Automatic electronic component welding equipment

Abstract

The invention relates to the technical field of welding equipment, in particular to automatic electronic element welding equipment. The two sides of the crest welder are provided with square holes; the controller is mounted on the side surface of the crest welder; the supporting cylinder is connected to the side, away from the controller, of the crest welder; the rotating ring is rotationally connected to the supporting cylinder; the placing frames are circumferentially and uniformly connected to the outer side of the rotating ring at intervals; the mounting plates are circumferentially and uniformly connected to the outer side of the rotating ring at intervals, and the mounting plates and the placing frames are distributed in a staggered manner; the multi-stage air cylinder is mounted at the top of the mounting plate; the mounting frame is connected to a telescopic rod of the multi-stage air cylinder, the mounting frame is located over the containing frame, and a groove matched with an electronic element on the PCB is formed in the bottom of the mounting frame. The groove matched with the electronic element on the PCB is formed in the bottom of the mounting frame, and the first cooling fin, the semiconductor chilling plate and the cooling liquid in the cavity are combined, so that heat generated in the welding process can be effectively absorbed and dissipated.

Description

Technical Field

[0001] The present invention relates to the technical field of welding equipment, and in particular to an automated electronic component welding equipment. Background Art

[0002] In the field of electronic manufacturing, wave soldering is a process widely used in through-hole component (THT) soldering. It uses the dynamic wave crest formed by molten solder to make the soldering surface of the printed circuit board (PCB) contact with the liquid solder, thereby achieving efficient and batch soldering operations.

[0003] The traditional wave soldering process usually adopts manual or semi-automatic methods. The operator needs to load the PCB into a special fixture first, and then transfer the fixture to the welding area through the conveying system. During the welding process, the bottom surface of the PCB is in full contact with the solder wave crest. The solder fills the through hole under the impetus of capillary action and wetting effect, completing the connection between the component pin and the pad. However, there are significant technical problems in the existing wave soldering process: since all areas of the bottom surface of the PCB will be in direct contact with the high-temperature molten solder (usually at a temperature of 245~265℃) when passing through the solder wave crest, the heat will be quickly transferred to the electronic components through the PCB substrate and copper foil layer. For heat-sensitive components (such as electrolytic capacitors, plastic packaged devices, certain integrated circuits, etc.), this high heat conduction may cause the components to overheat, and then cause problems such as package cracking, capacitor bursting, plastic deformation and even functional failure, which will affect the function and life of the entire circuit. In addition, as electronic components are moving towards miniaturization and integration, this problem has become more and more serious, which will not only increase the product failure rate, but also bring additional cost and time burden to manufacturers. Summary of the invention

[0004] In view of this, the present invention provides an automated electronic component soldering equipment, which can overcome the shortcomings of the existing wave soldering process that when the PCB passes through the solder wave, all areas of the bottom of the PCB will come into contact with the high-temperature molten solder, and the heat will be conducted to the electronic components, causing some heat-sensitive components to be damaged, thereby affecting the function and life of the entire circuit.

[0005] The technical solution of the present invention is: an automated electronic component welding device, comprising: a wave soldering machine, both sides of which are provided with square holes; a controller, which is installed on the side of the wave soldering machine; a support tube, which is connected to the side of the wave soldering machine away from the controller; a rotating ring, which is rotatably connected to the support tube; a placement frame, which is connected to the outer side of the rotating ring at uniform intervals in the circumferential direction; a mounting plate, which is connected to the outer side of the rotating ring at uniform intervals in the circumferential direction, and the mounting plate and the placement frame are staggered; a multi-stage cylinder, which is installed on the top of the mounting plate; a mounting frame, which is connected to the telescopic rod of the multi-stage cylinder, and the mounting frame is located on the placement frame. The mounting frame is directly above the mounting frame, and a groove matching the electronic components on the PCB is formed at the bottom of the mounting frame; a first heat sink is connected to the inner wall of the mounting frame, and a cavity for storing coolant is formed between the bottom of the first heat sink and the inner wall of the mounting frame; a semiconductor refrigeration sheet is installed on the top of the first heat sink; a rotating assembly is arranged on the inner wall of the supporting tube, and is used to drive the rotating ring to rotate; an exhaust assembly is arranged on the top of the wave soldering machine, and is used to exhaust harmful gases generated during welding; a cutting assembly is arranged on the outer wall of the supporting tube, and is used to cut the pins of the electronic components.

