Pressurizing driving mechanism, heating and pressurizing device, light-emitting chip transfer equipment and method

Abstract

The invention provides a pressurization driving mechanism, a heating and pressurization device and a light-emitting chip transfer device and method, and belongs to the technical field of display. The pressurization driving mechanism comprises a driving assembly and a pressurization assembly, the pressurization assembly comprises a first connecting piece and a light-transmitting pressing head, the first connecting piece comprises a pressurization part and a first hollow part, the pressurization part is connected to the light-transmitting pressing head and the driving assembly, the side, away from the pressurization part, of the light-transmitting pressing head is used for being connected with a first substrate, and the light-transmitting pressing head comprises a light-transmitting part; the light-transmitting part is used for allowing laser with a target wavelength to transmit in a first direction, the orthographic projection of the light-transmitting part on the reference surface and the orthographic projection of the first hollow part on the reference surface at least partially coincide, and the driving assembly is at least connected to the two opposite sides of the first hollow part; the reference surface is perpendicular to the first direction. The pressurization driving mechanism integrates pressurization and laser irradiation functions, is high in functionality, and provides feasibility for mass transfer of light-emitting chips.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a pressurizing driving mechanism, a heating and pressurizing device, and a light-emitting chip transfer device and method. Background Art

[0002] Mass transfer is a manufacturing technology that accurately transfers millions or even tens of millions of micron-sized light-emitting chips from the source plate to the driver substrate. There are many challenges in terms of transfer yield, accuracy and speed, and it has become a technical bottleneck restricting the new generation of display products. At present, a variety of laser-assisted transfer technologies have been developed. This transfer technology has the advantages of little damage to devices, high selectivity, fast and efficient response, etc., and has become a very potential mass transfer solution.

[0003] The mass transfer process is the most demanding, requiring the use of high temperature, high pressure and high precision bonding of upper and lower substrates of different sizes, laser scanning processing, and the peeling of the upper and lower substrates. This process is a very important part of the production of display products. Due to the shortcomings of the current technology, there is an urgent need for a transfer technology with simpler process steps that can ensure the transfer yield, accuracy and speed.

[0004] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present disclosure, and therefore may include information that does not constitute the prior art known to ordinary technicians in the field. Summary of the invention

[0005] The purpose of the present disclosure is to overcome the deficiencies of the above-mentioned prior art and to provide a pressurizing drive mechanism, a heating and pressurizing device, a light-emitting chip transfer device and method, which integrate pressurizing and laser irradiation functions to provide feasibility for mass transfer of chips.

[0006] In order to achieve the above-mentioned invention object, the present invention adopts the following technical solutions:

[0007] According to one aspect of the present disclosure, a pressurizing driving mechanism is provided, including a driving component and a pressurizing component. The pressurizing component includes a first connecting member and a light-transmitting pressing head. The first connecting member includes a pressurizing portion and a first hollow portion. The pressurizing portion is respectively connected to the light-transmitting pressing head and the driving component. The side of the light-transmitting pressing head away from the pressurizing portion is used to connect a first substrate. The light-transmitting pressing head includes a light-transmitting portion, and the light-transmitting portion is used to allow a laser of a target wavelength to pass through along a first direction. The orthographic projection of the light-transmitting portion on a reference plane and the orthographic projection of the first hollow portion on the reference plane at least partially overlap. The driving component is at least connected to opposite sides of the first hollow portion; the reference plane and the first direction are perpendicular to each other; wherein, the driving component drives the light-transmitting pressing head to move along the first direction through the first connecting member, so that the light-transmitting pressing head drives the first substrate and a second substrate to contact each other in the first direction and generate an interaction force, and under the action of the laser of the target wavelength, a light-emitting chip disposed on the first substrate is transferred to the second substrate, wherein the first substrate and the second substrate are located on the same side of the light-transmitting pressing head, and the first substrate is disposed between the light-transmitting pressing head and the second substrate.

[0008] In an exemplary embodiment of the present disclosure, the pressurizing portion includes a pressurizing area, and the orthographic projection of the pressurizing area on the reference plane surrounds the orthographic projection of the first hollow portion on the reference plane, and the orthographic projection of the pressurizing area on the reference plane is disposed along the edge of the orthographic projection of the first connecting member on the reference plane.

[0009] In an exemplary embodiment of the present disclosure, the first hollow portion is a first through hole provided in the first connecting member, and the pressurizing area is the portion of the first connecting member where the first through hole is not provided.

[0010] In an exemplary embodiment of the present disclosure, the adjacent side of the first hollow portion and the pressurizing area includes an arc-shaped edge; the pressurizing component further includes an arc-shaped concave surface, and the orthographic projection of the arc-shaped concave surface on the reference plane is conformal with the orthographic projection of the arc-shaped edge on the reference plane.

[0011] In an exemplary embodiment of the present disclosure, the first hollow portion is a circular structure.

[0012] In an exemplary embodiment of the present disclosure, the pressing assembly further includes: a second connecting member disposed between the first connecting member and the light-transmitting pressing head. The second connecting member includes a transverse plate and a column. The transverse plate is provided with a second hollow portion. At least a part of the orthographic projection of the light-transmitting portion on the reference plane coincides with the orthographic projection of the second hollow portion on the reference plane. The column is perpendicularly disposed relative to the transverse plate and is disposed between the first connecting member and the transverse plate. The column is correspondingly disposed with the driving assembly and is disposed at least on opposite sides of the first hollow portion.

[0013] In an exemplary embodiment of the present disclosure, the pressing assembly further includes: a third connecting member disposed between the second connecting member and the light-transmitting pressing head. The third connecting member is provided with a third hollow portion. At least a part of the orthographic projection of the light-transmitting portion on the reference plane coincides with the orthographic projection of the third hollow portion on the reference plane; wherein, along the first direction, the thickness of the third connecting member is greater than the thickness of the transverse plate in the second connecting member.

[0014] In an exemplary embodiment of the present disclosure, the second hollow portion, the third hollow portion, and the light-transmitting portion are all rectangular structures.

[0015] In an exemplary embodiment of the present disclosure, the pressing assembly further includes: a pressure sensor and an inclination sensor. The pressure sensor is disposed between the third connecting member and the light-transmitting pressing head; the inclination sensor is disposed on the third connecting member.

[0016] In an exemplary embodiment of the present disclosure, the pressing assembly further includes: a driving connecting member connected to the driving assembly and located on a side of the first connecting member away from the light-transmitting pressing head. The driving connecting member is in contact with the first connecting member, and the area where the driving connecting member is in contact with the first connecting member is the pressing area.

[0017] In an exemplary embodiment of the present disclosure, the driving connecting member is in contact with the driving assembly, and the area where the driving connecting member is in contact with the driving assembly is perpendicularly disposed to the pressing area.

[0018] In an exemplary embodiment of the present disclosure, the number of the driving assemblies is multiple, and the multiple driving assemblies are disposed on opposite sides of the first hollow portion and connected to the pressing portion.

[0019] In an exemplary embodiment of the present disclosure, the pressing driving mechanism further includes a fixing bracket located on a side of the first connecting member away from the light-transmitting pressing head. Adjacent two driving assemblies are connected by the fixing bracket.

[0020] In an exemplary embodiment of the present disclosure, the fixed bracket includes: a support side plate, a mounting plate, and a fixing plate. The support side plate is disposed on one side of the driving assembly along the second direction; the mounting plate is disposed on one side of the driving assembly along the third direction. A connecting arm is provided on one side of the support side plate along the second direction and facing the driving assembly, and the connecting arm is disposed between the driving assembly and the mounting plate; the fixing plate is disposed on one side of the mounting plate along the third direction and away from the driving assembly, and the fixing plate is connected to the mounting plate and the support side plate; wherein, the first direction, the second direction, and the third direction are perpendicular to each other in pairs.

[0021] In an exemplary embodiment of the present disclosure, the driving assembly includes: a first slide rail, a slider, and a power driving member. The first slide rail extends along the first direction; the slider is slidably connected to the first slide rail, and the slider is connected to the pressing assembly; the power driving member is connected to the slider and is used to drive the slider to slide along the first slide rail and apply pressure to the pressing assembly.

[0022] In an exemplary embodiment of the present disclosure, the driving assembly further includes a first support member and a photoelectric sensor. The first slide rail is connected to the first support member, and the photoelectric sensor is disposed on the first support member and on one side of the first slide rail; the power driving member includes a driving motor, a power conversion element, a speed reducer, a speed reduction mounting seat, and a coupling. The speed reduction mounting seat is disposed on one side of the first support member along the first direction, the speed reducer is disposed on the speed reduction mounting seat, the driving motor is connected to the speed reducer, the power conversion element has a power input end and a power output end, the speed reducer is connected to the power input end of the power conversion element through the coupling, and the power output end of the power conversion element is respectively connected to the slider and the first connecting member of the pressing assembly. The power conversion element is used to convert the rotational power output by the driving motor into linear motion.

[0023] According to another aspect of the present disclosure, a heating and pressing device is further provided, including a heating and carrying mechanism and the above-mentioned pressing and driving mechanism; the heating and carrying mechanism includes a heating member and a carrying table. The carrying table is used to carry the second substrate, and the heating member is used to heat the second substrate on the carrying table; wherein, the transparent pressing head and the carrying table are oppositely disposed in the first direction. The transparent pressing head is used to connect the first substrate, and the driving assembly is used to drive the transparent pressing head to move in the first direction, so that the transparent pressing head drives the first substrate to contact the second substrate in the first direction and generate an interaction force.

[0024] In an exemplary embodiment of the present disclosure, a second gas passage is provided in the carrier table, and the second gas passage has a second adsorption port extending to the surface of the carrier table facing the pressurizing assembly side.

[0025] In an exemplary embodiment of the present disclosure, the number of the pressurizing drive mechanisms is multiple, and the multiple pressurizing drive mechanisms are respectively located on both sides of the heating member in the second direction, and the two pressurizing drive mechanisms are symmetrically arranged about the central axis of the heating member, and the second direction is perpendicular to the first direction.

[0026] In an exemplary embodiment of the present disclosure, the target wavelength is in the range of 100 nm - 2000 nm.

[0027] According to still another aspect of the present disclosure, there is also provided a light-emitting chip transfer device, including: the above-mentioned heating and pressurizing device and the laser irradiation device; the laser irradiation device is used to generate a laser with a target wavelength and irradiate the laser to the light-transmitting area of the light-transmitting pressing head.

[0028] According to yet another aspect of the present disclosure, there is also provided a method for transferring a light-emitting chip, including: transferring the light-emitting chip from the source substrate to the intermediate substrate, and then from the intermediate substrate to the display substrate; wherein, the light-emitting chip transfer device as described above is used to transfer the light-emitting chip from the source substrate to the intermediate substrate, the first substrate is the source substrate, and the second substrate is the intermediate substrate; and / or, the light-emitting chip transfer device as described above is used to transfer the light-emitting chip from the intermediate substrate to the display substrate, the first substrate is the intermediate substrate, and the second substrate is the display substrate.

[0029] According to still another aspect of the present disclosure, there is also provided a method for transferring a light-emitting chip, including: using the above-mentioned light-emitting chip transfer device to heat, pressurize and laser-irradiate the first substrate and the second substrate located on the heating and pressurizing device, the first substrate allows the laser with the target wavelength to pass through in the first direction, and the light-emitting chip is initially located on the first substrate: wherein, the driving component drives the pressurizing component to move towards the carrier table to apply pressure, so that the first substrate and the second substrate are in contact and generate an interaction force; the heating member heats the second substrate carried on the carrier table; the laser generated by the laser irradiation device passes through the light-transmitting part of the light-transmitting pressing head to perform laser irradiation on the first substrate and the second substrate, so that the light-emitting chip on the first substrate is transferred to the second substrate.

[0030] In the embodiments of the present disclosure, a pressurizing driving mechanism provided in this embodiment is provided. The driving component is connected to the light-transmitting pressing head through the pressurizing part of the first connecting piece. The first connecting piece realizes the intermediate connection between the driving component and the light-transmitting pressing head, and the pressurizing part realizes the transmission of the pressurizing force, so that the driving force of the driving component is applied to the light-transmitting pressing head through the pressurizing part, so as to realize the contact between the first substrate and the second substrate and generate an interaction force, thereby realizing the bonding and fixing of a large number of light-emitting chips on the first substrate and the second substrate.

[0031] The light-transmitting part of the light-transmitting pressing head is used to allow the laser of the target wavelength to pass through along the first direction, so that the light-transmitting pressing head has light-transmitting properties. The orthographic projection of the first hollow part of the first connecting piece on the reference plane and the orthographic projection of the light-transmitting part on the reference plane at least partially overlap. The first hollow part is used to avoid the laser, and the first hollow part and the light-transmitting part form a light-transmitting channel. The laser of the target wavelength passes through the light-transmitting channel and then irradiates on the first substrate. Under the combined action of the first hollow part and the light-transmitting part, the feasibility of laser irradiating the first substrate is realized. Therefore, the pressurizing driving mechanism integrates the functions of pressurization and laser irradiation, and has strong functionality, providing feasibility for the massive transfer of light-emitting chips.

[0032] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit the present disclosure. Description of the Drawings

[0033] The drawings here are incorporated into the specification and constitute a part of this specification, showing the embodiments in line with the present disclosure, and are used together with the specification to explain the principles of the present disclosure. Obviously, the drawings in the following description are only some embodiments of the present disclosure. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0034] Figure 1 It is a schematic structural diagram of a pressurizing driving mechanism in a heating and pressurizing device according to an exemplary embodiment of the present disclosure;

[0035] Figure 2 It is a schematic structural diagram of a heating and bearing mechanism in a heating and pressurizing device according to an exemplary embodiment of the present disclosure;

[0036] Figure 3 It is an exploded schematic diagram of a pressurizing driving mechanism in a heating and pressurizing device according to an exemplary embodiment of the present disclosure;

[0037] Figure 4 It is a schematic structural diagram of a light-transmitting pressing head in a heating and pressurizing device according to an exemplary embodiment of the present disclosure;

[0038] Figure 5 It is a schematic structural diagram of a heating and pressurizing device according to an exemplary embodiment of the present disclosure showing the first support and the deceleration mounting seat;

[0039] Figure 6 It is a schematic structural diagram showing a pressurizing component of a heating and pressurizing device according to an exemplary embodiment of the present disclosure;

[0040] Figure 7 is Figure 6 a partial enlarged schematic diagram at A;

[0041] Figure 8 It is a schematic side view structure diagram of a pressurizing component in an exemplary embodiment of the present disclosure;

[0042] Figure 9 It is a schematic fixed explosion structure diagram of a pressurizing component in an exemplary embodiment of the present disclosure;

[0043] Figure 10 It is a schematic fixed explosion structure diagram of another pressurizing component in an exemplary embodiment of the present disclosure;

[0044] Figure 11 It is a schematic structure diagram of a light-transmitting pressure head in an exemplary embodiment of the present disclosure;

[0045] Figure 12 It is a schematic refraction diagram of a laser passing through a light-transmitting pressure head in an exemplary embodiment of the present disclosure;

[0046] Figure 13 It is a schematic structure diagram of another light-transmitting pressure head in an exemplary embodiment of the present disclosure;

[0047] Figure 14 It is a schematic bottom view structure diagram of another light-transmitting pressure head in an exemplary embodiment of the present disclosure;

[0048] Figure 15 It is a schematic side view structure diagram of another light-transmitting pressure head in an exemplary embodiment of the present disclosure;

[0049] Figure 16 It is a schematic bottom view structure diagram of a light-transmitting pressure head in an exemplary embodiment of the present disclosure.

