An optical receiving end and a QSFP56 package 200G DR4 optical module

Abstract

The present invention relates to an optical receiving end, where the RX fiber array is inclinedly distributed, and the lengths of the bare fibers of all the RX fibers in the RX fiber array outside the optical port side are different. The array detector chips are horizontally arranged on the optical port side of the RX fiber array, and the reflecting surfaces of all the bare fibers are aligned and coupled with the multiple photosensitive surfaces of the array detector chips one by one. A QSFP56 package 200G DR4 optical module has an optical transmitting end and an optical receiving end fixed side by side along the width direction of the PCB board. The TX fiber array in the optical transmitting end is horizontally distributed, and the TX fibers of the TX fiber array in the optical transmitting end and the RX fibers of the RX fiber array in the optical receiving end respectively enter the ferrule arranged in the middle relative to the PCB board. The RX fiber array and the TX fiber array are distributed in a constricted shape, and the beam outlet is close to the ferrule. The beneficial effects are: reducing the bending angle of the RX fiber at the root of the RX fiber array, and making it not easy for the RX fiber to break at the root of the RX fiber array.

Description

Technical Field

[0001] The present invention relates to the technical field of optical modules, and particularly relates to an optical receiving end and a QSFP56 package 200G DR4 optical module. Background Art

[0002] The traditional QSFP56 package 200G DR4 optical module is specifically as Figure 1 shown, and it includes: a PCB board, a ferrule, an optical transmitting end, and an optical receiving end. The optical transmitting end and the optical receiving end are arranged side by side along the width direction of the PCB board. Both the optical transmitting end and the optical receiving end have four paths of light. The TX optical fibers of the TX fiber array in the optical transmitting end and the RX optical fibers of the RX fiber array in the optical receiving end respectively enter the ferrule arranged in the middle relative to the PCB board after passing through the optical fiber protective sleeve;

[0003] The optical transmitting end includes: a TX fiber array and four DFB lasers. The TX fiber array is horizontally fixed on the PCB board. On the optical port side of the TX fiber array on the PCB board, one DFB laser is fixed at each of the four channels corresponding to the TX fiber array. Between each DFB laser and the TX fiber array, a lens and an optical isolator are sequentially coupled along the light propagation direction. The lens and the optical isolator are respectively fixed on the PCB board;

[0004] The optical receiving end includes: an RX fiber array and an array detector chip. The RX fiber array is horizontally fixed on the PCB board. The lengths of the bare optical fibers of all the RX optical fibers in the RX fiber array outside the optical port side are the same, that is, the reflection centers of all the bare optical fibers are on the same straight line and the included angle between this straight line and the end face of the optical port side of the RX fiber array is 0°. The array detector chip is arranged on the optical port side of the RX fiber array and fixed on the PCB board. The reflection surfaces of all the bare optical fibers are aligned and coupled with the multiple photosensitive surfaces of the array detector chip one by one. The array detector chip is electrically connected to the TIA chip fixed on the PCB board;

[0005] In this solution, the TX fiber array and the RX fiber array are distributed in parallel. Since the total length of the QSFP56 package 200G DR4 optical module is relatively short, the length of the RX optical fiber is relatively short (usually less than 20 mm). Also, due to the short length of the RX optical fiber and the ferrule being arranged in the middle relative to the PCB board, there is a large bending included angle (usually greater than 15°, as Figure 1 shown, the bending included angle of the RX optical fiber close to the TX fiber array in the RX fiber array at the root of the RX fiber array is 16°, and the bending included angle of the RX optical fiber far from the TX fiber array in the RX fiber array at the root of the RX fiber array is 20°) for the RX optical fiber to enter the ferrule. This large-angle bending easily causes the RX optical fiber to break at the root of the RX fiber array (the substrate and cover plate of the RX fiber array are made of glass material). Summary of the Invention

[0006] The technical problem to be solved by the present invention is to provide an optical receiving end and a QSFP56 package 200G DR4 optical module to overcome the deficiencies in the above-mentioned prior art.

