A circuit board processing method with a stepped groove for plug-in holes

Abstract

The present application provides a method for processing a circuit board with a plug-in hole step groove, belonging to the technical field of printed circuit board production, including: processing a first core board and a second core board; pasting a resist film at the position of the preset step groove on the first core board; stacking the first core board, prepreg, and second core board in sequence from bottom to top and then performing lamination; drilling a plug-in hole downward at the preset position on the first core board; routing out the step groove at the position of the preset step groove on the first core board to expose the resist film, and stripping the resist film; performing electroless copper plating, copper plating, and tin plating on the circuit board processed in the previous step; removing the tin layer on the side wall of the step groove and the copper surface; removing the tin layer at the substrate position on the first core board at the bottom of the step groove to expose the copper surface; removing the exposed copper surface and then removing the remaining tin layer. This processing method can avoid excessive copper reduction when removing the excess copper surface in the step groove, and prevent etching of the core board pattern at the bottom of the step groove and the hole copper of the plug-in hole.

Description

Technical Field

[0001] The present invention belongs to the technical field of printed circuit board production, and in particular relates to a processing method for a circuit board with a stepped slot for plug-in holes. Background Art

[0002] At present, a new type of printed circuit board processing technology is the stepped slot technology. The main feature of the stepped slot technology is that components are soldered in the stepped slots opened on the printed circuit board, which can reduce the package size of the circuit board. The existing processing method for a circuit board with a stepped slot for plug-in holes is to drill plug-in holes at the preset stepped slots on the bottom core board and perform electroplating in the holes, then laminate multiple circuit boards, and subsequently perform electroless copper plating and electroplating at the stepped slot positions. Then, the copper surfaces above the side walls of the stepped slots and the base material at the bottom of the stepped slots are removed by chemical copper reduction. During the copper reduction process, it is easy to over-reduce the copper, causing etching of the circuit pattern on the core board at the bottom of the stepped slot and the hole copper of the plug-in holes, resulting in the risk of product scrapping. Moreover, before laminating the circuit board, a resist film needs to be pasted at the preset stepped slot positions on the bottom core board to facilitate quickly exposing the circuit pattern at the stepped slot of the bottom core board by tearing off the resist film after the stepped slot is opened. Currently, pasting the resist film is usually manual operation, which is time-consuming and laborious, and is prone to being pasted crooked, affecting production efficiency. Therefore, it is necessary to make improvements. Summary of the Invention

[0003] To solve the above-mentioned defects of the prior art, the present application provides a processing method for a circuit board with a stepped slot for plug-in holes, which avoids over-reduction of copper during the removal of the copper surfaces on the side walls of the stepped slots and the base material at the bottom of the stepped slots, and prevents etching of the pattern on the core board at the bottom of the stepped slot and the hole copper of the plug-in holes.

[0004] To achieve the above object, the present invention adopts the following technologies:

[0005] A processing method for a circuit board with a stepped slot for plug-in holes, comprising:

[0006] S1. Perform blanking, inner layer circuit, and brownification in sequence to process a first core board and a second core board;

[0007] S2. Paste a resist film at the position of the preset stepped slot on the first core board;

[0008] S3. Stack the first core board, prepreg, and second core board from bottom to top in sequence and then perform lamination;

[0009] S4. Drill plug-in holes at the preset stepped slots on the first core board;

[0010] S5. From the top of the second core board, align downward with the position of the preset stepped slot on the first core board, mill out the stepped slot, expose the resist film, and peel off the resist film;

[0011] S6. Carry out electroless copper plating, copper plating, and tin plating on the circuit board processed in step S5;

[0012] S7. Remove the tin layer and copper surface on the side wall of the stepped groove;

[0013] S8. Remove the tin layer above the substrate on the first core board at the bottom of the stepped groove to expose the copper surface, where the substrate is the insulating layer below the circuit pattern on the first core board;

[0014] S9. Remove the copper surface exposed in step S8, and then remove the remaining tin layer.