[0050] Reference numerals:

[0051] Z, the first direction; X, the second direction; Y, the third direction;

[0052] 10, heating and carrying mechanism; 20, pressurizing drive mechanism; 30, base; 40, base leveling member;

[0053] 100, heating member; 200, carrying table; 500, second support member;

[0054] 210, second adsorption port; 220, second air extraction port;

[0055] 300, pressurizing component; 400, drive component;

[0056] 320. Translucent indenter; 3201. Translucent part; 330. Metal frame; 340. Elastic pad; 350. First fixing bolt; 360. Second fixing bolt; 370. Third fixing bolt; 380. Straight-through joint; 390. Fourth fixing bolt; 308. Washer; 309. Locking nut;

[0057] 310. First connecting member; 311. First hollowed-out part; 312. Pressing part; 3121. Pressing area;

[0058] 302. Second connecting member; 3021. Horizontal plate; 3022. Second hollowed-out part; 3023. Column;

[0059] 303. Third connecting member;

[0060] 304. Pressure sensor; 305. Tilt sensor;

[0061] 306. Driving connecting member; 3061. Arc-shaped concave surface;

[0062] 307. Fixed bracket; 3071. Support side plate; 3072. Mounting plate; 3073. Fixed plate; 3074. Connecting arm;

[0063] AA. Translucent area; BB. Peripheral area;

[0064] 321. Second surface; 322. First air extraction port; 323. First adsorption port; 324. Annular groove; 325. Vent hole; 326. Contour surface; 3261. Sub-contour surface; 327. Ventilation hole; 328. Air passage;

[0065] 410. First support member; 420. First slide rail; 430. Slide block; 440. Power driving member; 450. Photoelectric sensor;

[0066] 441. Driving motor; 442. Power conversion element; 4421. Power output end; 443. Reducer; 444. Reduction mounting base; 445. Coupling. Detailed implementation manners

[0067] Example embodiments will now be described more fully with reference to the accompanying drawings. However, the example embodiments can be implemented in various forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the example embodiments to those skilled in the art. Like reference numerals in the figures denote the same or similar structures, and thus their detailed descriptions will be omitted. In addition, the drawings are only schematic illustrations of the present disclosure and are not necessarily drawn to scale.

[0068] Although relative terms such as "upper" and "lower" are used in this specification to describe the relative relationship of one component of an icon to another component, these terms are used in this specification only for convenience, for example, according to the directions of the examples described in the drawings. It can be understood that if the device of the icon is turned upside down, the component described as "upper" will become the component "lower". When a structure is "on" another structure, it may mean that a structure is integrally formed on another structure, or that a structure is "directly" disposed on another structure, or that a structure is "indirectly" disposed on another structure through another structure.

[0069] The terms "a", "an", "the", "said" and "at least one" are used to indicate the existence of one or more elements / components / etc.; the terms "comprising" and "having" are used to mean an open inclusion and mean that there may be additional elements / components / etc. in addition to the listed elements / components / etc.; the terms "first", "second", "third", etc. are used only as labels and are not a limitation on the quantity of their objects.

[0070] The first direction and the second direction herein are two intersecting directions. In the drawings of the present disclosure, the first direction may be vertical. Specifically, the first direction is the height direction or the moving direction of the driving component, and the first direction is identified by Z. The second direction may be horizontal and is identified by X. The first direction and the second direction may be provided at a certain angle and are perpendicular to each other. For example, the first direction and the second direction are perpendicularly arranged. However, it is not limited thereto, and the first direction and the second direction may also be non-perpendicular directions. In addition, those skilled in the art can know that with the rotation of the pressurizing driving mechanism, the actual orientations of the first direction and the second direction may change, but their relative positions remain unchanged. Among them, the third direction may be longitudinal and is identified by Y, and the first direction, the second direction, and the third direction are perpendicular to each other in pairs.

[0071] The mass transfer process has the most demanding requirements. In related technologies, in order to achieve the mass transfer of light-emitting chips, two substrates to be transferred are pressurized in a pressurizing chamber first to fix the mass light-emitting chips provided on the first substrate on the second substrate, and then the two substrates to be transferred are irradiated with laser in a laser chamber to dissociate the first substrate from the mass light-emitting chips, and then the separation between the two substrates to be transferred is carried out. Due to the multi-chamber operation, it not only increases the process complexity of the light-emitting chip transfer, but also greatly reduces the production efficiency due to the transfer between multiple chambers.

[0072] The present disclosure provides a light-emitting chip transfer device, including a heating and pressurizing device and a laser irradiation device, and the laser irradiation device is used to generate a laser with a target wavelength.

[0073] Among them, the light-emitting chip transfer device is used to complete the mass transfer of light-emitting chips (such as Micro LED chips), that is, to accurately transfer millions or even tens of millions of micron-scale light-emitting chips from the first substrate to the second substrate. Among them, the first substrate can be a source substrate (such as a sapphire wafer), and the second substrate can be a glass substrate; or the first substrate can be a glass substrate, and the second substrate can be a display substrate including a driving circuit (for driving the light-emitting chips to emit light).

[0074] Among them, for the heating and pressing device and the laser irradiation device included in the light-emitting chip transfer device, the heating and pressing device is used to achieve the contact between the first substrate and the second substrate and generate an interaction force, as well as heat the second substrate. The laser irradiation device is used to generate a laser with a target wavelength to irradiate the first substrate after the first substrate and the second substrate are in contact and generate an interaction force. In this way, under the cooperation of the heating and pressing device and the laser irradiation device, the integrated operation of transferring the light-emitting chips provided on the first substrate to the second substrate can be realized, thereby simplifying the operation process of the mass transfer of light-emitting chips and improving the production efficiency at the same time.

[0075] Among them, the laser with the target wavelength generated by the laser irradiation device can penetrate the first substrate to effectively peel or dissociate a large number of light-emitting chips from the first substrate. The wavelength of the laser generated by the laser irradiation device can be in the range of 100nm to 2000nm. Of course, the wavelength of the laser generated by the laser irradiation device can also be slightly less than 100nm or slightly greater than 2000nm, as long as the peeling or dissociation of the light-emitting chips from the first substrate can be achieved.

[0076] Exemplarily, the wavelength range of the laser generated by the laser irradiation device can be in the range of 390nm - 780nm, such as visible light; or in the range of 780nm - 2000nm, such as infrared light; or in the range of 100nm - 390nm, such as ultraviolet light. Specifically, the wavelength of the laser generated by the laser irradiation device can be in one of the following ranges: 770nm - 622nm (red light), 622nm - 597nm (orange light), 597nm - 577nm (yellow light), 577 - 492nm (green light), 492nm - 450nm (cyan light), 450nm - 435nm (blue light), 455nm - 350nm (violet light). More specifically, the wavelength of the laser generated by the laser irradiation device is 355nm.

[0077] After the heating and pressing device realizes the contact between the first substrate and the second substrate through a pressing operation and generates an interaction force, it can realize the bonding and fixing of a large number of light-emitting chips on the first substrate and the second substrate through a heating operation; when the laser irradiation device generates a laser with a target wavelength to irradiate the first substrate, the peeling of the light-emitting chips from the first substrate (the first substrate is the source substrate and the second substrate is the intermediate substrate) or dissociation (the first substrate is the intermediate substrate and the second substrate is the display substrate) can be realized.

[0078] Among them, for the heating and pressing device, by way of example, the second substrate can be heated to 150 °C, and the pressure generated between the first substrate and the second substrate can be 0.5 MPa, and the duration can be 10 minutes to ensure the firmness of the bonding between the light-emitting chips on the first substrate and the second substrate.

[0079] Among them, the laser generated by the laser irradiation device can be pre-shaped so that the spot shape of the laser is the same as the contour shape of the light-emitting chip, while ensuring the uniformity of the energy within the spot area. By way of example, the contour shape of the light-emitting chip is rectangular. At this time, through shaping, the laser spot can be made into a rectangular flat-top spot. In addition, the laser irradiation device can irradiate the first substrate in a matrix dotting manner, and the dotting matrix corresponds to the arrangement of the light-emitting chips on the first substrate. It can be that one dotting point corresponds to one light-emitting chip, or one dotting point corresponds to 2×2 light-emitting chips, or corresponds to 2×3 light-emitting chips, etc.

[0080] It should be noted that the second substrate has a colloid that can realize glue bonding under heating conditions to ensure the bonding and fixing of the light-emitting chips on the first substrate and the second substrate after the first substrate and the second substrate are in contact and generate an interaction force, and the second substrate is heated. For the case where the light-emitting chips are dissociated from the first substrate, the light-emitting chips are fixed on the first substrate through a dissociation glue so that the dissociation glue can lose its adhesiveness after laser irradiation, realizing the dissociation of the light-emitting chips.

[0081] Next, a detailed explanation of the heating and pressing device included in the light-emitting chip transfer device will be given.

[0082] Such as Figure 1 and Figure 2As shown, the heating and pressing device includes a heating and carrying mechanism 10 and a pressing and driving mechanism 20. The heating and carrying mechanism 10 is used to carry the second substrate and heat the second substrate. The pressing and driving mechanism 20 includes a driving assembly 400 and a pressing assembly 300. The driving assembly 400 is connected to the pressing assembly 300. Among them, the pressing assembly 300 includes a light-transmitting pressing head 320. The light-transmitting pressing head 320 is oppositely arranged relative to the heating and carrying mechanism 10 in the first direction Z. The light-transmitting pressing head 320 is used to connect the first substrate. The driving assembly 400 is used to drive the light-transmitting pressing head 320 to move towards the heating and carrying mechanism 10, so as to drive the first substrate to contact the second substrate and generate an interaction force.

[0083] For the heating and pressing device provided by the present disclosure, the second substrate is carried by the heating and carrying mechanism 10, and the first substrate is connected by the light-transmitting pressing head 320. Then, the second substrate can be heated by the heating and carrying mechanism 10, and under the driving action of the driving assembly 400, the light-transmitting pressing head 320 of the pressing assembly 300 can move towards the heating and carrying mechanism 10, so that the first substrate contacts the second substrate and generates an interaction force, so as to realize the bonding and fixing of the light-emitting chip on the first substrate and the second substrate. In addition, by using the light-transmitting property of the light-transmitting pressing head 320, the feasibility of laser irradiating the first substrate is realized. Therefore, the heating and pressing device can integrate the functions of heating, pressing and laser irradiation, providing feasibility for the mass transfer of light-emitting chips.

[0084] Exemplarily, the heating temperature of the second substrate by the heating and carrying mechanism 10 is maintained at 150 °C. The pressure generated between the first substrate and the second substrate after the driving assembly 400 drives them to contact is 0.5 MPa, and the duration is 10 minutes to ensure the firm bonding of the light-emitting chip on the first substrate and the second substrate.

[0085] Optionally, as Figure 2 shown, the heating and carrying mechanism 10 includes a carrying platform 200 and a heating member 100. The carrying platform 200 is arranged on one side of the heating member 100 in the first direction Z. Specifically, the carrying platform 200 is arranged above the heating member 100 in the vertical direction.

[0086] Among them, the carrying platform 200 is oppositely arranged relative to the light-transmitting pressing head 320 in the first direction Z (that is, there is an overlapping area). The carrying platform 200 is used to carry and fix the second substrate, so that when the driving assembly 400 drives the light-transmitting pressing head 320 to move towards the carrying platform 200 along the first direction Z, the first substrate connected by the light-transmitting pressing head 320 can contact the second substrate on the carrying platform 200 and generate an interaction force. The heating member 100 has a heating function and is mainly used to heat the carrying platform 200 to realize the heating of the second substrate. The heating member 100 can be a heating table, which may include a housing and heating tubes, a temperature controller and other structures arranged inside the housing. Specifically, the present disclosure does not make a limitation.

[0087] Among them, the carrier table 200 and the heating table can be connected as a whole. For example, the carrier table 200 is connected to one side surface of the heating table in the first direction Z, or the carrier table 200 and the heating table are directly processed into an integral structure. In addition, the carrier table 200 may not be connected to the heating member 100, but the carrier table 200 is supported by other support structures on one side of the heating member 100 in the first direction Z.

[0088] For example, as Figure 2 shown, the heating and carrying mechanism 10 further includes a second support member 500. The second support member 500 supports the carrier table 200 and is located around the heating member 100. The number of the second support members 500 can be multiple, and multiple second support members 500 surround the heating member 100. The number of the second support members 500 can be set according to the size or shape of the carrier table 200, etc.

[0089] Among them, the second support member 500 can be a support column, and the support column extends along the first direction Z. The cross-section of the support column can be circular, elliptical, triangular, rectangular, square or other polygons, etc., and the present disclosure does not make specific limitations.

[0090] Among them, for the number of the second support members 500, for example, if the carrier table 200 is generally a circular table, the number of the second support members 500 can be three, four, five or more, and multiple second support members 500 are evenly distributed along the circumferential direction of the heating member 100. If the carrier table 200 is generally quadrilateral, the number of the second support members 500 can be four, six, eight or more, and multiple second support members 500 can be distributed around the heating member 100 according to the position of the four sides of the carrier table 200.

[0091] In some embodiments of the present disclosure, as Figure 1 shown, the heating and pressing device further includes a base 30. The base 30 is mainly used to provide a support platform for the heating and carrying mechanism 10 and the pressing driving mechanism 20. Specifically, the heating and carrying mechanism 10 and the pressing driving mechanism 20 can be connected to one side of the base 30 in the first direction Z. Among them, the heating member 100 of the heating and carrying mechanism 10 can be fixed to one side surface of the base 30. The second support member 500 can be connected between the base 30 and the carrier table 200. The bottom end of the first support member 410 of the pressing driving mechanism 20 can be connected to the base 30.

