Method for producing resin molded article, resin molded article, and mold for insert molding

Abstract

Provided is an insert molding method whereby an embedded portion continuous with an exposed portion can be easily and sufficiently supported by the resin of a resin molded body itself, and the embedded portion can be sufficiently sealed. And a step for sliding the sliding pin (130) in synchronization with the clamping operation of the first mold (110) and the second mold (120), and deforming the sliding pin (130) so that the sliding pin (130) is wrapped in the exposed portion (50) in a state in which the embedded portion (40) of the insert member is exposed in the molding space. At the boundary between the embedded part (40) and the exposed part (50), a third surface of the wall surface of the molding space is formed by a sliding pin (130). The molten resin is caused to flow in and solidify until the embedded part (40) is positioned in the molten resin and the molten resin is brought into contact with the third surface. The sliding pin (130) is caused to slide, and the sliding pin (130) is deformed so as to release the exposed part (50) from the inclusion of the sliding pin (130).

Description

Technical Field

[0001] The present invention relates to a method for producing a resin molded product, a resin molded product produced by the production method, and an insert molding die used in the production method. Background Art

[0002] A conventional method is to place an insert component in a mold and fill molten resin around the insert component to produce a resin molded product in which the insert component and the resin molded body are integrated. For example, Patent Document 1 (Japanese Patent No. 5546696) discloses a technique in which contact pins electrically connected to an electrode pattern of a base film embedded in an injection molded product are exposed from the molded resin by insert molding.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Patent Publication No. 5546696 Summary of the invention

[0006] Technical problem to be solved by the invention

[0007] Although a method of exposing a rod-shaped insert component such as a contact pin described in Patent Document 1 from a resin molded body has been proposed, it is difficult to expose a component having a complex shape such as a connector to the outside of the resin molded body by insert molding.

[0008] Therefore, conventionally, a manufacturing method is often used in which after insert molding, a through hole penetrating to an insert component for electrical connection is provided in the resin molded body, the electrical connection of the connector is performed using the through hole, and then the through hole is filled with a sealing material.

[0009] However, it is laborious to fill the through-hole with a sealing material after making an electrical connection such as a connector using the through-hole. In addition, if the sealing by the sealing material is insufficient, moisture may penetrate into the connection portion, causing a malfunction.

[0010] The technical problem of the present invention is to provide the following insert molding method: in the insert molding method in which a part of the embedded component is exposed to the outside of the resin molded body, the embedded part continuous with the exposed part can be easily supported by the resin of the resin molded body itself, and the embedded part can be fully sealed.

[0011] Solutions for solving technical problems

[0012] Hereinafter, a plurality of methods will be described as solutions to the technical problems. These methods can be arbitrarily combined as needed.

[0013] In a method for manufacturing a resin molded product according to one aspect of the present invention, the resin molded product is formed by integrating a resin molded body and an embedded component through insert molding, and the embedded component has: a main body portion embedded in the resin molded body; an embedded portion protruding from the main body portion and embedded in the resin molded body; and an exposed portion extending from the embedded portion and exposed outside the resin molded body. The method for manufacturing a resin molded product includes: a first step of placing the embedded component between a first mold and a second mold; a second step of closing the first mold and the second mold to form a molding space for accommodating the embedded component; a third step of molding the resin molded body embedded with the embedded component by allowing molten resin to flow into the molding space and solidifying the molten resin; and a fourth step of opening the first mold and the second mold to remove the resin molded body. The wall surface of the molding space includes a first surface of the first mold and a second surface of the second mold. In the second step, the slide pin is slid synchronously with the clamping action of the first mold and the second mold, and the slide pin is changed so that the exposed portion is enclosed by the slide pin while the embedded portion of the embedded component is exposed in the molding space, and the third surface of the wall of the molding space is formed by the slide pin at the boundary between the embedded portion and the exposed portion. In the third step, the molten resin is flowed and solidified until the embedded portion is located in the molten resin and the molten resin contacts the third surface. In the fourth step, the slide pin is slid and the slide pin is changed so that the exposed portion is released from the enclosed portion of the slide pin.

[0014] In the manufacturing method of the resin molded product thus constructed, the slide pin is changed so as to include the exposed portion, so that even if the shape of the exposed portion is complicated, a resin molded product having an embedded component in which the exposed portion is exposed to the outside of the resin molded body and the embedded portion is embedded in the inside of the resin molded body can be easily manufactured. In the resin molded product thus manufactured, the embedded portion is reliably supported by the resin molded body, and the periphery of the boundary between the embedded portion and the main body is sealed by the resin molded body.

[0015] The manufacturing method of the resin molded product can be configured such that, in the second step, the exposed portion is received in the receiving portion of the slide pin in the released state and the receiving portion is deformed into a closed state in synchronization with the mold clamping action, thereby enclosing the exposed portion and forming the third surface, in the third step, the molten resin is prevented from flowing into the receiving portion, and in the fourth step, the receiving portion in the closed state is deformed into a released state, and the exposed portion is taken out of the receiving portion. In the manufacturing method of the resin molded product configured in this way, the slide pin can be changed by utilizing the mold clamping action by deforming the receiving portion from the released state to the closed state in synchronization with the mold clamping action, and the manufacturing process and the manufacturing device can be simplified.

[0016] The manufacturing method of the resin molded product can be configured such that the housing portion of the slide pin includes a plurality of divided pieces, the plurality of divided pieces are deformed into a closed state by sliding and combining when the exposed portion is housed inside the housing portion in the second step, and are deformed into a released state by separating when the exposed portion is taken out of the housing portion in the fourth step. In the manufacturing method of the resin molded product configured in this way, the housing portion is composed of a plurality of divided pieces, so that it is easy to form the housing portion in accordance with the shape of the exposed portion.

[0017] The above-mentioned method for manufacturing a resin molded product can be configured such that the plurality of split pieces slide in a direction away from the resin molded body when separated. In the method for manufacturing a resin molded product configured in this way, the influence of the sliding pin on the resin molded product when sliding can be reduced.

[0018] In the above-mentioned method for manufacturing a resin molded product, the exposed portion has a bank on the outer peripheral surface, the bank protrudes in an annular shape to block the molten resin, and the receiving portion has an annular groove portion, the groove portion allows the exposed portion to move in a direction intersecting the sliding direction, and the groove portion can abut against the bank in an annular shape. In the method for manufacturing a resin molded product thus constructed, it is possible to increase the tolerance for the dimensional error of the embedded component.

[0019] A resin molded product according to one aspect of the present invention comprises: a resin molded body made of a thermoplastic resin; and an insert component embedded in the resin molded body by insert molding. The insert component comprises: a main body embedded in the resin molded body; an embedded portion protruding from the main body and embedded in the resin molded body; and an exposed portion extending from the embedded portion and exposed outside the resin molded body. The exposed portion comprises: an outer peripheral surface exposed from the resin molded body, and a convex portion protruding from the outer peripheral surface.

[0020] The resin molded product described above can be formed into a complex shape of the exposed portion of the insert component by the convex portion protruding from the outer peripheral surface, and can be formed into a connector with a complex shape, for example.

[0021] The above-mentioned resin molded product may be configured to have a bank portion on the outer peripheral surface, the bank portion protruding in an annular shape and in contact with the resin molded body.

[0022] In the above-mentioned resin molded product, the main body includes a film substrate, and the film substrate has a circuit. The exposed portion includes a connector or a connection terminal electrically connected to the circuit. In the resin molded product thus constructed, the connector or the connection terminal is reliably supported by the resin molded body, and the electrical connection between the circuit and the connector or the connection terminal can be protected by the resin molded body.

[0023] The insert molding die according to one aspect of the present invention is used to manufacture a resin molded product, wherein the resin molded product is formed by integrating a resin molded body and an insert component through insert molding, and the insert component has: a main body portion embedded in the resin molded body; an embedded portion protruding from the main body portion and embedded in the resin molded body; and an exposed portion extending from the embedded portion and exposed outside the resin molded body. The insert molding die includes: a first die and a second die, wherein the first die has a first surface, and the second die has a second surface, and the first die and the second die are used to form the wall surface of a molding space, and the molding space is used to mold the resin molded body; and a sliding pin having a third surface, and the third surface is used to form the wall surface of the molding space. The sliding pin has a housing portion, and the housing portion houses the exposed portion. The housing portion changes from a released state to a closed state when the mold is closed and houses the exposed portion, and changes from a closed state to a released state in a manner that allows the exposed portion to be taken out when the mold is opened.

[0024] The insert molding die configured in this manner can be used even if the shape of the portion exposed to the outside of the resin molded body is complicated.

[0025] Effects of the Invention

[0026] In the manufacturing method of the resin molded product, the resin molded product and the mold for embedding molding involved in the present invention, in a resin molded product having an embedded component having an exposed portion exposed to the outside of the resin molded body, the embedded portion continuous with the exposed portion can be fully supported by the resin of the resin molded body itself, and the embedded portion can be fully sealed. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a perspective view of a resin molded product according to an embodiment.

