Soldering tin detection equipment for multiple hardware assemblies

Abstract

The invention discloses soldering tin detection equipment for multiple hardware assemblies, and relates to the field of soldering tin detection, the soldering tin detection equipment comprises a rack and a mounting plate mounted at the upper end of the rack, a stand column is mounted at the upper end of the mounting plate, a high-speed high-precision driver is arranged at the upper end of the stand column, and a product placement platform is mounted at the upper end of the mounting plate; an automatic grabbing mechanism is arranged at the middle end of the high-speed and high-precision driver, an accurate visual inspection mechanism capable of detecting hardware flaws and defects is installed on the outer side of the automatic grabbing mechanism, and the accurate visual inspection mechanism comprises a plurality of CCD visual inspection mechanisms. According to the soldering tin detection equipment for the multiple hardware assemblies, accurate visual detection can be carried out on a plurality of products at the same time, visual detection in the aspects of accurate flaws, cracks or stains and the like can be carried out on the soldering tin appearance of the hardware, and the soldering tin appearance flaws of the hardware are visually captured through visual detection; the phenomenon of visual detection errors is avoided, and data can be obtained more quickly and accurately.

Description

Technical Field

[0001] The present invention relates to the technical field of solder detection, specifically to a solder detection device for multi-hardware assemblies. Background Art

[0002] In the electronics industry and mechanical manufacturing, the detection of solder joints on hardware components in electronic products is a key link to ensure the reliability of electronic products. Therefore, it is necessary to detect and process the solder joints through detection equipment. The appearance of the solder joints on the hardware components is mainly achieved through visual inspection. Visual inspection can accurately detect whether there are defects, flaws or stains on the solder joints, such as whether there are air holes, cracks, etc. in the solder joints. Through detection, the quality of electronic products can be guaranteed.

[0003] In the prior art, when performing visual inspection of solder joints on hardware assemblies, the detection efficiency is low. Through CCD visual inspection, only the appearance can be detected, and it is easy to have situations such as missed soldering, false soldering, insufficient soldering or excessive soldering. For the detection of the circuit aspect of the product, additional inspection by staff is still required, which is rather cumbersome.

[0004] In order to overcome the above deficiencies, a Chinese patent of the prior art (application number: 202222448032.0) discloses a multi-channel output hardware CCD full-inspection machine. The multi-channel output hardware CCD full-inspection machine aims to solve the technical problem that the multi-channel output processing of the hardware CCD full-inspection machine cannot be carried out under the prior art. The multi-hardware CCD full-inspection machine includes a base; an adjustment component is arranged inside the base, a bracket is fixedly installed outside the base, a CCD detection camera is arranged at the upper end of the bracket, a guide plate is fixedly installed outside the base, and a first conveying component is arranged inside the guide plate. The multi-channel output hardware CCD full-inspection machine only needs to drive the hardware components to the upper end of the adjustment component through the second conveying component, detect the hardware components through the CCD detection camera. After detection, start the adjustment component to drive the hardware components to be conveyed into the corresponding guide plates, and perform output processing on the hardware components through the setting of the first conveying component, thereby realizing the multi-channel output processing of the hardware CCD full-inspection machine.

[0005] In order to overcome the above deficiencies, a Chinese patent of the prior art (application number: 202011026524.X) discloses a precision hardware appearance detection device, including a detection mechanism one, a detection mechanism two, and a detection mechanism three for detecting hardware. The material guiding groove is arranged obliquely. The hardware falls onto the turntable through the material guiding groove. Then the turntable rotates, and the hardware sequentially passes through the detection mechanism one, the detection mechanism two, and the detection mechanism three for detection. When the hardware is transported by the turntable, the elastic force of the first spring pushes the pressing housing downward, so that the roller contacts the hardware, thereby avoiding the shaking of the hardware and improving the stability of the hardware transportation. The color sensor can detect the coating of the hardware to judge whether the coating of the hardware falls off. The distance sensor can detect whether there are pits on the surface of the hardware to judge whether the hardware is qualified.

