Feeding and cutting cooperative control method and system for laser plate splitting machine

Abstract

The invention provides a feeding and cutting cooperative control method and system for a laser plate splitting machine, applied to the laser plate splitting machine, and the method comprises the steps that monitoring data of a feeding mechanism are analyzed, and the first position of a to-be-cut plate is determined; analyzing the cutting process of the plate which is being cut, and predicting the cutting time; and on the basis of the first position and the cutting time, working parameters of the conveying device between the feeding mechanism and the cutting position are adjusted. According to the feeding and cutting cooperative control method and system for the laser plate splitting machine, conveying and cutting of the plates are coordinated, and the cutting efficiency is effectively improved.

Description

Technical Field

[0001] The present invention relates to the technical field of machine vision and automatic control, and in particular to a feeding and cutting coordinated control method and system for a laser panel splitter. Background Art

[0002] At present, the laser cutting PCB board depaneling machine is an advanced PCB board depaneling processing equipment, which can achieve high-precision, high-speed, high-efficiency and high-quality depaneling processing. It is widely used in electronics, communications, computers, automobiles and other fields. It can achieve high-precision, high-speed, high-efficiency and high-quality depaneling processing. In the existing laser cutting machines, the products and product carriers are transferred by rollers, and the laser cutting head moves above the roller table, and the position is calibrated by the visual module to cut the PCB board.

[0003] Among them, the specific steps of the panel splitter can be divided into feeding, cutting and discharging; feeding means that the plate to be cut needs to be transported to the designated position before cutting; cutting refers to cutting the plate with a laser cutting head; discharging refers to transporting the cut items from the designated position; the coordination between each step helps to improve cutting efficiency and cutting effect, especially the coordination between feeding and cutting. Summary of the invention

[0004] One of the purposes of the present invention is to provide a feeding and cutting coordinated control method and system for a laser panel splitter, so as to coordinate the conveying and cutting of panels and effectively improve the cutting efficiency.

[0005] A feeding and cutting coordinated control method for a laser panel separator provided in an embodiment of the present invention is applied to the laser panel separator, comprising: Analyze the monitoring data of the feeding mechanism to determine the first position of the plate to be cut; Analyze the cutting process of the plate being cut and predict the cutting time; Based on the first position and the cutting time, operating parameters of a conveying device between the feeding mechanism and the cutting position are adjusted.

[0006] Preferably, the laser panel separator includes: a main body, a conveying mechanism, at least one image acquisition mechanism, at least one laser cutting mechanism and a main controller. The conveying mechanism is used to convey the panels to be cut. The image acquisition mechanism and the laser cutting mechanism are associated one-to-one and are arranged above the conveying mechanism. The laser cutting mechanism can cut different panels separately or collaboratively cut the same panel.

[0007] Preferably, analyzing the monitoring data of the feeding mechanism to determine the first position of the plate to be cut includes: The first image acquired by the image acquisition device configured by the feeding mechanism is placed in a pre-configured coordinate system, and the plate to be cut is positioned by the coordinates in the coordinate system to obtain a first position.

[0008] Preferably, the cutting progress of the plate being cut is analyzed to predict the cutting time, including: Sampling the trajectory points of the planned trajectory to obtain multiple sampling points; Analyze the cutting process and determine the uncut parts on the planned trajectory; The number of sampling points of the uncut part is counted and the cutting time is obtained according to the pre-configured table of points and time correspondence.

[0009] Preferably, when the laser cutting mechanism is configured to cut the same plate, based on the first position and the cutting time, the operating parameters of the conveying device between the feeding mechanism and the cutting position are adjusted, including: Determine the conveying time according to the first position, the working parameters of the conveying device between the current feeding mechanism and the cutting position, and the end position of the configuration of the laser cutting mechanism close to the feeding mechanism side; When the conveying time is less than or equal to the cutting time, the working parameters are adjusted downward according to the time difference; When the conveying time is longer than the cutting time, the working parameters are adjusted upward according to the time difference; The downward adjustment of the working parameters and the upward adjustment of the working parameters are respectively based on a pre-configured first adjustment table and a pre-configured second adjustment table.

