A fixture applicable to rapid pressing and sealing of a vertical continuous electroplating device

Abstract

The present invention relates to the technical field of electroplating equipment, and discloses a fixture suitable for rapid pressing and sealing of a vertical continuous electroplating equipment. The device includes a fixture main body, a wafer main body and a sealing plate. One side of the fixture main body is fixedly installed with a conductive sheet and a wire. An installation groove is formed in the middle of the interior of the fixture main body. The device further includes: a toothed ring is snap-fitted in the installation groove, a sealing structure is arranged inside the toothed ring, and a pressing structure is arranged on the side of the sealing plate close to the fixture main body; the sealing structure includes an adjusting unit and a pressing unit. The adjusting unit includes an arc-shaped strip slidably installed inside the toothed ring, and the pressing unit includes a pressing groove and an inclined block, which solves the problem that when fixing the sealing back plate, multi-point positioning and unlocking are still required. When the vertical continuous electroplating equipment is used, it is not convenient to quickly install and disassemble the sealing back plate, reducing the continuity of use and production efficiency.

Description

Technical Field

[0001] The invention relates to the technical field of electroplating equipment, and in particular to a hanger suitable for rapid pressing and sealing of vertical continuous electroplating equipment. Background Art

[0002] In the wafer product electroplating equipment, the wafer is placed into the electroplating tank liquid through a hanger for the electroplating process. Only one side of the wafer is electroplated at a time, and the other side needs to be sealed and protected.

[0003] For example, a positive pressure wafer electroplating hanger that is easy to clean is disclosed with the announcement number CN216006066U. The surface of the hanger substrate has a cavity for placing wafer products, and a sealing back plate is fastened and fixed on the cavity. The inner side of the sealing back plate is provided with a protrusion corresponding to the shape of the cavity, and the outer edge of the sealing back plate rests on the surface of the hanger substrate. A plurality of locking mechanisms for locking the sealing back plate are provided on the hanger substrate. The locking arm can rotate and rise around the locking cam, driving the lower surface of the locking arm to press against the outer side of the sealing back plate. When the locking arm moves to the lower limit position along the cam profile of the locking cam, a gap is maintained between the lower surface of the locking arm and the surface of the hanger substrate, which can improve production. While improving processing efficiency, the quality of electroplating is improved, the impact of locking mechanism wear on electrolyte and products is reduced, and excessive residue of liquid medicine, etc. can be avoided in the hanger. However, when fixing the sealing back plate, the device still needs to rotate and position the locking cam separately, and the operation is relatively cumbersome. After the electroplating is completed, it is necessary to rotate and unlock it in sequence. When the vertical continuous electroplating equipment in the prior art is used, it is not convenient to quickly install and disassemble the sealing back plate, which reduces the continuity of use and is not suitable for use in vertical continuous electroplating equipment. There are limitations, and the usual wafer hanger is only suitable for wafers of the same size, which is not convenient for positioning wafers of different thicknesses, and the scope of application is also small.

[0004] Therefore, a hanger suitable for rapid pressing and sealing of vertical continuous electroplating equipment is proposed to solve the above-mentioned problems. Summary of the Invention

[0005] The purpose of the present invention is to provide a hanger suitable for rapid pressing and sealing of vertical continuous electroplating equipment, so as to solve the problem that when fixing the sealing back plate, multi-point positioning and unlocking are still required. When the vertical continuous electroplating equipment is used, it is inconvenient to quickly install and disassemble the sealing back plate, which reduces the continuity of use and production efficiency.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a rack suitable for rapid press-fit sealing in vertical continuous electroplating equipment, comprising a rack body, a wafer body, and a sealing plate; a conductive sheet and a wire are fixedly mounted on one side of the rack body; and a mounting groove is provided in the middle of the interior of the rack body;

[0007] It further includes:

[0008] A toothed ring is snap - fitted inside the installation groove. A sealing structure is arranged inside the toothed ring. A pressing structure is arranged on the side of the sealing plate close to the fixture body. A pressing plate is installed on the side of the sealing plate far from the fixture body.