[0092] Furthermore, as Figure 2 shown, the heating and pressing device further includes at least one base leveling member 40. The base leveling member 40 is connected between the base 30 and the second support member 500. The base leveling member 40 can be a leveling bolt. The size and shape of the base leveling member 40 can be set according to the shape and size of the cross-section of the second support member 500.

[0093] In some embodiments of the present disclosure, as Figure 2 shown, a second gas passage (not shown in the figure) is provided in the carrier stage 200. The second gas passage has a second adsorption port 210 and a second air extraction port 220. The second air extraction port 220 is used to connect to an air extraction device, and the air extraction device adsorbs and fixes the second substrate through the second adsorption port 210 of the second gas passage. The second adsorption port 210 is an opening where the second gas passage extends to the surface of the carrier stage 200 facing the light-transmitting pressing head 320; the second air extraction port 220 is an opening where the second gas passage extends to the surface of the carrier stage 200 facing away from the light-transmitting pressing head 320, or extends to the surface of the carrier stage 200 facing the light-transmitting pressing head 320, or extends to the side wall of the carrier stage 200.

[0094] This embodiment also provides a pressurization driving mechanism 20, as Figure 1 and Figure 3 shown. The pressurization driving mechanism 20 includes a driving component 400 and a pressurization component 300. The pressurization component 300 includes a first connecting member 310 and a light-transmitting pressing head 320. The first connecting member 310 includes a pressurization portion 312 and a first hollow portion 311. The pressurization portion 312 is respectively connected to the light-transmitting pressing head 320 and the driving component 400. The side of the light-transmitting pressing head 320 away from the pressurization portion 312 is used to connect to the first substrate. The light-transmitting pressing head 320 includes a light-transmitting portion 3201 (as Figure 4 shown), and the light-transmitting portion 3201 is used to allow the laser of the target wavelength to pass through along the first direction Z. The orthographic projection of the light-transmitting portion 3201 on the reference plane and the orthographic projection of the first hollow portion 311 on the reference plane at least partially overlap, and the driving component 400 is at least connected to opposite sides of the first hollow portion 311; the reference plane and the first direction Z are perpendicularly arranged, and the reference plane is substantially the plane where the first direction Z and the third direction Y are located.

[0095] Wherein, the driving component 400 drives the light-transmitting pressing head 320 to move along the first direction Z through the first connecting member 310, so that the light-transmitting pressing head 320 drives the first substrate and the second substrate to contact each other in the first direction Z and generate an interaction force, and under the action of the laser of the target wavelength, the light-emitting chip provided on the first substrate is transferred to the second substrate. Among them, the first substrate and the second substrate are located on the same side of the light-transmitting pressing head 320, and the first substrate is arranged between the light-transmitting pressing head 320 and the second substrate.

[0096] The pressurizing drive mechanism 20 provided in this embodiment has a drive assembly 400 connected to a light-transmitting pressing head 320 through a pressurizing portion 312 of a first connecting member 310. The first connecting member 310 realizes the intermediate connection between the drive assembly 400 and the light-transmitting pressing head 320, and the pressurizing portion 312 realizes the transmission of the pressurizing force, so that the driving force of the drive assembly 400 is applied to the light-transmitting pressing head 320 through the pressurizing portion 312, to achieve the contact between the first substrate and the second substrate and generate an interaction force, thereby realizing the bonding and fixing of a large number of light-emitting chips on the first substrate to the second substrate.

[0097] The light-transmitting portion 3201 of the light-transmitting pressing head 320 is used to allow the laser of the target wavelength to pass through along the first direction Z, so that the light-transmitting pressing head 320 has light-transmitting properties. The orthographic projection of the first hollow portion 311 of the first connecting member 310 on the reference plane and the orthographic projection of the light-transmitting portion 3201 on the reference plane at least partially overlap. The first hollow portion 311 is used to avoid the laser, and the first hollow portion 311 and the light-transmitting portion 3201 form a light-transmitting channel. The laser of the target wavelength irradiates the first substrate after passing through the light-transmitting channel. Under the combined action of the first hollow portion 311 and the light-transmitting portion 3201, the feasibility of laser irradiating the first substrate is realized. Therefore, the pressurizing drive mechanism 20 integrates the functions of pressurization and laser irradiation, has strong functionality, and provides feasibility for the massive transfer of light-emitting chips.

[0098] Specifically, as Figure 1 and Figure 3 shown, the drive assembly 400 is arranged on one side of the heating and carrying mechanism 10 in the second direction X, so that when the drive assembly 400 drives the light-transmitting pressing head 320 to move along the first direction Z, it can ensure that a certain magnitude of interaction force is generated between the light-transmitting pressing head 320 and the second substrate, thereby ensuring the extrusion force between the light-emitting chips on the first substrate and the second substrate, and further ensuring the bonding strength between the light-emitting chips and the second substrate.

[0099] Among them, the number of drive assemblies 400 is multiple, and the multiple drive assemblies 400 are arranged on opposite sides of the first hollow portion 311 and connected to the pressurizing portion 312. Specifically, the number of drive assemblies 400 can be two, three or more. Preferably, the number of drive assemblies 400 is two. The two drive assemblies 400 are respectively located on both sides of the heating and carrying mechanism 10 in the second direction X and are symmetrically arranged, so as to facilitate the drive assembly 400 to apply pressure to the pressurizing portion 312 of the first connecting member 310 along the second direction X, which helps to maintain the stability and uniformity of the applied force on the pressurizing assembly 300.

[0100] In some embodiments of the present disclosure, as Figure 1 and Figure 3As shown, the driving assembly 400 includes a first slide rail 420, a slider 430, and a power driving member 440. The first slide rail 420 extends along a first direction Z; the slider 430 is slidably connected to the first slide rail 420, and the slider 430 is connected to the pressing assembly 300; the power driving member 440 is respectively connected to the slider 430 and the pressing assembly 300, and is configured to drive the slider 430 to slide along the first slide rail 420 and apply a force to the pressing assembly 300.

[0101] Optionally, the first slide rail 420 has two first tracks, and the two first tracks are arranged along a third direction Y, that is, the two first tracks are respectively located on both sides of the power driving member 440 in the third direction Y.

[0102] In some embodiments, such as Figure 1 and Figure 3 as shown, the slider 430 is slidably connected to the first slide rail 420, and the power driving member 440 is configured to drive the slider 430 to slide along the first slide rail 420.

[0103] Among them, the slider 430 is slidably connected to a side of the first slide rail 420 close to the heating and bearing mechanism 10, and is connected to a power output end 4421 of the power driving member 440, and it can be directly connected or indirectly connected through other components. In addition, for the slidable connection between the slider 430 and the first slide rail 420, in combination with the situation that the first slide rail 420 has two first tracks described above, the slider 430 has a second track that matches the shape and size of the first track on the first slide rail 420. When the number of sliders 430 is two, each of the two sliders 430 has one second track; or when the number of sliders 430 is one, the slider 430 has two second tracks.

[0104] In some embodiments of the present disclosure, such as Figure 1 、 Figure 4 and Figure 5 as shown, the driving assembly 400 further includes a first support member 410, and the first slide rail 420 is connected to the first support member 410. The first support member 410 can be a support plate or a support column, etc., and the shape of its cross section can be circular, rectangular, square, "U" shaped or regular polygon, etc.

[0105] Preferably, the first support member 410 includes a support plate and a connecting plate. The support plate extends along the first direction Z, and two connecting plates are arranged at both ends of the support plate along the first direction Z, and the connecting plates extend along a second direction X. The first slide rail 420 can be connected to the connecting plate of the first support member 410 by means of bolts, screws, etc. Specifically, the number of the first support members 410 is two, and they are respectively located on both sides of the heating and bearing mechanism 10 in the second direction X.

[0106] In some embodiments of the present disclosure, such as Figure 1 andFigure 3 As shown, the driving assembly 400 further includes a photoelectric sensor 450. The photoelectric sensor 450 includes a light bar and a reading head disposed on the light bar. The light bar of the photoelectric sensor 450 is disposed on one side of the first slide rail 420, and the reading head of the photoelectric sensor 450 is used to detect the position of the light-transmitting pressure head 320.

[0107] Among them, the number of the photoelectric sensors 450 is one or more, and the functions of the photoelectric sensors 450 can be various. In one embodiment, there is a set force threshold for the force generated when the pressing assembly 300 drives the first substrate to contact the second substrate, and the setting position of the photoelectric sensor 450 corresponds to the force threshold. For example, when the force generated by the contact between the first substrate and the second substrate exceeds the force threshold, the photoelectric sensor 450 can transmit this information to structures such as an early warning system, so that it generates an early warning signal to avoid damaging the machine and causing potential safety hazards.

[0108] The setting position of the photoelectric sensor 450 is used to define the sliding range of the light-transmitting pressure head 320 in the first direction Z, so as to perform soft limit on the light-transmitting pressure head 320 to prevent the light-transmitting pressure head 320 from exceeding the slidable range.

[0109] In some other embodiments, a position sensor can also be provided on the power output end 4421. The position sensor is specifically an infrared sensor, and this infrared sensor is specifically installed on the lead screw nut and is used to sense the sliding position of the slider 430. The setting position of the position sensor is used to define the sliding range of the slider 430 in the first direction Z, so as to perform soft limit on the slider 430 to prevent the slider 430 from exceeding the slidable range.

[0110] In some embodiments, as Figure 1 and Figure 3 shown, the power driving member 440 includes a driving motor 441 and a power conversion element 442. The driving motor 441 is used to output rotational power; the power conversion element 442 has a power input end and a power output end 4421. The power input end of the power conversion element 442 is connected to the driving motor 441, and the power output end 4421 of the power conversion element 442 is connected to the slider 430 and the first connecting member 310 of the pressing assembly 300. The power conversion element 442 is used to convert the rotational power output by the driving motor 441 into linear motion and drive the light-transmitting pressure head 320 to move along the first direction Z through the first connecting member 310.

[0111] The driving motor 441 can be a servo motor for outputting rotational power. The power conversion element 442 can convert the rotational power into linear motion. Through this structural design, while meeting the motion requirements, the space utilization rate can be improved. The power conversion element 442 can be a ball screw. The two first tracks on the first slide rail 420 can be located on both sides of the power conversion element 442, that is, on the front and back sides of the ball screw. The power output end 4421 of the power conversion element 442 is specifically a lead screw nut, and the lead screw nut is sleeved outside the ball screw. The ball screw and the lead screw nut form a lead screw nut pair, and the lead screw nut is connected to the slider 430 and the first connecting member 310.

[0112] In some embodiments of the present disclosure, as Figure 1 , Figure 3 and Figure 4 shown, the power driving member 440 further includes a speed reducer 443, a speed reducer mounting seat 444, and a coupling 445. The speed reducer mounting seat 444 is disposed on one side of the first support member 410 along the first direction Z. The speed reducer 443 is disposed on the speed reducer mounting seat 444, and the driving motor 441 is connected to the speed reducer 443. Specifically, the driving motor 441 can be connected to the speed reducer 443 by a key. The speed reducer 443 is disposed between the driving motor 441 and the power conversion element 442. The speed reducer 443 is connected to the power input end of the power conversion element 442 through the coupling 445. The speed reducer 443 is used to reduce the output speed of the driving motor 441 and increase the torque. The driving motor 441 itself has a large output speed and a small torque. The speed reducer 443 has the functions of speed reduction and torque increase. After installing the speed reducer 443, the power conversion element 442 can provide a large torque and apply a large acting force, and its acting force can reach 1 ton, which can meet many process requirements.

[0113] Next, a detailed explanation of the pressing assembly 300 included in the heating and pressing device will be given.

[0114] As Figure 1 , Figure 3 and Figure 6 shown, the pressing assembly 300 includes a first connecting member 310 and a light-transmitting pressing head 320. The first connecting member 310 has a first hollow portion 311 penetrating therethrough. The first connecting member 310 is fixedly connected to the light-transmitting pressing head 320 and is located on one side close to the first surface of the light-transmitting pressing head 320. In the first direction Z, there is an overlapping area between the light-transmitting portion 3201 of the light-transmitting pressing head 320 and the first hollow portion 311.

[0115] In this way, when the laser of the target wavelength irradiates the pressing assembly 300, the laser can sequentially pass through the first hollow portion 311 on the first connecting member 310 and the light-transmitting portion 3201 of the light-transmitting pressing head 320 to irradiate the laser on the first substrate connected to the second surface of the light-transmitting pressing head 320, thereby realizing the effectiveness of the laser peeling or dissociation of the light-emitting chip on the first substrate.

[0116] Among them, the first connecting member 310 has two surfaces facing away from each other in the first direction Z. The first hollow portion 311 penetrates through these two surfaces. The light-transmitting pressing head 320 is located at the central position of the first connecting member 310 to ensure that the light-transmitting portion 3201 of the light-transmitting pressing head 320 and the first hollow portion 311 of the first connecting member 310 have a larger overlapping area. The first connecting member 310 can be made of steel to ensure that the first connecting member 310 has the characteristics of high strength, high hardness, and not being easily deformed.

[0117] In one embodiment, as shown in Figure 3 、 Figure 6 and Figure 7 shown, the pressing portion 312 includes a pressing area 3121. The orthographic projection of the pressing area 3121 on the reference plane surrounds the orthographic projection of the first hollow portion 311 on the reference plane, and the orthographic projection of the pressing area 3121 on the reference plane is arranged along the edge of the orthographic projection of the first connecting member 310 on the reference plane.

[0118] Specifically, the driving assembly 400 is connected to the pressing area 3121 of the first connecting member 310, so as to facilitate pressing on the first connecting member 310 through the driving assembly 400, realizing the contact between the first substrate and the second substrate and generating an interaction force. The pressing area 3121 is located outside the first hollow portion 311. The inner edge of the orthographic projection of the pressing area 3121 on the reference plane can be flush with the orthographic projection of the first hollow portion 311 on the reference plane, and the outer edge of the orthographic projection of the pressing area 3121 on the reference plane can be flush with the edge of the orthographic projection of the first connecting member 310 on the reference plane, so as to minimize the area of the pressing area 3121 arranged on the first connecting member 310. Along the second direction X, the pressing area 3121 is as close as possible to the first hollow portion 311, reducing the situation of shaking caused by the dispersion of the force on the first connecting member 310. The position where the driving assembly 400 applies pressure to the first connecting member 310 is near the first hollow portion 311 and concentrated towards the first hollow portion 311, which can improve the stability of the force on the first connecting member 310 and further improve the stability of the downward pressing of the light-transmitting pressing head 320 along the first direction Z.