[0028] Figure 2 It is along Figure 1 A cross-sectional view of a resin molded product cut along line II.

[0029] Figure 3 This is a flowchart showing an outline of a method for producing a resin molded product according to an embodiment.

[0030] Figure 4 It is a cross-sectional view showing a state in the middle of mold clamping during production of the resin molded product according to the first embodiment.

[0031] Figure 5 yes Figure 4 A partially enlarged stereoscopic view of the periphery of the segmented piece shown.

[0032] Figure 6 It is a cross-sectional view showing a mold clamping state during production of the resin molded product according to the first embodiment.

[0033] Figure 7 It is a perspective view of the slide pin according to the first embodiment.

[0034] Figure 8 It is an exploded perspective view of the slide pin according to the first embodiment.

[0035] Fig. 9 It is an exploded cross-sectional view of the slide pin according to the first embodiment.

[0036] Fig.10 yes Figure 4 An enlarged cross-sectional view of the periphery of the segmented piece is shown.

[0037] Fig.11 This is a block diagram for explaining the controller according to the first embodiment.

[0038] Fig.12 It is a partially broken perspective view showing a state of taking out the resin molded product during manufacture according to the second embodiment.

[0039] Fig.13 It is a cross-sectional view showing a state in the middle of mold clamping during production of a resin molded product according to the second embodiment.

[0040] Fig.14 It is a cross-sectional view showing a mold clamping state during production of a resin molded product according to the second embodiment.

[0041] Fig.15 It is a cross-sectional view showing a state of removal during manufacture of a resin molded article according to the second embodiment.

[0042] Fig.16 It is a front view of a slide pin included in the connector according to the third embodiment.

[0043] Fig.17 yes Fig.16 A partial enlarged stereoscopic view of the connector and the sliding pin.

[0044] Fig.18 It is an exploded perspective view of a slide pin according to a third embodiment.

[0045] Fig.19 It is a perspective view of a connector according to a third embodiment.

[0046] Fig. 20 yes Fig.16 A partial enlarged cross-sectional view of the connector and the sliding pin.

[0047] Fig.21 It is a front view of a resin molded product and a slide pin according to a fourth embodiment.

[0048] Fig. 22It is an exploded cross-sectional view of a slide pin according to a fourth embodiment.

[0049] Fig.23 It is an enlarged cross-sectional view of a split piece according to a fourth embodiment.

[0050] Fig.24 yes Fig.21 A partial enlarged cross-sectional view of a resin molded product and a sliding pin.

[0051] Fig.25 It is a cross-sectional view showing a state in the middle of mold closing during production of a resin molded product according to a fifth embodiment.

[0052] Fig.26 yes Fig.25 A partially enlarged stereoscopic view of the periphery of the segmented piece shown.

[0053] Fig. 27 It is a perspective view of a slide pin according to a fifth embodiment.

[0054] Fig.28 It is a front view of a slide pin according to a fifth embodiment.

[0055] Fig.29 It is a plan view of a slide pin according to a fifth embodiment.

[0056] Fig.30 It is a partially enlarged cross-sectional view of a slide pin according to a fifth embodiment.

[0057] Fig.31 This is a partially enlarged cross-sectional view of the periphery of the split piece of the first or second embodiment.

[0058] Fig.32 This is a partially enlarged cross-sectional view of the periphery of the split piece of Modification C.

[0059] Fig.33 It is a front view of the slide pin of modification example D.

[0060] Fig.34 It is a perspective view of a slide pin according to modification D.

[0061] Fig.35 It is a perspective view of a connector according to Modification E.

[0062] Fig.36 It is a front view of the slide pin and the fitting member in a state where the split piece according to the sixth embodiment is opened.

[0063] Fig.37 It is omitted Fig.36 A three-dimensional view of the sliding pin and the embedded component in a state on one side of the split piece.

[0064] Fig.38 The figure shows that the slide pin is stored in the embedded component, and the Fig.37 A perspective view of the sliding pin and the embedded part of the partition plate from different sides.

[0065] Fig.39A It is a perspective view of a resin molded product according to a sixth embodiment.

[0066] Fig.39B It is a perspective view of a resin molded product according to a third embodiment.

[0067] Fig.40 It is a perspective view of the slide pin and the fitting component in a state where one of the split pieces is omitted according to Modification G.

[0068] Fig.41 It is a front view of the slide pin and the fitting member in a state where the split piece according to the seventh embodiment is opened.

[0069] Fig.42 It is omitted Fig.41 A three-dimensional view of the sliding pin and the embedded component in a state on one side of the split piece.

[0070] Fig.43 The figure shows that the slide pin has an embedded component stored therein, and the slide pin is not provided with the embedded component. Fig.42 A perspective view of the sliding pin and the embedded part of the partition plate from different sides.

[0071] Fig.44 It is a cross-sectional view of a resin molded product according to a seventh embodiment.

[0072] Fig.45 This is a three-dimensional view of the slide pin and the embedded component in a state where one of the split pieces is omitted according to Modification Example 1. DETAILED DESCRIPTION

[0073] <First embodiment>

[0074] (1) Structure of resin molded products

[0075] exist Figure 1 as well as Figure 2 , an example of a resin molded product 1 manufactured by the method for manufacturing a resin molded product according to the first embodiment of the present invention is shown. Figure 2 In the figure, it is shown that Figure 1 The resin molded product 1 includes a resin molded body 10 and an insert component 20. The resin molded product 1 is formed by integrating the resin molded body 10 and the insert component 20 by insert molding.

[0076] The embedding member 20 includes a main body portion 30 , an embedded portion 40 , and an exposed portion 50 . The main body portion 30 is embedded in the resin molded body 10 . Figure 1 as well as Figure 2 The main body 30 shown is a thin component that is rectangular in shape when viewed from above. The main body 30 is a part of the embedded component 20. For example, the main body 30 is a film substrate having a circuit (not shown). However, the main body 30 is not limited to a film substrate, but may be other components. In addition, the shape of the main body 30 is not limited to a film shape, and may be other shapes such as a cube or a sphere. In addition, in the main body 30, a part is buried in the resin molded body 10, and a part is exposed from the first main surface 11 of the resin molded body 10. However, the place where the main body 30 is arranged is not limited to the first main surface 11. The main body 30 can also be arranged to be buried in the resin molded body 10. The main body 30 can also be arranged so that a part is buried in the resin molded body 10, a part is exposed from the first main surface 11, and a part is exposed from the second main surface 12. The main body 30 can also be arranged so that a part is buried in the resin molded body 10, and a part is exposed from the side 13 of the resin molded body 10.

[0077] The embedded portion 40 is a portion protruding from the main body portion 30 and embedded in the resin molded body 10. The embedded portion 40 is a part of the insert component 20. The exposed portion 50 is a portion extending from the embedded portion 40 and exposed to the outside of the resin molded body 10.

[0078] The exposed portion 50 is also a part of the embedded component 20. The exposed portion 50 includes an outer peripheral surface 51 exposed from the resin molded body 10 and two convex portions 52 protruding from the outer peripheral surface 51. The outer peripheral surface 51 is the surface of the exposed portion 50 which is cylindrical and has an elliptical cross section. The two convex portions 52 are arranged at a position farther from the central axis than the distance from the central axis of the cylindrical exposed portion 50 to the outer peripheral surface 51. Therefore, even in the second mold 120 (refer to Figure 4 ) forms a hole having the same size as the outer peripheral surface 51 of the exposed portion 50, and the protrusion 52 will also be stuck and cannot be accommodated in the hole.

[0079] Here, the embedded portion 40 and the exposed portion 50 constitute one component. The component constituted by the embedded portion 40 and the exposed portion 50 is, for example, a connector. For example, the connector including the embedded portion 40 and the exposed portion 50 is electrically connected to the circuit of the main body portion 30 as the film substrate. However, the component including the embedded portion 40 and the exposed portion 50 is not limited to the connector, but may also be other components. Here, the component including the embedded portion 40 and the exposed portion 50 is cylindrical, but the shape of the component including the embedded portion 40 and the exposed portion 50 is not limited to the cylindrical shape. For example, the shape of the component including the embedded portion 40 and the exposed portion 50 may also be other shapes such as a columnar shape, a hammer shape, or a plate shape.

[0080] In addition, here, the case where the member including the main body 30, the embedded part 40, and the exposed part 50 is a separate component is described, but they can also be an integrated component. Here, the case where the main body 30, the embedded part 40, and the exposed part 50 are each one is described. However, the main body 30 can also be multiple. The embedded part 40 can also be multiple. The exposed part 50 can also be multiple.

