Automatic disordered pattern polishing equipment for workpiece surface

Abstract

The invention belongs to the field of polishing equipment, and particularly relates to workpiece surface automatic disordered pattern polishing equipment which comprises a machine table, a sliding table, a polishing assembly and a driving mechanism, a first guide rail is arranged on the machine table, the sliding table is in guiding connection with the first guide rail, and the polishing assembly and the driving mechanism are arranged on a vertical frame and located above the sliding table. The vertical frame is fixedly connected with the machine table, the sliding table has the degree of freedom for carrying a workpiece to move front and back along the first guide rail and to pass through the grinding assembly in a reciprocating mode, and the grinding assembly has the degree of freedom for shaking relative to the moving path of the sliding table through a driving mechanism. The equipment can obviously improve the production efficiency of polishing the disordered grains on the surface of the workpiece, enables the surface of the workpiece to keep a consistent polishing effect, improves the polishing quality, and meets the high requirement of the semiconductor industry on the polishing quality.

Description

Technical Field

[0001] The present invention belongs to the field of polishing equipment, and particularly relates to an automatic random pattern polishing equipment for the surface of workpieces. Background Art

[0002] In the semiconductor industry, surface treatment technology has an important impact on the performance and reliability of equipment and components. As a unique surface treatment process, random pattern polishing is gradually being widely used in the semiconductor manufacturing process due to its advantages in reducing reflection, improving wear resistance and anti-fingerprint properties. Specifically, random pattern polishing technology has significant application value in the surface treatment of semiconductor equipment components. For example, in the manufacturing of key components such as vacuum chambers, fixtures and transfer devices, through random pattern polishing treatment, the surface reflection and glare can be effectively reduced, and the operation accuracy and stability of the equipment can be improved. In addition, random pattern polishing also has the function of preventing electrostatic accumulation, which is particularly important in the semiconductor manufacturing environment sensitive to static electricity, and helps to reduce the risk of damage to sensitive devices caused by electrostatic discharge (ESD). With the continuous progress of semiconductor technology and the increasing requirements for manufacturing processes, the application prospect of random pattern polishing technology is very broad. Its application in the surface treatment of optical components and detectors can significantly improve the optical performance and detection accuracy, meeting the requirements of high-precision manufacturing. At the same time, the application of random pattern polishing in the external decoration and marking treatment of equipment and tools not only improves the aesthetics and durability of products, but also enhances their scratch resistance and anti-fingerprint properties, facilitating daily maintenance and use.

[0003] Currently, random pattern polishing usually relies on manual holding of polishing equipment to polish the surface of workpieces to be polished, with low polishing efficiency. To avoid the appearance of linear polishing patterns, operators need to maintain a specific hand posture and force angle for a long time, and repeatedly change the angle to polish the workpiece. Continuous work is likely to cause hand tremors, affecting the polishing quality, and has high requirements for the work experience and skills of operators; the polishing quality is overly dependent on individual experience, and it is difficult for even the same operator to maintain consistent polishing effects. Therefore, the production method of manual polishing is difficult to meet the urgent needs of the semiconductor industry for high-precision, standardized and large-scale production. Summary of the Invention

[0004] In order to solve the problems existing in the above-mentioned prior art, the present invention provides an automatic random pattern polishing equipment for the surface of workpieces, which can significantly improve the production efficiency of random pattern polishing of the workpiece surface, keep the polishing effect of the workpiece surface consistent, improve the polishing quality, and meet the high requirements of the semiconductor industry for polishing quality.

[0005] The specific technical solution adopted by the present invention is:

[0006] An automatic random texture polishing device for the surface of a workpiece, including a machine table. The key lies in that it also includes a sliding table, a grinding component and a driving mechanism. A first guide rail is arranged on the machine table. The sliding table is connected to the first guide rail in a guiding manner. The grinding component and the driving mechanism are respectively arranged on a vertical frame and located above the sliding table. The vertical frame is fixedly connected to the machine table. The sliding table has the freedom to carry the workpiece to move back and forth along the first guide rail and reciprocate past the grinding component. The grinding component has the freedom to shake relative to the moving path of the sliding table by means of the driving mechanism.

