Planar liquid cooling chip

Abstract

The invention relates to the field of three-dimensional chips, and discloses a planar liquid cooling chip, the planar liquid cooling chip comprises a packaging cover, a pump body and a plurality of chip assemblies, the pump body and the chip assemblies are located in the packaging cover, the plurality of chip assemblies are stacked, cooling channels are arranged between the chip assemblies and / or between the chip assemblies, the packaging cover and the cooling channels are filled with a cooling agent, and the cooling agent is arranged between the pump body and the chip assemblies. The pump body is used for driving a coolant to flow. The pump body works, a coolant flows in the packaging cover and the cooling channel, heat of each chip assembly can be directly transmitted to the packaging cover through the coolant, and the heat dissipation efficiency of stacked chips is improved; meanwhile, the packaging cover is filled with the coolant in advance, so that on one hand, the quality of the coolant can be controlled; and on the other hand, the planar liquid cooling chip provided by the invention is the same as a conventional packaging chip circulating in the market at present in use method, and the planar liquid cooling chip and the conventional packaging chip are convenient for users to use.

Description

Technical Field

[0001] The present application relates to the field of three-dimensional chips, and in particular to a planar liquid-cooled chip. Background Art

[0002] Three-dimensional chip packaging can improve chip integration and reduce chip costs, and is the future development direction of the integrated circuit field.

[0003] However, as chip integration increases, the heat generated during chip operation tends to be concentrated in the package and is difficult to dissipate effectively. Summary of the invention

[0004] In order to improve the heat dissipation efficiency of stacked chips, the present application provides a planar liquid-cooled chip.

[0005] The present application provides a planar liquid cooling chip, which adopts the following technical solution: A planar liquid cooling chip comprises a packaging cover, a pump body and a plurality of chip components. The chip assembly is located in the packaging cover, A plurality of the chip assemblies are stacked, and cooling channels are provided between the chip assemblies and / or between the chip assemblies. The packaging cover and the cooling channel are filled with coolant. The pump body is used to drive the coolant to flow.

[0006] By adopting the above technical solution, the pump body works, the coolant flows in the packaging cover and the cooling channel, and the heat of each chip component can be directly transferred to the packaging cover through the coolant, thereby improving the heat dissipation efficiency of the stacked chips.

[0007] Preferably, the chip assembly includes a bare chip or a packaged chip.

[0008] Preferably, the chip assembly includes a bare chip and a substrate, or the chip assembly includes a packaged chip and a substrate.

[0009] By adopting the above technical solution, various chips can be stacked without being limited to the chip's solder pins and pads, thereby increasing the scope of application.

[0010] Preferably, the pump body comprises a pump casing and a drive assembly, the pump casing has an inlet and an outlet, the pump casing is elastic, and the drive assembly is used to drive the pump casing to deform.

[0011] By adopting the above technical solution, the pump casing is deformed to change the volume of the pump casing. When the volume of the pump casing increases, the coolant flows into the pump casing, and when the volume of the pump casing decreases, the coolant flows out of the pump casing, so as to drive the coolant to flow in the packaging cover and the cooling channel.

[0012] Preferably, the driving assembly comprises a magnet and an electromagnet, the magnet is connected to the pump housing, and the electromagnet is connected to the packaging cover.

[0013] By adopting the above technical solution, the displacement of the magnet is controlled by controlling the power on and off of the electromagnet, thereby causing the pump housing to deform.

[0014] Preferably, the driving component comprises a piezoelectric ceramic, one end of the piezoelectric ceramic is connected to the packaging cover, and the other end of the piezoelectric ceramic is connected to the pump housing.

[0015] By adopting the above technical solution, the voltage loaded on the piezoelectric ceramic is controlled to control the deformation of the piezoelectric ceramic, thereby causing the pump housing to deform.

[0016] Preferably, the pump body further comprises a one-way component, wherein the one-way component is used to allow the coolant to flow into the pump casing from the inlet in a one-way manner, and the one-way component is used to allow the coolant to flow out of the pump casing from the outlet in a one-way manner.

[0017] By adopting the above technical solution, during the change of the pump casing volume, the one-way component allows the coolant to flow in one direction to control the flow direction of the coolant, which is beneficial for the coolant to circulate in the packaging cover.

[0018] Preferably, the one-way component comprises a valve.

[0019] By adopting the above technical solution, the valve has a simple structure, a simple manufacturing process and low cost.

[0020] Preferably, the pump body is located in a packaging cover.

[0021] By adopting the above technical solution, the coolant is pre-filled into the packaging cover: on the one hand, the quality of the coolant can be controlled; on the other hand, the planar liquid cooling chip provided by the present application and the conventional packaging chip currently circulating on the market have the same usage method, which is convenient for users to use.

[0022] Preferably, the pump body is used to transfer heat to the packaging cover.

[0023] By adopting the above technical solution, the heat of the coolant is immediately transferred to the packaging cover, and the packaging cover is cooled by the external heat dissipation device outside the packaging cover.