[0081] (2) Overview of the method for manufacturing resin molded products

[0082] exist Figure 3 In FIG. 1 , a process of a method for manufacturing a resin molded article 1 is shown. Figures 4 to 7 , a mold 100 and an insert component 20 in the process of the method for manufacturing a resin molded product 1 are shown. The cross section of the resin molded product 1 including the insert component 20 and the resin molded body 10 is shown in the above-described Figure 2 The embedded component 20 has Figure 4 The main body 30 shown is placed on the first surface 118 of the first mold 110. On one main surface of the main body 30, for example, copper wiring (not shown) for forming a circuit and electrode terminals (not shown) electrically connected to the copper wiring are formed. The mold 100 includes a first mold 110 and a second mold 120. The first mold 110 has a first surface 118, and the second mold 120 has a second surface 128. The first mold 110 and the second mold 120 are used to form the wall surface of the molding space, and the molding space is used to mold the resin molded body 10. Figure 5 In addition, the mold 100 includes a slide pin 130 and an ejector pin 140 (see Figure 4 ). In addition, the mold 100 includes an ejector plate 150 and a cylinder 160 .

[0083] In the first step S1, the insert component 20 is placed between the first mold 110 and the second mold 120. The insert component 20 is placed so that one main surface of the main body 30 faces the molding space SP (see FIG. Figure 6 The embedded portion 40 and the exposed portion 50 (the cylindrical portion) of the embedded component 20 protrude from the main body portion 30 in the direction in which the slide pin 130 slides.

[0084] In the second step S2, the first mold 110 and the second mold 120 are molded together to form a molding space SP for accommodating the embedded component 20 (see Figure 6 ).exist Figure 4 as well as Figure 5 , the state in which the first mold 110 and the second mold 120 are in the middle of being molded is shown. Figure 6 , the state where the first mold 110 and the second mold 120 are completed is shown. Figure 4In FIG. 1 , although the cross-section of the first mold 110 and the second mold 120 is shown, the side surface of the slide pin 130 and the ejector pin 140 is shown. Figure 5 In the figure, the main body 30 is omitted for easy viewing of the embedded portion 40 and the exposed portion 50. For example, the embedded portion 40 is provided with an electrode terminal 41 for connection with the electrode terminal of the main body 30.

[0085] In the second step S2, the slide pin 130 is slid in synchronization with the clamping operation of the first mold 110 and the second mold 120. The mold 100 deforms the slide pin 130 so that the exposed portion 50 is enclosed by the slide pin 130 while the embedded portion 40 of the embedded component 20 is exposed in the molding space SP. Figure 6 ), at the boundary between the embedded portion 40 and the exposed portion 50, the third surface 138 as a part of the wall surface of the molding space SP is formed by the slide pin 130. Here, at the end of mold clamping, the upper surfaces of the split pieces 131 and 132 of the slide pin 130 become the same plane as the second surface 128 of the second mold 120, and become the third surface 138 of the molding space SP. Figure 6 The molding space SP shown is a closed space having the first surface 118 , the second surface 128 , and the third surface 138 as walls.

[0086] The receiving portion 133 of the slide pin 130 includes a plurality of divided pieces 131 and 132. Figure 4 as well as Figure 5 In the structure shown, the two split pieces 131 and 132 are the receiving portion 133. If we look at the above description of the receiving portion 133, in the second step S2, in synchronization with the mold clamping action, the exposed portion 50 is received inside the receiving portion 133 of the sliding pin 130 in the released state, so that the receiving portion 133 is deformed into a closed state. As a result, the receiving portion 133 encloses the exposed portion 50 and forms the third surface 138.

[0087] In the second step S2 , the two divided pieces 131 and 132 are moved and combined when the exposed portion 50 is accommodated in the accommodation portion 133 , thereby being deformed into a closed state.

[0088] In the third step S3, the molten resin is flowed into the molding space SP and solidified to thereby mold the resin molded body 10 (see Figure 1 ) is molded. In the third step S3, the molten resin is injected into the molding space SP, and the molten resin is cooled to solidify. In the third step S3, the molten resin is flowed in and solidified until the embedded portion 40 is located in the molten resin and the molten resin contacts the third surface 138.

[0089] In the fourth step S4, the first mold 110 and the second mold 120 are opened to take out the resin molded body 10 in which the embedded component 20 is embedded. For example, the resin molded body 10 taken out is as follows: Figure 1 The exposed portion 50 shown is a resin molded body exposed from the resin molded body 10 . On the other hand, the embedded portion 40 is embedded in the resin molded body 10 .

[0090] In the fourth step S4 , the two split pieces 131 and 132 are separated when the exposed portion 50 is taken out of the housing portion 133 , and are deformed into a released state.

[0091] In normal insert molding, a series of steps from the first step S1 to the fourth step S4 are repeated to manufacture a plurality of resin molded products 1 .

[0092] (3) Materials used in the manufacture of resin molded products

[0093] (3-1) Embedded components

[0094] As the embedded component 20, the main body 30 is, for example, a film-shaped or plate-shaped printed circuit board. For example, if the main body 30 is a film-shaped printed circuit board, the film substrate as the main material of the printed circuit board is insulating. Among the insulating film substrates, for example, resin films and elastomer films can be used. Among the materials of the resin film, for example, there are thermosetting resins and thermoplastic resins. Among the materials of the resin film, for example, there are polyimide, polyethylene terephthalate, polycarbonate, and cycloolefin.

[0095] In the base material used for the main body 30, in addition to the film base material, for example, a three-dimensional base material having a three-dimensional shape can be used. In the main body 30, for example, a MID (Molded Interconnect Device) can be used, or a device in which wiring is formed on the surface of a component having a three-dimensional shape by LDS (Laser Direct Structuring).

[0096] (3-2) Materials of resin molded body

[0097] Examples of thermoplastic resins that are materials for the molten resin include polyester resins, polyethylene terephthalate (PET) resins, acrylic resins, polycarbonate resins, polybutylene terephthalate (PBT) resins, cellulose triacetate resins, polyimide resins, polyethylene naphthalate (PEN) resins, liquid crystal polymers (LCP) resins, cycloolefin polymers (COP), styrene resins, and ABS resins.

[0098] (4) Description of the mold

[0099] (4-1) First and second models

[0100] In the first embodiment, the first mold 110 is a cavity and the second mold 120 is a core. The first mold 110 and the second mold 120 are made of metal, and the metal material is, for example, iron, steel or stainless steel. The first surface 118 of the first mold 110 and the second surface 128 of the second mold plus the third surface 138 of the slide pin 130 form a molding space SP for the molten resin to flow into.

[0101] (4-2) Sliding pin

[0102] The sliding pin 130 includes split pieces 131, 132 and a sliding portion 135. The sliding pin 130 is made of metal, for example, and the metal material includes iron, steel or stainless steel. Figure 7 , Figure 8 , Fig. 9 as well as Fig.10 The slide pin 130 is shown in FIG. The two split pieces 131 and 132 constitute a receiving portion 133. The slide portion 135 is fixed to the ejection plate 150. The slide portion 135 slides along with the movement of the ejection plate 150. Here, the slide portion 135 slides in the same direction as the movement direction of the first mold 110.

[0103] The sliding portion 135 has a T-slot 171 for supporting the split pieces 131 and 132 so as to be slidable. Each split piece 131 and 132 has a slider 172 with a T-shaped cross section embedded in the T-slot 171. As the slider 172 slides in the T-slot 171, the split pieces 131 and 132 move in a direction orthogonal to the sliding direction of the sliding portion 135. Each split piece 131 and 132 has a guide rib 173 extending in a direction inclined relative to the sliding direction of the sliding portion 135. In the second mold 120, a guide groove 174 (see FIG. 174 ) in which the guide rib 173 is embedded is formed. Figure 4 ). The guide groove 174 also extends in a direction inclined relative to the sliding direction of the sliding portion 135, similarly to the guide rib 173. Since the guide rib 173 slides in the guide groove 174, the receiving portion 133 is deformed by the sliding of the sliding portion 135. Specifically, if the sliding portion 135 slides in a manner close to the first mold 110, the split pieces 131 and 132 slide in a direction away from each other. On the contrary, if the sliding portion 135 slides in a manner away from the first mold 110, the split pieces 131 and 132 slide in a direction close to each other.

[0104] The combined split pieces 131 and 132 have an internal space IS (see FIG. 1 ) for housing the exposed portion 50 therein. Figure 7 ). Therefore, a recess 181 matching the outer peripheral surface 51 of the exposed portion 50 is formed on the partition sheet 131, and a recess 182 matching the outer shape of the exposed portion 50 is formed on the partition sheet 132. Fig.10 As shown, the recessed portions 181 and 182 are provided with grooves 184 for the convex portion 52 of the exposed portion 50 to enter. Fig.10 In Figure 5 The shape of the ellipse 185 of the combined split pieces 131 and 132 is consistent with the shape of the boundary between the embedded portion 40 and the exposed portion 50. Therefore, there is substantially no gap between the embedded portion 40 and the exposed portion 50 and the combined split pieces 131 and 132, so the molten resin does not intrude into the internal space IS of the combined split pieces 131 and 132.

