Phase array antenna device and modular extensible antenna packaging structure thereof

Abstract

The invention discloses a phased array antenna device and a modular extensible antenna packaging structure thereof. The modular extensible antenna packaging structure is electrically connected with a main circuit board, the main circuit board is provided with a signal control module, and the signal control module comprises a phase change circuit and a power distribution circuit. The modular extensible antenna packaging structure comprises a base material, at least one antenna radiation part and a radio frequency front-end circuit, the substrate comprises a first carrier plate, and the first carrier plate is provided with a first surface and a second surface which are oppositely arranged. The antenna radiation element is arranged on the first surface of the base material. The radio frequency front-end circuit is arranged on the second surface of the base material and is electrically connected with the at least one antenna radiation part. The radio frequency front-end circuit is electrically connected with the signal control module of the main circuit board.

Description

Technical Field

[0001] The present invention relates to the technical field of a phased array antenna, and more particularly to a phased array antenna device and a modular expandable antenna packaging structure that circuitizes an antenna radiator and a radio frequency front-end circuit and separates the antenna from a signal control module of a main circuit board and can be expanded in number as needed. Background Art

[0002] Phase array antenna technology is to set up an antenna array on a plane, and give different phase delays (phase shifting) to the signal emitted by each antenna. In this way, the wavefront formed by the interference and overlap of electromagnetic waves will produce a certain deflection angle (beam angle) with the plane where the antenna is set, making the signal transmission directional. At the same time, by changing the phase of the signal over time and then emitting it from each antenna, the deflection angle can be changed over time, thereby enabling the electromagnetic wave to produce a spatial scanning effect in space, thus becoming a phase array radar, which realizes electromagnetic wave scanning of space without moving the antenna body, which is different from the traditional radar that realizes scanning by rotating the antenna body.

[0003] The structure of the existing phase array antenna device, such as Figure 1 and Figure 2 As shown, the array of antenna radiators ANT is arranged on the upper surface M1 of the main circuit board MPCB, and the signal transceiver module BT, such as the modulation and demodulation circuit, power distribution circuit, phase change circuit and RF front-end circuit, is also arranged on the lower surface M2 of the main circuit board MPCB. In order to improve the power and resolution of the antenna or radar, generally more than 500 antenna radiators (Ku band, 12GHz-18GHz) to more than 1000 antenna radiators (Ka band, 27GHz-40GHz) are arranged on the main circuit board, and the circuits of the signal control module are arranged on the back of the main circuit board.

[0004] For the structure of this existing phased array antenna device, since all antenna radiators are arranged on the main circuit board, it is easy to cause the yield of the main circuit board to decrease. Moreover, for satellite antennas, the accuracy of their beam angles is plus or minus 1 degree, which means that the accuracy of signal phase changes must be controlled above 8 bits, which increases the difficulty of circuit design. The antenna radiators and signal control modules are all arranged on the same main circuit board, resulting in the number of layers of the main circuit board being increased to 12 layers, thereby increasing production costs and difficulty. In addition, since all antenna radiators are arranged on the main circuit board, if the main circuit board has a warping problem, it will affect the accuracy of the beam angle. Summary of the invention

[0005] In view of this, an object of the present invention is to provide a phased array antenna device and a modular expandable antenna packaging structure thereof, which modularize the antenna radiator and the radio frequency front-end circuit individually and set them separately from the main circuit board, thereby solving the problems in the prior art of reduced yield of the main circuit board, high difficulty in circuit design, and increased production cost and manufacturing difficulty caused by increased number of layers of the main circuit board.

[0006] An embodiment of the modular expandable antenna packaging structure of the present invention is electrically connected to a main circuit board, and the main circuit board is provided with a signal control module, and the signal control module includes a phase change circuit and a power distribution circuit. The modular expandable antenna packaging structure of this embodiment includes a substrate, at least one antenna radiator and a radio frequency front-end circuit. The substrate includes a first carrier board, and the first carrier board has a first surface and a second surface arranged opposite to each other. The antenna radiator is arranged on the first surface of the substrate. The radio frequency front-end circuit is arranged on the second surface of the substrate and is electrically connected to the at least one antenna radiator, and the radio frequency front-end circuit is electrically connected to the signal control module of the main circuit board.

[0007] In another embodiment, the substrate further includes a flange, which is disposed on the second surface of the first carrier and extends in a direction away from the second surface, and the flange is connected to the main circuit board.

[0008] In another embodiment, the flange is disposed on an edge of the second surface of the first carrier plate.