[0015] Further, in step S7, the tin layer and copper surface on the side wall of the stepped groove are removed by controlled-depth routing.

[0016] Further, in step S8, the tin layer at the substrate position on the first core board at the bottom of the stepped groove is removed by laser tin removal.

[0017] Further, in step S9, the copper surface exposed in step S8 is removed by etching.

[0018] Further, in step S9, the tin layer on the circuit board is removed by chemical tin stripping.

[0019] Further, in step S2, a resist film is pasted on the first core board by a film pasting device. The film pasting device includes a cutting table, a plurality of suction cups, a transfer mechanism, and a conveying mechanism. A plurality of strip-shaped grooves are arranged in an array along the length direction on the top of the cutting table. The length direction of the strip-shaped grooves is parallel to the width direction of the cutting table. A cutting knife is provided at one end of each strip-shaped groove, and the cutting edge of the cutting knife faces the other end of the strip-shaped groove. The plurality of cutting knives are fixed on a rotating shaft, and the rotating shaft is connected to a rotating mechanism. The rotating mechanism is used to drive the cutting knife to rotate into the strip-shaped groove through the rotating shaft; the conveying mechanism is arranged on the side of the cutting table away from the rotating mechanism and is used to convey the first core board; the suction cups are arranged in an array along the length direction of the support table above the support table, and a plurality of suction cups are respectively arranged between adjacent strip-shaped grooves. The plurality of suction cups are connected to a pitch-changing mechanism. The pitch-changing mechanism is used to change the distance between adjacent suction cups. The pitch-changing mechanism is connected to the transfer mechanism. The transfer mechanism is used to drive the pitch-changing mechanism and the suction cups to transfer to a preset position above the conveying mechanism; Pasting the resist film includes the following steps:

[0020] S21. Set a conveying frame on the conveying mechanism, place a plurality of first core boards side by side in the conveying frame, and apply adhesive at the position of the preset stepped groove on the first core board;

[0021] S22. Fix a roll of resist film at one end of the top of the cutting table, and then pull the resist film out a preset distance along the length direction of the cutting table;

[0022] S23. The control transfer mechanism drives the suction disc to move above the resist film to adsorb the resist film, and controls the rotation mechanism to drive the cutting knife to rotate towards the strip-shaped groove to cut the pulled resist film into multiple segments.

[0023] S24. When the conveying mechanism drives the conveying frame to move to a preset position above the conveying mechanism, control the transfer mechanism to drive the suction disc and the multiple segments of resist film to move to a preset position above the transfer mechanism, and at the same time control the variable pitch mechanism to increase the distance between the multiple suction discs, and transfer the multiple segments of resist film to the positions of the preset stepped grooves on the multiple first core boards.

[0024] Further, one end of the cutting table is provided with a support frame and a guide roller. A fixed shaft is rotatably connected to the support frame for fixing the roll-shaped resist film. The guide roller is arranged below the fixed shaft. The axial directions of the guide roller and the fixed shaft are both parallel to the width direction of the cutting table. A receiving groove is opened along the length direction at the top of the cutting table. The receiving groove penetrates through multiple strip-shaped grooves. A linear mechanism is arranged in the receiving groove. The movable end of the linear mechanism is connected to a chuck, and the chuck is used for clamping the resist film.

[0025] The specific steps of step S22 are: fix the roll-shaped resist film on the fixed shaft, then pass the resist film around the bottom of the guide roller and pull out the resist film to above one end of the receiving groove close to the guide roller, control the chuck to clamp the resist film, and then control the linear mechanism to drive the chuck to move towards the end of the receiving groove away from the guide roller.

[0026] The beneficial effects of the present invention are as follows:

[0027] 1. This processing method can avoid excessive copper reduction when removing the copper surface at the position of the stepped groove wall and the bottom of the stepped groove, and prevent the etching of the pattern and the via hole copper on the core board at the bottom of the stepped groove.

[0028] 2. Using a film pasting device to paste the resist film on the first core board, compared with manually pasting the resist film, the film pasting device can automatically cut the resist film, can paste multiple resist films at one time, can effectively improve the film pasting efficiency, and can avoid the situation that the manually pasted resist film is easily pasted crooked and affects the subsequent processing process.