[0105] (4-3) Cylinder

[0106] The cylinder 160 is an actuator for driving the ejector plate 150 to which the slide pin 130 and the ejector pin 140 are fixed. Fig.11 As shown, the controller C1 controls the driving device D1 and the cylinder 160 for driving the first mold 110 and the second mold 120. The ejector plate 150 is driven by the cylinder 160. Figure 6 The ejection stroke St shown changes. For example, the controller C1 can be composed of a computer (not shown). In the computer, for example, an MPU or a CPU and a memory can be used.

[0107] From the state where the first mold 110 and the second mold 120 are open, the mold closing action of the first mold 110 and the second mold 120 is started by an instruction from the controller C1 to the drive device D1. It should be noted that the second mold 120 does not move during the mold closing action. In the state where the first mold 110 and the second mold 120 are open, the split pieces 131 and 132 are also open. In the state where the split pieces 131 and 132 are open, the first mold 110 starts to move directly toward the second mold 120. At this time, the controller C1 controls the cylinder 160 in such a way that the ejector plate 150 does not start to move. Next, at the timing when the exposure portion 50 enters the receiving portion 133, the controller C1 controls the cylinder 160 in such a way that the movement of the ejector plate 150 starts, and controls the drive device D1 in such a way that the movement of the first mold 110 continues in this state. At the timing when the upper surface (third surface 138) of the split pieces 131 and 132 reaches the boundary between the embedded portion 40 and the exposed portion 50, the controller C1 controls the drive device D1 and the cylinder 160 in such a manner as to stop the movement of the first mold 110 and the ejector plate 150. As a result, the ejection stroke St between the second mold 120 and the ejector plate 150 becomes larger. If the ejection stroke St becomes larger, the guide rib 173 moves along the guide groove 174, thereby narrowing the interval between the split pieces 131 and 132. As a result, the split pieces 131 and 132 are combined to form a molding space SP surrounded by the first surface 118, the second surface 128, and the third surface 138, and the mold closing is completed. As described above, in the mold closing action, the cylinder 160 is synchronized with the action of the drive device D1 through the control of the controller C1.

[0108] After the molten resin is filled in the molding space SP and the molten resin is solidified, the mold opening begins. From the state where the first mold 110 and the second mold 120 are closed, the mold opening action of the first mold 110 and the second mold 120 begins by the instruction from the controller C1. When the first mold 110 and the second mold 120 are closed, the split pieces 131 and 132 are also closed. The cylinder 160 maintains the state when the mold closing action is completed until the first mold 110 and the second mold 120 are completely opened. If the first mold 110 and the second mold 120 are completely opened, the cylinder 160 reduces the ejection stroke St between the second mold 120 and the ejector plate 150. When the ejection stroke St becomes smaller, the guide rib 173 moves along the guide groove 174, so that the interval between the split pieces 131 and 132 becomes wider. As the ejection stroke St becomes smaller, the ejector pin 140 also causes the resin molded product 1 to protrude. The split pieces 131 and 132 are opened and the ejector pin 140 is protruded, thereby completing the mold opening of the first mold 110 and the second mold 120 .

[0109] <Second embodiment>

[0110] (5) Overall structure

[0111] In the first embodiment described above, the slide pin 130 is fixed to the ejector plate 150 . However, the dedicated plate 155 for sliding the slide pin 130 may be provided outside the ejector plate 150 .

[0112] In the second embodiment, the main structure except for the dedicated plate 155, the ejector plate driving part 164, the ejector return spring 165, and the dedicated plate return spring 166 is the same as the first embodiment, so the description of the structure of the first mold 110, the second mold 120 and the sliding pin 130 is omitted.

[0113] In the second embodiment, the air cylinder 160 is a dedicated plate 155 (see Fig.12 ) to drive the actuator. Fig.12 , the first mold 110 and the second mold 120 are partially broken and viewed from an oblique upper side. The ejector plate 150 is driven by an ejector plate driving unit 164. In the second embodiment, the controller C1 controls the driving device D1, the ejector plate driving unit 164, and the cylinder 160 for driving the first mold 110 and the second mold 120. The ejector plate 150 is driven by the ejector plate driving unit 164 and the ejector return spring 165. Fig.14 The ejection stroke St shown in the figure changes. The special plate 155 is made to return to the special plate by the cylinder 16 and the special plate return spring 166. Fig.13 The sliding stroke Di changes as shown. Figures 12 to 15 , although the cross-sections of the first mold 110 and the second mold 120 are shown, the side surfaces of the slide pin 130 and the ejector pin 140 are shown.

[0114] From the state where the first mold 110 and the second mold 120 are opened, the mold closing action of the first mold 110 and the second mold 120 is started by an instruction from the controller C1 to the driving device D1. It should be noted that the second mold 120 does not move during the mold closing action. When the first mold 110 and the second mold 120 are opened, the split pieces 131 and 132 are also opened. First, the first mold 110 starts to move toward the second mold 120. At this time, the controller C1 controls the cylinder 160 in such a way that the ejector plate 150 does not start to move. When the split pieces 131 and 132 are opened, the first mold 110 moves directly toward the second mold 120. At this time, the ejector plate 150 moves in a direction away from the second mold 120 by the ejection return spring 165. However, the dedicated plate 155 is supported by the cylinder 160 and does not move, and is stationary relative to the second mold 120. That is, the controller C1 controls the driving device D1 and the cylinder 160 to move the first mold 110 and the ejector plate 150 and keep the dedicated plate 155 stationary.

[0115] Next, at the timing when the exposed portion 50 enters the receiving portion 133, the controller C1 controls the cylinder 160 so as to start the movement of the dedicated plate 155, and controls the drive device D1 so as to continue the movement of the first mold 110 in this state. At the timing when the upper surface (third surface 138) of the split pieces 131 and 132 reaches the boundary between the embedded portion 40 and the exposed portion 50, the controller C1 controls the drive device D1 and the cylinder 160 so as to stop the movement of the first mold 110 and the dedicated plate 155. As a result, the sliding stroke Di between the second mold 120 and the dedicated plate 155 becomes smaller. At this time, the dedicated plate return spring 166 is stretched. When the sliding stroke Di becomes smaller, the guide rib 173 moves along the guide groove 174, so that the interval between the split pieces 131 and 132 becomes narrower. The split pieces 131 and 132 are combined to form a molding space SP surrounded by the first surface 118, the second surface 128, and the third surface 138, and the mold clamping is completed. As described above, during the mold clamping operation, the cylinder 160 and the driving device D1 operate in synchronization with each other under the control of the controller C1.

[0116] After the molten resin is filled in the molding space SP and the molten resin is solidified, the mold opening starts. From the state where the first mold 110 and the second mold 120 are closed, the mold opening action of the first mold 110 and the second mold 120 starts by the instruction from the controller C1. When the first mold 110 and the second mold 120 are closed, the split pieces 131 and 132 are also closed. If the mold opening action starts, the ejector plate 150 moves while the first mold 110 is opened by the drive device D1 controlled by the controller C1. As the ejector plate 150 moves, the ejector return spring 165 is compressed. Pressed by the ejector plate 150, the ejector pin 140 protrudes, and the dedicated plate 155 moves toward the second mold 120. As the ejector plate 150 approaches the second mold 120, the ejection stroke St becomes smaller. And, when the first mold 110 and the second mold 120 finish opening, the ejection stroke St becomes zero.

[0117] When the ejection stroke St becomes smaller, the guide rib 173 moves along the guide groove 174, so that the interval between the split pieces 131 and 132 becomes wider. Fig.15 As shown, the ejector pin 140 also protrudes the resin molded product 1. As the split pieces 131 and 132 are opened and the ejector pin 140 is protruded, the mold opening of the first mold 110 and the second mold 120 is completed.

[0118] <Third embodiment>

[0119] (6) Overall structure

[0120] In the first embodiment, the case where the intrusion of molten resin is prevented by substantially eliminating the gap between the third surface 138 formed by the slide pin 130, the embedded portion 40, and the boundary of the exposed portion 50 is described. As described in the third embodiment, the intrusion of molten resin may be prevented by a portion closer to the internal space IS of the housing portion 133 than the third surface 138.

[0121] In the third embodiment, the main structure except the slide pin 130 and the insert member 20 can be configured similarly to the first embodiment, so the description of the structure of the first mold 110, the second mold 120, the ejector plate 150, and the cylinder 160 is omitted.

[0122] exist Fig.16 , Fig.17 , Fig.18 , Fig.19 as well as Fig. 20 , a connector 200 including a buried portion 40 and an exposed portion 50 of a sliding pin 130 and an embedded component 20 is shown. The sliding pin 130 of the third embodiment includes four divided pieces 231, 232, 233, 234 and a sliding portion 235. The four divided pieces 231, 232, 233, 234 constitute the receiving portion 133. The sliding portion 235 of the third embodiment is fixed to the ejection plate 150 as in the first embodiment, or is fixed to the dedicated plate 155 as in the second embodiment. The sliding portion 235 slides along with the movement of the ejection plate 150 or the dedicated plate 155.

