Display panel, manufacturing method of display panel and electronic equipment

Abstract

The invention provides a display panel, a manufacturing method of the display panel and electronic equipment. The display panel comprises a substrate; the pixel defining layer is located on one side of the substrate, and a plurality of pixel openings are defined by the pixel defining layer; the isolation structure is located on the side, away from the substrate, of the pixel defining layer, a plurality of isolation openings are defined by the isolation structure, and orthographic projections of the pixel openings on the substrate are located in orthographic projections of the corresponding isolation openings on the substrate; the isolation structure comprises a supporting part and a shielding part located on the side, away from the substrate, of the supporting part. The extension part covers at least part of the exposed pixel defining layer, so that the risk that the part of the pixel defining layer is etched to generate pits in the subsequent etching operation can be reduced, the packaging quality of the subsequent packaging unit is ensured, and the risk that the light-emitting functional layer is damaged due to the fact that etching liquid invades into the light-emitting functional layer in the subsequent etching process is further reduced.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular, to a display panel, a method for manufacturing a display panel, and an electronic device. Background Art

[0002] Organic Light Emitting Diode (OLED) and flat-panel display devices based on technologies such as Light Emitting Diode (LED) have been widely used in various consumer electronic products such as mobile phones, televisions, laptops, desktop computers, etc. due to their advantages of high image quality, power saving, thin body and wide application range, becoming the mainstream in display devices. In the preparation process of traditional display panels, the graphicization of luminous pixels is usually achieved through a fine metal mask (FMM). FMM technology is mature and has rich experience in mass production. However, FMM technology also has problems such as limited accuracy, high development cost and long development cycle. The non-fine metal mask technology eliminates the limitations of traditional OLED processes on display screen size, resolution and other screen performance, and has the advantages of high performance, full-domain size and agile delivery. Patents CN118251982A, CN116648095A, CN117062489A, CN118742138A, CN118678783A, CN118660598A, CN118675450A, CN118824188A, and CN118781966A record relevant contents of the non-fine metal mask technology for reference.

[0003] However, the performance of current OLED display products needs to be improved. Summary of the invention

[0004] In order to overcome the above-mentioned deficiencies in the prior art, one of the purposes of the present application is to provide a display panel, the display panel comprising: substrate; A pixel defining layer located on one side of the substrate, the pixel defining layer enclosing a plurality of pixel openings; An isolation structure located on a side of the pixel defining layer away from the substrate, the isolation structure encloses a plurality of isolation openings, the orthographic projections of the pixel openings on the substrate are located within the orthographic projections of the corresponding isolation openings on the substrate; the isolation structure comprises a supporting portion and a shielding portion located on a side of the supporting portion away from the substrate; the isolation structure further comprises an extension portion located on a side of at least part of the supporting portion facing the isolation opening, the extension portion being located on a side of the pixel defining layer away from the substrate; in at least one of the isolation openings, the extension portion at different positions has different extension lengths in a direction toward the isolation opening; A plurality of light-emitting devices, at least part of which is located in the corresponding pixel opening, the light-emitting device comprising a first electrode, a light-emitting functional layer and a second electrode stacked in a direction away from the substrate, the second electrode of the light-emitting device overlapping the extension portion having a longer extension length.

[0005] In some possible implementations, the support portion is conductive, and includes a first side surface and a second side surface facing the isolation opening and arranged opposite to each other; the extension portion in at least part of the isolation opening includes a first extension portion close to the first side surface and a second extension portion close to the second side surface; the extension length of the second extension portion is less than the extension length close to the first extension portion; the second extension portion is conductive; At least a portion of the second electrode of the light-emitting device overlaps the second extending portion, and / or the second electrode of the light-emitting device overlaps the second side surface.

[0006] In some possible implementations, the material of the first extension portion includes a conductive material; At least part of the second electrode of the light emitting device is in contact with the corresponding first extension portion; Preferably, the light-emitting functional layer and the first extending portion are spaced apart from each other.

[0007] In some possible implementations, the support portion includes a first sublayer and a second sublayer located on a side of the first sublayer away from the substrate, the first extension portion is connected to the first sublayer, and the first extension portion and the first sublayer are arranged in the same layer and made of the same material; Preferably, under the same etching conditions, the etching resistance of the second sub-layer is weaker than the etching resistance of the shielding portion; Preferably, the orthographic projection of the supporting portion on the substrate is located within the orthographic projection of the shielding portion on the substrate; Preferably, the material of the first sublayer and the first extension portion includes molybdenum, and the material of the second sublayer includes aluminum; Preferably, the material of the shielding portion includes titanium.

[0008] In some possible implementations, the first extension portion 1431 and the support portion are made of the same material and are connected to each other; Preferably, the material of the support portion and the first extension portion 1431 includes aluminum.

[0009] In some possible implementations, the first extension portion includes a first portion and a second portion, the first portion is located on a side of the pixel defining layer away from the substrate, and the second portion extends along a side surface of the support portion; Preferably, a material of the first extension portion is different from a material of the support portion.

[0010] In some possible implementations, the material of the first extension portion includes an insulating material; Preferably, the material of the first extension portion includes organic material or inorganic material.

[0011] In some possible implementations, the thicknesses of the extension portions corresponding to at least two of the isolation openings are different; Preferably, the thicknesses of the extension portions in the isolation openings corresponding to the light emitting devices of different colors are different.

