Thin liquid film phase change heat dissipation device for coping with ultrahigh heat flow based on micro-channel and nano-porous film

Abstract

The invention discloses a heat dissipation device and a heat dissipation method, and belongs to the technical field of heat dissipation of high-power electronic devices. The device mainly comprises a gradually-shrinking micro-channel radiator which is of a hexagonal structure, a preset number of fan-shaped micro-ribs which are distributed in a radial mode are evenly arranged in the center of the gradually-shrinking micro-channel radiator, and gradually-shrinking micro-channels which are distributed in the radial mode are arranged between the adjacent fan-shaped micro-ribs; the nano-porous membrane is of a circular structure, circular nano through holes are uniformly distributed in the nano-porous membrane, and the nano-porous membrane is located on the gradually-reduced micro-channel radiator; and the liquid supply manifold is of an outer hexagonal and inner circular structure, is located on the micro-channel radiator and surrounds the nano-porous membrane, and the vertex angle of the hexagonal structure is provided with a liquid inlet and outlet. The cooling liquid can be continuously supplied to the tail end, overtemperature damage caused by insufficient liquid supply of the micro-channel at the tail end is effectively avoided, meanwhile, the overall temperature uniformity of the radiator can be guaranteed, and the situation that the radiator is damaged due to large thermal stress is greatly reduced.

Description

Technical Field

[0001] The present application relates to the technical field of heat dissipation of high-power electronic devices, and in particular to heat dissipation of high-performance chips. Background Art

[0002] With the advancement of science and technology, various instruments and equipment are becoming more and more compact and miniaturized, and the integration and power of electronic components such as integrated circuits inside the instruments are also increasing rapidly. The power of the new generation of chips and advanced systems, such as high-power electronic and electrical systems, pulsed power weapon systems, solid-state sensors and phased array radars, has reached 500-1000W / cm 2 , and the local hot spot heat flux can even reach up to 2000W / cm 2 Therefore, there is an urgent need for a heat dissipation method that can meet the requirements of ultra-high power heat dissipation while limiting the overheating to a smaller temperature range suitable for the operation of electronic devices.

[0003] In the prior art, single-phase flow heat transfer in microchannels, phase change heat transfer, thin liquid film phase change heat transfer, and parallel rectangular microchannel liquid supply methods are usually used to dissipate heat from electronic devices. However, single-phase flow heat transfer in microchannels will cause a large temperature gradient on the surface of the device, and its heat dissipation capacity is very limited; the phase change heat transfer method in a closed channel has serious coolant flow and heat transfer instability. Although the thin liquid film phase change based on nanoporous membrane can achieve a heat flux density exceeding 2000W / cm 2 The heat transfer capacity of the nanoporous membrane is improved, but this effect requires a special bottom liquid supply method. The parallel rectangular microchannels used to supply liquid to the nanoporous membrane will cause the liquid supply to the nanoporous membrane to decrease rapidly along the liquid flow direction in the microchannels, resulting in large uneven heat dissipation. Therefore, the width of the heat dissipation device with this structure is limited to less than 200um. Summary of the invention

[0004] In view of the problem of poor heat dissipation effect in the prior art, the present application mainly provides a heat dissipation device and a heat dissipation method.

[0005] In order to achieve the above-mentioned purpose, the first technical solution adopted in the present application is: a heat dissipation device, which includes: a tapered microchannel radiator, which is a hexagonal structure, and a predetermined number of fan-shaped micro-ribs distributed radially are evenly arranged at the center position, and radially distributed tapered microchannels are arranged between adjacent fan-shaped micro-ribs; a nanoporous membrane, which is a circular structure, and has evenly distributed circular nano-through holes thereon, and the nanoporous membrane is located on the tapered microchannel radiator; a liquid supply manifold, which is a hexagonal structure in appearance, and an outer hexagonal inner circular structure with a circular part arranged at the center corresponding to the nanoporous membrane, which is located on the microchannel radiator and surrounds the nanoporous membrane, and liquid inlets and outlets are arranged at the top corners of its hexagonal structure.

[0006] Optionally, the tapered microchannel is a liquid microchannel that tapers toward a center point of the hexagon.

[0007] Optionally, the nanoporous membrane is supported on the tapered microchannel heat sink through fan-shaped micro-ribs, and the nanoporous membrane is tightly connected to the fan-shaped micro-ribs through a bonding process.