[0007] The technical solution of the present invention to solve the above technical problems is as follows:

[0008] An optical receiving end includes: an RX optical fiber array distributed obliquely, where the bare fiber lengths of all RX optical fibers in the RX optical fiber array outside the optical port side are different, the reflection centers of all bare fibers are on the same straight line, and the angle between this straight line and the end face of the RX optical fiber array on the optical port side is 5° - 15°. An array detector chip is horizontally arranged on the optical port side of the RX optical fiber array, and the reflection surfaces of all bare fibers are aligned and coupled with multiple photosensitive surfaces of the array detector chip one by one.

[0009] The beneficial effects of the present invention are as follows: The RX optical fiber array in the optical receiving end is adjusted from a horizontal distribution to an oblique distribution, while the arrangement of the array detector chip remains the same as in the prior art. When it is applied to a QSFP56 package 200G DR4 optical module, the RX optical fiber array and the TX optical fiber array are no longer parallel but in a contracted distribution, and the beam port is close to the ferrule arranged in the middle relative to the PCB board, so that the bending angle of the RX optical fiber at the root of the RX optical fiber array becomes smaller. At this angle (5° - 15°), specifically: the bending angle of the RX optical fiber at the root of the RX optical fiber array can be reduced to less than 10°, so that the RX optical fiber is not easily broken at the root of the RX optical fiber array, and the arrangement of the array detector chip remains the same as in the prior art, that is, the array detector chip does not need to be obliquely pasted. If the array detector chip is obliquely pasted, the subsequent TIA chip will also be obliquely pasted, resulting in a large difference in the lengths of the high-speed RF lines of the four channels of the TIA chip, thus poor performance and unfriendly layout. Moreover, oblique pasting is more difficult for the mounter than normal pasting. In the present invention, the array detector chip does not need to be obliquely pasted, and the subsequent layout of the high-speed RF lines on the PCB board is friendly.

[0010] On the basis of the above technical solution, the present invention can be further improved as follows.

[0011] Further, the reflection centers of all bare fibers are on the same straight line, and the angle between this straight line and the end face of the RX optical fiber array on the optical port side is 10°.

[0012] The further beneficial effects are as follows: When all the reflection centers of the bare optical fibers are on the same straight line and the included angle between this straight line and the end face of the optical port side of the RX fiber array is 10°, the RX fiber in the RX fiber array close to the TX fiber array has a bending angle of 2° at the root of the RX fiber array, and the RX fiber in the RX fiber array far from the TX fiber array has a bending angle of 6° at the root of the RX fiber array. Compared with the prior art, the bending angle is greatly reduced, so that the RX fiber is not easily broken at the root of the RX fiber array.

[0013] Furthermore, the RX fiber array has four RX fibers.

[0014] Furthermore, the array detector chip has four photosensitive surfaces.

[0015] Furthermore, the reflection surface angle of the bare optical fiber is 40° - 45°.

[0016] Furthermore, the array detector chip is electrically connected to the TIA chip, and the TIA chip is horizontally distributed.

[0017] Based on the above technical solutions, the present invention also provides a QSFP56 package 200G DR4 optical module, including: a PCB board, a ferrule, an optical transmitting end, and an optical receiving end. The optical transmitting end and the optical receiving end are fixedly arranged side by side along the width direction of the PCB board. The TX fiber array in the optical transmitting end is horizontally distributed. The TX fibers of the TX fiber array in the optical transmitting end and the RX fibers of the RX fiber array in the optical receiving end respectively enter the ferrule arranged in the middle relative to the PCB board. The RX fiber array and the TX fiber array are distributed in a contracted shape, and the beam port is close to the ferrule.