[0119] In one embodiment, the first hollow portion 311 is a first through hole provided in the first connecting member 310, and the pressing area 3121 is the part of the first connecting member 310 where the first through hole is not provided.

[0120] In this way, the first connecting member 310 only has the first hollow portion 311 and the pressing area 3121. The pressing area 3121 is in close contact with the first hollow portion 311, that is, the distance between the pressing area 3121 and the first hollow portion 311 along the second direction X is zero, ensuring that the pressure application position of the driving component 400 on the first connecting member 310 is closest to the first hollow portion 311 to the greatest extent. Without other transfer or transmission structures, after the driving component 400 presses down the pressing area 3121, the pressing area 3121 can directly apply pressure to the light-transmitting pressing head 320 to improve the stability of the first connecting member 310 and the light-transmitting pressing head 320 when pressed down. At the same time, after forming the first through hole in the first connecting member 310, the first hollow portion 311 and the pressing area 3121 can be formed simultaneously, with a simple process, saving production time and production costs.

[0121] Among them, the general outline of the first connecting member 310 is a square structure. The length of the first connecting member 310 along the second direction X and the width along the third direction Y are approximately equal. The length of the first connecting member 310 can be appropriately shortened to save the cost of raw materials.

[0122] Specifically, the number of the pressing areas 3121 can be multiple, and the multiple pressing areas 3121 are symmetrically distributed around the first hollow portion 311. For example, the first connecting member 310 has two pressing areas 3121, and they are symmetrically distributed about the first hollow portion 311 in the second direction X.

[0123] In one embodiment, the first hollow portion 311 is a circular structure.

[0124] Compared with the polygonal structure, the circular first hollow portion 311 has no obvious inflection points, reducing the stress concentration and improving the structural strength of the first connecting member 310 and the first hollow portion 311.

[0125] In one embodiment, as Figure 3 and Figure 6 shown, the pressing component 300 further includes a second connecting member 302. The second connecting member 302 is disposed between the first connecting member 310 and the light-transmitting pressing head 320. The second connecting member 302 plays an intermediate connection role between the first connecting member 310 and the light-transmitting pressing head 320, and realizes isolation and buffering to a certain extent. The driving component 400 does not directly contact the light-transmitting pressing head 320, avoiding the situation that the light-transmitting pressing head 320 is damaged due to excessive downward pressure of the driving component 400.

[0126] Specifically, the second connecting member 302 includes a transverse plate 3021. The transverse plate 3021 is provided with a second hollow portion 3022. The orthographic projection of the light-transmitting portion 3201 on the reference plane and the orthographic projection of the second hollow portion 3022 on the reference plane at least partially overlap.

[0127] Among them, the second hollow portion 3022 is used to avoid the laser, facilitating the optical path propagation of the laser. The light-transmitting portion 3201 and the second hollow portion 3022 are at least partially overlapped. The first hollow portion 311, the second hollow portion 3022, and the light-transmitting portion 3201 form a light-transmitting channel. The laser of the target wavelength passes through the light-transmitting channel and then irradiates on the first substrate, realizing the feasibility of laser irradiating the first substrate.

[0128] Specifically, the second connecting member 302 further includes a column 3023. The column 3023 is vertically arranged relative to the cross plate 3021, so that the column 3023 and the cross plate 3021 form a structure similar to an L shape. The column 3023 is arranged between the first connecting member 310 and the cross plate 3021, and the column 3023 is correspondingly arranged with the driving assembly 400 and is at least arranged on opposite sides of the first hollow portion 311.

[0129] The first connecting member 310 is connected to the cross plate 3021 through the column 3023, and the column 3023 plays a role of transfer. The column 3023 extends along the first direction Z. Under the action of the column 3023, it is equivalent to moving the cross plate 3021 downward by a certain distance relative to the first connecting member 310 along the first direction Z. At this time, the first connecting member 310 and the cross plate 3021 form a double-layer structure. An opening structure is formed among the first connecting member 310, the cross plate 3021, and the column 3023. This opening structure can be used as an inspection window. The inspection window is communicated with the light-transmitting portion 3201, and the detection tool can extend into the light-transmitting portion 3201 through the inspection window for detecting various optical parameter indexes of the laser.

[0130] In one embodiment, as Figure 3 and Figure 6 shown, the pressurizing assembly 300 further includes a third connecting member 303. The third connecting member 303 is arranged between the second connecting member 302 and the light-transmitting pressing head 320. The third connecting member 303 is provided with a third hollow portion (not shown in the figure). The orthographic projection of the light-transmitting portion 3201 on the reference plane and the orthographic projection of the third hollow portion on the reference plane at least partially overlap.

[0131] The third hollow portion and the light-transmitting portion 3201 are at least partially overlapped. The third hollow portion is used to avoid the laser, facilitating the optical path propagation of the laser. The first hollow portion 311, the second hollow portion 3022, the third hollow portion, and the light-transmitting portion 3201 form a light-transmitting channel, improving the feasibility of laser irradiating the first substrate.

[0132] Among them, along the first direction Z, the thickness of the third connecting member 303 is greater than the thickness of the cross plate 3021 in the second connecting member 302.

[0133] By arranging the third connecting member 303 with a relatively thick thickness between the second connecting member 302 and the light-transmitting pressing head 320, the force stability of the third connecting member 303 is good, thereby improving the force uniformity of the light-transmitting pressing head 320.

[0134] In one embodiment, the second hollow portion 3022, the third hollow portion, and the light-transmitting portion 3201 are all rectangular structures.

[0135] With the rectangular light-transmitting portion 3201, it is convenient for the light-emitting chip to be transferred along the second direction X and the third direction Y. Since the distances between the second connecting member 302 and the third connecting member 303 and the light-transmitting pressing head 320 along the first direction Z are relatively small, compared with the first connecting member 310, the second connecting member 302 and the third connecting member 303 are closer to the light-transmitting pressing head 320. Keeping the shapes of the second hollow portion 3022 and the third hollow portion consistent with that of the light-transmitting portion 3201 can improve the alignment effect between these two hollow portions and the light-transmitting portion 3201, and improve the accuracy and efficiency of mass transfer.

[0136] In one embodiment, as Figure 3 、 Figure 6 and Figure 7 shown, the pressing assembly 300 further includes a driving connecting member 306. The driving connecting member 306 is connected to the driving assembly 400. The driving connecting member 306 is located on the side of the first connecting member 310 away from the light-transmitting pressing head 320. The driving connecting member 306 is in contact with the first connecting member 310, and the area where the driving connecting member 306 contacts the first connecting member 310 is the pressing area 3121.

[0137] Wherein, the lead screw nut of the driving assembly 400 is connected to the driving connecting member 306, and the driving connecting member 306 is in a strip structure or a block structure. Along the first direction Z, the bottom surface of the driving connecting member 306 and the top surface of the first connecting member 310 are the contact area between the driving connecting member 306 and the first connecting member 310, that is, the pressing area 3121. The lead screw nut of the driving assembly 400 transfers the downward pressure to the pressing area 3121 through the driving connecting member 306, and the pressing area 3121 then applies pressure to the first connecting member 310.

[0138] In one embodiment, as Figure 3 、 Figure 6 and Figure 7 shown, the driving connecting member 306 is in contact with the driving assembly 400, and the area where the driving connecting member 306 contacts the driving assembly 400 is perpendicular to the pressing area 3121.

[0139] Specifically, the driving connecting member 306 contacts and connects with the lead screw nut of the driving assembly 400 along the second direction X and away from the side surface of the first hollow portion 311. The area where the driving connecting member 306 contacts the driving assembly 400 extends along the first direction Z, and the movement direction of this contact area is consistent with that of the lead screw nut. There is no need to additionally add other direction conversion parts between the lead screw nut and the driving connecting member 306, reducing the number of parts and saving production costs. At the same time, this contact area is vertically arranged with the pressurizing area 3121, and the two areas do not interfere with each other, making full use of each surface of the driving connecting member 306. By using one driving connecting member 306, the connection with the lead screw nut and the first connecting member 310 can be realized simultaneously, simplifying the structure, reducing the number of parts, and lowering the production cost.

[0140] In one embodiment, as Figure 3 、 Figure 6 and Figure 7 shown, the side of the first hollow portion 311 adjacent to the pressurizing area 3121 includes an arc-shaped edge, which can reduce the occurrence of contact stress between the first hollow portion 311 and the pressurizing area 3121.

[0141] Among them, the pressurizing assembly 300 further includes an arc-shaped concave surface 3061, and the orthographic projection of the arc-shaped concave surface 3061 on the reference plane is conformal with the orthographic projection of the arc-shaped edge on the reference plane.

[0142] Specifically, the side surface of the driving connecting member 306 along the second direction X and close to the first hollow portion 311 is a planar structure. This planar structure may not be tangent to the edge of the first hollow portion 311, and this planar structure may have partial overlap with the first hollow portion 311, that is, this planar structure intersects with the edge of the first hollow portion 311, enabling the pressurizing area 3121 to be further close to the first hollow portion 311, making the pressurizing area 3121 concentrate towards the first hollow portion 311, and further improving the stability of the driving assembly 400 pressing down on the pressurizing area 3121. The arc-shaped concave surface 3061 may be arranged at the part where the driving connecting member 306 has partial overlap with the first hollow portion 311. The arc-shaped concave surface 3061 plays a role in avoiding the laser. The orthographic projection of the arc-shaped concave surface 3061 on the reference plane is conformal with the orthographic projection of the arc-shaped edge on the reference plane. While the driving connecting member 306 is closest to the first hollow portion 311 to the greatest extent, it also ensures the maximum penetration range of the laser to improve the reliability of the massive transfer of the light-emitting chips.

[0143] In one embodiment, as Figure 1 、 Figure 3 and Figure 6 shown, the pressurizing driving mechanism 20 further includes a fixing bracket 307. The fixing bracket 307 is located on the side of the first connecting member 310 away from the light-transmitting pressing head 320, and two adjacent driving assemblies 400 are connected through the fixing bracket 307.

[0144] The fixed bracket 307 is located on the side of the first connecting member 310 away from the light-transmitting pressing head 320. The fixed bracket 307 will not interfere with the positions of the light-transmitting pressing head 320 and each connecting member, facilitating the spatial layout of the light-transmitting pressing head 320 and each connecting member. Compared with the split structure of the driving assembly 400, two adjacent driving assemblies 400 are connected by the fixed bracket 307, enabling each driving assembly 400 to be connected into an integral structure, ensuring the synchronization of each driving assembly 400 when pressing down on the first connecting member 310, reducing the situation of the light-transmitting pressing head 320 shaking during the pressing process, and improving the pressing stability of the light-transmitting pressing head 320.

[0145] In one embodiment, the fixed bracket 307 includes a support side plate 3071, a mounting plate 3072, and a fixing plate 3073. The support side plate 3071 is connected to the driving assembly 400, the mounting plate 3072 is connected to the driving assembly 400 and the support side plate 3071, and the fixing plate 3073 is disposed on the side of the mounting plate 3072 away from the driving assembly 400.

[0146] Specifically, the support side plate 3071 is disposed on one side of the driving assembly 400 along the second direction X, the fixing plate 3073 is disposed on one side of the driving assembly 400 along the third direction Y. The fixing plate 3073 and the support side plate 3071 surround the outer periphery of the driving assembly 400. The support side plate 3071 is connected to the first support member 410 of the driving assembly 400. The fixing plate 3073 and the support side plate 3071 are connected to each other so that two adjacent driving assemblies 400 are connected. The mounting plate 3072 is located between the fixing plate 3073 and the driving assembly 400. The mounting plate 3072 plays a strengthening role to ensure the connection stability between two adjacent driving assemblies 400. Among them, the mounting plate 3072 has a relatively large stiffness and plays the role of a reinforcing rib plate, with good structural stability.

[0147] It can be understood that the number of the support side plate 3071, the mounting plate 3072, and the fixing plate 3073 can be multiple. For example, two support side plates 3071 are disposed opposite to each other and arranged along the second direction X. The two support side plates 3071 correspondingly connect to the first support members 410 of the two driving assemblies 400. One mounting plate 3072 and one fixing plate 3073 are stacked along the third direction Y to form a group and are respectively connected to the two support side plates 3071. Of course, two mounting plates 3072 can also be respectively disposed on both sides of the driving assembly 400 along the third direction Y, and two fixing plates 3073 are respectively disposed on both sides of the driving assembly 400 along the third direction Y. At this time, the support side plate 3071, the mounting plate 3072, and the fixing plate 3073 form a "mouth" - shaped structure to surround and fix the two driving assemblies 400, further improving the synchronization of two adjacent driving assemblies 400 when pressing down on the first connecting member 310 and improving the pressing stability of the light-transmitting pressing head 320.

[0148] In one embodiment, a connecting arm 3074 is provided on one side of the supporting side plate 3071 facing the driving assembly 400, and the connecting arm 3074 is disposed between the driving assembly 400 and the mounting plate 3072. Specifically, the first support member 410 of the driving assembly 400 and the mounting plate 3072 are positioned by the connecting arm 3074, and the connecting arm 3074 can also act as a spacer for adjusting the relative position between the first support member 410 and the mounting plate 3072.

[0149] Wherein, the number of the connecting arms 3074 can be multiple, and the multiple connecting arms 3074 are arranged along the first direction Z to ensure the uniformity and balance of the connection between the mounting plate 3072 and the first support member 410. For example, the number of the connecting arms 3074 is three, and the three connecting arms 3074 and the supporting side plate 3071 form a structure similar to the shape of "E".

[0150] In one embodiment, the connecting arm 3074 is provided with a positioning member (not shown in the figure), and the positioning member is disposed between the supporting side plate 3071 and the driving assembly 400. The positioning member can be a convex block protruding from the connecting arm 3074. The supporting side plate 3071 and the driving assembly 400 are positioned by the positioning member, and the positioning member can also act as a spacer for adjusting the relative position between the first support member 410 and the supporting side plate 3071.

[0151] In one embodiment, as Figure 1 、 Figure 3 and Figure 6 shown, the pressurizing assembly 300 further includes a pressure sensor 304, and the pressure sensor 304 is disposed between the third connecting member 303 and the light-transmitting pressing head 320. The pressure sensor 304 is used to detect the pressure of the third connecting member 303 on the light-transmitting pressing head 320.