[0012] In some possible implementations, the extension lengths of the extension portions corresponding to at least two of the isolation openings are different; Preferably, the extension lengths of the extension portions in the isolation openings corresponding to the light emitting devices of different colors are different.

[0013] In some possible implementations, the isolation opening includes a first isolation opening and a second isolation opening; the light emitting device includes a first light emitting device and a second light emitting device, the first light emitting device and the second light emitting device have different light colors, the first light emitting device is located in the first isolation opening, and the second light emitting device is located in the second isolation opening; In the same second isolation opening, the extension portions at different positions have different extension lengths in a direction toward the second isolation opening; Preferably, the isolation opening further includes a third isolation opening, the light emitting device further includes a third light emitting device, the first light emitting device, the second light emitting device and the third light emitting device have different light emitting colors, and the third light emitting device is located in the third isolation opening; In the same third isolation opening, the extension portions at different positions have different extension lengths in a direction toward the third isolation opening.

[0014] In some possible implementations, the pixel defining layer includes a first surface close to a side of the substrate and a second surface away from a side of the substrate, the orthographic projection of the second surface on the substrate is located within the orthographic projection of the first surface on the substrate; the orthographic projection of the extension portion on the substrate is located within the orthographic projection of the second surface on the substrate; Preferably, a distance between an orthographic projection of an edge of the extending portion having a longer extension length close to the pixel opening on the substrate and an orthographic projection of an edge of the second surface close to the pixel opening on the substrate is less than or equal to 2 micrometers.

[0015] In some possible implementations, the display panel further includes: A plurality of packaging units, wherein the packaging units are located at a side of the corresponding light-emitting device away from the substrate; Preferably, at least a portion of the packaging unit extends to a side of the isolation structure away from the substrate; Preferably, adjacent packaging units are arranged at intervals; Preferably, the display panel further comprises a first encapsulation layer and a second encapsulation layer located on a side of the encapsulation unit and the isolation structure away from the substrate; Preferably, the material of the encapsulation unit and the second encapsulation layer includes inorganic material; and the material of the first encapsulation layer includes organic material.

[0016] Another object of the present application is to provide a method for manufacturing a display panel, the method comprising: providing a substrate; A pixel defining layer and an isolation structure are stacked and arranged on one side of the substrate; the pixel defining layer encloses a plurality of pixel openings; the isolation structure encloses a plurality of isolation openings, and the orthographic projections of the pixel openings on the substrate are located within the orthographic projections of the corresponding isolation openings on the substrate; the isolation structure includes a supporting portion and a shielding portion located on a side of the supporting portion away from the substrate; at least part of the isolation structure also includes an extension portion located on a side of at least part of the supporting portion facing the isolation opening, and in at least one of the isolation openings, the extension lengths of the extension portions at different positions in the direction toward the isolation opening are different; A plurality of light-emitting devices are formed, wherein at least a portion of the light-emitting devices is located in the corresponding pixel openings, and the light-emitting devices include a first electrode, a light-emitting functional layer, and a second electrode stacked in a direction away from the substrate, and the second electrode of the light-emitting device overlaps the extension portion having a longer extension length.

[0017] In some possible implementations, the step of forming a stacked pixel defining layer and an isolation structure on one side of the substrate includes: Disposing a first material layer on one side of the substrate; Disposing a second material layer on one side of the first material layer; Etching the second material layer to form the shielding portion and the supporting portion of the isolation structure; Etching the first material layer to form a pixel defining layer including the pixel opening; A first extension portion among the extension portions is formed by deposition in at least a portion of the isolation opening.

[0018] Another object of the present application is to provide an electronic device, which includes the display panel provided in the present application, or the electronic device includes a display panel manufactured by the manufacturing method of the display panel provided in the present application.

[0019] Compared with the prior art, this application has the following beneficial effects: The present application provides a display panel, a method for manufacturing a display panel, and an electronic device. In a display panel with an isolation structure, by extending an extension portion to cover at least a portion of an exposed pixel defining layer, the risk of this portion of the pixel defining layer being etched to produce pits in a subsequent etching operation can be reduced, thereby ensuring the packaging quality of subsequent packaging units, and further reducing the risk of etching liquid invading the light-emitting functional layer and causing damage to the light-emitting functional layer during the subsequent etching process. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0021] Figure 1 It is a structural schematic diagram of a display panel in the prior art; Figure 2 One of the cross-sectional schematic diagrams of the display panel provided in this embodiment; Figure 3 A second cross-sectional schematic diagram of a display panel provided in this embodiment; Figure 4 The third cross-sectional schematic diagram of the display panel provided in this embodiment; Figure 5 A fourth cross-sectional schematic diagram of the display panel provided in this embodiment; Figure 6 A fifth cross-sectional schematic diagram of the display panel provided in this embodiment; Figure 7 A sixth cross-sectional schematic diagram of the display panel provided in this embodiment; Figure 8 The seventh cross-sectional schematic diagram of the display panel provided in this embodiment; Fig. 9 An eighth cross-sectional schematic diagram of the display panel provided in this embodiment; Fig.10 A ninth cross-sectional schematic diagram of a display panel provided in this embodiment; Fig.11 The tenth cross-sectional schematic diagram of the display panel provided in this embodiment; Fig.12 The eleventh cross-sectional schematic diagram of the display panel provided in this embodiment; Fig.13 The twelfth cross-sectional schematic diagram of the display panel provided in this embodiment; Fig.14 A schematic flow chart of the steps of the method for manufacturing a display panel provided in this embodiment; Fig.15 This is a schematic diagram of a manufacturing process of a display panel provided in this embodiment; Fig.16 The second schematic diagram of the manufacturing process of the display panel provided in this embodiment; Fig.17 The third schematic diagram of the manufacturing process of the display panel provided in this embodiment.