[0029] 3. The cooperation of the chuck and the linear mechanism can continuously and automatically pull out the resist film. After the resist film is cut, there is no need for manual pulling of the resist film, and the length of the pulled resist film can be controlled, improving the dimensional accuracy of the cut resist film. Description of the Drawings

[0030] Figure 1 It is a flowchart of the processing method of the circuit board with via hole stepped grooves in the embodiment of the present application.

[0031] Figure 2 It is a schematic structural diagram of the first core board in the embodiment of the present application.

[0032] Figure 3 Schematic structural diagram after lamination of the first core board, prepreg and second core board in the embodiment of the present application.

[0033] Figure 4 Schematic structural diagram of the circuit board after the insertion holes are opened in the embodiment of the present application.

[0034] Figure 5 Schematic structural diagram of the circuit board after the step grooves are opened in the embodiment of the present application.

[0035] Figure 6 Schematic structural diagram of the circuit board after copper plating and tin plating are completed in the embodiment of the present application.

[0036] Figure 7 Schematic structural diagram of the circuit board after the copper surface and tin layer on the side wall of the step groove are removed in the embodiment of the present application.

[0037] Figure 8 Schematic structural diagram of the circuit board after the tin layer at the substrate position at the bottom of the step groove is removed in the embodiment of the present application.

[0038] Figure 9 Schematic structural diagram of the circuit board after the copper surface at the substrate position at the bottom of the step groove is removed in the embodiment of the present application.

[0039] Figure 10 Schematic structural diagram of the circuit board after all tin layers are removed in the embodiment of the present application.

[0040] Figure 11 Stereoscopic view of the overall structure of the film laminating device used in step S2 in the embodiment of the present application.

[0041] Figure 12 Stereoscopic view of the overall structure of the film laminating device from another perspective in the embodiment of the present application.

[0042] Figure 13 is Figure 12 Enlarged view of part A in

[0043] Figure 14 Stereoscopic view of the structure of the cutting table in the embodiment of the present application.

[0044] Figure 15 is Figure 14 Enlarged view of part C in

[0045] Figure 16 Stereoscopic view of the structure of the linear mechanism and the chuck in the embodiment of the present application.

[0046] Figure 17 Stereoscopic view of another perspective of the structure of the cutting table in the embodiment of the present application.

[0047] Figure 18 isFigure 17 Enlarged view of part B

[0048] Reference numerals: first core board - 1, prepreg - 2, second core board - 3, cutting table - 4, suction cup - 5, transfer mechanism - 6, conveying mechanism - 7, pitch-changing mechanism - 8, first cylinder - 9, support frame - 10, guide roller - 11, linear mechanism - 12, chuck - 13, step groove - 101, resist film - 102, copper surface - 103, tin layer - 104, plug hole - 105, circuit pattern - 106, strip groove - 401, cutting knife - 402, rotating shaft - 403, receiving groove - 404, vertical rod - 801, slide rail - 802, pushing mechanism - 803, cross-folded rod - 804, grid bar - 8041, connecting shaft - 8042, connecting block - 901, fixed seat - 902, fixed shaft - 1001, motor - 1201, lead screw - 1202, movable block - 1203, lower chuck 1301, upper chuck - 1302, second cylinder - 1303. Detailed implementation manners

[0049] To make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the following describes the implementation manners of the present invention in detail with reference to the accompanying drawings. However, the embodiments described herein are only a part of the embodiments of the present invention, rather than all of the embodiments.