[0006] As a further preferred embodiment, the rotating assembly includes: a connecting plate, which is connected to the inner wall of the support tube at intervals; a first drive motor, which is installed on the connecting plate; a rotating gear, which is connected to the output shaft of the first drive motor, and the inner wall of the rotating ring is circumferentially spaced with tooth holes, and the rotating gear is meshed with the tooth holes.

[0007] As a further preferred solution, the exhaust assembly includes: an exhaust fan, which is installed at intervals on the top of the wave soldering machine, and the air inlet of the exhaust fan is connected to the interior of the wave soldering machine; a connecting frame, which is connected to the top of the exhaust fan and maintains communication with the air outlet of the exhaust fan.

[0008] As a further preferred embodiment, the cutting assembly includes: a fixed frame connected to the outer wall of the supporting tube; a second drive motor installed at the bottom of the fixed frame, and the output shaft of the second drive motor rotates through the top of the fixed frame; a blade connected to the output shaft of the second drive motor.

[0009] As a further preferred solution, the inner bottom of the fixing frame is provided with an inclined surface.

[0010] As a further preferred scheme, it also includes: a second heat sink connected to the top of the semiconductor refrigeration plate; a first fan symmetrically installed on one side of the installation frame, and the air outlet of the first fan is connected to the interior of the installation frame; a second fan symmetrically installed on a side of the installation frame away from the first fan, the air outlet of the second fan is connected to the interior of the installation frame, and exhaust holes are spaced apart on the top of the installation frame; a control component is arranged on the side of the installation frame, and is used to control the opening and closing of the first fan and the second fan.

[0011] As a further preferred solution, the control component includes: a first switch, symmetrically installed on the side of the installation frame; a second switch, symmetrically installed on the side of the installation frame, and the second switch is located at the bottom of the first switch; a first contact block, connected to one of the square holes; and a second contact block, connected to the other square hole.

[0012] As a further preferred scheme, it also includes: a third drive motor, which is installed on the second heat sink, and the output shaft of the third drive motor rotates through the semiconductor refrigeration plate and the middle part of the first heat sink; a stirring rod, which is connected to the output shaft of the third drive motor, and the stirring rod is located in the cavity.

[0013] The present invention has the following advantages: 1. The present invention can effectively absorb and dissipate the heat generated during the welding process by arranging grooves that are compatible with the electronic components on the PCB at the bottom of the installation frame, and combining the first heat sink, the semiconductor cooling plate and the coolant in the cavity. Specifically, when the PCB enters the wave soldering machine for welding, the semiconductor cooling plate absorbs the heat of the coolant in the cavity through the action of the first heat sink, and the coolant quickly absorbs the heat on the electronic components, thereby achieving the purpose of cooling the electronic components. This design is particularly suitable for protecting temperature-sensitive components (such as electrolytic capacitors, plastic packaging devices, etc.) to avoid component damage or failure due to overheating.

[0014] 2. The exhaust assembly of the present invention can effectively absorb and discharge harmful gases generated during the welding process. In addition, through the intelligent management of the first fan, the second fan and the control assembly, it can not only enhance the heat dissipation effect of the semiconductor refrigeration plate and the second heat sink, but also ensure that when the installation frame enters and exits the wave soldering machine, the fan will not directly discharge harmful gases inside the wave soldering machine into the external environment. This mechanism can not only ensure the safety of the working environment, but also meet environmental protection requirements and reduce potential threats to the health of operators.

[0015] 3. The present invention realizes a semi-automatic process from PCB loading, welding to unloading through the coordinated work of components such as a rotating ring, a placement frame, a mounting plate and a multi-stage cylinder. In particular, the rotating assembly enables the placement frame to rotate automatically, and the operations of pin cutting, welding and finished product removal are completed in sequence. At the same time, the cutting assembly can ensure the accuracy and flatness of the cutting of the electronic component pins, thereby improving the overall production efficiency and consistency of product quality. These automated functions can significantly reduce the need for manual intervention, reduce labor costs, and improve the flexibility and response speed of the production line. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention.

