Wafer cleaning equipment and wafer cleaning method

Abstract

The present application discloses a wafer cleaning device and a wafer cleaning method, belonging to the technical field of wafer cleaning. A tank cleaning machine and a single wafer scrubbing machine are arranged side by side. In this way, after the cleaned wafer is transported to the waiting station by the first wafer picking component, the second wafer picking component in the single wafer scrubbing machine transports the wafer to the scrubbing and drying component through the wafer inlet and outlet for further cleaning and drying. That is to say, the integration and linkage of the tank cleaning machine and the single wafer scrubbing machine are realized to clean and dry the wafer, which can omit the process flow in the related art of manually transporting the wafer after tank cleaning into the wafer drying device and then manually transporting the dried wafer into the single wafer scrubbing machine. In this way, while reducing the equipment investment cost, the instability of wafer transfer by personnel is reduced, the risk caused by possible misoperation of employees is reduced, the cleaning efficiency of the wafer and the process ability of cleaning are improved, and the yield of the integrated wafer product is ensured.

Description

Technical Field

[0001] The present application relates to the field of wafer cleaning technology, and in particular to a wafer cleaning device and a wafer cleaning method. Background Art

[0002] Wafers are the fundamental raw materials used in the manufacture of semiconductor devices. Examples include wafers made from materials such as silicon, sapphire, silicon carbide, gallium nitride, gallium oxide, lithium tantalate, and lithium niobate. These are used in photovoltaic devices, LED light-emitting elements, power devices, and other fields. After grinding, polishing, and slicing, the crystal ingot is formed into wafers, also known as wafers. The main wafer processing methods are sheet processing and batch processing, which involves processing one or more wafers simultaneously. Currently, cleaning is the most critical step in wafer processing that affects wafer surface cleanliness.

[0003] Therefore, there is an urgent need to provide an efficient wafer cleaning device. Summary of the Invention

[0004] The present application provides a wafer cleaning device that can solve the problem of the prior art that an efficient wafer cleaning device is urgently needed. The technical solution is as follows:

[0005] In one aspect, a wafer cleaning device is provided, comprising:

[0006] Tank cleaning machines and single-piece brush scrubbers arranged side by side;

[0007] The tank-type cleaning machine includes: a first shell, a first sheet picking assembly and two groups of sheet grabbing and transferring assemblies installed in the first shell, and two liquid medicine tanks, two transfer tables and at least one cleaning water tank distributed between the first sheet picking assembly and the two groups of sheet grabbing and transferring assemblies, wherein the liquid medicine tank and the cleaning water tank each have a plurality of vertically arranged trough bodies; the transfer table has a horizontally arranged support position; a sheet outlet is provided on a side of the first shell close to the single-sheet scrubber, and a material waiting station is provided between the first sheet picking assembly and the sheet outlet;

[0008] The single-sheet scrubber comprises: a second shell, a second sheet taking assembly installed in the second shell, and at least one scrubbing and drying assembly, wherein the second shell has a sheet inlet on a side close to the first shell;

[0009] Among them, the first wafer picking component is used for: grasping a single wafer to be washed and transferring it to the support position; each set of wafer picking and transferring components is used for: grasping a single wafer to be washed at the support position, flipping it by a target angle and placing it in the chemical liquid tank, or, grasping the washed wafer in the chemical liquid tank to the cleaning water tank, or, grasping the wafer in the cleaning water tank, flipping it by the target angle and placing it at the support position; the first wafer picking component is further used for: grasping the washed wafer at the support position to the waiting material station; the second wafer picking component is used for: transferring the wafer at the waiting material station to the brushing and spin-drying component through the wafer inlet and outlet.

[0010] Optionally, the first housing and the second housing are arranged along a first direction; the two chemical liquid tanks are arranged along the first direction, the two transfer platforms are located between the two chemical liquid tanks, and the at least one cleaning water tank is located between the two transfer platforms;

[0011] Among them, the arrangement direction of the second wafer picking component and the brushing and spin-drying component is parallel to the arrangement direction of the first wafer picking component and the two sets of wafer picking and transferring components. The first wafer picking component and the two sets of wafer picking and transferring components are arranged along a second direction, and the second direction is perpendicular to the first direction.

[0012] Optionally, the wafer picking and transferring component includes: a translation mechanism, a lifting mechanism, a rotation driving member, an arm driving member, and two parallel arms. The translation mechanism is installed at the bottom of the first housing and extends along the first direction; the lifting mechanism is slidably connected to the translation mechanism and extends along a third direction; the rotation driving member is installed on the lifting mechanism, and the rotation axis of the rotation driving member is fixedly connected to the arm driving member; the third direction is perpendicular to both the first direction and the second direction;

[0013] One end of each of the two arms is connected to the arm driving member. One end of one arm away from the arm driving member has two relatively arranged first limiting clamping protrusions, and one end of the other arm away from the arm driving member has two relatively arranged second limiting clamping protrusions. A clamping space is formed between the two first limiting clamping protrusions and the two second limiting clamping protrusions;

[0014] Among them, the rotation driving member is configured to: drive the arm driving member to rotate by the target angle around the rotation axis of the rotation driving member; the arm driving member is configured to: drive the two arms to move relatively, so as to drive the two first limiting clamping protrusions and the two second limiting clamping protrusions to move towards or away from each other.

[0015] Optionally, one of the clamping arms is a U-shaped clamping arm, and a part of the other clamping arm extends into the hollow area of the U-shaped clamping arm and is fixedly connected to the clamping arm driving member; wherein, the two first limiting clamping convex parts are respectively located at the two ends of the U-shaped clamping arm, and the two second limiting clamping convex parts are located at one end of the other clamping arm away from the clamping arm driving member.

[0016] Optionally, the first wafer picking component includes: a first translation mechanism, a first lifting mechanism, a first rotation driving member, a translation driving member, and a wafer clamping mechanism, which are sequentially arranged along the bottom away from the first housing. The first translation mechanism is installed at the bottom of the first housing and extends along the first direction. The first lifting mechanism is installed on the first translation mechanism and extends along the third direction. The first rotation driving member is installed on the first lifting mechanism, and the rotation axis of the first rotation driving member is fixedly connected to the translation driving member; the wafer clamping mechanism is installed on the translation driving member;

[0017] Wherein, the translation driving member is configured to: drive the wafer clamping mechanism to pick up the unwashed wafer and transport it to the support position, or transport the wafer at the support position to the waiting material station; the first rotation driving member is configured to: drive the translation driving member and the wafer clamping mechanism to rotate synchronously.

[0018] Optionally, the wafer clamping mechanism includes: a fixed support plate, a clamping support plate, and a support plate driving member. One end of the fixed support plate is fixedly connected to the translation driving member. The support plate driving member is fixed on the translation driving member, and the telescopic shaft of the support plate driving member is fixedly connected to one end of the clamping support plate;

[0019] Wherein, the other end of the fixed support plate has a first bearing arc surface, the other end of the clamping support plate has a second bearing surface, and the support plate driving member is configured to: drive the clamping support plate to move along the direction close to or away from the other end of the fixed support plate.

[0020] Optionally, the number of the wafer clamping mechanisms and the number of the translation driving members are both at least two, and the fixed support plates, the clamping support plates, and the support plate driving members in the at least two wafer clamping mechanisms are stacked.

[0021] Optionally, the transfer table has a set of multiple first limiting support convex parts distributed in a ring at the support position, and a set of multiple second limiting support convex parts distributed in a ring. The multiple first limiting support convex parts are distributed in the ring area surrounded by the multiple second limiting support convex parts;

[0022] The top of the second position-limiting support protrusion protrudes from the top of the first position-limiting support protrusion, the multiple first position-limiting support protrusions are used to support the first type of wafers, and the multiple second position-limiting support protrusions are used to support the second type of wafers.

[0023] Optionally, the transfer platform includes: a first platform body, and a second platform body distributed around the first platform body, the plurality of first position-limiting support protrusions are provided on the first platform body, and the plurality of second position-limiting support protrusions are provided on the second platform body;

[0024] The tank cleaning machine further includes: a second lifting mechanism and a second rotary drive member, wherein the second lifting mechanism is connected to the first housing, the second rotary drive member is mounted on the second lifting mechanism, and the rotary shaft of the second rotary drive member is connected to the first platform; the second platform is connected to the second lifting mechanism;

[0025] The second rotary drive member is configured to: drive the first stage to rotate while driving the first type of wafer to rotate a certain angle, so that the positioning edge of the first type of wafer is staggered with the clamping space.