[0022] Icon: 111-substrate; 112-array functional layer; 120-first electrode; 130-pixel defining layer; 140-isolation structure; 910-isolation opening; 911-first isolation opening; 912-second isolation opening; 913-third isolation opening; 810-light-emitting device; 811-first light-emitting device; 812-second light-emitting device; 813-third light-emitting device; 150-light-emitting functional layer; 160-second electrode; 170-packaging unit; 180-first packaging layer; 190-second packaging layer; 141-supporting part; 142-shielding part; 143-extension part; 1431=first extension part; 1432-second extension part; 1411-first sublayer; 1412-second sublayer; 1401-first side; 1402-second side; 701 first part; 702-second part; 1300-first material layer; 1400-second material layer. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0024] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0025] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0026] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "vertical", "horizontal", "inner", "outer", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the inventive product is usually placed when in use. They are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0027] It should be noted that, in the absence of conflict, different features in the embodiments of the present application may be combined with each other.

[0028] In some related display panels, see Figure 1 , an isolation structure 140' having an isolation opening 910' is provided on the pixel defining layer 130', and when the light-emitting material layer and the conductive material layer are formed by evaporating to form the light-emitting function layer 150' and the second electrode 160' of the light-emitting device 810', the light-emitting material layer and the conductive material layer between different isolation openings 910' can be disconnected, so that the light-emitting function layer 150' and the second electrode 160' can be formed by etching after the whole layer is evaporated. Among them, in some such display panels, the second electrode 160' is overlapped with the isolation structure 140' on only one side, so as to avoid the second electrode 160' being too thick to cause color deviation of the visual field.

[0029] The inventors have found that in the above case, since the second electrode 160' is overlapped on only one side, when the conductive material layer of the second electrode 160' is formed by evaporation, a portion of the pixel defining layer 130' will not be covered by the conductive material layer (such as Figure 1 In the subsequent etching process, the pixel defining layer 130' will be directly damaged by the etching, resulting in a pit defect in the pixel defining layer 130', which affects the performance of the actual panel.

[0030] In view of this, the present embodiment provides a solution that can reduce the pit defects in the pixel definition layer. The solution provided by the present embodiment is described in detail below.

[0031] See also Figure 2 , Figure 2This is a schematic diagram of a display panel provided in this embodiment. The display panel may include a substrate 111 , a pixel defining layer 130 , an isolation structure 140 and a plurality of light-emitting devices 810 .

[0032] In this embodiment, the material of the substrate 111 may include a rigid material, such as glass, or the material of the substrate 111 may include a flexible material, such as polyimide (Pi).

[0033] Optionally, an array function layer 112 may be further provided on one side of the substrate 111. The array function layer 112 may include multiple film layer structures, such as a buffer layer, an active layer, multiple conductive layers, multiple insulating layers, and a planarization layer. The multiple film layer structures of the array function layer 112 may form multiple thin film transistors (TFTs) and wiring structures at different positions. The thin film transistors cooperate with each other to form multiple pixel driving units or driving circuits. The wiring structure provides signals or voltages for the circuits.

[0034] See also Figure 3 The pixel defining layer 130 is located on one side of the substrate 111. For example, the pixel defining layer 130 may be located on a side of the array function layer 112 away from the substrate 111. The pixel defining layer 130 surrounds and forms a plurality of pixel openings 1301, and the plurality of pixel openings 1301 are arranged at intervals.

[0035] The isolation structure 140 is located on a side of the pixel defining layer 130 away from the substrate 111. The isolation structure 140 encloses and forms a plurality of isolation openings 910. The orthographic projection of the pixel opening 1301 on the substrate 111 is located within the orthographic projection of the corresponding isolation opening 910 on the substrate 111. That is, the isolation opening 910 is connected to the pixel opening 1301. Among them, one isolation opening 910 is correspondingly arranged with at least one pixel opening 1301.

[0036] The isolation structure 140 includes a support portion 141 and a shielding portion 142 located on a side of the support portion 141 away from the substrate 111. The isolation structure 140 also includes an extension portion 143 located on a side of at least a portion of the support portion 141 facing the isolation opening 910, and the extension portion 143 is located on a side of the pixel defining layer 130 away from the substrate 111, that is, in this embodiment, the extension portion 143 is provided to cover at least a portion of the area of ​​the pixel defining layer 130 not covered by the support portion 141.

[0037] In at least one isolation opening 910 , the extension portions 143 at different positions have different extension lengths in a direction toward the isolation opening 910 .

[0038] For example, see Figure 4The support portion 141 includes a first side surface 1401 and a second side surface 1402 facing the isolation opening 910 and arranged opposite to each other, and the extension portion 143 includes a first extension portion 1431 close to the first side surface 1401 and a second extension portion 1432 close to the second side surface 1402. The extension length W1 of the first extension portion 1431 is different from the extension length W2 of the second extension portion 1432.