[0007] The grinding component is arranged on a substrate. The substrate is connected to the vertical frame in a guiding manner by means of a second guide rail. The substrate is drivingly connected to the driving mechanism and has the freedom to move along the second guide rail. The second guide rail is horizontally arranged and perpendicular to the first guide rail.

[0008] The driving mechanism includes a translation driving component. The translation driving component includes a first motor, a speed reducer and a crank and connecting rod mechanism arranged in sequence along the power transmission direction. The first motor is installed on the vertical frame. The connecting rod in the crank and connecting rod mechanism is connected to the substrate.

[0009] The grinding component is a pneumatic grinding group, including a driving cylinder and a pneumatic grinding head. The driving cylinder is arranged on the substrate. The driving end of the driving cylinder is drivingly connected to the pneumatic grinding head.

[0010] Or, the grinding component is a mechanical grinding group, including a polishing belt. The polishing belt sequentially passes through a driving wheel and a tensioning wheel installed on an installation frame. A second motor and a supporting wheel are also arranged on the installation frame. The supporting wheel is arranged between the driving wheel and the tensioning wheel. The polishing belt passes through the supporting wheel and is pressed by the supporting wheel against the surface of the workpiece. The driving wheel is drivingly connected to the power output end of the second motor.

[0011] The driving mechanism also includes a rotation driving component. The rotation driving component includes a first gear, a second gear and a pair of first racks. The first gear and the second gear are arranged between the two first racks and are both meshed with the two first racks. A third guide rail is horizontally arranged on the substrate. The first rack is connected to the third guide rail in a guiding manner and is arranged on the vertical frame by means of the substrate. A third motor is fixedly connected to the third guide rail. The power output end of the third motor is drivingly connected to the first gear. The installation frame is fixedly connected to the second gear.

[0012] A dust suction nozzle is arranged on the second gear. The opening of the dust suction nozzle faces the material throwing direction of the grinding component. The dust suction nozzle is connected to the negative pressure end of a vacuum cleaner.

[0013] The described mounting frame is provided with a swing arm and a first telescopic cylinder. The support wheel is arranged at the end of the swing arm. The swing arm is hinged to the mounting frame by means of a first hinge shaft. The two ends of the first telescopic cylinder are respectively connected to the mounting frame and the swing arm. The first hinge shaft is arranged parallel to the axial direction of the support wheel. The swing arm has the freedom to swing on the mounting frame by means of the telescopic movement of the first telescopic cylinder. The support wheel has the freedom to move up and down relative to the sliding table by means of the swing of the swing arm.

[0014] The described tensioning wheel is hinged to the mounting frame by means of a movable connecting rod. The mounting frame is provided with a second telescopic cylinder. The fixed end of the second telescopic cylinder is hinged to the mounting frame by means of a second hinge shaft. The overhanging end of the second telescopic cylinder is hinged to the movable connecting rod by means of a third hinge shaft. The second hinge shaft and the third hinge shaft are arranged parallel to the axial direction of the tensioning wheel.

[0015] The beneficial effects of the present invention are as follows:

[0016] In the present invention, the workpiece is fixed on the sliding table, and the sliding table slides on the machine table to make the workpiece reciprocate past the grinding assembly. The grinding assembly automatically polishes the workpiece; the grinding assembly has the freedom to shake relative to the moving path of the sliding table by means of the driving mechanism, and can realize the random pattern polishing of the surfaces of workpieces with different sizes.

[0017] The present invention can realize high-speed, continuous and stable polishing operations. Compared with traditional manual polishing, the automatic random pattern polishing equipment can complete a large number of polishing tasks in a shorter time, significantly improve production efficiency, shorten the production cycle, and improve the polishing quality.

