Printed circuit board splitting and rim charge cutting equipment

Abstract

The invention, which relates to the technical field of printed circuit board processing, discloses printed circuit board splitting and rim charge cutting equipment comprising a transmission device, a board moving device, a plane moving device, a milling cutter cutting assembly, a laser cutting assembly, a target reading device and a control module. And the board moving device is used for moving the printed circuit boards arranged in the previous process to the positioning table of the transmission device. According to the invention, milling cutter cutting and laser cutting are coaxially combined and installed, a laser light path is coaxially aligned with the milling cutter rotating shaft, the milling cutter rotating shaft and the milling cutter body are internally provided with a channel for transmitting a laser beam, and the laser beam can directly penetrate through the rotating shaft and the milling cutter body to pre-cut or directly cut a printed circuit board; after pre-cutting of the laser head, the milling cutter body can be finely trimmed along the same path immediately, repeated positioning errors are reduced, arrangement of driving stations can be reduced, and synchronous driving of the milling cutter cutting assembly and the laser cutting assembly can be completed through one plane moving device.

Description

Technical Field

[0001] The present invention relates to the technical field of printed circuit board processing, and particularly to a printed circuit board board splitting and edge material cutting device. Background Art

[0002] A printed circuit board, also known as a printed wiring board, is a provider of electrical connections for electronic components. Generally, the mother board provided by a printed circuit board factory has a single size. To adapt to electronic products of different sizes, a cutting device is required to cut the printed circuit board.

[0003] In the prior art, when splitting and cutting a printed circuit board, ultraviolet laser cutting or high-speed milling cutter cutting is usually adopted. When these two cutting methods are used to cut different printed circuit board materials, each has its own advantages and disadvantages. For example, when the high-speed milling cutter cuts a printed circuit board with a relatively thick thickness, the efficiency is relatively high. However, when cutting with a milling cutter, due to the mechanical stress of the milling cutter, burrs are likely to be generated at the cutting end face of the printed circuit board, and cracks are likely to be generated at the end face of the printed circuit board, resulting in a relatively high defective rate. When cutting with ultraviolet laser, the accuracy is high and the cutting quality of the printed circuit board is high. However, when cutting a printed circuit board with a relatively thick thickness with ultraviolet laser, the efficiency is low, and a heat affected zone is easily generated.

[0004] However, when producing printed circuit boards, due to different sizes and thicknesses, and during the production and cutting process of printed circuit boards in the same batch, the cutting thickness is relatively thick when splitting and cutting two adjacent printed circuit boards, while the cutting thickness is relatively thin when cutting the edge materials of the printed circuit board. When using a single milling cutter or ultraviolet laser head for cutting, there are certain limitations. When the two are arranged separately, the production process is increased, which drags down the cutting and processing efficiency of the printed circuit board. Summary of the Invention

[0005] The technical solution of the present invention provides a solution significantly different from the prior art for the technical problem that the solution of the prior art is too single. Specifically, the purpose of the present invention is to provide a printed circuit board board splitting and edge material cutting device to solve the problem that there are certain limitations in the milling cutter cutting or ultraviolet laser head cutting in the prior art during the current printed circuit board board splitting and edge material cutting process.

[0006] To achieve the above object, the present invention provides the following technical solution: A printed circuit board board splitting and edge material cutting device, comprising a transmission device, a board moving device, a planar moving device, a milling cutter cutting assembly, a laser cutting assembly, a target reading device, and a control module; The plate moving device is used to move the printed circuit board discharged from the previous process to the positioning table of the transmission device. The transmission device continuously transports the printed circuit board thereon through the positioning table and passes through the target reading device, the milling cutter cutting assembly, and the laser cutting assembly in sequence; The target reading device is used to monitor the positioning holes on the printed circuit board in real time and feed back signals to the control module. The control module forms a cutting path based on the positioning holes on the printed circuit board; The milling cutter cutting assembly and the laser cutting assembly are used to perform panel cutting and edge material cutting on the printed circuit board; Among them, the milling cutter cutting assembly and the laser cutting assembly are installed at the output end of the planar moving device. The control module commands the planar moving device according to the path signal fed back by the target reading device. The planar moving device drives the milling cutter cutting assembly and the laser cutting assembly to adjust the cutting path of the printed circuit board to implement dynamic cutting of the printed circuit board.