[0039] In one example, see Figure 4 , the extension length W2 of the second extension portion 1432 is less than the extension length W1 of the first extension portion 1431. In another example, see Figure 5 , the length of the extension length W2 of the second extension portion 1432 can be 0.

[0040] Optionally, in a direction away from the substrate 111 , the thickness of the extending portion 143 is smaller than the thickness of the supporting portion 141 .

[0041] A plurality of light emitting devices 810, at least part of which is located in a corresponding isolation opening 910. The light emitting device 810 includes a first electrode 120, a light emitting functional layer 150, and a second electrode 160 stacked in a direction away from the substrate 111. In the same isolation opening 910, the extensions 143 at different positions have different extension lengths in the direction toward the isolation opening 910, and the second electrode 160 corresponding to the isolation opening 910 at least overlaps with the extension 143 with the longest extension length.

[0042] For example, see Figure 6 When the extension length of the first extension portion 1431 is greater than the extension length of the second extension portion 1432 , the second electrode 160 may overlap with the first extension portion 1431 .

[0043] Based on the above design, in the scheme of single-sided overlap of the second electrode 160, by extending the extension portion 143 on the non-overlapping side to cover at least a portion of the exposed pixel defining layer 130, the risk of this portion of the pixel defining layer 130 being etched to produce pits in the subsequent etching operation can be reduced, thereby ensuring the packaging quality of the subsequent packaging unit 170, and further reducing the risk of the etching solution invading the light-emitting functional layer 150 and causing damage to the light-emitting functional layer 150 during the subsequent etching process.

[0044] In some possible implementations, the pixel defining layer 130 includes a first surface close to the substrate 111 and a second surface away from the substrate 111, and the orthographic projection of the second surface on the substrate 111 is located within the orthographic projection of the second surface on the substrate 111. The orthographic projection of the extension portion 143 on the substrate 111 is located within the orthographic projection of the second surface on the substrate 111.

[0045] That is, in this embodiment, the extension portion 143 does not extend into the pixel opening 1301 , thereby preventing the extension portion 143 from blocking the light emitting effect of the light emitting device 810 .

[0046] Optionally, a distance between an orthographic projection of an edge of the first extension portion 1431 close to the pixel opening 1301 on the substrate 111 and an orthographic projection of an edge of the second surface close to the pixel opening 1301 on the substrate 111 is less than or equal to 2 micrometers.

[0047] In some possible implementations, the second extension portion 1432 is conductive, and at least a portion of the second electrode 160 of the light-emitting device 810 overlaps the second extension portion 1432 , and / or the second electrode 160 of the light-emitting device 810 overlaps the second surface 1402 .

[0048] Optionally, there is a gap between the orthographic projection of the light emitting functional layer 150 and the second electrode 160 on the substrate 111 and the orthographic projection of the first side surface 1401 on the substrate 111 .

[0049] That is, in this embodiment, the second electrode 160 of the light emitting device 810 is directly overlapped with the second side surface 1402 of the support portion 141 , and there is a gap between the second electrode 160 and the first side surface 1401 of the support portion 141 .

[0050] On a side close to the first side surface 1401 , a longer first extension portion 1431 is provided to cover the pixel defining layer 130 , thereby preventing the pixel defining layer 130 from being directly exposed and causing damage and pits to be formed during a subsequent etching process.

[0051] Optionally, the first electrode 120 can be connected to the pixel driving circuit in the array functional layer 112, and the second electrode 160 can be connected to the common voltage providing circuit through the isolation structure 140. When there is a potential difference between the first electrode 120 and the second electrode 160, the light-emitting functional layer 150 located between the first electrode 120 and the second electrode 160 is driven to emit light.

[0052] Optionally, in this embodiment, the support portion 141 includes a first side surface 1401 and a second side surface 1402 that are oppositely disposed and face the isolation opening 910 in a first direction, wherein the first direction is the same as the moving direction of the evaporation source when manufacturing the light-emitting device 810. For example, when manufacturing the light-emitting device 810, a linear evaporation source is used, the strip opening direction of the evaporation source is perpendicular to the first direction, and the moving direction of the evaporation source is parallel to the first direction.

[0053] In some possible implementations, the material of the first extension portion 1431 includes a conductive material. At least part of the second electrode 160 of the light emitting device 810 is in contact with the corresponding first extension portion 1431 .

[0054] That is, in this embodiment, the second electrode 160 of at least part of the light emitting device 810 is in direct contact with the second side surface 1402 of the support portion 141 to achieve electrical connection, and is also in contact with the conductive first extension portion 1431, so as to achieve electrical connection with the first side surface 1401 of the support portion 141 through the first extension portion 1431. In this way, the impedance of the electrical connection between the second electrode 160 of this part of the light emitting device 810 and the isolation structure 140 can be reduced, thereby reducing the light emitting energy consumption.

[0055] Optionally, in this case, the light-emitting functional layer 150 is spaced from the first extension portion 1431. That is, the light-emitting functional layer 150 does not contact the first extension portion 1431 to avoid lateral leakage. For example, in this embodiment, the light-emitting functional layer 150 can be prevented from contacting the first extension portion 1431 by controlling the evaporation angle.

