Packaging structure, circuit structure and electronic equipment

Abstract

The embodiment of the invention provides a packaging structure, a circuit structure and electronic equipment, the packaging structure is arranged in the electronic equipment, the packaging structure comprises a shell with a device bearing part, an original connecting part and an expansion connecting part, and an electronic element and an FPC arranged on the periphery of the electronic element are arranged on the device bearing part of the shell. And when the first circuit board exists on the first side outside the packaging structure and the second circuit board or the hardware module exists on the second side outside the packaging structure, the original connecting part and the first part of the FPC are used for electrically connecting the electronic device and the first circuit board. And the expansion connecting part and the second part of the FPC are used for electrically connecting the first circuit board and the second circuit board or the hardware module. As the original connecting part and the expansion connecting part are parts of the shell, the electric connection between the expansion connecting part of the packaging structure and the second part of the FPC can be established by using the packaging structure on the basis of not increasing the size of the packaging structure.

Description

Technical Field

[0001] The present invention relates to the field of electronic equipment, and in particular to a packaging structure, a circuit structure and electronic equipment. Background Art

[0002] An electronic device may be provided with a variety of electronic devices, and the electronic device may realize specific functions or complete specific tasks by means of electrical connections between different electronic devices. In the layout design of electronic devices, considering the limited internal space of the electronic device and the volume of different devices, it is easy to have another electronic device between two electronic devices that need to be electrically connected, that is, the other electronic device blocks the establishment of the electrical connection between the two electronic devices.

[0003] Among them, electronic devices may include smart phones, tablet computers, laptops, etc. The electronic devices installed inside the electronic devices may include printed circuit boards (PCBs) that integrate multiple electronic components, or may include hardware modules that encapsulate electronic components. The electronic components encapsulated in the hardware structure may be motors, speakers, cameras, etc.

[0004] Therefore, when another electronic device is disposed between two electronic devices, how to establish an electrical connection between the two devices becomes a problem that needs to be solved urgently. Summary of the invention

[0005] In view of this, an embodiment of the present invention provides a packaging structure, a circuit structure and an electronic device to provide a new type of packaging structure. When the packaging structure is arranged between two electronic devices that need to establish an electrical connection, the new type of packaging structure can be used to directly establish an electrical connection between the two, that is, to extend the electrical signal of one electronic device to another electronic device.

[0006] In a first aspect, an embodiment of the present invention provides a packaging structure, which is arranged in an electronic device, and the packaging structure comprises: a housing, the housing comprising a device carrying portion, an original connection portion and an extended connection portion;

[0007] The device carrying portion is provided with electronic components and a flexible circuit board FPC fixed to the periphery of the electronic device;

[0008] The original connection portion and the first portion of the FPC are used to electrically connect the electronic component to the first circuit board;

[0009] The extended connection portion and the second portion of the FPC are used to electrically connect the first circuit board to the second circuit board, or to electrically connect the first circuit board to a hardware module, the first circuit board is located on a first side outside the packaging structure, and the second circuit board or the hardware module is located on a second side outside the packaging structure.

[0010] In a second aspect, an embodiment of the present invention provides a circuit structure, which is arranged in an electronic device, and the circuit structure includes: a packaging structure encapsulating electronic components, a first circuit board located on a first side outside the packaging structure, and a second circuit board or hardware module located on a second side outside the packaging structure;

[0011] The packaging structure includes a housing, and the housing includes a device carrying portion, an original connection portion, and an extended connection portion;

[0012] The device carrying portion is provided with electronic components and a flexible circuit board FPC fixed to the periphery of the electronic device;

[0013] The original connection portion and the first portion of the FPC are used to electrically connect the electronic component to the first circuit board;

[0014] The extended connection portion and the second portion of the FPC are used to electrically connect the first circuit board to the second circuit board, or to electrically connect the first circuit board to the hardware module.

[0015] In a third aspect, an embodiment of the present invention provides an electronic device, including: a packaging structure as provided in the first aspect or a circuit structure as provided in the second aspect.

[0016] The packaging structure provided by the embodiment of the present invention is arranged in an electronic device, and the structure may include a shell having a device bearing part, an original connection part and an extended connection part, wherein the electronic component and the FPC arranged on the periphery of the electronic component are arranged on the device bearing part of the shell. When there is a first circuit board on the first side outside the packaging structure, and there is a second circuit board or a hardware module on the second side outside the packaging structure, the original connection part and the first part of the FPC are used to electrically connect the electronic device and the first circuit board, thereby ensuring the normal operation of the electronic component. On this basis, the newly added extended connection part and the second part of the FPC can also be used to form an electrical connection between the electronic device and the second circuit board, or to form an electrical connection between the first circuit board and the hardware module, thereby ensuring the normal operation of the first circuit board and the second circuit board or the hardware module. In this embodiment, since the extended connection part itself is a part of the shell, the FPC is arranged inside the shell, therefore, for the circuit board or hardware module with the packaging structure arranged in the middle interval, the electrical connection between the circuit boards or hardware modules on both sides of the packaging structure can be established without increasing the size of the packaging structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0018] Figure 1 A schematic diagram of a packaging structure provided by an embodiment of the present invention;

[0019] Figure 2 A schematic diagram of an electrical signal extension method;

[0020] Figure 3 A schematic diagram of another method of extending an electrical signal;

[0021] Figure 4 A schematic diagram of another packaging structure provided by an embodiment of the present invention;

[0022] Figure 5 A schematic diagram of a structure of another packaging structure provided by an embodiment of the present invention;

[0023] Figure 6 A schematic diagram of a circuit structure provided by an embodiment of the present invention;

[0024] Figure 7 A schematic diagram of another circuit structure provided by an embodiment of the present invention;

[0025] Figure 8 A schematic diagram of the architecture of an electronic device provided by an embodiment of the present invention.

[0026] Description of reference numerals:

[0027] Housing 100;

[0028] Electronic component 200;

[0029] Original connection part 300;

[0030] Extension connection part 400; first connection part 410, second connection part 420;

[0031] A first portion 500 of a flexible circuit board; a second portion 600 of a flexible circuit board;

[0032] A first circuit board 700, a second circuit board 800, and a hardware module 800;

[0033] - Battery 900. DETAILED DESCRIPTION

[0034] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0035] The terms used in the embodiments of the present invention are only for the purpose of describing specific embodiments, and are not intended to limit the present invention. The singular forms "a", "said" and "the" used in the embodiments of the present invention and the appended claims are also intended to include plural forms, unless the context clearly indicates other meanings, and "multiple" generally includes at least two, but does not exclude the inclusion of at least one.

[0036] It should be understood that the term "and / or" used in this article is only a description of the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0037] As used herein, the words "if" and "if" may be interpreted as "at the time of" or "when" or "in response to determining" or "in response to identifying", depending on the context. Similarly, the phrases "if it is determined" or "if (stated condition or event) is identified" may be interpreted as "when determining" or "in response to determining" or "when identifying (stated condition or event)" or "in response to identifying (stated condition or event)", depending on the context.

[0038] It should be noted that the user information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data used for analysis, stored data, displayed data, etc.) involved in the present invention are all information and data authorized by the user or fully authorized by all parties, and the collection, use and processing of relevant data must comply with the relevant laws, regulations and standards of relevant countries and regions, and provide corresponding operation entrances for users to choose to authorize or refuse.

[0039] It should also be noted that the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a product or system including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such a product or system. In the absence of more restrictions, the elements defined by the sentence "comprises a ..." do not exclude the existence of other identical elements in the product or system including the elements.

[0040] Some embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the case where there is no conflict between the embodiments, the following embodiments and the features and steps in the embodiments can be combined with each other. The step sequence in the following method embodiments is only an example and not a strict limitation.

