Grounding device and manufacturing method thereof

Abstract

The invention relates to a grounding device and a manufacturing method thereof, the grounding device comprises a resistance-reducing inner core, a conductive layer sleeves the periphery of the resistance-reducing inner core, the resistance-reducing inner core is made of an inorganic salt conductive agent, a carbon-containing conductive agent, a slow-release control agent and a binder, and the slow-release control agent is configured to enable conductive ions in the inorganic salt conductive agent to be electrically connected with the conductive layer. Releasing at a preset speed within a preset time; the binder is configured to bond the inorganic salt conductive agent and the slow release control agent. In conclusion, according to the grounding device in the embodiment, the material of the resistance-reducing inner core comprises the slow-release control agent, so that the resistance of the soil around the conductive layer is always smaller than the target resistance even if the grounding device is buried in different soil environments, and therefore, the grounding device can stably work in different soil environments for a long time.

Description

Technical Field

[0001] The present application relates to the technical field of power system grounding, and in particular to a grounding device and a manufacturing method thereof. Background Art

[0002] The power grounding system is an important power facility to ensure the safe and reliable operation of power equipment and the personal safety of power operators. In related technologies, the grounding device is made of metal grounding materials such as graphite, carbon steel, galvanized steel, copper, and copper-clad steel. Due to the complex and changeable soil environment, the problems of unstable grounding resistance and severe corrosion of the grounding device have not been fundamentally solved so far, and the grounding device cannot work stably for a long time in different environments. Summary of the invention

[0003] Based on this, it is necessary to propose a grounding device and a manufacturing method thereof to address the problem that the current grounding device cannot work for a long time and stably in different environments.

[0004] A grounding device, comprising:

[0005] Drag reduction inner core;

[0006] A conductive layer is sleeved on the outer periphery of the resistance reducing inner core;

[0007] Among them, the material of the resistance-reducing inner core includes an inorganic salt conductive agent, a carbon-containing conductive agent, a sustained-release controlling agent and a binder. The sustained-release controlling agent is configured to release the conductive ions in the inorganic salt conductive agent at a preset speed within a preset time; the binder is configured to bond the inorganic salt conductive agent and the sustained-release controlling agent.

[0008] In one embodiment, the slow-release controlling agent includes at least one of a bentonite slow-release controlling agent and a silicate slow-release controlling agent.

[0009] In one embodiment, the inorganic salt conductive agent accounts for 40% to 60% by mass in the resistance reducing inner core;

[0010] The sustained-release control agent accounts for 10% to 20% by mass in the drag-reducing inner core.

[0011] In one embodiment, the mass proportion of the binder in the drag reducing core is 30% to 50%.

[0012] In one embodiment, the adhesive comprises silicone resin.

[0013] In one embodiment, the inorganic salt conductive agent includes at least one inorganic salt.

[0014] In one embodiment, the carbon-containing conductive agent includes expanded graphite powder, and the mass proportion of the carbon-containing conductive agent in the resistance reducing core is 5% to 10%.

[0015] In one embodiment, the conductive layer is woven from composite graphite wires.

[0016] In one embodiment, the composite graphite wire is made of graphite, glass fiber and adhesive, and the adhesive is configured to bond the graphite and the glass fiber.

[0017] In this embodiment, the grounding device is buried in the soil, and the conductive layer in the grounding device is electrically connected to the wire to be grounded. The current transmitted by the wire to be grounded enters the conductive layer from the connection between the wire to be grounded and the conductive layer. A part of the current entering the conductive layer is directly conducted by the conductive layer to the soil around the conductive layer; the other part enters the resistance reduction core through the conductive layer, and is conducted to other areas on the conductive layer by the carbon-containing conductive agent and the inorganic salt conductive agent in the resistance reduction core, and enters the soil around the conductive layer from other areas on the conductive layer.

[0018] In the above process, the slow-release controlling agent in the resistance-reducing inner core gradually swells, and the swollen slow-release controlling agent chemically reacts with the inorganic salt conductive agent bonded to itself, prompting the inorganic salt conductive agent to release conductive ions at a preset speed within a preset time. The conductive ions released by the inorganic salt conductive agent enter the soil around the conductive layer, forming a conductive area in the soil around the conductive layer, reducing the resistance of the soil around the conductive layer, so that the resistance of the soil around the conductive layer is less than the target resistance.