[0026] Optionally, the first position-limiting support protrusion and the second position-limiting support protrusion each include: a support column and a position-limiting column, wherein the bottom of the support column is fixed to the turntable, the diameter of the position-limiting column is smaller than the diameter of the support column, and the position-limiting column is fixed to the central area of the top of the support column; the edge area of the top of the support column has a support surface;

[0027] Wherein, the supporting surface is used for cooperating and contacting with the chamfered surface of the edge of the wafer.

[0028] On the other hand, an embodiment of the present application further provides a wafer cleaning method, which is applied to any of the wafer cleaning devices described above.

[0029] The first wafer picking assembly grabs a single wafer to be cleaned and transfers it to a support position, and the wafer grabbing and transferring assembly grabs the single wafer to be cleaned on the support position, flips it to a target angle, and then places it in a chemical solution tank;

[0030] The grabbing piece transfer assembly grabs the cleaned wafers in the liquid tank and transfers them to the clean water tank;

[0031] The grabbing and transferring assembly grabs the wafer in the cleaning water tank, leaves the cleaning water tank, flips the wafer to the target angle, and then places the wafer in the supporting position;

[0032] The first wafer picking assembly grabs the cleaned wafer on the support position and moves it to the waiting position;

[0033] The second wafer picking component transfers the wafer on the feeding station to the brushing and spin-drying component through the wafer outlet of the first housing and the wafer inlet of the second housing.

[0034] The beneficial effects brought by the technical solution provided by the embodiment of the present application at least include:

[0035] By arranging the tank cleaning machine and the single wafer brushing machine side by side, and the first housing in the tank cleaning machine and the second housing in the single wafer brushing machine respectively have a wafer outlet and a wafer inlet. In this way, after the first wafer picking component transports the washed wafer to the feeding station, the second wafer picking component in the single wafer brushing machine transports the wafer on the feeding station to the brushing and spin-drying component in the single wafer brushing machine through the inlet and outlet for further cleaning and drying. That is, integrating and linking the tank cleaning machine and the single wafer brushing machine to realize the cleaning and drying of the wafer can omit the process flow in the related art of manually transporting the wafer after tank cleaning into the wafer drying equipment and then manually transporting the dried wafer into the single wafer brushing machine. In this way, while reducing the equipment investment cost, the instability of manual wafer transfer is also reduced, greatly reducing a series of risks caused by possible misoperations of employees and improving the cleaning efficiency of the wafer. In addition, since both the tank cleaning machine and the single wafer brushing machine can perform flow-through cleaning on the wafer, the number of cleaning tanks can be relatively reduced, and the required tank capacity can also be relatively reduced. Therefore, the amount of water used and the amount of chemicals used are relatively small, including the reduction of power consumption, achieving the purpose of energy conservation and emission reduction.

[0036] For example, arranging the tank cleaning machine and the single wafer brushing machine side by side, and the number of liquid medicine tanks and cleaning water tanks in the tank cleaning machine is relatively reduced, the equipment manufacturing cost is lower, and the floor space occupied by the equipment is expected to be reduced by 50% in the clean room; compared with the prior art, the usage amount of chemicals in the liquid medicine tank is reduced by 50% and the waste liquid discharge is reduced by 60%, so as to greatly improve the environmental protection; the wafer yield of the integrated equipment composed of the tank cleaning machine and the single wafer brushing machine is increased by 3%-8% compared with the wafer yield of the existing multi-machine independent setting; from the existing multi-machine where 1 person operates 1 machine alone to the integrated equipment controlled by 1 person in the present application, the labor cost is saved by more than 40%. Description of the Drawings

[0037] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0038] Figure 1 It is a front view of a wafer cleaning device provided by an embodiment of the present application;

[0039] Figure 2 is Figure 1 An internal top view of the wafer cleaning equipment shown;

[0040] Figure 3 is Figure 2 A top view of a partial structure of the wafer cleaning equipment shown;

[0041] Figure 4 A schematic diagram of a partial structure of a tank cleaning machine provided by an embodiment of the present application;

[0042] Figure 5 A schematic diagram of a partial structure of a tank cleaning machine provided by an embodiment of the present application;

[0043] Figure 6 A schematic diagram of a partial structure of another tank cleaning machine provided by an embodiment of the present application;

[0044] Figure 7 A schematic diagram of a partial structure of yet another tank cleaning machine provided by an embodiment of the present application;

[0045] Figure 8 is Figure 7 A schematic diagram of a structure from a certain perspective shown;

[0046] Figure 9 is Figure 7 A partially enlarged schematic diagram of the partial structure shown;

[0047] Figure 10 A side view of a first wafer picking component provided by an embodiment of the present application;

[0048] Figure 11 A schematic diagram of a partial structure of yet another tank cleaning machine provided by an embodiment of the present application;

[0049] Figure 12 is Figure 11 A partially enlarged schematic diagram of the structure shown;

[0050] Figure 13 An internal top view of a tank cleaning machine provided by an embodiment of the present application;

[0051] Figure 14 An exploded view of a gantry and a wafer cassette provided by an embodiment of the present application;

[0052] Figure 15 is Figure 14 An assembled view of the wafer cassette shown;

[0053] Figure 16 A schematic diagram of a wafer waiting device provided by an embodiment of the present application;

[0054] Figure 17 is Figure 16 the front view of the wafer waiting device shown;

[0055] Figure 18 is the structural schematic diagram of another wafer waiting device provided by an embodiment of the present application;

[0056] Figure 19 is Figure 18 the partial structural schematic diagram of the wafer waiting device shown;

[0057] Figure 20 is Figure 19 the partial structural schematic diagram of the wafer waiting device shown.

[0058] Among them, the tank type cleaning machine 100, the single wafer brushing machine 200, the wafer A, the first housing 101, the first wafer picking component 102, the wafer gripping and transferring component 103, the liquid medicine tank 104, the transfer table 105, the cleaning water tank 106, the tank body a1, the supporting position W, the wafer outlet b1, the waiting station D, the second housing 201, the second wafer picking component 202, the brushing and drying component 203, the wafer inlet b2, the auxiliary protection tank 300, the protection cover 400, the flipping mechanism 500, the connecting rod member 501, the driving cylinder 502, the first direction f1, the translation mechanism 103a, the lifting mechanism 103b, the rotary driving member 103c, the clamping arm driving member 103d, the two clamping arms 103e, the second direction f2, the third direction f3, the first limiting clamping convex part B1, the second limiting clamping convex part B2, the first translation mechanism 102a, the first lifting mechanism 102b, the first rotary driving member 102c, the translation driving member 102d, the wafer clamping mechanism 102e, the fixed support plate C1, the clamping support plate C2, the support plate driving member C3, the first bearing arc surface m1, the second bearing surface m2, the buffer screw 102f, the first limiting support convex part D1, the second limiting support convex part D2, the first table body 1051, the second table body 1052, the second lifting mechanism 600, the second rotary driving member 700, the support column D11, the limiting column D12, the table frame 107, the wafer cassette 108, the first positioning and clamping part 107a, the second positioning and clamping part 108a, the first type of clamping part 107a1, the second type of clamping part 107a2, the position sensor 109, the wafer waiting device 110, the cleaning water tank housing 111, the support frame 112, the lifting driving member 113, the wafer limiting member 114, the driving member 115, the inlet p1, the outlet p2, the accommodating cavity p3, the annular limiting groove X, the circulation hole k1, the adapter plate 114a, the wafer limiting rod 114b, the outer frame 1121, the support plate 1122, the third limiting support convex part T, the first bearing surface m4, the first type of support convex part T1, the second type of support convex part T2, the first translation driving member 116, the translation driving cylinder 1161, the moving slider 1162, the mounting frame 1131, the driving motor 1132, the transmission screw rod 1133, the lifting connecting frame 1134.

[0059] Through the above-mentioned accompanying drawings, specific embodiments of the present application have been shown, and more detailed descriptions will be provided hereinafter. These drawings and textual descriptions are not intended to limit the scope of the concept of the present application in any way, but to illustrate the concept of the present application to those skilled in the art by referring to specific embodiments. Detailed Description of the Embodiments

[0060] To make the objectives, technical solutions, and advantages of the present application clearer, the following will further describe the embodiments of the present application in detail with reference to the accompanying drawings.

[0061] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the scope of protection of the present invention.