[0009] The sealing structure includes an adjusting unit and a pressing unit. The adjusting unit includes an arc - shaped bar slidably installed inside the toothed ring. One side of the arc - shaped bar is fixedly connected with a slide bar and a push block. The other side of the arc - shaped bar is fixedly connected with a sliding column, and the sliding column is slidably installed with the toothed ring.

[0010] The pressing unit includes a pressing groove and an inclined block. The inclined block is slidably connected with the pressing groove. The inclined surface of the inclined block abuts against the push block. One end of the inclined block is fixedly installed with a pressing block, and the pressing block is located inside the toothed ring. A sealing gasket is also installed inside the toothed ring.

[0011] Preferably, arc - shaped grooves are symmetrically opened inside the toothed ring. A fixing ring is fixedly installed inside the arc - shaped grooves. The arc - shaped bar is slidably connected with the arc - shaped grooves. The slide bar is slidably connected with the fixing ring. A first spring is sleeved outside the slide bar. One end of the first spring is fixedly connected with the arc - shaped bar, and the other end of the first spring is fixedly connected with the fixing ring.

[0012] By adopting the above - mentioned technical solution, the pressing plate drives the positioning groove and the sealing plate to rotate. The sealing plate drives the sliding column to rotate clockwise, which is convenient for positioning the wafer body through the pressing block. After electroplating is completed, the pressing plate drives the sealing plate to rotate counterclockwise, and the pressing block releases the clamping of the wafer body, which is convenient for removing the wafer body.

[0013] Preferably, there are no less than three arc - shaped grooves. The number of the fixing rings and the arc - shaped bars is the same as that of the arc - shaped grooves. The arc - shaped grooves are communicated with the pressing grooves. Spring two is symmetrically and fixedly installed on the inner wall of the pressing grooves. One end of spring two far from the inner wall of the pressing grooves is fixedly connected with the inclined block.

[0014] By adopting the above - mentioned technical solution, the sliding column drives the arc - shaped bar and the slide bar to slide inside the arc - shaped grooves. The arc - shaped bar compresses the first spring, and the slide bar drives the push block to slide. The push block extrudes the inclined surface of the inclined block, so that the inclined block stretches the second spring and approaches the wafer body.

[0015] Preferably, a fixing bolt is slidably installed inside the pressing block. The fixing bolt is threadedly connected with the inclined block. Limited - position grooves are symmetrically opened on the side of the toothed ring close to the sealing plate. The number of the limited - position grooves is the same as that of the arc - shaped grooves. The sliding column is slidably connected with the limited - position grooves. The sealing gasket fits with the inner side of the toothed ring.

[0016] By adopting the above technical solution, the fixing bolt facilitates the replacement of abutting blocks of different sizes, so as to adapt to the size of the wafer body for use.

[0017] Preferably, the pressing structure includes a clamping groove opened on one side of the sealing plate. The number of the clamping grooves is the same as that of the sliding columns. The sliding columns are inserted and fixed in the clamping grooves. Inner grooves are symmetrically opened on one side of the sealing plate. A third spring is fixedly installed inside the inner grooves. One end of the third spring close to the toothed ring is fixedly connected with a sliding rod. The sliding rod is slidably connected with the inner groove. Two sliding rods are symmetrically arranged.

[0018] By adopting the above technical solution, when the sliding columns are inserted into the clamping grooves, the sealing plate will drive the sliding columns to rotate when it rotates, which is convenient for subsequent clamping and positioning of the wafer body.

[0019] Preferably, the two sliding rods are fixedly connected with the same pressing ring. The pressing ring is located outside the sealing plate. A plurality of groups of mounting blocks are symmetrically and fixedly connected to one side of the sealing plate close to the pressing ring. Each group of mounting blocks includes two symmetrically arranged ones. A connecting rod is rotatably connected between two adjacent mounting blocks.

