is used to contact the surface of the heat source. The heat pipe is combined with the aluminum base to ensure that the heat can be quickly and evenly transferred to the heat pipe. The heat pipe is filled with liquid, and the evaporation and condensation process of the liquid in a vacuum environment realizes efficient phase change heat conduction, and the heat is quickly transferred from the base to the heat dissipation fins. The heat dissipation fins are usually made of aluminum sheets, which are closely arranged and have a large surface area, which are used to increase the contact area with the air and improve the heat dissipation efficiency.

[0003] However, the surface of electronic products may be uneven due to manufacturing tolerances, material characteristics, packaging technology or thermal deformation, resulting in the inability to completely fit the flat bottom surface of the aluminum base of the heat pipe type radiator, further affecting the efficiency of heat transfer. The conventional method is to use thermal paste to fill the tiny gaps, but the coating thickness of the thermal paste is limited. Too thick thermal paste will form heat resistance, so the thermal paste cannot overcome the unevenness of the surface of the electronic product with a large curvature. In addition, the heat point of the processor is concentrated in the center of the metal cover (the chip is below the center of the metal cover), but the bottom surface of the existing heat pipe type radiator is a plane. When it is attached to the surface of the processor chip, the center of the bottom surface of the heat pipe type radiator may not fit tightly to the center of the processor with the highest temperature due to factors such as uneven buckling force of the buckle. Therefore, how to solve the problem that the heat pipe type radiator may not be in complete contact with the surface of the heat source is the subject to be overcome by the present invention. Summary of the invention

[0004] The main purpose of the present invention is to provide a heat pipe type heat dissipation device and a manufacturing method thereof, so that most heat pipes extend to the arc bottom surface of the base, and the bottom of the heat conduction section of the heat pipe is implemented as a full-circumference arc convex surface, so that the full-circumference arc convex surface is tightly fitted with the center of the chip to achieve efficient heat conduction, and the heat is quickly transferred to the heat dissipation section through the phase change of the liquid inside the heat pipe, so as to improve the heat dissipation efficiency and reduce the thermal resistance.

[0005] In order to achieve the above-mentioned purpose, the present invention proposes a heat pipe type heat dissipation device, and its preferred technical solution includes a base, a plurality of heat pipes and a plurality of heat dissipation fins, which are used to be installed on a chip for heat conduction and heat dissipation, wherein: the base is a rectangular block, and the arc bottom surface of the base is concavely provided with a plurality of heat pipe embedding grooves, and the heat pipe embedding grooves are connected to the two side surfaces of the base. The heat pipes are metal pipe bodies with a heat conduction section and at least one heat dissipation section and closed at both ends, and the metal pipe bodies of the heat pipes are filled with a liquid; the heat conduction sections are respectively embedded in the heat pipe embedding grooves of the base; the heat dissipation section is in communication with the heat conduction section, and the heat dissipation section extends to the top or any side of the base; the heat dissipation fins are sleeved on the heat dissipation sections of the heat pipes. The bottom of the heat-conducting sections of the heat pipes has a heat-conducting arc surface, and the heat-conducting arc surfaces of the heat pipes are aligned with the arc bottom surface of the base to form a full-circumference arc convex surface; the full-circumference arc convex surface is a spherical surface convex downward from the center of the base, and the full-circumference arc convex surface is used to press against the surface of the chip, so that the surface of the chip is slightly deformed according to the curvature of the full-circumference arc convex surface and is in close contact with each other.