[0062] It should be understood that the "one embodiment" or "an embodiment" mentioned throughout the specification means that a specific feature, structure, or characteristic related to the embodiment is included in at least one embodiment of the present invention. Therefore, the appearances of "in one embodiment" or "in an embodiment" throughout the specification do not necessarily refer to the same embodiment. In addition, these specific features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

[0063] Please refer to Figure 1 、 Figure 2 、 Figure 3 and Figure 4 , Figure 1 is a front view of a wafer cleaning device provided by an embodiment of the present application, Figure 2 is Figure 1 a top view of the interior of the wafer cleaning device shown, Figure 3 is Figure 2 a top view of a partial structure of the wafer cleaning device shown, Figure 4 is a schematic diagram of a partial structure of a tank cleaning machine provided by an embodiment of the present application. The wafer cleaning device may include: a tank cleaning machine 100 and a single wafer scrubber 200 arranged side by side.

[0064] The slot-type cleaning machine 100 may include: a first housing 101, a first wafer picking component 102 installed in the first housing 101, and two sets of wafer grasping and transferring components 103, as well as two chemical liquid tanks 104, two transfer tables 105, and at least one cleaning water tank 106 distributed between the first wafer picking component 102 and the two sets of wafer grasping and transferring components 103. Each chemical liquid tank 104 and each cleaning water tank 106 may have a plurality of vertically arranged tank bodies a1. Each transfer table 105 may have a horizontally arranged support position W. One side of the first housing 101 close to the single wafer brushing machine 200 may have a wafer outlet b1, and a waiting material station D located between the first wafer picking component 102 and the wafer outlet b1 may be provided inside the first housing 101. Here, the number of cleaning water tanks 106 may be two, the two chemical liquid tanks 104 may correspond to the two cleaning water tanks 106 respectively, and the two sets of wafer grasping and transferring components 103 may correspond to the two chemical liquid tanks 104 respectively. Each tank body a1 in the chemical liquid tank 104 may be used to place a single wafer, and each tank body a1 in the cleaning water tank 106 may be used to place a single wafer. For example, the number of tank bodies a1 in the chemical liquid tank 104 may be 5 to 15, and the number of tank bodies a1 in the cleaning water tank 106 may be 3 to 10. It should be noted that each chemical liquid tank 104 may introduce different cleaning liquids or the same cleaning liquid according to the actual cleaning needs of users, and no specific limitation is made here.

[0065] The single wafer brushing machine 200 may include: a second housing 201, a second wafer picking component 202 installed in the second housing 201, and at least one brushing and drying component 203. One side of the second housing 201 close to the first housing 101 may have a wafer inlet b2.

[0066] Among them, the first wafer picking component 102 in the slot-type cleaning machine 100 may be used to: grasp a single wafer A to be washed, flip it by a target angle and place it in the chemical liquid tank 104, or grasp the washed wafer A in the chemical liquid tank 104 to the cleaning water tank 106, or grasp the wafer A in the cleaning water tank 106, flip it by a target angle and place it on the support position W of the transfer table 105. The first wafer picking component 102 may also be used to: grasp the washed wafer on the support position W of the transfer table 105 to the waiting material station D inside the first housing 101. The second wafer picking component 202 in the single wafer brushing machine 200 may be used to: transfer the wafer A at the waiting material station D to the brushing and drying component 203 through the wafer inlet b2 on the second housing 201 and the wafer outlet b1 in the first housing 101.

[0067] Exemplarily, the process flow of cleaning and drying a wafer by a wafer cleaning device is schematically described herein: First, the first wafer picking component 102 can pick up a single wafer A to be washed each time and transfer it to the support position W of any transfer table 105; After that, the wafer picking and transferring component 103 picks up a single horizontally placed wafer A at the support position W each time and rotates the wafer by a target angle and then vertically places it into the chemical solution tank 104 for cleaning; After that, after the wafer A is cleaned, the wafer picking and transferring component 103 takes out the vertically placed wafer A from the corresponding chemical solution tank 104 again and places the wafer in the cleaning water tank 106 to clean the residual chemical solution. After that, the wafer picking and transferring component 103 picks up the vertically placed wafer A and takes it out of the cleaning water tank 106, rotates it by a target angle and then horizontally places it on the support position W; After that, the first wafer picking component 102 places the washed wafer A on the support position W at the waiting material station D; Finally, the second wafer picking component 202 picks up the wafer A at the waiting material station D and transfers it to the brushing and drying component 203 for further cleaning and drying.

[0068] Here, the brushing and drying component 203 in the single wafer brushing machine 200 can include a single-sided brushing machine and / or a double-sided brushing machine, and the brushing and drying component 203 can clean and dry one wafer each time.

[0069] In the embodiment of the present application, the tank-type cleaning machine 100 and the single wafer brushing machine 200 are arranged side by side, and the first housing 101 in the tank-type cleaning machine 100 and the second housing 201 in the single wafer brushing machine 200 respectively have a wafer outlet b1 and a wafer inlet b2. In this way, after the first wafer picking component 102 transports the washed wafer A to the waiting material station D, the second wafer picking component 202 in the single wafer brushing machine 200 transports the wafer A at the waiting material station D to the brushing and drying component 203 in the single wafer brushing machine 200 through the wafer inlet b2 and the wafer outlet b1 for further cleaning and drying. That is, the tank-type cleaning machine 100 and the single wafer brushing machine 200 are integrated and linked to realize the automatic cleaning and drying of the wafer A, which can omit the process flow in the related art of manually transporting the wafer after tank-type cleaning into the wafer drying device and then manually transporting the dried wafer into the single wafer brushing machine. In this way, while reducing the equipment input cost, it also reduces the instability of personnel wafer transfer, greatly reduces a series of risks caused by possible misoperations of employees, improves the cleaning efficiency of the wafer and the process ability of cleaning, and ensures the yield of integrated wafer products. In addition, since both the tank-type cleaning machine 100 and the single wafer brushing machine 200 can perform flow-through cleaning on the wafer, the number of cleaning tanks can be relatively reduced, and the required tank capacity can also be relatively reduced. Therefore, the amount of water used and the amount of chemicals used are relatively small, including the consumption of electric energy is also reduced, achieving the purpose of energy conservation and emission reduction.

[0070] In summary, the embodiment of the present application provides a wafer cleaning device, which may include: a batch cleaning machine and a single wafer scrubbing machine arranged side by side. By arranging the batch cleaning machine and the single wafer scrubbing machine side by side, and the first housing in the batch cleaning machine and the second housing in the single wafer scrubbing machine respectively have a wafer output port and a wafer input port. In this way, after the wafer after cleaning is transported to the waiting station by the first wafer picking component, the second wafer picking component in the single wafer scrubbing machine transports the wafer on the waiting station to the scrubbing and drying component in the single wafer scrubbing machine through the input port and the output port for further cleaning and drying. That is, integrating and linking the batch cleaning machine and the single wafer scrubbing machine to realize the cleaning and drying of the wafer can omit the process flow in the related art of manually transporting the wafer after batch cleaning into the wafer drying device and then manually transporting the dried wafer into the single wafer scrubbing machine. In this way, while reducing the equipment investment cost, the instability of wafer transfer by personnel is also reduced, greatly reducing a series of risks caused by possible misoperations of employees and improving the wafer cleaning efficiency and the process ability of cleaning, ensuring the yield of integrated wafer products. In addition, since both the batch cleaning machine and the single wafer scrubbing machine can perform flow-through cleaning on the wafer, the number of cleaning tanks can be relatively reduced, and the required tank capacity can also be relatively reduced, so the required water consumption and chemical agent consumption are also relatively small, including the reduction of power consumption, achieving the purpose of energy conservation and emission reduction.

[0071] In the present application, as Figure 4 shown, the wafer cleaning device may further include: two auxiliary protection tanks 300, and these two auxiliary protection tanks 300 may correspond to the two chemical solution tanks 104 respectively. Among them, the chemical solution tank 104 may be installed in the tank body of the corresponding auxiliary protection tank 300. By way of example, the material of the chemical solution tank 104 may be quartz, and the material of the auxiliary protection tank 300 may be polyvinyl chloride (English: Polyvinyl chloride; Abbreviation: PVC).

[0072] It should be noted that, in order to ensure the sealing performance of the chemical solution tank 104 when cleaning the wafer, please refer to Figure 5 , Figure 5It is a partial structural diagram of a tank cleaning machine provided in an embodiment of the present application. The wafer cleaning equipment may further include: a protective cover 400 corresponding to the opening of the liquid medicine tank 104, and a flipping mechanism 500 respectively connected to the protective cover 400 and the first shell 101. The flipping mechanism 500 may be configured to: drive the protective cover 400 to flip to cover the opening of the liquid medicine tank 104, or drive the protective cover 400 to flip and separate from the opening of the liquid medicine tank 104. For example, the flipping mechanism 500 may include: a connecting rod 501 and a driving cylinder 502, the driving cylinder 502 may be located on the outer side of the liquid medicine tank 104, and the telescopic shaft of the driving cylinder 502 may be connected to the connecting rod 501, and the end of the connecting rod 501 facing away from the driving cylinder 502 may be fastened to the protective cover 400. In this way, the protective cover 400 can be driven to flip by the connecting rod 501 during the extension and retraction of the telescopic shaft of the driving cylinder 502.