[0020] By adopting the above technical solution, the sealing plate drives the sliding rods and the pressing ring to move, so that the pressing ring contacts the wafer body. At this time, the elastic force of the third spring drives the pressing ring to press the wafer body, which is convenient for the wafer body to press the sealing gasket.

[0021] Preferably, there are no less than three groups of the mounting blocks. One end of the connecting rod far from the mounting block is fixedly connected with a pressing roller. The pressing roller is attached to the pressing ring. A fourth spring is fixedly connected to one side of the connecting rod close to the sealing plate.

[0022] By adopting the above technical solution, the elastic force of the fourth spring presses the connecting rod, and the connecting rod drives the pressing roller to press the pressing ring, maintaining the stable pressing of the pressing ring on the wafer body and reducing the looseness of the wafer body.

[0023] Preferably, a positioning groove is opened on the other side of the sealing plate. A positioning rod is fixedly connected to one side of the pressing plate close to the sealing plate. The positioning rod is engaged with the positioning groove. Adaptation rods are symmetrically and fixedly connected to one side of the sealing plate. Adaptation grooves are symmetrically opened on one side of the hanging tool body close to the sealing plate. The adaptation rods are slidably connected with the adaptation grooves.

[0024] By adopting the above technical solution, when the adaptation rods are inserted into the adaptation grooves, the adaptation rods slide inside the adaptation grooves when the sealing plate rotates, without blocking the sealing plate.

[0025] Preferably, the conductive sheet is fixedly installed on the fixture body through bolts. One end of the wire is fixedly connected to the conductive sheet, and the other end of the wire is fixedly connected with a connecting portion. A side groove is formed on the side of the tooth ring away from the sealing plate. The connecting portion is snap-fitted with the side groove, and the wire contacts the wafer body through the connecting portion.

[0026] By adopting the above technical solution, the cooperation of the wire and the connecting portion facilitates the subsequent electroplating operation of the wafer body.

[0027] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0028] 1. A sealing structure is provided. When installing the wafer body, the operator places the wafer body inside the tooth ring. One side of the wafer body is attached to the sealing pad. The sliding column is inserted into the card slot, and the adapter rod is inserted into the adapter slot. Then, the pressing plate is connected to an external rotary pressing device. The rotary pressing device is an electric push rod driving a servo motor to move. The output end of the servo motor is fixedly connected to the pressing plate to realize the movement and rotation of the pressing plate. The positioning rod on the pressing plate is inserted into the positioning slot. Then, the pressing plate drives the positioning slot and the sealing plate to rotate. The sealing plate drives the sliding column to rotate clockwise. The sliding column slides inside the limiting slot, and the sliding column drives the arc-shaped strip and the sliding strip to slide inside the arc-shaped slot. The arc-shaped strip compresses the first spring, and the sliding strip drives the push block to slide. The push block presses the inclined surface of the inclined block, causing the inclined block to stretch the second spring and approach the wafer body. The inclined block drives the abutting block to clamp the outside of the wafer body, facilitating the positioning of the wafer body by multiple symmetric abutting blocks. After electroplating is completed, the pressing plate drives the sealing plate to rotate counterclockwise. The elastic force of the second spring drives the inclined block and the abutting block to reset. The elastic force of the first spring drives the arc-shaped strip and the sliding column to reset, causing the abutting block to release the clamping of the wafer body and facilitating the removal of the wafer body, solving the problem that when fixing the sealing backplane, multi-point positioning and unlocking are still required, which is not convenient for quickly installing and disassembling the sealing backplane during the use of the vertical continuous electroplating equipment, reducing the use continuity and production efficiency.