[0006] In order to achieve the above-mentioned purpose, the present invention further proposes a method for manufacturing a heat pipe type heat dissipation device, which includes the following steps: (S1) preparing a base: using an aluminum extrusion process to extrude an aluminum extruded strip, the aluminum extruded strip having a flat bottom surface and a plurality of heat pipe embedding grooves recessed from the flat bottom surface, each of the heat pipe embedding grooves having a circular arc groove surface, and then cutting into a rectangular base in sections. (S2) making the heat pipes into round tubes whose cross sections correspond to the heat pipe embedding grooves, and pre-bending the heat pipes to form the heat conduction section and the heat dissipation section. (S3) assembling the heat pipes: the heat conduction sections of the heat pipes are embedded in each of the heat pipe embedding grooves, so that the outer tube surface of the heat conduction section is in close contact with the circular arc groove surface of the heat pipe embedding groove, and a portion of the round tube of the heat conduction section protrudes from the heat pipe embedding groove. (S4) Stamping or rolling the heat pipe: The heat-conducting sections of the heat pipes are simultaneously subjected to a stamping process or a rolling process, so that the bottom of the round tube of the heat-conducting section protruding from the flat bottom surface is flattened into a flat bottom. (S5) Processing the full-circumference arc convex surface: The flattened bottom of the heat-conducting section and the flat bottom surface of the base are simultaneously subjected to a cutting process, so that the flattened bottom of the heat-conducting section becomes the heat-conducting arc surface, and the flat bottom surface of the base becomes the arc bottom surface, and the heat-conducting arc surface and the arc bottom surface are aligned to form the full-circumference arc convex surface. (S6) Assembling the heat-dissipating fins: The heat-dissipating fins are tightly mounted on the heat-dissipating sections of the heat pipes.

[0007] The present invention provides a heat pipe type heat dissipation device and a manufacturing method thereof, which can achieve the following effects and functions: (a) Improved thermal contact performance: The heat conductive arc surface of the base and the heat pipe of the present invention constitute a full-circumference arc convex surface, which is a spherical surface structure. When the heat dissipation device is assembled through the fastener, the full-circumference arc convex surface can be tightly fitted with the main heating area of ​​the chip surface, reducing the contact thermal resistance and ensuring that the heat is more efficiently conducted to the heat pipe. (b) Strong adaptability: The full-circumference arc convex surface formed by the arc bottom surface of the base of the present invention and the heat conductive arc surface of the heat pipe can cause micro-deformation on the chip surface, further achieving complete surface fitting. Regardless of whether there are slight unevenness on the chip surface, excellent thermal conductivity performance can be guaranteed, thereby improving the versatility of the device. (c) Flexible arrangement of the heat dissipation structure: The heat dissipation section of the heat pipe of the present invention can extend to the top or either side of the base, and cooperate with the heat dissipation fins to achieve flexible heat dissipation structure design to meet the installation requirements of different equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 It is a top perspective schematic diagram of the first embodiment of the present invention.

[0009] Figure 2 It is a bottom perspective schematic diagram of the first embodiment of the present invention.

[0010] Figure 3 It is an exploded perspective schematic diagram of the first embodiment of the present invention.

[0011] Figure 4 It is a front view schematic diagram of the first embodiment of the present invention.

[0012] Figure 5 It is a side view schematic diagram of the first embodiment of the present invention.

[0013] Figure 6 It is a bottom perspective schematic diagram of the second embodiment of the present invention.

[0014] Figure 7 It is a front view schematic diagram of the second embodiment of the present invention.

[0015] Figure 8 It is a side view schematic diagram of the second embodiment of the present invention.

[0016] Fig. 9 It is a schematic diagram of the process of the manufacturing method of the present invention.

[0017] Fig.10 It is a schematic diagram of the punching out step difference structure of the present invention.