[0017] Figure 2It is a schematic diagram of the specific structure of the support cylinder, rotating ring, placement frame and mounting plate of the present invention.

[0018] Figure 3 It is a top view of the placement frame of the present invention.

[0019] Figure 4 The figure is a schematic diagram of the installation of the multi-stage cylinder and the installation frame of the present invention.

[0020] Figure 5 It is a bottom view of the installation frame of the present invention.

[0021] Figure 6 It is a schematic diagram of the installation of the first heat sink, the semiconductor cooling fin and the second heat sink of the present invention.

[0022] Figure 7 It is a schematic diagram of the installation of the rotating assembly of the present invention.

[0023] Figure 8 It is a schematic diagram of the installation of the cutting assembly of the present invention.

[0024] Fig. 9 It is a schematic diagram of the specific structure of the fixing frame of the present invention.

[0025] Fig.10 The figure is a schematic diagram of the installation of the first fan, the second fan, the first switch and the second switch of the present invention.

[0026] Fig.11 It is a schematic diagram of the installation of the first contact block and the second contact block of the present invention.

[0027] Fig.12 This is a schematic diagram of the installation of the third driving motor and the stirring rod of the present invention.

[0028] Wherein: 1- wave soldering machine, 101- square hole, 2- controller, 3- support cylinder, 4- rotating ring, 5- placement frame, 6- mounting plate, 7- multi-stage cylinder, 8- mounting frame, 801- groove, 9- first heat sink, 901- cavity, 10- semiconductor cooling plate, 11- connecting plate, 12- first drive motor, 13- rotating gear, 14- tooth hole, 15- exhaust fan, 16- connecting frame, 17- fixed frame, 18- second drive motor, 19- blade, 20- second heat sink, 21- first fan, 22- second fan, 23- exhaust hole, 24- first switch, 25- second switch, 261- first contact block, 262- second contact block, 27- third drive motor, 28- stirring rod. DETAILED DESCRIPTION

[0029] Embodiment: An automated electronic component welding device, such as Figure 1-Figure 9As shown, it includes a wave soldering machine 1, a controller 2, a support cylinder 3, a rotating ring 4, a placement frame 5, a mounting plate 6, a multi-stage cylinder 7, a mounting frame 8, a first heat sink 9, a semiconductor cooling plate 10, a rotating assembly, an exhaust assembly and a cutting assembly. Square holes 101 are opened on the upper parts of the left and right sides of the wave soldering machine 1. The controller 2 is installed in the middle of the front side of the wave soldering machine 1. The rear side of the wave soldering machine 1 is connected to the support cylinder 3. The upper part of the support cylinder 3 is rotatably connected to the rotating ring 4. The outer side of the rotating ring 4 is evenly spaced and connected to the placement frame 5 and the mounting plate 6. The mounting plate 6 and the placement frame 5 are staggered. The four corners on the inner side of the placement frame 5 are connected with triangular plates for supporting the PCB placed in the placement frame 5. A multi-stage cylinder 7 is installed on the top of each mounting plate 6. The two multi-stage cylinders 7 located on both sides of the same placement frame 5 are a group, and the same group of multi-stage cylinders 7 are connected to the mounting plate 6. There is a detachable mounting frame 8 between the telescopic rods of the two multi-stage cylinders 7. The mounting frame 8 corresponds to the placement frame 5 one by one, and the mounting frame 8 is located directly above the corresponding placement frame 5. A groove 801 is provided at the bottom of the mounting frame 8 to match the electronic components on the PCB. The mounting frame 8 can be replaced according to different layouts of electronic components on the PCB. A first heat sink 9 is connected to the middle of the inner wall of the mounting frame 8, and a cavity 901 for storing coolant is formed between the bottom of the first heat sink 9 and the inner wall of the mounting frame 8. A semiconductor cooling plate 10 is installed on the top of the first heat sink 9. The inner wall of the support tube 3 is provided with a rotating assembly for driving the rotating ring 4 to rotate. The top of the wave soldering machine 1 is provided with an exhaust assembly for discharging harmful gases generated during welding, and the outer wall of the support tube 3 is provided with a cutting assembly for cutting the pins of the electronic components.

