A half-etched two-dimensional code of a thick copper ceramic copper-clad carrier board and a manufacturing method thereof

Abstract

The application discloses a kind of thick copper ceramic copper-clad plate's half-etching two-dimensional code and manufacturing method, it is related to two-dimensional code manufacturing technical field, can solve the problem of the readability of the two-dimensional code of current thick copper product is bad.The thick copper ceramic copper-clad plate's half-etching two-dimensional code manufacturing method of the embodiment of the application includes the following steps: S1, obtain the thick copper plate that upper surface is covered with anticorrosion blue film;S2, etching structure, several reading unit cells with etching pattern in the inside are punched out on anticorrosion blue film, and the matrix of several reading unit cells constitutes two-dimensional code etching area;Reading unit cell includes etching pattern that anticorrosion blue film eliminates and protection pattern that anticorrosion blue film retains;S3, chemical etching, by controlling etching factor and etching speed, and etching pattern in reading unit cell, the rough bottom reading unit groove structure for diffuse reflection is etched below reading unit cell, and the matrix of several reading unit groove structures is used as two-dimensional code groove structure.

Description

TECHNICAL FIELD

[0001] The application relates to a two-dimensional code manufacturing technology field, in particular to a semi-etching two-dimensional code of a thick copper ceramic copper-clad carrier plate and a manufacturing method. BACKGROUND

[0002] DCB / AMB / DBA products are thick copper products, the copper foil thickness of which is in the range of 100 mu m-1000 mu m, the surface roughness Ra of the copper foil is between 1 and 3, the light reflection of the copper foil surface is serious, and it is very unfavorable for accurate and rapid reading of the two-dimensional code; in addition, unlike the thin copper foil with a thickness of less than 100 mu m of a PCB product, after etching of the thick copper product, there is a slope greater than 90 degrees between the upper copper and the lower copper, and if the etching is not to the bottom, a short circuit phenomenon will occur, so the two-dimensional code copper etching process of the traditional PCB is not applicable to the current DCB / AMB / DBA products.

[0003] Therefore, it is necessary to design a semi-etching two-dimensional code manufacturing method of a thick copper ceramic copper-clad carrier plate, so that the light entering amount forms a significant difference, thereby improving the contrast of the two-dimensional code and improving the readability of the two-dimensional code, which is a problem to be solved by the application. SUMMARY

[0004] The purpose of the application is to provide a semi-etching two-dimensional code of a thick copper ceramic copper-clad carrier plate and a manufacturing method, which solves the problem of poor readability of the two-dimensional code of the current thick copper product.

[0005] To solve the above technical problems, the application adopts the following scheme:

[0006] On the one hand, the application provides a semi-etching two-dimensional code manufacturing method of a thick copper ceramic copper-clad carrier plate, comprising the following steps:

[0007] S1, obtaining a thick copper carrier plate with an anticorrosion blue film covering the upper surface;

[0008] S2, etching structure, a plurality of reading unit cells with etching patterns inside are punched out on the anticorrosion blue film, and a matrix composed of a plurality of reading unit cells constitutes a two-dimensional code etching area;

[0009] The reading unit cell includes etching patterns eliminated by the anticorrosion blue film and protection patterns retained by the anticorrosion blue film;

[0010] S3, chemical etching, by controlling the etching factor and the etching speed, and the etching pattern in the reading unit cell, a rough bottom reading unit groove structure for diffuse reflection is etched below the reading unit cell, and a matrix composed of a plurality of reading unit groove structures serves as a two-dimensional code groove structure.

[0011] The etching speed in S3 is between 0.5 meters / minute and 1.5 meters / minute.

[0012] Optionally, the etching factor is calculated as follows: etching factor = 2* copper thickness / (top width of the read unit groove structure - bottom width).

[0013] Optionally, the etching factor is controlled between 2 and 4.

[0014] The etching angle of a single read unit groove structure is between 104° and 117°.

[0015] Optionally, in S3, the roughness Ra of the bottom of the read unit groove structure is between 6 and 8.

[0016] Optionally, the etching pattern in the read unit cell is a plurality of independently distributed isolated etching points.

[0017] The plurality of isolated etching points are distributed in a circular array or a rectangular array.

[0018] The number of isolated etching points in a single read unit cell ranges from 4 to 9.