[0007] In a preferred embodiment, the planar moving device includes an X guide rail and a Y guide rail arranged above the transmission device; Among them, a first sliding seat is slidably installed on the X guide rail, the Y guide rail is installed on the sliding seat, a second sliding seat is slidably installed on the Y guide rail, and independent power mechanisms for driving the first sliding seat and the second sliding seat to move are provided on both the X guide rail and the Y guide rail; A telescopic member is provided on the second sliding seat. The telescopic end of the telescopic member is connected with a mounting frame. The milling cutter cutting assembly and the laser cutting assembly are arranged on the mounting frame. The telescopic member and the two power mechanisms are all in communication connection with the control module.

[0008] In a preferred embodiment, the milling cutter cutting assembly includes a driving motor installed on the mounting frame, and a driving gear is installed on the output shaft of the driving motor; A rotating shaft is rotatably installed on the mounting frame. A driven gear is fixedly sleeved on the rotating shaft, and the driven gear meshes with the driving gear. A milling cutter body is connected to the lower end of the rotating shaft through a fixture.

[0009] In a preferred embodiment, the laser cutting assembly includes a laser emitting head arranged on the mounting frame, and a laser transmission optical fiber is connected to the emitting end of the laser emitting head; The laser cutting assembly further includes a first transmission channel formed in the rotating shaft, and the first transmission channel is disposed opposite to the emission port of the laser transmission optical fiber. A second transmission channel is formed in the milling cutter body and is disposed opposite to the first transmission channel, and the central axes of the first transmission channel and the second transmission channel coincide with the vertical center line axes of the rotating shaft and the milling cutter body; Both the laser emitting head and the driving motor are communicatively connected to the control module.

[0010] In a preferred embodiment, a cooling assembly is provided on the mounting frame, and the cooling assembly is used to cool down the milling cutter body and the laser transmission optical fiber.

[0011] In a preferred embodiment, the cooling assembly includes a heat insulation box and a refrigerator disposed on the mounting frame. A circulation cavity is provided in the heat insulation box, and the output end of the refrigerator is communicated with the circulation cavity; Wherein, the rotating shaft is rotatably mounted on the heat insulation box, and the first transmission channel on the rotating shaft is communicated with the circulation cavity, and one end of the laser transmission optical fiber far from the laser emitting head is communicated with the circulation cavity; The cooling assembly further includes a heat dissipation protection sleeve sleeved on the laser transmission optical fiber. An annular groove is formed at one end of the heat dissipation protection sleeve located in the circulation cavity. A plurality of exhaust pipes are provided in the heat dissipation protection sleeve. The exhaust pipes are arranged along the length direction of the heat dissipation protection sleeve, and one end of the exhaust pipe is communicated with the annular groove and the other end is communicated with the outside.

[0012] In a preferred embodiment, the fixture includes an ear seat fixedly sleeved on the upper end of the milling cutter body. An ear groove is formed at the lower end of the rotating shaft. A through hole is formed in the ear seat, and a threaded groove is formed between the ear groove and the peripheral wall of the rotating shaft and is disposed opposite to the through hole.

[0013] In a preferred embodiment, the plate moving device includes a plate moving guide rail disposed above the transmission device. A third sliding seat is provided on the plate moving guide rail. A telescopic rod is connected to the third sliding seat. The telescopic end of the telescopic rod is connected to a grasping platform. A plurality of suction cups are provided on one side surface of the grasping platform facing the printed circuit board.

[0014] In a preferred embodiment, control valves are provided at the opening of the annular groove and in the first transmission channel.

[0015] Compared with the prior art, the beneficial effects of the present invention are: 1. In the present invention, the milling cutter cutting and the laser cutting are coaxially and compoundly installed, the laser optical path is coaxially aligned with the rotation axis of the milling cutter, a channel for transmitting the laser beam is provided in the milling cutter rotating shaft and the milling cutter body, and the laser beam can directly pass through the rotating shaft and the milling cutter body to pre-cut or directly cut the printed circuit board. After the laser head pre-cuts, the milling cutter body can immediately perform fine trimming or secondary cutting along the same path, reducing the repeated positioning error, and the number of driving stations can be reduced. The synchronous driving of the milling cutter cutting assembly and the laser cutting assembly can be completed by a single planar moving device.