[0029] 2. A pressing structure is provided. When the sliding column is inserted into the card slot, the sealing plate drives the sliding rod and the pressing ring to move, so that the pressing ring contacts the wafer body. At this time, the elastic force of the third spring drives the sliding rod and the pressing ring to press the wafer body, and the wafer body presses the sealing gasket again. The sealing gasket deforms under the pressure, and the gap between the wafer body and the tooth ring is compressed, forming a good sealing effect, which can effectively prevent the leakage of the electroplating solution. Moreover, the elastic force of the fourth spring presses the connecting rod, and the connecting rod drives the pressing roller to press the pressing ring, maintaining the stable pressing of the pressing ring on the wafer body, reducing the looseness of the wafer body, adapting to the use of different thickness dimensions of the wafer body, facilitating the subsequent uniform electroplating operation, meeting the rapid pressing and sealing requirements of the vertical continuous electroplating equipment, improving the electroplating efficiency and quality. The fixture body is made of corrosion-resistant insulating material and has a frame shape, with a certain strength and rigidity, which can ensure bearing the weight of the wafer body and the impact force of the electroplating solution during the electroplating process, and playing an insulating role to prevent current leakage at the same time. The first spring, the second spring, the third spring and the fourth spring are made of high-strength stainless steel springs, which have good elasticity and corrosion resistance, can provide stable pressure, so that during the electroplating process, the springs continuously provide stable pressure, ensuring the reliability of the seal. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 is a schematic diagram of the three-dimensional overall structure of the present invention;

[0031] Figure 2 is an exploded schematic diagram of the sealing plate installation structure of the present invention;

[0032] Figure 3 is a schematic diagram of the tooth ring installation structure of the present invention;

[0033] Figure 4 is of the present invention Figure 3 the enlarged schematic diagram of part A in;

[0034] Figure 5 is a schematic diagram of the connecting part installation structure of the present invention;

[0035] Figure 6 is a schematic diagram of the cross-sectional structure of the tooth ring of the present invention;

[0036] Figure 7 is of the present invention Figure 6 the enlarged schematic diagram of part B in;

[0037] Figure 8 is a schematic diagram of the arc-shaped strip installation structure of the present invention;

[0038] Figure 9 is of the present invention Figure 8 the enlarged schematic diagram of part C in;

[0039] Figure 10 is a schematic diagram of the card slot opening structure of the present invention;

[0040] Figure 11 This is a schematic diagram of the cross-sectional structure of the sealing plate of the present invention;

[0041] Figure 12 For the present invention Figure 11 The enlarged structural diagram at D in the middle;

[0042] Figure 13 This is a schematic diagram of removing the sealing plate of the present invention.

[0043] In the figure: 1. Hanger body; 2. Conductive sheet; 3. Wire; 4. Mounting groove; 5. Gear ring; 6. Wafer body; 7. Sealing structure; 71. Arc groove; 72. Fixing ring; 73. Arc bar; 74. Sliding bar; 75. Spring 1; 76. Push block; 77. Sliding column; 78. Clamping groove; 79. Oblique block; 710. Spring 2; 711. Clamping block; 712. Fixing bolt; 713. Limiting groove; 714, sealing gasket; 8, sealing plate; 9, clamping structure; 91, card slot; 92, inner groove; 93, spring three; 94, sliding rod; 95, clamping ring; 96, mounting block; 97, connecting rod; 98, clamping roller; 99, spring four; 910, positioning groove; 911, adapter rod; 912, adapter groove; 10, pressure plate; 11, connecting part; 12, side groove; 13, positioning rod. DETAILED DESCRIPTION

[0044] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0045] See also Figures 1 - 3 The present invention provides a technical solution: a hanger suitable for rapid pressing and sealing of vertical continuous electroplating equipment, comprising a hanger body 1, a wafer body 6 and a sealing plate 8, a conductive sheet 2 and a wire 3 are fixedly installed on one side of the hanger body 1, and an installation groove 4 is opened in the middle of the interior of the hanger body 1.