[0009] In another embodiment, the flange is a closed structure, and the flange is connected with the first carrier board and the main circuit board to form a cavity, and the RF front-end circuit is located in the cavity.

[0010] In another embodiment, the flange and the first carrier plate are an integrated structure.

[0011] In another embodiment, the flange is a frame connected to the first carrier plate.

[0012] In another embodiment, the modular expandable antenna packaging structure of the present invention also includes a phase change circuit, wherein the substrate also includes a second carrier board, the flange has a second end edge opposite to the first end edge, the second end edge is connected to the second carrier board, and the phase change circuit is arranged on the second carrier board and is located in the cavity.

[0013] In another embodiment, the modular expandable antenna packaging structure of the present invention further includes a plurality of first electrical conductors disposed on a first end edge of the flange close to the first carrier, and the flange is electrically connected to the first carrier via the plurality of first electrical conductors.

[0014] In another embodiment, the modular expandable antenna packaging structure of the present invention further includes a plurality of second electrical conductors disposed at a second end edge of the flange away from the first carrier board, and the substrate is electrically connected to the main circuit board via the plurality of second electrical conductors.

[0015] In another embodiment, the modular expandable antenna packaging structure of the present invention further includes a plurality of third electrical conductors, the RF front-end circuit is electrically connected to the second surface of the substrate by the third electrical conductors, and the size of the second electrical conductor is larger than that of the third electrical conductor.

[0016] An embodiment of the phased array antenna device of the present invention includes a main circuit board, at least one modular expandable antenna packaging structure and a signal control module. The main circuit board has a third surface and a fourth surface, and the third surface and the fourth surface are arranged opposite to each other. The modular expandable antenna packaging structure is arranged on the third surface of the main circuit board. The signal control module is arranged on the main circuit board, and the signal control module includes a modulation and demodulation circuit, a power distribution circuit and a phase change circuit. The RF front-end circuit of the modular expandable antenna packaging structure is electrically connected to the signal control module.

[0017] In another embodiment, the signal control module further includes a phase change circuit, and the signal control module is disposed on the fourth surface.

[0018] In another embodiment, the modular expandable antenna packaging structure also includes a phase change circuit, wherein the substrate also includes a second carrier board, the flange has a second end edge opposite to the first end edge, the second end edge is connected to the second carrier board, and the phase change circuit is arranged on the second carrier board and is located in the cavity.

[0019] The phase array antenna device and its modular expandable antenna packaging structure of the present invention form a separate modular expandable packaging structure by modularizing both the antenna radiator and the radio frequency front-end circuit, and the signal control module including the modulation and demodulation circuit, the power distribution circuit and the phase change circuit is arranged on the main circuit board. An appropriate number of modular expandable packaging structures can be arranged on the main circuit board according to the design requirements, and the number of antenna radiators and power amplifier modules of each modular expandable antenna packaging structure can also be determined as needed. In this way, since the main circuit board is only provided with the relevant circuits of the signal control module and does not have the antenna radiator and the power amplifier module, the number of layers of the main circuit board can be reduced to 6 layers, and the complexity of the circuit of the main circuit board is also greatly reduced, providing greater flexibility in circuit design. At the same time, since the circuit structure of the main circuit board is simplified, the yield of both the main circuit board and the modular expandable antenna packaging structure is greatly improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1is a system block diagram of a phase array antenna in the prior art.

[0021] Figure 2 It is a cross-sectional view of a partial structure of a phase array antenna in the prior art.

[0022] Figure 3 System block diagrams of the first and second embodiments of the phased array antenna device and its modular expandable antenna packaging structure of the present invention.

[0023] Figure 4 It is a cross-sectional view of a first embodiment of a phased array antenna device and a modular expandable antenna packaging structure thereof according to the present invention.

[0024] Figure 5 It is a cross-sectional view of a second embodiment of the phased array antenna device and its modular expandable antenna packaging structure of the present invention.

[0025] Figure 6 yes Figure 5 A cross-sectional view of the flange.

[0026] Figure 7 It is a system block diagram of the third embodiment and the fourth embodiment of the phased array antenna device and the modular expandable antenna packaging structure thereof of the present invention.

[0027] Figure 8 It is a cross-sectional view of a third embodiment of a phased array antenna device and a modular expandable antenna packaging structure thereof according to the present invention.

[0028] Fig. 9 It is a cross-sectional view of a third embodiment of a phased array antenna device and a modular expandable antenna packaging structure thereof according to the present invention.