[0073] Optional, such as Figure 2 As shown, the first housing 101 of the tank-type cleaning machine 100 and the second housing 201 of the single-sheet scrubber 200 can be arranged along a first direction f1. The two liquid medicine tanks 104 can be arranged along the first direction f1, the two transfer tables 105 can be located between the two liquid medicine tanks 104, and at least one cleaning water tank 106 can be located between the two transfer tables 105. The second sheet picking assembly 202 and the scrubbing and drying assembly 203 can be arranged in a direction that is parallel to the direction of arrangement of the first sheet picking assembly 102 and the two sets of sheet grabbing and transfer assemblies 103. Furthermore, the first sheet picking assembly 102 and the two sets of sheet grabbing and transfer assemblies 103 can be arranged along a second direction f2. Here, the second direction f2 can be perpendicular to the first direction f1. In this case, the first housing 101 of the tank cleaning machine 100 and the second housing 201 of the single-wafer scrubber 200 are arranged along a first direction f1. The first wafer picking assembly 102 and two sets of wafer grabbing and transferring assemblies 103 within the first housing 101, and the second wafer picking assembly 202 and scrubbing and drying assembly 203 within the second housing 201 can all be arranged along a second direction f2 perpendicular to the first direction f1. This arrangement of multiple components can effectively reduce the overall dimensions of the wafer cleaning equipment.

[0074] In the examples of this application, please refer to Figure 6 , Figure 6It is a partial structural schematic diagram of another slot cleaning machine provided by an embodiment of the present application. Each wafer gripping and transferring component 103 may include: a translation mechanism 103a, a lifting mechanism 103b, a rotation driving member 103c, an arm driving member 103d, and two parallel arms 103e. The translation mechanism 103a may be installed at the bottom of the first housing 101 and extend along the first direction f1. The lifting mechanism 103b may be slidably connected to the translation mechanism 103a and extend along the third direction f3, and the third direction f3 may be perpendicular to both the first direction f1 and the second direction f2. The rotation driving member 103c may be installed on the lifting mechanism 103b, and the rotation axis of the rotation driving member 103c may be fixedly connected to the arm driving member 103d. One end of each of the two arms 103e may be fixedly connected to the arm driving member 103d. One end of one arm 103e away from the arm driving member 103d may have two relatively arranged first limiting clamping protrusions B1, and one end of the other arm 103e away from the arm driving member 103d may have two relatively arranged second limiting clamping protrusions B2. A clamping space may be formed between the two first limiting clamping protrusions B1 and the two second limiting clamping protrusions B2.

[0075] Among them, the rotation driving member 103c may be configured to: drive the arm driving member 103d to rotate a target angle around the rotation axis of the rotation driving member 103c. The arm driving member 103d may be configured to: drive the two arms 103e to move relatively, so as to drive the two first limiting clamping protrusions B1 and the two second limiting clamping protrusions B2 to move towards each other or away from each other.

[0076] For example, the translation mechanism 103a in the wafer gripping and transferring component 103 may drive the lifting mechanism 103b, the rotation driving member 103c, the arm driving member 103d, and the two arms 103e to move integrally along the first direction f1, so that the two arms 103e are arranged to cooperate with the arrangement positions of the liquid medicine tank 104 and the cleaning water tank 106. The lifting mechanism 103b may drive the rotation driving member 103c, the arm driving member 103d, and the two arms 103e to lift simultaneously along the third direction f3. The rotation driving member 103c may drive the arm driving member 103d and the two arms 103e to rotate a target angle simultaneously, so as to switch the wafer A between a horizontal state and a vertical state. When the translation mechanism 103a drives the two arms 103e to extend to the bottom surface of the wafer A, the arm driving member 103d may drive the first limiting clamping protrusions B1 and the second limiting clamping protrusions B2 on the two arms 103e to move towards each other, so as to clamp the horizontally placed wafer A in the clamping space formed between the first limiting clamping protrusions B1 and the second limiting clamping protrusions B2. In addition, the arm driving member 103d may drive the first limiting clamping protrusions B1 and the second limiting clamping protrusions B2 on the two arms 103e to move away from each other, so as to release the wafer A.

[0077] For example, the arrangement direction of the two first limiting clamping protrusions B1 can be parallel to the arrangement direction of the two second limiting clamping protrusions B2, and the arrangement direction of the two first limiting clamping protrusions B1 can be perpendicular to the arrangement direction of the first limiting clamping protrusions B1 and the second limiting clamping protrusions B2, and the arrangement direction of the two second limiting clamping protrusions B2 can be perpendicular to the arrangement direction of the first limiting clamping protrusions B1 and the second limiting clamping protrusions B2.

[0078] For example, the translation mechanism 103a may include a drive motor and a drive screw (not shown). The lifting mechanism 103b may be in transmission connection with the drive screw. The lifting mechanism 103b may include a lifting cylinder or a transmission assembly of the drive motor and the drive screw. The clamping arm drive 103d may include a slider cylinder, and the rotation drive 103c may include a drive motor. It should be noted that the transmission methods of the above-mentioned mechanisms are not specifically limited.

[0079] Optional, such as Figure 6 As shown, one clamping arm 103e can be a U-shaped clamping arm, and a portion of the other clamping arm 103e can extend into the hollow area of the U-shaped clamping arm and be fastened to the clamping arm driving member 103d. The two first position-limiting clamping protrusions B1 can be located at the two ends of the U-shaped clamping arm, and the two second position-limiting clamping protrusions B2 can be located at the end of the other clamping arm 103e facing away from the clamping arm driving member 103d. In this case, by setting one clamping arm 103e as a U-shaped clamping arm and a portion of the other clamping arm 103e extending into the hollow area of the U-shaped clamping arm, the two clamping arms 103e are arranged flush. This makes the structure of the two clamping arms 103e more compact, facilitating the miniaturization design of the tank cleaning machine 100.

[0080] Optional, please refer to Figure 7 、 Figure 8 and Figure 9 , Figure 7 This is a partial structural diagram of another tank-type cleaning machine provided in an embodiment of the present application. Figure 8 yes Figure 7 A structural diagram of a perspective is shown. Figure 9 yes Figure 7Partial enlarged schematic view of the shown partial structure. The first wafer picking component 102 may include: a first translation mechanism 102a, a first lifting mechanism 102b, a first rotation driving member 102c, a translation driving member 102d, and a wafer clamping mechanism 102e, which are sequentially arranged along the bottom away from the first housing 101. The first translation mechanism 102a may be installed at the bottom of the first housing 101 and extend along the first direction f1. The first lifting mechanism 102b may be installed on the first translation mechanism 102a and may extend along the third direction f3. The first rotation driving member 102c may be installed on the first lifting mechanism 102b, and the rotation axis of the first rotation driving member 102c may be fixedly connected to the translation driving member 102d. The wafer clamping mechanism 102e may be installed on the translation driving member 102d. Among them, the translation driving member 102d may be configured to: drive the wafer clamping mechanism 102e to pick up the unwashed wafer and transport it to the support position W, or transport the wafer A at the support position W to the waiting material station D in the first housing 101. The first rotation driving member 102c may be configured to: drive the translation driving member 102d and the wafer clamping mechanism 102e to rotate synchronously.

[0081] Exemplarily, the first translation mechanism 102a may drive the first lifting mechanism 102b, the first rotation driving member 102c, the translation driving member 102d, and the wafer clamping mechanism 102e to move simultaneously along the first direction f1 to cooperate with the arrangement positions of the two transfer tables 105 and the waiting material station D. The first lifting mechanism 102b may drive the first rotation driving member 102c, the translation driving member 102d, and the wafer clamping mechanism 102e to lift simultaneously along the third direction f3 to enable the wafer clamping mechanism 102e to grasp the wafers to be washed at different heights. The first rotation driving member 102c may drive the translation driving member 102d and the wafer clamping mechanism 102e to rotate simultaneously, so that the wafer clamping mechanism 102e can pick up the wafer to be cleaned and transport it to the support position W of the transfer table 105, or transport the washed wafer at the support position W to the waiting material station D. The translation driving member 102d may drive the wafer clamping mechanism 102e to move closer to the wafer to be cleaned, or closer to the support position W of the transfer table 105, or closer to the waiting material station D, so that the wafer clamping mechanism 102e can smoothly pick up the wafer A. Here, the first translation mechanism 102a may include the transmission cooperation of a driving motor and a driving screw rod. The first lifting mechanism 102b may include a lifting cylinder. The first rotation driving member 102c may include a rotation motor. The translation driving member 102d may include a telescopic electric cylinder. It should be noted that the embodiments of the present application do not make specific limitations on the transmission methods of the above mechanisms.