[0010] Preferably, when the laser cutting mechanism is configured to cut different plates, the operating parameters of the conveying device between the feeding mechanism and the cutting position are adjusted based on the first position and the cutting time, including: Determine the conveying time according to the first position, the working parameters of the conveying device between the current feeding mechanism and the cutting position and the end position of the configuration of the first laser cutting mechanism close to the feeding mechanism side; The maximum cutting time corresponding to each laser cutting mechanism is used as the threshold time; When the delivery time is less than or equal to the threshold time, the working parameters are adjusted downward according to the time difference; When the delivery time is greater than the threshold time, the working parameters are adjusted upward according to the time difference; The downward adjustment of the working parameters and the upward adjustment of the working parameters are respectively based on a pre-configured first adjustment table and a pre-configured second adjustment table.

[0011] Preferably, the configuration rules of the end point position are as follows: The end position is determined by translating from the boundary of the clamped sheet toward the feeding mechanism based on the reaction time of the clamping device of the laser cutting mechanism and the maximum speed limit of the conveying device.

[0012] Preferably, a plate material distribution mechanism is arranged before the feeding mechanism, and the plate material distribution mechanism distributes the plates to be cut evenly according to the configuration of the laser cutting mechanism.

[0013] The present invention also provides a feeding and cutting coordinated control system for a laser panel separator, which is applied to the laser panel separator and includes: a position positioning module, a time prediction module and an adjustment module; wherein the position positioning module analyzes the monitoring data of the feeding mechanism to determine the first position of the plate to be cut; the time prediction module analyzes the cutting process of the plate being cut to predict the cutting time; the adjustment module adjusts the working parameters of the conveying device between the feeding mechanism and the cutting position based on the first position and the cutting time.

[0014] Preferably, the position positioning module analyzes the monitoring data of the feeding mechanism to determine the first position of the plate to be cut, including: The first image acquired by the image acquisition device configured by the feeding mechanism is placed in a pre-configured coordinate system, and the plate to be cut is positioned by the coordinates in the coordinate system to obtain a first position.

[0015] Preferably, the time prediction module analyzes the cutting progress of the plate being cut and predicts the cutting time, including: Sampling the trajectory points of the planned trajectory to obtain multiple sampling points; Analyze the cutting process and determine the uncut parts on the planned trajectory; Count the number of sampling points of the uncut part and obtain the cutting time according to the pre-configured table of points and time correspondence; Preferably, when the laser cutting mechanism is configured to cut the same plate, the adjustment module adjusts the working parameters of the conveying device between the feeding mechanism and the cutting position based on the first position and the cutting time, including: Determine the conveying time according to the first position, the working parameters of the conveying device between the current feeding mechanism and the cutting position, and the end position of the configuration of the laser cutting mechanism close to the feeding mechanism side; When the conveying time is less than or equal to the cutting time, the working parameters are adjusted downward according to the time difference; When the conveying time is longer than the cutting time, the working parameters are adjusted upward according to the time difference; The downward adjustment of the working parameters and the upward adjustment of the working parameters are respectively based on a pre-configured first adjustment table and a pre-configured second adjustment table.

[0016] Preferably, when the laser cutting mechanism is configured to cut different plates, the adjustment module adjusts the working parameters of the conveying device between the feeding mechanism and the cutting position based on the first position and the cutting time, including: Determine the conveying time according to the first position, the working parameters of the conveying device between the current feeding mechanism and the cutting position and the end position of the configuration of the first laser cutting mechanism close to the feeding mechanism side; The maximum cutting time corresponding to each laser cutting mechanism is used as the threshold time; When the delivery time is less than or equal to the threshold time, the working parameters are adjusted downward according to the time difference; When the delivery time is greater than the threshold time, the working parameters are adjusted upward according to the time difference; The downward adjustment of the working parameters and the upward adjustment of the working parameters are respectively based on a pre-configured first adjustment table and a pre-configured second adjustment table.