[0041] Before describing in detail the packaging structure provided by the following embodiments of the present invention, the packaging structure, the electronic device and the positional relationship between the two may be described first:

[0042] Following the description in the background technology, the electronic device may be a smart phone, a tablet computer, a laptop computer, etc. The electronic device disposed inside the electronic device may include a hardware module and a PCB. The hardware module may also be considered as a packaging structure of any device such as a motor, a speaker, a camera, a USB socket, and a SIM card socket, and the packaging structure may also be called a module.

[0043] In practice, when electronic devices are arranged inside electronic devices, the following situation may occur: electronic devices that need to be electrically connected are respectively arranged on different sides of the outside of a packaging structure. Optionally, the electronic devices that need to be electrically connected may be of the same type, such as two PCBs or two hardware modules, or of different types, such as one is a PCB and the other is a hardware module.

[0044] At this point, the packaging structure provided in the following embodiments of the present invention can be used to establish electrical connections between electronic devices located on different sides of the packaging structure, that is, the packaging structure provided in the embodiments of the present invention can be used to extend the electrical signal of one electronic device to another electronic device.

[0045] Based on the above description, Figure 1 The schematic diagram of a packaging structure provided by an embodiment of the present invention is shown in FIG. The structure can be arranged in an electronic device. Figure 1 As shown, the packaging structure may include: a housing 100. The housing 100 may include a device carrying portion provided with an electronic component 200 and a flexible printed circuit (FPC), an original connection portion 300 and an extended connection portion 400.

[0046] The device carrying portion, the original connection portion 300 and the extended connection portion 400 are essentially three areas of the housing 100 .

[0047] The FPC can be arranged at the periphery of the electronic component 200. The FPC can be specifically divided into two parts, namely, the first part 500 of the FPC and the second part 600 of the FPC. For the sake of simplicity, the two parts of the FPC can be referred to as the first part and the second part respectively.

[0048] like Figure 1 As shown, the electronic component 200 in the package structure is marked with a vertical line, the first part 500 of the FPC is marked with a left oblique line, and the first part 500 of the FPC is marked with a cross line. The part marked with a vertical line, a left oblique line and a cross line is the device carrying part of the housing 100. The original connection part 300 is marked with a cross grid line, and the extended connection part 400 is marked with a horizontal line.

[0049] Optionally, the electronic component 200 packaged in the packaging structure may be a speaker, a camera, etc.

[0050] like Figure 1 As shown, the positional relationship between the various parts in the packaging structure can be described as:

[0051] The electronic component 200 can be fixed in the target area of ​​the device carrying part in the housing 100, and optionally, the target area can generally be the center of the device carrying part. The FPC, the original connection part 300 and the extended connection part 400 can be arranged at the periphery of the electronic component 200. Optionally, the two connection parts can be arranged at different sides of the periphery of the electronic element 200. The FPC can be fixed at least two sides of the periphery of the electronic component 200.

[0052] When the first circuit board 700 and the second circuit board 800 or the hardware module 800 that need to be electrically connected are arranged on different sides of the outside of the packaging structure, the electronic component 200 in the packaging structure and the first circuit board 700 outside the packaging structure can be electrically connected by means of the original connection portion 300 and the first part 500. With this electrical connection, the electrical signal of the first circuit board 700 can be transmitted to the electronic component 200 in the packaging structure to ensure the normal operation of the electronic component 200, that is, to ensure the normal operation of the packaging structure.

[0053] The first circuit board 700 and the second circuit board 800 can also be electrically connected with the help of the extended connection part 400 and the second part 600 inside the packaging structure, which is equivalent to extending the electrical signal of the first circuit board 700 to the second circuit board 800. The establishment of the electrical connection can enable the electrical signals generated by the first circuit board 700 and the second circuit board 800 to be transmitted to each other, thereby ensuring the normal operation of the two. Similarly, the first circuit board 700 and the hardware module 800 can also be electrically connected with the help of the extended connection part 400 and the second part 600, thereby extending the electrical signal and ensuring the normal operation of the first circuit board 700 and the hardware module 800.

[0054] In this embodiment, since the first circuit board 700 and the second circuit board 800 or the hardware module 800 are devices disposed outside the packaging structure, Figure 1 Indicated by dotted line. Figure 1 The arrow in the figure indicates the transmission direction of the electrical signal. Optionally, the connecting portion can establish an electrical connection by contacting with a circuit board or a hardware module. Figure 1 The white square portion in the middle may be a projection area formed after the circuit board or hardware module contacts the connection part. Optionally, the original connection part 300 and the extended connection part 400 are also covered with a conductive medium, and the circuit board or hardware module may contact the conductive medium on the connection part to form an electrical connection. For specific contact methods, please refer to Figure 4 The conductive medium is Figure 1 The white rectangle in the

[0055] In addition, since the original connection part 300 and the first part 500 are used to establish an electrical connection between the electronic component 200 and the first circuit board 700, and the extended connection part 400 and the second part 600 are used to establish an electrical connection between the first circuit board 700 and the second circuit board 800 or to establish an electrical connection between the first circuit board 700 and the hardware module 800, the setting position of the connection part and the FPC is related to the position of the circuit board or hardware module that needs to be electrically connected.

[0056] Optionally, the first circuit board 700 may be located on the first side outside the packaging structure, and the first part 500 and the first circuit board 700 may be located on the same side. The second circuit board 800 or the hardware module 800 may be located on the second side outside the packaging structure, and the second part 600 and the second electronic device 800 or the hardware module 800 may be located on the same side. That is, the first side outside the packaging structure is on the same side as the periphery of the electronic component 200; the second side outside the packaging structure is on the same side as the second side outside the electronic component 200. The first side of the electronic component 200 and the second side of the electronic component 200 are parallel or perpendicular to each other.

[0057] In order to extend the electrical signal from the first circuit board 700 to the second circuit board 800 or the hardware module 800 , optionally, the second portion 600 may also be disposed on a third side adjacent to both the first side and the second side of the periphery of the electronic component 200 .

[0058] In this embodiment, the packaging structure may include a housing 100 having a device bearing portion, an original connection portion 300 and an extended connection portion 400, wherein the electronic component 200 and the FPC disposed on the periphery of the electronic component 200 are disposed on the device bearing portion of the housing. When a first circuit board 700 exists on the first side outside the packaging structure, and a second circuit board 800 or a hardware module 800 exists on the second side outside the packaging structure, the original connection portion 300 and the first portion 500 of the FPC are used to electrically connect the electronic device 200 and the first circuit board 700, thereby ensuring the normal operation of the electronic element 200. On this basis, for the first circuit board 700 and the second circuit board 800 or the hardware module 800 disposed on different sides outside the packaging structure, the electrical connection between the two parts can also be achieved through the newly added extended connection portion 400 and the newly added second portion 600 to ensure the normal operation of the two.

[0059] It can be seen that for circuit boards or hardware modules disposed on different sides of the outside of the packaging structure, the extended connection portion 400 and the second portion 600 in the packaging structure can establish an electrical connection between the two, that is, the electrical signal of one side is extended to the other side. In addition, since the extended connection portion 400 is a part of the housing 100, the above solution will not increase the size of the packaging structure on the basis of achieving the above-mentioned electrical signal extension.

[0060] It should be noted that the embodiments of the present invention focus on the positional relationship between the various parts of the housing, and the embodiments of the present invention do not limit the shape of the housing. Figure 1 It is just an illustration of the shell shape.