[0016] 2. In the present invention, through the gas overflow in the cooling assembly, the low-temperature gas can directly pass through the inside of the milling cutter body and the outside of the laser optical fiber, thereby synchronously or specifically cooling the milling cutter body or the laser optical fiber, and thus improving the service life of the milling cutter body and the laser optical fiber. Description of the Drawings

[0017] Figure 1 is the overall process structure schematic diagram of a printed circuit board splitting and side material cutting device provided by the present invention; Figure 2 is the external structure schematic diagram of the milling cutter cutting assembly and the laser cutting assembly in a printed circuit board splitting and side material cutting device provided by the present invention; Figure 3 is the sectional structure schematic diagram of the milling cutter cutting assembly and the laser cutting assembly in a printed circuit board splitting and side material cutting device provided by the present invention Figure 4 is Figure 3 the enlarged view of part A in Figure 5 is Figure 3 the enlarged view of part B in In the figure: 1 Transmission device, 2 Positioning table, 3 Plate moving device, 4 Planar moving device, 5 Telescopic member, 6 Mounting frame; 7 Milling cutter cutting assembly, 701 Driving motor, 702 Driving gear, 703 Rotating shaft, 704 Driven gear, 705 Milling cutter body, 706 Ear seat, 707 Through hole; 8 Laser cutting assembly, 801 Laser emitting head, 802 Laser transmission optical fiber, 803 First transmission channel, 804 Second transmission channel; 9 Heat insulation box; 10 Cooling assembly, 1001 Flow cavity, 1002 Heat dissipation protective sleeve, 1003 Annular groove, 1004 Exhaust pipe, 1005 Refrigerator. Detailed Embodiments

[0018] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0019] To solve the problem in the above-mentioned background technology that there are certain limitations when the milling cutter cutting or ultraviolet laser head cutting in the prior art is used alone during the printed circuit board sub-board and edge material cutting processes.

[0020] Please refer to Figure 1 and Figure 2 as shown, the present invention provides a technical solution: a printed circuit board sub-board and edge material cutting device, including a transmission device 1, a board moving device 3, a planar moving device 4, a milling cutter cutting assembly 7, a laser cutting assembly 8, a target reading device, and a control module.

[0021] Among them, the board moving device 3, the planar moving device 4, the milling cutter cutting assembly 7, the laser cutting assembly 8, and the target reading device are all arranged above the transmission device 1. The target reading device is a CCD or a laser sensor, and the positioning holes or marks on the printed circuit board are identified through the target reading device to ensure that the cutting path is consistent with the design drawing.

[0022] The board moving device 3 is used to move the printed circuit board discharged from the previous process to the positioning table 2 of the transmission device 1, and the transmission device 1 continuously transports the printed circuit board thereon through the positioning table 2 in sequence through the target reading device, the milling cutter cutting assembly 7, and the laser cutting assembly 8.

[0023] The target reading device is used to monitor the positioning holes on the printed circuit board in real time and feedback the signals to the control module, and the control module forms a cutting path based on the positioning holes on the printed circuit board.

[0024] The milling cutter cutting assembly 7 and the laser cutting assembly 8 are used to perform sub-board cutting and edge material cutting on the printed circuit board.

[0025] Among them, the milling cutter cutting assembly 7 and the laser cutting assembly 8 are installed at the output end of the planar moving device 4. The control module instructs the planar moving device 4 according to the path signal fed back by the target reading device, and the planar moving device 4 drives the milling cutter cutting assembly 7 and the laser cutting assembly 8 to adjust the cutting path for the printed circuit board to implement dynamic cutting of the printed circuit board.

[0026] In this device, different cutting methods are selected according to the different positions and materials of the printed circuit board to be cut. Specifically, for a printed circuit board with a relatively thin cutting position or high cutting accuracy requirements, a laser cutting process is selected. When in use, the target reading device reads the set cutting path on the printed circuit board, and the control module drives the laser cutting assembly 8 to cut the printed circuit board through the planar moving device.

[0027] For a printed circuit board with a relatively thick cutting position, a cutting process combining milling cutter cutting and laser cutting is selected. When in use, first, the target reading device reads the set cutting path on the printed circuit board. The control module first drives the laser cutting assembly 8 to perform pre-cutting on the printed circuit board, and at this time, the laser emitting head should be set with low power and short pulses to eliminate the substrate stress of the printed circuit board. Subsequently, the control module drives the milling cutter cutting assembly 7 to cut the printed circuit board along the same path, so as to reduce the mechanical stress of the milling cutter cutting assembly 7 and the cutting image of the heat affected zone of the laser cutting assembly 8 on the printed circuit board.

[0028] Since the cutting path of the printed circuit board is not a simple straight line, in this embodiment, the planar moving device 4 includes an X guide rail and a Y guide rail arranged above the transmission device 1.