[0019] Optionally, the etching pattern in the read unit cell is a single continuous etching slit or a combination of a plurality of continuous etching slits.

[0020] Optionally, the etching pattern is a single square spiral etching slit or a circular spiral etching slit that fills the read unit cell.

[0021] Optionally, the etching pattern is a plurality of concentric ring-shaped slits that are independent of each other and fill the read unit cell.

[0022] Optionally, the etching pattern is a combination of a circular etching slit and a plurality of horizontal etching slits or / and vertical etching slits.

[0023] Another aspect of the present application provides a thick copper ceramic copper-clad carrier board semi-etched two-dimensional code groove structure, which is made by the above-mentioned thick copper ceramic copper-clad carrier board semi-etched two-dimensional code manufacturing method.

[0024] The read unit groove structure of the semi-etched two-dimensional code groove structure has an etching depth of 30% to 80%, an etching angle of 104° to 117°, and a roughness Ra of the bottom of the etching area of 6 to 8.

[0025] The beneficial effects of the present application relative to the prior art are as follows:

[0026] The etching factor, etching line speed, and the shape design and area ratio design of the reading cell etching pattern in the embodiment make the reading cell groove structure etched by the application have an etching depth range of 30% to 80%; the roughness value of the bottom is increased to about 6 to 8, which is at least twice that of the original thick copper surface roughness of 1 to 3; and the sidewall is an inclined sidewall, so that the overall structure of the reading cell groove structure matrix constituting the two-dimensional code groove structure has good contrast, is easy to read and match, and can effectively solve the problem of poor readability of the current two-dimensional code. BRIEF DESCRIPTION OF DRAWINGS

[0027] Figure 1 The flowchart of the embodiment 1 of the application is shown.

[0028] Figure 2 The reading unit sectional view of the embodiment 1 of the application is shown.

[0029] Figure 3 The first example of the etching pattern in the reading unit of the embodiment 1 of the application is shown.

[0030] Figure 4 The second example of the etching pattern in the reading unit of the embodiment 1 of the application is shown.

[0031] Figure 5 The third example of the etching pattern in the reading unit of the embodiment 1 of the application is shown.

[0032] Figure 6 The fourth example of the etching pattern in the reading unit of the embodiment 1 of the application is shown.

[0033] Figure 7 The structure schematic diagram of the embodiment 2 of the application is shown.

[0034] Figure 8 The partial enlarged schematic diagram of the two-dimensional code groove structure in the embodiment 2 of the application is shown. DETAILED DESCRIPTION

[0035] The application will be further described in detail below in combination with the embodiments and drawings, but the embodiments of the application are not limited thereto.

[0036] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "longitudinal," "lateral," "horizontal," "inner," "outer," "front," "rear," "top," and "bottom," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this invention is in use. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0037] In the description of this invention, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set up," "have," "install," "connect," and "connect" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0038] The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0039] Example 1:

[0040] like Figures 1 to 6 As shown in the figure, this embodiment provides a method for fabricating semi-etched QR codes on a thick copper-ceramic copper-clad substrate, which includes the following steps:

[0041] S1. Obtain a thick copper substrate with an anti-corrosion blue film covering its upper surface;

[0042] S2. Create an etched structure by creating several read cells with etched patterns inside on the anti-corrosion blue film. The matrix of these read cells forms the QR code etched area.

[0043] The cell readout includes the etched pattern of the anti-corrosion blue film removal and the protective pattern of the anti-corrosion blue film retention;

[0044] S3. Chemical etching: By controlling the etching factor and etching speed, as well as the etching pattern in the reading cell, a rough bottom reading cell groove structure for diffuse reflection is etched below the reading cell. A matrix composed of several reading cell groove structures serves as the QR code groove structure.

[0045] In this embodiment, the area of ​​the protective graphic within the cell is read as 5 to 9 times the area of ​​the etched graphic inside it.

[0046] The design concept of this application is as follows:

[0047] In the case of determining the etching pattern of the reading unit cell, the etching depth of the reading unit cell structure can be controlled by controlling the etching line speed, and the etching angle of the reading unit cell structure can be controlled by controlling the etching factor. The roughness of the bottom of the reading unit cell structure can be improved by designing the shape and area ratio of the etching pattern of the reading unit cell, and the contrast of the reading unit cell structure can be ensured by the roughness of the bottom of the reading unit cell structure, the inclined surface of the side of the reading unit cell structure, and the appropriate etching depth, so that the overall contrast of the two-dimensional code groove structure composed of the reading unit cell structure matrix is good, and the reading and matching are easy. The problem of poor readability of the current two-dimensional code can be effectively solved.