[0056] For some possible implementations, see Figure 7 The support portion 141 includes a first sublayer 1411 and a second sublayer 1412 located on a side of the first sublayer 1411 away from the substrate 111. The first extension portion 1431 is connected to the first sublayer 1411. The first extension portion 1431 is disposed in the same layer and made of the same material as the first sublayer 1411. For example, the first sublayer 1411 and the first extension portion 1431 can be formed by etching the same film layer.

[0057] That is, in this embodiment, the first extension portion 1431 can be regarded as the first sub-layer 1411 extending in the direction of the isolation opening 910 .

[0058] Optionally, under the same etching conditions, the etching resistance of the second sub-layer 1412 is weaker than the etching resistance of the blocking portion 142 .

[0059] Optionally, the orthographic projection of the support portion 141 on the substrate 111 is located within the orthographic projection of the shielding portion 142 on the substrate 111. That is, on the side facing the isolation opening 910, the support portion 141 is retracted relative to the shielding portion 142 to form an undercut structure.

[0060] Optionally, the material of the first sub-layer 1411 includes molybdenum, and the material of the second sub-layer 1412 includes aluminum.

[0061] Optionally, the material of the shielding portion 142 includes titanium.

[0062] Optionally, in this case, the second extension portion 1432 is disposed in the same layer and made of the same material as the first sub-layer 1411. For example, the first sub-layer 1411 and the second extension portion 1432 can be formed by etching the same film layer.

[0063] For other possible implementations, see Figure 8The first extension portion 1431 and the support portion 141 are made of the same material and are connected to each other.

[0064] That is, in this embodiment, the first extension portion 1431 can be regarded as a portion of the support portion 141 extending toward the isolation opening 910 .

[0065] Optionally, the orthographic projection of the support portion 141 on the substrate 111 is located within the orthographic projection of the shielding portion 142 on the substrate 111. That is, on the side facing the isolation opening 910, the support portion 141 is retracted relative to the shielding portion 142 to form an undercut structure.

[0066] Optionally, the support portion 141 and the first extension portion 1431 are made of aluminum. Thus, aluminum oxide may be formed on the surface of the first extension portion 1431 to reduce the conductivity of the first extension portion 1431. Even if the light emitting functional layer 150 contacts the first extension portion 1431, a large amount of lateral leakage will not be generated.

[0067] Optionally, the material of the shielding portion 142 includes titanium.

[0068] Optionally, in this case, the extension length of the second extension portion 1432 may be 0.

[0069] For other possible implementations, see Fig. 9 The first extension portion 1431 includes a first portion 701 and a second portion 702 . The first portion 701 is located on a side of the pixel defining layer 130 away from the substrate 111 , and the second portion 702 extends along the first side surface 1401 of the support portion 141 .

[0070] For example, in this embodiment, after the support portion 141 and the shielding portion 142 are completed, the first extension portion 1431 can be formed by deposition through a separate process. In this case, a portion of the first extension portion 1431 (i.e., the first portion 701) is located on the side of the pixel defining layer 130 away from the substrate 111, and the other portion (i.e., the second portion 702) can cover the first side surface 1401 of the support portion 141.

[0071] Optionally, the material of the first extension portion 1431 is different from that of the support portion 141 .

[0072] In some possible implementations, the material of the first extension portion 1431 includes an insulating material. For example, the material of the first extension portion 1431 includes an organic material or an inorganic material. In this way, the light-emitting functional layer 150 can be prevented from being electrically connected to the support portion 141 of the isolation structure 140 through the extension portion 143, thereby preventing lateral leakage.

[0073] Optionally, see Fig.10When the material of the first extension portion 1431 is an insulating material, the light-emitting functional layer 150 can be in contact with the first extension portion 1431, and the first extension portion 1431 can extend toward the isolation opening 910 as much as possible. For example, the first extension portion 1431 can extend to the boundary of the pixel defining layer 130 close to the pixel opening 1301, thereby better covering and protecting the pixel defining layer 130.

[0074] In some possible implementations, the thicknesses of the extension portions 143 corresponding to at least two isolation openings 910 are different.

[0075] For example, see Fig.11 The isolation opening 910 may include a first isolation opening 911, a second isolation opening 912 and a third isolation opening 913, wherein if an extension portion 143 is provided in the second isolation opening 912 and the third isolation opening 913, a thickness H1 of the extension portion 143 corresponding to the second isolation opening 912 may be different from a thickness H2 of the extension portion 143 corresponding to the third isolation opening 913.

[0076] Optionally, the thickness of the extension portion 130 within the isolation opening 910 corresponding to the light emitting devices 810 of different colors is different. Specifically, the light-emitting device 810 may include a first light-emitting device 811, a second light-emitting device 812 and a third light-emitting device 813. The light-emitting colors of the first light-emitting device 811, the second light-emitting device 812 and the third light-emitting device 813 are different. The first light-emitting device 811 is located in the first isolation opening 911, the second light-emitting device 812 is located in the second isolation opening 912, and the third light-emitting device 813 is located in the third isolation opening 913.