[0029] Among them, a first sliding seat is slidably installed on the X guide rail, the Y guide rail is installed on the sliding seat, a second sliding seat is slidably installed on the Y guide rail, and independent power mechanisms for driving the first sliding seat and the second sliding seat to move are provided on both the X guide rail and the Y guide rail.

[0030] A telescopic member 5 is provided on the second sliding seat, the telescopic end of the telescopic member 5 is connected with a mounting frame 6, the milling cutter cutting assembly 7 and the laser cutting assembly 8 are arranged on the mounting frame 6, and the telescopic member 5 and the two power mechanisms are in communication connection with the control module. Through the cooperation of the X guide rail, the Y guide rail and the telescopic member 5, three-dimensional movement of the milling cutter cutting assembly 7 and the laser cutting assembly 8 on the X - Y - Z axes is achieved.

[0031] In this embodiment, referring to Figure 2 and Figure 3 as shown, the milling cutter cutting assembly 7 includes a driving motor 701 installed on the mounting frame 6, and a driving gear 702 is installed on the output shaft of the driving motor 701.

[0032] A rotating shaft 703 is rotatably installed on the mounting frame 6, a driven gear 704 is fixedly sleeved on the rotating shaft 703, and the driven gear 704 meshes with the driving gear 702. A milling cutter body 705 is connected to the lower end of the rotating shaft 703 through a fixture.

[0033] Among them, the drive motor 701 is communicatively connected to the control module. The control module controls the activation of the drive motor 701. The drive motor 701 drives the rotation of the driving gear 701. The driving gear 701 drives the rotation of the driven gear 704. The driven gear 704 drives the rotation of the rotating shaft 703. The rotating shaft 703 drives the rotation of the milling cutter body 705 to cut the printed circuit board.

[0034] In this embodiment, referring to Figure 2 and Figure 4 as shown, the laser cutting assembly 8 includes a laser emitter 801 provided on the mounting bracket 6. A laser transmission optical fiber 802 is connected to the emission end of the laser emitter 801. The laser emitter 801 is communicatively connected to the control module.

[0035] The laser cutting assembly 8 further includes a first transmission channel 803 opened on the rotating shaft 703. And the first transmission channel 803 is disposed opposite to the emission port of the laser transmission optical fiber 802. A second transmission channel 804 is opened on the milling cutter body 705 and is disposed opposite to the first transmission channel 803. And the central axes of the first transmission channel 803 and the second transmission channel 804 coincide with the vertical median axes of the rotating shaft 703 and the milling cutter body 705.

[0036] The laser cutting assembly 8 and the milling cutter cutting assembly 7 are integrally installed. The laser light path is coaxially aligned with the milling cutter rotating shaft. A first transmission channel 803 is opened inside the milling cutter rotating shaft. A second transmission channel 804 is opened inside the milling cutter body 705. The laser beam can directly pass through the rotating shaft 703 and the milling cutter body 705 to pre-cut or cut the printed circuit board. After the laser head pre-cuts, the milling cutter body 705 can immediately perform fine trimming along the same path, reducing the repeat positioning error, and the number of driving stations can be reduced. The synchronous driving of the milling cutter cutting assembly 7 and the laser cutting assembly 8 can be completed by a single planar moving device 4.

[0037] Among them, the rotating shaft 703 can be made of silicon carbide ceramic or titanium alloy material. And an antireflection film is plated on the inner wall of the first transmission channel 803 for transmitting ultraviolet laser and reducing laser energy loss.

[0038] In this equipment, the milling cutter body 705 itself serves as a cutting structure and is also indirectly used to transmit high-energy laser beams. During use, there may be an overheating phenomenon, which affects the use of the milling cutter body 705. And when the laser cutting assembly 8 is used, a large amount of heat energy is also generated in the first transmission channel 803 inside the rotating shaft 703, reducing the service life of the rotating shaft 703. To solve the above problems, the present application proposes the following solutions: In this embodiment, referring to Figure 2 and Figure 4As shown, a cooling component 10 is provided on the mounting bracket 6, and the cooling component 10 is used to cool down the milling cutter body 705 and the laser transmission optical fiber 802.

[0039] Among them, the cooling component 10 includes a heat insulation box 9 provided on the mounting bracket 6 and a refrigerator 1005. A circulation cavity 1001 is provided inside the heat insulation box 9, and the output end of the refrigerator 1005 is communicated with the circulation cavity 1001.