[0061] As can be seen from the above description, optionally, for the extension of the electrical signal between the first circuit board 700 and the second circuit board 800, a specific usage scenario is: the packaging structure can be a speaker module in an electronic device, then the two ends of the speaker module can be respectively provided with a mainboard PCB and an antenna PCB, and the antenna PCB is also provided with at least one of an antenna switch, an antenna matching circuit, a sensor, and a microphone, and the sensor can specifically include a compass, a gyroscope sensor, an ambient light sensor, etc. At this time, with the help of the second part 600 of the FPC disposed on the periphery of the speaker in the speaker module and the extended connection part 400, an electrical connection between the two PCBs can be established, and with the help of this electrical connection, the electrical signal of the mainboard PCB can be extended to the antenna PCB, so that the mainboard PCB controls the antenna switch on the antenna PCB, thereby controlling the switch state of antennas of different frequency bands on the antenna PCB, improving the reuse degree of the antenna, and enhancing the signal of the electronic device.

[0062] The above-mentioned usage scenario is common in the case where the electronic device is specifically a foldable mobile phone. Compared with a straight-plate mobile phone, the internal space of a foldable mobile phone is more limited. Therefore, an antenna switch that improves the antenna reuse degree can be set on the antenna PCB, and then the antenna PCB is controlled by the mainboard PCB through the electrical connection between the antenna PCB and the mainboard PCB.

[0063] As can be seen from the above description, optionally, for the extension of the electrical signal between the first circuit board 700 and the hardware module 800, a specific usage scenario is: the packaging structure can be a speaker module in an electronic device, and the two ends of the speaker module can be respectively provided with a mainboard PCB and a motor module. At this time, with the help of the electrical connection between the mainboard PCB and the motor module, the electrical signal of the mainboard PCB can be extended to the motor module, so that the mainboard PCB controls the rotation mode of the motor, thereby enabling the electronic device to provide different vibration modes, and different vibration modes can be applied to different functions of the electronic device.

[0064] Optionally, the above-mentioned motor module can also be replaced by any one of a camera, a USB socket, and a SIM card socket.

[0065] It should also be noted that the specific use scenarios of the above-mentioned electrical signal extension are merely illustrative examples, and the present invention does not limit the electronic components packaged in the packaging structure, nor does it limit the electronic devices located on different sides outside the packaging structure and requiring electrical connection. In practice, the electronic components packaged in the packaging structure and the electronic devices requiring electrical connection can be any different electronic devices inside the electronic device.

[0066] In addition, when the packaging structure provided in the above and following embodiments of the present invention is used to extend the electrical signal, the technical effect achieved can also be understood in conjunction with the following description:

[0067] For the extension method of the electrical signal between the first circuit board 700 and the second circuit board 800, or the extension method of the electrical signal between the first circuit board 700 and the hardware module 800, such as Figure 2 As shown, the second circuit board 800 or the hardware module 800 is isolated, that is, there is no connection between the housing 100 and the first circuit board 700, and it is impossible to directly use the housing 100 to achieve electrical connection with the first circuit board 700. Then one way is to directly cover the outer side of the housing 100 with an FPC, and the circuit boards or hardware modules located on different sides of the packaging structure can directly use this FPC to achieve electrical connection. However, considering the thickness of the FPC itself, when the thickness of the electronic device is limited, covering the FPC on the packaging structure to achieve the extension of the electrical signal will inevitably require reducing the thickness of the packaging structure.

[0068] When the packaging structure is a speaker module, the reduction in the thickness of the speaker module is equivalent to the reduction in the sound cavity space, which will affect the audio playback effect of the electronic device and may also increase the power consumption of the electronic device. On the other hand, since the FPC covered on the packaging structure is not fixed on the packaging structure, when the speaker module vibrates during operation, it can also drive the FPC to vibrate, and the vibration of the FPC may cause noise.

[0069] Compared to Figure 2 In the shell in the packaging structure, the shape of the shell 100 in the packaging structure and the internal structure of the packaging structure are changed in each embodiment of the present invention (that is, the area of ​​the FPC is increased in the shell). When the packaging structure is a speaker module, since the second part 600 for extending the electrical signal is located inside the packaging structure, the extended connection part 400 is also a part of the shell 100 itself, and therefore, the sound cavity space is not reduced, thereby ensuring the audio playback effect. In addition, the second part 600 can be fixed inside the packaging structure, so the vibration of the speaker module will not cause the second part 600 to vibrate, thereby avoiding the occurrence of noise.

[0070] For the extension method of the electrical signal between the first circuit board 700 and the second circuit board 800, or the extension method of the electrical signal between the first circuit board 700 and the hardware module 800, such as Figure 3 As shown, similarly, the second circuit board 800 or the hardware module 800 is isolated, and has no connection relationship with the housing 100 and the first circuit board 700, so it is impossible to directly achieve electrical connection with the first circuit board 700 with the help of the housing 100.

[0071] Another way is to add another PCB on any side of the outer shell 100, and the first circuit board 700 and the second circuit board 800 or the hardware module 800 can be directly electrically connected with the help of the newly added PCB. However, this method will occupy the internal space of the electronic device. Considering the limited internal space, it is necessary to reduce the volume of other electronic devices inside the electronic device, such as reducing the volume of the battery, but this will further shorten the battery life and standby time of the electronic device.

[0072] When the packaging structure provided by the embodiments of the present invention can be arranged adjacent to the battery inside the electronic device, since the embodiments of the present invention modify the shape of the shell 100 in the packaging structure and the internal structure of the packaging structure, and since the second part 600 is located inside the packaging structure, the extended connection part 400 is also a part of the shell 100 itself. Therefore, while achieving electrical connection, the size of the packaging structure will not be increased, and the volume of the battery in the electronic device will not be reduced, thereby ensuring the battery life and standby time of the electronic device.

[0073] Figure 4 A schematic diagram of another packaging structure provided by an embodiment of the present invention. Figure 1 Based on the embodiment shown, Figure 4 As shown, the extended connection portion 400 can be specifically divided into a first connection portion 410 and a second connection portion 420 .

[0074] According to the above embodiments, the original connection portion 300 may be electrically connected to the first circuit board 700 .

[0075] Optionally, the original connection portion 300 can contact the first circuit board 700 to achieve electrical connection between the two. For the contact between the original connection portion 300 and the first circuit board 700, an optional way is that a spring can be provided on the first circuit board 700, and the spring can directly contact the original connection portion 300, and after contact, an electrical connection can be established between the electronic component 200 and the first circuit board 700. Another optional way is that a board-to-board connector (Board-to-board Connectors, referred to as B2B) can be provided on the original connection portion 300. Then the first circuit board 700 can be inserted into this B2B connector to achieve electrical connection between the electronic component 200 and the first circuit board 700. Optionally, the part of the original connection portion provided with the B2B connector is also covered with an FPC, and the B2B connector is provided on the FPC.

[0076] For the extended connection part 400 divided into the first connection part 410 and the second connection part 420. Figure 4As shown, the first connection portion 410 is located on the first side of the electronic component 200, and the first connection portion 410 is also located on the same side as the first circuit board 700. The second connection portion 420 is located on the second side of the electronic component 200, and the second connection portion 420 is also located on the same side as the second circuit board 800 or the hardware module 800. And the first connection portion 410 can be electrically connected to the first circuit board 700, and the second connection portion 420 can also be electrically connected to the second circuit board 800. The electrical connection between the first connection portion 410 and the first circuit board 700 can be achieved by contact between the two, and similarly, the electrical connection between the second connection portion 420 and the second circuit board 800 can also be achieved by contact between the two. Finally, the electrical connection between the first circuit board 700 and the second circuit board 800 can be achieved by contact between the connection portion and the circuit board and the FPC provided in the housing 100.