[0123] The sliding part 235 has a T-slot 171 extending in a cross shape when viewed from above, and the T-slot 171 is used to support the four split pieces 231 to 234 so that they can slide. Each split piece 231 to 234 has a slider 172 with a T-shaped cross section embedded in the T-slot 171. Each split piece 231 to 234 slides in the T-slot 171, which is a cross shape when viewed from above, through the slider 172, so that it moves and combines from all four directions in a direction orthogonal to the sliding direction of the sliding part 235. Each split piece 231 to 234 has a guide rib 173 extending in a direction inclined relative to the sliding direction of the sliding part 235.

[0124] The combined divided pieces 231 to 234 have an internal space IS (see Fig. 20 ). Therefore, if Fig.18 As shown, in the split pieces 231 to 234, recesses 281 to 284 are formed to match the outer peripheral surface 210 of the exposed portion 50. In the recesses 281 to 284, grooves 285 are provided for the convex portion 52 of the exposed portion 50 to enter.

[0125] The connector 200 of the embedded component 20 has a bank 220 on the outer peripheral surface 210 of the exposed portion 50. The bank 220 protrudes in an annular shape to block the molten resin. The split pieces 231 to 234 (accommodating portion 133) have an annular groove 250 that allows the exposed portion 50 to move in a direction intersecting the sliding direction, and the groove 250 can abut against the bank 220 in an annular shape. Fig. 20 As shown, the upper wall 251 of the groove portion 250 abuts against the upper surface 221 of the bank portion 220. Therefore, there is substantially no gap between the exposed portion 50 and the combined split pieces 231 to 234, so the molten resin does not intrude into the internal space IS of the combined split pieces 231 to 234 (the housing portion 133). The width L1 of the annular bank portion 220 becomes smaller than the width L2 of the annular groove portion 250, so it becomes easier to allow for manufacturing errors of the connector 200. In such a manufacturing method, the area from the upper surface 221 of the bank portion 220 to the third surface 138 becomes the boundary between the exposed portion 50 and the embedded portion 40. The electrode terminal 222 is arranged in the embedded portion 40.

[0126] <Fourth embodiment>

[0127] (7) Overall structure

[0128] In the first embodiment, the T-slot 171 of the slide pin 130 is formed to extend in a direction perpendicular to the sliding direction. However, the T-slot 171 of the slide pin 130 may be formed to extend in a direction inclined with respect to the sliding direction.

[0129] In the fourth embodiment, the main structure other than the slide pin 130 is the same as that of the first embodiment, and therefore the description of the structure of the first die 110 and the second die 120 will be omitted.

[0130] exist Fig.21 , Fig. 22 , Fig.23 as well as Fig.24 , a slide pin 130 and a resin molded body 10 are shown. The slide pin 130 of the fourth embodiment includes two split pieces 131, 132 and a slide portion 135. The two split pieces 131, 132 constitute a receiving portion 133. The slide portion 135 of the fourth embodiment is fixed to the ejection plate 150 as in the first embodiment, or is fixed to the dedicated plate 155 as in the second embodiment. The slide portion 135 slides as the ejection plate 150 or the dedicated plate 155 moves. Fig.21The arrow AR1 is the direction of the mold opening in the sliding direction, and the arrow AR2 is the direction of the mold opening in the moving direction of the split pieces 131 and 132. When the mold is opened, the split pieces 131 and 132 move away from the resin molded body 10. In other words, the split pieces 131 and 132 move in a direction inclined relative to the direction orthogonal to the sliding direction.

[0131] Therefore, the sliding portion 135 has a T-slot 171 that supports the split pieces 131 and 132 so that they can slide, and the T-slot 171 extends in a direction that is inclined relative to a direction orthogonal to the sliding direction in a side view. Fig. 22 As shown in FIG. 1 , the extension direction of the T-slot 171 is only inclined at an angle An1 relative to the direction orthogonal to the sliding direction. Fig.23 As shown, the extending direction of the slider 172 is inclined by only an angle An1 relative to the direction orthogonal to the sliding direction.

[0132] By moving the split pieces 131 and 132 in an inclined direction (the direction of the arrow AR2), Fig.21 As shown, even in the case where the resin molded body 10 is bent, the resin molded body 10 can move without colliding with the split pieces 131 and 132. In addition to such a case, for example, it can also be applied to the case where the resin molded body 10 has a convex portion protruding further than the third surface 138, or the case where a protrusion other than the exposed portion 50 protrudes from the resin molded body 10.

[0133] <Fifth embodiment>

[0134] (8) Overall structure

[0135] In the first to fourth embodiments, the split pieces 131, 132 or the split pieces 231 to 234 are described as being composed of a member that can be separated from the sliding parts 135, 235. In the first to fourth embodiments, the sliding pin 130 is formed so that the receiving part 133 is deformed by the slider 172 of the split pieces 131, 132 or the split pieces 231 to 234 sliding in the T-slot 171. However, the split piece may not be separated from the sliding part, and the split piece may be connected to the sliding part.

[0136] exist Fig.25 , Fig.26 , Fig. 27 , Fig.28 , Fig.29 as well as Fig.30, the first mold 110 and the second mold 120 involved in the fifth embodiment are shown, as well as a sliding pin 330 connected to two split pieces 331, 332 and a sliding portion 335. In other words, the sliding pin 330 of the fifth embodiment is divided into two parts at its end, and has split pieces 331, 332 at the end (see Fig. 27 as well as Fig.28 ). If no force is applied to the split pieces 331 and 332, the split pieces 331 and 332 are separated from each other. The slide pin 330 is made of metal. If a force is applied in a direction to bring the split pieces 331 and 332 closer together, the split pieces 331 and 332 are combined to form an internal space IS (see Fig.30 ).

[0137] From the state of mold opening to the middle of mold closing, such as Fig.25 as well as Fig.26 As shown in FIG. 1 , the split pieces 331 and 332 are opened. Therefore, the exposed portion 50 having the convex portion 52 can be inserted between the split pieces 331 and 332. If the mold is further closed, the inclined back surfaces 341 and 342 (see FIG. 1 ) of the split pieces 331 and 332 are Fig.28 ) hits the opening edge 125 of the second mold 120. The size of the opening edge 125 is substantially equal to the size of the split pieces 331 and 332 after the mold is closed, so as the mold is closed and the slide pin 330 is introduced into the second mold 120, the split pieces 331 and 332 pressed by the opening edge 125 approach each other. And when the mold is closed, the split pieces 331 and 332 are closed, and the upper surface of the slide pin 330 becomes the third surface 138 (refer to Fig.29 ).

[0138] When the first mold 110 and the second mold 120 are completely opened, the ejector plate 150 is moved closer to the second mold 120, so that the ejector pin 140 and the slide pin 330 protrude from the second mold 120. At this time, the distal end of the slide portion 335 is deformed so that the elastic deformation of the slide portion 335 of the slide pin 330 is released, and the split pieces 331 and 332 are opened.

[0139] The recessed parts 381, 382 and the groove 384 of the slide pin 330 are the same as the recessed parts 181, 182 and the groove 184 of the slide pin 130 of the first embodiment. It should be noted that in the fifth embodiment, the same reference numerals are given to the same components as those of the first embodiment, and the description of the components is omitted. Fig.25 , although the cross-sections of the first mold 110 and the second mold 120 are shown, the side surfaces of the slide pin 330 and the ejector pin 140 are shown.

[0140] (9) Modification

[0141] (9-1) Modification A

[0142] In the first to fifth embodiments described above, an example in which one slide pin 130, 330 is provided in the second mold 120 is described. However, a plurality of exposed portions 50 may be provided in one resin molded product 1. Therefore, a plurality of slide pins 130, 330 may be provided in the second mold 120. In addition, the slide pins 130, 330 may also be provided in the first mold 110. For example, the dedicated plate 155 and the cylinder 160 may also be provided in the first mold 110.

[0143] (9-2) Modification B

[0144] In the first to fifth embodiments described above, the slide pins 130 and 330 are described as sliding in the same direction as the relative movement direction of the first mold 110 and the second mold 120. However, the slide pins 130 and 330 may also slide in a direction inclined with respect to the relative movement direction of the first mold 110 and the second mold 120.

[0145] (9-3) Modification C

[0146] In the above-mentioned first to fifth embodiments, for example, Fig.31 As shown in the figure, the case where a portion 51a of the outer peripheral surface 51 of the exposed portion 50 contacts the contact surfaces 181a and 182a of the recessed portions 181 and 182 is described. In this case, the exposed portion 50 can be exposed from the resin molded body 10 by closing the arcuate contact surface 181a and the arcuate contact surface 182a and contacting the entire portion 51a of the annular outer peripheral surface 51.