[0082] In the embodiments of the present application, as Figures 7 to 9As shown, the collet mechanism 102e may include: a fixed support plate C1, a clamping support plate C2, and a support plate driving member C3. One end of the fixed support plate C1 may be fixedly connected to the translation driving member 102d. The support plate driving member C3 may be fixed on the translation driving member 102d, and the telescopic shaft of the support plate driving member C3 may be fixedly connected to one end of the clamping support plate C2. Among them, the other end of the fixed support plate C1 has a first bearing arc surface m1, the other end of the clamping support plate C2 may have a second bearing surface m2, and the support plate driving member C3 may be configured to: drive the clamping support plate C2 to move in a direction close to or away from the other end of the fixed support plate C1.

[0083] In this case, the translation driving member 102d may drive the fixed support plate C1 in the collet mechanism 102e to extend under the wafer A, and make the wafer located between the other end of the fixed support plate C1 and the other end of the clamping support plate C2. The support plate driving member C3 drives the clamping support plate C2 to move, so that the second bearing surface m2 in the clamping support plate C2 and the first bearing arc surface m1 in the fixed support plate C1 clamp the wafer A. After the wafer is placed, the support plate driving member C3 may drive the clamping support plate C2 to contract to loosen the wafer.

[0084] Exemplarily, in order to further ensure the safety performance of the fixed support plate C1 and the clamping support plate C2 when clamping the wafer, as Figure 9 shown, the first wafer picking component 102 may further include: a buffer screw 102f with two ends respectively connected to the clamping support plate C2 and the translation driving member 102d, and the buffer screw can generate a certain buffering effect when the other end of the clamping support plate C2 approaches the other end of the fixed support plate C1.

[0085] In this application, please refer to Figure 10 , Figure 10 is a side view of a first wafer picking component provided by an embodiment of this application. The number of the collet mechanisms 102e and the number of the translation driving members 102d may both be at least two, and the fixed support plates C1, the clamping support plates C2, and the support plate driving members C3 in at least two collet mechanisms 102e may be respectively stacked. In this case, by setting multiple collet mechanisms 102e, the efficiency of wafer conveying is effectively improved, and further the cleaning efficiency of multiple wafers is improved. For example, the lengths of the fixed support plates C1 of two collet mechanisms 102e among at least two collet mechanisms are different, the length of the fixed support plate C1 in one collet mechanism 102e may be greater than the length of the fixed support plate C1 in another collet mechanism 102e, so that the two collet mechanisms 102e can flexibly adapt to wafers of different sizes, and further improve the flexibility of use of the collet mechanism 102e. During use, the upper collet mechanism

[0086] In the examples of this application, please refer to Figure 11 and Figure 12 , Figure 11 This is a partial structural diagram of another tank-type cleaning machine provided in an embodiment of the present application. Figure 12 yes Figure 11 A partially enlarged schematic diagram of the structure shown. Each transfer table 105 can have a group of multiple first position-limiting support protrusions D1 distributed in an annular manner and arranged at the support position W, and a group of multiple second position-limiting support protrusions D2 distributed in an annular manner. The multiple first position-limiting support protrusions D1 can be distributed in the area surrounded by the multiple second position-limiting support protrusions D2. Among them, the top of the second position-limiting support protrusion D2 can protrude from the top of the first position-limiting support protrusion D1, and the multiple first position-limiting support protrusions D1 can be used to support the first type of wafers, and the multiple second position-limiting support protrusions D2 can be used to support the second type of wafers. In this way, by providing a group of first position-limiting support protrusions D1 and a group of second position-limiting support protrusions D2 at the support position W of each support table 105, wafers of different sizes can be supported by the two types of position-limiting support protrusions. For example, the size of the first type of wafer supported by the multiple first position-limiting support protrusions D1 can be smaller than the second type of wafer supported by the multiple second position-limiting support protrusions D2. It should be noted that the heights of the plurality of first position-limiting support protrusions D1 may be the same, and the heights of the plurality of second position-limiting support protrusions D2 may also be the same.

[0087] In this application, if Figure 11 and Figure 12 As shown, the transfer table 105 may include: a first platform 1051, and a second platform 1052 distributed around the first platform 1051. A plurality of first position-limiting support protrusions D1 may be provided on the first platform 1051, and a plurality of second position-limiting support protrusions D2 may be provided on the second platform 1052. The tank cleaning machine may further include: a second lifting mechanism 600 and a second rotary drive member 700. The second lifting mechanism 600 may be connected to the first housing 101. The second rotary drive member 700 may be mounted on the second lifting mechanism 600, and the rotating shaft of the second rotary drive member 700 may be connected to the bottom of the first platform 1051. The second platform 1052 may be fastened to the second lifting mechanism 600.

[0088] The second rotary drive member 700 can be configured to simultaneously drive the first platform 1051 to rotate and drive the first type of wafer to rotate by a certain angle, so that the positioning edge of the first type of wafer is offset from the clamping space formed between the two first position-limiting clamping protrusions B1 and the two second position-limiting clamping protrusions B2. For example, the second lifting mechanism 600 can include a lifting cylinder, and the second rotary drive member 700 can include a rotary cylinder.

[0089] In this case, the transfer table 105 is configured as a first platform 1051 and a second platform 1052, with multiple first position-limiting support protrusions D1 provided on the first platform 1051, and the second rotary drive member 700 connected to the first platform 1051. Thus, after the multiple first position-limiting support protrusions D1 support the first type of wafer, the second rotary drive member 700 can drive the first platform 1051 to rotate while simultaneously driving the first type of wafer to rotate a certain angle, so that the positioning edge of the first type of wafer is offset from the clamping space, thereby preventing the wafer from falling out of the clamping space after being flipped to a vertical state.

[0090] It should be noted that the length of the positioning edge of the first type of wafer is greater than that of the positioning edge of the second type of wafer.

[0091] For example, Figure 11 and Figure 12 As shown, the first position-limiting support protrusion D1 and the second position-limiting support protrusion D2 may each include: a support column D11 and a position-limiting column D12, the bottom of the support column D11 may be fixed on the turntable 105, the diameter of the position-limiting column D12 may be smaller than the diameter of the support column D11, and the position-limiting column D12 may be fixed in the central area of the top of the support column D11. The edge area of the top of the support column D11 may have a support surface m3. The support surface in the support column D11 may be in contact with the chamfered surface of the edge of the wafer. For example, the support surface m3 may be an arc-shaped conical surface. In this case, taking the first position-limiting support protrusion D1 as an example, the first position-limiting support protrusion D1 is provided with a support column D11 and a position-limiting column D12 that are interconnected, the position-limiting column D12 may be fixed in the central area of the support column D11, and the edge area of the top of the support column D11 is provided with a support surface m3. In this way, the chamfered surface of the wafer edge can contact and cooperate with the supporting surface m3 of the supporting column D11, effectively ensuring the cleanliness requirements of the wafer and reducing the risk of wafer contamination, and the limiting column D12 can play a certain horizontal limiting role on the wafer.

[0092] Optional, please refer to Figure 13 、 Figure 14 and Figure 15 , Figure 13 This is an internal top view of a tank-type cleaning machine provided by an embodiment of the present application. Figure 14 1 is an exploded schematic diagram of a stand and a wafer box provided in an embodiment of the present application. Figure 15 yes Figure 14Schematic diagram of the assembly of the wafer cassette shown. The cassette washer may further include: a gantry 107 and a wafer cassette 108. The gantry 107 may be fixed within the first housing 101 and may be located on a side of the first wafer picking component 102 away from the wafer gripping and transferring component 103. The top of the gantry 107 may have a first positioning and clamping portion 107a detachably connected thereto. Among them, the bottom of the wafer cassette 108 may have a second positioning and clamping portion 108a that mates with the first positioning and clamping portion 107a. The wafer cassette 108 may be used to place wafers to be cleaned. In this case, the wafer cassette 108 may be connected to the gantry 107 by mating the second positioning and clamping portion 108a with the first positioning and clamping portion 107a in the gantry 107, so as to facilitate the installation of the wafer cassette 108 and the gantry 107.