[0017] Preferably, the configuration rules of the end point position are as follows: The end position is determined by translating from the boundary of the clamped sheet toward the feeding mechanism based on the reaction time of the clamping device of the laser cutting mechanism and the maximum speed limit of the conveying device.

[0018] Preferably, a plate material distribution mechanism is arranged before the feeding mechanism, and the plate material distribution mechanism distributes the plates to be cut evenly according to the configuration of the laser cutting mechanism.

[0019] Other features and advantages of the present invention will be described in the following description, and partly become apparent from the description, or understood by practicing the present invention. The purpose and other advantages of the present invention can be realized and obtained by the structures particularly pointed out in the written description and the accompanying drawings.

[0020] The technical solution of the present invention is further described in detail below through the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings: Figure 1 It is a schematic diagram of a feeding and cutting coordinated control method of a laser panel splitter in an embodiment of the present invention; Figure 2 A schematic diagram of a laser panel separator according to an embodiment of the present invention; Figure 3 It is a schematic diagram of a feeding and cutting coordinated control system of a laser panel separator in an embodiment of the present invention. DETAILED DESCRIPTION

[0022] The preferred embodiments of the present invention are described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention.

[0023] The embodiment of the present invention provides a feeding and cutting coordinated control method for a laser panel splitter, which is applied to a laser panel splitter, such as Figure 1 As shown, including: Step 1: Analyze the monitoring data of the feeding mechanism to determine the first position of the plate to be cut; Step 2: Analyze the cutting process of the plate being cut and predict the cutting time; Step three: Based on the first position and the cutting time, the working parameters of the conveying device between the feeding mechanism and the cutting position are adjusted.

[0024] The laser panel splitter includes: a main body, a conveying mechanism, at least one image acquisition mechanism, at least one laser cutting mechanism and a main controller. The conveying mechanism is used to convey the plate to be cut; the image acquisition mechanism and the laser cutting mechanism are associated one by one and are arranged above the conveying mechanism. The laser cutting mechanism can cut different plates separately or cooperate to cut the same plate, such as Figure 2 As shown, it is a laser panel separator using two image acquisition mechanisms and two laser cutting mechanisms, and the laser panel separator includes: a main body 10, a conveying mechanism 11, two image acquisition mechanisms 12, two laser cutting mechanisms 13 and a main controller 14; the two image acquisition mechanisms 12 and the two laser cutting mechanisms 13 form two cutting stations; when cutting the same plate, the conveying mechanism conveys the plate to be cut to the bottom of the image acquisition mechanism, and the two image acquisition mechanisms scan and shoot from both sides of the plate respectively, and the controller performs image splicing and analysis, and then controls the laser cutting mechanism to perform coordinated cutting; when cutting different plates, the conveying mechanism conveys two plates at the same time, and conveys them to the bottom of each laser cutting mechanism respectively, and then the corresponding image acquisition mechanism performs image scanning, plans cutting, and then the laser cutting mechanism performs separate cutting.

[0025] The coordination of feeding and cutting of the plate splitter is mainly to ensure that the next plate to be cut is moved to the side of the clamping position after the previous plate is cut, and then the transmission device is started to realize the unloading and holding in place. In order to achieve this goal, the monitoring data of the feeding mechanism is first analyzed to determine the position of the plate on the conveying device, and then the cutting process of the previous plate is analyzed to predict how much time is needed to complete the cutting; then the first position and cutting time are analyzed to determine whether the plate can be transported to one side of the clamping device just after cutting, so that the two are seamlessly connected, thereby improving the cutting efficiency.

[0026] In one embodiment, analyzing the monitoring data of the feeding mechanism to determine the first position of the plate to be cut includes: The first image acquired by the image acquisition device configured by the feeding mechanism is placed in a pre-configured coordinate system, and the plate to be cut is positioned by the coordinates in the coordinate system to obtain a first position.