[0152] Optionally, the pressure sensor 304 is connected to the third connecting member 303, and the setting position of the pressure sensor 304 is closer to the light-transmitting pressing head 320, so that the pressure detected by the pressure sensor 304 can better represent the pressure of the light-transmitting pressing head 320 on the first substrate, and the pressure detection accuracy is improved. Further, the photoelectric sensor 450 can be used in combination with the pressure sensor 304 to improve the safety factor.

[0153] The heating and pressurizing device has a pressurizing state and a pressure relief state: in the pressurizing state, the third connecting member 303 contacts the pressure sensor 304 and applies a force to make the pressure sensor 304 receive the acting force; in the pressure relief state, there is a gap between the third connecting member 303 and the pressure sensor 304, or the third connecting member 303 contacts the pressure sensor 304, but no effective acting force is generated (the acting force value detected by the pressure sensor 304 is zero).

[0154] Among them, the pressure sensor 304 is connected to the central position of the third connecting member 303 to enhance the accuracy of its force detection. Preferably, the pressure sensor 304 has a disc-shaped structure to better complete the force detection while not affecting the contact between the first connecting member 310 and the third connecting member 303.

[0155] In one embodiment, as Figure 1 , Figure 3 and Figure 6 shown, the pressurizing assembly 300 further includes an inclination sensor 305. The inclination sensor 305 is disposed on the third connecting member 303, and the inclination sensor 305 is used to detect the angle of the light-transmitting indenter 320 relative to the first direction Z.

[0156] Optionally, the inclination sensor 305 is connected to the third connecting member 303, and the setting position of the inclination sensor 305 is closer to the light-transmitting indenter 320, so that the pressure detected by the inclination sensor 305 can better characterize the pressing angle of the light-transmitting indenter 320 on the first substrate, so that the downward pressure of the light-transmitting indenter 320 on the first substrate is as along the first direction Z as possible, avoiding the occurrence of angular deviation of the downward pressure, and improving the pressing reliability of the light-transmitting indenter 320 on the first substrate.

[0157] In the present disclosure, for the fixation of the light-transmitting indenter 320 and the first connecting member 310, in some embodiments, as Figure 8 shown, the pressurizing assembly 300 further includes a metal frame 330. The metal frame 330 is located between the third connecting member 303 and the light-transmitting indenter 320 (that is, the metal frame 330 is located on the side close to the first surface of the light-transmitting indenter 320), and the light-transmitting indenter 320 and the metal frame 330 can be fixed to the third connecting member 303 by screws.

[0158] Among them, the metal frame 330 has an annular structure, and the orthographic projection on the light-transmitting indenter 320 surrounds the light-transmitting area AA on the light-transmitting indenter 320. That is, when the laser irradiation device generates laser for irradiation, the metal frame 330 does not block the laser from passing through the light-transmitting area AA of the light-transmitting indenter 320.

[0159] In some other embodiments, as Figure 8 and Figure 9 shown, the pressurizing assembly 300 further includes a metal frame 330 and an elastic pad 340. The metal frame 330 and the elastic pad 340 are both located on the side of the light-transmitting indenter 320 away from the second surface 321 (that is, located between the third connecting member 303 (not shown in the figure) and the light-transmitting indenter 320), and the metal frame 330 is located between the elastic pad 340 and the light-transmitting indenter 320. The metal frame 330 and the elastic pad 340 both have an annular structure, and the orthographic projections of the metal frame 330 and the elastic pad 340 on the light-transmitting indenter 320 surround the light-transmitting area AA.

[0160] Among them, the elastic pad 340 can be a rubber pad with certain elasticity and compressible deformation. When the driving component 400 drives the first substrate and the second substrate to generate a relative acting force, due to the parallelism problem of the surface of the light-transmitting indenter 320 and the possible inclination problem during the assembly of the light-transmitting indenter 320, etc., it may cause the light-transmitting indenter 320 to have a small lateral displacement in the direction perpendicular to the first direction Z. Through the setting of the elastic pad 340, an elastic buffer can be formed between the light-transmitting indenter 320 and the third connecting member 303, and when the driving component 400 drives the first substrate and the second substrate to generate a relative acting force, the elastic deformation of the elastic pad 340 can absorb the lateral displacement of the light-transmitting indenter 320 in the second direction X and / or the third direction Y, avoiding the relative displacement between the light-transmitting indenter 320 and the first substrate, and further avoiding the situation of friction between the light-transmitting indenter 320 and the first substrate to generate debris, and at the same time avoiding the problem that the light-transmitting indenter 320 drives the first substrate to shift and misalign with the second substrate.

[0161] For the fixation of the third connecting member 303, the light-transmitting indenter 320, the metal frame 330 and the elastic pad 340, in some embodiments, such as Figure 9 shown, the pressing component 300 further includes a first fixing bolt 350, a second fixing bolt 360 and a third fixing bolt 370. The light-transmitting indenter 320 has a first counterbore hole located on the surface facing away from the metal frame 330 and penetrating through. The metal frame 330 has a first threaded hole located on the surface facing the light-transmitting indenter 320. The center line of the first counterbore hole coincides with the center line of the first threaded hole. The first fixing bolt 350 passes through the first counterbore hole and is screwed into the first threaded hole; the metal frame 330 has a second counterbore hole located on the surface facing the light-transmitting indenter 320 and penetrating through. The elastic pad 340 has a second threaded hole located on the surface facing the metal frame 330. The center line of the second counterbore hole coincides with the center line of the second threaded hole. The second fixing bolt 360 passes through the second counterbore hole and is screwed into the second threaded hole; the third connecting member 303 has a third counterbore hole located on the surface facing away from the elastic pad 340 and penetrating through. The elastic pad 340 has a third threaded hole located on the surface facing the first connecting member 310. The center line of the third counterbore hole coincides with the center line of the third threaded hole. The third fixing bolt 370 passes through the third counterbore hole and is screwed into the third threaded hole.

[0162] Taking the outer contours of the light-transmitting indenter 320, the metal frame 330, the elastic pad 340, and the contour of the third hollow portion of the third connecting member 303 as rectangles as an example, optionally, such as Figure 9As shown, two first counterbore holes are provided at each of the four corners of the light-transmitting indenter 320. Correspondingly, the metal frame 330 has eight first threaded holes that correspond one by one to the eight first counterbore holes on the light-transmitting indenter 320, so as to realize the fixed connection between the light-transmitting indenter 320 and the metal frame 330 through eight first fixing bolts 350; a second counterbore hole is provided in the middle of each side of the metal frame 330. Correspondingly, the elastic pad 340 has four second threaded holes that correspond one by one to the four second counterbore holes, so as to realize the fixed connection between the metal frame 330 and the elastic pad 340 through four second fixing bolts 360; a third counterbore hole is provided at each corner of the third connecting member 303. Correspondingly, the elastic pad 340 has four third threaded holes that correspond one by one to the four third counterbore holes, so as to realize the fixed connection between the metal frame 330 and the elastic pad 340 through four first fixing bolts 350. At this time, the metal frame 330 and the elastic pad 340 can be fixedly connected by the second fixing bolts 360 first, the third connecting member 303 and the elastic pad 340 can be fixedly connected by the third fixing bolts 370, and then the light-transmitting indenter 320 and the metal frame 330 can be fixedly connected by the first fixing bolts 350.

[0163] In some other embodiments, as Figure 10 shown, the pressing assembly 300 further includes a fourth fixing bolt 390 and a locking nut 309. One end of the locking nut 309 is a threaded hole end, and the other end of the locking nut 309 is a threaded end; the light-transmitting indenter 320 has a fourth counterbore hole that penetrates through the surface facing away from the metal frame 330, the metal frame 330 has a first through hole, the elastic pad 340 has a second through hole, and the third connecting member 303 has a fourth threaded hole on the surface facing the elastic pad 340. The center lines of the first counterbore hole, the first through hole, the second through hole, and the fourth threaded hole coincide; the threaded end of the locking nut 309 is screwed into the fourth threaded hole of the first connecting member 310. The threaded hole end of the locking nut 309 sequentially passes through the second through hole, the first through hole, and extends into the small-diameter end of the fourth counterbore hole. The fourth fixing bolt 390 extends into the fourth counterbore hole and is screwed into the threaded hole end of the locking nut 309.

[0164] Taking the outer contours of the light-transmitting indenter 320, the metal frame 330, the elastic pad 340, and the third hollowed-out portion of the third connecting member 303 as rectangles as an example, optionally, as Figure 10As shown, each of the four corners of the light-transmitting indenter 320 has a fourth counterbore hole. Correspondingly, the metal frame 330 has four first through holes that correspond one-to-one to the four fourth counterbore holes on the light-transmitting indenter 320. The elastic pad 340 has four second through holes that correspond one-to-one to the four fourth counterbore holes. The third connecting member 303 has four fourth threaded holes that correspond one-to-one to the four fourth counterbore holes, so as to realize the fixed connection of the third connecting member 303, the light-transmitting indenter 320, the metal frame 330, and the elastic pad 340 through four fourth fixing bolts 390 and four locking nuts 309. At this time, the locking nut 309 can be fixed on the third connecting member 303 first, and then the elastic pad 340, the metal frame 330, and the light-transmitting indenter 320 are sequentially sleeved on the locking nut 309. Then, the fourth fixing bolt 390 is pressed on the light-transmitting indenter 320 and fixedly connected to the locking nut 309.

[0165] In addition, as Figure 10 shown, the pressurizing assembly 300 further includes a washer 308. The washer 308 is sleeved on the fourth fixing bolt 390 and is limited in the fourth counterbore hole of the light-transmitting indenter 320 by the screw head of the fourth fixing bolt 390, so as to provide an elastic margin through the washer 308, thereby realizing the elastic buffer when the pressurizing assembly 300 is fixed.

[0166] Compared with the above-mentioned second fixing method, the first fixing method can separately realize the fixed connection of any two adjacent structural members, thereby reducing the machining accuracy of the counterbore holes or threaded holes on each structural member. At the same time, compared with the situation where the locking nut 309 in the second fixing method passes through the first through hole and the second through hole, it can avoid the shaking of the metal frame 330 and the elastic pad 340 caused by machining errors, thereby ensuring the stability of the fixed connection of the third connecting member 303, the light-transmitting indenter 320, the metal frame 330, and the elastic pad 340.

[0167] In the present disclosure, for the light-transmitting indenter 320 included in the pressurizing assembly 300, in combination with the above-mentioned transfer process of the light-emitting chip, in order to realize the integrated operation of the light-emitting chip in mass transfer, the light-transmitting indenter 320 needs to have the pressure-bearing performance during pressurization, the light-transmitting performance during laser dissociation, and also needs to ensure the normal separation of the first substrate and the second substrate.

[0168] In some embodiments, as Figure 11As shown, the light-transmitting indenter 320 includes a first surface (not shown in the figure) and a second surface 321 that are parallel to each other. Both the first surface and the second surface 321 extend along a plane, and the light-transmitting indenter 320 allows the laser of the target wavelength to pass through in the first direction Z from the first surface to the second surface 321. The light-transmitting indenter 320 is used to transfer the light-emitting chip attached to the first substrate to the second substrate under the action of pressure and the laser of the target wavelength. Among them, the first substrate is located on the side of the light-transmitting indenter 320 close to the second surface 321 and allows the laser of the target wavelength to pass through in the first direction Z. The first substrate and the second substrate are located on the same side of the light-transmitting indenter 320, and the first substrate is closer to the light-transmitting indenter 320 than the second substrate.

[0169] In this way, the feasibility of bearing pressure is realized through the light-transmitting indenter 320. And since the light-transmitting indenter 320 can transmit the laser of the target wavelength in the first direction Z, the feasibility of laser irradiation is realized. Thus, the feasibility of integrating pressure application and laser irradiation is realized, which is convenient for simplifying the process of massive transfer of light-emitting chips and improving production efficiency.

[0170] For example, the light transmittance of the light-transmitting indenter 320 for the laser of the target wavelength is greater than or equal to 80%; further, the light transmittance of the light-transmitting indenter 320 for the laser of the target wavelength is greater than or equal to 90%; even further, the light transmittance of the light-transmitting indenter 320 for the laser of the target wavelength is greater than or equal to 92%. In this way, the light-transmitting effect of the light-transmitting indenter 320 for the laser of the target wavelength is ensured, so as to ensure the effect of the laser passing through the light-transmitting area AA generated by the laser irradiation device during laser dissociation, and further ensure the dissociation effect of the light-emitting chips on the first substrate when the first substrate is irradiated by the laser.

[0171] When the laser passes through the light-transmitting indenter 320 and irradiates the first substrate, in order to ensure that the light transmittance of the light-transmitting indenter 320 for the laser of the target wavelength is greater than 92%, a lens body (double-plane mirror structure) with a light transmittance greater than 92% can be directly selected as the light-transmitting indenter 320, or a lens body with an anti-reflection film attached to its surface can be selected as the light-transmitting indenter 320. Usually, after the lens body is attached with the anti-reflection film, the light transmittance can be as high as 99%.

[0172] Exemplarily, the target wavelength can be in the range of 390nm - 780nm, such as visible light; or in the range of 780nm - 2000nm, such as infrared light; or in the range of 100nm - 390nm, such as ultraviolet light. Specifically, the target wavelength can be in one of the following ranges: 770nm~622nm (red light), 622nm~597nm (orange light), 597nm~577nm (yellow light), 577~492nm (green light), 492nm~450nm (cyan light), 450nm~435nm (blue light), 455nm~350nm (violet light). More specifically, the target wavelength is 355nm.

[0173] Among them, the lens body can generally be a cuboid, a cube, a polygonal prism, a cylinder, etc. The material of the lens body (which is also the material of the light-transmitting indenter) can be glass products (such as fused silica glass, synthetic quartz glass, natural quartz glass), crystalline or amorphous inorganic non-metals, etc., as long as it can meet the light transmittance, pressure-bearing performance (bearing pressure greater than or equal to 0.5 MPa) and high-temperature resistance performance (bearing temperature greater than or equal to 150 °C). Exemplarily, the material of the lens body is silicon dioxide. Exemplarily, the material of the lens body is magnesia quartz glass. Exemplarily, the material of the lens body can be JGS1 quartz glass to ensure the high light transmittance of the light-transmitting indenter 320 to the laser of the target wavelength (such as 355 nm), and at the same time realize the low cost of the light-transmitting indenter 320. JGS1 quartz glass refers to being melted by synthetic stone and high-purity hydrogen oxygen flame. Due to containing a large amount of hydroxyl groups (about 2000 ppm), it has excellent light transmittance. Especially in the short-wave ultraviolet band, its transmittance is far better than that of all other types of glass, and the ultraviolet transmittance at 185 nm can reach more than 90%. Exemplarily, the material of the lens body can be JGS2 quartz glass, or JGS3 quartz glass. Exemplarily, the material of the lens body can be one of Corning 7978 quartz glass, Corning 7979 quartz glass, and Corning 7980 quartz glass.

