Circuit board assembly and electronic equipment

Abstract

The invention provides a circuit board assembly and electronic equipment. The circuit board assembly comprises a first circuit board, a first shielding case, a second circuit board, a second shielding case and a heat conduction connecting piece. The first circuit board comprises a first board body and a first heating device carried on the first board body; the first shielding cover and the first plate body form a first accommodating cavity for accommodating the first heating device, and the first shielding cover is in heat conduction connection with the first heating device; the second circuit board comprises a second board body and a second heating device carried on the second board body; the second shielding case and the second plate body form a second accommodating cavity for accommodating a second heating device, the second shielding case is in heat conduction connection with the second heating device, and the second shielding case and the first shielding case are arranged oppositely; the heat-conducting connector is in heat-conducting connection with the first shielding case and the second shielding case. According to the circuit board assembly, the temperature consistency of the first circuit board side and the second circuit board side is good.

Description

Technical Field

[0001] This application relates to the field of electronic technologies, and in particular, to a circuit board assembly and an electronic device. Background Art

[0002] With the development of technologies, electronic devices such as mobile phones have become increasingly popular and have more and more powerful functions. However, in related technologies, the problem of heat generation of functional devices of electronic devices has become increasingly prominent, thereby resulting in a poor holding experience when users hold the electronic devices. Summary of the Invention

[0003] In a first aspect, an embodiment of the present application provides a circuit board assembly, which includes:

[0004] A first circuit board, which includes a first board body and a first heat-generating device carried on the first board body;

[0005] A first shielding cover, which forms a first receiving cavity with the first board body to receive the first heat-generating device, and the first shielding cover is thermally connected to the first heat-generating device;

[0006] A second circuit board, which includes a second board body and a second heat-generating device carried on the second board body;

[0007] A second shielding cover, which forms a second receiving cavity with the second board body to receive the second heat-generating device, and the second shielding cover is thermally connected to the second heat-generating device, and the second shielding cover is arranged opposite to the first shielding cover; and

[0008] A heat-conducting connecting member, which is thermally connected to the first shielding cover and the second shielding cover.

[0009] In a second aspect, another embodiment of the present application provides an electronic device, which includes the circuit board assembly as described in the first aspect.

[0010] In summary, for the circuit board assembly provided by the embodiment of the present application, the first shielding cover is thermally connected to the first heat-generating device. Therefore, the heat dissipated by the first heat-generating device can be transferred to the first shielding cover. The second shielding cover is thermally connected to the second heat-generating device. Therefore, the heat dissipated by the second heat-generating device can be transferred to the second shielding cover. Further, the circuit board assembly provided by the embodiment of the present application further includes a heat-conducting connecting member, and the heat-conducting connecting member is connected to the first shielding cover and the second shielding cover. Therefore, the heat of the first shielding cover and the heat of the second shielding cover can be transferred via the heat-conducting connecting member, so that the temperature of the circuit board assembly on the side where the first circuit board is located is the same as or approximately the same as the temperature of the circuit board assembly on the side where the second circuit board is located. When the circuit board assembly is applied to an electronic device, the temperature of the components in the electronic device adjacent to the first circuit board is the same as or approximately the same as the temperature of the components in the electronic device adjacent to the second circuit board. Thus, the experience of the user when holding the electronic device is improved. In addition, since the heat-conducting connecting member is connected to the first shielding cover and the second shielding cover, it can also prevent the temperature of the first heat-generating device from being too high and causing the performance of the first heat-generating device to decline. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0012] Figure 1 is a schematic cross-sectional view of a circuit board assembly provided by an embodiment of the present application;

[0013] Figure 2 is Figure 1 a schematic diagram of the detailed identification of the circuit board assembly shown in;

[0014] Figure 3 is Figure 2 a schematic diagram of the detailed identification of the circuit board assembly shown in;

[0015] Figure 4 is Figure 1 a schematic diagram of the detailed identification of the circuit board assembly shown in;