[0030] like Figure 4 and Figure 7 As shown, the rotating assembly includes a connecting plate 11, a first drive motor 12 and a rotating gear 13. Three groups of connecting plates 11 are connected to the inner wall of the support cylinder 3 at circumferential intervals. The number of connecting plates 11 in each group is two, and the two connecting plates 11 in the same group are symmetrically arranged in the upper and lower directions. The first drive motor 12 is installed on the top of the connecting plate 11 on the upper side, and the output shaft of the first drive motor 12 rotates through the connecting plate 11. The output shafts of the three first drive motors 12 are connected to the rotating gears 13, and the inner wall of the rotating ring 4 is circumferentially spaced with tooth holes 14, and the rotating gears 13 are meshed with the tooth holes 14.

[0031] like Figure 1 As shown, the exhaust assembly includes an exhaust fan 15 and a connecting frame 16. Three exhaust fans 15 are installed at intervals on the top of the wave soldering machine 1, and the air inlet of the exhaust fan 15 is connected to the interior of the wave soldering machine 1. A connecting frame 16 is connected between the tops of the three exhaust fans 15, and the bottom of the connecting frame 16 is connected to the air outlet of the exhaust fan 15.

[0032] like Figure 1 , Figure 8 and Fig. 9 As shown, the cutting assembly includes a fixed frame 17, a second drive motor 18 and a blade 19. The fixed frame 17 is connected to the middle of the left side of the outer wall of the support tube 3. An inclined surface is provided on the rear side of the inner bottom of the fixed frame 17. The second drive motor 18 is installed at the bottom of the fixed frame 17, and the output shaft of the second drive motor 18 rotates through the top of the fixed frame 17. The blade 19 is connected to the output shaft of the second drive motor 18.

[0033] When it is necessary to solder the electronic components on the PCB, first install the device in place, connect the top of the connection frame 16 to the exhaust pipe, and then place the PCB filled with electronic components in each placement frame 5 in turn. Then, the controller 2 controls the multi-stage cylinder 7 to drive the installation frame 8 to move downward, so that the bottom of the installation frame 8 contacts the top of the placement frame 5. At this time, the installation frame 8 covers the top of the PCB, and each electronic component on the PCB is located in the corresponding groove 801. The installation frame 8 can also limit the position of each electronic component on the PCB through the groove 801 to prevent the electronic components from moving or shaking. Then, the controller 2 controls the second drive motor 18 to drive the blade 19 to rotate, and controls the first drive motor 12 to drive the rotating gear 13 to rotate. The rotating gear 13 can drive the rotating ring 4 to rotate through the tooth hole 14, and the rotating ring 4 can drive the placement frame 5 to rotate. The placement frame 5 drives the PCB inside it to rotate. When the placement frame 5 passes over the top of the fixed frame 17, the pins of the electronic components will contact the blade 19, and the rotating blade 19 can cut the pins of the electronic components flat, and the cut pins will fall into the fixed frame 17 and slide down along the inclined surface at the bottom of the fixed frame 17 for discharge, which is convenient for Unified collection and processing; then the placement frame 5 will drive the PCB inside it to rotate to the square hole 101 on the left, and enter the wave soldering machine 1 through the square hole 101 on the left for soldering. During the soldering process, the semiconductor refrigeration sheet 10 can absorb the heat of the coolant in the cavity 901 through the action of the first heat sink 9, and the coolant will quickly absorb the heat of the electronic components, thereby achieving the purpose of cooling the electronic components and preventing the electronic components from being damaged due to overheating. At the same time, the controller 2 will control the exhaust fan 15 to start working, and the exhaust fan 15 will absorb the harmful gas generated during welding and discharge the harmful gas through the connection The frame 16 and the exhaust pipe are uniformly discharged to the waste treatment equipment. Since the suction of the exhaust fan will form a negative pressure inside the wave soldering machine, harmful gases can be prevented from leaking from the square hole 101. Then the placement frame 5 will drive the soldered PCB to rotate to the square hole 101 on the right, and move it out of the wave soldering machine 1 through the square hole 101 on the right. Then the controller 2 controls the multi-stage cylinder 7 to drive the installation frame 8 to move upward and reset, so that the installation frame 8 is separated from the placement frame 5. At this time, the soldered PCB can be taken away and a new PCB can be placed in the placement frame 5. Repeat the above operations to continuously solder the PCB.