[0018] When the grinding assembly is a mechanical grinding group, the surface of the workpiece is polished by a polishing belt. The first gear drives the two racks to move in opposite directions to form a rubbing action. The second gear rotates around its own axis due to the rubbing action of the two racks. The rotation of the second gear changes the angle between the polishing belt and the moving direction of the sliding table, realizing the shaking of the polishing belt relative to the moving path of the sliding table; by changing the angle, the movement trajectory of the polishing belt on the surface of the workpiece will change, and the surface of the workpiece can be polished from multiple angles instead of being limited to polishing in a single direction. The traces generated by multi-angle polishing intersect and overlap with each other, so as to visually reduce or eliminate obvious polishing lines, making the surface of the workpiece look smoother and more delicate, and improving the surface quality.

[0019] A dust suction nozzle is provided on the second gear. The dust suction nozzle is connected to the negative pressure end of the vacuum cleaner. The position of the dust suction nozzle and the polishing belt is always fixed. Through the action of the negative pressure of the vacuum cleaner, the debris generated during the process of the polishing belt polishing the surface of the workpiece is absorbed and collected, reducing the possibility of debris entering between the inner side of the polishing belt and the driving wheel, the tensioning wheel and the supporting wheel, preventing the inner side of the polishing belt or the driving wheel, the tensioning wheel and the supporting wheel from being scratched and damaged, and also being beneficial to keeping the working environment clean, avoiding secondary pollution of the workpiece surface by the debris, and being beneficial to improving the polishing quality. Description of the Drawings

[0020] Figure 1 It is a schematic structural diagram of Embodiment 1;

[0021] Figure 2 It is an exploded view of the grinding assembly, the driving mechanism and the vertical frame in Embodiment 1;

[0022] Figure 3 It is an assembly schematic diagram of the third rack and the fourth motor;

[0023] Figure 4 It is an assembly schematic diagram of the grinding assembly, the rotating driving assembly and the substrate in Embodiment 2;

[0024] Figure 5 For Figure 4 A-A sectional view;

[0025] Figure 6 It is a schematic structural diagram of the grinding assembly of Embodiment 2;

[0026] In the drawings, 1, machine table; 2, sliding table; 3, first guide rail; 4, vertical frame; 5, driving cylinder; 6, pneumatic grinding head; 7, substrate; 8, second guide rail; 9, first motor; 10, reducer; 11, crank connecting rod mechanism, 1101, connecting rod; 12, polishing belt; 13, mounting bracket; 14, driving wheel; 15, tensioning wheel; 16, second motor; 17, supporting wheel; 18, first gear; 19, second gear; 20, first rack; 21, third guide rail; 22, third motor; 23, dust suction nozzle; 24, swing arm; 25, first telescopic cylinder; 26, first hinge shaft; 27, movable connecting rod; 28, second telescopic cylinder; 29, second hinge shaft; 30, third hinge shaft; 31, second rack; 32, third gear; 34, fourth motor. The double-headed arrow indicates the moving direction of the sliding table. Detailed Embodiments

[0027] The present invention will be further described below in conjunction with the drawings and specific embodiments:

[0028] Embodiment 1, as shown in Figure 1As shown in the figure, this embodiment relates to an automatic random texture polishing device for the surface of a workpiece, which includes a machine table 1, a sliding table 2, a grinding assembly, and a driving mechanism. A first guide rail 3 is provided on the machine table 1, and the sliding table 2 is guidingly connected to the first guide rail 3. The grinding assembly and the driving mechanism are respectively arranged on a vertical frame 4 and above the sliding table 2. The vertical frame 4 is fixedly connected to the machine table 1. The sliding table 2 has the freedom to carry the workpiece and move back and forth along the first guide rail 3 and reciprocate past the grinding assembly. The grinding assembly contacts the surface of the workpiece and grinds the surface of the workpiece. The grinding assembly has the freedom to shake relative to the movement path of the sliding table 2 by means of the driving mechanism, thereby realizing the automatic polishing of the random texture of the workpiece.