[0093] It should be noted that the first positioning and clamping portion 107a may include: a first type of clamping portion 107a1 and a second type of clamping portion 107a2. The first type of clamping portion 107a1 and the second type of clamping portion 107a2 may be adapted to the second positioning and clamping portions 108a in different wafer cassettes 108. It should be noted that different wafer cassettes 108 may accommodate different numbers of wafers and / or wafers of different sizes, which may be actually designed according to the needs of users.

[0094] In the embodiment of the present application, as Figure 14 shown, the cassette washer may further include: a position sensor 109 installed on the gantry 107. The position sensor 109 may be electrically connected to the pallet driving member C3. Among them, the position sensor may be used to detect the position of the wafer cassette 108 on the gantry 107 and send the detected position signal to the pallet driving member C3 to control whether the pallet driving member C3 is in a working state. In this way, after the position sensor 109 detects that the wafer cassette 108 is installed in place on the gantry 107, it may send a position detection signal to the pallet driving member C3 to control the pallet driving member C3 to be in a normal working state to pick up the wafers to be cleaned in the wafer cassette 108. By way of example, the position sensor 109 may include: a micro switch, a magnetic reed switch or a Hall switch. The embodiment of the present application does not make specific limitations thereto.

[0095] Optionally, please refer to Figure 13 、 Figure 16 and Figure 17 , Figure 16 which is a schematic structural diagram of a wafer waiting device provided by an embodiment of the present application, Figure 17 is Figure 16 a front view of the wafer waiting device shown. The cassette washer 100 may further include: a wafer waiting device 110 installed at the waiting station D. The wafer waiting device 110 may include: a cleaning water tank housing 111, a support frame 112, a lifting driving member 113, a wafer limiting member 114 and a driving member 115.

[0096] The cleaning water tank housing 111 in the wafer waiting device 110 may have a tank body for carrying cleaning water.

[0097] The support frame 112 in the wafer waiting device 110 can have an inlet p1 and an outlet p2 that are relatively arranged, and a plurality of horizontal accommodating cavities p3 that are stacked and distributed between the inlet p1 and the outlet p2. Each accommodating cavity p3 can be used to accommodate wafers A that have been cleaned by the tank cleaning machine 100. Here, the wafers cleaned by the tank cleaning machine 100 can enter the accommodating cavity p3 from the inlet p1 of the support frame 112, and the outlet p2 of the support frame 112 can be used to transfer the wafers to the subsequent single-wafer scrubber. It should be noted that in order to facilitate the smooth entry and exit of the wafers in the accommodating cavity p3, the height of the accommodating cavity p3 can be greater than the thickness of the wafer.

[0098] The lifting drive 113 in the wafer waiting device 110 can be connected to the support frame 112, and the lifting drive 113 can be configured to: drive the support frame 112 down to the tank body of the cleaning water tank shell 111 to clean the wafers, or drive the support frame 112 out of the tank body of the cleaning water tank shell 111.

[0099] The side surface of the wafer limiter 114 in the wafer waiting device 110 may have a plurality of annular limit grooves X distributed along the axial direction of the wafer limiter 114. The plurality of annular limit grooves X may correspond one-to-one to the multi-layer accommodating cavities p3 in the support frame 112. Each annular limit groove X may extend radially along the wafer limiter 114.

[0100] The drive member 115 in the wafer waiting device 110 can be mounted on the lifting drive member 113, and the drive member 115 can be in driving connection with the wafer stopper 114. The drive member can be configured to: drive the wafer stopper 114 to move to the inlet p1 or outlet p2 of the support frame 112 so that the annular stopper groove X is aligned with the corresponding accommodating cavity p3 in the support frame 112, or drive the wafer stopper 114 to move to be offset from the inlet p1 or outlet p2 of the support frame 112.

[0101] For example, in one embodiment, the wafer stopper 114 and the driving member 115 are arranged in one group, and the driving member 115 can drive the wafer stopper 114 to move to the entrance p1 or the exit p2, depending on the placement of the driving member 115 and the wafer stopper 114. In another embodiment, the wafer stopper 114 and the driving member are arranged in two groups, and one group of driving members can be used to drive one wafer stopper 114 to move to the entrance p1 of the support frame 112, so that the annular limiting groove X in the wafer stopper 114 is aligned with the corresponding accommodating cavity p3; or, the wafer stopper 114 can be driven to move to a position offset from the entrance p1 of the support frame 112. Another set of driving members can be used to drive another wafer stopper 114 to move to the exit p2 of the support frame 112 so that the annular stopper groove X in the wafer stopper 114 is aligned with the corresponding accommodating cavity p3; or, drive the wafer stopper 114 to move to be staggered with the exit p2 of the support frame 112. Here, the wafer stopper 114 is driven to be staggered with the entrance p1 of the support frame 112 to prevent the wafer A from interfering with the wafer stopper 114 during the process of entering the accommodating cavity p3 of the support frame 112. The wafer stopper 114 is driven to be staggered with the exit p2 of the support frame 112 to prevent the wafer from interfering with the wafer stopper 114 during the process of being transferred out of the accommodating cavity p3 of the support frame 112.

[0102] Among them, after the wafer A is in the accommodating cavity p3 in the support frame 112, part of the edge of the wafer A can be located in the annular limiting groove X in the wafer limiting member 114 corresponding to the accommodating cavity p3.

[0103] In this case, by arranging a cleaning water tank shell 111 for carrying cleaning water in the wafer waiting device 110, a plurality of horizontal accommodation cavities p3 are arranged in the support frame 112. Thus, the wafer A after being cleaned by the tank cleaning machine can be placed in the accommodation cavity p3 of the support frame 112 from the inlet p1 of the support frame 112; then the driving member can drive the wafer limiting member 114 to move to the inlet p1 of the support frame 112 (or the outlet p2 of the support frame 112) so that the annular limiting groove X on the wafer limiting member 114 is aligned with the accommodation cavity p3, and it is ensured that a part of the edge of the wafer A located in the accommodation cavity p3 is located in the annular limiting groove X; afterwards, the lifting driving member 113 drives to synchronously move the driving member and the support frame 112 towards the inside of the tank body of the cleaning water tank shell 111, so that the wafer A carried in the accommodation cavity p3 of the support frame 112 can be immersed in the cleaning water inside the tank body. In this way, during the cleaning process cycle between the tank cleaning machine integrated with the wafer waiting device 110 and the single wafer cleaning machine, the wafer waiting device 110 can still ensure the cleanliness of the wafer A, further improving the manufacturing yield of the wafer A. In addition, after the wafer A is immersed in the cleaning water inside the tank body, the wafer A will be subjected to the buoyancy force of the cleaning water. Here, the annular limiting groove X in the wafer limiting member 114 will exert a certain limiting effect on the wafer A, ensuring the stable position of the wafer A in the accommodation cavity p3 of the support frame 112, and further ensuring the efficiency and reliability when the wafer A is taken out from the outlet p2 subsequently.

[0104] It should be noted that when the wafer A needs to be conveyed to the single wafer cleaning machine, the lifting driving member 113 drives the support frame 112 to move away from the tank body of the cleaning water tank shell 111, rising to a certain height so that the wafer A can leave the tank body.

[0105] For example, as Figure 17 shown, the support frame 112 in the wafer waiting device 110 can have a flow hole k1 for the circulation of cleaning water. Here, the flow hole k1 in the support frame 112 can communicate with the accommodation cavity p3.

[0106] Optionally, please refer to Figure 16 and Figure 18 , Figure 181 is a schematic structural diagram of another wafer feeding device provided in an embodiment of the present application. The driving member 115 in the wafer feeding device 110 can be a rotary driving member, and the rotating axis of the rotary driving member can be connected to the wafer limiting member 114. The central axis of the wafer limiting member 114 can be parallel to and not coaxial with the rotating axis of the rotary driving member. The rotary driving member can be configured to drive the wafer limiting member 114 to rotate around the rotating axis to a target angle. In this case, the wafer limiting member 114 is driven by the rotary driving member to rotate in a direction close to the support frame 112 or away from the support frame 112, so that the structure of the mechanism composed of the rotary driving member and the wafer limiting member 114 is simple and relatively compact, which is convenient for the miniaturization design of the tank cleaning machine. Here, the target angle is the angle at which the wafer limiting member 114 rotates from the initial position to the entrance p1 or exit p2 of the support frame 112 and makes the edge of part of the wafer A in the accommodating chamber p3 located in the annular limiting groove X in the wafer limiting member 114.