[0016] Figure 5 is Figure 4 a schematic diagram of the heat transfer path of the circuit board assembly provided in;

[0017] Figure 6 is a schematic cross-sectional view of a circuit board assembly provided by another embodiment of the present application;

[0018] Figure 7 Schematic diagram of an electronic device provided by an embodiment of the present application;

[0019] Figure 8 For an embodiment Figure 7 Cross-sectional view of the electronic device shown in an embodiment along line I-I;

[0020] Figure 9 For another embodiment Figure 7 Cross-sectional view of the electronic device shown in an embodiment along line I-I. Specific embodiments

[0021] The technical solutions of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described in the present application are only a part of the embodiments, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments provided in the present application without creative efforts shall fall within the protection scope of the present application.

[0022] Referring to "embodiment" in the present application means that the specific features, structures or characteristics described in connection with the embodiment may be included in at least one embodiment of the present application. The phrase appears in various positions in the specification does not necessarily refer to the same embodiment, nor is it an exclusive, independent or alternative embodiment to other embodiments. Those skilled in the art can explicitly and implicitly understand that the embodiments described in the present application can be combined with other embodiments.

[0023] The terms "first", "second", etc. in the specification and claims of the present application and the above accompanying drawings are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a component or device including one or more parts is not limited to the one or more parts listed, but optionally further includes one or more parts not listed but inherent in the product shown, or one or more parts that should be possessed based on the described functions.

[0024] Please refer to Figure 1 , Figure 1A cross-sectional schematic diagram of a circuit board assembly provided by an embodiment of the present application. In this embodiment, the circuit board assembly 10 includes a first circuit board 110, a first shielding cover 120, a second circuit board 130, a second shielding cover 140, and a heat conducting connection member 150. The first circuit board 110 includes a first board body 111 and a first heat generating device 112 carried on the first board body 111. The first shielding cover 120 and the first board body 111 form a first receiving cavity 120a to receive the first heat generating device 112, and the first shielding cover 120 is thermally connected to the first heat generating device 112. The second circuit board 130 includes a second board body 131 and a second heat generating device 132 carried on the second board body 131. The second shielding cover 140 and the second board body 131 form a second receiving cavity 140a to receive the second heat generating device 132, and the second shielding cover 140 is thermally connected to the second heat generating device 132. The second shielding cover 140 is disposed opposite to the first shielding cover 120. The heat conducting connection member 150 is connected between the first shielding cover 120 and the second shielding cover 140.

[0025] In the schematic diagram of this embodiment, the first circuit board 110 is located above the circuit board assembly 10. Therefore, the first circuit board 110 is also referred to as the top board (Top Layer / Top Board) or the top plate. The first circuit board 110 includes a first board body 111 and a first heat generating device 112. The first board body 111 can be, but is not limited to, a printed circuit board body. The first heat generating device 112 is a key electronic component in the circuit board assembly 10. For example, the first heat generating device 112 can include, but is not limited to, a processor or a memory, etc. When the first heat generating device 112 is working, it generates heat.

[0026] In addition, in an embodiment, the first circuit board 110 may further include an external connection interface. In other embodiments, the first circuit board 110 may not include an external connection interface. The embodiments of the present application do not limit whether the first circuit board 110 includes an external connection interface.

[0027] The first shielding cover 120 is used to form a first accommodation cavity 120a with the first board body 111, and the first accommodation cavity 120a is used to accommodate the first heating device 112. When the first heating device 112 operates, electromagnetic waves will be emitted. The first shielding cover 120 can shield the electromagnetic waves emitted by the first heating device 112 to reduce or even prevent the electromagnetic waves emitted by the first heating device 112 from radiating outside the first shielding cover 120. In addition, the first shielding cover 120 can also reduce or even prevent the electromagnetic waves outside the first shielding cover 120 from entering the first accommodation cavity 120a. Generally speaking, the material of the first shielding cover 120 includes metals, such as copper, or aluminum, or steel, etc. This application does not limit the material of the first shielding cover 120.