[0029] Reference numerals

[0030] 1: Phased Array Antenna Device

[0031] 10: Signal control module

[0032] 11: Modulation and demodulation circuit

[0033] 12: Frequency Up / Down Circuit

[0034] 13: Power distribution circuit

[0035] 14: Phase change circuit

[0036] 20: RF front-end circuit

[0037] 30: Antenna radiator

[0038] 100, 100', 100", 100'': Modular and expandable antenna packaging structure

[0039] 110: Base material

[0040] 111: First carrier board

[0041] 111a: First surface

[0042] 111b: Second surface

[0043] 112, 112': flange

[0044] 112a: end edge (second end edge)

[0045] 112b: end edge (first end edge)

[0046] 113: Solder pad

[0047] 113f: High frequency signal pad

[0048] 113G: Pad Group

[0049] 113g: Ground pad

[0050] 114: Second carrier board

[0051] ANT: Antenna radiator

[0052] B1: Solder ball (second electrical conductor)

[0053] B2: Solder ball (first electrical conductor)

[0054] B3: Solder ball

[0055] B': Solder ball (third electrical conductor)

[0056] BT: signal transceiver module

[0057] C: Cavity

[0058] LNA: Low noise amplifier for downlink signal

[0059] M1: upper surface

[0060] M2: Lower surface

[0061] MPCB: Main Circuit Board

[0062] S3: Third surface

[0063] S4: Fourth Surface

[0064] PA: Power amplifier for uplink signal

[0065] PS-Up: Phase change circuit for uplink signal

[0066] PS-Dn: Phase change circuit for downlink signal DETAILED DESCRIPTION

[0067] See also Figure 3 and Figure 4 , which represents the first embodiment of the phase array antenna device and its modular expandable antenna packaging structure of the present invention. The phase array antenna device 1 of this embodiment is an active phase array antenna, which includes a signal control module 10, multiple RF front-end circuits 20 and multiple antenna radiators 30. The signal control module 10 includes a modulation and demodulation circuit 11, an up-down frequency circuit 12, a power distribution circuit 13 and multiple phase change circuits 14. The RF front-end circuit 20 and the antenna radiator 30 are integrated and modularized to form a modular expandable antenna packaging structure 100. The modulation and demodulation circuit 11 of the signal control module 10 provides a high-frequency carrier for modulation of the low-frequency signal to be transmitted, or demodulates the received high-frequency signal into a low-frequency signal. The up-down frequency circuit 12 is used to up-convert or down-convert the signal. The power distribution circuit 13 is used to distribute the signal to multiple RF front-end circuits 20. The plurality of phase change circuits 14 correspond to the plurality of modular expandable antenna packaging structures 100. The phase change circuits 14 include a phase change circuit PS-Up for an uplink signal and a phase change circuit PS-Dn for a downlink signal. The signal control module 10 is a ball grid array package (BGA) of an integrated circuit, so the signal control module 10 is electrically connected to a main circuit board MPCB via solder balls.

[0068] The modular expandable antenna packaging structure 100 is separately arranged from the signal control module 10, and the signal control module 10 is arranged on the main circuit board MPCB. The modular expandable antenna packaging structure 100 can be arranged on the main circuit board MPCB with an appropriate number of modular expandable antenna packaging structures 100 as required, and is electrically connected to the signal control module 10, so that the modular expandable antenna packaging structure 100 is arranged on the main circuit board MPCB in an expandable manner. The main circuit board MPCB includes a third surface S3 and a fourth surface S4. The third surface S3 and the fourth surface S4 are arranged relative to each other, the modular expandable antenna packaging structure 100 is arranged on the third surface S3, and the signal control module 10 is arranged on the fourth surface S4.

[0069] The RF front-end circuit 20 includes a power amplifier PA for the signal uplink and a low noise amplifier LNA for the signal downlink. The power amplifier PA for the signal uplink is electrically connected to the phase change circuit PS-Up of the signal uplink, and the low noise amplifier LNA for the signal downlink is electrically connected to the phase change circuit PS-Dn of the signal downlink. The modulated and up-converted signal is transmitted from the antenna radiator 30 to space via the signal uplink. The antenna radiator 30 receives the electromagnetic wave in space from the signal downlink and enters the signal control module 10, and obtains the required signal through down-conversion and demodulation. The signal can be switched by the switch component via the uplink or downlink.