[0029] As Figure 1 , Figure 3 shown in the figure, a second rack 31 meshing with a third gear 32 is fixedly provided at the lower end of the sliding table 2. A fourth motor 34 is installed on the machine table 1, and the power output end of the fourth motor 34 is connected to the third gear 32. The fourth motor 34 drives the third gear 32 to rotate, thereby driving the second rack 31. Driven by the fourth motor 34, the sliding table 2 moves along the first guide rail 3. The sliding table 2 and the fourth motor 34 can also be power-transmitted through transmission methods such as a synchronous belt, chain drive, or wire rope drive.

[0030] The grinding assembly is arranged on a substrate 7. The substrate 7 is guidingly connected to the vertical frame 4 by means of a second guide rail 8. The substrate 7 is drivingly connected to the driving mechanism and has the freedom to move along the second guide rail 8. The second guide rail 8 is horizontally arranged and perpendicular to the first guide rail 3. The grinding assembly translates on the vertical frame 4 along the second guide rail 8 by means of the substrate 7, so that the moving direction of the grinding assembly relative to the sliding table 2 moves left and right, realizing uniform grinding of the surface of the workpiece and being able to adapt to the grinding work of workpieces of different sizes.

[0031] As Figure 2 shown in the figure, the driving mechanism includes a translation driving assembly. The translation driving assembly includes a first motor 9, a speed reducer 10, and a crank and connecting rod mechanism 11 arranged in sequence along the power transmission direction. The first motor 9 is installed on the vertical frame 4, and the connecting rod 1101 in the crank and connecting rod mechanism 11 is connected to the substrate 7.

[0032] The first motor 9 drives the speed reducer 10 to rotate, thereby driving the crank and connecting rod mechanism 11 to move. The connecting rod 1101 drives the substrate 7 to move left and right along the second guide rail 8, and the grinding of workpieces of different widths can be realized. The connecting rod 1101 can be selected as a telescopic rod, and the speed and frequency of the reciprocating movement of the substrate 7 can be adjusted by adjusting the length of the connecting rod 1101.

[0033] As Figure 1 , Figure 2As shown in the figure, in this embodiment, the grinding assembly is a pneumatic grinding unit. A plurality of grinding assemblies are arranged on the substrate 7. The grinding assembly includes a driving cylinder 5 and a pneumatic grinding head 6. The driving cylinder 5 is arranged on the substrate 7, and the driving end of the driving cylinder 5 is drivingly connected to the pneumatic grinding head 6. Among them, the cylinder 5 is a 3-axis cylinder with a guide rod, which has good rigid stability. By adjusting the air pressure, the pressure of the pneumatic grinding head 6 on the workpiece during grinding can be controlled, ensuring a good and consistent grinding effect, and it can adapt to workpieces of different heights. The cylinder 5 and the pneumatic grinding head 6 are sequentially connected by means of an adapter plate and a shock pad. The shock pad is a polyurethane or rubber block shock pad arranged between the adapter plate and the pneumatic grinding head 6, which can reduce the vibration noise caused by the rotational friction of the pneumatic grinding head 6.

[0034] The pneumatic grinding head 6 rotates concentrically or eccentrically on the cylinder 5 to achieve different grinding effects. Eccentric rotation is suitable for surface grinding and polishing of different thicknesses. Its movement trajectory has a wide coverage range and a large number of repeated grinding times, and a relatively flat and fine grinding surface can be obtained. Concentric rotation is suitable for polishing workpieces with higher surface flatness.