[0077] Similarly, there may be an electrical connection between the second connecting portion 420 and the hardware module 800, and the electrical connection between the two may also be formed by contact. Finally, the electrical connection between the first circuit board 700 and the hardware module 800 may be achieved by means of the contact between the connecting portion and the circuit board and the FPC provided in the shell 100.

[0078] Regarding the contact between the first connecting portion 410 and the first circuit board 700 , and the contact between the second connecting portion 420 and the second circuit board 800 , optionally, the first connecting portion 410 may contact a spring sheet provided on the first circuit board 700 , and the second connecting portion 420 may contact a spring sheet provided on the second circuit board 800 .

[0079] Alternatively, the first connecting portion 410 may be in contact with a spring sheet disposed on the first circuit board 700, and a B2B connector may be disposed on the second connecting portion 420, and the second circuit board 800 or the hardware module 800 may be inserted into the connector, thereby achieving contact between the second connecting portion 420 and the second circuit board 800 or the hardware module 800.

[0080] In another optional manner, a B2B connector may be provided on the first connection portion 410 and the second connection portion 420. Then the first circuit board 700 may contact the first connection portion 410 by insertion, and the second circuit board 800 or the hardware module 800 may also contact the second connection portion 420 by insertion.

[0081] When the connection part is in contact with the connection part by means of the spring on the circuit board, Figure 1 and Figure 4 As shown, the white square part in the figure is the projection area formed after the spring on the circuit board contacts the connecting part.

[0082] When a B2B connector is provided on the connection part, when the circuit board contacts the connection part by insertion, Figure 5 As shown, the white rectangular part in the figure is the B2B connector provided on the connecting portion, and the square frame in the white rectangular frame is the projection area formed after the circuit board is inserted into the B2B connector.

[0083] Optionally, the B2B connectors respectively provided on the original connection portion 300 and the first connection portion 410 may be the same one, for inserting into the first circuit board 700. The use of the B2B connector can also realize the extension of more electrical signals.

[0084] In view of the contact methods between the connecting part and the circuit board or the hardware module mentioned above, it should be noted that the contact methods between different connecting parts and the circuit board or the hardware module may be the same or different, and the embodiments of the present invention do not limit them. That is, you may choose to use the spring clip on the circuit board or the hardware module to achieve contact with the connecting part, or you may choose to set a B2B connector on the connecting part to achieve contact with the circuit board or the hardware module through the B2B connector.

[0085] Optionally, this embodiment does not limit the manner of electrical connection between the connection portion and the circuit board or the hardware module, and the above-mentioned manner of achieving electrical connection through the spring clip or the B2B connector are just a few examples.

[0086] In this embodiment, the combination of the original connection part 300 and the first part 500 in the packaging structure can ensure the normal operation of the electronic component 200 in the packaging structure. On this basis, the packaging structure is also newly provided with an extended connection part 400 including a first connection part 410 and a second connection part 420 and a second part 600. The combination of the first connection part 410 in contact with the first circuit board 700 and the second connection part 420 in contact with the second circuit board 800 or the hardware module 800, and the second part 600 can realize the electrical connection between the first circuit board 700 and the second circuit board 800 or the hardware module 800.

[0087] In addition, for the contents not described in detail in this embodiment and the technical effects that can be achieved, please refer to the relevant descriptions in the above embodiments, and will not be repeated here.

[0088] Optionally, the FPC in the packaging structure can be arranged on at least two sides of the electronic component 200 to receive the Figure 1In the description of the illustrated embodiment, the first portion 500 may be located on the first side of the electronic component 200, and the second portion 600 may be located on the second side of the electronic component 200. The first side and the second side are parallel or perpendicular to each other. Optionally, an FPC may also be provided on a third side adjacent to both the first and second sides of the electronic component 200. For example, the first side may be the left side of the electronic component 200, the second side may be the right side of the electronic component 200, and the third side may be the upper side and / or the lower side of the electronic component 200.

[0089] In addition, compared to Figure 4 , you can also set up a larger area of ​​FPC, such as Figure 5 As shown in the figure, the increase in the area of ​​the FPC can extend more electrical signals without increasing the volume of the packaging structure.

[0090] In this embodiment, by increasing the area of ​​the FPC in the packaging structure, more electrical signals can be extended.

[0091] Optionally, a battery may also be provided inside the electronic device, and the battery may be provided adjacent to the packaging structure provided by the embodiments of the present invention. It is easy to understand that the volume of the battery is positively correlated with the battery life and standby time of the electronic device. The larger the module volume, the longer the battery life and standby time. When using the packaging structure provided by the embodiments of the present invention, since the second part 600 is provided inside the packaging structure, the extended connection part 400 is part of the housing 100. Therefore, while realizing the electrical connection between the first circuit board 700 and the second circuit board 800 or the hardware module 800, the size of the packaging structure will not be increased, and the volume of the battery in the electronic device will not be reduced, thereby ensuring the battery life and standby time of the electronic device.

[0092] Optionally, the number of wiring layers of the FPC provided in the packaging structure may be two layers. Further optionally, the number of wiring layers of the FPC may be increased, for example, the number of wiring layers may be at least three layers. By increasing the number of wiring layers, when the number of electrical signals to be extended is fixed, the setting area of ​​the FPC can be reduced, and a smaller shell can be used to package the electronic components, connecting parts and FPC inside the shell, thereby obtaining a smaller packaging structure. Ultimately, a larger battery can be provided inside the electronic device, thereby extending the battery life and standby time of the electronic device.

[0093] In this embodiment, for the packaging structure arranged adjacent to the battery, since the electrical connection can be extended without increasing the volume of the packaging structure, there is no need to reduce the size of the battery in the electronic device, thereby ensuring the battery life and standby time of the electronic device.

[0094] exist Figure 1 or Figure 4-5 Based on the package structure shown, the package structure and the circuit boards or hardware modules located on different sides outside the package structure can also form a circuit structure. Figure 6 A schematic diagram of a circuit structure provided by an embodiment of the present invention. Figure 6 As shown, the structure can be arranged in an electronic device, and specifically can include a packaging structure encapsulating an electronic component 200 and a first circuit board 700 and a second circuit board 800 or a hardware module 800 located on different sides outside the packaging structure.

[0095] The packaging structure may include a housing 100, which may include a device carrying portion, an original connection portion 300, and an extended connection portion 400. The device carrying portion is provided with an electronic component 200 and an FPC fixed to the periphery of the electronic device 200. The FPC is specifically divided into a first part 500 and a second part 600. Optionally, the electronic component 200 packaged in the packaging structure may be a speaker, a camera, and the like.

[0096] The first circuit board 700 and the second circuit board 800 or the hardware module 800 can be electrically connected through the extended connection part 400 and the second part 600 inside the packaging structure, which is equivalent to extending the electrical signal of the first circuit board 700 to the second circuit board 800 or the hardware module 800, thereby ensuring the normal operation of the two. At the same time, the electronic component 200 in the packaging structure and the first circuit board 700 can also be electrically connected through the original connection part 300 and the first part 500. With this electrical connection, the electrical signal of the first circuit board 700 can be transmitted to the electronic component 200 in the packaging structure to ensure the normal operation of the electronic component 200, that is, to ensure the normal operation of the packaging structure.

[0097] Optionally, the first circuit board 700 may be disposed on a first side outside the package structure, and the second circuit board 800 or the hardware module 800 may be disposed on a second side outside the package structure. Optionally, the first side and the second side may be perpendicular or parallel to each other.

[0098] Optionally, the first part 500 and the first circuit board 700 may be located on the same side, that is, both are located on the first side of the electronic component 200, and the first side of the electronic component 200 is the same side as the first side outside the packaging structure. The second part 600 and the second circuit board 800 or the hardware module 800 may be located on the same side, that is, located on the second side of the electronic component 200. The second side of the electronic component 200 is the same side as the second side outside the packaging structure.