[0046] A gear ring 5 is snap-fitted into the interior of the mounting groove 4 , and a sealing structure 7 is provided on the inner side of the gear ring 5 .

[0047] The sealing structure 7 includes an adjustment unit and a tightening unit. The adjustment unit includes an arc-shaped bar 73 slidably mounted inside the gear ring 5. One side of the arc-shaped bar 73 is fixedly connected to a sliding bar 74 and a push block 76. The other side of the arc-shaped bar 73 is fixedly connected to a sliding column 77. The sliding column 77 is slidably mounted on the gear ring 5.

[0048] An arc-shaped groove 71 is symmetrically formed inside the gear ring 5. A fixing ring 72 is fixedly installed inside the arc-shaped groove 71. The arc-shaped strip 73 is slidably connected to the arc-shaped groove 71, the sliding strip 74 is slidably connected to the fixing ring 72. A first spring 75 is sleeved outside the sliding strip 74. One end of the first spring 75 is fixedly connected to the arc-shaped strip 73, and the other end of the first spring 75 is fixedly connected to the fixing ring 72.

[0049] There are no less than three arc-shaped grooves 71. The number of the fixing rings 72 and the arc-shaped strips 73 is the same as that of the arc-shaped grooves 71. The arc-shaped groove 71 communicates with the abutting groove 78. Spring two 710 is symmetrically and fixedly installed on the inner wall of the abutting groove 78. One end of the spring two 710 away from the inner wall of the abutting groove 78 is fixedly connected to the inclined block 79.

[0050] The abutting unit includes an abutting groove 78 and an inclined block 79. The inclined block 79 is slidably connected to the abutting groove 78. The inclined surface of the inclined block 79 abuts against the push block 76. One end of the inclined block 79 is fixedly installed with an abutting block 711. The abutting block 711 is located inside the gear ring 5. A sealing gasket 714 is also installed inside the gear ring 5.

[0051] A fixing bolt 712 is slidably installed inside the abutting block 711. The fixing bolt 712 is threadedly connected to the inclined block 79. Limit grooves 713 are symmetrically formed on one side of the gear ring 5 close to the sealing plate 8. The number of the limit grooves 713 is the same as that of the arc-shaped grooves 71. The sliding column 77 is slidably connected to the limit groove 713. The sealing gasket 714 fits against the inner side of the gear ring 5.

[0052] The conductive sheet 2 is fixedly installed on the fixture body 1 by bolts. One end of the wire 3 is fixedly connected to the conductive sheet 2. The other end of the wire 3 is fixedly connected with a connecting portion 11. A side groove 12 is formed on one side of the gear ring 5 away from the sealing plate 8. The connecting portion 11 is snap-fitted with the side groove 12. The wire 3 contacts the wafer body 6 through the connecting portion 11.

[0053] Example 1: As Figures 4 - 9 shown, when installing the wafer body 6, the operator places the wafer body 6 inside the gear ring 5. One side of the wafer body 6 fits against the sealing gasket 714. The sliding column 77 is inserted into the card slot 91, and the fitting rod 911 is inserted into the fitting groove 912. Then, the pressing plate 10 is connected to an external rotary pressing device. The rotary pressing device is an electric push rod driving a servo motor to move. The output end of the servo motor is fixedly connected to the pressing plate 10 to realize the movement and rotation of the pressing plate 10.

[0054] The positioning rod 13 on the pressure plate 10 is inserted into the positioning groove 910, and then the pressure plate 10 drives the positioning groove 910 and the sealing plate 8 to rotate, and the sealing plate 8 drives the sliding column 77 to rotate clockwise, and the sliding column 77 slides inside the limit groove 713, and the sliding column 77 drives the arc bar 73 and the slide bar 74 to slide inside the arc groove 71, and the arc bar 73 compresses the spring 1 75, and the slide bar 74 drives the push block 76 to slide, and the push block 76 squeezes the inclined surface of the inclined block 79, so that the inclined block 79 stretches the spring 2 710 and approaches the wafer body 6, and the inclined block 79 drives the tightening block 711 to clamp the outside of the wafer body 6, so as to facilitate the positioning of the wafer body 6 through multiple symmetrical tightening blocks 711.