[0008] Optionally, the cooling liquid in the tapered microchannel reaches the upper surface of the nanoporous membrane through the circular nano-through holes.

[0009] Optionally, an annular liquid supply manifold is connected to the outer side of the tapered microchannel radiator.

[0010] Optionally, the liquid supply manifold is tightly connected to the tapered microchannel heat sink using a key and technology, and the inner circular edge of the liquid supply manifold is fitted with the outer edge of the circular nanoporous membrane.

[0011] Optionally, the shape of the liquid inlet and outlet is one-third of a circle.

[0012] Optionally, the coolant flows into the tapered microchannels in the tapered microchannel heat sink through the liquid inlet and outlet of the liquid supply manifold, and flows into the nanoporous membrane through the tapered microchannels.

[0013] Optionally, multiple heat sinks are interconnected to meet the heat dissipation requirements of large-area and unconventional-shaped heat sources.

[0014] The second technical solution adopted in the present application is: a heat dissipation method, which includes: introducing or leading the cooling liquid into or out of the heat dissipation device through an outer hexagonal inner circular structure with a circular part arranged at the center corresponding to the nanoporous membrane, and a liquid supply manifold located on the microchannel radiator surrounding the nanoporous membrane, and a liquid inlet and outlet arranged at the top corner of the hexagonal structure; through a tapered microchannel radiator with a hexagonal structure and a predetermined number of fan-shaped micro-ribs evenly arranged in a radial pattern at the center position, and radially distributed tapered microchannels arranged between adjacent fan-shaped micro-ribs, the cooling liquid introduced by the liquid supply manifold is drained under the nanoporous membrane; using a nanoporous membrane with a circular structure and evenly distributed circular nanopores thereon, the heat source is cooled by the cooling liquid flowing into and out of the circular nanopores, wherein the nanoporous membrane is located on the tapered microchannel radiator.

[0015] Optionally, the tapered microchannel is a liquid microchannel that tapers toward a center point of the hexagon.

[0016] Optionally, the nanoporous membrane is supported on the tapered microchannel heat sink through fan-shaped micro-ribs, and the nanoporous membrane is tightly connected to the fan-shaped micro-ribs through a bonding process.

[0017] Optionally, the cooling liquid in the tapered microchannel reaches the upper surface of the nanoporous membrane through the circular nano-through holes.

[0018] Optionally, an annular liquid supply manifold is connected to the outer side of the tapered microchannel radiator.

[0019] Optionally, the liquid supply manifold is tightly connected to the tapered microchannel heat sink using a key and technology, and the inner circular edge of the liquid supply manifold is fitted with the outer edge of the circular nanoporous membrane.

[0020] Optionally, the shape of the liquid inlet and outlet is one-third of a circle.

[0021] Optionally, the coolant flows into the tapered microchannels in the tapered microchannel heat sink through the liquid inlet and outlet of the liquid supply manifold, and flows into the nanoporous membrane through the tapered microchannels.

[0022] Optionally, multiple heat sinks are interconnected to meet the heat dissipation requirements of large-area and unconventional-shaped heat sources.

[0023] The tapered microchannel of the present application can maintain a high liquid supply pressure within a longer channel length, and can continuously supply coolant to the end, effectively avoiding over-temperature damage of the end microchannel due to insufficient liquid supply. Secondly, by arranging the tapered microchannel radially, the situation of insufficient liquid supply when the cross-sectional area of ​​the microchannel end is small but a larger area needs to be cooled is avoided, effectively ensuring the overall temperature uniformity of the radiator, and greatly reducing the situation where the radiator is damaged due to large thermal stress. In addition, by arranging a nanoporous membrane above the microchannel, the coolant heated to the saturation temperature flows through the nanopores to the top of the porous membrane. The coolant is heated by the porous membrane and undergoes phase change, taking away a large amount of heat. The disadvantages of phase change heat transfer in the microchannel, such as unstable flow and heat transfer, are avoided while still being able to give play to the advantages of low temperature rise and strong heat dissipation capacity of phase change heat transfer. This avoids the situation where the supercooled coolant is heated to the saturation temperature in the microchannel and continues to be heated and will undergo phase change, and the phase change heat transfer in the microchannel will result in unstable flow and uneven heat dissipation. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0025] Figure 1 It is a schematic diagram of structural components of a heat dissipation device of the present application;

