Metal structure for boiling heat dissipation of high-heat-flux device and preparation method of metal structure

Abstract

The invention relates to the technical field of porous metal heat dissipation, and discloses a metal structure for boiling heat dissipation of a high-heat-flux device and a preparation method thereof.The upper side of the porous metal structure makes contact with a liquid medium for heat exchange, and the lower side of the porous metal structure makes contact with heat flux; the whole body is in gradient and non-uniform porous design from top to bottom, rectangular protrusions are arranged on the upper side surface, the rectangular upper side surface, the left side surface and the right side surface are in hydrophilic surface microstructure design, and the non-protruding surface is in hydrophobic surface microstructure design. The gradient and non-uniform porous design is adopted, internal micropores provide rich nucleation points for boiling, bubble formation is promoted, a large number of nucleation bubbles in the porous structure are rapidly separated, rapid supplement of liquid is achieved, and the liquid transportation capacity is enhanced through generated capillary force; by adopting the hydrophilic and hydrophobic surface microstructure, the movement of gas and liquid can be shunted through the design of the microstructure, the critical heat flux density is effectively improved, and the problem that the boiling heat dissipation performance is deteriorated under the high heat flux density is relieved.

Description

Technical Field

[0001] The invention relates to the technical field of porous metal heat dissipation, and in particular to a metal structure used for boiling heat dissipation of a high heat flux density device and a preparation method thereof. Background Art

[0002] Chips play a vital role in modern society and play a vital role in many key areas. With the rapid development of industrial technology, the supercomputer chip industry has continuously increased its requirements for heat dissipation. Since the 19th century, the main way people have solved the heat dissipation problem has been to use air-cooled and liquid-cooled radiators, and found that coolants can better capture the heat emitted by the equipment. By the end of the 20th century, heat flux density exceeding 100W / cm 2 The electrical equipment makes it difficult to maintain the single-phase heat transfer capacity. Compared with natural convection and single-phase convection heat transfer, boiling heat transfer effectively increases the upper limit of the heat transfer coefficient and has great potential in future thermal management. To this end, it is of great strategic significance to study the boiling heat and mass transfer mechanism, design a high-energy-density boiling enhanced heat transfer structure, solve the problem of boiling heat transfer performance deterioration under high heat flow, and meet the chip's ever-increasing high heat flow heat dissipation needs.

[0003] Methods to improve boiling heat dissipation mainly focus on improving the surface gas-liquid-solid interaction forces to increase the nucleation probability and bubble detachment rate, breaking through the heat dissipation limit under high heat flux. Under high heat flux conditions, the nucleation and diffusion of bubbles inside the pores occupy a large amount of liquid transport space, hindering the replenishment of liquid evaporation, resulting in a rapid deterioration of boiling heat transfer capacity, thereby limiting its high heat flux handling capacity. Therefore, alleviating the competitive relationship between bubble diffusion detachment and liquid transport in the pore channel, allowing a large number of nucleated bubbles inside the porous structure to quickly detach and achieve rapid liquid replenishment, has become a key factor in breaking through the high heat flux boiling heat dissipation limit.

[0004] Related research has even been extended to the nanoscale, and has achieved good heat transfer effects. However, the phenomenon of mutual restriction between gas and liquid in the same flow channel in the porous design still exists. If we want to further break through the critical heat flux density and heat transfer coefficient limitations, we need to explore new structural design ideas. In view of this, we propose a metal structure for boiling heat dissipation in high heat flux devices and its preparation method. Summary of the invention

[0005] In view of the shortcomings of the prior art, the present invention provides a metal structure for boiling heat dissipation of high heat flux density devices and a preparation method thereof, which solves the problem of deterioration of boiling heat transfer performance under high heat flux and meets the ever-increasing high heat flux heat dissipation needs of chips.

[0006] To achieve the above objectives, the present invention is implemented through the following technical solutions: A metal structure for boiling heat dissipation of a high heat flux density device, comprising a porous metal structure, wherein the upper surface of the porous metal structure contacts a liquid medium for heat dissipation;

[0007] The lower surface of the porous metal structure contacts the heat flow;

[0008] The upper surface of the porous metal structure is provided with a hydrophilic and hydrophobic surface microstructure;

[0009] The upper surface of the porous metal structure is provided with a rectangular protrusion;

[0010] The porous metal structure is a gradient porous design;

[0011] The porous metal structure is a non-uniform porous design.