[0035] The automatic random pattern polishing equipment of this embodiment can achieve high-speed, continuous and stable polishing operations. Compared with traditional manual polishing, the automatic random pattern polishing equipment can complete a large number of polishing tasks in a shorter time, significantly improve production efficiency, shorten the production cycle, achieve the consistency and stability of polishing quality, make the surface of the polished workpiece smoother and finer, and meet the high-quality requirements. On the other hand, the automatic random pattern polishing equipment realizes automatic operation, greatly reduces manual participation, and thus reduces labor costs.

[0036] Embodiment 2 is different from Embodiment 1 in that the grinding assembly is a mechanical grinding unit, and the driving mechanism further includes a rotational driving component.

[0037] In this embodiment, the pneumatic grinding unit in Embodiment 1 is replaced by a mechanical grinding unit, and a plurality of pneumatic grinding units are arranged on the substrate 7. As Figures 4-6 shown, the grinding assembly in this embodiment includes a polishing belt 12. The polishing belt 12 sequentially passes through a driving wheel 14 and a tensioning wheel 15 installed on a mounting frame 13. A second motor 16 and a supporting wheel 17 are further arranged on the mounting frame 13. The supporting wheel 17 is arranged between the driving wheel 14 and the tensioning wheel 15. The polishing belt 12 passes through the supporting wheel 17, and the supporting wheel 17 provides a supporting effect on the polishing belt 12 to press the polishing belt 12 against the surface of the workpiece. The driving wheel 14 is drivingly connected to the power output end of the second motor 16. Driven by the second motor 16, the driving wheel 14 rotates around its own axis, thereby driving the polishing belt 12 to move. The supporting wheel 17 makes the polishing belt 12 fully contact with the surface of the workpiece, improving the polishing effect.

[0038] Preferably, in this embodiment, two support wheels 17 are provided on the mounting bracket 13. When the two support wheels 17 are at the same height, the polishing belt 12 between the two support wheels 17 is horizontally arranged, and the surface of the workpiece can be polished in a wide range.

[0039] The driving mechanism further includes a rotation driving assembly. The rotation driving assembly includes a first gear 18, a second gear 19 and a pair of first racks 20. The first gear 18 and the second gear 19 are arranged between the two first racks 20 and are both engaged with the two first racks 20. The first gear 18 is installed on the substrate 7. A clamping plate for forming a height-direction limit for the second gear 19 is also provided on the substrate 7. A third guide rail 21 is horizontally arranged on the substrate 7. The first rack 20 is connected to the third guide rail 21 in a guiding manner and is arranged on the vertical frame 4 by means of the substrate 7. A third motor 22 is fixedly connected to the third guide rail 21. The power output end of the third motor 22 is in transmission connection with the first gear 18. The mounting bracket 13 is fixedly connected to the second gear 19. The clamping plates are respectively attached to and supported on the upper and lower end faces of the second gear 19. The second gear 19 can rotate around its own axis between the clamping plates.

[0040] The third motor 22 drives the first gear 18 to rotate forward and backward, so that the two first racks 20 move in opposite directions. The first rack 20 drives the second gear 19 to rotate forward or backward, so that the polishing belt 12 on the second gear 19 swings around the axis of the second gear 19, enabling the grinding assembly to not only move left and right horizontally, but also change the angle between the polishing belt 12 and the moving direction of the sliding table 2. By changing the angle, the movement trajectory of the polishing belt 12 on the surface of the workpiece changes, and the surface of the workpiece can be polished at multiple angles, rather than being limited to polishing in a single direction. The traces generated by polishing at multiple angles intersect and overlap, thereby visually reducing or eliminating obvious polishing lines, making the surface of the workpiece look smoother and more delicate, and improving the surface quality.