[0070] The modular expandable antenna package structure 100 includes a substrate 110, and the RF front end circuit 20 and the antenna radiator 30 are both disposed on the substrate 110. The substrate 110 of this embodiment is a circuit board as a carrier, and the substrate 110 includes a first carrier 111, and the first carrier 111 has a first surface 111a and a second surface 111b disposed opposite to each other. The antenna radiator 30 is disposed on the first surface 111a of the first carrier 111, and the antenna radiator 30 is a copper patch antenna formed on the substrate 110 by copper plating. The RF front end circuit 20 is disposed on the second surface 111b of the first carrier 111 and is electrically connected to the antenna radiator 30 via copper-plated through holes or blind holes or lines. The RF front end circuit 20 can be a ball grid array package (BGA) of an integrated circuit, and the RF front end circuit 20 is electrically connected to the substrate 110 via solder balls, and then electrically connected to the antenna radiator 30 via copper-plated through holes or blind holes or lines of the substrate 110.

[0071] The substrate 110 of this embodiment further includes a flange 112, which is disposed on the second surface 110b of the first carrier 111 and extends in a direction away from the second surface 110b. The flange 112 of this embodiment is perpendicular to the second surface 111b of the first carrier 111, and the flange 112 is disposed at the edge of the second surface 111b of the first carrier 111. The flange 112 of this embodiment is a closed shape, and the flange 112 of this embodiment is a rectangular closed shape. Figure 4 As shown, the flange 112 and the first carrier board 111 of this embodiment are integrally formed structures, that is, the substrate 110 is formed into a structure with a rectangular surrounding wall (flange 112) when the epoxy resin, glass fiber and copper layers are formed layer by layer.

[0072] The end edge 112a (second end edge) of the flange 112 away from the second surface 111b of the first carrier 111 is electrically connected to the main circuit board MPCB through a plurality of solder balls B1 (second electrical conductor), thereby the RF front-end circuit 20 is electrically connected to the signal control module 10 of the main circuit board MPCB. Moreover, the second surface 111b of the first carrier 111 of the substrate 110, the flange 112 and the main circuit board MPCB are combined to form a cavity C, and the RF front-end circuit 20 is disposed on the second surface 111b of the first carrier 111 and is located in the cavity C. Since the flange 112 is connected to the main circuit board MPCB through the metal solder balls B1, and the flange 112 has a metal copper layer, the flange 112 can produce an electromagnetic shielding effect for the cavity C, which can make the signal less susceptible to external electromagnetic waves when passing through the RF front-end circuit 20 and reduce the noise in the signal. The diameter of the solder ball B1 is larger than the diameter of the solder ball B' (third electrical conductor) that forms an electrical connection between the RF front-end circuit 20 and the second surface 111b of the first carrier 111. This is done to increase scalability on the one hand, and on the other hand, the diameter of the solder ball B1 and the diameter of the solder ball B' can increase the assembly of the flange 112 and the main circuit board MPCB.

[0073] The signal control module 10 and the modular expandable antenna packaging structure 100 of this embodiment are arranged on two oppositely arranged surfaces of the main circuit board MPCB, so the signal control module 10 is located outside the cavity C. However, the present invention is not limited thereto, and in other embodiments, part of the structure of the signal control module 10 may also be arranged in the cavity C, such as the phase change circuit 14 of the signal control module 10. In other embodiments, the solder ball B1 of this embodiment may also be replaced by a gold ball or a copper bump.

[0074] In this embodiment, the substrate 110 is provided with four RF front-end circuits 20 and four antenna radiators 30 , and the number thereof can be adjusted according to demand.

[0075] See also Figure 5, which represents the second embodiment of the phased array antenna device and its modular expandable antenna packaging structure of the present invention. This embodiment has the same structure as the first embodiment, so the same components are given the same symbols and their descriptions are omitted. The difference between the modular expandable antenna packaging structure 100' of this embodiment and the modular expandable antenna packaging structure 100 of the first embodiment is that the flange 112' of the substrate 110 of the modular expandable antenna packaging structure 100' of this embodiment is a frame connected to the first carrier 111. The flange 112' is also formed layer by layer of epoxy resin, glass fiber and copper layer. The end edge (first end edge) 112b of the flange 112' close to the second surface 111b of the first carrier 111 is electrically connected to the first carrier 111 by a plurality of solder balls B2 (first electrical conductors). The end edge 112a (second end edge) of the flange 112' away from the second surface 111b of the first carrier 111 is electrically connected to the main circuit board MPCB by a plurality of solder balls B1 (second electrical conductors). Similar to the first embodiment, the flange 112 can produce an electromagnetic shielding effect for the cavity C, which can reduce the noise in the signal by making the signal less susceptible to the influence of external electromagnetic waves when passing through the RF front-end circuit 20. In other embodiments, the solder balls B1 and B2 of this embodiment can also be replaced by gold balls or copper bumps.