[0018] The further beneficial effects are as follows: By making the RX fiber array and the TX fiber array no longer parallel but distributed in a contracted shape, and the beam port is close to the ferrule arranged in the middle relative to the PCB board, the bending angle of the RX fiber at the root of the RX fiber array becomes smaller. At this angle (5° - 15°), specifically: the bending angle of the RX fiber at the root of the RX fiber array can be reduced to less than 10°, so that the RX fiber is not easily broken at the root of the RX fiber array. The arrangement of the array detector chip and the TIA chip remains the same as in the prior art, that is, the array detector chip and the TIA chip do not need to be tilted for soldering. If the array detector chip is tilted for soldering, the subsequent TIA chip will also be tilted for soldering, resulting in a large difference in the lengths of the high-speed RF lines of the four channels of the TIA chip, thus poor performance and unfriendly layout. And tilting for soldering is more difficult for the soldering machine than normal soldering. In the present invention, the array detector chip and the TIA chip do not need to be tilted for soldering, and the subsequent layout of the high-speed RF lines on the PCB board is friendly.

[0019] Further, the optical transmitting end includes: a TX fiber array and four DFB lasers. The TX fiber array is horizontally fixed on the PCB board. On the optical port side of the TX fiber array on the PCB board, one DFB laser is fixed at each of the four channels corresponding to the TX fiber array. Between each DFB laser and the TX fiber array, a lens and an optical isolator are sequentially coupled along the optical propagation direction. The lens and the optical isolator are respectively fixed on the PCB board.

[0020] Further, the optical isolator is attached to the end face on the optical port side of the TX fiber array.

[0021] Further, a fiber protection sleeve is provided at the tail end of the ferrule. The TX fibers of the TX fiber array in the optical transmitting end and the RX fibers of the RX fiber array in the optical receiving end respectively enter the ferrule arranged in the middle relative to the PCB board through the fiber protection sleeve. Description of the Drawings

[0022] Figure 1 is a structural diagram of a QSFP56 package 200G DR4 optical module in the prior art;

[0023] Figure 2 is a structural diagram of the optical receiving end in the present invention;

[0024] Figure 3 is a structural diagram of the RX fiber array in the present invention;

[0025] Figure 4 is a structural diagram of a QSFP56 package 200G DR4 optical module in the present invention.

[0026] In the drawings, the list of components represented by each reference numeral is as follows:

[0027] 1. Optical receiving end, 110. Array detector chip, 120. RX fiber array, 121. RX fiber, 1211. Bare fiber, 130. TIA chip, 2. PCB board, 3. Ferrule, 4. Optical transmitting end, 410. TX fiber array, 411. TX fiber, 420. DFB laser, 430. Lens, 440. Optical isolator, 5. Fiber protection sleeve. Detailed Embodiment

[0028] The principles and features of the present invention will be described below with reference to the drawings. The examples given are only for explaining the present invention and are not intended to limit the scope of the present invention.

[0029] Embodiment 1

[0030] As Figure 2 , Figure 3 shown, an optical receiving end includes:

[0031] The RX optical fiber array 120 with an inclined distribution, all the RX optical fibers 121 in the RX optical fiber array 120 protrude from its optical port side, and the lengths of the bare optical fibers 1211 of all the RX optical fibers 121 in the RX optical fiber array 120 outside the optical port side are different. Taking Figure 3 the direction of the arrow in the shown perspective as an example: the lengths of the bare optical fibers 1211 of all the RX optical fibers 121 in the RX optical fiber array 120 outside the optical port side decrease successively from outside to inside. It can be processed by laser cutting. The reflection centers of all the bare optical fibers 1211 are on the same straight line, and the angle between the straight line connecting the reflection centers of all the bare optical fibers 1211 and the end face of the optical port side of the RX optical fiber array 120 is Q, and the value of Q is 5° to 15°. At this angle, the bending angle of the RX optical fiber 121 at the root of the RX optical fiber array 120 can be reduced to less than 10°. In the prior art, the angle between the connection line of the reflection centers of all the bare optical fibers 1211 and the end face of the optical port side of the RX optical fiber array 120 is 0°. An array detector chip 110 is horizontally arranged on the optical port side of the RX optical fiber array 120, that is, the layout of the array detector chip 110 remains unchanged compared with the prior art. The reflection surfaces of all the bare optical fibers 1211 are aligned and coupled with the multiple photosensitive surfaces of the array detector chip 110 one by one. In actual implementation, it can be realized that the reflection centers of the reflection surfaces of all the bare optical fibers 1211 are aligned and coupled with the centers of the multiple photosensitive surfaces of the array detector chip 110 one by one. For the received light, each path of received light enters one RX optical fiber 121, and then is reflected by the reflection surface of the bare optical fiber 1211 into one of the photosensitive surfaces of the array detector chip 110.