[0012] Preferably, the hydrophilic and hydrophobic surface microstructures include a hydrophilic surface microstructure and a hydrophobic surface microstructure.

[0013] Preferably, the gradient is designed so that the porosity decreases gradually from top to bottom.

[0014] Preferably, the non-uniform design is a non-uniform pore distribution on the same cross section.

[0015] Preferably, the hydrophobic surface microstructure is located on the non-raised surface of the upper side of the gradient porous metal structure.

[0016] Preferably, the hydrophilic surface microstructure is located on the upper surface and the left and right side surfaces of the rectangular protrusion.

[0017] Preferably, a method for preparing a metal structure for boiling heat dissipation of a high heat flux device is characterized by comprising the following steps:

[0018] Step 1: Put the metal powder into a pressing mold and press it into a metal sheet;

[0019] Setting different porosities, mixing powders according to the porosity, grinding the mixtures with different porosities respectively, putting them into pressing molds respectively and pressing them into mixed pressed tablets;

[0020] Step 2: firstly put the metal sheet into the pressing mold, and then lay the mixed pressed sheets in the pressing mold in order from small to large porosity and from bottom to top; place the metal pressed sheet with a rectangular depression on top of the mixed pressed sheet, and then press it into a porous metal blank;

[0021] Step 3: placing the porous metal blank on a tray and sending it into a vacuum atmosphere tubular electric furnace, setting a temperature curve, and sintering after vacuuming to obtain a porous metal;

[0022] Step 4: Place the porous metal on a glass support plate and send it into a vacuum plasma cleaning machine, first evacuate the area and then introduce a gas that can introduce non-polar functional groups on the metal surface through port A for surface treatment to obtain a porous metal with a hydrophobic surface microstructure; cover the non-raised part of the porous metal after the hydrophobic treatment with a plasma corrosion-resistant mask, then place it on a glass support plate and send it into a vacuum plasma cleaning machine, first evacuate the area and then introduce a gas that can introduce polar functional groups on the metal surface through port B to obtain a porous metal with a hydrophilic and hydrophobic structure.

[0023] Preferably, the non-raised portion of the porous metal obtained in step seven is a hydrophobic surface microstructure, and the upper surface and left and right side surfaces of the rectangular protrusion are hydrophilic surface microstructures.

[0024] The present invention provides a metal structure for boiling heat dissipation of a high heat flux device and a preparation method thereof. It has the following beneficial effects:

[0025] 1. The present invention increases the bubble detachment speed and liquid supply capacity under high heat flow by modifying the macroscopic or microscopic geometric structure on the surface of the structure, and the boiling heat transfer coefficient and critical heat flow are significantly improved; the gradient and non-uniform porous design adopted by the present invention is conducive to the distribution of liquid flow, and the coolant is guided to the heated area through capillary adsorption, thereby enhancing the boiling evaporation rate and making the heat dissipation efficiency higher; the high specific surface area of ​​the porous metal provides a larger interface in contact with the coolant, which can effectively disperse the heat and avoid excessive heat accumulation in a single area;

[0026] 2. The hydrophobic surface microstructure of the present invention enables bubbles to quickly slide or leave the porous metal surface, reducing the bubble residence time; the hydrophilic surface microstructure allows the coolant to quickly flow back to the evaporation point, replenish the liquid and prevent the bubbles from adhering for a long time. The rectangular protrusion design improves the efficiency of liquid reflux and avoids the aggregation of bubbles on the porous metal surface; compared with solid metal, porous metal can significantly reduce weight, and is suitable for weight-sensitive fields while ensuring heat dissipation performance.

[0027] 3. The porous metal structure in the present invention is obtained by sintering and surface treatment; the solid sintering method is a very flexible manufacturing process, which is particularly suitable for application in technical fields such as porous metal heat dissipation. It is easy to implement on a large scale in a factory and has low cost, so it is easy to achieve mass production of porous metals; the hydrophilic and hydrophobic treatment of the metal surface is simple to operate, does not require complex equipment, has strong controllability, and has the conditions for large-scale production; therefore, the porous metal structure has very high economic benefits. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 Schematic diagram of porous metal structure;

[0029] Figure 2is a schematic diagram of a pressing die;

[0030] Figure 3 It is a schematic diagram of metal pressing sheet;

[0031] Figure 4 This is a schematic diagram of a vacuum atmosphere tubular electric furnace;

[0032] Figure 5 It is a schematic diagram of a vacuum plasma cleaning machine;

[0033] Figure 6 A schematic diagram of a mask resistant to plasma corrosion;

[0034] Figure 7 is a manufacturing flow chart of a porous metal structure;

[0035] Figure 8 This is a graph of experimental data in the gas-liquid transport experiment.