[0077] Among them, the first light-emitting device 811, the second light-emitting device 812 and the third light-emitting device 813 are formed in different etching processes in sequence. In this case, the extension portion 143 corresponding to the third isolation opening 913 will be subjected to more etching damage than the extension portion 143 corresponding to the second isolation opening 912. Therefore, the thickness H1 of the extension portion 143 corresponding to the second isolation opening 912 can be set to be different from the thickness H2 of the extension portion 143 corresponding to the third isolation opening 913. For example, the thickness H2 of the extension portion 143 corresponding to the third isolation opening 913 is made greater than the thickness H1 of the extension portion 143 corresponding to the second isolation opening 912, thereby offsetting the more etching damage to the extension portion 143 corresponding to the third isolation opening 913, and ensuring the protection effect of each extension portion 143 on the pixel definition layer 130.

[0078] In some possible implementations, the extension lengths of the extension portions 143 corresponding to at least two isolation openings 910 are different. Optionally, the maximum extension lengths of the extension portions 143 corresponding to at least two isolation openings 910 are different.

[0079] For example, see Fig.11 The isolation opening 910 may include a first isolation opening 911, a second isolation opening 912 and a third isolation opening 913, wherein if an extension portion 143 is provided in the second isolation opening 912 and the third isolation opening 913, an extension length W11 of the extension portion 143 corresponding to the second isolation opening 912 may be different from an extension length W12 of the extension portion 143 corresponding to the third isolation opening 913.

[0080] Optionally, the extension lengths of the extension portions 130 in the isolation openings 910 corresponding to the light emitting devices 810 of different colors are different.

[0081] Specifically, the light-emitting device 810 may include a first light-emitting device 811, a second light-emitting device 812 and a third light-emitting device 813. The light-emitting colors of the first light-emitting device 811, the second light-emitting device 812 and the third light-emitting device 813 are different. The first light-emitting device 811 is located in the first isolation opening 911, the second light-emitting device 812 is located in the second isolation opening 912, and the third light-emitting device 813 is located in the third isolation opening 913.

[0082] Among them, the first light-emitting device 811, the second light-emitting device 812 and the third light-emitting device 813 are formed in different etching processes in sequence. In this case, the extension portion 143 corresponding to the third isolation opening 913 will be subjected to more etching damage than the extension portion 143 corresponding to the second isolation opening 912. Therefore, the maximum extension length W11 of the extension portion 143 corresponding to the second isolation opening 912 can be set to be different from the maximum extension length W12 of the extension portion 143 corresponding to the third isolation opening 913. For example, the maximum extension length W12 of the extension portion 143 corresponding to the third isolation opening 913 is made greater than the maximum extension length W11 of the extension portion 143 corresponding to the second isolation opening 912, thereby offsetting the more etching damage suffered by the extension portion 143 corresponding to the third isolation opening 913, and ensuring the protection effect of each extension portion 143 on the pixel definition layer 130.

[0083] For some possible implementations, see again Figure 2 The isolation opening 910 includes a first isolation opening 911 and a second isolation opening 912. The light emitting device 810 includes a first light emitting device 811 and a second light emitting device 812. The first light emitting device 811 and the second light emitting device 812 emit different colors. The first light emitting device 811 is located in the first isolation opening 911, and the second light emitting device 812 is located in the second isolation opening 912.

[0084] In the same second isolation opening 920 , the extension portions 14 at different positions have different extension lengths in the direction toward the second isolation opening 920 .

[0085] Optionally, the isolation opening 910 further includes a third isolation opening 913 , the light emitting device 810 further includes a third light emitting device 813 , the first light emitting device 811 , the second light emitting device 812 and the third light emitting device 813 have different luminous colors, and the third light emitting device 813 is located in the third isolation opening 913 .

[0086] In the same third isolation opening 930 , the extension portions 14 at different positions have different extension lengths in the direction toward the third isolation opening 930 .

[0087] For example, in this embodiment, the extension portion 143 in the first isolation opening 911 may not be extended, and the extension portions 143 in the second isolation opening 912 and the third isolation opening 913 may be extended.

[0088] Specifically, in this embodiment, the light-emitting device 810 of the first isolation opening 911 may be the light-emitting device 810 manufactured first. In this case, the pixel defining layer 130 corresponding to the first isolation opening 911 will not be damaged by etching, so it is not necessary to extend the extension portion 143 to protect the pixel defining layer 130. The second light-emitting device 812 and the third light-emitting device 813 are manufactured later, so in the process of etching to form the first light-emitting device 811, the pixel defining layer 130 corresponding to the second isolation opening 912 and the third isolation opening 913 may be damaged, so the extension portions 143 of the second isolation opening 912 and the third isolation opening 913 may be extended to protect the pixel defining layer 130.

[0089] In some other possible implementations, the extension portions 143 in the first isolation opening 911 , the second isolation opening 912 , and the third isolation opening 913 may be extended.

[0090] For some possible implementations, see Fig.13 The display panel further includes a plurality of packaging units 170 , and the packaging units 170 are located on a side of the corresponding light emitting device 810 away from the substrate 111 .

[0091] Optionally, at least a portion of the packaging unit 170 extends to a side of the isolation structure 140 away from the substrate 111 .

[0092] Optionally, adjacent encapsulation units 170 are arranged at intervals.

[0093] Optionally, the display panel further includes a first encapsulation layer 180 and a second encapsulation layer 190 located on a side of the encapsulation unit 170 and the isolation structure 140 away from the substrate 111 .