[0027] The image acquisition device takes pictures of the image on the conveying device on the feeding mechanism side, so that the plate can be positioned after image analysis.

[0028] In one embodiment, the cutting progress of the plate being cut is analyzed to predict the cutting time, including: Sampling the trajectory points of the planned trajectory to obtain multiple sampling points; Analyze the cutting process and determine the uncut parts on the planned trajectory; The number of sampling points of the uncut part is counted and the cutting time is obtained according to the pre-configured table of points and time correspondence.

[0029] Through the pre-configured point number and time correspondence table, the planned trajectory is associated with time, thereby realizing the time analysis of the cutting process.

[0030] In one embodiment, when the laser cutting mechanism is configured to cut the same plate, based on the first position and the cutting time, the operating parameters of the conveying device between the feeding mechanism and the cutting position are adjusted, including: Determine the conveying time according to the first position, the working parameters of the conveying device between the current feeding mechanism and the cutting position, and the end position of the configuration of the laser cutting mechanism close to the feeding mechanism side; When the conveying time is less than or equal to the cutting time, the working parameters are adjusted downward according to the time difference; When the conveying time is longer than the cutting time, the working parameters are adjusted upward according to the time difference; The downward adjustment of the working parameters and the upward adjustment of the working parameters are respectively based on a pre-configured first adjustment table and a pre-configured second adjustment table.

[0031] The space between the first position and the end position is the space that needs to be transported. The working parameters represent the transport speed of the transport device, which is used to determine the transport time. If the transport time is less than or equal to the cutting time, it means that the plate will arrive in advance, so the working parameters need to be lowered, that is, the transport speed of the transport device needs to be lowered; if the transport time is greater than the cutting time, it means that the plate will arrive later, so the working parameters need to be increased, that is, the transport speed of the transport device needs to be increased; in summary, whether it is an increase or a decrease, it is to achieve that after the previous plate is cut, the next cut plate is in place on one side waiting for cutting.

[0032] In one embodiment, when the laser cutting mechanism is configured to cut different plates, the operating parameters of the conveying device between the feeding mechanism and the cutting position are adjusted based on the first position and the cutting time, including: Determine the conveying time according to the first position, the working parameters of the conveying device between the current feeding mechanism and the cutting position and the end position of the configuration of the first laser cutting mechanism close to the feeding mechanism side; The maximum cutting time corresponding to each laser cutting mechanism is used as the threshold time; When the delivery time is less than or equal to the threshold time, the working parameters are adjusted downward according to the time difference; When the delivery time is greater than the threshold time, the working parameters are adjusted upward according to the time difference; The downward adjustment of the working parameters and the upward adjustment of the working parameters are respectively based on a pre-configured first adjustment table and a pre-configured second adjustment table.

[0033] The configuration rules of the end point position are as follows: The end position is determined by translating from the boundary of the clamped sheet toward the feeding mechanism based on the reaction time of the clamping device of the laser cutting mechanism and the maximum speed limit of the conveying device.

[0034] Among them, a plate material distribution mechanism is arranged in front of the feeding mechanism, and the plate material distribution mechanism distributes the plates to be cut evenly according to the configuration of the laser cutting mechanism.

[0035] This embodiment is a configuration of a plurality of laser cutting mechanisms with a feeding mechanism, that is, on a conveying device, the front end is a feeding mechanism, and the rear end is sequentially arranged with the laser cutting mechanism; at this time, the working condition is more complicated; the plates are grouped into three by a configured uniform distribution mechanism, and the spacing of the components is uniformly distributed to be consistent with the spacing between the laser cutting mechanisms; the end position is moved outward for a distance to avoid the occasional early arrival of the plate; the specific configuration of the end position is: based on the reaction time of the clamping device of the laser cutting mechanism and the maximum speed limit of the conveying device, the end position is determined by translating from the boundary of the clamped plate toward the feeding mechanism.

