Sensor and method for manufacturing sensor

Abstract

The sensor comprises a pressure sensor chip, a first chip and a substrate, and the first chip is used for converting signals; the pressure sensor chip and the first chip are electrically connected with the substrate; the substrate is provided with a groove, and at least part of at least one of the pressure sensor chip and the first chip is located in the groove. The substrate is provided with a groove, and at least part of at least one of the pressure sensor chip and the first chip is located in the groove, so that the substrate has a limiting effect on at least one of the pressure sensor chip and the first chip, and the integration stability of at least one of the pressure sensor chip and the first chip and the substrate is improved. According to the manufacturing method of the sensor, the groove is formed in the substrate, the groove has a limiting effect on at least one of the pressure sensor chip and the first chip, and the integration stability of the at least one of the pressure sensor chip and the first chip and the substrate is improved.

Description

Technical Field

[0001] The present application relates to the field of sensor technology, and in particular to a sensor and a method for manufacturing the sensor. Background Art

[0002] At present, in order to improve the sensitivity of pressure sensors, two chips are used to measure pressure and convert pressure signals into electrical signals for transmission. The implantation of the two chips will increase the size of the sensor. Therefore, in related technologies, integrating the two chips into a substrate can reduce the size of the sensor. The stability of the integration of the two chips and the substrate is very important. Summary of the invention

[0003] The present application provides a sensor, which includes a pressure sensor chip, a first chip and a substrate, wherein the first chip is used to convert signals; the pressure sensor chip and the first chip are both electrically connected to the substrate; the substrate has a groove, and at least a portion of at least one of the pressure sensor chip and the first chip is located in the groove.

[0004] In the sensor of the present application, a groove is designed on the substrate, and at least a portion of at least one of the pressure sensor chip and the first chip is located in the groove, so that the substrate has a limiting effect on at least one of the pressure sensor chip and the first chip, thereby improving the stability of the integration of at least one of the pressure sensor chip and the first chip with the substrate.

[0005] A method for manufacturing a sensor comprises the following steps:

[0006] A groove is formed on a substrate, at least a portion of the pressure sensor chip and at least a portion of the first chip are placed in the groove, and the pressure sensor chip and the first chip are electrically connected to the substrate respectively; a connecting portion is deposited on the substrate; glue is filled into the groove, and the glue is cured.

[0007] In the manufacturing method of the sensor of the present application, a groove is formed on the substrate, so that the substrate has a limiting and fixing effect on at least one of the pressure sensor chip and the first chip, thereby improving the stability of the integration of at least one of the pressure sensor chip and the first chip with the substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 A schematic cross-sectional view of a sensor provided in one embodiment of the present application;

[0009] Figure 2 A schematic cross-sectional view of a sensor provided in one embodiment of the present application. DETAILED DESCRIPTION

[0010] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the following exemplary embodiments do not represent all implementations consistent with the present application. Instead, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.

[0011] At present, in related sensors, the pressure sensor chip and the chip for converting signals are integrated into one body to reduce the volume of the sensor, but the stability of the chip after integration is poor. In the present application, the sensor has a first direction H, which is parallel to the height direction of the sensor.

[0012] The sensor includes a pressure sensor chip 1, a first chip 2 and a substrate 3. The first chip 2 is used to convert signals. The pressure sensor chip 1 and the first chip 2 are both electrically connected to the substrate 3. The substrate 3 has a groove 31. At least a portion of at least one of the pressure sensor chip 1 and the first chip 2 is located in the groove 31. The groove 31 is equivalent to fixing at least one of the pressure sensor chip 1 and the first chip 2. When the chip is tilted, the wall of the groove 31 provides support for the chip, so that the stability of the chip integrated into the substrate 3 is improved.

[0013] The substrate 3 has a first surface 32 and a second surface 33. Along the first sensor direction H, the first surface 32 and the second surface 33 are respectively located at two sides of the substrate 3. The groove 31 is formed from the first surface to the inside of the substrate.