[0026] Figure 2 It is a schematic diagram of a combination of structural components of a heat dissipation device of the present application;

[0027] Figure 3 Schematic diagram of the positional relationship of the structural components of a heat dissipation device of the present application, wherein: Figure 3 (a) is a three-view diagram of the heat dissipation device of the present application in the front view, side view and top view directions; Figure 3 (b) is a three-view diagram of the tapered microchannel heat sink of the present application in the front view, side view and top view directions, Figure 3 (c1) is the three-view diagram of the liquid supply manifold in the front, side and top view directions. Figure 3 (c2) is a rear view of the liquid supply manifold;

[0028] Figure 4 It is a schematic diagram of a specific implementation of a heat dissipation method of the present application.

[0029] The above drawings have shown clear embodiments of the present application, which will be described in more detail later. These drawings and text descriptions are not intended to limit the scope of the present application in any way, but to illustrate the concept of the present application to those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0030] The preferred embodiments of the present application are described in detail below in conjunction with the accompanying drawings so that the advantages and features of the present application can be more easily understood by those skilled in the art, thereby making a clearer and more definite definition of the protection scope of the present application.

[0031] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "include..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0032] With the advancement of science and technology, various instruments and equipment are becoming more and more compact and miniaturized, and the integration and power of electronic components such as integrated circuits inside the instruments are also increasing rapidly. The power of the new generation of chips and advanced systems, such as high-power electronic and electrical systems, pulsed power weapon systems, solid-state sensors and phased array radars, has reached 500-1000W / cm 2 , and the local hot spot heat flux can even reach up to 2000W / cm 2 Therefore, people are in urgent need of a heat dissipation method that can meet the requirements of ultra-high power heat dissipation while limiting the overheating to a smaller temperature range suitable for the operation of electronic devices. In the prior art, single-phase flow heat transfer in microchannels, phase change heat transfer, thin liquid film phase change heat transfer, and parallel rectangular microchannel liquid supply methods are usually used to dissipate heat from electronic devices.

[0033] However, the single-phase flow in the microchannel will cause a temperature gradient on the device surface, and its heat dissipation capacity in maintaining the temperature within the optimal operating temperature of the chip (70°C) is very limited. Phase change heat transfer is widely used because of its small temperature difference and high heat flux density. However, due to the complexity of the two-phase flow in the microchannel, the phase change heat transfer method is prone to flow instability and temperature instability, which will lead to unstable pressure drop of the radiator and cause the chip to bear periodic thermal stress.

[0034] Compared with the above two cooling methods, the thin liquid film phase change heat transfer method can achieve over 2000W / cm by maintaining high-frequency nucleate boiling in an extremely thin liquid film. 2 The thin liquid film phase change can maintain extremely low superheat under high heat flux, thanks to its unique negative differential phase change curve, which is very suitable for the heat dissipation needs of high-power chips. However, due to the unique bottom liquid supply method of the thin liquid film phase change, it is difficult to solve the problem of chip heat dissipation in practical applications.

[0035] In 2018, Hanks et al. from MIT fabricated a phase-change heat exchange device by bonding a nanoporous membrane to a conventional parallel rectangular microchannel. The device achieved a temperature rise of 28.5°C and a power of 665 W / cm2 using pentane as the coolant. 2 However, due to the high pressure drop characteristics of the parallel rectangular microchannels, the width of the heat sink is only 200um, and there are large uneven liquid supply and heat transfer phenomena, which cannot meet the actual chip heat dissipation needs.

[0036] That is to say, in the existing heat dissipation methods, single-phase flow heat transfer in microchannels will cause a large temperature gradient on the device surface, and its heat dissipation capacity is very limited; the phase change heat transfer method in closed channels has serious coolant flow and heat transfer instability. Although the thin liquid film phase change based on nanoporous membranes can achieve a heat flux density of over 2000W / cm 2 The heat transfer capacity of the nanoporous membrane is improved, but this effect requires a special bottom liquid supply method. The parallel rectangular microchannels used to supply liquid to the nanoporous membrane will cause the liquid supply to the nanoporous membrane to decrease rapidly along the liquid flow direction in the microchannels, resulting in large uneven heat dissipation. Therefore, the width of the heat dissipation device with this structure is limited to less than 200um.