[0048] In the embodiment, the etching depth range of the reading unit cell structure can be ensured to be between 30% and 80% by controlling the etching factor, the etching line speed, and the shape and area ratio of the etching pattern of the reading unit cell, the roughness value of the bottom of the reading unit cell structure is improved to about 6 to 8, which is at least twice the roughness of the original thick copper surface of 1 to 3, the inclination angle of the inclined wall is between 104° and 117°, and the contrast of the entire two-dimensional code groove structure is ensured, and the reading and matching of the entire two-dimensional code groove structure are easy.

[0049] Specifically, in the embodiment, the calculation method of the etching factor is as follows: etching factor = 2* copper thickness / (top width of reading unit cell structure - bottom width). According to the control of the etching factor, the side wall etching angle of the reading unit cell structure can be controlled, and according to the control of the etching factor and the etching depth, the bottom width of the reading unit cell structure can be controlled.

[0050] As for the top width of the reading unit cell structure, since the reading unit cell of the two-dimensional code etching area is generally a square, the top width can be calculated according to the preset size of the two-dimensional code etching area and the number of reading unit cells.

[0051] In some embodiments, the steps of S1 and S2 can be exchanged, and the anti-corrosion blue film covered in S1 is the anti-corrosion blue film treated by S2.

[0052] Specifically, referring to Figure 2 In the embodiment, the value of the etching factor is controlled between 2 and 4;

[0053] The etching angle of a single reading unit cell structure is between 104° and 117°. As Figure 2 shown, when the etching factor value is 2, the etching angle of the reading unit cell structure is 117°, when the etching factor value is 3, the etching angle of the reading unit cell structure is 108°, and when the etching factor value is 4, the etching angle of the reading unit cell structure is 104°.

[0054] Specifically, in the embodiment, the etching speed in S3 is between 0.5 m / min and 1.5 m / min, and the etching depth can be controlled by controlling the etching line speed.

[0055] Specifically, in the embodiment, the roughness Ra of the bottom of the read unit groove structure in S3 is between 6 and 8, and the roughness Ra of the bottom of the read unit groove structure can be 6.7, 7.3, etc.

[0056] As shown in Figure 3 Specifically, in one of the etching patterns that can be used in the embodiment, the etching pattern in the read unit cell is a plurality of independently distributed isolated etching points.

[0057] The plurality of isolated etching points are distributed in a circular array or a rectangular array.

[0058] The number of isolated etching points in a single read unit cell ranges from 4 to 9. In the embodiment, the number of isolated etching points in the read unit cell is 4, and the distance between the centers of adjacent isolated etching points is 0.5 to 0.7 times the width of a single read unit cell. A technician can set it to 5, 6, 7, 8, 9, and other numbers as needed, and adjust the distance between the centers of adjacent isolated etching points to make the plurality of isolated etching points as evenly spaced as possible to cover the read unit cell.

[0059] The shape of the isolated etching points in the embodiment is circular. In some embodiments, the shape of the isolated etching points can also be rectangular, regular hexagonal, regular octagonal, etc. which are not exemplified and described here.

[0060] Specifically, in the embodiment, the etching pattern in the read unit cell is a single continuous etching seam or a combination of etching patterns of a plurality of continuous etching seams. In the embodiment, the continuous etching seam or the combination of etching patterns of a plurality of continuous etching seams is formed by a plurality of laser pixel points along the etching pattern.

[0061] Specifically, in one of the etching patterns that can be used in the embodiment, as shown in Figure 5 and Figure 6 The etching pattern is a square spiral etching seam or a circular spiral etching seam that covers a read unit cell. In the etching pattern, the square spiral etching seam or the circular spiral etching seam is formed by a plurality of laser pixel points along a square spiral line or a circular spiral line.

[0062] Specifically, in one of the etching patterns that can be used in the embodiment, the etching pattern is a plurality of concentric ring-shaped seams (not shown in the figure) that are independent of each other and cover a read unit cell. The concentric ring-shaped seam can be a square or circular concentric ring.