[0032] The RX optical fiber array 120 in the optical receiving end 1 is adjusted from a horizontal distribution to an inclined distribution, while the layout of the array detector chip 110 remains consistent with the prior art. When it is applied to the QSFP56 package 200G DR4 optical module, the RX optical fiber array 120 and the TX optical fiber array 410 are no longer parallel, but are in a contracted distribution, and the beam port is arranged near the ferrule 3 centered relative to the PCB board 2, so that the bending angle of the RX optical fiber 121 at the root of the RX optical fiber array 120 becomes smaller. At this angle (5° to 15°), specifically: the bending angle of the RX optical fiber 121 at the root of the RX optical fiber array 120 can be reduced to less than 10°. In this way, the RX optical fiber 121 is not easily broken at the root of the RX optical fiber array 120, and the array detector chip 110 still maintains a horizontal distribution, that is, the array detector chip 110 does not need to be inclined and pasted. If the array detector chip 110 is inclined and pasted, the subsequent TIA chip 130 will also be inclined and pasted, resulting in large differences in the lengths of the high-speed RF lines of the four channels of the TIA chip 130, thus poor performance and unfriendly layout. And the inclined pasting is more difficult for the mounter than the normal pasting. In this embodiment, the array detector chip 110 does not need to be inclined and pasted, and the subsequent layout of the high-speed RF lines on the PCB board 2 is friendly.

[0033] Example 2

[0034] As Figure 2 shown, this embodiment is a further improvement based on Embodiment 1, specifically as follows:

[0035] The reflection centers of all bare optical fibers 1211 are on the same straight line, and the angle between the straight line connecting the reflection centers of all bare optical fibers 1211 and the end face of the optical port side of the RX optical fiber array 120 is 10°, which can be specifically adjusted according to the fiber lengths of different modules. Here, only a specific value is listed exemplarily. If the fiber length is long, a small angle is selected; if the fiber length is short, a large angle is selected.

[0036] When the reflection centers of all bare optical fibers 1211 are on the same straight line and the angle between the straight line connecting the reflection centers of all bare optical fibers 1211 and the end face of the optical port side of the RX optical fiber array 120 is 10°, the bending angle of the RX optical fiber 121 close to the TX optical fiber array 410 at the root of the RX optical fiber array 120 is 2°, and the bending angle of the RX optical fiber 121 far from the TX optical fiber array 410 at the root of the RX optical fiber array 120 is 6°. Compared with the prior art (the bending angle of the RX optical fiber close to the TX optical fiber array in the RX optical fiber array at the root of the RX optical fiber array is 16°, and the bending angle of the RX optical fiber far from the TX optical fiber array in the RX optical fiber array at the root of the RX optical fiber array is 20°), the bending angle is greatly reduced (i.e., reduced by 14°), so that the RX optical fiber is not easily broken at the root of the RX optical fiber array.

[0037] Example 3

[0038] As Figure 2 shown, this embodiment is a further improvement based on Embodiment 1 or 2, specifically as follows:

[0039] The RX optical fiber array 120 has four RX optical fibers 121, that is, a four-channel optical fiber array, and the array detector chip 110 has four photosensitive surfaces, that is, it has four detector chips.

[0040] Example 4

[0041] As Figure 2 shown, this embodiment is a further improvement based on any one of Embodiments 1 to 3, specifically as follows:

[0042] The reflection surface angle of the bare optical fiber 1211 is 40° - 45°, usually it can be 42°.

[0043] Example 5

[0044] As Figure 2As shown in the figure, this embodiment is a further improvement based on any one of Embodiments 1 to 4, specifically as follows:

[0045] The array detector chip 110 is electrically connected to the TIA chip 130. That is, the array detector chip 110 can transmit signals to the TIA chip 130. The TIA chip 130 still maintains a horizontal distribution, that is, the arrangement of the TIA chip 130 is still the same as that in the prior art.