[0006] Although the prior art can overcome the above-mentioned deficiencies, there are still other problems in its operation process. For example, when visually detecting the soldering points of a large number of hardware, it takes a long time, the visual detection efficiency is low, and it cannot adapt to large-scale production operations. Summary of the Invention

[0007] The purpose of the present invention is to provide a soldering detection device for multi-hardware assemblies to solve the problems mentioned in the above background technology, that is, when visually detecting the soldering points of a large number of hardware, it takes a long time, the visual detection efficiency is low, and it cannot adapt to large-scale production operations.

[0008] To achieve the above purpose, the present invention provides the following technical solution: A soldering detection device for multi-hardware assemblies, including a frame and a mounting plate installed at the upper end of the frame. And a column is installed at the upper end of the mounting plate, and a high-speed and high-precision drive is arranged at the upper end of the column. A product placement platform is installed at the upper end of the mounting plate; an automatic grasping mechanism is arranged in the middle of the high-speed and high-precision drive, and an accurate visual detection mechanism capable of detecting hardware defects is installed outside the automatic grasping mechanism; a limiting sleeve is arranged outside the product placement platform, and the limiting sleeve is rotationally connected to the gear rod, and a positioning visual detection mechanism capable of precise positioning is arranged outside the limiting sleeve; a positioning bin is arranged at the upper end of the product placement platform, and a sealing plate is arranged inside the positioning bin, and the upper end of the positioning bin is installed with the lower end of the air jet port, and an auxiliary visual detection mechanism is installed outside the sealing plate.

[0009] Further, the accurate visual detection mechanism includes a plurality of CCD visual detection mechanisms, and the outside of the CCD visual detection mechanisms is installed at the upper end of the column. A circuit testing device is arranged on the back of the CCD visual detection mechanism. A guide rail is fixedly installed at the upper end of the mounting plate, and a slider is arranged on the surface of the guide rail. And the upper end of the slider is fixedly installed with the lower end of the product placement platform.

[0010] Further, a second cylinder is fixedly installed at the lower end of the mounting plate, and a first cylinder is installed at the output end of the second cylinder, and the output end of the first cylinder is connected to the left side of the product placement platform.

[0011] Further, a circuit defective material tank and a CCD defective material tank are fixedly installed at the upper end of the mounting plate, and a first defective product box and a second defective product box are arranged at the front ends of the circuit defective material tank and the CCD defective material tank, and the first defective product box is correspondingly arranged with the circuit defective material tank, and the second defective product box is correspondingly arranged with the CCD defective material tank. A third cylinder is installed at the upper ends of the circuit defective material tank and the CCD defective material tank.

[0012] Further, a good product conveyor belt is installed on the left side of the mounting plate, and the good product conveyor belt corresponds to the circuit defective material tank and the CCD defective material tank.

[0013] Further, the positioning vision detection mechanism further includes a toothed plate, and the outer side of the toothed plate is fixedly installed on the inner side of the column, and the toothed plate meshes with the gear rod.

[0014] Further, a disc is fixedly installed at the upper end of the gear rod, and a positioning column is fixedly installed at the upper end of the disc, and a groove push rod is sleeved on the surface of the positioning column, and the shape of the groove push rod is "T" shaped, and a moving plate is fixedly installed at the front end of the groove push rod.

[0015] Further, a limiting rod is installed through the inside of the moving plate, and a positioning bin is fixedly installed at the rear end of the limiting rod, and the lower end of the positioning bin is installed on the product placement platform.

[0016] Further, a return spring is fixedly installed at the front end of the moving plate, and a movable plate is installed at the front end of the return spring, and the movable plate corresponds to the product on the product placement platform, and a damper is arranged between the rear end of the movable plate and the moving plate.