[0147] However, if Fig.32 As shown, a sealing member 400 may be sandwiched between a portion 51a of the outer peripheral surface 51 of the exposed portion 50 and the contact surfaces 181a, 182a of the recessed portions 181, 182. As the sealing member 400, for example, heat-resistant rubber, heat-resistant resin film, or metal film may be wound around the exposed portion 50. The sealing member 400 is configured to be detached after molding. In this case, the position of the sliding pin 130 to form the third surface 138 is changed, and the exposed portion 50 is wrapped by the sliding pin 130 in a state where the embedded portion 40 of the embedded component 20 is exposed in the molding space SP. However, in this case, the receiving portion 133 cannot be set to a closed state and blocked in a manner that prevents the molten resin from flowing into the internal space of the receiving portion 133 by only the sliding pin 130, and the internal space of the receiving portion 133 is blocked by the cooperation of the receiving portion 133 and the sealing member 400.

[0148] (9-4) Modification D

[0149] In the first to fifth embodiments, a part of the slide pin 130, 330 is described as the split piece 131, 132, the split piece 231, 232, 233, 234, or the split piece 331, 332. In these slide pins 130, 330, the split pieces 131, 132, 231 to 234, 331, 332 are deformed by sliding one sliding portion 135, 335.

[0150] However, if Fig.33 as well as Fig.34 As shown in the figure, the sliding pin 530 may be configured to have two sliding parts 535a and 535b. In the sliding pin 530, the segment 531 and the sliding part 535a are integrally formed, and the segment 532 and the sliding part 535b are integrally formed. The accommodating part 533 is composed of the two segment parts 531 and 532. The sliding parts 535a and 535b of the sliding pin 530 slide in mutually different directions. When the sliding part 535a slides in the direction of the arrow AR3, the segment 531 moves in the direction of the arrow AR5. When the sliding part 535b slides in the direction of the arrow AR4, the segment 532 moves in the direction of the arrow AR6. In other words, when the sliding parts 535a and 535b slide toward the segment parts 531 and 532, respectively, the two segment parts 531 and 532 change in the direction of separation from each other.

[0151] Fig.33 as well as Fig.34 The state shown is a state where the two dividing parts 531 and 532 are combined, and the upper surfaces of the dividing parts 531 and 532 form the third surface 138. By combining the dividing parts 531 and 532, the recesses 181 and 182 are closed, and the receiving exposed part 50 can be formed (see Fig.31 ) space.

[0152] (9-5) Modification E

[0153] exist Fig.35 , a connector 200 according to a modification example E is shown. The connector according to the modification example E is different from the connector 200 according to the third embodiment (see Fig.19 ) is different in that a portion of the embedded portion 40, which is the close contact surface with the resin molded body, has a concave-convex shape 223, thereby adding a bayonet. Fig.35 In the connector 200 shown, the concavo-convex shape 223 is formed on the flat portion 224 where the electrode terminal 222 is formed. However, the location where the concavo-convex shape 223 is formed is not limited to the flat portion 224, and may be anywhere in the embedded portion 40. By having the concavo-convex shape 223 in the embedded portion 40, the engagement of the embedded portion 40 with the resin molded body 10 is increased, and the fixing strength of the connector 200 to the resin molded body 10 can be improved.

[0154] (10) Features

[0155] (10-1)

[0156] In the manufacturing method of the resin molded article 1 described in the first embodiment and the fifth embodiment, the slide pins 130 and 330 are deformed so as to wrap the exposed portion 50. Therefore, even if the shape of the exposed portion 50 is complicated, such as having the convex portion 52, for example, the exposed portion 50 can be exposed to the outside of the resin molded body 10, and the embedded portion 40 can be embedded in the inside of the resin molded body 10. The resin molded article 1 having the embedded component 20 including such an exposed portion 50 and the embedded portion 40 can be easily manufactured. In the resin molded article 1 manufactured in this way, the embedded portion 40 and the exposed portion 50 are reliably supported by the resin molded body 10, and the boundary periphery between the embedded portion 40 and the main body 30 is sealed by the resin molded body 10.

[0157] (10-2)

[0158] In the manufacturing method of the resin molded product 1 described above, in the second step S2, in synchronization with the mold clamping operation, the exposed portion 50 is received in the receiving portion 133, 333 of the slide pin 130, 330 in the released state, and the receiving portion 133, 333 is deformed into a closed state, so that the exposed portion 50 is enclosed. Furthermore, by deforming the receiving portion 133, 333 into the closed state, the third surface 138 is formed, and in the third step S3, the molten resin is not allowed to flow into the inside of the receiving portion 133, 333, and a part of the outer surface of the resin molded product 10 is formed by the third surface 138. Furthermore, in the fourth step S4, the receiving portion 133, 333 in the closed state is deformed into the released state, and the exposed portion 50 is taken out of the receiving portion 133, 333. If the manufacturing method of the resin molded product 1 is constructed in this way, the receiving portion is deformed from the released state to the closed state in synchronization with the mold clamping action, so that the mold clamping action of the first mold 110 and the second mold 120 can be utilized to change the slide pins 130 and 330, and the manufacturing process and manufacturing equipment can be simplified.

[0159] (10-3)

[0160] In the manufacturing method of the resin molded product 1 described above, the housing portion 133 of the slide pin 130 includes a plurality of divided pieces 131, 132 or divided pieces 231 to 234. In the second step S2, the plurality of divided pieces 131, 132 or divided pieces 231 to 234 are slid and combined when the exposed portion 50 is housed inside the housing portion 133, thereby deforming into a closed state. In the fourth step S4, the plurality of divided pieces 131, 132 or divided pieces 231 to 234 are separated when the exposed portion 50 is taken out of the housing portion 133, thereby deforming into a released state. In such a manufacturing method of the resin molded product 1, the housing portion 133 is composed of a plurality of divided pieces 131, 132 or divided pieces 231 to 234, so that it becomes easy to form the housing portion 133 in accordance with the shape of the exposed portion 50.

[0161] (10-4)

[0162] In use Figure 21 to Figure 24 In the manufacturing method of the resin molded product 1 described above, the plurality of split pieces 131, 132 or the split pieces 231 to 234 can be configured to slide in a direction away from the resin molded body 10 when separated. In the manufacturing method of the resin molded product 1 configured in this way, the influence on the resin molded product 1 when the slide pin 130 slides can be reduced. For example, it becomes difficult for the slide pin 130 to rub against the resin molded body 10 when sliding, or it becomes easy to form a portion protruding to the side of the sliding portion 135 more than the third surface 138 of the resin molded body 10.

[0163] (10-5)

[0164] In use Figures 16 to 20 In the manufacturing method of the resin molded article 1 described above, the exposed portion 50 has a bank 220 on the outer peripheral surface 210, and the bank 220 protrudes in an annular shape to block the molten resin. In addition, the receiving portion 133 has an annular groove 250, and the groove 250 allows the exposed portion 50 to move in a direction intersecting the sliding direction, and the groove 250 can abut against the bank 220 in an annular shape. In the manufacturing method of the resin molded article 1 having such a structure, for example, even if the difference between the width L1 of the bank 220 and the width L2 of the annular groove 250 is moved, the intrusion of the resin can be prevented, and for example, the tolerance of the dimensional error of the embedded component 20 can be increased.

[0165] In the resin molded product 1 having the bank portion 220 , the resin molded body 10 is in contact with the bank portion 220 .

[0166] <Sixth embodiment>

[0167] (11) Overall structure

[0168] In the third embodiment, the embedded component 20 is composed of the main body 30 and the connector 200, and the embedded portion 40 and the exposed portion 50 are included in the connector 200. However, the embedded portion 40 and the exposed portion 50 may also be Fig.36 , Fig.37 , Fig.38 ,as well as Fig.39A The plate-shaped connecting terminal 600 (sixth embodiment) is shown. For example, Figures 36 to 39A The connecting terminal 600 shown is a terminal formed by bending a metal plate. The metal used as the material of the plate includes, for example, copper, brass, phosphor bronze, iron, and stainless steel. The connecting terminal 600 includes a connecting portion 601 and a rising portion 602 that intersect each other with a bent portion 603 interposed therebetween. Fig.36 In FIG. 6 , the connection terminal 600 is shown to be bent at a right angle, but the bending angle may be an obtuse angle or an acute angle.

[0169] In the case where the main body 30 is a film substrate having a circuit, the connection portion 601 of the connection terminal 600 is a portion connected to the circuit. The connection portion 601 is fixed to the main body 30. For example, the connection portion 601 is fixed to the main body 30 by solder and is electrically connected. The rising portion 602 of the connection terminal 600 is a portion for connecting to, for example, an electrical device outside the film substrate. The rising portion 602 rises in a direction intersecting with the surface of the main body 30 to which the connection portion 601 is fixed. Fig.36 In the illustrated connection terminal 600 , the connection portion 601 is orthogonal to the rising portion 602 . For example, the direction in which the rising portion 602 extends coincides with the direction in which the slide pin 130 slides.

[0170] In the connection terminal 600 of the sixth embodiment, the connection portion 601 and a part of the rising portion 602 form the embedded portion 40, and the other part of the rising portion 602 forms the exposed portion 50. In the sixth embodiment, the exposed portion 50 is included in the connection terminal 600.