[0040] Among them, the rotating shaft 703 is rotatably mounted on the heat insulation box 9, and the first transmission channel 803 on the rotating shaft 703 is communicated with the circulation cavity 1001. One end of the laser transmission optical fiber 802 far from the laser emitting head 801 is communicated with the circulation cavity 1001.

[0041] The cooling component 10 further includes a heat dissipation protection sleeve 1002 sleeved on the laser transmission optical fiber. An annular groove 1003 is formed at one end of the heat dissipation protection sleeve 1002 located inside the circulation cavity 1001. A plurality of exhaust pipes 1004 are provided inside the heat dissipation protection sleeve 1002. The exhaust pipes 1004 are arranged along the length direction of the heat dissipation protection sleeve 1002, and one end of the exhaust pipe 1004 is communicated with the annular groove 1003 and the other end is communicated with the outside.

[0042] When the milling cutter body 705 and the rotating shaft 703 are overheated, the refrigerator 1005 injects low-temperature gas into the circulation cavity 1001. The low-temperature gas passes through the first transmission channel 803 and the second transmission channel 804 and is discharged from the lower end of the milling cutter body 705. The flow of the low-temperature gas takes away the heat on the rotating shaft 703 and the milling cutter body 705, thereby achieving the purpose of cooling down the milling cutter body 705 and the rotating shaft 703. Moreover, during the rotation and cutting process of the milling cutter body 705, the gas discharged from the milling cutter body 705 can also blow away the chips generated by cutting.

[0043] At the same time, the low-temperature gas in the circulation cavity 1001 will also pass through the annular groove 1003 and the exhaust pipes 1004 and be discharged to the outside, thereby cooling down the laser transmission optical fiber 802.

[0044] Furthermore, control valves are provided at the opening of the annular groove 1003 and inside the first transmission channel 803. By controlling the opening or closing of the first transmission channel 803 and the opening of the annular groove 1003, the laser transmission optical fiber 802 or the milling cutter body 705 can be selectively cooled to avoid the phenomenon that the temperature of either of them is too low and affects the cutting efficiency.

[0045] In this embodiment, refer to Figure 4As shown, the fixture includes an ear seat 706 fixedly sleeved on the upper end of the milling cutter body 705. An ear groove is provided at the lower end of the rotating shaft 703. A through hole 707 is provided on the ear seat 706. A threaded groove facing the through hole 707 is provided between the ear groove and the peripheral wall of the rotating shaft 703, so that the user can quickly replace the milling cutter body 705.

[0046] In this embodiment, the plate moving device 3 includes a plate moving guide rail disposed above the transmission device 1. A third sliding seat is provided on the plate moving guide rail. A telescopic rod is connected to the third sliding seat. The telescopic end of the telescopic rod is connected to a grasping platform. A plurality of suction cups are provided on one side surface of the grasping platform facing the printed circuit board.

[0047] Among them, the suction cups are connected to an external air pump. Thus, after the suction cups are attached to the surface of the printed circuit board, negative pressure can be automatically formed in the suction cups to adsorb and grasp the printed circuit board. Then, the printed circuit board is driven by the guide rail to the positioning table 2 on the transmission device 1.

[0048] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A printed circuit board splitting and edge material cutting device, characterized in that: It comprises a transmission device (1), a plate moving device (3), a plane moving device (4), a milling cutter cutting component (7), a laser cutting component (8), a target reading device and a control module; The plate moving device (3) is used to move the printed circuit board discharged in the previous process to the positioning table (2) of the transmission device (1), and the transmission device (1) continuously transmits the printed circuit board thereon through the positioning table (2) to pass through the target reading device, the milling cutter cutting component (7) and the laser cutting component (8) in sequence; The target reading device is used to monitor the positioning holes on the printed circuit board in real time and feed back the signal to the control module, and the control module forms a cutting path according to the positioning holes on the printed circuit board; The milling cutter cutting assembly (7) and the laser cutting assembly (8) are used to perform board cutting and edge material cutting on a printed circuit board; The milling cutter cutting assembly (7) and the laser cutting assembly (8) are installed at the output end of the planar moving device (4); the control module instructs the planar moving device (4) according to the path signal fed back by the target reading device; the planar moving device (4) drives the milling cutter cutting assembly (7) and the laser cutting assembly (8) to adjust the cutting path of the printed circuit board, so as to implement dynamic cutting of the printed circuit board.