[0099] In order to extend the electrical signal, the second portion 600 is further disposed on a third side adjacent to both the first side and the second side of the electronic component 200 .

[0100] In this embodiment, the circuit structure may include a packaging structure and a first circuit board 700 and a second circuit board 800 or a hardware module 800 located on different sides of the outside of the packaging structure. The packaging structure may include a housing 100 having a device bearing portion, an original connection portion 300 and an extended connection portion 400, and the electronic component 200 and the FPC disposed on the periphery of the electronic component 200 are disposed on the device bearing portion of the housing. When the first circuit board 700 may be present on the first side outside the packaging structure, and the second circuit board 800 or the hardware module 800 may be present on the second side outside the packaging structure, the original connection portion 300 and the first part 500 of the FPC are used to electrically connect the electronic device 200 and the first circuit board 700, thereby ensuring the normal operation of the electronic element 200. On this basis, for the first circuit board 700 and the second circuit board 800 or the hardware module 800 disposed on different sides outside the packaging structure, the electrical connection between the two circuit boards or the electrical connection between the circuit board and the hardware module can also be achieved through the newly added extended connection portion 400 and the newly added second part 600 to ensure the normal operation of both.

[0101] It can be seen that for circuit boards or hardware modules disposed on different sides of the outside of the packaging structure, the extended connection portion 400 and the second portion 600 in the packaging structure can establish an electrical connection between the two, that is, the electrical signal of one side is extended to the other side. In addition, since the extended connection portion 400 is a part of the housing 100, the above solution will not increase the size of the packaging structure on the basis of achieving the above-mentioned electrical signal extension.

[0102] In addition, the contents not described in detail in this embodiment and the technical effects that can be achieved can all be found in the relevant contents of the above embodiments, and will not be repeated here.

[0103] Optionally, the extended connection part 400 of the packaging structure in this embodiment can also be divided into multiple connection parts. The original connection part 300 and the extended connection part 400 can realize the electrical connection between the electronic component 200 and the first circuit board 700, and realize the electrical connection between the first circuit board 700 and the second circuit board 800, or realize the electrical connection between the first circuit board 700 and the hardware module 800. The specific method of realizing the electrical connection between the connection part and the circuit board or hardware module and the technical effect that can be achieved can be referred to. Figure 4 The relevant description in the illustrated embodiment will not be repeated here.

[0104] Similar to the packaging structure, a specific usage scenario of the circuit structure may be: the packaging structure is a speaker module in an electronic device, the first circuit board 700 may be a mainboard PCB arranged on the first side of the speaker module, and the second circuit board 800 may be an antenna PCB arranged on the second side of the speaker module, and the antenna PCB may also be provided with at least one of an antenna switch, an antenna matching circuit, a sensor, and a microphone. Among them, the first side and the second side are perpendicular or parallel to each other. Then, the electrical connection between the two PCBs can be achieved with the help of the extended connection part in the speaker module and the second part of the FPC. At this time, an electrical connection between the two PCBs can be established with the help of the second part of the FPC and the extended connection part arranged on the periphery of the speaker in the speaker module. With the help of this electrical connection, the electrical signal of the mainboard PCB can be extended to the antenna PCB, so that the mainboard PCB controls the antenna switch on the antenna PCB, thereby controlling the switch state of antennas of different frequency bands on the antenna PCB, improving the reuse degree of the antenna, and enhancing the signal of the electronic device.

[0105] Another use scenario of the circuit structure may be: the packaging structure may be a speaker module in an electronic device, the first circuit board 700 may be a mainboard PCB, and the hardware module 800 may be a motor module. At this time, with the electrical connection between the mainboard PCB and the motor module, the electrical signal of the mainboard PCB can be extended to the motor module, so that the mainboard PCB controls the rotation mode of the motor, thereby enabling the electronic device to provide different vibration modes, and different vibration modes can be applied to different functions of the electronic device.

[0106] Optionally, the above-mentioned motor module can also be replaced by any one of a camera, a USB socket, and a SIM card socket.

[0107] Figure 7 A schematic diagram of another circuit structure provided by an embodiment of the present invention. Figure 6 Based on the circuit structure shown in FIG. 1 , the circuit structure may further include a battery 900 disposed adjacent to the packaging structure. Figure 7 As shown, the battery 900 is marked with a right slash.

[0108] It is easy to understand that the volume of the battery 900 is positively correlated with the battery life and standby time of the electronic device. The larger the volume of the battery 900, the longer the battery life and standby time. When using the packaging structure provided by the embodiments of the present invention, since the second part 600 is arranged inside the packaging structure, the extended connection part 400 is a part of the housing 100. Therefore, while realizing the electrical connection between the first circuit board 700 and the second circuit board 800 or the hardware module 800, the size of the packaging structure will not be increased, and the volume of the battery 900 in the electronic device will not be reduced, thereby ensuring the battery life and standby time of the electronic device.

[0109] Optionally, the number of wiring layers of the FPC can be two layers. Further optionally, the number of wiring layers of the FPC can be increased, for example, the number of wiring layers can be at least three layers. By increasing the number of wiring layers, electrical connection can be achieved while reducing the area of ​​the FPC, thereby achieving the extension of electrical signals. At this time, a smaller shell can be used to encapsulate the electronic components, connecting parts and FPC inside the shell, thereby obtaining a smaller packaging structure. Finally, a larger battery can be set inside the electronic device, thereby extending the battery life and standby time of the electronic device.

[0110] In the present embodiment, for the circuit structure arranged adjacent to the battery, since the electrical connection between the circuit boards or the electrical connection between the circuit boards and the hardware modules can be achieved without increasing the volume of the packaging structure, there is no need to reduce the size of the battery in the electronic device, thereby ensuring the battery life and standby time of the electronic device.

[0111] The packaging structure and electronic structure provided in the above embodiments of the present invention can be arranged in electronic devices including but not limited to mobile phones, personal computers (PCs), tablet computers, augmented reality (AR) devices, virtual reality (VR) devices, vehicle-mounted computers, wearable devices, smart home devices, etc.

[0112] Figure 8 A schematic diagram of the structure of an electronic device provided by an embodiment of the present invention.

[0113] The electronic device may include a processor 110, an external memory interface 120, an internal memory 121, a Universal Serial Bus (USB) interface 130, a charging management module 140, a power management module 141, a battery 142, an antenna 1, an antenna 2, a mobile communication module 150, a wireless communication module 160, an audio module 170, a speaker 170A, a receiver 170B, a microphone 170C, an earphone interface 170D, a sensor module 180, a button 190, a motor 191, an indicator 192, a camera 193, a display screen 194, etc. Among them, the sensor module 180 may include a pressure sensor 180A, a gyroscope sensor 180B, an air pressure sensor 180C, a magnetic sensor 180D, an acceleration sensor 180E, a distance sensor 180F, a proximity light sensor 180G, a fingerprint sensor 180H, a temperature sensor 180J, a touch sensor 180K, an ambient light sensor 180L, a bone conduction sensor 180M, etc.

[0114] It is also understood that the structure illustrated in the embodiments of the present invention does not constitute a specific limitation on the electronic device. In other embodiments of the present invention, the electronic device may include more or fewer components than shown in the figure, or combine some components, or split some components, or arrange the components differently. The components shown in the figure may be implemented in hardware, software, or a combination of software and hardware.

[0115] The packaging structure, the first electronic device and the second electronic device mentioned in the above embodiments can be Figure 8 Any part of the electronic device shown in the figure can be used as long as the positional relationship of the three inside the electronic device satisfies that the first electronic device and the second electronic device are respectively arranged on different sides outside the packaging structure.