[0014] In one embodiment, the pressure sensor chip 1 includes a MEMS chip, and the first chip 2 includes an ASIC chip. The MEMS chip is responsible for sensing signals and converting the measured quantity into changes in resistance, capacitance, and other signals; the ASIC chip is responsible for converting signals such as capacitance and resistance into electrical signals, which involves functions such as signal conversion and amplification. In one embodiment, the substrate 3 is a silicon adapter board.

[0015] In order to further improve the stability of the integration of the pressure sensor chip 1, the first chip 2 and the substrate 3, in one embodiment, as Figure 1 As shown, the groove 31 includes a first groove 311 and a second groove 312. The pressure sensor chip 1 is at least partially located in the first groove 311, and the first chip 2 is at least partially located in the second groove 312. There is a gap d between the first groove 311 and the second groove 312. The separate arrangement of the first groove 311 and the second groove 312 can respectively fix the stability of the integration of the pressure sensor chip 1 and the first chip 2 with the substrate 3. The first groove 311 is formed by being recessed from the first surface to the inside of the substrate, and the second groove 312 is formed by being recessed from the first surface to the inside of the substrate.

[0016] Along the direction of the first direction H of the vertical sensor, the interval d is greater than or equal to 3 mm and less than or equal to 5 mm. To increase the stability of the integration of the pressure sensor chip 1 and the first chip 2 with the substrate 3, in one embodiment, as Figure 1 shown, the interval d is greater than or equal to 3 mm. Among them, the interval d is solid. An interval of 3 mm or more can increase the load-bearing capacity of the first groove 311 and the second groove 312, avoiding structural failure or rupture caused by a too short interval d resulting in a thin wall. At the same time, to control the volume of the sensor, the interval d is less than or equal to 5 mm to prevent the sensor volume from increasing due to an overly large interval d.

[0017] Furthermore, to improve the firmness between the pressure sensor chip 1 and the first chip 2 and the groove 31, in one embodiment, as Figure 1 shown, the sensor includes an adhesive layer 4. The adhesive layer 4 is at least partially located in the groove 31, and at least a part of at least one of the pressure sensor chip 1 and the first chip 2 is located within the adhesive layer 4. Among them, the adhesive layer 4 includes an epoxy adhesive layer or a Teflon layer.

[0018] In one embodiment, as Figure 1 shown, the adhesive layer 4 can be simultaneously located in the first groove 311 and the second groove 312 to improve the stability of the pressure sensor chip 1 and the first chip 2 in the first groove 311 and the second groove 312.

[0019] In one embodiment, the sensitive resistor 12 includes a pressure-sensitive resistor. In one embodiment, as Figure 1 shown, along the first direction H of the sensor, the height of the adhesive layer 4 exceeds at least half of the height of at least one of the first chip 2 and the pressure sensor chip 1. The pressure sensor chip 1 includes a top surface 11, and the top surface 11 is away from the substrate 3 relative to the adhesive layer 4. Since the pressure sensor chip 1 includes a pressure-sensitive film 111 and a sensitive resistor 12, the sensitive resistor 12 is connected to the pressure-sensitive film 111, and the pressure-sensitive film 111 is connected to the top surface 11. The pressure sensor chip 1 includes a sensitive resistor 12, and the pressure will be transmitted to the sensitive resistor 12 through the pressure-sensitive film 111. To prevent the adhesive layer 4 from affecting the transmission of the pressure, the height of the adhesive layer 4 does not exceed the top surface 11.