[0036] Among them, 1. porous metal structure; 11. hydrophilic surface microstructure; 12. hydrophobic surface microstructure; 13. liquid medium; 14. heat flow; 2. pressing mold; 21. metal tablet; 22. mixed tablet; 23. metal sheet; 3. vacuum atmosphere tubular electric furnace; 31. porous metal blank; 32. tray; 4. vacuum plasma cleaning machine; 41. A port; 42. B port; 43. glass support plate; 44. porous metal; 45. mask; DETAILED DESCRIPTION

[0037] The following will be combined with the drawings in the specification of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0038] Please refer to the attached Figure 1 An embodiment of the present invention provides a porous metal structure for boiling heat dissipation of a high heat flux density device, wherein the upper side of the porous metal structure contacts a liquid medium 13 for heat exchange, and the lower side contacts a heat flux 14; the overall structure is a gradient, non-uniform porous design from top to bottom, a rectangular protrusion is provided on the upper surface, the upper side and left and right side surfaces of the rectangle are designed as a hydrophilic surface microstructure 11, and the non-protrusion surface is designed as a hydrophobic surface microstructure 12.

[0039] Wherein, the gradient porous design is from bottom to top, with the porosity increasing from small to large.

[0040] Wherein, the non-uniform porous design is that the pores are unevenly distributed on the same cross section.

[0041] like Figure 2-6As shown, a manufacturing and modification equipment for a porous metal structure includes: a pressing mold 2, a vacuum atmosphere tubular electric furnace 3, and a vacuum plasma cleaning machine 4.

[0042] Wherein, the pressing mold 2 is provided with a metal pressing sheet 21 which can be optionally used.

[0043] Wherein, the vacuum plasma cleaning machine 4 is provided with a mask 45 which can be optionally used.

[0044] Wherein, the vacuum plasma cleaning machine 4 uses an external vacuum pump to evacuate.

[0045] A method for preparing a porous metal structure for boiling heat dissipation in a high heat flux density device, the specific steps are as follows:

[0046] Step 1: Put the metal powder into the pressing mold 2 and press it into a metal sheet 23; set different porosities, mix the powders according to the porosity, grind the mixtures with different porosities separately, put them into the pressing mold 2 respectively, and press them into mixed pressed sheets 22;

[0047] Step 2: firstly put the metal sheet 23 into the pressing mold 2, and then lay the mixed pressed sheets 22 in the pressing mold 2 in order from small to large porosity and from bottom to top; place the metal pressed sheet 21 with a rectangular depression on top of the mixed pressed sheet 22, and then press it into a porous metal blank 31;

[0048] Step 3: placing the porous metal blank 31 on a tray 32 and sending it into a vacuum atmosphere tubular electric furnace 3, setting a temperature curve, evacuating the vacuum and sintering to obtain a porous metal 44;

[0049] Step 4: placing the porous metal 44 on a glass support plate 43 and sending it into a vacuum plasma cleaning machine 4, first evacuating the vacuum and then introducing a gas capable of introducing non-polar functional groups on the metal surface through the A port 41 for surface treatment to obtain a porous metal 44 with a hydrophobic surface microstructure; covering the non-raised portion of the porous metal 44 after the hydrophobic treatment with a plasma corrosion-resistant mask 45, then placing it on a glass support plate 43 and sending it into a vacuum plasma cleaning machine 4, first evacuating the vacuum and then introducing a gas capable of introducing polar functional groups on the metal surface through the B port 42 to obtain a porous metal 44 with a hydrophilic and hydrophobic structure;

[0050] The specific implementation of Example 1 is as follows:

[0051] 1 Raw materials: Copper (density 8.960 g / cm3) is selected as the metal powder, the metal pressed sheet 21 has a size of 41 mm×41 mm×6 mm, and a rectangular depression is provided on the surface, and the size of a single rectangular depression is 1 mm×1 mm×1 mm; urea (density 1.335 g / cm3) is selected as the pore-forming agent; nitrogen (N2) is selected as the gas for introducing polar functional groups on the metal surface, and carbon tetrafluoride (CF4) is selected as the gas for introducing non-polar functional groups on the metal surface. There is an opening with a size of 1 mm×1 mm on the mask 45.