[0116] The specific functions of the above-mentioned different components can be introduced below.

[0117] The processor 110 may include one or more processing units, for example, the processor 110 may include an application processor (AP), a modem processor, a graphics processor (GPU), an image signal processor (ISP), a controller, a video codec, a digital signal processor (DSP), a baseband processor, and / or a neural-network processing unit (NPU), etc. Different processing units may be independent devices or integrated into one or more processors.

[0118] The controller can generate operation control signals according to the instruction operation code and timing signal to complete the control of instruction fetching and execution.

[0119] The processor 110 may also be provided with a memory for storing instructions and data. In some embodiments, the memory in the processor 110 is a cache memory. The memory may store instructions or data that the processor 110 has just used or cyclically used. If the processor 110 needs to use the instruction or data again, it may be directly called from the memory. This avoids repeated access, reduces the waiting time of the processor 110, and thus improves the efficiency of the system.

[0120] In some embodiments, the processor 110 may include one or more interfaces. The interface may include an Inter-integrated Circuit (I2C) interface, an Inter-integrated Circuit Sound (I2S) interface, a Pulse Code Modulation (PCM) interface, a Universal Asynchronous Receiver / Transmitter (UART) interface, a Mobile Industry Processor Interface (MIPI), a General-Purpose Input / Output (GPIO) interface, a Subscriber Identity Module (SIM) interface, and / or a Universal Serial Bus (USB) interface, etc.

[0121] The USB interface 130 is an interface that complies with the USB standard specification, and specifically can be a Mini USB interface, a Micro USB interface, a USB Type C interface, etc. The USB interface 130 can be used to connect a charger to charge an electronic device, and can also be used to transfer data between an electronic device and a peripheral device. It can also be used to connect headphones to play audio through the headphones. The interface can also be used to connect other electronic devices, such as AR devices, etc.

[0122] It is understandable that the interface connection relationship between the modules illustrated in the embodiment of the present invention is only a schematic illustration and does not constitute a structural limitation of the electronic device. In other embodiments of the present invention, the electronic device may also adopt different interface connection methods in the above embodiments, or a combination of multiple interface connection methods.

[0123] The charging management module 140 is used to receive charging input from a charger. The charger may be a wireless charger or a wired charger. In some wired charging embodiments, the charging management module 140 may receive charging input from a wired charger through the USB interface 130. In some wireless charging embodiments, the charging management module 140 may receive wireless charging input through a wireless charging coil of an electronic device. While the charging management module 140 is charging the battery 142, it may also power the electronic device through the power management module 141.

[0124] The power management module 141 is used to connect the battery 142, the charging management module 140 and the processor 110. The power management module 141 receives input from the battery 142 and / or the charging management module 140, and supplies power to the processor 110, the internal memory 121, the display screen 194, the camera 193, and the wireless communication module 160. The power management module 141 can also be used to monitor parameters such as battery capacity, battery cycle number, battery health status (leakage, impedance), etc. In some other embodiments, the power management module 141 can also be set in the processor 110. In other embodiments, the power management module 141 and the charging management module 140 can also be set in the same device.

[0125] The wireless communication function of the electronic device can be implemented through antenna 1, antenna 2, mobile communication module 150, wireless communication module 160, modem processor and baseband processor.

[0126] Antenna 1 and antenna 2 are used to transmit and receive electromagnetic wave signals. Each antenna in the electronic device can be used to cover a single or multiple communication frequency bands. Different antennas can also be reused to improve the utilization of the antennas. For example, antenna 1 can be reused as a diversity antenna for a wireless local area network. In some other embodiments, the antenna can be used in combination with a tuning switch.

[0127] The mobile communication module 150 can provide solutions for wireless communications including 2G / 3G / 4G / 5G, etc., applied to electronic devices. The mobile communication module 150 may include at least one filter, a switch, a power amplifier, a low noise amplifier (LNA), etc. The mobile communication module 150 can receive electromagnetic waves from the antenna 1, and filter, amplify, and process the received electromagnetic waves, and transmit them to the modulation and demodulation processor for demodulation. The mobile communication module 150 can also amplify the signal modulated by the modulation and demodulation processor, and convert it into electromagnetic waves for radiation through the antenna 1. In some embodiments, at least some of the functional modules of the mobile communication module 150 can be set in the processor 110. In some embodiments, at least some of the functional modules of the mobile communication module 150 can be set in the same device as at least some of the modules of the processor 110.

[0128] The modem processor may include a modulator and a demodulator. Among them, the modulator is used to modulate the low-frequency baseband signal to be sent into a medium-high frequency signal. The demodulator is used to demodulate the received electromagnetic wave signal into a low-frequency baseband signal. The demodulator then transmits the demodulated low-frequency baseband signal to the baseband processor for processing. After the low-frequency baseband signal is processed by the baseband processor, it is passed to the application processor. The application processor outputs a sound signal through an audio device (not limited to a speaker 170A, a receiver 170B, etc.), or displays an image or video through a display screen 194. In some embodiments, the modem processor may be an independent device. In other embodiments, the modem processor may be independent of the processor 110 and be set in the same device as the mobile communication module 150 or other functional modules.

[0129] The wireless communication module 160 can provide wireless communication solutions including wireless local area networks (WLAN) (such as wireless fidelity (Wi-Fi) networks), Bluetooth (BT), global navigation satellite system (GNSS), frequency modulation (FM), near field communication (NFC), infrared (IR), etc., which are applied to electronic devices. The wireless communication module 160 can be one or more devices integrating at least one communication processing module. The wireless communication module 160 receives electromagnetic waves via the antenna 2, modulates the frequency of the electromagnetic wave signal and filters it, and sends the processed signal to the processor 110. The wireless communication module 160 can also receive the signal to be sent from the processor 110, modulate the frequency of it, amplify it, and convert it into electromagnetic waves for radiation through the antenna 2.

[0130] In some embodiments, the antenna 1 of the electronic device is coupled to the mobile communication module 150, and the antenna 2 is coupled to the wireless communication module 160, so that the electronic device can communicate with the network and other devices through wireless communication technology. The wireless communication technology may include Global System for Mobile Communications (GSM), General Packet Radio Service (GPRS), Code Division Multiple Access (CDMA), Wideband Code Division Multiple Access (WCDMA), Time-Division Code Division Multiple Access (TD-SCDMA), Long Term Evolution (LTE), BT, GNSS, WLAN, NFC, FM, and / or IR technology. The GNSS may include a global positioning system (GPS), a global navigation satellite system (GLONASS), a Beidou navigation satellite system (BDS), a quasi-zenith satellite system (QZSS) and / or a satellite-based augmentation system (SBAS).

[0131] The electronic device implements the display function through a GPU, a display screen 194, and an application processor. The GPU is a microprocessor for image processing, which connects the display screen 194 and the application processor. The GPU is used to perform mathematical and geometric calculations for graphics rendering. The processor 110 may include one or more GPUs that execute program instructions to generate or change display information.

[0132] The display screen 194 is used to display images, videos, etc. The display screen 194 includes a display panel. The display panel can be a liquid crystal display (LCD), an organic light-emitting diode (OLED), an active-matrix organic light-emitting diode or an active-matrix organic light-emitting diode (AMOLED), a flexible light-emitting diode (FLED), Miniled, MicroLed, Micro-oLed, a quantum dot light-emitting diode (QLED), etc. In some embodiments, the electronic device may include 1 or N display screens 194, where N is a positive integer greater than 1.

[0133] The electronic device can realize the shooting function through ISP, camera 193, video codec, GPU, display screen 194 and application processor.