[0174] For the case where the light-transmitting indenter 320 only includes the lens body, when the laser passes through the lens body, due to the large damage threshold of the lens body, the damage caused by the heat accumulation on the surface area of the lens body to the lens body is avoided. For the case where the light-transmitting indenter 320 includes the lens body and the antireflection film, the first surface and / or the second surface 321 of the lens body has an antireflection film; in addition, when the laser passes through the antireflection film, heat will accumulate on the antireflection film. At this time, in order to avoid the damage caused by the accumulated heat to the antireflection film, the damage threshold greater than or equal to 7.5 J / cm2 can be set on the surface of the lens body. Exemplarily, the damage threshold of the antireflection film is 7.5 J / cm2, 8 J / cm2, 8.5 J / cm2, 9 J / cm2, etc.

[0175] It should be noted that for the case where the above light-transmitting indenter 320 is the lens body, taking the thickness of the light-transmitting indenter 320 as 10 mm as an example, the light transmittance test is carried out, and the test data is shown in the following table.

[0176]

[0177]

[0178] It can be seen from the test data shown in the above table that the average light loss of the light-transmitting indenter 320 with a thickness of 10 mm is 7.37%, so as to ensure that the light transmittance of the light-transmitting indenter 320 is greater than 92%.

[0179] In the present disclosure, when the laser generated by the laser irradiation device irradiates the light-transmitting indenter 320, for the laser vertically passing through the light-transmitting area AA, the laser will not refract, and at this time the optical path of the laser remains unchanged, avoiding the shift of the spot position where the laser irradiates on the first substrate; for the laser obliquely (i.e., not parallel to the first direction Z) passing through the light-transmitting area AA, the laser will refract, resulting in an increase in the optical path of the laser, and further causing the spot where the laser irradiates on the first substrate to shift. When the shift amount of the spot formed by the laser on the first substrate is relatively large, especially for the laser irradiation where one dot corresponds to one light-emitting chip as described above, it is easy to cause some light-emitting chips to not be effectively peeled off or dissociated from the first substrate.

[0180] Among them, as Figure 12 shown, when the laser irradiates the light-transmitting indenter 320 from a vacuum environment, according to Snell's law, the relationship between the incident angle, the refraction angle, and the refractive indices of the two media can be expressed as: n1*sinθ1 = n2*sinθ2. Wherein, n1 and θ1 respectively refer to the refractive index and the incident angle of the laser in the vacuum environment, and n2 and θ2 respectively refer to the refractive index and the refraction angle of the laser in the light-transmitting indenter 320. Since n1 takes the constant 1, the refraction angle of the laser can be determined by combining the refractive index n2 of the laser in the light-transmitting indenter 320 and the incident angle of the laser, and then Figure 10 shown, the shift amount of the spot formed by the laser irradiating on the first substrate is calculated according to the following formula.

[0181] ΔL = (tanθ1 - tanθ2) / D

[0182] In the above formula, ΔL refers to the shift amount of the spot on the first substrate, θ1 refers to the incident angle of the laser, θ2 refers to the refraction angle of the laser, and D refers to the thickness of the light-transmitting indenter 320 (i.e., the thickness of the light-transmitting area AA of the light-transmitting indenter 320).

[0183] Combined with the above, the factors affecting the shift amount of the spot on the first substrate at least include the refractive index of the laser in the light-transmitting indenter 320 and the thickness of the light-transmitting indenter 320. The greater the refractive index of the laser in the light-transmitting indenter 320, the smaller the refraction angle, and further the greater the shift amount of the spot. And the greater the thickness of the light-transmitting indenter 320, the greater the shift amount of the spot.

[0184] Regarding the refractive index of the laser in the light-transmitting indenter 320, for a certain medium, the refractive index of the laser is \(n = c / v\). Since the propagation frequency of the laser is a fixed value, the propagation speed of the laser at this time is \(v = f\times\lambda\). Substituting this into the above refractive index relationship, the refractive index of the laser is \(n = c / (f\times\lambda)\). Thus, when the laser enters the light-transmitting indenter 320 from a vacuum medium, for the laser that passes through obliquely, the relationship between the refractive indices and wavelengths of the laser in the two different media is \(n_1 / n_2=\lambda_2 / \lambda_1\).

[0185] Among them, \(n\), \(v\), and \(\lambda\) respectively refer to the refractive index, propagation speed, and wavelength of the laser in the same medium, \(c\) refers to the propagation speed of the laser in a vacuum, \(f\) is the propagation frequency of the laser, \(n_1\) and \(\lambda_1\) respectively refer to the refractive index and wavelength of the laser in the vacuum medium, and \(n_2\) and \(\lambda_2\) respectively refer to the refractive index and wavelength of the laser in the light-transmitting indenter 320.

[0186] It can be seen from this that there is a certain relationship between the wavelength of the laser and the refractive index of the propagation medium (light-transmitting indenter 320), that is, the shorter the wavelength of the laser, the greater the refractive index of the laser in the light-transmitting indenter 320. For example, in combination with the situation that the larger the refractive index, the larger the offset of the light spot mentioned above, and in combination with the minimum thickness of the light-transmitting indenter 320 involved in the present disclosure, it is necessary to select a double-plane mirror structure with a refractive index less than 1.6 for the laser with a wavelength of 355 nm, that is, the refractive index of the light-transmitting indenter 320 involved in the present disclosure for the laser with a wavelength of 355 nm is less than 1.6 (that is, the refractive index of the light-transmitting indenter 320 is in the range of (1, 1.6)) to avoid the relatively small wavelength of the laser and the relatively large offset of the light spot on the first substrate. When the refractive index of the light-transmitting indenter 320 is greater than or equal to 1.6, the offset of the light spot irradiated on the first substrate is relatively large, which easily affects the peeling or dissociation effect of the light-emitting chip on the first substrate.

[0187] Preferably, the refractive index of the light-transmitting indenter 320 for the laser with a wavelength of 355 nm is in the range of (1, 1.46) to further ensure the peeling or dissociation effect of the light-emitting chip on the first substrate. For example, the refractive index of the light-transmitting indenter 320 for the laser with a wavelength of 355 nm can be 1.1, 1.2, 1.3, 1.4, etc.

[0188] Regarding the thickness of the light-transmitting indenter 320, as the thickness of the light-transmitting indenter 320 increases, the size of the light spot on the first substrate will also change. For example, for the case where the incident angle is 0.705 and the refractive index is 1.45, in combination with light-transmitting indenters 320 of different thicknesses, the change amount of the size of the light spot on the first substrate and the predicted size of the light spot are shown in the following table.

[0189]

[0190] As can be seen from the above table, the light spot on the first substrate becomes larger as the light-transmitting indenter 320 thickens. After performing binary fitting on the thickness of the light-transmitting indenter 320 and the predicted size of the light spot, a corresponding relationship approximated by a straight line can be obtained. Additionally, considering the situation that the larger the thickness of the light-transmitting indenter 320, the greater the offset of the light spot as described above, the thickness of the light-transmitting indenter 320 can be set to be less than or equal to 35 mm, that is, the distance between the first surface and the second surface 321 of the light-transmitting indenter 320 is less than or equal to 35 mm. Preferably, the thickness of the light-transmitting indenter 320 can be set to be less than or equal to 20 mm to minimize the offset of the light spot on the first substrate to the greatest extent.

[0191] In addition, as the thickness of the light-transmitting indenter 320 decreases, the structural strength of the light-transmitting indenter 320 also becomes smaller, and the pressure-bearing capacity becomes weaker. Therefore, in order to ensure that the light-transmitting indenter 320 has a certain structural strength and thus ensure its certain pressure-bearing performance, the thickness of the light-transmitting indenter 320 can be set to be greater than or equal to 8 mm (i.e., the distance between the first surface and the second surface 321 of the light-transmitting indenter 320 is greater than or equal to 8 mm) to avoid the situation where the light-transmitting indenter 320 is damaged due to extrusion when the first substrate and the second substrate come into contact and generate mutual forces.

[0192] Combining the above, the thickness of the light-transmitting indenter 320 is greater than or equal to 8 mm and less than or equal to 35 mm (i.e., the distance between the first surface and the second surface 321 of the light-transmitting indenter 320 is in the range of [8 mm, 35 mm]), which ensures the pressure-bearing capacity of the light-transmitting indenter 320 and at the same time avoids the situation where the light spot on the first substrate cannot effectively dissociate the light-emitting chip due to the offset of the light spot caused by the excessive thickness of the light-transmitting indenter 320. For example, the thickness of the light-transmitting indenter 320 can be set to 8 mm, 12 mm, 16 mm, 20 mm, etc.

[0193] In the present disclosure, when the first substrate is irradiated with a laser, it is found that the peeling or dissociation effect of some light-emitting chips on the first substrate is not ideal. After careful and meticulous research by the inventor, it is found that the energy distribution within each area of some light spots formed by the laser on the first substrate is not uniform, which further causes the dissociation glue in some areas on the first substrate not to dissociate effectively, and thus the peeling or dissociation effect of some light-emitting chips is not ideal.

[0194] For light-transmitting indenters 320 with different thicknesses, the inventor found through experimental data that the thickness of the light-transmitting indenter 320 only affects the transmission of the laser from the aspect of geometric optics and does not affect the uniformity of a single light spot on the first substrate. After careful and meticulous research, the inventor found that the parallelism of the surface of the light-transmitting area AA on the light-transmitting indenter 320 and the inclusions within the light-transmitting area AA may affect the uniformity of the light spot on the first substrate.

[0195] Regarding the parallelism of the surface of the light-transmitting area AA, when the laser passes through the light-transmitting area AA of the light-transmitting pressing head 320, the first surface and the second surface 321 of the light-transmitting pressing head 320 are not strictly flat surfaces in the light-transmitting area AA, which causes reflection, refraction, etc. of the laser, and then leads to uneven light spots formed on the first substrate, and further leads to suboptimal peeling or dissociation effects of the light-emitting chips on the first substrate.

[0196] Among them, the first surface and the second surface 321 of the light-transmitting pressing head 320 are both flat surfaces, and the parallelism of the first surface and the second surface 321 in the light-transmitting area AA is less than or equal to 0.006 mm. Exemplarily, the parallelism of the first surface and the second surface 321 in the light-transmitting area AA is 0.004 mm, 0.005 mm, 0.006 mm. Of course, the parallelism of the first surface and the second surface 321 in the light-transmitting area AA can also be slightly greater than 0.006 mm, as long as the uniformity of the light spots formed on the first substrate can be ensured and the uneven distribution of laser energy in the area where the light spots are formed can be avoided.

[0197] Preferably, the parallelism of the first surface and the second surface 321 in the light-transmitting area AA is less than or equal to 0.003 mm. Exemplarily, the parallelism of the first surface and the second surface 321 in the light-transmitting area AA is 0.002 mm, 0.0025 mm, 0.003 mm.

[0198] In addition, for the case where the first surface and the second surface 321 of the light-transmitting pressing head 320 are both flat surfaces, not only can the uniformity of the light spots on the first substrate be ensured, but also the uniformity of the acting force exerted by the light-transmitting pressing head 320 on the first substrate can be ensured, thereby ensuring that all the light-emitting chips on the first substrate can be effectively bonded to the second substrate.

[0199] Regarding the inclusions in the light-transmitting area AA, the inclusions (such as tiny air bubbles, impurities, etc.) in the light-transmitting pressing head 320 will also cause reflection, refraction, etc. of the laser, and then cause unevenness of the light spots on the first substrate. Thus, the particle size of the inclusions in the light-transmitting pressing head 320 can be set to be less than 0.1 mm to reduce the influence of the inclusions in the light-transmitting pressing head 320 on the reflection, refraction, etc. of the laser, and then ensure the uniformity of the light spots formed on the first substrate.

[0200] Exemplarily, the particle size of the inclusions in the light-transmitting pressing head 320 is 0.04 mm, 0.06 mm, 0.08 mm, 0.1 mm, etc. Of course, the particle size of the inclusions in the light-transmitting pressing head 320 can also be slightly greater than 0.1 mm, such as 0.11 mm, as long as it does not affect the uniformity of the light spots formed on the first substrate.

[0201] It should be noted that the light transmittance, refractive index, thickness, surface parallelism, inclusions, etc. of the light-transmitting indenter 320 involved above in this disclosure are all explained with respect to the light-transmitting region of the laser with the target wavelength for light transmission on the light-transmitting indenter 320.

[0202] In addition, in this disclosure, the refractive index, thickness, surface parallelism, inclusions, etc. of the light-transmitting indenter 320 described above are combined to ensure the optical effect of the light-transmitting indenter 320.

[0203] Optionally, after the light-transmitting indenter 320 transmits the laser within the range where the transmission incident angle is less than or equal to 14 degrees, the spot offset is less than or equal to 0.5 mm. Further, after the light-transmitting indenter 320 transmits the laser within the range where the transmission incident angle is less than or equal to 14 degrees, the spot offset is less than or equal to 200 μm. In this way, after the laser with the target wavelength passes through the light-transmitting region of the light-transmitting indenter and forms a spot on the first substrate, it is possible to avoid the situation where the spot cannot effectively dissociate the dissociation glue between the first substrate and the light-emitting chip due to a large offset, ensuring the dissociation effect of a huge number of light-emitting chips on the first substrate.

[0204] It should be noted that the above spot offset can be the test effect when the laser with a wavelength of 355 nm transmits through the light-transmitting region AA on the light-transmitting indenter 320 and forms a spot of 132 μm * 132 μm; of course, it can also be the test effect when a laser with other wavelengths transmits through the light-transmitting region AA on the light-transmitting indenter 320 and forms spots of other sizes.

[0205] Optionally, after the light-transmitting indenter 320 transmits the laser within the laser amplitude of Amm × Bmm, the deterioration of the laser spot uniformity does not exceed 2%, and both A and B are less than or equal to 70. In this way, by setting the size of the laser amplitude region on the light-transmitting indenter 320, the uniformity of the laser spot within the region corresponding to the entire laser amplitude is ensured, that is, the uniformity of the laser energy within the region corresponding to the entire laser amplitude, so as to avoid the situation where the light-emitting chips in a local area on the first substrate cannot be effectively dissociated, thereby facilitating the improvement of the transfer yield of the light-emitting chips. Exemplarily, the size of the laser amplitude on the light-transmitting indenter 320 is 70 mm × 70 mm, 60 mm × 70 mm, 50 mm × 70 mm, 60 mm × 60 mm, etc.