[0052] 2. Process method:

[0053] Step 1: Mix the powder and press it into tablets.

[0054] 451.85g of metal powder was measured and put into a pressing mold 2, and pressed at a pressure of 10MPa to obtain a metal sheet 23 with a thickness of 3mm; the porosity was set to 50%, 55%, 60%, 65%, and 70%, and the powder ratio was performed according to the porosity. The thickness of each mixed tablet was set to 0.4mm. It can be calculated that the masses of metal powder and urea are 3.01g:0.45g, 2.71g:0.49g, 2.41g:0.54g, 2.11g:0.58g, and 1.80g:0.63g, respectively. The metal powder and urea were weighed, ground separately, and put into the pressing mold 2 separately, and each was pressed into a mixed tablet 22 with a force of 10MPa;

[0055] Step 2: stacking the metal sheets and the mixed pressed sheets together to form a metal blank.

[0056] First, the metal sheet 23 is placed in the pressing mold 2, and then the mixed pressed sheets 22 are laid in the pressing mold 2 in order of porosity from small to large and from bottom to top; a metal pressed sheet 21 with a rectangular depression is placed above the mixed pressed sheet 22, and a pressure of 150 MPa is used to press and hold for 30 seconds to obtain a porous metal blank 31;

[0057] Step 3: Produce porous metal 44 by solid sintering method

[0058] The porous metal blank 31 is placed on a tray 32 and sent into a vacuum atmosphere tubular electric furnace 3, and vacuum is drawn. The temperature curve is set as follows: the heating time from room temperature to about 400°C is 90 minutes, the heat preservation time in the range of 400°C to 420°C is 90 minutes, the heating time from 420°C to 830°C is 90 minutes, the heat preservation time in the range of 830°C to 850°C is 30 minutes, the cooling time from 850°C to 500°C is 90 minutes, and the heat preservation time in the range of 500°C to 470°C is 30 minutes. Finally, after cooling to room temperature, the porous metal 44 is obtained by ultrasonic cleaning to remove impurities.

[0059] Step 4: Perform hydrophilic-hydrophobic modification on the surface of the porous metal 44 .

[0060] A porous metal 44 is placed on a glass support plate 43 and sent to a vacuum plasma cleaning machine 4. After first evacuating to a pressure of -102 KPa with an external vacuum pump, the switch of the A port 41 is opened, carbon tetrafluoride (CF4) is introduced, the power is set to 70%, and the porous metal 44 is taken out after waiting for about 10 minutes to obtain a porous metal 44 with a hydrophobic surface microstructure; subsequently, a mask 45 resistant to plasma corrosion is used to cover the non-raised portion of the hydrophobic porous metal 44, and then the porous metal 44 is placed on a glass support plate 43 and sent to a vacuum plasma cleaning machine 4. After first evacuating to a pressure of -102 KPa with an external vacuum pump, the switch of the B port 42 is opened, nitrogen (N2) is introduced, the power is set to 70%, and the porous metal 44 is taken out after waiting for about 20 minutes to obtain a porous metal 44 with a hydrophobic surface microstructure in the non-raised portion and a hydrophilic surface microstructure in the upper side surface of the rectangular protrusion and the left and right side surfaces;

[0061] The specific implementation of the second embodiment is as follows:

[0062] 1 Raw materials: Aluminum (density 2.7 g / cm3) is selected as metal powder, the metal pressed sheet 21 has a size of 41 mm×41 mm×6 mm, and a rectangular depression is provided on the surface, and the size of a single rectangular depression is 1 mm×1 mm×1 mm. Sodium chloride (density 2.165 g / cm3) is selected as the pore-forming agent. Argon (Ar) is selected as the gas for introducing polar functional groups on the metal surface, and carbon tetrafluoride (CF4) is selected as the gas for introducing non-polar functional groups on the metal surface. The mask 45 has an opening of 1 mm×1 mm in size.

[0063] 2. Process method:

[0064] Step 1: Mix the powder and press it into tablets.