[0037] Based on the problems existing in the prior art, this application proposes a thin liquid film phase change heat dissipation device based on microchannels and nanoporous membranes under ultra-high heat flux. The device is composed of a tapered microchannel heat sink, a liquid supply manifold and a nanoporous membrane. It can meet the requirements of over 2000W / cm by realizing a thin liquid film phase change on the surface of the nanoporous membrane. 2 At the same time, the hexagonal structure of the heat sink can be used to connect and expand multiple heat sinks, thereby meeting the heat dissipation needs of ultra-high heat flux density heat sources of various shapes and areas, and thus adapting to the application of more heat dissipation scenarios.

[0038] Figure 1 A schematic diagram of structural components of a heat dissipation device of the present application is shown.

[0039] Figure 1The heat dissipation device shown includes: a tapered microchannel radiator, which is a hexagonal structure, and a predetermined number of fan-shaped micro-ribs distributed radially are evenly arranged at the center position, and radially distributed tapered microchannels are arranged between adjacent fan-shaped micro-ribs; a nanoporous membrane, which is a circular structure and has evenly distributed circular nano-through holes, and the nanoporous membrane is located on the tapered microchannel radiator; a liquid supply manifold, which is a hexagonal structure in appearance, and an outer hexagonal inner circular structure with a circular part arranged at the center corresponding to the nanoporous membrane, which is located on the microchannel radiator and surrounds the nanoporous membrane, and a liquid inlet and outlet are arranged at the top corners of the hexagonal structure.

[0040] This specific implementation method can maintain a higher liquid supply pressure within a longer channel length through the tapered microchannel, and can continuously supply coolant to the end, effectively avoiding over-temperature damage of the end microchannel due to insufficient liquid supply. Secondly, by arranging the tapered microchannel radially, the situation of insufficient liquid supply when the cross-sectional area of ​​the microchannel end is small but a larger area needs to be cooled is avoided, effectively ensuring the overall temperature uniformity of the radiator, and greatly reducing the situation where the radiator is damaged due to large thermal stress. In addition, by arranging a nanoporous membrane above the microchannel, the coolant heated to the saturation temperature flows through the nanopores to the top of the porous membrane. The coolant is heated by the porous membrane and undergoes phase change, taking away a large amount of heat. The disadvantages of phase change heat transfer in the microchannel, such as unstable flow and heat transfer, are avoided while still being able to give play to the advantages of low temperature rise and strong heat dissipation capacity of phase change heat transfer. It is avoided that after the supercooled coolant is heated to the saturation temperature in the microchannel, if it continues to be heated, it will undergo phase change, and the phase change heat transfer in the microchannel will result in unstable flow and uneven heat dissipation.

[0041] Specifically, Figure 1 As shown, the heat dissipation device includes a hexagonal tapered microchannel heat sink, a circular nanoporous membrane, and a liquid supply manifold with an outer hexagon and an inner circle.

[0042] Figure 2 It is a schematic diagram of a combination of structural components of a heat dissipation device of the present application. Figure 3 (a) is a three-view diagram of the heat dissipation device of the present application in the front view, side view and top view. Figure 2 and Figure 3 As shown, the tapered microchannel heat sink is located at the bottom of the heat sink, the circular nanoporous membrane is located on the fan-shaped micro-ribs of the microchannel heat sink, and the liquid supply manifold with an annular outer hexagonal inner circular structure is located on the tapered microchannel heat sink, wherein the above three structures are closely connected to each other. Preferably, the connection process is a bonding process, wherein the above connection method is only exemplary, and the present application does not limit the specific method of connecting the above three structures.

[0043] Figure 3(b) is a three-view diagram of the tapered microchannel heat sink of the present application in the front view, side view and top view directions, as shown in FIG. Figure 3 As shown in (b), a plurality of evenly distributed fan-shaped micro-ribs and a plurality of evenly distributed tapered micro-channels are provided on the tapered micro-channel heat sink, wherein the fan-shaped micro-ribs are radially distributed on the tapered micro-channel heat sink with the center point of the hexagon as the fan-shaped vertex; the grooves between adjacent fan-shaped micro-ribs form tapered micro-channels, which are liquid micro-channels that are radially distributed and tapered toward the center point of the hexagon.