[0041] The cleanliness requirements for the inner side of the polishing belt 12 and each wheel such as the driving wheel 14, the tensioning wheel 15, and the supporting wheel 17 are relatively high when the polishing belt 12 is driven by a pulley. Once impurities enter between the inner side of the polishing belt 12 and each wheel, it will cause scratches and damage to the inner side of the polishing belt 12 or the driving wheel 14, the tensioning wheel 15, and the supporting wheel 17. A dust suction nozzle 23 is provided on the second gear 19. The opening of the dust suction nozzle 23 faces the material throwing direction of the polishing belt 12. The dust suction nozzle 23 is connected to the negative pressure end of the vacuum cleaner. During the swinging process of the second gear 19, the position of the dust suction nozzle 23 and the polishing belt 12 is always fixed. Through the action of the negative pressure of the vacuum cleaner, the debris generated during the process of the polishing belt 12 polishing the workpiece surface is absorbed and collected, reducing the possibility of debris entering between the inner side of the polishing belt 12 and the driving wheel 14, the tensioning wheel 15, and the supporting wheel 17, preventing the inner side of the polishing belt 12 or the driving wheel 14, the tensioning wheel 15, and the supporting wheel 17 from being scratched and damaged, and also helping to keep the working environment clean, avoiding secondary pollution of the workpiece surface by the debris, and being beneficial to improving the polishing quality.

[0042] Preferably, a swing arm 24 and a first telescopic cylinder 25 are provided on the mounting frame 13. The supporting wheel 17 is arranged at the end of the swing arm 24. In this embodiment, the two supporting wheels 17 are respectively arranged at both ends of the swing arm 24. The middle of the swing arm 24 is hinged to the mounting frame 13 by means of a first hinge shaft 26. Both ends of the first telescopic cylinder 25 are respectively connected to the mounting frame 13 and the swing arm 24. The first hinge shaft 26 is arranged parallel to the axial direction of the supporting wheel 17. The swing arm 24 has the freedom to swing on the mounting frame 13 by means of the telescopic movement of the first telescopic cylinder 25. The supporting wheel 17 has the freedom to move up and down relative to the sliding table 2 by means of the swinging of the swing arm 24. The position of the supporting wheel 17 can be adjusted according to the shape and size of the workpiece, so that the polishing belt 12 can better fit the surface of the workpiece, improving the adaptability and effect of polishing.

[0043] The tensioning wheel 15 is hinged to the mounting frame 13 by means of a movable connecting rod 27. A second telescopic cylinder 28 is provided on the mounting frame 13. The fixed end of the second telescopic cylinder 28 is hinged to the mounting frame 13 by means of a second hinge shaft 29. The overhanging end of the second telescopic cylinder 28 is hinged to the movable connecting rod 27 by means of a third hinge shaft 30. The second hinge shaft 29 and the third hinge shaft 30 are arranged parallel to the axial direction of the tensioning wheel 15. The telescopic length of the second telescopic cylinder 28 can be automatically adjusted according to the tensioning condition of the polishing belt 12, so as to change the position of the tensioning wheel 15 and adapt to the swinging of the swing arm 24, ensuring that the polishing belt 12 is always in a suitable tensioning state.

Claims

1. An automatic random-grain polishing device for a workpiece surface, comprising a machine platform (1), characterized in that: The machine also comprises a slide (2), a grinding assembly and a driving mechanism. A first guide rail (3) is arranged on the machine (1). The slide (2) is connected to the first guide rail (3) in a guiding manner. The grinding assembly and the driving mechanism are respectively arranged on a vertical frame (4) and located above the slide (2). The vertical frame (4) is fixedly connected to the machine (1). The slide (2) has the freedom to carry the workpiece and move forward and backward along the first guide rail (3) and reciprocate through the grinding assembly. The grinding assembly has the freedom to shake relative to the moving path of the slide (2) with the help of the driving mechanism.

2. The automatic random-grain polishing equipment for workpiece surface according to claim 1, characterized in that: The polishing assembly is arranged on a base plate (7), the base plate (7) is connected to the vertical frame (4) by means of a second guide rail (8), the base plate (7) is connected to the driving mechanism and has the freedom to move along the second guide rail (8), and the second guide rail (8) is arranged horizontally and is perpendicular to the first guide rail (3).