[0034] like Figure 6 , Fig.10 and Fig.11 As shown, the second heat sink 20, the first fan 21, the second fan 22 and the control component are also included. The top of the semiconductor cooling sheet 10 is connected to the second heat sink 20, and the first fan 21 is symmetrically installed on the upper part of one side of each mounting frame 8, and the air outlet of the first fan 21 is connected to the inside of the mounting frame 8. The second fan 22 is symmetrically installed on the upper part of the side of the mounting frame 8 away from the first fan 21, and the air outlet of the second fan 22 is connected to the inside of the mounting frame 8, and the top of the mounting frame 8 is spaced apart with exhaust holes 23, and the mounting frame 8 is provided with a control unit for controlling the first fan 21. A control component for opening and closing the fan 21 and the second fan 22; the control component includes a first switch 24, a second switch 25, a first contact block 261 and a second contact block 262, two first switches 24 and two second switches 25 are installed on the side of the mounting frame 8 away from the support tube 3, and the second switch 25 is located at the lower side of the first switch 24, the first contact block 261 is connected to the front side of the inner wall of the square hole 101 on the left, and the second contact block 262 is connected to the front side of the inner wall of the square hole 101 on the right, and the horizontal height of the second contact block 262 is higher than the first contact block 261.

[0035] After the semiconductor refrigeration sheet 10 absorbs the heat of the coolant in the cavity 901, the hot end of the semiconductor refrigeration sheet 10 will release the heat upward, and the second heat sink 20 will dissipate the heat through air convection, thereby ensuring the stable operation of the semiconductor refrigeration sheet 10; and during the rotation of the mounting frame 8, the first fan 21 and the second fan 22 can be controlled by the controller 2 to start working, and the first fan 21 and the second fan 22 can blow the outside air into the mounting frame 8 and discharge it outward through the exhaust hole 23, thereby accelerating the air flow around the second heat sink 20 to enhance the heat dissipation effect of the second heat sink 20; when the mounting frame 8 is about to enter the square hole 101 on the left, the first fan 21 will first enter the inside of the wave soldering machine 1, at which time the first contact block 261 will contact the second switch 25 on the right, and the second switch 25 on the right will send a signal. After receiving the signal, the controller 2 will control the first fan 21 to temporarily stop working, thereby preventing the first fan 21 from sucking in hot air. The harmful gas is discharged to the outside through the exhaust hole 23. When the installation frame 8 completely enters the wave soldering machine 1, the first contact block 261 will contact the second switch 25 on the left, and the second switch 25 on the left will send a signal. After receiving the signal, the controller 2 will control the first fan 21 to restart working. Since the exhaust hole 23 is located inside the wave soldering machine 1 at this time, the harmful gas will not be discharged to the outside. Similarly, when the installation frame 8 is about to be moved out of the square hole 101 on the right, the first fan 21 will first be moved out of the square hole 101 on the right, and the second fan 22 is still located inside the wave soldering machine 1. At this time, the second contact block 262 will contact the first switch 24 on the right, so that the second fan 22 will temporarily stop working to prevent the second fan 22 from inhaling harmful gases and discharging them to the outside through the exhaust hole 23. When the second fan 22 is moved out of the square hole 101 on the right, the second contact block 262 will contact the first switch 24 on the left, so that the second fan 22 will restart working.

[0036] like Fig.12 As shown, it also includes a third drive motor 27 and a stirring rod 28. The third drive motor 27 is installed in the middle of the second heat sink 20, and the output shaft of the third drive motor 27 rotates through the middle of the semiconductor refrigeration plate 10 and the first heat sink 9. The stirring rod 28 is connected to the output shaft of the third drive motor 27, and the stirring rod 28 is located in the cavity 901. During the operation of the equipment, the third drive motor 27 can be controlled by the controller 2 to drive the stirring rod 28 to rotate, and the stirring rod 28 will stir the coolant in the cavity 901 to evenly distribute the heat in the coolant, so as to better cool the electronic components.