[0063] Specifically, in one of the etching patterns that can be used in this embodiment, such as Figure 4 As shown, the etched pattern is a combination of a circular etch seam and multiple horizontal etch seams and / or vertical etch seams. In this embodiment, the etched pattern can be a component consisting of a circular etch seam and multiple horizontal etch seams laid within the circular etch seam.

[0064] Example 2:

[0065] like Figure 7 and Figure 8 As shown, this embodiment provides a semi-etched QR code groove structure for a thick copper ceramic copper-clad substrate, which is fabricated using the above-described method for fabricating a semi-etched QR code on a thick copper ceramic copper-clad substrate.

[0066] The etching depth of the reading unit groove structure that makes up the semi-etched QR code groove structure is between 30% and 80%, the etching angle is between 104° and 117°, and the roughness Ra value of the bottom of the etched area is between 6 and 8.

[0067] If the etching depth of the reading unit slot structure is too shallow, the structural features of the reading unit slot structure will not be obvious enough, resulting in poor reading accuracy and matching accuracy. On the other hand, if the etching depth is too deep, the bottom of the reading unit slot structure will be etched through, resulting in the loss of the entire QR code slot structure image, which will also lead to poor reading accuracy and matching accuracy.

[0068] In this embodiment, the etching depth of the unit structure is between 30% and 80%, the etching angle is between 104° and 117°, and the roughness Ra value of the bottom of the etched area is between 6 and 8. This ensures that the QR code groove structure composed of the reading unit groove structure has good contrast and ensures readability.

[0069] It is understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present invention, and the present invention is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A method for manufacturing a half-etched two-dimensional code of a thick copper ceramic copper clad carrier board, characterized in that, The method comprises the following steps: S1, obtaining a thick copper carrier plate with an anticorrosion blue film on the upper surface; S2, etching structure, a plurality of reading unit cells with etching patterns inside are punched on the anticorrosion blue film, and a matrix composed of the plurality of reading unit cells constitutes a two-dimensional code etching area; The reading unit cell comprises etching patterns eliminated by the anticorrosion blue film and protection patterns retained by the anticorrosion blue film; S3, chemical etching, a reading unit groove structure with a rough bottom for diffuse reflection is etched below the reading unit cell by controlling an etching factor and an etching speed and etching patterns in the reading unit cell, and a matrix composed of a plurality of reading unit groove structures serves as a two-dimensional code groove structure; The etching depth of the reading unit groove structure constituting the semi-etching two-dimensional code groove structure is between 30% and 80%, the etching angle is between 104° and 117°, and the roughness Ra value of the bottom of the etching area is between 6 and 8.

2. The method of claim 1, wherein the method is a method of manufacturing a half-etched two-dimensional code of a thick copper ceramic copper-clad substrate, characterized in that, The calculation method of the etching factor is as follows: etching factor = 2 * copper thickness / (top width of the reading unit groove structure - bottom width); The etching speed in S3 is between 0.5 m / min and 1.5 m / min.

3. The method of claim 2, wherein the method further comprises: applying a photoresist layer on the thick copper ceramic CCL; and exposing the photoresist layer to a laser beam to form a half-etched two-dimensional code. The value of the etching factor is controlled to be between 2 and 4; The etching angle of a single reading unit groove structure is between 104° and 117°.

4. The method of claim 1, wherein the method further comprises: The etching patterns in the reading unit cell are a plurality of independently distributed isolated etching points; The plurality of isolated etching points are distributed in a circular array or a rectangular array; The number of isolated etching points in a single reading unit cell ranges from 4 to 9.

5. The method of claim 1, wherein the method further comprises: The etching patterns in the reading unit cell are a single continuous etching seam or a combination of a plurality of continuous etching seams.

6. The method of claim 5, wherein the method further comprises: The etching patterns are a single square spiral etching seam or a circular spiral etching seam that fills the reading unit cell.

7. The method of claim 5, wherein the method further comprises: etching the thick copper layer to form a half-etched two-dimensional code. The etching patterns are a plurality of concentric ring-shaped seams that are independent of each other and fill the reading unit cell.

8. The method of claim 5, wherein the method further comprises: etching the thick copper layer to form a half-etched two-dimensional code. The etching patterns are a combination of a circular etching seam and a plurality of horizontal etching seams or / and vertical etching seams.

9. A semi-etching two-dimensional code of a thick copper ceramic copper-clad carrier plate, which is made by the method of any one of claims 1-8.

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