[0055] After the electroplating is completed, the pressure plate 10 drives the sealing plate 8 to rotate counterclockwise, and the elastic force of the spring 2 710 drives the inclined block 79 and the tightening block 711 to reset, and the elastic force of the spring 1 75 drives the arc bar 73 and the sliding column 77 to reset, so that the tightening block 711 releases the clamping of the wafer body 6, making it convenient to remove the wafer body 6, solving the problem of multi-point positioning and unlocking when fixing the sealing backplate. When the vertical continuous electroplating equipment is used, it is not convenient to quickly install and disassemble the sealing backplate, which reduces the continuity of use and production efficiency.

[0056] A clamping structure 9 is provided on the side of the sealing plate 8 close to the hanger body 1, and a pressure plate 10 is installed on the side of the sealing plate 8 away from the hanger body 1. The clamping structure 9 includes a card slot 91 opened on one side of the sealing plate 8. The number of the card slots 91 is the same as the sliding column 77. The sliding column 77 is plugged and fixed to the card slot 91. An inner groove 92 is also symmetrically opened on one side of the sealing plate 8. A spring three 93 is fixedly installed inside the inner groove 92. The end of the spring three 93 close to the gear ring 5 is fixedly connected to a slide rod 94. The slide rod 94 is slidably connected to the inner groove 92, and two slide rods 94 are symmetrically provided.

[0057] The two sliding rods 94 are fixedly connected to the same clamping ring 95, and the clamping ring 95 is located on the outside of the sealing plate 8. The sealing plate 8 is symmetrically fixedly connected to one side of the clamping ring 95 with multiple groups of mounting blocks 96. Each group of mounting blocks 96 includes two symmetrically arranged ones, and a connecting rod 97 is rotatably connected between the two adjacent mounting blocks 96.

[0058] There are no less than three groups of mounting blocks 96, and one end of the connecting rod 97 away from the mounting block 96 is fixedly connected to a clamping roller 98, which fits the clamping roller 98 and the clamping ring 95, and the side of the connecting rod 97 close to the sealing plate 8 is fixedly connected to a spring four 99.

[0059] On the other side of the sealing plate 8, a positioning groove 910 is provided. On the side of the pressing plate 10 close to the sealing plate 8, a positioning rod 13 is fixedly connected. The positioning rod 13 is engaged with the positioning groove 910. On one side of the sealing plate 8, matching rods 911 are symmetrically and fixedly connected. On the side of the fixture body 1 close to the sealing plate 8, matching grooves 912 are symmetrically provided. The matching rods 911 are slidably connected with the matching grooves 912.

[0060] Embodiment 2: As Figures 10 - 13 shown, when the sliding column 77 is inserted into the clamping groove 91, the sealing plate 8 drives the sliding rod 94 and the pressing ring 95 to move, so that the pressing ring 95 contacts the wafer body 6. At this time, the elastic force of the third spring 93 drives the sliding rod 94 and the pressing ring 95 to press the wafer body 6. The wafer body 6 further presses the sealing gasket 714. The sealing gasket 714 deforms under the pressure. The gap between the wafer body 6 and the gear ring 5 is compressed, forming a good sealing effect and effectively preventing the leakage of the electroplating solution.

[0061] Moreover, the elastic force of the fourth spring 99 presses the connecting rod 97, and the connecting rod 97 drives the pressing roller 98 to press the pressing ring 95, maintaining the stable pressing of the pressing ring 95 on the wafer body 6, reducing the looseness of the wafer body 6, adapting to the use of different thickness dimensions of the wafer body 6, facilitating subsequent uniform electroplating operations, meeting the rapid pressing and sealing requirements of the vertical continuous electroplating equipment, and improving the electroplating efficiency and quality.