[0036] The present invention also provides a feeding and cutting coordinated control system for a laser panel splitter, which is applied to a laser panel splitter, such as Figure 3 As shown, it includes: a position positioning module 1, a time prediction module 2 and an adjustment module 3; wherein the position positioning module 1 analyzes the monitoring data of the feeding mechanism to determine the first position of the plate to be cut; the time prediction module 2 analyzes the cutting process of the plate being cut to predict the cutting time; the adjustment module 3 adjusts the working parameters of the conveying device between the feeding mechanism and the cutting position based on the first position and the cutting time.

[0037] The position positioning module analyzes the monitoring data of the feeding mechanism to determine the first position of the plate to be cut, including: The first image acquired by the image acquisition device configured by the feeding mechanism is placed in a pre-configured coordinate system, and the plate to be cut is positioned by the coordinates in the coordinate system to obtain a first position.

[0038] The time prediction module analyzes the cutting process of the plate being cut and predicts the cutting time, including: Sampling the trajectory points of the planned trajectory to obtain multiple sampling points; Analyze the cutting process and determine the uncut parts on the planned trajectory; Count the number of sampling points of the uncut part and obtain the cutting time according to the pre-configured table of points and time correspondence; Wherein, when the laser cutting mechanism is configured to cut the same plate, the adjustment module adjusts the working parameters of the conveying device between the feeding mechanism and the cutting position based on the first position and the cutting time, including: Determine the conveying time according to the first position, the working parameters of the conveying device between the current feeding mechanism and the cutting position, and the end position of the configuration of the laser cutting mechanism close to the feeding mechanism side; When the conveying time is less than or equal to the cutting time, the working parameters are adjusted downward according to the time difference; When the conveying time is longer than the cutting time, the working parameters are adjusted upward according to the time difference; The downward adjustment of the working parameters and the upward adjustment of the working parameters are respectively based on a pre-configured first adjustment table and a pre-configured second adjustment table.

[0039] Wherein, when the laser cutting mechanism is configured to cut different plates, the adjustment module adjusts the working parameters of the conveying device between the feeding mechanism and the cutting position based on the first position and the cutting time, including: Determine the conveying time according to the first position, the working parameters of the conveying device between the current feeding mechanism and the cutting position and the end position of the configuration of the first laser cutting mechanism close to the feeding mechanism side; The maximum cutting time corresponding to each laser cutting mechanism is used as the threshold time; When the delivery time is less than or equal to the threshold time, the working parameters are adjusted downward according to the time difference; When the delivery time is greater than the threshold time, the working parameters are adjusted upward according to the time difference; The downward adjustment of the working parameters and the upward adjustment of the working parameters are respectively based on a pre-configured first adjustment table and a pre-configured second adjustment table.

[0040] The configuration rules for the end point position are as follows: The end position is determined by translating from the boundary of the clamped sheet toward the feeding mechanism based on the reaction time of the clamping device of the laser cutting mechanism and the maximum speed limit of the conveying device.

[0041] Among them, a plate material distribution mechanism is arranged in front of the feeding mechanism, and the plate material distribution mechanism distributes the plates to be cut evenly according to the configuration of the laser cutting mechanism.

[0042] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. A feeding and cutting coordinated control method for a laser panel splitter, applied to a laser panel splitter, characterized in that: include: Analyze the monitoring data of the feeding mechanism to determine the first position of the plate to be cut; Analyze the cutting process of the plate being cut and predict the cutting time; Based on the first position and the cutting time, operating parameters of a conveying device between the feeding mechanism and the cutting position are adjusted.

2. The feeding and cutting coordinated control method of the laser panel splitter according to claim 1, characterized in that: The laser panel separator includes: a main body, a conveying mechanism, at least one image acquisition mechanism, at least one laser cutting mechanism and a main controller. The conveying mechanism is used to convey the panels to be cut. The image acquisition mechanism and the laser cutting mechanism are associated one-to-one and are arranged above the conveying mechanism. The laser cutting mechanism can cut different panels separately or collaboratively cut the same panel.