[0050] As Figure 1 shown, this embodiment provides a method for processing a circuit board with a plug hole step groove, including the following steps:

[0051] S1. Core board processing: successively perform blanking, inner layer circuit, and brownification to process the first core board 1 and the second core board 3. The processed first core board 1 is as Figure 2 shown;

[0052] S2. Paste resist film: paste the resist film 102 at the position of the preset step groove 101 on the first core board 1;

[0053] S3. Lamination: as Figure 3 shown, stack the first core board 1, prepreg 2, and second core board 3 from bottom to top and then perform lamination;

[0054] S4. Drilling: as Figure 4 shown, drill the plug hole 105 at the preset step groove 101 of the first core board 1;

[0055] S5. Grooving: as Figure 5 shown, mill the step groove 101 from the top of the second core board 3 downward to align with the position of the preset step groove 101 on the first core board 1, expose the resist film 102, and strip the resist film 102;

[0056] S6. Coating processing: asFigure 6 As shown, the circuit board processed in step S5 is subjected to electroless copper plating, copper plating, and tin plating.

[0057] S7. As Figure 7 shown, the tin layer 104 and the copper surface 103 on the side wall of the stepped groove 101 are removed.

[0058] S8. As Figure 8 shown, the tin layer 104 above the base material on the bottom of the stepped groove 101 on the first core board 1 is removed to expose the copper surface 103, where the base material is the insulating layer below the circuit pattern 106 on the first core board 1.

[0059] S9. As Figure 9 shown, the exposed copper surface 103 in step S8 is removed. As Figure 10 shown, the remaining tin layers 104 on the circuit board are then removed.

[0060] Specifically, in step S7, the tin layer 104 and the copper surface 103 on the side wall of the stepped groove 101 are simultaneously removed by controlled-depth routing. Then, in step S8, the tin layer 104 at the position of the base material on the bottom of the stepped groove 101 on the first core board 1 is removed by laser tin removal. After the copper surface 103 is exposed, the exposed copper surface 103 is removed by etching. Since the remaining tin layer 104 can protect the copper surface 103 below it, it can prevent the circuit pattern 106 at the bottom of the stepped groove 101 and the hole copper in the plug hole 105 from being etched during the etching process. Finally, the tin layer 104 used for copper surface protection on the circuit board is quickly removed by chemical tin stripping, and the processing can be completed.

[0061] Embodiment 2

[0062] As Figures 11 - 18 shown, this embodiment provides a film pasting device, including a cutting table 4, a plurality of suction cups 5, a transfer mechanism 6, a conveying mechanism 7, etc., which is applied in Embodiment 1 to paste a resist film 102 at the position of the stepped groove 101 preset on the first core board 1.

[0063] Specifically, a plurality of strip-shaped grooves 401 are arranged in an array along the length direction of the top of the cutting table 4. The length direction of the strip-shaped grooves 401 is parallel to the width direction of the cutting table 4. One end of each strip-shaped groove 401 is provided with a cutting knife 402. The cutting edge of the cutting knife 402 faces the other end of the strip-shaped groove 401. A plurality of cutting knives 402 are all fixed on a rotating shaft 403. The axial direction of the rotating shaft 403 is parallel to the length direction of the cutting table 4. The rotating shaft 403 is connected to a rotating mechanism. The rotating mechanism is used to drive the cutting knife 402 to rotate into the strip-shaped groove 401 through the rotating shaft 403, and cut the resist film 102 placed on the cutting table 4 into several segments that match the size of the step groove 101. The conveying mechanism 7 is arranged on the side of the cutting table 4 away from the rotating mechanism, and is used to convey the first core board 1. The suction discs 5 are arranged in an array along the length direction of the support table above the support table, and a plurality of suction discs 5 are respectively arranged between adjacent strip-shaped grooves 401, and are used to adsorb the plurality of cut resist films 102. The plurality of suction discs 5 are connected to a variable-spacing mechanism 8. The variable-spacing mechanism 8 is used to change the distance between adjacent suction discs 5. The variable-spacing mechanism 8 is connected to the transfer mechanism 6. The transfer mechanism 6 is used to drive the variable-spacing mechanism 8 and the suction discs 5 to transfer to a preset position above the conveying mechanism 7. When the variable-spacing mechanism 8 changes the distance between adjacent suction discs 5 to a certain limit, the distance between the resist films 102 adsorbed at the bottom of the adjacent suction discs 5 matches the distance between the positions of the preset step grooves 101 on the two first core boards 1 arranged side by side. When the transfer mechanism 6 is used to drive the variable-spacing mechanism 8 and the suction discs 5 to transfer to a preset position above the conveying mechanism 7, the resist films 102 adsorbed at the bottom of the suction discs 5 can just be aligned with the positions of the step grooves 101 of the plurality of first core boards 1 conveyed on the transfer mechanism 6, and the pasting of the resist film 102 is completed.