[0046] Embodiment 6

[0047] As Figure 4 shown, a QSFP56 package 200G DR4 optical module includes: a PCB board 2, a ferrule 3, an optical transmitting end 4, and an optical receiving end 1 as described in any one of Embodiments 1 to 5. The optical transmitting end 4 and the optical receiving end 1 are fixedly arranged side by side along the width direction of the PCB board 2. The optical transmitting end 4 is arranged more centrally relative to the PCB board 2, that is, the same as the prior art. The optical receiving end 1 is still distributed outside the optical transmitting end 4. The fixed positions of the array detector chip 110 and the TIA chip 130 in the optical receiving end 1 on the PCB board 2 remain unchanged compared with the prior art. The actual change is only the RX fiber array 120. The TX fiber array 410 in the optical transmitting end 4 is horizontally distributed. The TX fiber 411 of the TX fiber array 410 in the optical transmitting end 4 and the RX fiber 121 of the RX fiber array 120 in the optical receiving end 1 respectively enter the ferrule 3 arranged centrally relative to the PCB board 2. In this embodiment, the arrangement position of the ferrule 3 relative to the PCB board 2 remains unchanged compared with the prior art. The RX fiber array 120 and the TX fiber array 410 are distributed in a contracted shape, and the beam mouth is close to the ferrule 3. That is, the RX fiber array 120 and the TX fiber array 410 are not parallel, but the outgoing fiber end of the RX fiber array 120 is inclined towards the TX fiber array 410. Taking the perspective shown in Figure 2 as an example, the lengths of the bare fibers 1211 of all the RX fibers 121 in the RX fiber array 120 outside the optical port side decrease sequentially from outside to inside.

[0048] By making the RX fiber optic array 120 and the TX fiber optic array 410 not parallel but in a converging distribution, with the beam mouth centered near the ferrule 3 relative to the PCB board 2, the bending angle of the RX fiber 121 at the root of the RX fiber optic array 120 is reduced. At this angle (5° to 15°), specifically, the bending angle of the RX fiber 121 at the root of the RX fiber optic array 120 can be reduced to less than 10°. In this way, the RX fiber 121 is not easily broken at the root of the RX fiber optic array 120. The arrangement of the array detector chip 110 and the TIA chip 130 remains the same as in the prior art, that is, the array detector chip 110 and the TIA chip 130 do not need to be tilted for soldering. If the array detector chip 110 is tilted for soldering, the subsequent TIA chip 130 will also be tilted for soldering, resulting in a large difference in the lengths of the high-speed RF lines of the four channels of the TIA chip 130, thus poor performance and unfriendly layout. And tilted soldering is more difficult for the soldering machine than normal soldering. In the present invention, the array detector chip 110 and the TIA chip 130 do not need to be tilted for soldering, and the subsequent high-speed RF line layout of the PCB board 2 is friendly.

[0049] Embodiment 7

[0050] As Figure 4 shown, this embodiment is a further improvement on the basis of Embodiment 6, specifically as follows:

[0051] The optical emission end 4 includes: a TX fiber optic array 410 and four DFB lasers 420. The TX fiber optic array 410 is horizontally fixed on the PCB board 2. On the optical port side of the TX fiber optic array 410 on the PCB board 2, one DFB laser 420 is fixed at each of the four channels corresponding to the TX fiber optic array 410. And between each DFB laser 420 and the TX fiber optic array 410, a lens 430 and an optical isolator 440 are sequentially coupled along the light propagation direction. That is, the laser emitted by each DFB laser 420 is sequentially coupled into one of the channels of the TX fiber optic array 410 after passing through a lens 430 and an optical isolator 440. The lens 430 and the optical isolator 440 are respectively fixed on the PCB board 2.

[0052] Furthermore, the optical isolator 440 is preferably attached to the end face on the optical port side of the TX fiber optic array 410.