[0076] In addition, if Figure 6 As shown, the flange 112' uses a special circuit structure to transmit signals, which can reduce signal loss. The flange 112' has multiple pads 113 disposed at the end edges 112a and 112b. The multiple pads 113 form multiple pad groups 113G. Each pad group 113G has a structure in which multiple ground pads 113g surround a high-frequency signal pad 113f. The ground pad 113g is electrically connected to the ground circuit, and the high-frequency signal pad 113f is connected to the circuit for transmitting the high-frequency signal. In this way, the high-frequency signal can be prevented from being attenuated when being transmitted in the flange 112'.

[0077] See also Figure 7 and Figure 8 , which represents the third embodiment of the phase array antenna device and its modular expandable antenna packaging structure of the present invention. This embodiment has the same structure as the first embodiment, so the same components are given the same symbols and their descriptions are omitted. Figure 7 As shown, the difference between the modular expandable antenna packaging structure 100" of the present embodiment and the modular expandable antenna packaging structure 100 of the first embodiment is that the modular expandable antenna packaging structure 100" of the present embodiment also includes a phase change circuit 14, and the phase change circuit 14 of the present embodiment is also integrated into the modular expandable antenna packaging structure 100".

[0078] like Figure 8As shown, the substrate 110 also includes a second carrier 114, the second end edge 112a of the flange 112 is connected to the second carrier 114, and the phase change circuit 14 is disposed on the second carrier 114 and is located in the cavity C. The second carrier 114 is a printed circuit board. The flange 112 is electrically connected to the second carrier 114 through a plurality of solder balls B1 (second electrical conductor), and the second carrier 114 is connected to the main circuit board MPCB through a plurality of solder balls (third electrical conductor) B3, so that the RF front-end circuit 20 and the phase change circuit 14 are electrically connected to the signal control module 10 of the main circuit board MPCB. The signal control module 10 of this embodiment includes a modulation and demodulation circuit 11, a frequency conversion circuit 12, and a power distribution circuit 13. In other embodiments, the solder balls B1 and B3 of this embodiment can also be replaced by gold balls or copper bumps.

[0079] See also Fig. 9 , which represents the fourth embodiment of the phased array antenna device and its modular expandable antenna packaging structure of the present invention. This embodiment has a partially identical structure to the second embodiment, so identical components are given the same symbols and their descriptions are omitted. The difference between the modular expandable antenna packaging structure 100'" of this embodiment and the modular expandable antenna packaging structure 100' of the second embodiment is that the modular expandable antenna packaging structure 100'" of this embodiment also includes a phase change circuit 14, and the phase change circuit 14 of this embodiment is also integrated into the modular expandable antenna packaging structure 100'".

[0080] like Figure 8 As shown, the substrate 110 further includes a second carrier 114, the second end edge 112a of the flange 112' is connected to the second carrier 114, and the phase change circuit 14 is disposed on the second carrier 114 and is located in the cavity C. The flange 112' is electrically connected to the second carrier 114 through a plurality of solder balls B1 (second electrical conductors), and the second carrier 114 is connected to the main circuit board MPCB through a plurality of solder balls B3, so that the RF front-end circuit 20 and the phase change circuit 14 are electrically connected to the signal control module 10 of the main circuit board MPCB. The signal control module 10 of this embodiment includes a modulation and demodulation circuit 11, a frequency conversion circuit 12, and a power distribution circuit 13.

[0081] The phase array antenna device and its modular expandable antenna packaging structure of the present invention form a separate modular expandable packaging structure by modularizing both the antenna radiator and the radio frequency front-end circuit, and the signal control module including the modulation and demodulation circuit, the power distribution circuit and the phase change circuit is arranged on the main circuit board. An appropriate number of modular expandable packaging structures can be arranged on the main circuit board according to the design requirements, and the number of antenna radiators and power amplifier modules of each modular expandable antenna packaging structure can also be determined as needed. In this way, since the main circuit board is only provided with the relevant circuits of the signal control module and does not have the antenna radiator and the power amplifier module, the number of layers of the main circuit board can be reduced to 6 layers, and the complexity of the circuit of the main circuit board is also greatly reduced, providing greater flexibility in circuit design. At the same time, due to the simplified circuit structure of the main circuit board, the yield of both the main circuit board and the modular expandable antenna packaging structure is greatly improved, and the warping of the main circuit board is prevented from affecting the accuracy of the antenna transmitting or receiving signals.