[0018] Description of the accompanying drawings

[0019] 100: Refrigeration chip

[0020] 10: Base

[0021] 11: Arc bottom

[0022] 11': Flat bottom

[0023] 12: Heat pipe groove

[0024] 121: Arc groove surface

[0025] 13: Buckle groove

[0026] 14: Heat sink

[0027] 20: Heat pipe

[0028] 21: Heat conduction section

[0029] 22: Heat dissipation section

[0030] 23: Heat conductive arc surface

[0031] 23': Flatten the bottom

[0032] 24: Arc outer tube surface

[0033] 25: Break structure

[0034] 30: Cooling fins

[0035] 40: Buckle

[0036] 41: First gusset

[0037] 42: Second gusset

[0038] 43: First fixing element

[0039] 44: Second fixing element

[0040] 45: Screw

[0041] 50: Full arc convex surface

[0042] R1: Radius of curvature

[0043] S1: Prepare the base

[0044] S2: Preparation of a plurality of heat pipes

[0045] S3: Assembling the heat pipe

[0046] S4: Stamped or rolled heat pipe

[0047] S41: Stamping step

[0048] S5: Processing the full circumference arc convex surface

[0049] S6: Assemble the heat sink fins. DETAILED DESCRIPTION

[0050] The technical features, structure, manufacturing method and other functions, purposes and effects of the present invention are described in detail as follows according to the accompanying drawings:

[0051] See also Figures 1 to 5 FIG. 1 is a first preferred embodiment of a heat pipe type heat dissipation device of the present invention, which is a heat pipe type heat sink for installation on a heat generating electronic component such as a processor (not shown) or a cooling chip 100. The preferred embodiment includes a base 10, a plurality of heat pipes 20 and a plurality of heat dissipation fins 30, and may be implemented with a fastener 40, wherein:

[0052] See also Figure 3 , Figure 4 and Figure 5 As shown, the base 10 is a rectangular block or a block of other shapes made of aluminum alloy or other metal materials, and is used to fit its arc bottom surface 11 on the processor or cooling chip 100. The arc bottom surface 11 of the base 10 is concavely provided with a plurality of heat pipe embedding grooves 12, and the inner wall of the heat pipe embedding groove 12 has a circular arc groove surface 121, and the heat pipe embedding groove 12 is connected to any two side surfaces or two corresponding side surfaces of the base 10, so as to provide the heat pipes 20 to be embedded in each heat pipe embedding groove 12. Among them, the top surface of the base 10 can be concavely provided with a buckle groove 13, and the buckle groove 13 connects the two corresponding side surfaces of the base 10. The top surface of the base 10 can also be processed with a plurality of heat sinks 14 formed in one piece, so that the base 10 can also enhance its heat dissipation effect.

[0053] The heat pipes 20 are a known heat-conducting element, which are long tubes made of metal tubes and closed at both ends. The metal tube bodies of the heat pipes 20 are filled with a liquid (not shown). When the heat pipe 20 is in use, one section is used as a heat-conducting section 21, and the other section is used as a heat-dissipating section 22. The heat-conducting section 21 is connected to the heat-dissipating section 22, so that the internal liquid can conduct heat quickly. In the present invention, the heat-conducting sections 21 are respectively embedded in the heat pipe embedding grooves 12 of the base 10, so that most of the heat pipes 20 are fixed side by side on the arc bottom surface 11 of the base 10. The heat-dissipating section 22 extends to the top or any side of the base 10, and then the heat-dissipating fins 30 are sleeved on the heat-dissipating section 22 of the heat pipe 20, so that the heat-dissipating fins 30 remove the heat of the heat pipe 20.

[0054] See also Figures 2 to 5As shown, the present invention has a heat-conducting arc surface 23 at the bottom of the heat-conducting section 21 of the heat pipes 20. The heat-conducting arc surface 23 of the heat pipes 20 is aligned with the arc bottom surface 11 of the base 10 and forms a 360° full-circumference arc convex surface 50. The full-circumference arc convex surface 50 is a spherical surface or a complex curved surface that protrudes downward from the center of the base 10. When installed, the full-circumference arc convex surface 50 is used to press against the surface of the chip, so that the surface of the chip is slightly deformed according to the curvature of the full-circumference arc convex surface 50 and is closely connected to each other, and the central heating area of ​​the processor is also more closely connected to the full-circumference arc convex surface 50. Figure 4 and Figure 5 As shown, the preferred curvature radius R1 of the full-circumference arc convex surface 50 is 1500 mm to 2500 mm, and the height of the full-circumference arc convex surface 50 from the edge of the arc surface to the center vertex of the arc surface is 0.02 mm to 0.25 mm.