[0053] Embodiment 8

[0054] As Figure 4 shown, this embodiment is a further improvement on the basis of Embodiment 6 or 7, specifically as follows:

[0055] The end of the ferrule 3 is provided with an optical fiber protection sleeve 5. The TX optical fibers 411 of the TX optical fiber array 410 in the optical transmitting end 4 and the RX optical fibers 121 of the RX optical fiber array 120 in the optical receiving end 1 respectively enter the ferrule 3 centrally arranged relative to the PCB board 2 through the optical fiber protection sleeve 5.

[0056] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those of ordinary skill in the art can make changes, modifications, substitutions, and variations to the above embodiments within the scope of the present invention.

Claims

1. A QSFP56 package 200G DR4 optical module, characterized in that Including: An optical receiving end (1), a PCB board (2), a ferrule (3), and an optical transmitting end (4). The optical transmitting end (4) and the optical receiving end (1) are fixedly arranged side by side along the width direction of the PCB board (2). The TX optical fiber array (410) in the optical transmitting end (4) is horizontally distributed. The optical receiving end (1) includes: an RX optical fiber array (120) distributed obliquely. The lengths of the bare optical fibers (1211) of all the RX optical fibers (121) in the RX optical fiber array (120) outside the optical port side are different. The reflection centers of all the bare optical fibers (1211) are on the same straight line, and the angle between this straight line and the end face of the RX optical fiber array (120) on the optical port side is 5° - 15°. An array detector chip (110) is horizontally arranged on the optical port side of the RX optical fiber array (120). The reflection surfaces of all the bare optical fibers (1211) are aligned and coupled one by one with the multiple photosensitive surfaces of the array detector chip (110). The TX optical fibers (411) of the TX optical fiber array (410) in the optical transmitting end (4) and the RX optical fibers (121) of the RX optical fiber array (120) in the optical receiving end (1) respectively enter the ferrule (3) arranged in the middle relative to the PCB board (2). The bending angle of the RX optical fiber (121) at the root of the RX optical fiber array (120) is less than 10°. The RX optical fiber array (120) and the TX optical fiber array (410) are distributed in a converging shape, and the beam outlet is close to the ferrule (3).

2. The 200G DR4 optical module with QSFP56 package according to claim 1, wherein The reflection centers of all the bare optical fibers (1211) are on the same straight line, and the angle between this straight line and the end face of the RX optical fiber array (120) on the optical port side is 10°.

3. A QSFP56 package 200G DR4 optical module according to claim 1, characterized in that, The RX optical fiber array (120) has four RX optical fibers (121).

4. The QSFP56 package 200G DR4 optical module according to claim 3, characterized in that, The array detector chip (110) has four photosensitive surfaces.

5. A QSFP56 package 200G DR4 optical module according to claim 1, characterized in that The reflection surface angle of the bare optical fiber (1211) is 40° - 45°.

6. A QSFP56 packaged 200G DR4 optical module according to any one of claims 1 to 5, characterized in that, The array detector chip (110) is electrically connected to a TIA chip (130), and the TIA chip (130) is horizontally distributed.

7. A QSFP56 package 200G DR4 optical module according to claim 1, characterized in that The optical transmitting end (4) includes: a TX optical fiber array (410) and four DFB lasers (420). The TX optical fiber array (410) is horizontally fixed on the PCB board (2). On the optical port side of the TX optical fiber array (410) on the PCB board (2), one DFB laser (420) is fixed at each of the four channels corresponding to the TX optical fiber array (410). Between each DFB laser (420) and the TX optical fiber array (410), a lens (430) and an optical isolator (440) are sequentially coupled along the optical propagation direction. The lens (430) and the optical isolator (440) are respectively fixed on the PCB board (2).

8. A QSFP56 package 200G DR4 optical module according to claim 7, characterized in that, The optical isolator (440) is attached to the end face of the TX optical fiber array (410) on the optical port side.

9. The QSFP56 package 200G DR4 optical module according to claim 1, wherein The end of the ferrule (3) is provided with an optical fiber protective sleeve (5). The TX optical fibers (411) of the TX optical fiber array (410) in the optical transmitting end (4) and the RX optical fibers (121) of the RX optical fiber array (120) in the optical receiving end (1) respectively enter the ferrule (3) arranged in the middle relative to the PCB board (2) through the optical fiber protective sleeve (5).

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