3. The feeding and cutting coordinated control method of a laser panel splitter according to claim 1, characterized in that: Analyze the monitoring data of the feeding mechanism to determine the first position of the plate to be cut, including: The first image acquired by the image acquisition device configured by the feeding mechanism is placed in a pre-configured coordinate system, and the plate to be cut is positioned by the coordinates in the coordinate system to obtain a first position.

4. The feeding and cutting coordinated control method of a laser panel splitter according to claim 1, characterized in that: Analyze the cutting process of the plate being cut and predict the cutting time, including: Sampling the trajectory points of the planned trajectory to obtain multiple sampling points; Analyze the cutting process and determine the uncut parts on the planned trajectory; The number of sampling points of the uncut part is counted and the cutting time is obtained according to the pre-configured table of points and time correspondence.

5. The feeding and cutting coordinated control method of a laser panel splitter according to claim 2, characterized in that: When the laser cutting mechanism is configured to cut the same plate, based on the first position and the cutting time, the operating parameters of the conveying device between the feeding mechanism and the cutting position are adjusted, including: Determine the conveying time according to the first position, the working parameters of the conveying device between the current feeding mechanism and the cutting position, and the end position of the configuration of the laser cutting mechanism close to the feeding mechanism side; When the conveying time is less than or equal to the cutting time, the working parameters are adjusted downward according to the time difference; When the conveying time is longer than the cutting time, the working parameters are adjusted upward according to the time difference; The downward adjustment of the working parameters and the upward adjustment of the working parameters are respectively based on a pre-configured first adjustment table and a pre-configured second adjustment table.

6. The feeding and cutting coordinated control method of a laser panel splitter according to claim 1, characterized in that: When the laser cutting mechanism is configured to cut different plates, based on the first position and the cutting time, the operating parameters of the conveying device between the feeding mechanism and the cutting position are adjusted, including: Determine the conveying time according to the first position, the working parameters of the conveying device between the current feeding mechanism and the cutting position and the end position of the configuration of the first laser cutting mechanism close to the feeding mechanism side; The maximum cutting time corresponding to each laser cutting mechanism is used as the threshold time; When the delivery time is less than or equal to the threshold time, the working parameters are adjusted downward according to the time difference; When the delivery time is greater than the threshold time, the working parameters are adjusted upward according to the time difference; The downward adjustment of the working parameters and the upward adjustment of the working parameters are respectively based on a pre-configured first adjustment table and a pre-configured second adjustment table.

7. The feeding and cutting coordinated control method of a laser panel splitter according to claim 5 or 6, characterized in that: The configuration rules for the end point position are as follows: The end position is determined by translating from the boundary of the clamped sheet toward the feeding mechanism based on the reaction time of the clamping device of the laser cutting mechanism and the maximum speed limit of the conveying device.

8. A feeding and cutting coordinated control system for a laser panel splitter, applied to a laser panel splitter, characterized in that: include: Position positioning module, time prediction module and adjustment module; wherein the position positioning module analyzes the monitoring data of the feeding mechanism to determine the first position of the plate to be cut; the time prediction module analyzes the cutting process of the plate being cut to predict the cutting time; The adjustment module adjusts the working parameters of the conveying device between the feeding mechanism and the cutting position based on the first position and the cutting time.

9. The feeding and cutting coordinated control system of the laser panel splitter according to claim 8, characterized in that: The position positioning module analyzes the monitoring data of the feeding mechanism to determine the first position of the plate to be cut, including: The first image acquired by the image acquisition device configured by the feeding mechanism is placed in a pre-configured coordinate system, and the plate to be cut is positioned by the coordinates in the coordinate system to obtain a first position.

10. The feeding and cutting coordinated control system of the laser panel splitter according to claim 8, characterized in that: The time prediction module analyzes the cutting process of the plate being cut and predicts the cutting time, including: Sampling the trajectory points of the planned trajectory to obtain multiple sampling points; Analyze the cutting process and determine the uncut parts on the planned trajectory; The number of sampling points of the uncut part is counted and the cutting time is obtained according to the pre-configured table of points and time correspondence.

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