3. The automatic random-grain polishing equipment for workpiece surface according to claim 2, characterized in that: The driving mechanism comprises a translation driving assembly, which comprises a first motor (9), a reducer (10) and a crank-connecting rod mechanism (11) arranged in sequence along a power transmission direction, the first motor (9) being mounted on a vertical frame (4), and a connecting rod (1101) in the crank-connecting rod mechanism (11) being connected to a base plate (7).

4. The automatic random-grain polishing equipment for workpiece surface according to claim 2, characterized in that: The grinding assembly is a pneumatic grinding assembly, comprising a driving cylinder (5) and a pneumatic grinding head (6). The driving cylinder (5) is arranged on a base plate (7), and the driving end of the driving cylinder (5) is drivingly connected to the pneumatic grinding head (6).

5. The automatic random-grain polishing equipment for workpiece surface according to claim 2, characterized in that: The grinding assembly is a mechanical grinding assembly, comprising a polishing belt (12), wherein the polishing belt (12) passes through a driving wheel (14) and a tensioning wheel (15) mounted on a mounting frame (13) in sequence, wherein the mounting frame (13) is further provided with a second motor (16) and a supporting wheel (17), wherein the supporting wheel (17) is arranged between the driving wheel (14) and the tensioning wheel (15), wherein the polishing belt (12) passes through the supporting wheel (17) and is pressed against the surface of a workpiece by the supporting wheel (17), and wherein the driving wheel (14) is transmission-connected to a power output end of the second motor (16).

6. The automatic random-grain polishing device for workpiece surface according to claim 5, characterized in that: The driving mechanism further comprises a rotation driving assembly, the rotation driving assembly comprising a first gear (18), a second gear (19) and a pair of first racks (20), the first gear (18) and the second gear (19) being arranged between the two first racks (20) and meshing with the two first racks (20), a third guide rail (21) being arranged horizontally on the base plate (7), the first rack (20) being guidedly connected to the third guide rail (21) and being arranged on the vertical frame (4) with the aid of the base plate (7), a third motor (22) being fixedly connected to the third guide rail (21), a power output end of the third motor (22) being transmission-connected to the first gear (18), and the mounting frame (13) being fixedly connected to the second gear (19).

7. The automatic random-grain polishing device for workpiece surface according to claim 6, characterized in that: The second gear (19) is provided with a dust suction nozzle (23), the opening of the dust suction nozzle (23) faces the throwing direction of the grinding assembly, and the dust suction nozzle (23) is connected to the negative pressure end of the vacuum cleaner.

8. The automatic random-grain polishing device for workpiece surface according to claim 5, characterized in that: The mounting frame (13) is provided with a swing arm (24) and a first telescopic cylinder (25); the support wheel (17) is arranged at the end of the swing arm (24); the swing arm (24) is hinged to the mounting frame (13) by means of a first hinge shaft (26); the two ends of the first telescopic cylinder (25) are respectively connected to the mounting frame (13) and the swing arm (24); the first hinge shaft (26) is arranged parallel to the axial direction of the support wheel (17); the swing arm (24) has the freedom to swing on the mounting frame (13) by means of the extension and retraction of the first telescopic cylinder (25); the support wheel (17) has the freedom to rise and fall relative to the slide table (2) by means of the swing of the swing arm (24).

9. The automatic random-grain polishing device for workpiece surface according to claim 5, characterized in that: The tensioning wheel (15) is hinged to the mounting frame (13) by means of a movable connecting rod (27); a second telescopic cylinder (28) is arranged on the mounting frame (13); a fixed end of the second telescopic cylinder (28) is hinged to the mounting frame (13) by means of a second hinge shaft (29); an overhanging end of the second telescopic cylinder (28) is hinged to the movable connecting rod (27) by means of a third hinge shaft (30); the second hinge shaft (29), the third hinge shaft (30) and the axial direction of the tensioning wheel (15) are arranged parallel.

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