[0055] See also Figure 3 As shown, the heat-conducting arc surfaces 23 at the bottom of the heat-conducting sections 21 of the heat pipes 20 can be parallel to each other and close together, or parallel to each other and spaced together, and are not limited to the state shown in the figure. The heat-conducting section 21 outside the heat-conducting arc surface 23 forms an arc outer tube surface 24, so that the arc outer tube surface 24 and the arc groove surface 121 of the heat pipe embedding groove 12 are completely in close contact for heat conduction.

[0056] See also Figure 1 As shown, the present invention further includes a clip 40. One of the preferred embodiments of the clip 40 includes two first clip plates 41, a second clip plate 42 and a screw 45. The two first clip plates 41 are used to be arranged on both sides of the base 10. The two ends of each first clip plate 41 are respectively provided with a first fixing element 43 for fixing on a circuit board or other objects. The second clip plate 42 is arranged on the clip groove 13 of the base 10. The two ends of the second clip plate 42 are respectively provided with a second fixing element 44, and the second fixing element 44 is fixed in the middle of the first clip plate 41. The screw 45 is passed through the middle of the second clip plate 42 and locked into the clip groove 13 on the base 10, so that the second clip plate 42 is fixed on the base 10. In this way, the base 10 is installed and fixed on the processor or cooling chip 100 through the clip 40, so that the full-circle arc convex surface 50 formed by the heat pipe type heat dissipation device of the present invention is pressed against the surface of the processor or cooling chip 100.

[0057] The full-circle arc convex surface 50 of the present invention is a spherical surface or a complex surface with a slight downward convexity in the center, so that the surface of the processor or the cooling chip 100 is slightly concave, so that the full-circle arc convex surface 50 has a tight fit effect, and can overcome the problem of uneven pressure under the buckle 40, and prevent the problem that a certain area is not tightly fitted to the surface of the processor or the cooling chip 100 due to the uneven pressure of the buckle 40. Moreover, the heating point of the processor is now concentrated in the middle of the metal cover. The present invention can achieve a more close heat conduction effect on the central heating point through the full-circle arc convex surface 50. As for the peripheral less heated parts, they can be compensated by thermal conductive paste. Therefore, the present invention can reduce the contact thermal resistance and ensure that the heat is more efficiently conducted to the heat pipe.

[0058] See also Figure 6 , Figure 7 and Figure 8 FIG. 1 is a second preferred embodiment of a heat pipe type heat dissipation device of the present invention. In this embodiment, the full-circle arc convex surface 50 is also provided. The difference from the first preferred embodiment is that the heat dissipation sections 22 at both ends of the heat pipes 20 extend to the upper sides of the base 10, and the heat dissipation sections 22 on each side are sleeved with a plurality of heat dissipation fins 30, forming a structure of two groups of heat dissipation fins 30. It can be seen that the direction in which the heat dissipation sections 22 of the heat pipes 20 extend and the form in which the heat dissipation fins 30 are installed are not limited.

[0059] Also, see Fig. 9 As shown, the present invention further provides a method for manufacturing a heat pipe type heat dissipation device, which includes the following steps:

[0060] (S1) Preparing a base: An aluminum extrusion strip 10' is extruded by an aluminum extrusion process. The aluminum extrusion strip 10' has a flat bottom surface 11' and a plurality of heat pipe embedding grooves 12 recessed in the flat bottom surface 11'. Each of the heat pipe embedding grooves 12 has a circular arc groove surface 121, and then the base 10 is cut into sections into a rectangular shape.

[0061] (S2) Preparing a plurality of heat pipes: forming the heat pipes 20 into round tubes whose cross sections correspond to the shape of the heat pipe embedding groove 12 and are filled with liquid, sealing both ends of the heat pipes 20, and then bending the heat pipes 20 to form the above-mentioned heat conduction section 21 and one or two heat dissipation sections 22, so that when the heat conduction section 21 and the heat pipe embedding groove 12 are assembled, the heat dissipation section 22 is located above the two sides of the base 10 or in other directions.