[0019] To summarize, the grounding device in this embodiment, through the material of the resistance-reducing inner core including a slow-release control agent, ensures that even if the grounding device is buried in different soil environments, the resistance of the soil around the conductive layer is always less than the target resistance, thereby ensuring that the grounding device can work long-term and stably in different soil environments.

[0020] The present application also proposes a method for manufacturing a grounding device, which is used to prepare the grounding device described in any of the above items, and the method for manufacturing the grounding device comprises the following steps:

[0021] Provide inorganic salt conductive agents, slow-release control agents, carbon-containing conductive agents and binders;

[0022] Adding the slow-release control agent and the carbon-containing conductive agent into the dissolved inorganic salt conductive agent;

[0023] Adding the binder into the dissolved inorganic salt conductive agent and stirring to form a slurry;

[0024] Extruding the slurry with an extruder to prepare the drag-reducing inner core;

[0025] A conductive layer is used to cover the outer periphery of the resistance-reducing inner core.

[0026] The grounding device prepared by the grounding device manufacturing method in the present embodiment is buried in the soil, and the conductive layer in the grounding device is electrically connected to the wire to be grounded. The current transmitted by the wire to be grounded enters the conductive layer from the connection between the wire to be grounded and the conductive layer. A part of the current entering the conductive layer is directly conducted by the conductive layer to the soil around the conductive layer; the other part enters the resistance reduction core through the conductive layer, and is conducted by the carbon-containing conductive agent and the inorganic salt conductive agent in the resistance reduction core to other areas on the conductive layer, and enters the soil around the conductive layer from other areas on the conductive layer.

[0027] In the above process, the slow-release controlling agent in the resistance-reducing inner core gradually swells, and the swollen slow-release controlling agent chemically reacts with the inorganic salt conductive agent bonded to itself, prompting the inorganic salt conductive agent to release conductive ions at a preset speed within a preset time. The conductive ions released by the inorganic salt conductive agent enter the soil around the conductive layer, forming a conductive area in the soil around the conductive layer, reducing the resistance of the soil around the conductive layer, so that the resistance of the soil around the conductive layer is less than the target resistance.

[0028] To summarize, the method for manufacturing a grounding device in this embodiment includes a slow-release control agent in the material of the resistance-reducing inner core, so that even if the grounding device is buried in different soil environments, the resistance of the soil around the conductive layer is always less than the target resistance, thereby ensuring that the grounding device can work long-term and stably in different soil environments. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions in the embodiments or exemplary embodiments of the present application, the drawings required for use in the description of the embodiments or exemplary embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0030] Figure 1 Schematic diagram of the structure of a grounding device in one embodiment of the present application.

[0031] Figure 2 for Figure 1 A cross-sectional view of the grounding device shown at point A.

[0032] Figure 3 It is a flowchart of a method for manufacturing a grounding device in one embodiment of the present application.

[0033] Reference numerals:

[0034] A grounding device 10 , a resistance reducing inner core 100 , and a conductive layer 200 . DETAILED DESCRIPTION

[0035] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0036] In the description of the present application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0037] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0038] In this application, unless otherwise clearly specified and limited, if the terms "installed", "connected", "connected", "fixed" and the like appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0039] In the present application, unless otherwise clearly specified and limited, if there is a description that a first feature is "above" or "below" a second feature, etc., or similar descriptions appear, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0040] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only implementation method.

[0041] See also Figure 1 and Figure 2 , Figure 1 A schematic diagram of the structure of a grounding device in an embodiment of the present application is shown. A grounding device 10 provided in an embodiment of the present application includes: a resistance reducing inner core 100 and a conductive layer 200. The conductive layer 200 is sleeved on the outer periphery of the resistance reducing inner core 100, wherein the material of the resistance reducing inner core 100 includes an inorganic salt conductive agent (not marked in the figure), a carbon-containing conductive agent (not marked in the figure), a slow-release control agent (not marked in the figure) and a binder (not marked in the figure), the slow-release control agent is configured to release the conductive ions in the inorganic salt conductive agent at a preset speed within a preset time; the binder is configured to bond the inorganic salt conductive agent and the slow-release control agent.