[0065] 136.16g of metal powder was measured and put into a pressing mold 2, and pressed at a pressure of 10MPa to obtain a metal sheet 23 with a thickness of 3mm; the porosity was set to 50%, 55%, 60%, 65%, and 70%, and the powder ratio was carried out according to the porosity. The thickness of each mixed pressed tablet was set to 0.4mm. It can be calculated that the mass of metal powder and urea are 0.91g:0.73g, 1.00g:0.66g, 1.09g:0.58g, 1.18g:0.51g, and 1.27g:0.44g, respectively. The metal powder and urea were weighed, and magnesium powder with a mass fraction of 5% of aluminum powder was added as a combustion aid. The metal powder and urea were ground separately, and each was put into a pressing mold 2 and pressed into a mixed pressed tablet 22 with a force of 10MPa.

[0066] Step 2: stacking the metal sheets and the mixed pressed sheets together to form a metal blank.

[0067] First, the metal sheet 23 is placed in the pressing mold 2, and then the mixed pressed sheets 22 are laid in the pressing mold 2 in order of porosity from small to large and from bottom to top; a metal pressed sheet 21 with a rectangular depression is placed above the mixed pressed sheet 22, and a pressure of 300 MPa is used to press and hold for 30 seconds to obtain a porous metal blank 31;

[0068] Step 3: Produce porous metal 44 by solid sintering method

[0069] The porous metal blank 31 is placed on a tray 32 and sent into a vacuum atmosphere tubular electric furnace 3, and vacuum is drawn. The temperature curve is set as follows: the heating time from room temperature to about 300°C is 60 minutes, the heat preservation time in the range of 300°C to 320°C is 70 minutes, the heating time from 320°C to 650°C is 70 minutes, the heat preservation time in the range of 640°C to 655°C is 30 minutes, the cooling time from 650°C to 300°C is 70 minutes, and the heat preservation time in the range of 300°C to 270°C is 30 minutes. Finally, after cooling to room temperature, the porous metal 44 is obtained by ultrasonic cleaning to remove impurities.

[0070] Step 4: Perform hydrophilic-hydrophobic modification on the surface of the porous metal 44 .

[0071] The porous metal 44 is placed on a glass support plate 43 and sent to a vacuum plasma cleaning machine 4. After the vacuum is evacuated to -102 KPa with an external vacuum pump, the switch of the B port 42 is opened to introduce argon (Ar) and the power is set to 50%. This step is to remove the oxide film on the aluminum surface. After waiting for five minutes, the power is set to 0 and the vacuum is evacuated to -102 KPa. The switch of the A port 41 is opened to introduce carbon tetrafluoride (CF4) and the power is set to 70%. After waiting for about 10 minutes, the porous metal 44 is taken out to obtain a porous metal with a hydrophobic surface microstructure. The porous metal 44 is then covered with a plasma corrosion-resistant mask 45 on the non-raised part of the hydrophobic porous metal 44, and then placed on a glass support plate 43 and sent to a vacuum plasma cleaning machine 4. After the vacuum is evacuated to a pressure of -102 KPa with an external vacuum pump, the switch of port A 41 is turned on, argon (Ar) is introduced, and the power is set to 70%. After waiting for about 25 minutes, the porous metal 44 is taken out, and the non-raised part is a hydrophobic surface microstructure, and the upper side surface of the rectangular protrusion and the left and right side surfaces are hydrophilic surface microstructures.

[0072] The following is a comparison chart of raw materials and operation items in Example 1 and Example 2:

[0073]

[0074]

[0075]

[0076] Experimental design:

[0077] Prepare the copper powder, urea, nitrogen, carbon tetrafluoride in Example 1, and the aluminum powder, sodium chloride, argon, carbon tetrafluoride in Example 2, as well as corresponding pressing molds, vacuum atmosphere tubular electric furnaces, vacuum plasma cleaning machines and other equipment, and make metal pressing sheets and masks as required.

[0078] Gas-liquid transport experiment (experimental data such as Figure 8 shown):

[0079] Build an experimental device to transport gas and liquid in the same flow channel of the prepared porous material;

[0080] Control the flow rate, pressure and other parameters of gas and liquid, and record the phenomenon of gas-liquid mutual restriction in porous materials with different porosities and materials, such as gas resistance, liquid resistance and gas-liquid separation.

[0081] Experimental summary:

[0082] Influence of material properties: Copper has a high density and poses a greater resistance to gas-liquid flow, but has good chemical stability. It is suitable for gas-liquid transportation scenarios that have high requirements for chemical stability and allow greater resistance. Aluminum has a low density and is suitable for weight-sensitive applications, but its surface is easily oxidized and the oxide film needs to be removed first.