[0064] In Embodiment 1, a glue-resistant film 102 is pasted at the position of the preset step groove 101 on the first core board 1, which specifically includes the following steps: S21. A conveying frame 14 is arranged on the conveying mechanism 7, and a plurality of first core boards 1 are placed side by side in the conveying frame 14, and glue is coated at the positions of the preset step grooves 101 on the first core boards 1. Specifically, the internal dimensions of the conveying frame 14 can be set to match the overall dimensions of the plurality of first core boards 1 placed therein; S22. A roll-shaped glue-resistant film 102 is fixed at one end of the top of the cutting table 4, and then the glue-resistant film 102 is pulled out a preset distance along the length direction of the cutting table 4. Specifically, the width of the used roll-shaped glue-resistant film 102 matches the width of the step groove 101; S23. The transfer mechanism 6 is controlled to drive the suction cup 5 to move above the glue-resistant film 102 to adsorb the glue-resistant film 102, and the rotating mechanism is controlled to drive the cutting knife 402 to rotate towards the strip-shaped groove 401 to cut the pulled-out glue-resistant film 102 into multiple sections of glue-resistant film 102 that match the shape and size of the step groove 101; S24. When the conveying mechanism 7 drives the conveying frame 14 to move to a preset position above the conveying mechanism 7, the transfer mechanism 6 is controlled to drive the suction cup 5 and the multiple sections of glue-resistant film 102 to move to a preset position above the transfer mechanism 6, and at the same time, the variable distance mechanism 8 is controlled to increase the distance between the multiple suction cups 5, and the multiple sections of glue-resistant film 102 are transferred to the positions of the preset step grooves 101 on the plurality of first core boards 1. Compared with manually pasting the glue-resistant film 102, this device can paste multiple glue-resistant films 102 at one time, which can effectively improve the film pasting efficiency and solve the problem that manually pasting the glue-resistant film 102 is easy to be pasted crookedly and affect the subsequent processing process.

[0065] Specifically, refer to Figure 12 、 Figure 13, the variable distance mechanism 8 includes multiple vertical rods 801, a slide rail 802, a pushing mechanism 803, and multiple groups of cross-folded rods 804 that are hinged end to end. Each group of cross-folded rods 804 includes a pair of cross-set grid bars 8041. The pair of grid bars 8041 are connected by a connecting shaft 8042. The multiple connecting shafts 8042 are respectively connected to the multiple vertical rods 801. The bottoms of the multiple vertical rods 801 are respectively connected to the multiple suction cups 5. The top of one of the vertical rods 801 is fixedly connected to the slide rail 802, and the tops of the remaining vertical rods 801 are all slidably connected to the slide rail 802. The slide rail 802 is connected to the transfer mechanism 6. The vertical rod 801 fixedly connected to the slide rail 802 is connected to the fixed end of the pushing mechanism 803. The connecting shaft 8042 connected to any one of the vertical rods 801 slidably connected to the slide rail 802 is connected to the telescopic end of the pushing mechanism 803. The telescopic direction of the telescopic end of the pushing mechanism 803 is parallel to the length direction of the cutting table 4. When the telescopic end of the pushing mechanism 803 is pushed out, the multiple groups of cross-folded rods 804 will rotate synchronously, increasing the distance between adjacent connecting shafts 8042, thereby driving the increase in the distance between adjacent vertical rods 801, creating a certain distance between the resist films 102 adsorbed at the bottom of the suction cups 5, which matches the distance between the positions of the preset step grooves 101 on the adjacent first core plates 1 placed side by side. When the telescopic end of the pushing mechanism 803 retracts, the distance between adjacent connecting shafts 8042 will decrease, and the vertical rods 801 and the suction cups 5 will return to the initial position, facilitating the next pressing of the resist film 102 and driving the transfer of the resist film 102. The specific steps for controlling the variable distance mechanism 8 to increase the distance between the multiple suction cups 5 in step S14 are: controlling the telescopic end of the pushing mechanism 803 to push out a preset distance.