[0206] Exemplarily, within a region where the laser area is 70 mm × 70 mm, with the size of the incident laser light plate being a square with a side length of 6 mm and the size of the outgoing laser spot being a square with a side length of 137.5 μm, the uniformity of the laser spot before adding the transparent pressure head 320 is 82%, and the uniformity of the laser spot after adding a 10-mm-thick transparent pressure head 320 is 83.5%. Thus, by adding the transparent pressure head 320, the uniformity of the laser spot is effectively improved, ensuring the dissociation effect of the light-emitting chips on the first substrate. For the case of adding the transparent pressure head 320, when the laser passes through the light-transmitting region AA of the transparent pressure head 320, the inclusions within the light-transmitting region AA on the transparent pressure head 320 can adjust the refraction angle of the laser beam to improve the uniformity of the laser light plate. For example, the inclusions of the transparent pressure head 320 can be one or more of air bubbles, scattering particles (such as silica particles, etc.). In this way, uniformly distributed inclusions can be added to the light-transmitting region AA of the transparent pressure head 320 during the preparation of the transparent pressure head 320 to effectively improve the uniformity of the laser light plate.

[0207] Optionally, after the transparent pressure head 320 transmits the laser within a range where the incident angle is less than or equal to 14 degrees, the uniformity of the laser spot is equal to or better than the uniformity of the laser spot before incidence. Thus, by ensuring the uniformity of the laser spot, that is, ensuring the uniformity of the laser energy within the region where the laser spot is located, it is ensured that the light-emitting chips within the region where the laser spot is located can be effectively dissociated, thereby facilitating the improvement of the transfer yield of the light-emitting chips. Combining the above examples, after the laser with a wavelength of 355 nm passes through the light-transmitting region AA of the 10-mm-thick transparent pressure head 320, it is convenient to optimize the uniformity of the laser spot.

[0208] In the present disclosure, when the driving assembly 400 drives the transparent pressure head 320 to cause the first substrate and the second substrate to contact and generate a mutual acting force, the first substrate and the second substrate can be directly placed in alignment first, and then during the process of the driving assembly 400 driving the transparent pressure head 320 to move, pressure is applied to the first substrate to generate a mutual acting force between the first substrate and the second substrate. Or the first substrate can be fixed to the second surface 321 of the transparent pressure head 320 first, and then during the process of the driving assembly 400 driving the transparent pressure head 320 to move, pressure is applied to the first substrate to achieve the contact and generation of a mutual acting force between the first substrate and the second substrate.

[0209] For the case where the first substrate is fixed to the second surface 321 of the transparent pressure head 320, the first substrate can be adhered to the second surface 321 of the transparent pressure head 320 through a dissociation adhesive that is easy to peel off, or can be fixed to the second surface of the transparent pressure head 320 by adsorption. Next, the structure of the transparent pressure head 320 will be explained by taking the first substrate fixed by adsorption as an example.

[0210] As Figure 11 Or Figure 13As shown, the light-transmitting pressing head 320 includes a light-transmitting area AA and a peripheral area BB, and the peripheral area BB surrounds the light-transmitting area AA; a first gas passage (not shown in the figure) is provided in the peripheral area BB, and the first gas passage has a first adsorption port 323 extending to the second surface 321, and the first adsorption port 323 is distributed around the light-transmitting area AA. In addition, the first gas passage also has a first air extraction port 322 extending to the first surface and / or side wall of the light-transmitting pressing head 320, and the first air extraction port 322 is used to connect to an air extraction device so as to adsorb and fix the first substrate through the first adsorption port 323.

[0211] Thus, by providing the first gas passage in the peripheral area BB of the light-transmitting pressing head 320 to form the first adsorption port 323 on the second surface 321, while ensuring the stable adsorption of the first substrate, the influence on the laser is avoided, and the spot effect of the laser passing through the light-transmitting area AA is ensured.

[0212] Exemplarily, in combination with the thickness of the light-transmitting pressing head 320 described above, taking the thickness of the light-transmitting pressing head 320 as 8 mm and the first air extraction port 322 being located on the side wall of the light-transmitting pressing head 320 as an example, a straight-through joint 380 with a length of 7 mm is provided at the first air extraction port 322 so as to be directly connected to the air extraction device and ensure the structural strength of the light-transmitting pressing head 320 at the same time.

[0213] In the embodiment of the present disclosure, when the first substrate is adsorbed by the light-transmitting pressing head 320, in order to ensure the effective separation of the first substrate and the second substrate, it is necessary to ensure that the adsorption force of the light-transmitting pressing head 320 on the first substrate is greater than the molecular interaction force between the first substrate and the second substrate.

[0214] Among them, when the first substrate is adsorbed by the light-transmitting pressing head 320, the fixation of the first substrate can be realized by negative pressure adsorption. Exemplarily, the fixation of the first substrate can be realized by vacuum adsorption.

[0215] Generally, the first substrate is adsorbed on the light-transmitting pressing head 320 along the first direction Z (i.e., the vertical direction). At this time, the magnitude of the adsorption force of the light-transmitting pressing head 320 on the first substrate can be calculated by the following formula.

[0216] F = 0.1 x A x P / S;

[0217] In the above formula, F refers to the adsorption force of the light-transmitting pressing head 320 on the first substrate, and the unit is Newton; A refers to the effective adsorption area of the first adsorption port 323 on the second surface 321, and the unit is cm 2 ², P refers to the vacuum degree of the gas passage when the light-transmitting pressing head 320 adsorbs the first substrate, and the unit is kPa; S refers to the safety factor, and S is greater than or equal to 2.

[0218] Combined with the above formula, it can be seen that the adsorption force of the light-transmitting pressing head 320 on the first substrate varies positively with the vacuum degree and the safety factor. That is, as the vacuum degree increases or the safety factor increases, the adsorption force will increase. In normal use, the vacuum degree of the light-transmitting pressing head 320 adsorbing the first substrate is greater than or equal to 80 kPa. Thus, the minimum adsorption force of the light-transmitting pressing head 320 on the first substrate is 4A (in Newtons). And combined with the test data, the molecular force between the first substrate and the second substrate is usually greater than or equal to 1 Newton and less than or equal to 5 Newtons. In this way, in order to ensure that the adsorption force of the light-transmitting pressing head 320 on the first substrate is greater than the molecular force between the first substrate and the second substrate, that is, 4A is greater than 5 Newtons, it can be obtained that A is greater than 1.25 cm 2 , that is, the effective adsorption area of the first adsorption port 323 on the second surface 321 is greater than 1.25 cm 2 .

[0219] It should be noted that when the light-transmitting pressing head 320 adsorbs the first substrate, if the vacuum degree is less than 80 kPa, the effective adsorption area of the first adsorption port 323 on the second surface 321 of the light-transmitting pressing head 320 can also be less than or equal to 1.25 cm 2 , as long as it can ensure that the first substrate and the second substrate can be normally separated after the light-transmitting pressing head 320 adsorbs the first substrate. In addition, if the molecular force between the first substrate and the second substrate is less than 5 Newtons, the effective adsorption area of the first adsorption port 323 on the second surface 321 of the light-transmitting pressing head 320 can also be less than or equal to 1.25 cm 2 , and the present disclosure does not limit this embodiment

[0220] In some embodiments, as Figure 13 shown, the light-transmitting pressing head 320 includes a contour surface 326 located between the first surface and the second surface 321. The first gas passage includes an annular groove 324 and a ventilation hole 327. The notch of the annular groove 324 is located on the second surface 321 and forms the first adsorption port 323. One end of the ventilation hole 327 is communicated with the annular groove 324, and the port of the other end of the ventilation hole 327 is located on the contour surface 326 and forms the first air extraction port 322. The first air extraction port 322 is used to communicate with the air extraction device

[0221] Among them, the annular groove 324 is a square annular groove, a rectangular annular groove, a circular annular groove, etc., and the present disclosure does not limit this. Specifically, the shape of the annular groove 324 can be determined according to the outer contour shape of the light-transmitting area AA, as long as it can ensure stable adsorption and fixation of the first substrate and does not affect the transmission of the laser in the light-transmitting area AA. For the shape of the outer contour of the light-transmitting area AA, it can be designed in combination with the outer contour shape of the light-emitting chip on the first substrate to ensure that the laser can effectively dissociate the dissociation glue bonding the light-emitting chip through the light-transmitting area AA

[0222] Exemplarily, the shape of the outer contour of all the light-emitting chips on the first substrate is square. At this time, the shape of the outer contour of the light-transmitting area AA on the light-transmitting pressing head 320 can be designed as square, and then the annular groove 324 is set as a square annular groove, so as to ensure that the first substrate can be stably adsorbed and fixed, and at the same time reduce the size of the light-transmitting pressing head 320.

[0223] Optionally, taking the annular groove 324 as a square annular groove, the side length of the inner ring of the square annular groove is greater than or equal to 75 mm and less than or equal to 80 mm. Exemplarily, the side length of the annular groove 324 is 75 mm, 77 mm, 79 mm, 80 mm. In this way, to ensure that a sufficiently large laser amplitude can be designed on the light-transmitting pressing head 320 as the light-transmitting area AA, and further ensure that the light spot formed by the laser in the light-transmitting area AA on the first substrate can completely cover the dissociation glue for fixing the light-emitting chips.

[0224] Combined with the above-mentioned effective adsorption area of the first adsorption port 323 on the second surface 321 of the light-transmitting pressing head 320 being greater than 1.25 cm 2 , at this time, the groove width of the square annular groove can be set to be greater than or equal to 0.42 mm. Exemplarily, the groove width of the square annular groove is 0.5 mm, 1.0 mm, 1.5 mm, 2.0 mm.

[0225] Furthermore, the groove width of the annular groove 324 can be set to be less than or equal to 1 mm. Exemplarily, the groove width of the annular groove 324 is 0.42 mm, 0.62 mm, 0.82 mm, 1.0 mm. In this way, while ensuring the adsorption stability of the first adsorption port 323 of the square annular groove to the first substrate, the situation of the large size of the light-transmitting pressing head 320 can be avoided.

[0226] In a specific embodiment, as Figure 14 and Figure 15 shown, the light-transmitting pressing head 320 is a cube with a side length of 100 mm and a thickness of 10 mm. The annular groove 324 on the second surface 321 of the light-transmitting pressing head 320 is a square annular groove, and the side length of the inner ring of the annular groove 324 is 78 mm, the side length of the outer ring is 82 mm, the groove width of the annular groove 324 is 2 mm, and the groove depth is 6 mm.

[0227] Among them, the annular groove 324 can be directly machined on the second surface 321 of the light-transmitting pressing head 320, and at the same time, an air vent 327 communicating with the annular groove 324 is arranged on the contour surface 326 of the light-transmitting pressing head 320 to obtain the first air extraction port 322.

[0228] In some other embodiments, as Figure 11As shown, the outer contour of the light-transmitting indenter 320 is rectangular; the light-transmitting indenter 320 includes four sub-profile surfaces 3261 located between the first surface and the second surface 321. The first gas passage includes four air channels 328 and four groups of air-permeable holes 325, and the four sub-profile surfaces 3261, the four air channels 328, and the four groups of air-permeable holes 325 correspond one by one. One air channel 328 is located between a corresponding sub-profile surface 3261 and the light-transmitting area AA. One end of the air-permeable holes 325 in a group of air-permeable holes 325 communicates with a corresponding air channel 328, and the other end is located on the second surface 321, forming a first adsorption port 323. One air channel 328 extends to two sub-profile surfaces 3261 adjacent to a corresponding sub-profile surface 3261, and a pair of orifices are formed on the two adjacent sub-profile surfaces 3261. At least one orifice in the four pairs of orifices forms a first air extraction port 322, which is used to communicate with the air extraction device, and the remaining orifices are sealed.

[0229] In this way, the first adsorption port 323 is formed by the orifices of multiple groups of air-permeable holes 325, avoiding the situation that the entire first adsorption port 323 is depressurized due to the pressure relief of some air-permeable holes 325 when the light-transmitting indenter 320 adsorbs the first substrate, and improving the stability of the adsorption of the first substrate.

[0230] Optionally, the four air channels 328 are located in the same plane and communicate with each other. At this time, one orifice in the four pairs of orifices can be set to form the first air extraction port 322, and the remaining orifices are all sealed. In this way, the number of the first air extraction ports 322 can be reduced, and then the number of air extraction devices can be reduced. The air channel 328 extends in a straight line direction and is parallel to the plane where a corresponding sub-profile surface 3261 is located.

[0231] Among them, the orifice shape of the air-permeable hole 325 can be square, rectangular, circular, oval, etc. For example, the light-transmitting area AA is rectangular. At this time, the orifice shape of the air-permeable hole 325 can be set to be oval, and the long axis of the oval is parallel to the side close to the light-transmitting area AA. In this way, on the basis of ensuring the adsorption strength of each air-permeable hole 325 on the first substrate, the size of the light-transmitting indenter 320 can be reduced.

[0232] Optionally, the orifice area of the air-permeable hole 325 is greater than or equal to 0.785mm 2 and less than or equal to 7.065mm 2 . For example, the orifice area of the air-permeable hole 325 is 0.785mm 2 , 0.1mm 2 , 1mm 2 , 3mm 2 , 5mm 2 , 7.065mm 2 etc.

[0233] Combined with the above, the effective adsorption area of the first adsorption port 323 on the second surface 321 of the light-transmitting pressing head 320 is greater than 1.25 cm 2 , at this time, the number of air-permeable holes 325 provided on the second surface 321 of the light-transmitting pressing head 320 can be determined according to the minimum effective adsorption cotton and the orifice area of the air-permeable holes 325. For example, the orifice diameter of the air-permeable hole 325 is 1 mm, and at this time the orifice area is 3.14 mm 2 , and then it is determined that the minimum number of air-permeable holes 325 is 40.

[0234] Optionally, the distance between two adjacent air-permeable holes 325 (the distance between the center points of the air-permeable holes 325) is greater than or equal to 3 mm. In this way, it can be ensured that after the air-permeable holes 325 are provided on the second surface 321 of the light-transmitting pressing head 320, the structural strength of the light-transmitting pressing head 320 is avoided, and the situation that the light-transmitting pressing head 320 is easily compressed due to the small distance between two adjacent air-permeable holes 325. For example, the distance between two adjacent air-permeable holes 325 is 3 mm, 4 mm, 5 mm, etc.