[0028] In this embodiment, the number of the first heating devices 112 carried on the first circuit board 110 is shown as one for illustration. It can be understood that the first circuit board 110 may include one or more first heating devices 112, and the number of the first heating devices 112 in the schematic diagram of the embodiment of this application should not be construed as a limitation on the first circuit board 110 provided by the embodiment of this application.

[0029] The first shielding cover 120 is thermally connected to the first heating device 112. Therefore, the heat generated by the first heating device 112 can be transferred to the first shielding cover 120. The specific manner of the thermal connection between the first shielding cover 120 and the first heating device 112 will be described in detail later.

[0030] In this embodiment, the second circuit board 130 and the first circuit board 110 are stacked. Therefore, the circuit board assembly 10 is also called a stacked board or a stacked board assembly. In the figure, the second circuit board 130 is located below the circuit board assembly 10. Therefore, the second circuit board 130 is also called the lower board (Bottom Layer / Bottom Board) or the bottom plate. The second circuit board 130 includes a second board body 131 and a second heating device 132. The second board body 131 can be, but is not limited to, a printed circuit board body. The second heating device 132 can include, but is not limited to, a power management chip, or a radio frequency chip, etc. When the second heating device 132 operates, heat is generated.

[0031] In addition, the second circuit board 130 may further include an external connection interface. In another embodiment, the second circuit board 130 may not include an external connection interface either. This application embodiment does not limit whether the second circuit board 130 includes an external connection interface.

[0032] The second shielding cover 140 is used to form a second receiving cavity 140a with the second plate body 131, and the second receiving cavity 140a is used to receive the second heating device 132. When the second heating device 132 operates, electromagnetic waves will be emitted. The second shielding cover 140 can shield the electromagnetic waves emitted by the second heating device 132 to reduce or even prevent the electromagnetic waves emitted by the second heating device 132 from radiating outside the second shielding cover 140. In addition, the second shielding cover 140 can also reduce or even prevent the electromagnetic waves outside the second shielding cover 140 from entering the second receiving cavity 140a. Generally speaking, the material of the second shielding cover 140 includes metals, such as copper, or aluminum, or steel, etc. The present application does not limit the material of the second shielding cover 140.

[0033] In this embodiment, the number of the second heating devices 132 carried on the second circuit board 130 is shown as one for illustration. It can be understood that the second circuit board 130 may include one or more second heating devices 132, and the number of the second heating devices 132 in the schematic diagram of the embodiment of the present application should not be construed as a limitation on the second circuit board 130 provided by the embodiment of the present application.

[0034] The second shielding cover 140 is thermally connected to the second heating device 132. Therefore, the heat generated by the second heating device 132 can be transferred to the second shielding cover 140. The specific manner of the thermal connection between the second shielding cover 140 and the second heating device 132 will be described in detail later.

[0035] Under normal circumstances, when the circuit board assembly 10 operates, the heat generated by the first circuit board 110 is greater than the heat generated by the second circuit board 130.

[0036] To clearly illustrate the beneficial effects of the circuit board assembly 10 provided by the embodiment of the present application, the circuit board assembly 10 in the related art before the improvement of the circuit board assembly 10 provided by the embodiment of the present application will be described herein. It can be understood that the circuit board assembly 10 in the related art should not be construed as the circuit board assembly 10 in the prior art.

[0037] In the circuit board assembly 10 in the related art, due to the uneven distribution of the first heating device 112 on the first circuit board 110 and the second heating device 132 on the second circuit board 130, and there is a large conduction thermal resistance between the first circuit board 110 and the second circuit board 130. Therefore, it will cause a large temperature difference between the temperature on the side of the first circuit board 110 facing away from the second circuit board 130 and the temperature on the side of the second circuit board 130 facing away from the first circuit board 110 in the circuit board assembly 10. As a result, when the circuit board assembly 10 in the related art is applied to the electronic device 1, the temperature of the components adjacent to the first circuit board 110 in the electronic device 1 is higher than the temperature of the components adjacent to the second circuit board 130 in the electronic device 1, thereby affecting the user experience when holding the electronic device 1.