[0044] The circular nanoporous membrane is provided with uniformly distributed circular nano-through holes penetrating the upper and lower surfaces of the membrane, and the nanoporous membrane is supported on the tapered micro-channel radiator through fan-shaped micro-ribs.

[0045] Figure 3 (c1) is the three-view diagram of the liquid supply manifold in the front, side and top view directions. Figure 3 (c2) is the rear view of the liquid supply manifold, as shown in Figure 3 (c1) and Figure 3 As shown in (c2), the liquid supply manifold is provided with a circular structure with the center point of the outer hexagon as the center and the circular nanoporous membrane as the diameter to ensure that the circular nanoporous membrane can take away a large amount of heat from the device. Liquid inlets and outlets are also provided at the top corners of the hexagonal structure. The shape of the liquid inlet and outlet can be one-third of a circle or one-half of a circle. The present application does not limit the specific shape of the liquid inlet and outlet. Secondly, the specific setting position of the liquid inlet and outlet provided above is only exemplary and can be adjusted accordingly according to actual usage in actual applications.

[0046] In particular, the circular part of the liquid supply manifold is the same size as the nanoporous membrane, the length of the fan-shaped micro-ribs is greater than the diameter of the nanoporous membrane, the lower part of the liquid inlet and outlet is a radially distributed tapered microchannel, and the outer side of the tapered microchannel radiator is tightly connected to the annular liquid supply manifold.

[0047] In a specific embodiment of the present application, multiple heat sinks are interconnected to meet the heat dissipation requirements of large-area and unconventional-shaped heat sources. That is, when facing unconventional and large-area heat sources, multiple hexagonal heat sinks can be combined to effectively meet the heat dissipation requirements of large-area and unconventional-shaped heat sources. The present application has the characteristics of low power consumption and strong heat dissipation capacity. The present application modularizes the heat sink to achieve device expansion and can meet 2000W / cm 2 It can meet the cooling requirements of any shape and any area with ultra-high heat flux density of the same scale.

[0048] In a specific embodiment of the present application, the material of the regular hexagonal microchannel heat sink is silicon (Si). During the manufacturing process, the shape of the microchannel heat sink is first determined by photolithography technology, that is, the circumscribed circle diameter of the regular hexagonal microchannel heat sink, the angular arc of the fan-shaped micro-ribs and the angle of the center angle occupied by the tapered microchannel are determined, and then the corresponding shape is depicted by photolithography technology, wherein the circumscribed circle diameter of the regular hexagonal microchannel heat sink can be 300-500um, the angular arc of the fan-shaped micro-ribs can be 1-3°, and the angle of the center angle occupied by the radially tapered microchannel can be 2-5°. Then, deep reactive ion etching technology (deep silicon etching) is used to prepare a tapered microchannel of a predetermined depth, thereby completing the preparation of the microchannel heat sink, wherein the depth of the tapered microchannel can be 2-4um.

[0049] The material of the circular nanoporous membrane is silicon (Si), and its diameter needs to be smaller than the diameter of the inscribed circle of the regular hexagonal microchannel heat sink. Circular nanopores or nanopores of other shapes are prepared thereon by interference lithography / deep silicon etching process, wherein the thickness of the nanoporous membrane can be 1-3um, the diameter can be 200-400um, the diameter of the nanopore can be 100-200nm, and the porosity can be set to 30-50%.

[0050] The material of the liquid supply manifold is silicon (Si). Like the microchannel radiator, its shape is determined by photolithography technology. The diameter of the circumscribed circle of its outer ring regular hexagon is the same as the diameter of the circumscribed circle of the regular hexagonal microchannel radiator, and the diameter of the inner ring is the same as the diameter of the circular nanoporous membrane. Through deep reactive ion etching technology (deep silicon etching), a manifold channel of a predetermined depth can be prepared thereon, wherein the depth of the manifold channel can be 50-100um.