[0134] ISP is used to process the data fed back by camera 193. For example, when taking a photo, the shutter is opened, and the light is transmitted to the camera photosensitive element through the lens. The light signal is converted into an electrical signal, and the camera photosensitive element transmits the electrical signal to ISP for processing and converts it into an image visible to the naked eye. ISP can also perform algorithm optimization on the noise, brightness, and skin color of the image. ISP can also optimize the exposure, color temperature and other parameters of the shooting scene. In some embodiments, ISP can be set in camera 193.

[0135] The camera 193 is used to capture still images or videos. The object generates an optical image through the lens and projects it onto the photosensitive element. The photosensitive element can be a charge coupled device (CCD) or a complementary metal oxide semiconductor (CMOS) phototransistor. The photosensitive element converts the optical signal into an electrical signal, and then transmits the electrical signal to the ISP for conversion into a digital image signal. The ISP outputs the digital image signal to the DSP for processing. The DSP converts the digital image signal into an image signal in a standard RGB, YUV or other format. In some embodiments, the electronic device may include 1 or N cameras 193, where N is a positive integer greater than 1.

[0136] Digital signal processors are used to process digital signals. In addition to processing digital image signals, they can also process other digital signals. For example, when an electronic device selects a frequency point, a digital signal processor is used to perform Fourier transform on the frequency point energy.

[0137] Video codecs are used to compress or decompress digital videos. Electronic devices can support one or more video codecs. In this way, electronic devices can play or record videos in multiple encoding formats, such as Moving Picture Experts Group (MPEG) 1, MPEG2, MPEG3, MPEG4, etc.

[0138] NPU is a neural network (NN) computing processor. It can quickly process input information and continuously self-learn by drawing on the structure of biological neural networks, such as the transmission mode between neurons in the human brain. NPU can realize applications such as intelligent cognition of electronic devices, such as image recognition, face recognition, voice recognition, text understanding, etc.

[0139] The external memory interface 120 can be used to connect an external memory card, such as a Micro SD card, to expand the storage capacity of the electronic device. The external memory card communicates with the processor 110 through the external memory interface 120 to implement a data storage function. For example, files such as music and videos can be stored in the external memory card.

[0140] The internal memory 121 can be used to store computer executable program codes, which include instructions. The internal memory 121 may include a program storage area and a data storage area. Among them, the program storage area may store an operating system, an application required for at least one function (such as a sound playback function, an image playback function, etc.), etc. The data storage area may store data created during the use of the electronic device (such as audio data, a phone book, etc.), etc. In addition, the internal memory 121 may include a high-speed random access memory, and may also include a non-volatile memory, such as at least one disk storage device, a flash memory device, a universal flash storage (Universal Flash Storage, referred to as UFS), etc. The processor 110 executes various functional applications and data processing of the electronic device by running instructions stored in the internal memory 121 and / or instructions stored in a memory provided in the processor.

[0141] The electronic device can implement audio functions such as music playing and recording through the audio module 170, the speaker 170A, the receiver 170B, the microphone 170C, the headphone jack 170D, and the application processor.

[0142] The audio module 170 is used to convert digital audio information into analog audio signal output, and is also used to convert analog audio input into digital audio signals. The audio module 170 can also be used to encode and decode audio signals. In some embodiments, the audio module 170 can be arranged in the processor 110, or some functional modules of the audio module 170 can be arranged in the processor 110.

[0143] The speaker 170A, also called a "speaker", is used to convert an audio electrical signal into a sound signal. The electronic device can listen to music or listen to a hands-free call through the speaker 170A.

[0144] The receiver 170B, also called a "earpiece", is used to convert audio electrical signals into sound signals. When the electronic device receives a call or voice message, the voice can be received by placing the receiver 170B close to the human ear.

[0145] Microphone 170C, also called "microphone" or "microphone", is used to convert sound signals into electrical signals. When making a call or sending a voice message, the user can speak by putting their mouth close to the microphone 170C to input the sound signal into the microphone 170C. The electronic device can be provided with at least one microphone 170C. In other embodiments, the electronic device can be provided with two microphones 170C, which can not only collect sound signals but also realize noise reduction function. In other embodiments, the electronic device can also be provided with three, four or more microphones 170C to realize the collection of sound signals, noise reduction, identification of sound sources, and directional recording function, etc.

[0146] The earphone interface 170D is used to connect a wired earphone and can be a USB interface 130, or a 3.5 mm Open Mobile Terminal Platform (OMTP) standard interface or a Cellular Telecommunications Industry Association of the USA (CTIA) standard interface.

[0147] The pressure sensor 180A is used to sense the pressure signal and can convert the pressure signal into an electrical signal. In some embodiments, the pressure sensor 180A can be set on the display screen 194. There are many types of pressure sensors 180A, such as resistive pressure sensors, inductive pressure sensors, capacitive pressure sensors, etc. The capacitive pressure sensor can be a parallel plate including at least two conductive materials. When a force acts on the pressure sensor 180A, the capacitance between the electrodes changes. The electronic device determines the intensity of the pressure based on the change in capacitance. When a touch operation acts on the display screen 194, the electronic device detects the touch operation intensity according to the pressure sensor 180A. The electronic device can also calculate the touch position according to the detection signal of the pressure sensor 180A. In some embodiments, touch operations acting on the same touch position but with different touch operation intensities can correspond to different operation instructions. For example: when a touch operation with a touch operation intensity less than the first pressure threshold acts on the short message application icon, an instruction to view the short message is executed. When a touch operation with a touch operation intensity greater than or equal to the first pressure threshold acts on the short message application icon, an instruction to create a new short message is executed.

[0148] The gyroscope sensor 180B can be used to determine the motion posture of the electronic device. In some embodiments, the angular velocity of the electronic device around three axes (i.e., the x, y, and z axes) can be determined by the gyroscope sensor 180B. The gyroscope sensor 180B can be used for anti-shake shooting. For example, when the shutter is pressed, the gyroscope sensor 180B detects the angle of the electronic device's shaking, calculates the distance that the lens module needs to compensate based on the angle, and allows the lens to offset the shaking of the electronic device through reverse motion to achieve anti-shake. The gyroscope sensor 180B can also be used for navigation and somatosensory game scenes.

[0149] The air pressure sensor 180C is used to measure air pressure. In some embodiments, the electronic device calculates the altitude through the air pressure value measured by the air pressure sensor 180C to assist positioning and navigation.

[0150] The magnetic sensor 180D includes a Hall sensor. The electronic device can use the magnetic sensor 180D to detect the opening and closing of the flip leather case. In some embodiments, when the electronic device is a flip phone, the electronic device can detect the opening and closing of the flip cover according to the magnetic sensor 180D. Then, according to the detected opening and closing state of the leather case or the opening and closing state of the flip cover, the flip cover can be automatically unlocked.

[0151] The acceleration sensor 180E can detect the magnitude of the acceleration of the electronic device in all directions (generally three axes). When the electronic device is stationary, it can detect the magnitude and direction of gravity. It can also be used to identify the posture of the electronic device and is applied to applications such as horizontal and vertical screen switching and pedometers.

[0152] The distance sensor 180F is used to measure the distance. The electronic device can measure the distance by infrared or laser. In some embodiments, when shooting a scene, the electronic device can use the distance sensor 180F to measure the distance to achieve fast focusing.

[0153] The proximity light sensor 180G may include, for example, a light emitting diode (LED) and a light detector, such as a photodiode. The light emitting diode may be an infrared light emitting diode. The electronic device emits infrared light outward through the light emitting diode. The electronic device uses a photodiode to detect infrared reflected light from nearby objects. When sufficient reflected light is detected, it can be determined that there is an object near the electronic device. When insufficient reflected light is detected, the electronic device can determine that there is no object near the electronic device. The electronic device can use the proximity light sensor 180G to detect when the user holds the electronic device close to the ear to talk, so as to automatically turn off the screen to save power. The proximity light sensor 180G can also be used in leather case mode and pocket mode to automatically unlock and lock the screen.