[0038] In the circuit board assembly 10 provided by the embodiment of the present application, the heat conduction connection member 150 is connected to the first shielding cover 120 and the second shielding cover 140. Therefore, the heat of the first shielding cover 120 and the heat of the second shielding cover 140 can be transferred through the heat conduction connection member 150. Thus, the temperature on the side where the first circuit board 110 is located in the circuit board assembly 10 is the same as or approximately the same as the temperature on the side where the second circuit board 130 is located in the circuit board assembly 10. When the circuit board assembly 10 is applied to the electronic device 1, the temperature of the components adjacent to the first circuit board 110 in the electronic device 1 is the same as or approximately the same as the temperature of the components adjacent to the second circuit board 130 in the electronic device 1.

[0039] In one embodiment, the side where the first circuit board 110 is located in the circuit board assembly 10 is also called the front side, and the side where the second circuit board 130 is located in the circuit board assembly 10 is also called the back side. Thus, it can be seen that the temperature on the front side and the back side of the circuit board assembly 10 provided by the embodiment of the present application is the same as or approximately the same, and the temperature difference between the front side and the back side of the circuit board assembly 10 is small.

[0040] In one embodiment, the components adjacent to the first circuit board 110 in the electronic device 1 can be, but are not limited to, the display screen 20 (also called the screen), and the components adjacent to the second circuit board 130 in the electronic device 1 can be, but are not limited to, the rear cover 30. Thus, when the circuit board assembly 10 provided by the embodiment of the present application is applied to the electronic device 1, the temperature of the display screen 20 of the electronic device 1 is the same as or approximately the same as the temperature of the rear cover 30 of the electronic device 1, thereby improving the user experience when holding the electronic device 1.

[0041] In one embodiment, the heat-conducting connecting member 150 may include, but is not limited to, inorganic heat-conducting films (such as graphite, graphene, or boron nitride), or metal foils (such as copper foils or aluminum foils, etc.), or polymers (such as ultra-high molecular weight polyethylene, polymer matrix composites, etc.), or two-phase heat-conducting connecting members 150 (such as vapor chambers (VCs)), or active liquid cooling (such as liquid-cooled diaphragms), etc., materials with relatively high thermal conductivity.

[0042] In summary, for the circuit board assembly 10 provided by the embodiment of the present application, the first shielding cover 120 is thermally connected to the first heat-generating device 112. Therefore, the heat dissipated by the first heat-generating device 112 can be transferred to the first shielding cover 120. The second shielding cover 140 is thermally connected to the second heat-generating device 132. Therefore, the heat dissipated by the second heat-generating device 132 can be transferred to the second shielding cover 140. Further, the circuit board assembly 10 provided by the embodiment of the present application further includes a heat-conducting connecting member 150, and the heat-conducting connecting member 150 is connected to the first shielding cover 120 and the second shielding cover 140. Therefore, the heat of the first shielding cover 120 and the heat of the second shielding cover 140 can be transferred via the heat-conducting connecting member 150, so that the temperature of the circuit board assembly 10 on the side where the first circuit board 110 is located is the same as or approximately the same as the temperature of the circuit board assembly 10 on the side where the second circuit board 130 is located. When the circuit board assembly 10 is applied to the electronic device 1, the temperature of the components in the electronic device 1 adjacent to the first circuit board 110 is the same as or approximately the same as the temperature of the components in the electronic device 1 adjacent to the second circuit board 130. Thus, the experience of the user holding the electronic device 1 is improved. In addition, the heat-conducting connecting member 150 is connected to the first shielding cover 120 and the second shielding cover 140, which can also prevent the temperature of the first heat-generating device 112 from being too high and causing the performance of the first heat-generating device 112 to decline.