[0051] In a specific embodiment of the present application, Figure 3 Schematic diagram of the position relationship of the structural components of a heat dissipation device of the present application, such as Figure 3 As shown, the bottom of the heat sink is in contact with the heat source, and the coolant with a certain degree of supercooling flows into the heat sink through the liquid inlet and outlet on the liquid supply manifold, and the coolant is evenly distributed to the tapered microchannels below the liquid inlet and outlet. The coolant flows through the tapered microchannels to the hexagonal center point of the tapered microchannel radiator and is evenly distributed in the tapered microchannels. The coolant in the tapered microchannels contacts the wall of the microchannel radiator, and single-side convection heat transfer occurs. The coolant is gradually heated to the saturation temperature, taking away part of the heat from the heat source.

[0052] After the coolant below the nanoporous membrane is heated, it reaches the upper surface of the nanoporous membrane from the circular nanopores under the action of pressure difference, forming a thin liquid film and causing phase change heat transfer. That is, the coolant in the tapered microchannel reaches the upper surface of the nanoporous membrane from the circular nanopores, is heated at the upper surface of the nanoporous membrane, undergoes phase change, and takes away a large amount of heat.

[0053] All the coolants involved in heat exchange will undergo phase change, and the radiator can be an open radiator or a closed radiator. If the radiator is an open radiator, the steam generated by the phase change can be directly diffused into the environment to complete the outflow of the coolant; if the radiator is a closed radiator, the steam generated on the upper surface of the nanoporous membrane is discharged into a closed space and then pumped away by a vacuum pump.

[0054] The device separates single-phase heat transfer from phase change heat transfer, making full use of the flow stability of single-phase heat transfer and the ultra-high heat dissipation capacity of thin liquid film phase change heat transfer. While having super heat transfer performance, it avoids the flow instability of phase change heat transfer in the microchannel.

[0055] Figure 4 A specific implementation of a heat dissipation method of the present application is shown.

[0056] exist Figure 4 In the specific embodiment shown, the heat dissipation method mainly includes: step S401, introducing or leading the cooling liquid into or out of the heat dissipation device through an outer hexagonal inner circular structure having a hexagonal structure and a circular portion arranged at the center corresponding to the nanoporous membrane, and a liquid supply manifold located on the microchannel radiator surrounding the nanoporous membrane, and a liquid inlet and outlet arranged at the top corner of the hexagonal structure; step S402, through a tapered microchannel radiator having a hexagonal structure and a predetermined number of fan-shaped micro-ribs uniformly arranged at the center position in a radially distributed manner, and radially distributed tapered microchannels arranged between adjacent fan-shaped micro-ribs, the cooling liquid introduced by the liquid supply manifold is drained under the nanoporous membrane; step S403, using a nanoporous membrane having a circular structure and uniformly distributed circular nanopores thereon, the heat source is cooled by the cooling liquid flowing into and out of the circular nanopores, wherein the nanoporous membrane is located on the tapered microchannel radiator.

[0057] In this specific embodiment, a high liquid supply pressure can be maintained within a longer channel length through a tapered microchannel, and the coolant can be continuously supplied to the end, effectively avoiding over-temperature damage to the end microchannel due to insufficient liquid supply. Secondly, by arranging the tapered microchannel radially, the situation of insufficient liquid supply when the cross-sectional area of ​​the microchannel end is small but a larger area needs to be cooled is avoided, effectively ensuring the overall temperature uniformity of the radiator, and greatly reducing the situation where the radiator is damaged due to large thermal stress. In addition, by arranging a nanoporous membrane above the microchannel, the coolant heated to the saturation temperature flows through the nanopores to the top of the porous membrane. The coolant is heated by the porous membrane and undergoes a phase change, taking away a large amount of heat. The disadvantages of unstable flow and heat transfer of phase change heat transfer in the microchannel are avoided, while the advantages of low temperature rise and strong heat dissipation capacity of phase change heat transfer can still be exerted, and the supercooled coolant is avoided from undergoing a phase change if it continues to be heated after being heated to the saturation temperature in the microchannel, and the phase change heat transfer in the microchannel will result in unstable flow and uneven heat dissipation.

[0058] In a specific embodiment of the present application, the tapered microchannel is a liquid microchannel that tapers toward the center point of the hexagon.

[0059] In a specific embodiment of the present application, the nanoporous membrane is supported on the tapered microchannel heat sink through fan-shaped micro-ribs, and the nanoporous membrane is tightly connected to the fan-shaped micro-ribs through a bonding process.

[0060] In a specific embodiment of the present application, the cooling liquid in the tapered microchannel reaches the upper surface of the nanoporous membrane through the circular nano-through holes.