Claims

1. An automated electronic component welding device, characterized in that: The invention comprises: a wave soldering machine (1) having square holes (101) on both sides thereof; a controller (2) mounted on the side of the wave soldering machine (1); a support tube (3) connected to the side of the wave soldering machine (1) away from the controller (2); a rotating ring (4) rotatably connected to the support tube (3); a placement frame (5) connected to the outer side of the rotating ring (4) at even intervals in the circumferential direction; a mounting plate (6) connected to the outer side of the rotating ring (4) at even intervals in the circumferential direction, and the mounting plate (6) and the placement frame (5) are arranged in a staggered manner; a multi-stage cylinder (7) mounted on the top of the mounting plate (6); and a mounting frame (8) connected to the telescopic rod of the multi-stage cylinder (7), and the mounting frame (8) is located at the front of the placement frame (5). The mounting frame (8) is provided with a groove (801) adapted to the electronic component on the PCB at the bottom; a first heat sink (9) is connected to the inner wall of the mounting frame (8), and a cavity (901) for storing coolant is formed between the bottom of the first heat sink (9) and the inner wall of the mounting frame (8); a semiconductor cooling sheet (10) is mounted on the top of the first heat sink (9); a rotating assembly is arranged on the inner wall of the support tube (3) and is used to drive the rotating ring (4) to rotate; an exhaust assembly is arranged on the top of the wave soldering machine (1) and is used to exhaust harmful gases generated during soldering; and a cutting assembly is arranged on the outer wall of the support tube (3) and is used to cut the pins of the electronic component.

2. The automated electronic component welding equipment according to claim 1, characterized in that: The rotating assembly comprises: a connecting plate (11) connected to the inner wall of the supporting tube (3) at intervals; a first driving motor (12) mounted on the connecting plate (11); a rotating gear (13) connected to the output shaft of the first driving motor (12); and tooth holes (14) are spaced apart in the circumferential direction of the inner wall of the rotating ring (4), and the rotating gear (13) meshes with the tooth holes (14).

3. The automated electronic component welding equipment according to claim 1, characterized in that: The exhaust assembly comprises: an exhaust fan (15) installed at intervals on the top of the wave soldering machine (1), and an air inlet of the exhaust fan (15) is connected to the interior of the wave soldering machine (1); and a connecting frame (16) connected to the top of the exhaust fan (15) and maintained in communication with the air outlet of the exhaust fan (15).

4. The automated electronic component welding equipment according to claim 1, characterized in that: The cutting assembly comprises: a fixed frame (17) connected to the outer wall of the support tube (3); a second drive motor (18) installed at the bottom of the fixed frame (17), and the output shaft of the second drive motor (18) rotates and passes through the top of the fixed frame (17); and a blade (19) connected to the output shaft of the second drive motor (18).

5. The automated electronic component welding equipment according to claim 4, characterized in that: The inner bottom of the fixed frame (17) is provided with an inclined surface.

6. The automated electronic component welding equipment according to claim 1, characterized in that: It also includes: a second heat sink (20) connected to the top of the semiconductor cooling sheet (10); a first fan (21) symmetrically mounted on one side of the mounting frame (8), and the air outlet of the first fan (21) is connected to the inside of the mounting frame (8); a second fan (22) symmetrically mounted on a side of the mounting frame (8) away from the first fan (21), the air outlet of the second fan (22) is connected to the inside of the mounting frame (8), and an exhaust hole (23) is spaced apart at the top of the mounting frame (8); and a control component is arranged on the side of the mounting frame (8) and is used to control the opening and closing of the first fan (21) and the second fan (22).

7. The automated electronic component welding equipment according to claim 6, characterized in that: The control assembly comprises: a first switch (24) mounted on a side of a mounting frame (8); a second switch (25) mounted on a side of the mounting frame (8), and the second switch (25) is located below the first switch (24); a first contact block (261) connected to one of the square holes (101); and a second contact block (262) connected to the other square hole (101).

8. The automated electronic component welding equipment according to claim 6, characterized in that: It also includes: a third drive motor (27) mounted on the second heat sink (20), and the output shaft of the third drive motor (27) rotates to penetrate the semiconductor cooling plate (10) and the middle part of the first heat sink (9); and a stirring rod (28) connected to the output shaft of the third drive motor (27), and the stirring rod (28) is located in the cavity (901).

Images