[0043] Please refer to Figure 1 and Figure 2 , Figure 2 For Figure 1Schematic diagram of the detail identification of the circuit board assembly shown. The first shielding cover 120 includes a first shielding portion 121 and a second shielding portion 122. The first shielding portion 121 is thermally connected to the first heat generating device 112. The second shielding portion 122 is bent and connected to the periphery of the first shielding portion 121. The second shielding cover 140 includes a third shielding portion 141 and a fourth shielding portion 142. The third shielding portion 141 is thermally connected to the second heat generating device 132. The fourth shielding portion 142 is bent and connected to the periphery of the third shielding portion 141. Wherein, the thermal connection member 150 includes a connected first thermal connection portion 151 and a second thermal connection portion 152. The first thermal connection portion 151 is connected to the first shielding portion 121, and the second thermal connection portion 152 is connected to the third shielding portion 141.

[0044] In this embodiment, the first shielding portion 121 is the portion of the first shielding cover 120 located away from the first plate body 111 of the first heat generating device 112. The first shielding portion 121 is thermally connected to the first heat generating device 112. Therefore, the heat generated by the first heat generating device 112 can be quickly transmitted to the first shielding portion 121. One end of the second shielding portion 122 is bent and connected to the periphery of the first shielding portion 121, and the other end of the second shielding portion 122 is connected to the first plate body 111. Thus, the first shielding portion 121 of the first shielding cover 120, the second shielding portion 122 of the first shielding cover 120 and the first plate body 111 cooperate together to form the first receiving cavity 120a.

[0045] In this embodiment, the third shielding portion 141 is the portion of the second shielding cover 140 located away from the second plate body 131 of the second heat generating device 132. The third shielding portion 141 is thermally connected to the second heat generating device 132. Therefore, the heat generated by the second heat generating device 132 can be quickly transmitted to the third shielding portion 141. One end of the fourth shielding portion 142 is bent and connected to the periphery of the third shielding portion 141, and the other end of the fourth shielding portion 142 is connected to the second plate body 131. Thus, the third shielding portion 141 of the second shielding cover 140, the fourth shielding portion 142 of the second shielding cover 140 and the second plate body 131 cooperate together to form the second receiving cavity 140a.

[0046] As introduced above, the heat generated by the first heating device 112 can be quickly transferred to the first shielding part 121, and the heat generated by the second heating device 132 can be quickly transferred to the third shielding part 141. The first heat conduction connection part 151 is connected to the first shielding part 121, and the second heat conduction connection part 152 is connected to the third shielding part 141. Therefore, when the heat generated by the first heating device 112 is greater than the heat generated by the second heating device 132, the heat generated by the first heating device 112 can be transferred to the second heat conduction connection part 152 via the first shielding part 121 and the first heat conduction connection part 151, so that the temperature on the side of the first circuit board 110 of the circuit board assembly 10 is equal to or approximately equal to the temperature on the side of the second circuit board 130. When the circuit board assembly 10 is applied to the electronic device 1, the temperature of the components in the electronic device 1 adjacent to the first circuit board 110 is the same as or approximately the same as the temperature of the components in the electronic device 1 adjacent to the second circuit board 130. Thus, the experience of the user holding the electronic device 1 is improved.

[0047] When the heat generated by the second heating device 132 is greater than the heat generated by the first heating device 112, the heat generated by the second heating device 132 can be transferred to the first heat conduction connection part 151 via the third shielding part 141 and the second heat conduction connection part 152, so that the temperature on the side of the first circuit board 110 of the circuit board assembly 10 is equal to or approximately equal to the temperature on the side of the second circuit board 130. When the circuit board assembly 10 is applied to the electronic device 1, the temperature of the components in the electronic device 1 adjacent to the first circuit board 110 is the same as or approximately the same as the temperature of the components in the electronic device 1 adjacent to the second circuit board 130. Thus, the experience of the user holding the electronic device 1 is improved.