[0171] The protrusion 52 is provided at the terminal end 604 of the rising portion 602 (see Fig.37 ). The convex portion 52 is a portion that protrudes further in the width direction (direction DR3) than the main portion 605 of the rising portion 602. The main portion 605 is a portion of the rising portion 602 other than the portion provided with the convex portion 52, a portion of the main portion 605 is included in the embedded portion 40, and the other portion of the main portion 605 is included in the exposed portion 50. Here, the width direction (direction DR3) is a direction orthogonal to the thickness direction (direction DR2) of the rising portion 602, and is a direction orthogonal to the rising direction (direction DR1) from the bent portion 603 toward the terminal portion 604.

[0172] In the sixth embodiment, the mold 100 of the first embodiment including the slide pin 130 can be used to manufacture the Fig.39A The resin molded product 1 having the connection terminal 600 shown in FIG. Fig.39B In the figure, for comparison, a resin molded product 1 having a connector 200 according to the third embodiment is shown. Figure 1 , Fig.39A as well as Fig.39B As shown in the figure, the resin molded product 1 of the sixth embodiment includes a resin molded body 10 and an insert component 20, similarly to the resin molded products 1 of the first and third embodiments. In the sixth embodiment, in order to simplify the description, the structure of the insert component 20 having a different shape from the resin molded products 1 of the first and third embodiments is mainly described. Regarding the resin molded product 1, in the first and third embodiments and the sixth embodiment, for the same components marked with the same reference numerals, some descriptions are omitted in order to avoid duplication of the same descriptions.

[0173] In addition, the mold of the sixth embodiment can be configured to include a first mold 110, a second mold 120, a slide pin 130, and an ejector pin 140 (see Figure 4 ). Furthermore, the mold of the sixth embodiment can be configured to include an ejector plate 150 and a cylinder 160. In the sixth embodiment, in order to simplify the description, the structure of the sliding pin 130 having a different shape from the sliding pin 130 of the mold 100 of the first embodiment is mainly described. Regarding the sliding pin 130, in the first embodiment and the sixth embodiment, for the same components marked with the same reference numerals, there are parts where the description is omitted in order to avoid duplication of the same description.

[0174] In the sixth embodiment, the housing portion 133 for housing the exposed portion 50 includes the split pieces 131 and 132 as in the first embodiment. Concave portions 181 and 182 are formed in each of the split pieces 131 and 132. The shape of the exposed portion 50 of the first embodiment is different from that of the exposed portion 50 of the sixth embodiment, so the shape of the concave portions 181 and 182 of the first embodiment is different from that of the concave portions 181 and 182 of the sixth embodiment. The shape of the concave portions 181 and 182 of the sixth embodiment is a shape composed of normal width portions 181m and 182m corresponding to the main portion 605 and wide width portions 181n and 182n having a larger width than the normal width portions 181m and 182m (see Fig.37 as well as Fig.38). The width of the wide portions 181n and 182n is greater than the width of the portion where the convex portion 52 is formed. The wide portions 181n and 182n are portions corresponding to the concave groove 184 of the first embodiment.

[0175] The resin molded product 1 of the sixth embodiment can be manufactured by the same manufacturing method as the manufacturing method of the resin molded product 1 of the first embodiment. Due to the presence of the convex portion 52, the connection terminal 600 cannot be pulled out from the hole formed by closing the normal width portions 181m and 182m when the split pieces 131 and 132 are closed. However, as described in the first embodiment, the slider 172 of the split pieces 131 and 132 slides in the T-slot 171 of the slide portion 135 and separates, so that the connection terminal 600 can be taken out from the recessed portions 181 and 182.

[0176] It should be noted that, in the split pieces 131 and 132 of the sixth embodiment, in order to suppress the relative positional deviation when the split pieces 131 and 132 are closed, the split piece 131 is provided with a fitting groove 186, and the split piece 132 is provided with a fitting protrusion 187. The fitting protrusion 187 is fitted into the fitting groove 186 and abuts against it, so that the relative positional deviation can be suppressed when the split pieces 131 and 132 are closed.

[0177] (12) Modification F

[0178] In the sixth embodiment, the case where the protrusion 52 is arranged at the terminal portion 604 of the connection terminal 600 is described. However, the position where the protrusion 52 is arranged may be a position other than the terminal portion 604 of the exposed portion 50. For example, the protrusion 52 may be arranged in the middle of the exposed portion 50 in the rising portion 602. In addition, the case where one protrusion 52 is provided on one side of one rising portion 602 is described, but the protrusion 52 may also be provided on both sides of one rising portion 602. In addition, in the sixth embodiment, the case where the width of the protrusion 52 protruding from the main portion 605 is constant everywhere is described. However, the shape of the protrusion 52 may also be a shape such as a sine curve in which the protrusion width varies depending on the location of the protrusion 52.

[0179] In addition, in the sixth embodiment, the case where the convex portion 52 protrudes in the width direction of the plate-shaped connecting terminal 600 is described. However, although the convex portion is omitted from the figure, it may also be a convex portion that protrudes in the thickness direction of the plate-shaped connecting terminal 600. For example, the convex portion can be formed by bending the terminal end 604 of the plate-shaped connecting terminal 600.

[0180] (13) Modification G

[0181] In the sixth embodiment, the case where the resin molded product 1 is formed using the connection terminal 600 having the convex portion 52 has been described. Fig.40 In the resin molded product using the connection terminal 690 without the protrusion 52 and its production, a mold having the same technical features and a production method having the same technical features can also be applied. Fig.40 The connection terminal 690 shown in the figure has a connection portion 601 and a rising portion 602. Fig.37 The connection terminals 600 shown are identical. However, Fig.40 The width of the rising portion 602 is constant and does not have the convex portion 52 .

[0182] thereby, Fig.40 The split pieces 131 and 132 of the slide pin 130 accommodate the exposed portion 50 of the connection terminal 690 which does not have the protrusion 52, so there is no Fig.37 as well as Fig.38 The large width portions 181n, 182n are shown.

[0183] <Seventh embodiment>

[0184] (14) Overall structure

[0185] In the sixth embodiment, for example, a case where the connection terminal 600 is formed by bending a metal plate is described. Figure 41 to Figure 44 As shown, for example, the shape of the connection terminal 700 may be a pin shape having a protrusion 52. For example, the connection terminal 700 is made of metal. Examples of the material of the metal connection terminal 700 include copper, brass, phosphor bronze, iron, and stainless steel. Figure 41 to Figure 44 The connection terminal 700 of the seventh embodiment shown has a disc-shaped connection portion 701 and a rising portion 702. The terminal portion 704 of the rising portion 702 is processed into a disc shape and has a convex portion 52. The portion of the rising portion 702 other than the disc-shaped terminal portion 704 is a cylindrical main portion 705. The embedded portion 40 includes the disc-shaped connection portion 701 and a portion of the cylindrical main portion 705, and the exposed portion 50 includes the other portion of the cylindrical main portion 705. The convex portion 52 is included in the exposed portion 50.

[0186] In the case where the main body 30 is a film substrate having a circuit, the connection portion 701 of the connection terminal 700 is a portion connected to the circuit. The connection portion 701 is fixed to the main body 30. For example, the connection portion 701 is fixed to the main body 30 by solder and is electrically connected. The rising portion 702 of the connection terminal 700 is a portion for connecting to, for example, an electrical device outside the film substrate. The rising portion 702 rises in a direction intersecting with the surface of the main body 30 to which the connection portion 701 is fixed. Fig.41The connection terminal 700 shown is configured such that the central axes of the disk-shaped connection portion 701 and the cylindrical main portion 705 coincide with each other. For example, the direction in which the rising portion 702 extends coincides with the direction in which the slide pin 130 slides.

[0187] In the seventh embodiment, the mold 100 of the first embodiment including the slide pin 130 can be used to manufacture the Fig.44 The resin molded product 1 having the connection terminal 700 is shown. Figure 1 as well as Fig.44 As shown in FIG. 1 , the resin molded product 1 of the seventh embodiment includes a resin molded body 10 and an insert component 20, similarly to the resin molded product 1 of the first embodiment. In the seventh embodiment, in order to simplify the description, the structure of the insert component 20 having a different shape from the resin molded product 1 of the first embodiment is mainly described. Regarding the resin molded product 1, in the first embodiment and the seventh embodiment, for the same components marked with the same reference numerals, some descriptions are omitted in order to avoid duplication of the same descriptions.

[0188] in addition, Fig.42 The direction DR1 shown is the rising direction of the rising portion 702, and is the direction in which the central axis of the rising portion 702 extends. The directions DR2 and DR3 are radial directions of the rising portion 702. The direction DR2 is the moving direction of the split pieces 131 and 132, and the direction DR3 is a direction orthogonal to the direction DR2.