[0235] Furthermore, the distance between two adjacent air-permeable holes 325 is less than or equal to 6 mm. In this way, it can be ensured that a relatively large number of air-permeable holes 325 are provided on the second surface 321 of the light-transmitting pressing head 320 to ensure that the second surface 321 of the light-transmitting pressing head 320 has a sufficient effective adsorption area. For example, the distance between two adjacent air-permeable holes 325 is 4 mm. At this time, the second surface 321 of the light-transmitting pressing head 320 has 76 air-permeable holes 325 to ensure the stable adsorption of the light-transmitting pressing head 320 to the first substrate.

[0236] In a specific embodiment, as Figure 16 shown, the light-transmitting pressing head 320 is a cube with a side length of 100 mm (thickness of 10 mm). The orifice diameter of the air-permeable holes on the second surface 321 of the light-transmitting pressing head 320 is 1 mm (i.e., the orifice area is 3.14 mm2), and the distance between two adjacent air-permeable holes 325 is 4 mm. In addition, the light-transmitting pressing head 320 also has 8 uniformly distributed and through stepped holes. The diameter of the large end of the stepped hole is 5.5 mm, and the diameter of the small end is 2.9 mm.

[0237] Among them, a plurality of air-permeable holes 325 can be directly processed on the second surface 321 of the light-transmitting pressing head 320. At the same time, an air channel 328 connecting a column of air-permeable holes 325 is provided on the sub-profile surface 3261 of the light-transmitting pressing head 320 along the arrangement direction of the plurality of air-permeable holes 325 to obtain four air channels 328 located on the four sub-profile surfaces 3261 and communicating with each other. Then, one orifice of one air channel 328 is reserved as the first air extraction port 322, and the orifices of the remaining air channels 328 are sealed with a sealing plug.

[0238] The present disclosure provides a method for transferring a light-emitting chip, the method comprising:

[0239] transferring the light-emitting chip from the source substrate to the intermediate substrate, and then from the intermediate substrate to the display substrate;

[0240] wherein, the light-emitting chip transfer device described in the above embodiment is used to transfer the light-emitting chip from the source substrate to the intermediate substrate, the first substrate is the source substrate, and the second substrate is the intermediate substrate; and / or the light-emitting chip transfer device described in the above embodiment is used to transfer the light-emitting chip from the intermediate substrate to the display substrate, the first substrate is the intermediate substrate, and the second substrate is the display substrate.

[0241] The present disclosure provides another method for transferring a light-emitting chip, the method comprising:

[0242] heating, pressing, and laser irradiating the first substrate and the second substrate located on the heating and pressing device by using the light-emitting chip transfer device described in the above embodiment, the first substrate allows the laser of the target wavelength to pass through in the first direction Z, and the light-emitting chip is initially located on the first substrate:

[0243] wherein, the driving component 400 drives the pressing component 300 to move towards the bearing platform 200 for pressing, so that the first substrate and the second substrate come into contact and generate a mutual acting force; the heating member heats the second substrate carried on the bearing platform 200; the laser generated by the laser irradiating device passes through the light-transmitting part 3201 of the light-transmitting pressing head 320 to irradiate the first substrate and the second substrate with laser, so that the light-emitting chip on the first substrate is transferred to the second substrate.

[0244] In a specific embodiment, the light-emitting chip is located on one side of the first substrate, and there is a first adhesive layer (i.e., a release adhesive that can be peeled off by a laser of a specific wavelength, or a dissociation adhesive that dissociates) sensitive to the laser of a specific wavelength between the first substrate and the light-emitting chip; when performing chip transfer, the second substrate is disposed opposite to the first substrate, and one side of the second substrate facing the first substrate includes a second adhesive layer (i.e., an adhesive layer that is glued after being heated to a certain temperature). After the first substrate and the second substrate come into contact and generate a mutual acting force, when the laser sequentially passes through the light-transmitting pressing head and the first substrate and acts on the first adhesive layer at the target position, the viscosity of the first adhesive becomes weaker, making the light-emitting chip at the target position easier to be adhered by the second adhesive layer, thereby realizing the transfer of the light-emitting chip from the first substrate to the second substrate. Heating, pressing, and laser irradiation are performed simultaneously, which is beneficial to firmly bonding the transferred light-emitting chip to the second substrate.

[0245] For example, a laser can perform surface irradiation on the first substrate (the irradiation area is relatively large) to transfer multiple light-emitting chips; for example, a laser can perform point irradiation on the first substrate (it can be understood that the irradiation area only plays a role in transferring one of the light-emitting chips) to transfer the light-emitting chip at a target position; for example, a laser can scan the first substrate to sequentially transfer multiple light-emitting chips arranged in an array from the first substrate to the second substrate. Therefore, by using the light-emitting chip transfer device of the present disclosure, selective transfer of the light-emitting chips can be achieved.

[0246] It should be noted that although the steps of the method for transferring the light-emitting chips in the present disclosure are described in a specific order in the drawings, this does not require or imply that these steps must be performed in that specific order, or that all the steps shown must be performed to achieve the desired result. Additionally or alternatively, some steps may be omitted, multiple steps may be combined into one step for execution, and / or one step may be decomposed into multiple steps for execution, etc.

[0247] Those skilled in the art will readily conceive of other embodiments of the present disclosure after considering the specification and practicing the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the present disclosure that follow the general principles of the present disclosure and include known common knowledge or conventional technical means in the technical field not disclosed in the present disclosure. The specification and examples are only to be considered as exemplary, and the true scope and spirit of the present disclosure are pointed out by the appended claims.

Claims

1. A pressurizing driving mechanism, characterized in that, comprising: a driving component; a pressurizing component, the pressurizing component includes a first connecting member and a light-transmitting pressing head, the first connecting member includes a pressurizing portion and a first hollowed-out portion, the pressurizing portion is respectively connected to the light-transmitting pressing head and the driving component, and the side of the light-transmitting pressing head away from the pressurizing portion is used to connect a first substrate. The light-transmitting pressing head includes a light-transmitting portion, and the light-transmitting portion is used to allow a laser with a target wavelength to pass through along a first direction. At least part of the orthographic projection of the light-transmitting portion on a reference plane coincides with the orthographic projection of the first hollowed-out portion on the reference plane, and the driving component is at least connected to opposite sides of the first hollowed-out portion; the reference plane and the first direction are perpendicular to each other; wherein, the driving component drives the light-transmitting pressing head to move along the first direction through the first connecting member, so that the light-transmitting pressing head drives the first substrate and the second substrate to contact each other and generate an interaction force in the first direction, and under the action of the laser with the target wavelength, the light-emitting chip disposed on the first substrate is transferred to the second substrate, wherein the first substrate and the second substrate are located on the same side of the light-transmitting pressing head, and the first substrate is disposed between the light-transmitting pressing head and the second substrate.

2. The pressurizing driving mechanism according to claim 1, characterized in that, the pressurizing portion includes a pressurizing area, the orthographic projection of the pressurizing area on the reference plane surrounds the orthographic projection of the first hollowed-out portion on the reference plane, and the orthographic projection of the pressurizing area on the reference plane is arranged along the edge of the orthographic projection of the first connecting member on the reference plane.

3. The pressurizing driving mechanism according to claim 2, characterized in that, the first hollowed-out portion is a first through hole provided on the first connecting member, and the pressurizing area is the portion of the first connecting member where the first through hole is not provided.

4. The pressurizing driving mechanism according to claim 2, characterized in that, the adjacent side of the first hollowed-out portion and the pressurizing area includes an arc-shaped edge; the pressurizing component further includes an arc-shaped concave surface, and the orthographic projection of the arc-shaped concave surface on the reference plane is conformal with the orthographic projection of the arc-shaped edge on the reference plane.

5. The pressurizing driving mechanism according to claim 1, characterized in that, the first hollowed-out portion is a circular structure.

6. The pressurizing driving mechanism according to claim 1, characterized in that, the pressurizing component further includes: a second connecting member, disposed between the first connecting member and the light-transmitting pressing head, the second connecting member includes a cross plate and a column, the cross plate is provided with a second hollowed-out portion, and at least part of the orthographic projection of the light-transmitting portion on the reference plane coincides with the orthographic projection of the second hollowed-out portion on the reference plane. The column is perpendicular to the cross plate, the column is disposed between the first connecting member and the cross plate, and the column is correspondingly disposed with the driving component and is at least disposed on opposite sides of the first hollowed-out portion.

7. The pressurizing driving mechanism according to claim 6, characterized in that, the pressurizing component further includes: The third connecting member is disposed between the second connecting member and the light-transmitting pressing head. The third connecting member is provided with a third hollow portion, and at least a part of the orthographic projection of the light-transmitting portion on the reference plane coincides with the orthographic projection of the third hollow portion on the reference plane; Wherein, along the first direction, the thickness of the third connecting member is greater than the thickness of the transverse plate in the second connecting member.

8. The pressurizing drive mechanism according to claim 7, characterized in that The second hollow portion, the third hollow portion and the light-transmitting portion are all rectangular structures.

9. The pressurizing drive mechanism according to claim 7, characterized in that The pressurizing assembly further includes: A pressure sensor disposed between the third connecting member and the light-transmitting pressing head; An inclination sensor disposed on the third connecting member.

10. The pressurizing drive mechanism according to claim 2, characterized in that The pressurizing assembly further includes: A driving connecting member, the driving connecting member is connected to the driving assembly and is located on the side of the first connecting member away from the light-transmitting pressing head. The driving connecting member is in contact with the first connecting member, and the area where the driving connecting member is in contact with the first connecting member is the pressurizing area.

11. The pressurizing drive mechanism according to claim 10, characterized in that The driving connecting member is in contact with the driving assembly, and the area where the driving connecting member is in contact with the driving assembly is perpendicular to the pressurizing area.

12. The pressurizing drive mechanism according to any one of claims 1-9, characterized in that The number of the driving assemblies is multiple, and the multiple driving assemblies are disposed on opposite sides of the first hollow portion and are connected to the pressurizing portion.

13. The pressurizing drive mechanism according to claim 12, characterized in that The pressurizing drive mechanism further includes a fixing bracket, the fixing bracket is located on the side of the first connecting member away from the light-transmitting pressing head, and adjacent two driving assemblies are connected by the fixing bracket.

14. The pressurizing drive mechanism according to claim 13, characterized in that The fixing bracket includes: A supporting side plate disposed on one side of the driving assembly along the second direction; A mounting plate disposed on one side of the driving assembly along the third direction. The supporting side plate is provided with a connecting arm on the side along the second direction and facing the driving assembly, and the connecting arm is disposed between the driving assembly and the mounting plate; A fixing plate disposed on the side of the mounting plate along the third direction and away from the driving assembly, and the fixing plate is connected to the mounting plate and the supporting side plate; Wherein, the first direction, the second direction and the third direction are perpendicular to each other in pairs.

15. The pressurizing drive mechanism according to any one of claims 1-9, characterized in that The driving assembly includes: A first slide rail extending along the first direction; A slider slidably connected to the first slide rail, and the slider is connected to the pressurizing assembly; A power driving member connected to the slider for driving the slider to slide along the first slide rail and applying pressure to the pressurizing assembly.

16. The pressurizing drive mechanism according to claim 15, It is characterized in that the driving component further includes a first support member and a photoelectric sensor. The first slide rail is connected to the first support member, and the photoelectric sensor is disposed on the first support member and on one side of the first slide rail; the power driving member includes a driving motor, a power conversion element, a speed reducer, a speed reduction mounting seat, and a coupling. The speed reduction mounting seat is disposed on one side of the first support member along the first direction, the speed reducer is disposed on the speed reduction mounting seat, the driving motor is connected to the speed reducer, the power conversion element has a power input end and a power output end, the speed reducer is connected to the power input end of the power conversion element through the coupling, and the power output end of the power conversion element is respectively connected to the slider and the first connecting member of the pressing component. The power conversion element is used to convert the rotational power output by the driving motor into linear motion.

17. A heating and pressing device It is characterized in that it includes a heating and carrying mechanism and the pressing driving mechanism according to any one of claims 1-16; the heating and carrying mechanism includes a heating member and a carrying table. The carrying table is used to carry the second substrate, and the heating member is used to heat the second substrate on the carrying table; wherein, the light-transmitting pressing head and the carrying table are oppositely arranged in the first direction. The light-transmitting pressing head is used to connect the first substrate, and the driving component is used to drive the light-transmitting pressing head to move in the first direction, so that the light-transmitting pressing head drives the first substrate and the second substrate to contact in the first direction and generate a mutual acting force.

18. The heating and pressing device according to claim 17 It is characterized in that a second gas passage is provided in the carrying table, and the second gas passage has a second adsorption port extending to the surface of the carrying table facing the pressing component.

19. The heating and pressing device according to claim 17 It is characterized in that the number of the pressing driving mechanisms is multiple. The multiple pressing driving mechanisms are respectively located on both sides of the heating member in the second direction, and the two pressing driving mechanisms are axially symmetrically arranged with respect to the central axis of the heating member. The second direction is perpendicular to the first direction.

20. The heating and pressing device according to claim 17 It is characterized in that the target wavelength is in the range of 100 nm - 2000 nm.

21. A light-emitting chip transfer device It is characterized in that it includes: the heating and pressing device according to any one of claims 17-20; a laser irradiation device for generating a laser with a target wavelength and irradiating the laser to the light-transmitting area of the light-transmitting pressing head.

22. A method for transferring a light-emitting chip It is characterized in that it includes: transferring the light-emitting chip from the source substrate to the intermediate substrate, and then from the intermediate substrate to the display substrate; wherein, the light-emitting chip transfer device according to claim 21 is used to transfer the light-emitting chip from the source substrate to the intermediate substrate. The first substrate is the source substrate, and the second substrate is the intermediate substrate. And / or, transferring the light-emitting chip from the intermediate substrate to the display substrate by using the light-emitting chip transfer device according to claim 21, wherein the first substrate is the intermediate substrate and the second substrate is the display substrate.

23. A method for transferring a light-emitting chip, characterized in that it includes: heating, pressurizing and laser irradiating the first substrate and the second substrate located on the heating and pressurizing device by using the light-emitting chip transfer device according to claim 21, wherein the first substrate allows the laser of the target wavelength to pass through in the first direction, and the light-emitting chip is initially located on the first substrate; wherein the driving component drives the pressurizing component to move towards the carrier table to apply pressure, so that the first substrate and the second substrate come into contact and generate a mutual acting force; the heating member heats the second substrate carried on the carrier table; the laser generated by the laser irradiating device passes through the light-transmitting part of the light-transmitting pressing head to irradiate the first substrate and the second substrate with laser, so that the light-emitting chip on the first substrate is transferred to the second substrate.

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