[0020] To enable the pressure sensor chip 1 to detect accurately, the housing 5 has a second hole 52. The second hole 52 communicates with the inner cavity 53, and the second hole 52 communicates with the outside. Define the plane perpendicular to the first direction as the projection plane. Along the first direction H, the positive projection of the pressure-sensitive film 111 on the projection plane is at least partially located within the positive projection of the wall of the second hole 52 on the projection plane. That is to say, the pressure can enter directly through the second hole 52 to contact the pressure-sensitive film 111 and be transmitted to the sensitive resistor 12. In one embodiment, as Figure 2As shown, the number of the second holes 52 is not limited to one and can be multiple small holes to prevent a large hole from causing the return stroke to enter the inner cavity 53.

[0021] In one embodiment, for example, Figure 1 As shown, the sensor has an inner cavity 53, and the pressure sensor chip 1 is at least partially located outside the inner cavity 53; the sensor includes a housing 5, and the housing 5 forms at least part of the wall of the inner cavity 53. The housing 5 has a first hole 51, the first hole 51 communicates with the inner cavity 53, and the first hole 51 communicates with the outside. Glue is injected into the inner cavity 53 from the first hole 51. Further, perpendicular to the first direction H, the first hole 51 needs to be away from the pressure sensor chip 1 and the first chip 2.

[0022] In one embodiment, for example, Figure 1 As shown, the substrate 3 includes a body part 34 and a connecting part 7. The connecting part 7 is embedded in the body part 34. The connecting part 7 includes a conductive material, and the conductive material is copper. Both the pressure sensor chip 1 and the first chip 2 are electrically connected to the connecting part 7. The connecting part 7 is connected to the substrate 3. Along the first direction H, the pressure sensor chip 1 and the substrate 3 are respectively located at both ends of the connecting part 7, and the first chip 2 and the substrate 3 are respectively located at both ends of the connecting part 7. In order to make the stress between the substrate 3 and the pressure sensor chip 1 and the first chip 2 smaller and the reliability of the pressure sensor chip 1 and the first chip 2 higher, the connecting part 7 includes RDL.

[0023] Further, in one embodiment, for example, Figure 1 As shown, the sensor includes a first solder ball 71 and a second solder ball 72. Along the first direction H, the first solder ball 71 and the second solder ball 72 are closer to the substrate 3 relative to the top surface 11. The first solder ball 71 is connected to the connecting part 7, and the first solder ball 71 is connected to the pressure sensor chip 1. The second solder ball 72 is connected to the connecting part 7, and the second solder ball 72 is connected to the first chip 2.

[0024] In one embodiment, the sensor further includes a PCB board 8. The connecting part 7 is electrically connected to the PCB board 8. Along the first direction H of the sensor, the pressure sensor chip 1 and the PCB board 8 are respectively located at both ends of the PCB board 8.

[0025] In one embodiment, for example, Figure 1 As shown, the pressure sensor chip 1 is a back pressure sensor chip.

[0026] In one embodiment, for example, Figure 2 As shown, the pressure sensor chip 1 is a positive pressure sensor chip.

[0027] A manufacturing method of a pressure sensor according to the present application includes the following steps: forming a groove 31 on a substrate 3, and depositing a connection portion 7 on the substrate 3; placing at least a part of the pressure sensor chip 1 and at least a part of the first chip 2 into the groove 31, and electrically connecting the pressure sensor chip 1 and the first chip 2 to the substrate 3 respectively; filling glue into the groove 31 and curing the glue.

[0028] Further, the groove 31 is obtained by dry etching on the substrate 3, the connection portion 7 is deposited on the substrate 3, the connection portion 7 penetrates the substrate 3, and at least a part of the pressure sensor chip 1 and at least a part of the first chip 2 are placed into the groove 31; along the first direction H of the sensor, one end of the connection portion 7 is connected to a PCB board 8; for the parts of the pressure sensor chip 1 and the first chip 2 and the connection portion 7, an RDL is formed by electroplating on the substrate 3, and photolithography and copper electroplating are continued to form a UMB layer. At this time, Sn balls are implanted through a reflow soldering process to electrically connect the pressure sensor chip 1 and the first chip 2 to the connection portion 7.