2. A printed circuit board splitting and edge material cutting device according to claim 1, characterized in that: The planar moving device (4) comprises an X guide rail and a Y guide rail arranged above the transmission device (1); Wherein, a first sliding seat is slidably mounted on the X guide rail, the Y guide rail is mounted on the sliding seat, a second sliding seat is slidably mounted on the Y guide rail, and an independent power mechanism for driving the first sliding seat and the second sliding seat to move is provided on both the X guide rail and the Y guide rail; A telescopic member (5) is arranged on the second sliding seat, the telescopic end of the telescopic member (5) is connected to a mounting frame (6), the milling cutter cutting assembly (7) and the laser cutting assembly (8) are arranged on the mounting frame (6), and the telescopic member (5) and the two power mechanisms are both communicatively connected to the control module.

3. A printed circuit board splitting and edge material cutting device according to claim 2, characterized in that: The milling cutter cutting assembly (7) comprises a driving motor (701) mounted on the mounting frame (6), and a driving gear (702) is mounted on the output shaft of the driving motor (701); A rotating shaft (703) is rotatably mounted on the mounting frame (6); a driven gear (704) is fixedly sleeved on the rotating shaft (703), and the driven gear (704) is meshed with the driving gear (702); a milling cutter body (705) is connected to the lower end of the rotating shaft (703) via a clamp.

4. A printed circuit board splitting and edge material cutting device according to claim 3, characterized in that: The laser cutting assembly (8) comprises a laser emitting head (801) arranged on the mounting frame (6), and a laser transmission optical fiber (802) is connected to the emitting end of the laser emitting head (801); The laser cutting assembly (8) further comprises a first transmission channel (803) provided on the rotating shaft (703), and the first transmission channel (803) is arranged opposite to the emission port of the laser transmission optical fiber (802), a second transmission channel (804) is provided on the milling cutter body (705) and opposite to the first transmission channel (803), and the central axes of the first transmission channel (803) and the second transmission channel (804) coincide with the vertical centerline axes of the rotating shaft (703) and the milling cutter body (705); The laser emitting head (801) and the driving motor (701) are both communicatively connected to the control module.

5. A printed circuit board splitting and edge material cutting device according to claim 4, characterized in that: A cooling component (10) is arranged on the mounting frame (6), and the cooling component (10) is used to cool the milling cutter body (705) and the laser transmission optical fiber (802).

6. A printed circuit board splitting and edge material cutting device according to claim 5, characterized in that: The cooling assembly (10) comprises a heat-insulating box (9) and a refrigerator (1005) arranged on the mounting frame (6); a circulation cavity (1001) is arranged in the heat-insulating box (9); and an output end of the refrigerator (1005) is in communication with the circulation cavity (1001); The rotating shaft (703) is rotatably mounted on the heat-insulating box (9), and the first transmission channel (803) on the rotating shaft (703) is connected to the circulation cavity (1001), and an end of the laser transmission optical fiber (802) away from the laser emission head (801) is connected to the circulation cavity (1001); The cooling assembly (10) further comprises a heat dissipation protective sleeve (1002) sleeved on the laser transmission optical fiber, wherein an annular groove (1003) is provided on one end of the heat dissipation protective sleeve (1002) located in the circulation cavity (1001), and a plurality of exhaust pipes (1004) are arranged in the heat dissipation protective sleeve (1002), wherein the exhaust pipes (1004) are arranged along the length direction of the heat dissipation protective sleeve (1002), and one end of the exhaust pipe (1004) is connected to the annular groove (1003), and the other end is connected to the outside.

7. The printed circuit board splitting and edge material cutting device according to claim 3, characterized in that: The clamp comprises an ear seat (706) fixedly mounted on the upper end of the milling cutter body (705), an ear groove is provided at the lower end of the rotating shaft (703), a through hole (707) is provided on the ear seat (706), and a threaded groove is provided between the ear groove and the peripheral wall of the rotating shaft (703) and is opposite to the through hole (707).

8. The printed circuit board splitting and edge material cutting device according to claim 1, characterized in that: The plate moving device (3) comprises a plate moving guide rail arranged above the transmission device (1), a third sliding seat being arranged on the plate moving guide rail, a telescopic rod being connected to the third sliding seat, a telescopic end of the telescopic rod being connected to a gripping platform, and a plurality of suction cups being arranged on a side surface of the gripping platform facing the printed circuit board.

9. A printed circuit board splitting and edge material cutting device according to claim 6, characterized in that: Control valves are provided at the opening of the annular groove (1003) and in the first transmission channel (803).

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