[0017] Further, the auxiliary vision detection mechanism further includes an adjusting rod, and the front end of the adjusting rod is fixedly installed at the rear end of the moving plate, and the rear end of the adjusting rod is fixedly installed with a sealing plate, and the outer side of the sealing plate fits the inner wall of the positioning bin. The rear end of the positioning bin is communicated with the air jet port through a guide pipe, and the output end of the air jet port corresponds to the product on the surface of the product placement platform. The rear end of the positioning bin is connected to a one-way air inlet, and a one-way valve is arranged inside the one-way air inlet.

[0018] Compared with the prior art, the beneficial effects of the present invention are:

[0019] (1) The solder inspection device for multiple hardware assemblies can perform visual inspections on multiple products simultaneously with multiple CCD vision inspection mechanisms, ensuring rapid and accurate visual inspections of the appearance of solder joints on hardware parts for defects, flaws, or stains. It can directly capture the appearance defects of hardware products through visual inspection, avoiding visual inspection errors. Therefore, the present invention can not only obtain data more quickly and accurately, but also synchronously detect multiple products, with a short inspection time and high inspection efficiency, and can adapt to large-scale operations.

[0020] (2) The solder inspection device for multiple hardware assemblies, after the appearance inspection by the CCD, moves the product to the detection end of the circuit function to detect the malfunction of functions such as short circuit or open circuit of the product. In this way, based on the appearance inspection, it can detect whether there are cases of missed soldering, false soldering, insufficient soldering, or excessive soldering in the hardware parts. The combination of circuit detection and appearance inspection makes the inspection more comprehensive, improves the overall inspection effect, and effectively guarantees the quality and reliability of the inspected products.

[0021] (3) The solder inspection device for multiple hardware assemblies, after the visual inspection is completed, places the products with CCD defects inside the CCD defective material tank. After the circuit inspection is completed, places the products with circuit defects on the circuit defective material tank. Finally, by activating the third cylinder, the defective products on the circuit defective material tank and the CCD defective material tank are pushed into the first defective product box and the second defective product box respectively, so as to classify and store the inspected products and avoid confusion between qualified and unqualified products.

[0022] (4) The solder inspection device for multiple hardware assemblies can straighten and limit the products on the product placement platform to prevent deviation during the CCD vision inspection mechanism and circuit test. At the same time, when grasping the products, it can automatically release the products to achieve the effect of limit positioning, thus assisting in the inspection of the products.

[0023] (5) The solder inspection device for multiple hardware assemblies sucks air through the check valve inside the one-way air inlet, making the positioning chamber filled with gas. Conversely, when the sealing plate is pushed, the air inside the positioning chamber is squeezed and transported through the air duct to the air jet port, and the air jet port jets air at the products on the surface of the product placement platform for cleaning, improving the inspection accuracy and avoiding problems of detection deviation. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic three-dimensional structure diagram of the whole of the present invention.

[0025] Figure 2 It is a schematic side three-dimensional structure diagram of the present invention.

[0026] Figure 3 It is an exploded structure diagram of the present invention.

[0027] Figure 4 This is a schematic perspective view of the installation plate of the present invention as seen from below.

[0028] Figure 5 This is a schematic perspective view of the back side of the CCD vision detection mechanism of the present invention.

[0029] Figure 6 This is a schematic perspective view of the product placement platform of the present invention.

[0030] Figure 7 This is a schematic perspective view of the automatic grasping mechanism of the present invention.

[0031] Figure 8 This is a schematic perspective view of the top of the automatic grasping mechanism of the present invention.

[0032] Figure 9 This is a schematic perspective view of the top of the product placement platform of the present invention.

[0033] Figure 10 For the present invention Figure 9 Schematic diagram of the enlarged structure of A in

[0034] Figure 11 This is a schematic perspective view of the sectional view of the positioning bin of the present invention.

[0035] Figure 12 This is a schematic perspective view of the adjusting rod of the present invention as seen from below.