[0061] In a specific embodiment of the present application, the outer side of the tapered microchannel radiator is connected to an annular liquid supply manifold.

[0062] In a specific embodiment of the present application, the liquid supply manifold is tightly connected to the tapered microchannel heat sink by using keys and technology, and the inner circular edge of the liquid supply manifold is fitted with the outer edge of the circular nanoporous membrane.

[0063] In a specific embodiment of the present application, the shape of the liquid inlet and outlet is one-third of a circle.

[0064] In a specific embodiment of the present application, the cooling liquid flows into the tapered microchannel in the tapered microchannel heat sink through the liquid inlet and outlet of the liquid supply manifold, and flows into the nanoporous membrane through the tapered microchannel.

[0065] In a specific embodiment of the present application, a plurality of heat dissipation devices are interconnected to meet the heat dissipation requirements of heat sources with large areas and unconventional shapes.

[0066] In the several embodiments provided in the present application, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the device embodiments described above are only schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0067] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0068] The above description is only an embodiment of the present application and does not limit the patent scope of the present application. Any equivalent structural transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A heat dissipation device, characterized in that: include: The tapered microchannel heat sink has a hexagonal structure, and a predetermined number of fan-shaped micro-ribs distributed radially are evenly arranged at the center thereof, and radially distributed tapered micro-channels are arranged between adjacent fan-shaped micro-ribs; A nanoporous membrane, which is a circular structure and has evenly distributed circular nano-through holes, and the nanoporous membrane is located on the tapered microchannel heat sink; The liquid supply manifold is a hexagonal structure with an outer hexagonal inner circular structure having a circular portion at the center corresponding to the nanoporous membrane. It is located on the microchannel radiator and surrounds the nanoporous membrane. The top corners of the hexagonal structure are provided with liquid inlets and outlets.

2. The heat dissipation device according to claim 1, characterized in that: The tapered microchannel is a liquid microchannel that tapers toward the center point of the hexagon.

3. The heat dissipation device according to claim 1, characterized in that: The nanoporous membrane is supported on the tapered microchannel heat sink through the fan-shaped micro-ribs, and the nanoporous membrane is tightly connected to the fan-shaped micro-ribs through a bonding process.

4. The heat dissipation device according to claim 1, characterized in that: The cooling liquid in the tapered microchannel reaches the upper surface of the nanoporous membrane through the circular nano-through hole.

5. The heat dissipation device according to claim 1, characterized in that: The outer side of the tapered microchannel radiator is connected to the annular liquid supply manifold.

6. The heat dissipation device according to claim 1, characterized in that: The liquid supply manifold is tightly connected to the tapered microchannel heat sink by using keys and technology, and the inner circular edge of the liquid supply manifold is fitted with the outer edge of the circular nanoporous membrane.

7. The heat dissipation device according to claim 1, characterized in that: The shape of the liquid inlet and outlet is one-third of a circle.

8. The heat dissipation device according to claim 1, characterized in that: The cooling liquid flows into the tapered microchannel in the tapered microchannel radiator through the liquid inlet and outlet of the liquid supply manifold, and flows into the nanoporous membrane through the tapered microchannel.

9. The heat dissipation device according to claim 1, characterized in that: Connect multiple heat sinks to meet the cooling needs of large-area and unconventional-shaped heat sources.

10. A heat dissipation method, characterized in that: include: The coolant is introduced into or led out of the heat dissipation device through a liquid supply manifold having an outer hexagonal inner circular structure with a circular portion arranged at the center corresponding to the nanoporous membrane, and surrounding the nanoporous membrane on the microchannel heat sink, and having a liquid inlet and outlet arranged at the top corner of the hexagonal structure; The cooling liquid introduced by the liquid supply manifold is drained to the bottom of the nanoporous membrane by a tapered microchannel radiator having a hexagonal structure and a predetermined number of fan-shaped micro-ribs evenly arranged at the center thereof and radially distributed tapered microchannels arranged between adjacent fan-shaped micro-ribs; A nanoporous membrane having a circular structure and uniformly distributed circular nano-through holes is used to cool a heat source by means of a cooling liquid flowing into and out of the circular nano-through holes, wherein the nanoporous membrane is located above the tapered microchannel radiator.

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