[0048] Furthermore, the first heat conduction connection part 151 is connected to the first shielding part 121, and the second heat conduction connection part 152 is connected to the third shielding part 141, which can quickly conduct the heat generated by the first heating device 112 and the heat generated by the second heating device 132.

[0049] Please refer to Figure 2 and Figure 3 , Figure 3 For Figure 2Schematic diagram of the detail identification of the circuit board assembly shown. In this embodiment, the first board body 111 has a first bearing surface 111a and a first side surface 111b. The first bearing surface 111a is used to bear the first heating device 112, and the first side surface 111b is bent and connected to the first bearing surface 111a. The second board body 131 has a second bearing surface 131a and a second side surface 131b. The second bearing surface 131a is used to bear the second heating device 132, and the second side surface 131b is bent and connected to the first bearing surface 111a. The heat conduction connecting member 150 further includes a third heat conduction connecting portion 153. The third heat conduction connecting portion 153 is connected between the first heat conduction connecting portion 151 and the second heat conduction connecting portion 152, and the third heat conduction connecting portion 153 is disposed on one side of the first side surface 111b and the second side surface 131b.

[0050] In this embodiment, the heat conduction connecting member 150 further includes a third heat conduction connecting portion 153. In one embodiment, the first heat conduction connecting portion 151, the second heat conduction connecting portion 152 and the third heat conduction connecting portion 153 are of an integral structure. In other embodiments, the third heat conduction connecting portion 153 and at least one of the first heat conduction connecting portion 151 and the second heat conduction connecting portion 152 are of a split structure. The embodiment of the present application does not limit whether the third heat conduction connecting portion 153 and the first heat conduction connecting portion 151 and the second heat conduction connecting portion 152 are of an integral structure or a split structure, as long as the third heat conduction connecting portion 153 conducts heat and connects the first heat conduction connecting portion 151, and the third heat conduction connecting portion 153 conducts heat and connects the second heat conduction connecting portion 152.

[0051] One end of the third heat conduction connecting portion 153 is bent and connected to the first heat conduction connecting portion 151, and the other end of the third heat conduction connecting portion 153 is bent and connected to the second heat conduction connecting portion 152.

[0052] The third heat conduction connecting portion 153 is disposed on one side of the first side surface 111b and the second side surface 131b. Therefore, when the heat conduction connecting member 150 connects the first shielding cover 120 and the second shielding cover 140, it is convenient to connect with the first shielding cover 120 and the second shielding cover 140, and it is also convenient to cooperate and assemble with the first circuit board 110 and the second circuit board 130.

[0053] Further, please refer to Figure 2 and Figure 3, the circuit board assembly 10 further includes a first heat conducting member 160 and a second heat conducting member 170. The first heat conducting member 160 is connected to the first heat generating device 112 and the first shielding portion 121. The orthographic projection of the first heat conducting member 160 on the first shielding portion 121 falls within the orthographic projection range of the first heat conducting connection portion 151 on the first shielding portion 121. The second heat conducting member 170 is connected to the second heat generating device 132 and the third shielding portion 141, and the orthographic projection of the second heat conducting member 170 on the third shielding portion 141 falls within the orthographic projection range of the second heat conducting connection portion 152 on the third shielding portion 141.

[0054] In this embodiment, the first heat conducting member 160 is also referred to as a thermal interface material (TIM). The first heat conducting member 160 can be, but is not limited to, thermal grease, or thermal silica gel, or thermal glue, etc. The first heat conducting member 160 is connected to the first heat generating device 112 and the first shielding portion 121, and can fill the micro voids between the first heat generating device 112 and the first shielding portion 121, fill the holes on the surface of the first heat generating device 112, and fill the holes on the surface of the first shielding portion 121 facing the first heat generating device 112, thereby effectively increasing the heat conduction between the first heat generating device 112 and the first shielding portion 121, reducing the contact thermal resistance between the first heat generating device 112 and the first shielding portion 121, and improving the heat dissipation effect of the heat generated by the first heat generating device 112 being transferred to the first shielding portion 121.