[0024] In summary, the present application includes at least one of the following beneficial technical effects: 1. When the pump body is working, the coolant flows in the packaging cover and cooling channel. The heat of each chip component can be directly transferred to the packaging cover through the coolant, thereby improving the heat dissipation efficiency of the stacked chips; 2. The coolant is pre-filled into the packaging cover: on the one hand, the quality of the coolant can be controlled; on the other hand, the planar liquid cooling chip provided by the present application and the conventional packaging chip currently circulating on the market have the same usage method, which is convenient for users to use; 3. The pump body has a simple structure, no rotor structure, is easy to miniaturize, and is suitable for chips. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 This is a schematic diagram of the structure of the planar liquid cooling chip in Example 1.

[0026] Figure 2 It is a schematic diagram of the structure of a planar liquid-cooled chip when the chip assembly includes a substrate.

[0027] Figure 3 It is a schematic diagram of the structure of a planar liquid cooling chip in another embodiment.

[0028] Figure 4 It is a schematic diagram of the structure of a flat liquid-cooled chip when the packaging cover has a layer.

[0029] Figure 5 It is a schematic diagram of the structure of a planar liquid cooling chip when the packaging cover has an interlayer and the pump body is located in the interlayer.

[0030] Figure 6 This is a schematic diagram of the structure of the planar liquid cooling chip in Example 2.

[0031] Explanation of the reference numerals: 1. Packaging cover; 11. Interlayer cavity; 2. Chip assembly; 21. Substrate; 22. Flow channel; 3. Cooling channel; 4. Pump body; 41. Pump casing; 42. Drive assembly; 421. Magnet; 422. Electromagnet; 423. Piezoelectric ceramic; 43. One-way assembly. DETAILED DESCRIPTION

[0032] The present application is further described in detail below in conjunction with the accompanying drawings.

[0033] The embodiment of the present application discloses a planar liquid cooling chip.

[0034] Embodiment 1 of the present application Reference Figure 1 The planar liquid cooling chip comprises a packaging cover 1 and a plurality of chip components 2. The chip components 2 are located in the packaging cover 1.

[0035] Several chip assemblies 2 are stacked, and cooling channels 3 are provided between the chip assemblies 2 and / or between the chip assemblies 2 .

[0036] The chip assembly 2 includes a bare chip or a packaged chip, or the chip assembly 2 includes a bare chip and a substrate 21 , or the chip assembly 2 includes a packaged chip and a substrate 21 .

[0037] Reference Figure 1 In the case where the chip assembly 2 includes a bare chip or a packaged chip, multiple bare chips (or multiple packaged chips) are stacked, and the gaps between the bare chips (or packaged chips) form a cooling channel 3, that is, there is a cooling channel 3 between the chip assemblies 2.

[0038] Reference Figure 2 In the case where the chip assembly 2 includes a bare chip and a substrate 21, or the chip assembly 2 includes a packaged chip and a substrate 21, one side or both sides of the substrate 21 are connected to the bare chip (or packaged chip), multiple substrates 21 are stacked, and the gaps between the substrates 21 form a cooling channel 3, that is, there is a cooling channel 3 between the chip assemblies 2.

[0039] When the chip assembly 2 includes a bare chip and a substrate 21, or when the chip assembly 2 includes a packaged chip and a substrate 21, a flow channel 22 can be set at the substrate 21. The flow channel 22 can pass through both sides of the substrate 21. The flow channel 22 can also be located in the middle of the substrate 21 in the thickness direction and the flow channel 22 passes through the edge of the substrate 21. The flow channel 22 forms a cooling channel 3, that is, the chip assembly 2 has a cooling channel 3.

[0040] The packaging cover 1 and the cooling channel 3 are filled with coolant. The planar liquid cooling chip further includes a pump body 4, which is used to drive the coolant to flow.

[0041] Reference Figure 1 In this embodiment, the pump body 4 is located inside the packaging cover 1.

[0042] The pump body 4 comprises a pump housing 41, a driving assembly 42 and a one-way assembly 43. The pump housing 41 has an inlet and an outlet, and is elastic. The driving assembly 42 is used to drive the pump housing 41 to deform.

[0043] In one embodiment, the driving assembly 42 includes a magnet 421 and an electromagnet 422, wherein the magnet 421 is connected to the pump housing 41, and the electromagnet 421 is connected to the packaging cover 1. The magnet 421 and the electromagnet 421 may be located on the same side of the pump body 4, or may be located on both sides of the pump body 4 respectively.

[0044] Reference Figure 3 In another embodiment, the driving component 42 includes a piezoelectric ceramic 423 , one end of the piezoelectric ceramic 423 is connected to the packaging cover 1 , and the other end of the piezoelectric ceramic 423 is connected to the pump housing 41 .

[0045] The one-way component 43 is used to allow the coolant to flow into the pump housing 41 from the inlet in one direction, and the one-way component 43 is used to allow the coolant to flow out of the pump housing 41 from the outlet in one direction. The one-way component 43 includes a valve. The valve is provided at the inlet and the outlet.