[0036] In the figure: 1, frame; 2, mounting plate; 3, column; 4, high-speed and high-precision drive; 5, automatic grasping mechanism; 6, CCD vision detection mechanism; 7, product placement platform; 8, guide rail; 9, slider; 10, first cylinder; 11, second cylinder; 12, good product conveyor belt; 13, circuit defective product trough; 14, CCD defective product trough; 15, first defective product box; 16, second defective product box; 17, third cylinder; 18, toothed plate; 19, limit sleeve; 20, gear rod; 21, disc; 22, positioning column; 23, groove push rod; 24, moving plate; 25, positioning bin; 26, limit rod; 27, return spring; 28, movable plate; 29, damper; 30, adjusting rod; 31, sealing plate; 32, air duct; 33, air jet port; 34, one-way air inlet. Detailed implementation manners

[0037] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0038] Example 1: As Figures 1-7 shown in the technical solution, a solder inspection device for multiple hardware components is disclosed to solve the problem of slow measurement speed: a frame 1 and a mounting plate 2 installed at the upper end of the frame 1, and a column 3 is installed at the upper end of the mounting plate 2, and a high-speed and high-precision drive 4 is provided at the upper end of the column 3. A product placement platform 7 is installed at the upper end of the mounting plate 2; an automatic grasping mechanism 5 is provided in the middle of the high-speed and high-precision drive 4, and an accurate vision inspection mechanism capable of detecting hardware defects is installed outside the automatic grasping mechanism 5. The accurate vision inspection mechanism includes a plurality of CCD vision inspection mechanisms 6, and the outside of the CCD vision inspection mechanism 6 is installed at the upper end of the column 3. A circuit test device is provided on the back of the CCD vision inspection mechanism 6, and a guide rail 8 is fixedly installed at the upper end of the mounting plate 2, and a slider 9 is provided on the surface of the guide rail 8, and the upper end of the slider 9 is fixedly installed with the lower end of the product placement platform 7. A second cylinder 11 is fixedly installed at the lower end of the mounting plate 2, and a first cylinder 10 is installed at the output end of the second cylinder 11, and the output end of the first cylinder 10 is connected to the left side of the product placement platform 7. A circuit defective material tank 13 and a CCD defective material tank 14 are fixedly installed at the upper end of the mounting plate 2, and a first defective product box 15 and a second defective product box 16 are provided at the front ends of the circuit defective material tank 13 and the CCD defective material tank 14. The first defective product box 15 is correspondingly arranged with the circuit defective material tank 13, and the second defective product box 16 is correspondingly arranged with the CCD defective material tank 14. A third cylinder 17 is installed at the upper ends of the circuit defective material tank 13 and the CCD defective material tank 14. A good product conveyor belt 12 is installed on the left side of the mounting plate 2, and the good product conveyor belt 12 corresponds to the circuit defective material tank 13 and the CCD defective material tank 14.

[0039] During use, first, the product placement platform 7 on the mounting plate 2 is filled with multiple hardware component products. After filling the multiple hardware component products, the CCD vision inspection mechanism 6 is started. The CCD vision inspection mechanism 6 is used to detect the solder joints of the multiple hardware components. The CCD vision inspection mechanism 6 includes an image acquisition part and other parts such as an image processing system. Both the image acquisition part and the image processing system are conventional technical products and will not be elaborated here. The CCD camera in the image acquisition part can collect the image of the solder joint of the multiple hardware components and convert the image into a digital signal and transmit it to the image processing system. The image processing system analyzes the digital signal. In this way, the appearance inspection of the solder joints of the multiple hardware components is completed, and thus it can be detected whether there are defects such as air holes and cracks in the solder joints of the multiple hardware component products.

[0040] The detection results of defective products and qualified products are transmitted to the system program for storage. At this time, by starting the first cylinder 10, the placement platform 7 for qualified hardware assembly products is pulled, and it slides along the guide rail 8 through the slider 9 to the lower end of the circuit testing device. At this time, the hardware assembly product contacts the pins on the circuit testing device, and the electrical hardware assembly is connected to the external power grid through the pins on the circuit testing device, so that the circuit test of the hardware assembly product can be carried out. If there is a short circuit or open circuit in the circuit, it can be used to detect whether there are defects and deficiencies such as missed soldering, false soldering, less soldering, and more soldering in the hardware assembly product.