[0062] The fixture body 1 is made of corrosion-resistant insulating material and is in a frame shape, having a certain strength and rigidity, which can ensure bearing the weight of the wafer body 6 and the impact force of the electroplating solution during the electroplating process, and at the same time playing an insulating role to prevent current leakage. The first spring 75, the second spring 710, the third spring 93 and the fourth spring 99 are made of high-strength stainless steel springs, having good elasticity and corrosion resistance, and can provide stable pressure, so that during the electroplating process, the springs continuously provide stable pressure, ensuring the reliability of the seal.

[0063] Working principle: When using this device, first, as Figures 1 - 13As shown, the operator places the wafer body 6 inside the toothed ring 5. The sliding column 77 is inserted into the card slot 91, and the adapter rod 911 is inserted into the adapter slot 912. Then, the pressing plate 10 is connected to an external rotary pressing device, and the positioning rod 13 on the pressing plate 10 is inserted into the positioning slot 910. Next, the pressing plate 10 drives the positioning slot 910 and the sealing plate 8 to rotate. The sealing plate 8 drives the sliding column 77 to rotate clockwise, facilitating the positioning of the wafer body 6 through multiple symmetrically arranged abutting blocks 711. After electroplating is completed, the pressing plate 10 drives the sealing plate 8 to rotate counterclockwise, causing the abutting blocks 711 to release the clamping of the wafer body 6, facilitating the removal of the wafer body 6. When the sealing plate 8 drives the sliding rod 94 and the pressing ring 95 to move, the pressing ring 95 presses the wafer body 6, and the wafer body 6 further presses the sealing gasket 714. The connecting rod 97 drives the pressing roller 98 to press the pressing ring 95, maintaining the stable pressing of the pressing ring 95 on the wafer body 6, reducing the looseness of the wafer body 6, and facilitating subsequent uniform electroplating operations.

[0064] The content not described in detail in this specification belongs to the prior art well-known to those skilled in the art.

[0065] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A fixture suitable for rapid pressing and sealing of a vertical continuous electroplating device, comprising a fixture main body (1), a wafer main body (6) and a sealing plate (8). One side of the fixture main body (1) is fixedly installed with a conductive sheet (2) and a wire (3), and an installation groove (4) is opened in the middle of the interior of the fixture main body (1); Characterized in that, It further includes: A toothed ring (5) is snap-fitted inside the installation groove (4). A sealing structure (7) is arranged inside the toothed ring (5). A pressing structure (9) is arranged on the side of the sealing plate (8) close to the fixture main body (1). A pressing plate (10) is installed on the side of the sealing plate (8) away from the fixture main body (1); The sealing structure (7) includes an adjusting unit and a pressing unit. The adjusting unit includes an arc-shaped strip (73) slidably installed inside the toothed ring (5). One side of the arc-shaped strip (73) is fixedly connected with a sliding strip (74) and a pushing block (76). The other side of the arc-shaped strip (73) is fixedly connected with a sliding column (77), and the sliding column (77) is slidably installed with the toothed ring (5); Arc-shaped grooves (71) are symmetrically opened inside the toothed ring (5). A fixing ring (72) is fixedly installed inside the arc-shaped grooves (71). The arc-shaped strip (73) is slidably connected with the arc-shaped grooves (71). The sliding strip (74) is slidably connected with the fixing ring (72). A first spring (75) is sleeved outside the sliding strip (74). One end of the first spring (75) is fixedly connected with the arc-shaped strip (73), and the other end of the first spring (75) is fixedly connected with the fixing ring (72); The pressing unit includes a pressing groove (78) and an inclined block (79). The inclined block (79) is slidably connected with the pressing groove (78). The inclined surface of the inclined block (79) abuts against the pushing block (76). One end of the inclined block (79) is fixedly installed with a pressing block (711). The pressing block (711) is located inside the toothed ring (5). A sealing gasket (714) is also installed inside the toothed ring (5); There are no less than three arc-shaped grooves (71). The number of the fixing rings (72) and the arc-shaped strips (73) is the same as that of the arc-shaped grooves (71). The arc-shaped grooves (71) are communicated with the pressing grooves (78). Spring two (710) is symmetrically and fixedly installed on the inner wall of the pressing groove (78). One end of the spring two (710) away from the inner wall of the pressing groove (78) is fixedly connected with the inclined block (79); A fixing bolt (712) is slidably installed inside the pressing block (711). The fixing bolt (712) is threadedly connected with the inclined block (79). Limiting grooves (713) are symmetrically opened on the side of the toothed ring (5) close to the sealing plate (8). The number of the limiting grooves (713) is the same as that of the arc-shaped grooves (71). The sliding column (77) is slidably connected with the limiting grooves (713). The sealing gasket (714) is attached to the inner side of the toothed ring (5).