[0029] Finally, a glue filling step is carried out. First, the groove 31 is cleaned, and the glue is filled into the groove 31 through a first hole 51. After filling the glue, high-temperature curing is carried out to form a glue layer 4.

[0030] The above are only the preferred embodiments of the present application, and do not impose any form of limitation on the present application. Although the present application has been disclosed above with the preferred embodiments, it is not intended to limit the present application. Any person skilled in the art, without departing from the technical solution of the present application, can make some changes or modifications to the above-disclosed technical content to form equivalent embodiments with equivalent changes. However, as long as it does not depart from the technical solution of the present application, any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present application still fall within the scope of the technical solution of the present application.

Claims

1. A sensor, characterized in that: the sensor includes a pressure sensor chip, a first chip, and a substrate, and the first chip is used for signal conversion; both the pressure sensor chip and the first chip are electrically connected to the substrate; the substrate has a groove, and at least a part of at least one of the pressure sensor chip and the first chip is located in the groove.

2. The sensor according to claim 1, characterized in that: the groove includes a first groove and a second groove, at least a part of the pressure sensor chip is located in the first groove, and at least a part of the first chip is located in the second groove; there is a gap between the first groove and the second groove.

3. The sensor according to claim 2, characterized in that: along the direction perpendicular to the first direction of the sensor, the gap is greater than or equal to 3 mm and less than or equal to 5 mm.

4. The sensor according to claim 1, characterized in that: the sensor includes an adhesive layer, at least a part of the adhesive layer is located in the groove, and at least a part of at least one of the pressure sensor chip and the first chip is located within the adhesive layer.

5. The sensor according to claim 4, characterized in that: along the first direction of the sensor, the height of the adhesive layer exceeds half of the height of at least one of the first chip and the pressure sensor chip, the pressure sensor chip includes a top surface, and the top surface is away from the substrate relative to the adhesive layer, the height of the adhesive layer does not exceed the top surface.

6. The sensor according to claim 1, characterized in that: the sensor has an inner cavity, and at least a part of the pressure sensor chip is located outside the periphery of the inner cavity; the sensor includes a housing, the housing forms at least a part of the wall of the inner cavity, the housing has a first hole, the first hole communicates with the inner cavity, and the first hole communicates with the outside.

7. The sensor according to claim 6, characterized in that: the housing has a second hole, the second hole communicates with the inner cavity, the second hole communicates with the outside, the pressure sensor chip includes a pressure sensing film, the pressure sensor chip includes a sensitive resistor, and the sensitive resistor is connected to the pressure sensing film; defining the plane perpendicular to the first direction as the projection plane, along the first direction, the positive projection of the pressure sensing film on the projection plane is at least partially located within the positive projection of the wall of the second hole on the projection plane.

8. The sensor according to claim 1, characterized in that: the substrate includes a body part and a connecting part, the connecting part is embedded within the body part, the connecting part includes a conductive material, both the pressure sensor chip and the first chip are electrically connected to the connecting part, the connecting part is connected to the substrate, along the first direction, the pressure sensor chip and the substrate are respectively located at both ends of the connecting part, and the first chip and the substrate are respectively located at both ends of the connecting part.

9. The sensor according to claim 8, characterized in that: The sensor includes a first solder ball and a second solder ball. Along the first direction, the first solder ball and the second solder ball are closer to the substrate relative to the top surface. The first solder ball is connected to the connecting portion, the first solder ball is connected to the pressure sensor chip, the second solder ball is connected to the connecting portion, and the second solder ball is connected to the first chip.

10. A manufacturing method of a sensor, characterized in that, it includes the following steps: forming a groove on the substrate, depositing a connecting portion on the substrate; placing at least a part of the pressure sensor chip and at least a part of the first chip into the groove, and electrically connecting the pressure sensor chip and the first chip to the substrate respectively; filling glue into the groove and curing the glue.

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