[0042] In this embodiment, the grounding device 10 is buried in the soil. The conductive layer 200 in the grounding device 10 is electrically connected to the wire to be grounded. The current transmitted by the wire to be grounded enters the conductive layer 200 from the connection between the wire to be grounded and the conductive layer 200. A part of the current entering the conductive layer 200 is directly conducted by the conductive layer 200 to the soil around the conductive layer 200; the other part enters the resistance reduction core 100 through the conductive layer 200, is conducted to other areas on the conductive layer 200 by the carbon-containing conductive agent and the inorganic salt conductive agent in the resistance reduction core 100, and enters the soil around the conductive layer 200 from other areas on the conductive layer 200.

[0043] In the above process, the slow-release controlling agent in the resistance reducing inner core 100 gradually swells, and the swollen slow-release controlling agent chemically reacts with the inorganic salt conductive agent bonded to itself, prompting the inorganic salt conductive agent to release conductive ions at a preset speed within a preset time. The conductive ions released by the inorganic salt conductive agent enter the soil around the conductive layer 200, forming a conductive area in the soil around the conductive layer 200, reducing the resistance of the soil around the conductive layer 200, so that the resistance of the soil around the conductive layer 200 is less than the target resistance.

[0044] To summarize, the grounding device 10 in this embodiment, through the material of the resistance-reducing inner core 100 including a slow-release control agent, ensures that even if the grounding device 10 is buried in different soil environments, the resistance of the soil around the conductive layer 200 is always less than the target resistance, thereby ensuring that the grounding device 10 can work long-term and stably in different soil environments.

[0045] It should be noted that, even if the grounding device 10 is buried in different soil environments, the resistance of the soil around the conductive layer 200 is always lower than the target resistance. Therefore, the grounding device 10 is not prone to safety hazards caused by excessively high soil resistance around the conductive layer 200, and the maintenance cost of the grounding device 10 is reduced.

[0046] Please continue reading Figure 1 and Figure 2 In some embodiments, the slow-release controlling agent includes at least one of a bentonite-based slow-release controlling agent and a silicate-based slow-release controlling agent.

[0047] In this embodiment, at least one of the bentonite-type slow-release controlling agent and the silicate-type slow-release controlling agent in the resistance-reducing inner core 100 swells, and then chemically reacts with the inorganic salt conductive agent bonded to itself, thereby causing the inorganic salt conductive agent to release conductive ions at a preset speed within a preset time.

[0048] Please continue reading Figure 1 and Figure 2 In some embodiments, the mass proportion of the inorganic salt conductive agent in the resistance reducing core 100 is 40% to 60%, and the mass proportion of the sustained-release control agent in the resistance reducing core 100 is 10% to 20%.

[0049] In this embodiment, by setting the mass proportion of the inorganic salt conductive agent in the resistance reducing core 100 to 40%-60%, more inorganic salt conductive agent in the resistance reducing core 100 releases conductive ions.

[0050] Please continue reading Figure 1 and Figure 2 In some embodiments, the mass proportion of the adhesive in the drag reducing core 100 is 30% to 50%.

[0051] In this embodiment, by setting the mass proportion of the binder in the resistance reducing core 100 to 30%~50%, the binder has a larger mass proportion in the resistance reducing core 100, which can ensure that the inorganic salt conductive agent and the sustained-release controlling agent in the resistance reducing core 100 are firmly bonded together to form a stable sustained-release structure.

[0052] Please continue reading Figure 1 and Figure 2 In some embodiments, the binder includes a silicone resin.

[0053] In this embodiment, the organic silicone resin has strong weather resistance and corrosion resistance. The use of an adhesive including the organic silicone resin can more firmly bond the inorganic salt conductive agent and the sustained-release controlling agent in the resistance-reducing core 100 together.

[0054] Please continue reading Figure 1 and Figure 2 In some embodiments, the inorganic salt-based conductive agent includes at least one inorganic salt.

[0055] In this embodiment, the inorganic salt includes but is not limited to sodium salt, potassium salt and the like.