[0107] In the embodiments of this application, Figure 18 As shown, the wafer stopper 114 may include: an adapter plate 114a and a wafer stopper rod 114b. The extension direction of the adapter plate 114a may be perpendicular to the axial direction of the rotation axis of the rotary drive member. The first end of the adapter plate 114a may be fastened to the rotation axis of the rotary drive member, and the second end of the adapter plate 114a may be fastened to one end of the wafer stopper rod 114b. The plurality of annular stopper grooves X in the wafer stopper 114 may be provided on the wafer stopper rod 114b.

[0108] In the present application, the wafer waiting device 110 may further include: an angle sensor (not shown in the figure) provided in the rotary drive member, which can detect the rotation angle of the rotary shaft in the rotary drive member and generate an angle detection signal to output to the control component (not shown in the figure), and the control component can generate an electrical signal and output it to the rotary drive member. In this case, by providing a position sensor in the rotary drive member, the position sensor can be used to detect the rotation angle of the rotary shaft to the target angle and then generate an angle detection signal to output to the control component, and the control component generates an electrical signal according to the angle detection signal and then outputs it to the rotary drive member to control the rotary drive member to be in a stopped working state.

[0109] For example, the control assembly may include a PLC control system and a signal converter, the angle sensor may be communicatively connected to the signal converter, the signal converter may be communicatively connected to the PLC control system, and the rotary drive member may be communicatively connected to the PLC control system. The angle sensor may be a Hall sensor or a reed switch, and the rotary drive member may be a rotary cylinder or a servo motor, etc., which are not specifically limited in the embodiments of the present application.

[0110] It should be noted that the control component in the wafer cleaning device can be electrically connected to other components separately. For example, the control component can be connected to mechanisms such as the flipping mechanism 500, the translation mechanism 103a, the lifting mechanism 103b, the rotation driving part 103c, the clamping arm driving part 103d, the first translation mechanism 102a, the first lifting mechanism 102b, the first rotation driving part 102c, the translation driving part 102d, and the wafer clamping mechanism 102e respectively to control these mechanisms to perform corresponding actions.

[0111] Optionally, please refer to Figure 18 、 Figure 19 and Figure 20 , Figure 19 is Figure 18 a partial structural schematic diagram of the wafer waiting device shown. Figure 20 is Figure 19 a partial structural schematic diagram of the wafer waiting device shown. The support frame 112 in the wafer waiting device 110 can include: an outer frame 1121, and multiple groups of support plates 1122 fixedly arranged in an array within the outer frame 1121. A receiving cavity p3 can be formed between adjacent two layers of support plates 1122. And each group of support plates 1122 can include multiple support plates. Among them, the end of each support plate 1122 can have a third limit support protrusion T, and the top of the third limit support protrusion T can have a first support surface m4 that contacts and cooperates with the chamfered surface of the edge part of the wafer A. For example, the first support surface m4 can be an arc-shaped conical surface. In this case, after the wafer A is placed in the receiving cavity p3, it can be supported by the third limit support protrusions T on each group of support plates 1122, and the chamfered surface of the edge part of the wafer A contacts and cooperates with the first support surface m4 at the top of the third limit support protrusion T, effectively reducing the probability of damage to the front and back surfaces of the wafer A.

[0112] In the embodiments of the present application, as Figure 19As shown, multiple support plates in each group of support plates 1122 can be arranged in two rows. The third limit support protrusion T in each row of support plates 1122 can include at least two first-type support protrusions T1 and at least two second-type support protrusions T2. The space surrounded by the first-type support protrusions T1 in the two rows of support plates 1122 can be distributed within the space surrounded by the second-type support protrusions T2. Among them, the top of the second-type support protrusion T2 can protrude relative to the support plate 1122 from the top of the first-type support protrusion T1. In this case, the first-type support protrusion T1 can be used to support the wafer A with a smaller area, and the second-type support protrusion T2 can be used to support the wafer A with a larger area. Thus, the bearing flexibility of the support frame 112 for the wafer A is effectively improved. For example, the number of the first-type support protrusions T1 in each layer of support plates 1122 can be six, and the six first-type support protrusions T1 can be distributed in a ring shape; the number of the second-type support protrusions T2 can be four, and the four second-type support protrusions T2 can be distributed in a square shape.

[0113] It should be noted that, as Figure 18 and Figure 19 shown, when the third limit support protrusion T in each layer of support plates 1122 includes the first-type support protrusion T1 and the second-type support protrusion T2, the number of the annular limit grooves X corresponding to each accommodation cavity p3 in the wafer limit member 114 can be two. One annular limit groove X can be used to limit the wafer A supported by the first-type support protrusion T1; the other annular limit groove X can be used to limit the wafer A supported by the second-type support protrusion T2. In addition, when the area of the wafer A supported by the first-type support protrusion T1 is small, in order to ensure that a part of the edge of the wafer A can be located in the annular limit groove X in the wafer limit member 114 that is used in cooperation with the first-type support protrusion T1, the opening of the annular limit groove X used in cooperation with the first-type support protrusion T1 can be made closer to the support frame 112 than the opening of the annular limit groove X used in cooperation with the second-type support protrusion T2.

[0114] In other possible implementation manners, as Figure ၁၉ shown, the wafer waiting device 110 can further include: a first translation driving member 116, which can be respectively connected to the lifting driving member 113 and the rotation driving member, and the first translation driving member 116 is configured to: when the wafer limit member 114 rotates to the target position (the inlet p1 or the outlet p2 of the support frame 112) of the support frame 112, drive the rotation driving member and the wafer limit member 114 to move synchronously along the direction close to the wafer A supported by the first-type support protrusion T1, so that a part of the edge of the wafer A supported by the first-type support protrusion T1 is located in the annular limit groove X in the wafer limit member 114.

[0115] Exemplarily, the first translation driving member 116 may include a translation driving cylinder 1161 and a moving slider 1162 that are drivingly connected. The translation driving cylinder 1161 may be connected to the lifting driving member 113, and the rotation driving member may be mounted on the moving slider 1162. Among them, the translation driving cylinder 1161 may drive the moving slider 1162 to perform translation.

[0116] Optionally, as Figure 18 shown, the lifting driving member 113 in the wafer waiting device 110 may include a mounting frame 1131, a driving motor 1132, a transmission screw rod 1133, and a lifting connecting frame 1134. The driving motor 1132 may be fixed on the mounting frame 1131, the transmission screw rod 1133 may be mounted on the mounting frame 1131 and the axial direction of the transmission screw rod 1133 may be parallel to the lifting direction of the support frame 112. The lifting connecting frame 1134 may be drivingly connected to the transmission screw rod 1133, and both the support frame 112 and the driving member 115 may be fixedly connected to the lifting connecting frame 1134. And the output shaft of the driving motor 1132 may be connected to one end of the transmission screw rod 1133. Among them, the driving motor 1132 may be configured to: drive the lifting connecting frame 1134 to move along the axial direction of the transmission screw rod 1133 through the transmission screw rod 1133, so as to drive the support frame 112 to lift synchronously.

[0117] Exemplarily, the mounting frame 1131 may be fixed in the tank cleaning machine 100. When the driving motor 1132 is in a working state, it drives the transmission screw rod 1133 to rotate, and then drives the lifting connecting frame 1134 to lift along the axial direction of the transmission screw rod 1133, so as to drive the support frame 112 and the wafer limiting member 114 to lift and move synchronously.

[0118] It should be noted that, as Figure 18 and Figure 19 shown, in the case where the first translation driving member 116 includes a translation driving cylinder 1161 and a moving slider 1162, the translation driving cylinder 1161 may be mounted on the lifting connecting frame 1134.

[0119] The embodiment of the present application further provides a wafer cleaning method, and the wafer cleaning method may be applied to any of the above-mentioned wafer cleaning devices.

[0120] Step 1: The first wafer picking component in the tank cleaning machine of the wafer cleaning device may pick up a single wafer to be washed and transfer it to the support position.

[0121] Step 2: The wafer picking and transferring component in the tank cleaning machine of the wafer cleaning device picks up a single wafer to be washed on the support position each time, flips it by a target angle, and then places it in the liquid medicine tank. Here, wafers are placed in the tank body of the liquid medicine tank, or after placing any number of wafers, the wafers can be cleaned with liquid medicine.

[0122] Step 3: The wafer gripping and transferring component can grip the washed wafer in the liquid medicine tank and transfer it to the cleaning water tank for cleaning.

[0123] Step 4: The wafer gripping and transferring component can grip the wafer in the cleaning water tank, leave the cleaning water tank, and then place it at the support position of the transfer table after flipping it by a target angle.

[0124] Step 5: The first wafer picking component can grip the washed wafer at the support position of the transfer table and transfer it to the waiting station.