[0066] Preferably, refer to Figures 14 - 17, one end of the cutting table 4 is provided with a support frame 10 and a guide roller 11. A fixed shaft 1001 is rotatably connected to the support frame 10 for fixing the roll-shaped resistive glue film 102. The guide roller 11 is arranged below the fixed shaft 1001. The axial directions of the guide roller 11 and the fixed shaft 1001 are both parallel to the width direction of the cutting table 4. In actual use, the roll-shaped resistive glue film 102 is pulled out, bypassed from the bottom of the guide roller 11, and a certain length is pulled out, so that the resistive glue film 102 can be pulled out in a fixed direction along the length direction of the cutting table 4. A receiving groove 404 is opened along the length direction on the top of the cutting table 4. The receiving groove 404 penetrates through a plurality of strip-shaped grooves 401. A linear mechanism 12 is arranged in the receiving groove 404. The movable end of the linear mechanism 12 is connected to a chuck 13. The chuck 13 can be a pneumatic chuck 13 for clamping the resistive glue film 102. When it is necessary to pull out the resistive glue film 102, first make the end of the resistive glue film 102 being pulled out be above one end of the receiving groove 404 close to the guide roller 11, and then control the linear mechanism 12 to drive the chuck 13 to move towards the guide roller 11 to clamp the end of the part of the roll-shaped resistive glue film 102 that is pulled out. Finally, control the linear mechanism 12 to drive the chuck 13 to move to the end of the receiving groove 404 far from the guide roller 11, and the resistive glue film 102 can be pulled out. After the subsequent cutting knife 402 cuts the resistive glue film 102 and the transfer mechanism 6 transfers the resistive glue film 102, repeating the foregoing steps can continuously and automatically pull out the resistive glue film 102.

[0067] The specific steps of step S22 are as follows: Fix the roll-shaped resistive glue film 102 on the fixed shaft 1001, then bypass the resistive glue film 102 from the bottom of the guide roller 11 and pull out the resistive glue film 102 to above one end of the receiving groove 404 close to the guide roller 11, control the chuck 13 to clamp the resistive glue film 102, and then control the linear mechanism 12 to drive the chuck 13 to move towards the end of the receiving groove 404 far from the guide roller 11.

[0068] Specifically, in order to prevent the roll-shaped resistive glue film from rotating under the action of tension when the cutting knife 402 cuts the pulled-out resistive glue film 102, which affects the subsequent clamping of the resistive glue film by the chuck, a clamping mechanism can be arranged on the support frame 10 to restrict the rotation of the fixed shaft 1001. In step S23, when cutting the resistive glue film 102, control the clamping mechanism to clamp the fixed shaft 1001 so that it cannot rotate. In step S22, when pulling out the resistive glue film 102, control the locking mechanism to cancel the clamping of the fixed shaft 1001.

[0069] Specifically, refer to Figure 15 、 Figure 16, the linear mechanism 12 includes a motor 1201, a lead screw 1202, and a movable block 1203. The two ends of the lead screw 1202 are rotatably connected in the accommodation groove 404. One end of the output shaft of the motor 1201 is connected to the lead screw 1202. The movable block 1203 is threadedly connected to the lead screw 1202, and the movable block 1203 is slidably disposed in the accommodation groove 404 along the length direction of the accommodation groove 404. The chuck 13 includes a lower chuck 1301, an upper chuck 1302, and a second air cylinder 1303. The lower chuck 1301 is fixed to the side of the movable block 1203 away from the motor 1201. The height of the top of the lower chuck 1301 matches the height of the top of the cutting table 4. The upper chuck 1302 is disposed above the lower chuck 1301, and the upper chuck 1302 is connected to the telescopic end of the second air cylinder 1303. The telescopic direction of the telescopic end of the second air cylinder 1303 is the vertical direction. The fixed end of the second air cylinder 1303 is connected to the movable block 1203. In step S22, the steps of pulling out the resist film 102 are as follows: controlling the telescopic end of the second air cylinder 1303 to move downward so that the upper chuck 1302 and the lower chuck 1301 clamp the resist film 102, and then controlling the motor 1201 to drive the lead screw 1202 to rotate so that the movable block 1203 moves toward the end of the accommodation groove 404 away from the guide roller 11.