[0094] Optionally, the materials of the encapsulation unit 170 and the second encapsulation layer 190 include inorganic materials, and the material of the first encapsulation layer 180 includes organic materials.

[0095] In some possible implementations, the display panel provided in this embodiment may further include an optical film (e.g., a polarizer) located on the side of the second encapsulation layer 190 away from the substrate 111, a transparent adhesive layer (e.g., an optical adhesive layer), a cover plate and other film layer structures, which are not described one by one in this embodiment.

[0096] See also Fig.14 This embodiment also provides a method for manufacturing a display panel, which may include the following steps.

[0097] Step S110 , providing a substrate 111 .

[0098] Step S120, forming a stacked pixel definition layer 130 and an isolation structure 140 on one side of the substrate 111. The pixel definition layer 130 encloses a plurality of pixel openings 1301. The isolation structure 140 encloses a plurality of isolation openings 910, and the orthographic projection of the pixel opening 1301 on the substrate 111 is located within the orthographic projection of the corresponding isolation opening 910 on the substrate 111. The isolation structure 140 includes a support portion 141 and a shielding portion 142 located on a side of the support portion 141 away from the substrate 111. At least part of the isolation structure 140 also includes an extension portion 143 located on a side of at least part of the support portion 141 facing the isolation opening 910, and in at least one isolation opening 910, the extension lengths of the extension portion 143 at different positions in the direction toward the isolation opening 910 are different.

[0099] Step S130, forming a plurality of light-emitting devices 810, wherein at least a portion of the light-emitting devices 810 is located in the corresponding isolation openings 910. The light-emitting devices 810 include a first electrode 120, a light-emitting functional layer 150, and a second electrode 160 stacked in a direction away from the substrate 111. The second electrode 160 of the light-emitting device 810 overlaps the extension portion 143 having a longer extension length.

[0100] For some possible implementations, see Fig.15 In step S120 , a first material layer 1300 may be disposed on one side of the substrate 111 , and then a second material layer 1400 may be disposed on one side of the first material layer 1300 .

[0101] Next, see Fig.16 The second material layer 1400 is etched to form the shielding portion 142 and the supporting portion 141 of the isolation structure 140 . The first material layer 1300 is etched to form the pixel defining layer 130 including the pixel opening 1301 .

[0102] Optionally, when the extension length of the second extension portion 1432 is not 0, the second extension portion 1432 may be formed when the second material layer 1400 is etched.

[0103] Then, see Fig.17 , a first extension portion 1431 of the extension portion 143 is deposited in at least a portion of the isolation opening 910 .

[0104] In some other possible implementations, in step S120, the second material layer 1400 may include multiple sub-layers. After the second material layer 1400 is formed, different sub-layers in the second material layer 1400 may form the shielding portion 142, the supporting portion 141 and the first extension portion 1431 of the isolation structure 140 by controlling the etching range and / or etching time.

[0105] Optionally, when the extension length of the second extension portion 1432 is not 0, the second extension portion 1432 may be formed when the second material layer 1400 is etched.

[0106] The present application also provides an electronic device, which includes the display panel provided in the present application, or includes a display panel manufactured by the method for manufacturing a display panel provided in the present application. The electronic device may include a mobile phone, a tablet computer, a smart wearable device, a television, a laptop computer, a monitor, and other devices with a display function.

[0107] In summary, the present application provides a display panel, a method for manufacturing a display panel, and an electronic device. In a display panel with an isolation structure, the risk of this part of the pixel defining layer being etched to produce pits in a subsequent etching operation can be reduced, thereby ensuring the packaging quality of the subsequent packaging unit, and further reducing the risk of the etching liquid invading the light-emitting functional layer and causing damage to the light-emitting functional layer during the subsequent etching process.

[0108] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0109] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A display panel, characterized in that: The display panel comprises: substrate; A pixel defining layer located on one side of the substrate, the pixel defining layer enclosing a plurality of pixel openings; An isolation structure located on a side of the pixel definition layer away from the substrate, the isolation structure encloses a plurality of isolation openings, the orthographic projections of the pixel openings on the substrate are located within the orthographic projections of the corresponding isolation openings on the substrate; the isolation structure comprises a support portion and a shielding portion located on a side of the support portion away from the substrate; the isolation structure further comprises an extension portion located on a side of at least a portion of the support portion facing the isolation opening, the extension portion being located on a side of the pixel definition layer away from the substrate; A plurality of light-emitting devices, at least part of which is located in the corresponding pixel opening, and the light-emitting device comprises a first electrode, a light-emitting functional layer, and a second electrode stacked in a direction away from the substrate; In the same isolation opening, the extension portions at different positions have different extension lengths in the direction toward the isolation opening, and the second electrode of the light-emitting device at least overlaps with the extension portion with the longest extension length.

2. The display panel according to claim 1, characterized in that: The support portion is conductive, and includes a first side surface and a second side surface facing the isolation opening and arranged opposite to each other; the extension portion in at least part of the isolation opening includes a first extension portion close to the first side surface and a second extension portion close to the second side surface; the extension length of the second extension portion is shorter than the extension length close to the first extension portion; the second extension portion is conductive; At least a portion of the second electrode of the light-emitting device overlaps the second extending portion, and / or the second electrode of the light-emitting device overlaps the second side surface.