[0083] Porosity influence: The higher the porosity, the larger the space for gas and liquid to flow, but the structural strength of the material will decrease. In high-pressure and low-flow gas and liquid transportation, materials with lower porosity perform better; when low pressure and high flow are used, materials with higher porosity are more suitable.

[0084] Influence of sintering temperature and time: The high temperature section of Example 1 is longer, which makes the material have high crystallinity and high strength, which is conducive to withstanding high-pressure gas-liquid transportation; the low-temperature sintering of Example 2 is suitable for gas-liquid transportation processes involving temperature-sensitive materials.

[0085] Influence of hydrophilic and hydrophobic modification: Different modification gases and time will make the surface hydrophilic and hydrophobic of the material different. The appropriate hydrophilic and hydrophobic modification method can be selected according to the gas-liquid transport direction and separation requirements.

[0086] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A metal structure for boiling heat dissipation in a high heat flux device, comprising a porous metal structure (1), characterized in that: The upper surface of the porous metal structure (1) contacts a liquid medium (13) for heat dissipation; The lower surface of the porous metal structure (1) contacts the heat flow (14); The upper surface of the porous metal structure (1) is provided with a hydrophilic and hydrophobic surface microstructure; The upper surface of the porous metal structure (1) is provided with a rectangular protrusion; The porous metal structure (1) is of gradient porous design; The porous metal structure (1) is of non-uniform porous design.

2. A metal structure for boiling heat dissipation of a high heat flux device according to claim 1, characterized in that: The hydrophilic and hydrophobic surface microstructure comprises a hydrophilic surface microstructure (11) and a hydrophobic surface microstructure (12).

3. The metal structure for boiling heat dissipation of a high heat flux device according to claim 1, characterized in that: The gradient is designed so that the porosity decreases gradually from top to bottom.

4. The metal structure for boiling heat dissipation of a high heat flux device according to claim 1, characterized in that: The non-uniform design is a non-uniform distribution of pores on the same cross section.

5. The metal structure for boiling heat dissipation of a high heat flux device according to claim 1, characterized in that: The hydrophobic surface microstructure (12) is located on the non-raised surface of the upper side of the gradient porous metal structure.

6. The metal structure for boiling heat dissipation of a high heat flux device according to claim 1, characterized in that: The hydrophilic surface microstructure (11) is located on the upper surface and the left and right side surfaces of the rectangular protrusion.

7. The method for preparing a metal structure for boiling heat dissipation of a high heat flux device according to claim 1, characterized in that: The following steps are involved: Step 1: Put metal powder into a pressing mold (2) and press it into a metal sheet (23); Setting different porosities, mixing powders according to the porosity, grinding the mixtures with different porosities respectively, placing them in pressing molds (2) respectively, and pressing them into mixed pressed tablets (22); Step 2: firstly, placing the metal sheet (23) into the pressing mold (2), and then laying the mixed pressed sheets (22) in the pressing mold (2) in order of porosity from small to large and from bottom to top; placing the metal pressed sheet (21) with a rectangular depression on top of the mixed pressed sheet (22), and then pressing it into a porous metal blank (31); Step 3: placing the porous metal blank (31) on a tray (32) and sending it into a vacuum atmosphere tubular electric furnace (3), setting a temperature curve, and sintering after vacuuming to obtain a porous metal (44); Step 4: placing the porous metal (44) on a glass support plate (43) and sending it into a vacuum plasma cleaning machine (4), first evacuating the vacuum and then introducing a gas capable of introducing non-polar functional groups on the metal surface through port A (41) for surface treatment to obtain a porous metal (44) with a hydrophobic surface microstructure; covering the non-raised portion of the porous metal (44) after the hydrophobic treatment with a plasma corrosion-resistant mask (45), then placing it on a glass support plate (43) and sending it into a vacuum plasma cleaning machine (4), first evacuating the vacuum and then introducing a gas capable of introducing polar functional groups on the metal surface through port B (42) to obtain a porous metal (44) with a hydrophilic and hydrophobic structure.

8. The method for preparing a metal structure for boiling heat dissipation of a high heat flux device according to claim 7, characterized in that: The non-protruding part of the porous metal (44) obtained in step seven is a hydrophobic surface microstructure (12), and the upper side surface and the left and right side surfaces of the rectangular protrusion are a hydrophilic surface microstructure (11).

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