[0070] Specifically, refer to Figure 17 , Figure 18 , the rotating mechanism includes a first air cylinder 9 and a connecting block 901. The bottom of the first air cylinder 9 is hinged to a fixed seat 902. The telescopic end of the first air cylinder 9 is hinged to the connecting block 901. The connecting block 901 is connected to the rotating shaft 403. When the telescopic end of the first air cylinder 9 is pushed out, the cutting knife 402 rotates into the strip-shaped groove 401. When the telescopic end of the first air cylinder 9 retracts, the cutting knife 402 rotates upward to disengage from the strip-shaped groove 401. The specific steps of controlling the rotating mechanism to drive the cutting knife 402 to rotate toward the strip-shaped groove 401 in step S23 are: controlling the telescopic end of the first air cylinder 9 to be pushed out.

[0071] Specifically, refer to Figure 11 , Figure 12 , the transfer mechanism 6 selects a PPU manipulator. The PPU manipulator is spaced above the cutting table 4 and the conveying mechanism 7. The grasping end of the PPU manipulator is connected to the pitch-changing mechanism 8, and is used to drive the pitch-changing mechanism 8 to achieve an inverted U-shaped movement trajectory, and transfer the resist film 102 above the cutting table 4 to the first core board 1 conveyed on the conveying mechanism 7.

[0072] The above are only the preferred embodiments of the present invention, and do not represent the only or limit the present invention. Those skilled in the art should understand that without departing from the scope of the present invention, various changes or equivalent replacements made to the present invention all fall within the scope of protection of the present invention.