[0125] Step 6: The second wafer picking component in the single wafer brushing machine of the wafer cleaning equipment can transfer the wafer at the waiting station to the brushing and drying component through the wafer outlet of the first housing of the tank cleaning machine and the wafer inlet of the second housing of the single wafer brushing machine. Here, the brushing and drying component can further brush and dry the wafer.

[0126] The embodiments of the wafer cleaning equipment and the embodiments of the wafer cleaning method provided by the embodiments of the present invention can be referred to each other, and the embodiments of the present invention will not be elaborated herein.

[0127] The embodiments of the wafer cleaning equipment and the embodiments of the usage method of the wafer cleaning equipment provided by the embodiments of the present invention can be referred to each other, and the embodiments of the present invention will not be elaborated herein.

[0128] In the present application, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance. The term "plurality" means two or more, unless otherwise clearly defined.

[0129] The above are only optional embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present application shall be included within the protection scope of the present application.

Claims

1. A wafer cleaning device, characterized in that: include: Tank cleaning machines and single-piece brush scrubbers arranged side by side; The tank-type cleaning machine includes: a first shell, a first sheet picking assembly and two groups of sheet grabbing and transferring assemblies installed in the first shell, and two liquid medicine tanks, two transfer tables and at least one cleaning water tank distributed between the first sheet picking assembly and the two groups of sheet grabbing and transferring assemblies, wherein the liquid medicine tank and the cleaning water tank each have a plurality of vertically arranged trough bodies; the transfer table has a horizontally arranged support position; a sheet outlet is provided on a side of the first shell close to the single-sheet scrubber, and a material waiting station is provided between the first sheet picking assembly and the sheet outlet; The single-sheet scrubber comprises: a second shell, a second sheet taking assembly installed in the second shell, and at least one scrubbing and drying assembly, wherein the second shell has a sheet inlet on a side close to the first shell; The first wafer picking assembly is used to grab a single wafer to be washed and transfer it to the support position; each group of the wafer grabbing and transferring assemblies is used to grab a single wafer to be washed on the support position, flip it to a target angle, and then place it in the liquid medicine tank, or grab the wafer that has been cleaned in the liquid medicine tank and transfer it to the clean water tank, or grab the wafer in the clean water tank and flip it to the target angle and then place it in the support position; the first wafer picking assembly is also used to grab the washed wafer on the support position and transfer it to the waiting position; the second wafer picking assembly is used to transfer the wafer on the waiting position to the scrubbing and drying assembly through the wafer inlet and outlet; The first shell and the second shell are arranged along a first direction; the first sheet picking assembly and the two sets of sheet grabbing and transferring assemblies are arranged along a second direction, and the second direction is perpendicular to the first direction; 4. The repairing kit for automotive dents, according to claim 1, wherein a bottom of the foot stand comprises a through-hole, and the two foot pieces comprise two bosses, wherein the bosses comprise a through-hole, a screw bolt, and a nut. The bosses comprise a through-hole, a screw bolt, and a nut. The two foot pieces comprise a through-hole, a screw bolt, and a nut. The two foot pieces comprise a through-hole, a screw bolt and a nut. Wherein, the rotating driving member is configured to: drive the clamping arm driving member to rotate the target angle around the rotating axis of the rotating driving member; the clamping arm driving member is configured to: drive the two clamping arms to move relative to each other, so as to drive the two first limiting clamping protrusions and the two second limiting clamping protrusions to move toward or away from each other.

2. The wafer cleaning device according to claim 1, wherein: The two liquid medicine tanks are arranged along the first direction, the two transfer tables are located between the two liquid medicine tanks, and the at least one cleaning water tank is located between the two transfer tables; Wherein, the arrangement direction of the second sheet taking assembly and the scrubbing and drying assembly is parallel to the arrangement direction of the first sheet taking assembly and the two groups of sheet grabbing and transferring assemblies.

3. The wafer cleaning device according to claim 1, wherein: One of the clamping arms is a U-shaped clamping arm, and a portion of the other clamping arm extends into the hollow area of the U-shaped clamping arm and is fastened to the clamping arm driving member; wherein, the two first limiting clamping protrusions are respectively located at the two ends of the U-shaped clamping arm, and the two second limiting clamping protrusions are located at the end of the other clamping arm away from the clamping arm driving member.

4. The wafer cleaning device according to claim 1, wherein: The first film-taking assembly includes: a first translation mechanism, a first lifting mechanism, a first rotation drive member, a translation drive member, and a clip mechanism, which are sequentially arranged along the bottom facing away from the first housing, the first translation mechanism being mounted on the bottom of the first housing and extending along the first direction, the first lifting mechanism being mounted on the first translation mechanism and extending along the third direction, the first rotation drive member being mounted on the first lifting mechanism, and the rotation axis of the first rotation drive member being fastened to the translation drive member; the clip mechanism being mounted on the translation drive member; Among them, the translation drive member is configured to: drive the clamping mechanism to clamp the uncleaned wafer and transport it to the support position, or transport the wafer on the support position to the waiting position; the first rotation drive member is configured to: drive the translation drive member and the clamping mechanism to rotate synchronously.

5. The wafer cleaning device according to claim 4, characterized in that: The clip mechanism includes: a fixed pallet, a clamping pallet and a pallet driver, one end of the fixed pallet is fastened to the translation driver, the pallet driver is fixed to the translation driver, and the telescopic shaft of the pallet driver is fastened to one end of the clamping pallet; The other end of the fixed pallet has a first supporting arc surface, the other end of the clamping pallet has a second supporting surface, and the pallet driving member is configured to drive the clamping pallet to move in a direction close to or away from the other end of the fixed pallet.

6. The wafer cleaning device according to claim 5, characterized in that: The number of the clip mechanisms and the number of the translation driving members are both at least two, and the fixed support plates, the clamping support plates and the support plate driving members in the at least two clip mechanisms are all stacked.

7. The wafer cleaning device according to any one of claims 1 to 6, characterized in that: The transfer platform has a group of annularly distributed multiple first position-limiting support protrusions and a group of annularly distributed multiple second position-limiting support protrusions, which are arranged at the support position. The multiple first position-limiting support protrusions are distributed in an annular area surrounded by the multiple second position-limiting support protrusions. The top of the second position-limiting support protrusion protrudes from the top of the first position-limiting support protrusion, the multiple first position-limiting support protrusions are used to support the first type of wafers, and the multiple second position-limiting support protrusions are used to support the second type of wafers.

8. The wafer cleaning device according to claim 7, wherein: The transfer platform includes: a first platform body, and a second platform body distributed around the first platform body, the plurality of first position-limiting support protrusions are arranged on the first platform body, and the plurality of second position-limiting support protrusions are arranged on the second platform body; The tank cleaning machine further includes: a second lifting mechanism and a second rotary drive member, wherein the second lifting mechanism is connected to the first housing, the second rotary drive member is mounted on the second lifting mechanism, and the rotary shaft of the second rotary drive member is connected to the first platform; the second platform is connected to the second lifting mechanism; The second rotary drive member is configured to: drive the first stage to rotate while driving the first type of wafer to rotate a certain angle, so that the positioning edge of the first type of wafer is staggered with the clamping space.

9. The wafer cleaning device according to claim 7, wherein: The first position-limiting support protrusion and the second position-limiting support protrusion each include: a support column and a position-limiting column, wherein the bottom of the support column is fixed to the turntable, the diameter of the position-limiting column is smaller than the diameter of the support column, and the position-limiting column is fixed to the central area of the top of the support column; the edge area of the top of the support column has a support surface; Wherein, the supporting surface is used for cooperating and contacting with the chamfered surface of the edge of the wafer.

10. A wafer cleaning method, characterized in that: The wafer cleaning method is applied to the wafer cleaning device according to any one of claims 1 to 9 above; The first wafer picking component grabs a single wafer to be cleaned and transfers it to the support position; The wafer grabbing and transferring component grabs the single wafer to be cleaned on the supporting position, flips it to a target angle, and then places it in the chemical solution tank; The grabbing piece transfer assembly grabs the cleaned wafers in the liquid tank and transfers them to the clean water tank; The grabbing and transferring assembly grabs the wafer in the cleaning water tank, leaves the cleaning water tank, flips the wafer to the target angle, and then places the wafer in the supporting position; The first wafer picking assembly grabs the cleaned wafer on the support position and moves it to the waiting position; The second wafer taking assembly transfers the wafers on the waiting station to the scrubbing and drying assembly through the wafer outlet of the first shell and the wafer inlet of the second shell.

Images