[0056] Please continue reading Figure 1 and Figure 2 In some embodiments, the carbon-containing conductive agent includes expanded graphite powder, and the mass proportion of the carbon-containing conductive agent in the resistance-reducing inner core 100 is 5% to 10%.

[0057] In this embodiment, the expanded graphite powder has good electrical conductivity. The use of the carbon-containing conductive agent including the expanded graphite powder can enable the resistance-reducing inner core 100 to better conduct the current entering the resistance-reducing inner core 100 .

[0058] Please continue reading Figure 1 and Figure 2 In some embodiments, the conductive layer 200 is woven from composite graphite wires (not shown).

[0059] In this embodiment, the graphite in the composite graphite wire has good electrical conductivity and corrosion resistance. The conductive layer 200 is woven from the composite graphite wire, which can enhance the current conduction capability and corrosion resistance of the conductive layer 200 .

[0060] Please continue reading Figure 1 and Figure 2 In some embodiments, the material of the composite graphite wire includes graphite (not labeled in the figure), glass fiber (not labeled in the figure) and adhesive (not labeled in the figure), and the adhesive is configured to bond the graphite and the glass fiber.

[0061] In this embodiment, glass fiber is added to the composite graphite wire to improve the flexibility of the composite graphite wire, so that the conductive layer 200 woven from the composite graphite wire has good flexibility, thereby facilitating the conductive layer 200 to be coated on the outside of the resistance-reducing inner core 100 of different shapes. This facilitates the grounding device 10 to adapt to the installation requirements of various complex terrains, such as irregular terrains in mountainous areas and around buildings, and increases the convenience of installation of the grounding device 10.

[0062] See also Figure 3 , Figure 3 A flowchart of a method for manufacturing a grounding device in an embodiment of the present application is shown. A method for manufacturing a grounding device provided in an embodiment of the present application is used to prepare the above-mentioned grounding device 10. The method for manufacturing a grounding device comprises the following steps:

[0063] S100: Provides inorganic salt conductive agents, slow-release control agents, carbon-containing conductive agents and binders.

[0064] S300: adding the slow-release control agent and the carbon-containing conductive agent into the dissolved inorganic salt conductive agent.

[0065] S400: adding a binder into the dissolved inorganic salt conductive agent and stirring to form a slurry.

[0066] S500 : using an extruder (not shown) to extrude the slurry to prepare the resistance-reducing inner core 100 .

[0067] S800: Using a conductive layer 200 to cover the outer periphery of the resistance-reducing inner core 100.

[0068] The grounding device 10 prepared by the grounding device manufacturing method in the present embodiment is buried in the soil, and the conductive layer 200 in the grounding device 10 is electrically connected to the wire to be grounded. The current transmitted by the wire to be grounded enters the conductive layer 200 from the connection between the wire to be grounded and the conductive layer 200. A part of the current entering the conductive layer 200 is directly conducted by the conductive layer 200 to the soil around the conductive layer 200; the other part enters the resistance reduction core 100 through the conductive layer 200, and is conducted to other areas on the conductive layer 200 by the carbon-containing conductive agent and the inorganic salt conductive agent in the resistance reduction core 100, and enters the soil around the conductive layer 200 from other areas on the conductive layer 200.

[0069] In the above process, the slow-release controlling agent in the resistance reducing inner core 100 gradually swells, and the swollen slow-release controlling agent chemically reacts with the inorganic salt conductive agent bonded to itself, prompting the inorganic salt conductive agent to release conductive ions at a preset speed within a preset time. The conductive ions released by the inorganic salt conductive agent enter the soil around the conductive layer 200, forming a conductive area in the soil around the conductive layer 200, reducing the resistance of the soil around the conductive layer 200, so that the resistance of the soil around the conductive layer 200 is less than the target resistance.

[0070] To sum up, the method for manufacturing a grounding device in this embodiment, through the material of the resistance reducing inner core 100 including a slow-release control agent, ensures that even if the grounding device 10 is buried in different soil environments, the resistance of the soil around the conductive layer 200 is always less than the target resistance, thereby ensuring that the grounding device 10 can work long-term and stably in different soil environments.