2. The fixture for rapid press-fitting and sealing applicable to vertical continuous electroplating equipment according to claim 1, wherein: The pressing structure (9) includes a card slot (91) opened on one side of the sealing plate (8). The number of the card slots (91) is the same as that of the sliding columns (77). The sliding columns (77) are inserted and fixed with the card slots (91). An inner slot (92) is symmetrically opened on one side of the sealing plate (8). A third spring (93) is fixedly installed inside the inner slot (92). One end of the third spring (93) close to the toothed ring (5) is fixedly connected with a sliding rod (94). The sliding rod (94) is slidably connected with the inner slot (92). Two sliding rods (94) are symmetrically arranged.

3. The fixture applicable to rapid press-fitting and sealing of a vertical continuous electroplating device according to claim 2, wherein: The two sliding rods (94) are fixedly connected with the same pressing ring (95). The pressing ring (95) is located outside the sealing plate (8). A plurality of groups of mounting blocks (96) are symmetrically and fixedly connected to one side of the sealing plate (8) close to the pressing ring (95). Each group of the mounting blocks (96) includes two symmetrically arranged ones. A connecting rod (97) is rotatably connected between two adjacent mounting blocks (96).

4. The fixture applicable to rapid pressing and sealing of a vertical continuous electroplating device according to claim 3, characterized in that: There are no less than three groups of the mounting blocks (96). One end of the connecting rod (97) away from the mounting block (96) is fixedly connected with a pressing roller (98). The pressing roller (98) is in fit with the pressing ring (95). A fourth spring (99) is fixedly connected to one side of the connecting rod (97) close to the sealing plate (8).

5. The fixture for rapid pressing and sealing applicable to vertical continuous electroplating equipment according to claim 4, wherein: A positioning slot (910) is opened on the other side of the sealing plate (8). A positioning rod (13) is fixedly connected to one side of the pressing plate (10) close to the sealing plate (8). The positioning rod (13) is engaged with the positioning slot (910). A pair of adapting rods (911) are symmetrically and fixedly connected to one side of the sealing plate (8). A pair of adapting slots (912) are symmetrically opened on one side of the fixture body (1) close to the sealing plate (8). The adapting rods (911) are slidably connected with the adapting slots (912).

6. The fixture applicable to rapid pressing and sealing of a vertical continuous electroplating device according to claim 1, wherein: The conductive sheet (2) is fixedly installed on the fixture body (1) through bolts. One end of the wire (3) is fixedly connected with the conductive sheet (2). The other end of the wire (3) is fixedly connected with a connecting part (11). A side slot (12) is opened on one side of the toothed ring (5) away from the sealing plate (8). The connecting part (11) is engaged with the side slot (12). The wire (3) is in contact with the wafer body (6) through the connecting part (11).

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