[0041] After the appearance inspection of the CCD, the hardware assembly product is moved to the detection end of the circuit function to detect the defective conditions such as short circuit or open circuit of the hardware assembly product. The results of the circuit test are also transmitted to the system program for storage. After the circuit test is completed, the first cylinder 10 and the product placement platform 7 are pulled by the second cylinder 11 to be fixed in a specific position for waiting. At the same time, the automatic grasping mechanism 5 moves along the high-speed and high-precision drive 4 on the column 3. The high-speed and high-precision drive 4 is a component used to drive the automatic grasping mechanism 5. It mainly drives the automatic grasping mechanism 5 to move along its surface through a power source. The high-speed and high-precision drive 4 includes a bracket, and a servo motor and a guide column arranged on the bracket. The servo motor is used as the driving force. The servo motor can drive the cross plate on the automatic grasping mechanism 5 to move through a lead screw. At the same time, the cross plate on the automatic grasping mechanism 5 can perform high-precision horizontal movement under the limitation of a group of guide columns. The cross plate on the automatic grasping mechanism 5 is also provided with a cylinder or other power components and an electric gripper. Through the expansion and contraction of the cylinder, the electric gripper at the lower end can be driven to grasp the hardware assembly. After the electric gripper moves the hardware assembly to a specific position, it releases. The electric gripper is a mature technical product on the market and will not be elaborated here. In this way, it can be realized that the automatic grasping mechanism 5 grasps the product and transports it to the corresponding position according to the test results. The qualified products are placed on the good product conveyor belt 12 for transportation out. The products with circuit defects are placed on the circuit defective material tank 13, and the products with CCD defects are placed inside the CCD defective material tank 14. Finally, by starting the third cylinder 17, the defective products on the circuit defective material tank 13 and the CCD defective material tank 14 are dialed into the first defective product box 15 and the second defective product box 16. In this way, the visual inspection of the products can be carried out accurately. The products after the visual inspection can be stored separately. A dotting mechanism is arranged at the upper end of the product placement platform 7. The dotting mechanism can mark the good products after all the detection processes are completed to indicate that the products pass the test. The accurate visual inspection can detect multiple products at the same time. In this way, the accurate visual inspection can detect multiple products to ensure that the hardware parts can be accurately visually inspected for defects, flaws or stains. The appearance defects of the hardware parts products can be captured intuitively through the visual inspection, avoiding the phenomenon of visual inspection errors, and more rapid and accurate data can be obtained.

[0042] Embodiment 2: As Figure 1 , Figure 2 , Figure 3 , Figure 9 , Figure 10 , Figure 11 and Figure 12The described technical solution, on the basis of Embodiment 1, in order to solve the problem of poor stability of the hardware assembly product before placement, discloses that: a limit sleeve 19 is arranged outside the product placement platform 7, and the limit sleeve 19 is rotatably connected to the gear rod 20. A positioning vision detection mechanism capable of precise positioning is arranged outside the limit sleeve 19. The positioning vision detection mechanism further includes a toothed plate 18. The outside of the toothed plate 18 is fixedly installed inside the column 3, and the toothed plate 18 meshes with the gear rod 20. The upper end of the gear rod 20 is fixedly installed with a disc 21, and the upper end of the disc 21 is fixedly installed with a positioning column 22. A groove push rod 23 is sleeved on the surface of the positioning column 22. Moreover, the shape of the groove push rod 23 is "T" shaped. The front end of the groove push rod 23 is fixedly installed with a moving plate 24. A limit rod 26 is installed through the inside of the moving plate 24. The rear end of the limit rod 26 is fixedly installed with a positioning bin 25. The lower end of the positioning bin 25 is installed on the product placement platform 7. The front end of the moving plate 24 is fixedly installed with a return spring 27. The front end of the return spring 27 is installed with a movable plate 28. The movable plate 28 corresponds to the product on the product placement platform 7. Moreover, a damper 29 is arranged between the rear end of the movable plate 28 and the moving plate 24.