[0071] In some embodiments, after step S100 and before step S300, step S200 is further included: adding water to the inorganic salt conductive agent to dissolve the inorganic salt conductive agent, and stirring the dissolved inorganic salt conductive agent at a speed of 1200r / min~1500r / min, and the stirring time is 30min~45min.

[0072] In some embodiments, after step S300 and before step S400, step S310 is also included: stirring the dissolved inorganic salt conductive agent at a speed of 1200r / min~1500r / min for 15min~20min, so that the sustained-release control agent and the carbon-containing conductive agent are evenly dispersed in the dissolved inorganic salt conductive agent.

[0073] In other embodiments, step S400 includes: adding a binder into the dissolved inorganic salt conductive agent, and stirring at a speed of 300 r / min to 500 r / min for 20 min to 30 min until a uniform slurry is formed.

[0074] In other embodiments, step S500 includes: using an extruder to extrude the slurry at an extrusion temperature of 80° C. to 100° C. and an extrusion pressure of 3 MPa to 5 MPa to prepare the resistance-reducing inner core 100 .

[0075] In some embodiments, after step S500 and before step S800, step S600 is also included: intercalating, washing, drying and high-temperature boronizing the flake graphite to obtain graphite in the composite graphite wire, compounding the graphite, glass fiber and adhesive to form a graphite-based flexible membrane structure, and using a twisting wire process to prepare the graphite-based flexible membrane structure into a composite graphite wire.

[0076] In some embodiments, after step S600 and before step S800, step S700 is further included: using a three-dimensional rotary weaving process, with a weaving tension of 8N to 12N, the composite graphite wire is weaved around the outer periphery of the resistance reduction inner core 100 to form a conductive layer 200.

[0077] In this embodiment, by controlling the braiding tension of the composite graphite wire to be between 8N and 12N, the tightness and uniformity of the braiding of the composite graphite wire can be ensured.

[0078] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0079] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A grounding device, characterized in that: The grounding device comprises: Drag reduction inner core; A conductive layer is sleeved on the outer periphery of the resistance reducing inner core; Among them, the material of the resistance-reducing inner core includes an inorganic salt conductive agent, a carbon-containing conductive agent, a sustained-release controlling agent and a binder. The sustained-release controlling agent is configured to release the conductive ions in the inorganic salt conductive agent at a preset speed within a preset time; the binder is configured to bond the inorganic salt conductive agent and the sustained-release controlling agent.

2. The grounding device according to claim 1, characterized in that: The slow-release controlling agent includes at least one of a bentonite-based slow-release controlling agent and a silicate-based slow-release controlling agent.

3. The grounding device according to claim 1, characterized in that: The inorganic salt conductive agent accounts for 40% to 60% by mass in the resistance reducing inner core; The sustained-release control agent accounts for 10% to 20% by mass in the drag-reducing inner core.

4. The grounding device according to claim 1, characterized in that: The mass proportion of the binder in the drag reducing core is 30% to 50%.

5. The grounding device according to claim 4, characterized in that: The binder includes a silicone resin.

6. The grounding device according to claim 1, characterized in that: The inorganic salt conductive agent includes at least one inorganic salt.

7. The grounding device according to claim 1, characterized in that: The carbon-containing conductive agent includes expanded graphite powder, and the mass proportion of the carbon-containing conductive agent in the resistance-reducing inner core is 5% to 10%.

8. The grounding device according to claim 1, characterized in that: The conductive layer is woven from composite graphite wires.

9. The grounding device according to claim 8, characterized in that: The composite graphite wire is made of graphite, glass fiber and adhesive, and the adhesive is configured to bond the graphite and the glass fiber.

10. A method for manufacturing a grounding device, characterized in that: Used to prepare the grounding device described in any one of claims 1 to 9, the grounding device manufacturing method comprises the following steps: Provide inorganic salt conductive agents, slow-release control agents, carbon-containing conductive agents and binders; Adding the slow-release control agent and the carbon-containing conductive agent into the dissolved inorganic salt conductive agent; Adding the binder into the dissolved inorganic salt conductive agent and stirring to form a slurry; Extruding the slurry with an extruder to prepare the drag-reducing inner core; A conductive layer is used to cover the outer periphery of the resistance-reducing inner core.

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