[0062] (S3) Assembling the heat pipes: During assembly, the outer tube surfaces (arc outer tube surfaces 24) of the heat conducting sections 21 of the heat pipes 20 are embedded into the heat pipe embedding grooves 12, so that the outer tube surfaces (arc outer tube surfaces 24) of the heat conducting sections 21 are in close contact with the arc groove surfaces 121 of the heat pipe embedding grooves 12, and the bottom of the circular tube of the heat conducting section 21 protrudes from the heat pipe embedding grooves 12.

[0063] (S4) Stamping or rolling the heat pipe: The heat conducting sections 21 of the heat pipes 20 are simultaneously subjected to a stamping process or a rolling process, so that the round tube bottom of the heat conducting section 21 protruding from the flat bottom surface 11' is flattened into a flattened bottom 23', thereby making the outer tube surface (arc outer tube surface 24) of the heat conducting section 21 tightly combined with the arc groove surface 121 of the heat pipe embedding groove 12.

[0064] (S5) Processing the full-circumference arc convex surface: The flattened bottom 23' of the above-mentioned heat-conducting section 21 and the flat bottom surface 11' of the base 10 are simultaneously subjected to a cutting process, so that the flattened bottom 23' of the above-mentioned heat-conducting section 21 forms the heat-conducting arc surface 23, and the flat bottom surface 11' of the base 10 forms the above-mentioned arc bottom surface 11, and the heat-conducting arc surface 23 is aligned with the arc bottom surface 11 of the base 10 to form the full-circumference arc convex surface 50.

[0065] (S6) Assembling the heat dissipation fins: The heat dissipation fins 30 are tightly mounted on the heat dissipation sections 22 of the heat pipes 20 to form a heat pipe type heat dissipation device.

[0066] See also Fig.10 As shown, the present invention can perform a step (S41) of punching a step difference after the above step (S4): a step difference structure 25 is punched out at the two side surfaces of the heat pipes 20 aligned with the base 10, and the step difference structure 25 is aligned with the two side surfaces of the base 10 to form a complete full-circumference arc convex surface 50 structure.

[0067] The manufacturing method steps of the heat pipe type heat dissipation device of the present invention enable the flat bottom surface 11' of the base 10 and the heat conducting sections 21 of the majority of heat pipes 20 to simultaneously process the full-circle arc convex surface 50, so that the heat conducting arc surface 23 of each heat pipe 20 will not have errors such as uneven height, which can make the full-circle arc convex surface 50 more complete and precise, and can effectively increase the contact area and tightness between the base and the heat pipe, and further reduce thermal resistance. At the same time, the integrated processing method simplifies the manufacturing process, improves production efficiency, and reduces processing errors, achieving the goal of manufacturing a high-performance and high-reliability heat dissipation structure.

[0068] In summary, the heat pipe type heat dissipation device and its manufacturing method of the present invention are indeed practical and creative, and the application of its technical means is undoubtedly novel, and the effect is indeed consistent with the design purpose, which is considered to be a reasonable progress. For this reason, I have filed an invention patent application in accordance with the law, but I sincerely ask the Office to examine it in detail and grant the patent. I will be grateful.

Claims

1. A heat pipe type heat dissipation device, comprising a base, a plurality of heat pipes and a plurality of heat dissipation fins, for being installed on a chip for heat conduction and heat dissipation, wherein: The base is a rectangular block, and a plurality of heat pipe embedding grooves are concavely arranged on an arc bottom surface of the base, and the heat pipe embedding grooves are connected to two side surfaces of the base; The heat pipes are metal pipes having a heat conducting section and at least one heat dissipating section and closed at both ends. The metal pipes of the heat pipes are filled with a liquid. The heat conducting sections are respectively embedded in the heat pipe embedding grooves of the base. The heat dissipating section is in communication with the heat conducting section and extends to the top or any side of the base. The heat dissipating fins are sleeved on the heat dissipating sections of the heat pipes. The bottom of the heat-conducting sections of the heat pipes has a heat-conducting arc surface, and the heat-conducting arc surfaces of the heat pipes are aligned with the arc bottom surface of the base to form a full-circumference arc convex surface; the full-circumference arc convex surface is a spherical surface convex downward from the center of the base, and the full-circumference arc convex surface is used to press against the surface of the chip, so that the surface of the chip is slightly deformed according to the curvature of the full-circumference arc convex surface and is in close contact with each other.