[0154] The ambient light sensor 180L is used to sense the ambient light brightness. The electronic device can adaptively adjust the brightness of the display screen 194 according to the perceived ambient light brightness. The ambient light sensor 180L can also be used to automatically adjust the white balance when taking pictures. The ambient light sensor 180L can also cooperate with the proximity light sensor 180G to detect whether the electronic device is in a pocket to prevent accidental touch.

[0155] The fingerprint sensor 180H is used to collect fingerprints. Electronic devices can use the collected fingerprint characteristics to achieve fingerprint unlocking, access application locks, fingerprint photography, fingerprint call answering, etc.

[0156] The temperature sensor 180J is used to detect temperature. In some embodiments, the electronic device uses the temperature detected by the temperature sensor 180J to execute a temperature processing strategy. For example, when the temperature reported by the temperature sensor 180J exceeds a threshold, the electronic device reduces the performance of a processor located near the temperature sensor 180J to reduce power consumption and implement thermal protection. In other embodiments, when the temperature is lower than another threshold, the electronic device heats the battery 142 to avoid abnormal shutdown of the electronic device due to low temperature. In other embodiments, when the temperature is lower than another threshold, the electronic device boosts the output voltage of the battery 142 to avoid abnormal shutdown due to low temperature.

[0157] The touch sensor 180K is also called a "touch control device". The touch sensor 180K can be set on the display screen 194, and the touch sensor 180K and the display screen 194 form a touch screen, also called a "touch control screen". The touch sensor 180K is used to detect touch operations acting on or near it. The touch sensor can pass the detected touch operation to the application processor to determine the type of touch event. Visual output related to the touch operation can be provided through the display screen 194. In other embodiments, the touch sensor 180K can also be set on the surface of the electronic device, which is different from the position of the display screen 194.

[0158] The bone conduction sensor 180M can obtain a vibration signal. In some embodiments, the bone conduction sensor 180M can obtain a vibration signal of a vibrating bone block of the vocal part of the human body. The bone conduction sensor 180M can also contact the human pulse to receive a blood pressure beat signal. In some embodiments, the bone conduction sensor 180M can also be set in an earphone and combined into a bone conduction earphone. The audio module 170 can parse out a voice signal based on the vibration signal of the vibrating bone block of the vocal part obtained by the bone conduction sensor 180M to realize a voice function. The application processor can parse the heart rate information based on the blood pressure beat signal obtained by the bone conduction sensor 180M to realize a heart rate detection function.

[0159] The key 190 includes a power key, a volume key, etc. The key 190 can be a mechanical key or a touch key. The electronic device can receive key input and generate key signal input related to user settings and function control of the electronic device.

[0160] Motor 191 can generate vibration prompts. Motor 191 can be used for incoming call vibration prompts, and can also be used for touch vibration feedback. For example, touch operations acting on different applications (such as taking pictures, audio playback, etc.) can correspond to different vibration feedback effects. For touch operations acting on different areas of the display screen 194, motor 191 can also correspond to different vibration feedback effects. Different application scenarios (for example: time reminders, receiving messages, alarm clocks, games, etc.) can also correspond to different vibration feedback effects. The touch vibration feedback effect can also support customization.

[0161] Indicator 192 may be an indicator light, which may be used to indicate charging status, power changes, messages, missed calls, notifications, etc.

[0162] The SIM card interface 195 is used to connect a SIM card. The SIM card can be connected to and separated from the electronic device by inserting it into the SIM card interface 195 or pulling it out from the SIM card interface 195. The electronic device can support 1 or N SIM card interfaces, where N is a positive integer greater than 1. The SIM card interface 195 can support Nano SIM cards, Micro SIM cards, SIM cards, and the like. Multiple cards can be inserted into the same SIM card interface 195 at the same time. The types of the multiple cards can be the same or different. The SIM card interface 195 can also be compatible with different types of SIM cards. The SIM card interface 195 can also be compatible with external memory cards. The electronic device interacts with the network through the SIM card to implement functions such as calls and data communications. In some embodiments, the electronic device uses an eSIM, i.e., an embedded SIM card. The eSIM card can be embedded in an electronic device and cannot be separated from the electronic device.

[0163] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A packaging structure, It is characterized in that Set in an electronic device, the packaging structure includes a shell, and the shell includes a device carrying part, an original connection part and an extended connection part; The device carrying portion is provided with electronic components and a flexible circuit board FPC fixed to the periphery of the electronic device; The original connection portion and the first portion of the FPC are used to electrically connect the electronic component to the first circuit board; The extended connection portion and the second portion of the FPC are used to electrically connect the first circuit board to the second circuit board, or to electrically connect the first circuit board to a hardware module, the first circuit board is located on a first side outside the packaging structure, and the second circuit board or the hardware module is located on a second side outside the packaging structure.

2. The structure according to claim 1, It is characterized in that The first side outside the packaging structure and the second side outside the packaging structure are perpendicular or parallel to each other.

3. The structure according to claim 1, It is characterized in that The original connection portion is located on a first side of the electronic component; the original connection portion and the first circuit board are located on the same side; The original connection portion is electrically connected to the first circuit board.

4. The structure according to claim 1, It is characterized in that The extended connection portion includes a first connection portion located at a first side of the electronic component and a second connection portion located at a second side of the electronic component; The first connection portion and the first circuit board are located on the same side, the second connection portion and the second circuit board are located on the same side, and the second connection portion and the hardware module are located on the same side; The first connecting portion is electrically connected to the first circuit board; The second connecting portion is electrically connected to the second circuit board or the hardware module.

5. The structure according to claim 1, It is characterized in that The FPC is fixedly arranged on at least two adjacent sides of the periphery of the electronic component.

6. The structure according to claim 1, It is characterized in that The number of wiring layers of the FPC is at least two.

7. The structure according to claim 1, It is characterized in that The packaging structure is arranged adjacent to the battery inside the electronic device.

8. The structure according to claim 1, It is characterized in that The packaging structure includes a speaker module in the electronic device.

9. A circuit structure, It is characterized in that The device is in an electronic device, wherein the circuit structure comprises: a packaging structure encapsulating electronic components, a first circuit board located on a first side outside the packaging structure, and a second circuit board or hardware module located on a second side outside the packaging structure; The packaging structure includes a housing, and the housing includes a device carrying portion, an original connection portion, and an extended connection portion; The device carrying portion is provided with electronic components and a flexible circuit board FPC fixed to the periphery of the electronic device; The original connection portion and the first portion of the FPC are used to electrically connect the electronic component to the first circuit board; The extended connection portion and the second portion of the FPC are used to electrically connect the first circuit board to the second circuit board, or to electrically connect the first circuit board to the hardware module.

10. According to the structure of claim 9, It is characterized in that The first side outside the packaging structure and the second side outside the packaging structure are perpendicular or parallel to each other.

11. The structure according to claim 10, It is characterized in that The first circuit board includes a printed circuit board PCB mainboard of the electronic device, the second circuit board includes an antenna PCB in the electronic device, and the antenna PCB is provided with at least one of an antenna switch, an antenna matching circuit, a sensor and a microphone, and the hardware module includes any one of a motor, a camera, a USB socket and a SIM card socket.

12. The structure according to claim 9, It is characterized in that The electronic component includes a speaker, and the packaging structure includes a speaker module; The circuit structure further includes: a battery disposed adjacent to the speaker module.

13. An electronic device, It is characterized in that The invention comprises a packaging structure as claimed in any one of claims 1 to 8 or a circuit structure as claimed in any one of claims 9 to 12.

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