[0043] When the product placement platform 7 moves, the gear rod 20 rotatably installed outside through the limit sleeve 19 fits and moves along the toothed plate 18. As the product placement platform 7 moves, the gear rod 20 rotates synchronously under the meshing of the toothed plate 18. When the gear rod 20 rotates, it can drive the upper disc 21 and positioning column 22 to rotate. When the positioning column 22 rotates, it can push the groove push rod 23. The movement of the groove push rod 23 drives the moving plate 24. The moving plate 24 can reciprocate under the limitation of the limit rod 26. The reciprocating moving plate 24 pushes the front return spring 27 and the movable plate 28. With the setting of the damper 29, the return spring 27 can be prevented from reciprocating vibration. At this time, as the product placement platform 7 moves to the left, the product on the product placement platform 7 can be straightened and limited, avoiding deviation during the CCD vision detection mechanism 6 and circuit testing. At the same time, when the product is grabbed, the product can be automatically released, achieving the effect of limit positioning. In this way, it can assist the product in visual detection, so that during subsequent visual detection, the product will not move and cause deviation in visual detection.

[0044] Embodiment 3: As Figures 1-12The described technical solution, based on Embodiment 2, in order to solve the problem that surface impurities of the hardware assembly product affect the detection accuracy, discloses that: a positioning bin 25 is arranged at the upper end of the product placement platform 7, and a sealing plate 31 is arranged inside the positioning bin 25. Moreover, the upper end of the positioning bin 25 is installed with the lower end of the air jet port 33. And an auxiliary vision detection mechanism is installed on the outer side of the sealing plate 31. The auxiliary vision detection mechanism further includes an adjusting rod 30. And the front end of the adjusting rod 30 is fixedly installed at the rear end of the moving plate 24. And the rear end of the adjusting rod 30 is fixedly installed with the sealing plate 31. Moreover, the outer side of the sealing plate 31 fits against the inner wall of the positioning bin 25. The rear end of the positioning bin 25 is communicated with the air jet port 33 through a conduit 32. And the output end of the air jet port 33 corresponds to the product on the surface of the product placement platform 7. The rear end of the positioning bin 25 is connected to a one-way air inlet 34, and a one-way valve is arranged inside the one-way air inlet 34.

[0045] As the moving plate 24 reciprocates, the adjusting rod 30 pulls the sealing plate 31 along the inside of the positioning bin 25. The sealing plate 31 performs a piston movement along the inside of the positioning bin 25. When the sealing plate 31 is pulled, air is drawn in through the one-way valve inside the one-way air inlet 34, so that the inside of the positioning bin 25 is filled with gas. On the contrary, when the sealing plate 31 is pushed, the air inside the positioning bin 25 is squeezed and conveyed to the air jet port 33 through the conduit 32. The air jet port 33 jets air at the product on the surface of the product placement platform 7 for cleaning, improving the accuracy of vision detection, blowing debris and impurities off the product, avoiding affecting the results of subsequent vision detection, and reducing the probability of deviation.

[0046] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A multi-hardware assembly solder detection device, comprising a frame (1) and a mounting plate (2) mounted on the upper end of the frame (1), wherein a column (3) is mounted on the upper end of the mounting plate (2), and a high-speed and high-precision drive (4) is arranged on the upper end of the column (3), and a product placement platform (7) is mounted on the upper end of the mounting plate (2); Features: An automatic gripping mechanism (5) is disposed at the middle end of the high-speed and high-precision drive (4), and an accurate visual inspection mechanism capable of detecting defects of hardware parts is installed on the outer side of the automatic gripping mechanism (5), wherein the accurate visual inspection mechanism includes a plurality of CCD visual inspection mechanisms (6); A limiting sleeve (19) is arranged on the outer side of the product placement platform (7), and the limiting sleeve (19) is rotatably connected to the gear rod (20), and a positioning visual detection mechanism capable of accurate positioning is arranged on the outer side of the limiting sleeve (19); A positioning bin (25) is provided at the upper end of the product placement platform (7), a sealing plate (31) is provided inside the positioning bin (25), the upper end of the positioning bin (25) is mounted on the lower end of the air jet port (33), and an auxiliary visual detection mechanism is installed on the outer side of the sealing plate (31).