3. The display panel according to claim 2, characterized in that: The material of the first extension portion includes a conductive material; At least a portion of the second electrodes of the light emitting device is in contact with the corresponding first extending portion.

4. The display panel according to claim 3, characterized in that: The light-emitting functional layer is spaced apart from the first extension portion.

5. The display panel according to claim 2, characterized in that: The support portion includes a first sublayer and a second sublayer located on a side of the first sublayer away from the substrate, the first extension portion is connected to the first sublayer, and the first extension portion and the first sublayer are arranged in the same layer and made of the same material; The orthographic projection of the supporting portion on the substrate is located within the orthographic projection of the shielding portion on the substrate.

6. The display panel according to claim 5, characterized in that: The material of the first sub-layer and the first extension portion includes molybdenum, the material of the second sub-layer includes aluminum; and the material of the shielding portion includes titanium.

7. The display panel according to claim 2, characterized in that: The first extension portion and the support portion are made of the same material and are connected to each other.

8. The display panel according to claim 7, characterized in that: The material of the support portion and the first extension portion includes aluminum.

9. The display panel according to claim 2, characterized in that: The first extension portion includes a first portion and a second portion, the first portion is located on a side of the pixel defining layer away from the substrate, and the second portion extends along a side surface of the support portion; The material of the first extension portion is different from that of the support portion.

10. The display panel according to claim 2, characterized in that: The material of the first extension portion includes insulating material.

11. The display panel according to claim 1, characterized in that: The thickness of the extension portion in the isolation opening corresponding to the light emitting devices of different colors is different.

12. The display panel according to claim 1, characterized in that: The extension lengths of the extension portions in the isolation openings corresponding to the light emitting devices of different colors are different.

13. The display panel according to claim 1, characterized in that: The isolation opening includes a first isolation opening and a second isolation opening; the light emitting device includes a first light emitting device and a second light emitting device, the first light emitting device and the second light emitting device have different light emitting colors, the first light emitting device is located in the first isolation opening, and the second light emitting device is located in the second isolation opening; In the same second isolation opening, the extension portions at different positions have different extension lengths in a direction toward the second isolation opening.

14. The display panel according to claim 13, characterized in that: The isolation opening further includes a third isolation opening, the light emitting device further includes a third light emitting device, the first light emitting device, the second light emitting device and the third light emitting device have different light emitting colors, and the third light emitting device is located in the third isolation opening; In the same third isolation opening, the extension portions at different positions have different extension lengths in a direction toward the third isolation opening.

15. The display panel according to claim 1, characterized in that: The pixel defining layer includes a first surface close to the substrate and a second surface away from the substrate, wherein the orthographic projection of the second surface on the substrate is located within the orthographic projection of the first surface on the substrate; and the orthographic projection of the extension portion on the substrate is located within the orthographic projection of the second surface on the substrate.

16. The display panel according to claim 15, characterized in that: A distance between an orthographic projection of an edge of the extending portion having a longer extension length close to the pixel opening on the substrate and an orthographic projection of an edge of the second surface close to the pixel opening on the substrate is less than or equal to 2 micrometers.

17. The display panel according to claim 1, characterized in that: The display panel further includes: A plurality of packaging units, wherein the packaging units are located at a side of the corresponding light-emitting device away from the substrate; At least part of the packaging unit extends to a side of the isolation structure away from the substrate; adjacent packaging units are arranged at intervals; The display panel further comprises a first encapsulation layer and a second encapsulation layer located on a side of the encapsulation unit and the isolation structure away from the substrate; the materials of the encapsulation unit and the second encapsulation layer comprise inorganic materials; and the material of the first encapsulation layer comprises organic materials.

18. A method for manufacturing a display panel, characterized in that: The method comprises: providing a substrate; A pixel defining layer and an isolation structure are stacked on one side of the substrate; the pixel defining layer encloses a plurality of pixel openings; the isolation structure encloses a plurality of isolation openings, and the orthographic projections of the pixel openings on the substrate are located within the orthographic projections of the corresponding isolation openings on the substrate; the isolation structure includes a supporting portion and a shielding portion located on a side of the supporting portion away from the substrate; at least part of the isolation structure also includes an extension portion located on a side of at least part of the supporting portion facing the isolation opening, and in at least one of the isolation openings, the extension lengths of the extension portions at different positions in the direction toward the isolation opening are different; A plurality of light-emitting devices are formed, wherein at least a portion of the light-emitting devices is located in the corresponding pixel openings, and the light-emitting devices include a first electrode, a light-emitting functional layer, and a second electrode stacked in a direction away from the substrate, and the second electrode of the light-emitting device overlaps the extension portion having a longer extension length.

19. The method according to claim 18, characterized in that The step of forming a stacked pixel defining layer and an isolation structure on one side of the substrate comprises: Disposing a first material layer on one side of the substrate; Disposing a second material layer on one side of the first material layer; Etching the second material layer to form the shielding portion and the supporting portion of the isolation structure; Etching the first material layer to form a pixel defining layer including the pixel opening; A first extension portion among the extension portions is formed by deposition in at least a portion of the isolation opening.

20. An electronic device, characterized in that: The electronic device comprises the display panel according to any one of claims 1 to 12, or the electronic device comprises a display panel manufactured by the method for manufacturing a display panel according to any one of claims 13 to 14.

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