2. The heat pipe cooling device according to claim 1, wherein the curvature radius of the full-circumference arc convex surface is 1500 mm to 2500 mm.

3. The heat pipe cooling device according to claim 2, wherein the height of the full-circumference arc convex surface from the edge of the arc surface to the center vertex of the arc surface is 0.02mm to 0.25mm.

4. The heat pipe type heat dissipation device according to claim 1 or 3, wherein the heat pipe embedding grooves extend parallel to each other to two corresponding side surfaces of the base; and the heat conductive arc surfaces of the heat pipes are parallel to each other and arranged side by side. 5 . The heat pipe type heat dissipation device according to claim 4 , wherein the heat pipe embedding groove has a circular arc groove surface, and the heat pipe has a circular arc outer tube surface closely connected to the circular arc groove surface. 6 . The heat pipe cooling device according to claim 1 , wherein a buckle groove is concavely formed on the top surface of the base, and the buckle groove communicates with two corresponding side surfaces of the base. 7 . The heat pipe heat dissipation device according to claim 6 , wherein a plurality of heat dissipation fins are integrally formed on the top surface of the base.

8. The heat pipe cooling device according to claim 6 further includes a clip, which has two first clip plates, a second clip plate and a screw; the two first clip plates are arranged on both sides of the base, and a first fixing element is respectively provided at both ends of each first clip plate; the second clip plate is arranged on the clip groove, and a second fixing element is respectively provided at both ends of the second clip plate, and the second fixing element is fixed in the middle of the first clip plate; the screw is passed through the second clip plate and locked into the clip groove.

9. A method for manufacturing a heat pipe type heat dissipation device, comprising the following steps: (S1) preparing a base: using an aluminum extrusion process to extrude an aluminum extrusion strip, the aluminum extrusion strip having a flat bottom surface and a plurality of heat pipe embedding grooves recessed from the flat bottom surface, each of the heat pipe embedding grooves having a circular arc groove surface, and then cutting into sections to form a rectangular base; (S2) preparing a plurality of heat pipes: forming the heat pipes into round tubes whose cross-sections correspond to the heat pipe embedding grooves and are filled with liquid, sealing both ends of the heat pipes, and then bending the heat pipes to form the heat conduction section and the heat dissipation section; (S3) Assembling the heat pipes: embedding the heat conducting sections of the heat pipes into the heat pipe embedding grooves, so that the outer tube surface of the heat conducting section is in close contact with the arc groove surface of the heat pipe embedding groove, and the bottom of the round tube of the heat conducting section protrudes from the heat pipe embedding groove; (S4) stamping or rolling the heat pipes: stamping or rolling the heat conducting sections of the heat pipes simultaneously, so that the bottom of the round tube of the heat conducting section protruding from the flat bottom surface is flattened into a flattened bottom; (S5) machining a full-circumference arc convex surface: simultaneously performing a cutting process on the flattened bottom of the heat conducting section and the flat bottom surface of the base, so that the flattened bottom of the heat conducting section forms the heat conducting arc surface, the flat bottom surface of the base forms the arc bottom surface, and the heat conducting arc surface and the arc bottom surface are aligned to form the full-circumference arc convex surface; (S6) Assembling heat dissipation fins: tightly arranging the heat dissipation fins on the heat dissipation sections of the heat pipes.

10. The manufacturing method of the heat pipe type heat dissipation device according to claim 9, wherein after the step (S4), a step (S41) is further performed: a step structure is punched out at two side surfaces of the base where the heat pipes are aligned, and the step structure is aligned with the two side surfaces of the base.

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