[0082] The above is only a preferred embodiment of the present invention, and it cannot be used to limit the scope of the implementation of the present invention. That is, all simple equivalent changes and modifications made according to the scope of the claims and the description of the present invention are within the scope of the patent of the present invention. In addition, any embodiment of the present invention or the scope of the patent application does not need to achieve all the purposes, advantages or features disclosed by the present invention. In addition, the abstract and the title are only used to assist in searching patent documents, and are not used to limit the scope of rights of the present invention. In addition, the terms "first", "second", etc. mentioned in this specification or the scope of the patent application are only used to name the name of the component (element) or to distinguish different embodiments or scopes, and are not used to limit the upper or lower limit of the number of components.

Claims

1. A modular expandable antenna packaging structure, which is electrically connected to a main circuit board, the main circuit board is provided with a signal control module, the signal control module includes a modulation and demodulation circuit and a power distribution circuit, the modular expandable antenna packaging structure includes: A substrate, comprising a first carrier having a first surface and a second surface disposed opposite to each other; At least one antenna radiation element is disposed on the first surface of the substrate; as well as A radio frequency front-end circuit is disposed on the second surface of the substrate and is electrically connected to the at least one antenna radiation element. The radio frequency front-end circuit is electrically connected to the signal control module of the main circuit board.

2. The modular expandable antenna packaging structure according to claim 1, wherein the substrate further comprises a flange, the flange being disposed on the second surface of the first carrier and extending in a direction away from the second surface, the flange being connected to the main circuit board. 3 . The modular expandable antenna packaging structure according to claim 2 , wherein the flange is disposed on an edge of the second surface of the first carrier.

4. The modular expandable antenna packaging structure according to claim 2, wherein the flange is a closed structure, and the flange is connected with the first carrier board and the main circuit board to form a cavity, and the RF front-end circuit is located in the cavity. 5 . The modular expandable antenna packaging structure according to claim 4 , wherein the flange and the first carrier are an integrated structure. 6 . The modular expandable antenna packaging structure according to claim 4 , wherein the flange is a frame connected to the first carrier board, and the flange has a first end edge, and the first end edge is connected to the first carrier board.

7. The modular expandable antenna packaging structure according to claim 5 or 6 further comprises a phase change circuit, wherein the substrate further comprises a second carrier board, the flange has a second end edge opposite to the first end edge, the second end edge is connected to the second carrier board, and the phase change circuit is arranged on the second carrier board and is located in the cavity.

8. The modular expandable antenna packaging structure according to claim 6 further comprises a plurality of first electrical conductors, wherein the first electrical conductors are disposed on a first end edge of the flange close to the first carrier, and the flange is electrically connected to the first carrier via the first electrical conductors. 9 . The modular expandable antenna package structure according to claim 2 , further comprising a plurality of second electrical conductors, wherein the second electrical conductors are disposed at a second end edge of the flange away from the first carrier board.

10. The modular expandable antenna packaging structure according to claim 9 further comprises a plurality of third electrical conductors, the RF front-end circuit is electrically connected to the second surface of the device by the third electrical conductors, and the size of the second electrical conductor is larger than the size of the third electrical conductor.

11. A phased array antenna device, comprising: A main circuit board having a third surface and a fourth surface, wherein the third surface is arranged opposite to the fourth surface; The modular expandable antenna packaging structure according to any one of claims 1 to 6, which is disposed on the third surface of the main circuit board; as well as A signal control module is arranged on the main circuit board, and the radio frequency front-end circuit of the modular expandable antenna packaging structure is electrically connected to the signal control module. 12 . The phased array antenna device according to claim 11 , wherein the signal control module further comprises a phase variation circuit, and the signal control module is disposed on the fourth surface.

13. A phased array antenna device according to claim 11, wherein the modular expandable antenna packaging structure also includes a phase change circuit, wherein the substrate also includes a second carrier board, the flange has a second end edge opposite to the first end edge, the second end edge is connected to the second carrier board, and the phase change circuit is arranged on the second carrier board and is located in the cavity.

14. The phased array antenna device as claimed in claim 11, wherein the signal control module comprises a modulation and demodulation circuit and a power distribution circuit.

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