[0046] Reference Figure 4In another embodiment, the packaging cover 1 is provided with an interlayer cavity 11; specifically, the iron shell of the packaging cover 1 is provided with an interlayer cavity 11. The interlayer cavity 11 is connected to the cooling channel 3, and the pump body 4 is located on one side of all the chip components 2.

[0047] Reference Figure 5 In another embodiment, the packaging cover 1 is provided with an interlayer cavity 11; specifically, the iron shell of the packaging cover 1 is provided with an interlayer cavity 11. The interlayer cavity 11 is connected to the cooling channel 3, and the pump body 4 is located in the interlayer cavity 11.

[0048] In another embodiment, heat is directly transferred between the pump housing 41 and the packaging cover 1; for example, the pump housing 41 and the packaging cover 1 are integrated.

[0049] The implementation principle of a planar liquid-cooled chip in Example 1 of the present application is: the pump body 4 works, the coolant flows in the packaging cover 1 and the cooling channel 3, and the heat of each chip component 2 can be directly transferred to the packaging cover 1 through the coolant, thereby improving the heat dissipation efficiency of the stacked chips; the packaging cover 1 is cooled by an external heat dissipation system.

[0050] At the same time, the coolant is pre-filled into the packaging cover 1: on the one hand, the quality of the coolant can be controlled; on the other hand, the planar liquid cooling chip provided by the present application and the conventional packaging chip currently circulating on the market have the same usage method, which is convenient for users to use.

[0051] Embodiment 2 of the present application The difference between this embodiment and embodiment 1 is that: Figure 6 , the pump body 4 is located outside the packaging cover 1.

[0052] The packaging cover 1 is provided with two communication ports.

[0053] One communication port of the packaging cover 1 is connected to the inlet of the pump body 4 through a pipeline, and the other communication port of the packaging cover 1 is connected to the outlet of the pump body 4 through a pipeline.

[0054] A further embodiment: the planar liquid cooling chip further includes a heat dissipation container; the heat dissipation container is connected between the packaging cover 1 and the pump body 4, and the heat dissipation container, the packaging cover 1 and the pump body 4 are isolated from the outside world, which is beneficial to ensure the quality of the coolant. The heat dissipation container is cooled by an external heat dissipation system (such as a fan, etc.).

[0055] Another further embodiment: the planar liquid cooling chip also includes a heat dissipation container; the heat dissipation container is connected between the packaging cover 1 and the pump body 4; wherein the heat dissipation container has an opening, and the coolant can be added or replaced into the heat dissipation container through the opening.

[0056] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A planar liquid cooling chip, characterized in that: It comprises a packaging cover (1), a pump body (4) and a plurality of chip components (2). The chip component (2) is located in the packaging cover (1). A plurality of the chip assemblies (2) are stacked, and cooling channels (3) are provided between the chip assemblies (2) and / or between the chip assemblies (2). The packaging cover (1) and the cooling channel (3) are filled with a coolant. The pump body (4) is used to drive the coolant to flow.

2. The planar liquid cooling chip according to claim 1, characterized in that: The chip assembly (2) comprises a bare chip or a packaged chip.

3. The planar liquid cooling chip according to claim 1, characterized in that: The chip assembly (2) comprises a bare chip and a substrate (21), or the chip assembly (2) comprises a packaged chip and a substrate (21).

4. The planar liquid cooling chip according to claim 1, characterized in that: The pump body (4) comprises a pump casing (41) and a drive assembly (42); the pump casing (41) has an inlet and an outlet; the pump casing (41) is elastic; and the drive assembly (42) is used to drive the pump casing (41) to deform.

5. The planar liquid cooling chip according to claim 4, characterized in that: The driving assembly (42) comprises a magnet (421) and an electromagnet (422); the magnet (421) is connected to the pump housing (41), and the electromagnet (421) is connected to the packaging cover (1).

6. The planar liquid cooling chip according to claim 4, characterized in that: The driving component (42) comprises a piezoelectric ceramic (423), one end of the piezoelectric ceramic (423) is connected to the packaging cover (1), and the other end of the piezoelectric ceramic (423) is connected to the pump housing (41).

7. The planar liquid cooling chip according to claim 4, characterized in that: The pump body (4) further comprises a one-way component (43), wherein the one-way component (43) is used to allow the coolant to flow from the inlet into the pump casing (41) in a one-way manner, and the one-way component (43) is used to allow the coolant to flow out of the pump casing (41) in a one-way manner from the outlet.

8. The planar liquid cooling chip according to claim 7, characterized in that: The one-way component (43) includes a valve.

9. The planar liquid cooling chip according to claim 1, characterized in that: The pump body (4) is located inside the packaging cover (1).

10. The planar liquid cooling chip according to claim 9, characterized in that: The pump body (4) is used to transfer heat to the packaging cover (1).

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