Claims

1. A method for processing a circuit board with a stepped groove for plug-in holes, characterized in that, It includes the following steps: S1. Perform blanking, inner layer circuit, and brownification in sequence to process the first core board (1) and the second core board (3); S2. Paste a resist film (102) at the position of the preset step groove (101) on the first core board (1); S3. Stack the first core board (1), prepreg (2), and the second core board (3) in sequence from bottom to top and then perform lamination; S4. Drill insertion holes (105) at the preset step groove (101) of the first core board (1); S5. Align from the top of the second core board (3) downward to the position of the preset step groove (101) on the first core board (1) and rout out the step groove (101) to expose the resist film (102), and peel off the resist film (102); S6. Perform electroless copper plating, copper plating, and tin plating on the circuit board processed in step S5; S7. Remove the tin layer (104) and copper surface (103) on the side wall of the step groove (101); S8. Remove the tin layer (104) above the substrate on the first core board (1) at the bottom of the step groove (101) to expose the copper surface (103), where the substrate is the insulating layer below the circuit pattern (106) on the first core board (1); S9. Remove the exposed copper surface (103) in step S8, and then remove the remaining tin layer (104); In step S2, a film pasting device is used to paste the resist film (102) on the first core board (1). The film pasting device includes a cutting table (4), a plurality of suction cups (5), a transfer mechanism (6), and a conveying mechanism (7). A plurality of strip-shaped grooves (401) are arranged in an array along the length direction on the top of the cutting table (4). The length direction of the strip-shaped grooves (401) is parallel to the width direction of the cutting table (4). A cutting knife (402) is provided at one end of each strip-shaped groove (401). The cutting edge of the cutting knife (402) is arranged towards the other end of the strip-shaped groove (401). A plurality of cutting knives (402) are fixed on a rotating shaft (403). The rotating shaft (403) is connected to a rotating mechanism. The rotating mechanism is used to drive the cutting knife (402) to rotate into the strip-shaped groove (401) through the rotating shaft (403); the conveying mechanism (7) is arranged on the side of the cutting table (4) away from the rotating mechanism and is used to convey the first core board (1); the suction cups (5) are arranged in an array along the length direction of the support table above the support table, and a plurality of suction cups (5) are respectively arranged between adjacent strip-shaped grooves (401). A plurality of suction cups (5) are connected to a pitch-changing mechanism (8). The pitch-changing mechanism (8) is used to change the distance between adjacent suction cups (5). The pitch-changing mechanism (8) is connected to the transfer mechanism (6). The transfer mechanism (6) is used to drive the pitch-changing mechanism (8) and the suction cups (5) to transfer to a preset position above the conveying mechanism (7); Pasting the resist film (102) includes the following steps: S21. Set a conveying frame on the conveying mechanism (7), place a plurality of first core boards (1) side by side in the conveying frame, and apply adhesive at the position of the preset step groove (101) on the first core board (1); S22. Fix a roll-shaped resist film (102) at one end of the top of the cutting table (4), and then pull out the resist film (102) a preset distance along the length direction of the cutting table (4); S23. The control transfer mechanism (6) drives the suction disc (5) to move above the resist film (102) to adsorb the resist film (102), and controls the rotation mechanism to drive the cutting knife (402) to rotate towards the strip groove (401) to cut the pulled resist film (102) into multiple segments. S24. When the conveying mechanism (7) drives the conveying frame to move to a preset position above the conveying mechanism (7), the control transfer mechanism (6) drives the suction disc (5) and the multiple segments of the resist film (102) to move to a preset position above the transfer mechanism (6), and at the same time controls the variable pitch mechanism (8) to increase the distance between the multiple suction discs (5), and transfers the multiple segments of the resist film (102) to the positions of the preset step grooves (101) on the multiple first core boards (1).

2. The processing method of a circuit board with a plug-in hole step groove according to claim 1, characterized in that In step S7, the tin layer (104) and the copper surface (103) on the side wall of the step groove (101) are milled away by means of controlled-depth milling.

3. A method for processing a circuit board with a stepped groove for a plug-in hole according to claim 1, characterized in that, In step S8, the tin layer (104) at the substrate position on the bottom of the first core board (1) in the step groove (101) is removed by means of laser tin removal.

4. A method for processing a circuit board with a plug hole step groove according to claim 1, characterized in that In step S9, the copper surface (103) exposed in step S8 is removed by means of etching.

5. A method for processing a circuit board with a plug-in hole step groove according to claim 1, characterized in that, In step S9, the tin layer on the circuit board is removed by means of chemical tin stripping.

6. A method for processing a circuit board with a stepped slot for a plug-in hole according to claim 1, characterized in that, One end of the cutting table (4) is provided with a support frame (10) and a guide roller (11). A fixed shaft (1001) is rotatably connected to the support frame (10) for fixing the roll-shaped resist film (102). The guide roller (11) is arranged below the fixed shaft (1001). The axial directions of the guide roller (11) and the fixed shaft (1001) are both parallel to the width direction of the cutting table (4). A receiving groove (404) is formed in the top of the cutting table (4) along the length direction. The receiving groove (404) penetrates through multiple strip grooves (401). A linear mechanism (12) is arranged in the receiving groove (404). The movable end of the linear mechanism (12) is connected to a chuck (13), and the chuck (13) is used for clamping the resist film (102). The specific steps of step S22 are as follows: Fix the roll-shaped resist film (102) on the fixed shaft (1001), then bypass the resist film (102) from the bottom of the guide roller (11) and pull out the resist film (102) to above one end of the receiving groove (404) close to the guide roller (11), control the chuck (13) to clamp the resist film (102), and then control the linear mechanism (12) to drive the chuck to move towards the end of the receiving groove (404) away from the guide roller (11).

Images