2. The multi-hardware assembly solder detection equipment according to claim 1, characterized in that: The outer side of the CCD visual detection mechanism (6) is installed on the upper end of the column (3), a circuit testing device is arranged on the back of the CCD visual detection mechanism (6), a guide rail (8) is fixedly installed on the upper end of the mounting plate (2), a slider (9) is arranged on the surface of the guide rail (8), and the upper end of the slider (9) is fixedly installed on the lower end of the product placement platform (7).

3. The solder detection equipment for multiple hardware assemblies according to claim 2 is characterized in that: A second cylinder (11) is fixedly mounted on the lower end of the mounting plate (2), and a first cylinder (10) is mounted on the output end of the second cylinder (11), and the output end of the first cylinder (10) is connected to the left side of the product placement platform (7).

4. The multi-hardware assembly solder detection equipment according to claim 3, characterized in that: A circuit defective material trough (13) and a CCD defective material trough (14) are fixedly mounted on the upper end of the mounting plate (2), and a first defective product box (15) and a second defective product box (16) are arranged at the front ends of the circuit defective material trough (13) and the CCD defective material trough (14), and the first defective product box (15) is arranged corresponding to the circuit defective material trough (13), and the second defective product box (16) is arranged corresponding to the CCD defective material trough (14), and a third cylinder (17) is installed at the upper ends of the circuit defective material trough (13) and the CCD defective material trough (14).

5. The multi-hardware assembly solder detection equipment according to claim 4, characterized in that: A good product conveyor belt (12) is installed on the left side of the installation plate (2), and the good product conveyor belt (12) corresponds to the circuit defective material slot (13) and the CCD defective material slot (14).

6. The solder detection equipment for multiple hardware assemblies according to claim 1, characterized in that: The positioning visual detection mechanism also includes a toothed plate (18), and the outer side of the toothed plate (18) is fixedly mounted on the inner side of the column (3), and the toothed plate (18) is meshed with a gear rod (20).

7. The solder detection equipment for multiple hardware assemblies according to claim 6, characterized in that: A disc (21) is fixedly mounted on the upper end of the gear rod (20), a positioning column (22) is fixedly mounted on the upper end of the disc (21), a groove push rod (23) is sleeved on the surface of the positioning column (22), and the groove push rod (23) is in a T-shape, and a moving plate (24) is fixedly mounted on the front end of the groove push rod (23).

8. The solder detection equipment for multiple hardware assemblies according to claim 7, characterized in that: A limiting rod (26) is installed through the interior of the movable plate (24), and a positioning bin (25) is fixedly installed at the rear end of the limiting rod (26), and the lower end of the positioning bin (25) is installed on the product placement platform (7).

9. The solder detection equipment for multiple hardware assemblies according to claim 8, characterized in that: A return spring (27) is fixedly mounted on the front end of the movable plate (24), and a movable plate (28) is mounted on the front end of the return spring (27), and the movable plate (28) corresponds to the product on the product placement platform (7), and a damper (29) is arranged between the rear end of the movable plate (28) and the movable plate (24).

10. The solder detection equipment for multiple hardware assemblies according to claim 1, characterized in that: The auxiliary visual inspection mechanism also includes an adjusting rod (30), and the front end of the adjusting rod (30) is fixedly mounted on the rear end of the movable plate (24), and the rear end of the adjusting rod (30) is fixedly mounted with a sealing plate (31), and the outer side of the sealing plate (31) is in contact with the inner wall of the positioning bin (25), the rear end of the positioning bin (25) is connected to the air jet (33) through an air guide pipe (32), and the output end of the air jet (33) corresponds to the product on the surface of the product placement platform (7), the rear end of the positioning bin (25) is connected to a one-way air inlet (34), and a one-way valve is arranged inside the one-way air inlet (34).

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