[0189] The mold of the seventh embodiment can be configured to include a first mold 110, a second mold 120, a slide pin 130, and an ejector pin 140 (see Figure 4 ). Furthermore, the mold of the seventh embodiment can be configured to include an ejector plate 150 and a cylinder 160. In the seventh embodiment, in order to simplify the description, the structure of the sliding pin 130 having a different shape from the sliding pin 130 of the mold 100 of the first embodiment is mainly described. With respect to the sliding pin 130, in the first embodiment and the seventh embodiment, for the same components marked with the same reference numerals, there are portions where the description is omitted in order to avoid duplication of the same description.

[0190] In the seventh embodiment, the housing portion 133 for housing the exposed portion 50 includes the split pieces 131 and 132 as in the first embodiment. Concave portions 181 and 182 are formed in each of the split pieces 131 and 132. Since the shape of the exposed portion 50 of the first embodiment is different from that of the exposed portion 50 of the seventh embodiment, the shapes of the recesses 181 and 182 of the first embodiment are different from those of the recesses 181 and 182 of the seventh embodiment. The shapes of the recesses 181 and 182 of the seventh embodiment include a semi-cylindrical first portion 181p and 182p corresponding to the main portion 705, and a second portion 181q and 182q in a shape obtained by cutting a disk having a larger radius than the semi-cylindrical first portion 181p and 182p in half by a plane passing through the central axis. The radius of the second portion 181q and 182q is a radius greater than the radius of the disk-shaped terminal portion 704. The second portion 181q and 182q is a portion corresponding to the concave groove 184 of the first embodiment. It should be noted that, in the seventh embodiment, the third portions 181 r and 182 r into which the connection terminals 700 cannot enter are provided in the recesses 181 and 182 , but a configuration may be adopted in which the third portions 181 r and 182 r are not provided.

[0191] The resin molded product 1 of the seventh embodiment can be manufactured by the same manufacturing method as the manufacturing method of the resin molded product 1 of the first embodiment. Due to the presence of the convex portion 52, the connection terminal 700 cannot be pulled out from the hole formed by closing the first parts 181p and 182p when the split pieces 131 and 132 are closed. However, as described in the first embodiment, the sliders 172 of the split pieces 131 and 132 slide and separate in the T-slots 171 of the slide portion 135, so that the connection terminal 700 can be taken out from the recesses 181 and 182.

[0192] It should be noted that the split pieces 131 and 132 of the seventh embodiment are also provided with the fitting grooves 186 and the fitting protrusions 187 similar to those of the sixth embodiment.

[0193] (15) Modification H

[0194] In the seventh embodiment, the case where the convex portion 52 is arranged at the terminal portion 704 of the connection terminal 700 is described. However, the position where the convex portion 52 is arranged may also be a position other than the terminal portion 704 of the exposed portion 50. For example, the convex portion 52 may also be arranged in the middle of the exposed portion 50 in the rising portion 702. In addition, in the seventh embodiment, the case where the radius of the convex portion 52 is constant everywhere is described. However, the shape of the exposed portion 50 with the convex portion 52 may also be, for example, a barrel shape that gradually expands as it goes to the center.

[0195] (16) Modification I

[0196] In the seventh embodiment, the case where the resin molded product 1 is formed using the connection terminal 700 having the convex portion 52 has been described. Fig.45 In the resin molded product using the connection terminal 790 without the protrusion 52 and its production, a mold having the same technical features and a production method having the same technical features can also be applied. Fig.45 The connection terminal 790 shown in the figure has a connection portion 701 and a rising portion 702. Fig.41 The connection terminals 700 shown are identical. However, Fig.44 The rising portion 702 is cylindrical with a constant radius and does not have the convex portion 52 .

[0197] thereby, Fig.44 The split pieces 131 and 132 of the slide pin 130 accommodate the exposed portion 50 of the connection terminal 790 which does not have the protrusion 52, so there is no Fig.42 as well as Fig.43 Second portions 181q, 182q are shown.

[0198] The first to seventh embodiments of the present invention have been described above, but the present invention is not limited to the above embodiments and can be variously modified within the scope of the subject matter of the invention. In particular, the multiple embodiments and modifications described in this specification can be arbitrarily combined as needed.

[0199] Description of Reference Numerals

[0200] 1: resin molded product; 10: resin molded body; 20: embedded component; 30: main body; 40: embedded part; 50: exposed part; 52: convex part; 100: mold; 110: first mold; 118: first surface; 120: second mold; 128: second surface; 130: sliding pin; 131, 132, 231-234: dividing pieces; 133, 333: receiving part; 135, 235, 335: sliding part; 138: third surface; 181, 182, 281, 282, 283, 284: concave part; 181n, 182n: wide width part; 181q, 182q: second part; 184, 285: groove; SP: molding space.

Claims

1. A method for producing a resin molded product, in, The resin molded product is formed by integrating a resin molded body and an embedded component through insert molding, and the embedded component has: a main body portion embedded in the resin molded body; and an embedded portion protruding from the main body portion and embedded in the resin molded body; and an exposed portion extending from the embedded portion and exposed outside the resin molded body, the manufacturing method comprising: The first step is to place the embedded component between the first mold and the second mold; The second step is to close the first mold and the second mold to form a molding space for accommodating the embedded component; a third step of molding the resin molded body in which the insert component is embedded by flowing molten resin into the molding space and solidifying the molten resin; and The fourth step is to open the first mold and the second mold to take out the resin molded body. The wall surface of the molding space includes a first surface of the first mold and a second surface of the second mold. In the second step, the slide pin is slid synchronously with the clamping action of the first mold and the second mold, and the slide pin is changed in such a manner that the exposed portion is wrapped by the slide pin in a state where the embedded portion of the embedded component is exposed in the molding space, and the third surface of the wall surface of the molding space is formed by the slide pin at the boundary between the embedded portion and the exposed portion. In the third step, the molten resin is allowed to flow and solidify until the embedded portion is located in the molten resin and the molten resin contacts the third surface. In the fourth step, the slide pin is slid to change the slide pin so as to release the exposed portion from being wrapped by the slide pin.

2. The method for producing a resin molded product according to claim 1, in, In the second step, in synchronization with the mold clamping action, the exposed portion is accommodated in the accommodating portion of the slide pin in the released state and the accommodating portion is deformed into a closed state, thereby enclosing the exposed portion and forming the third surface. In the third step, the molten resin is prevented from flowing into the interior of the housing portion. In the fourth step, the housing portion in the closed state is deformed into the released state, and the exposed portion is taken out of the housing portion.

3. The method for producing a resin molded product according to claim 2, in, The receiving portion of the sliding pin includes a plurality of divided pieces. The plurality of split pieces are deformed into the closed state by sliding and combining when the exposed portion is accommodated in the accommodation portion in the second step, and are deformed into the released state by separating when the exposed portion is taken out of the accommodation portion in the fourth step.

4. The method for producing a resin molded article according to claim 3, in, The plurality of split pieces slide in a direction away from the resin molded body when being separated.

5. The method for producing a resin molded article according to any one of claims 2 to 4, in, The exposed portion has a bank on the outer peripheral surface, the bank protruding in a ring shape to block the molten resin. The housing portion has an annular groove portion that allows the exposed portion to move in a direction intersecting the sliding direction and that can abut against the bank portion in an annular shape.

6. A resin molded article comprising: a resin molded body composed of a thermoplastic resin; and The embedded component is embedded in the resin molded body by insert molding, The embedded component has: A main body portion, embedded in the resin molded body; an embedded portion protruding from the main body and embedded in the resin molded body; and an exposed portion extending from the embedded portion and exposed outside the resin molded body, The exposed portion include: An outer peripheral surface exposed from the resin molded body, and a convex portion protruding from the outer peripheral surface.

7. The resin molded article according to claim 6, in, The exposed portion has a bank portion on the outer peripheral surface, the bank portion protruding in a ring shape and contacting the resin molded body.

8. The resin molded article according to claim 6 or 7, in, The main body includes a film substrate having a circuit. The exposed portion is included in a connector or a connection terminal, and the connector or the connection terminal is electrically connected to the circuit.

9. An insert molding die for manufacturing a resin molded product, wherein the resin molded product is formed by integrating a resin molded body and an insert component by insert molding, and the insert component comprises: a main body, which is embedded in the resin molded body; ； an embedded portion protruding from the main body and embedded in the resin molded body; and an exposed portion extending from the embedded portion and exposed outside the resin molded body, The insert molding die comprises: A first mold and a second mold, wherein the first mold has a first surface, and the second mold has a second surface, and the first mold and the second mold are used to form a wall surface of a molding space, and the molding space is used to mold the resin molded body; as well as A sliding pin having a third surface, wherein the third surface is used to form the wall surface of the molding space, The sliding pin has a receiving portion, and the receiving portion receives the exposed portion. The receiving portion changes from a released state to a closed state when the mold is closed and receives the exposed portion, and changes from the closed state to the released state when the mold is opened so that the exposed portion can be taken out.

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