[0055] The orthographic projection of the first heat conducting member 160 on the first shielding portion 121 falls within the orthographic projection range of the first heat conducting connection portion 151 on the first shielding portion 121. Thus, it can be seen that there is a relatively large contact area between the first heat conducting connection portion 151 and the first shielding portion 121. After the heat generated by the first heat generating device 112 is transferred to the first shielding portion 121, it can be quickly transferred out through the first heat conducting connection portion 151, thereby improving the heat dissipation effect.

[0056] In this embodiment, the second heat conducting member 170 is also referred to as a thermal interface material (TIM). The second heat conducting member 170 can be, but is not limited to, thermal grease, thermal silica gel, thermal glue, etc. The second heat conducting member 170 is connected to the second heat generating device 132 and the third shielding portion 141, and can fill the micro voids between the second heat generating device 132 and the third shielding portion 141, fill the holes on the surface of the second heat generating device 132, and fill the holes on the surface of the third shielding portion 141 facing the second heat generating device, so as to effectively increase the heat conduction between the second heat generating device 132 and the third shielding portion 141, reduce the contact thermal resistance between the second heat generating device 132 and the third shielding portion 141, and improve the heat dissipation effect of the heat generated by the second heat generating device 132 being transferred to the third shielding portion 141.

[0057] The orthographic projection of the second heat conducting member 170 on the third shielding portion 141 falls within the orthographic projection range of the second heat conducting connection portion 152 on the third shielding portion 141. It can be seen that there is a relatively large contact area between the second heat conducting connection portion 152 and the third shielding portion 141. After the heat generated by the second heat generating device 132 is transferred to the third shielding portion 141, it can be quickly transferred out through the second heat conducting connection portion 152, thereby improving the heat dissipation effect.

[0058] Please refer to Figure 1 、 Figure 4 and Figure 5 , Figure 4 is Figure 1 a schematic diagram of the detail identification of the circuit board assembly shown in Figure 5 is Figure 4 a schematic diagram of the heat transfer path of the circuit board assembly provided in . In this embodiment, the circuit board assembly 10 further includes a support member 180 and a third heat conducting member 190. The support member 180 is disposed between the first board body 111 and the second board body 131. The support member 180, the first board body 111, and the second board body 131 jointly define an assembly gap 131c. The third heat conducting member 190 is disposed in the assembly gap 131c for thermally connecting the first board body 111 and the second board body 131.

[0059] The support member 180 is disposed between the first board body 111 and the second board body 131 for supporting the first board body 111 and the second board body 131. In one embodiment, the support member 180 can be, but is not limited to, a metal support member 180. It can be understood that in other embodiments, the support member 180 can also be a support member 180 made of insulating material.

[0060] The circuit board assembly 10 includes a support member 180 disposed between the first board body 111 and the second board body 131 for supporting the first board body 111 and the second board body 131. An assembly gap 131c is jointly defined among the support member 180, the first board body 111, and the second board body 131. The third heat conducting member 190 is disposed in the assembly gap 131c. When the heat dissipated by the first heat generating device 112 is not balanced with the heat dissipated by the second heat generating device 132, the heat of the one with a higher temperature among the first heat generating device 112 and the second heat generating device 132 can be transferred to the other with a lower temperature among the first heat generating device 112 and the second heat generating device 132 via the third heat conducting member 190. Thus, the temperature of the circuit board assembly 10 on the side where the first circuit board 110 is located is made to be the same as or approximately the same as the temperature of the circuit board assembly 10 on the side where the second circuit board 130 is located. When the circuit board assembly 10 is applied to the electronic device 1, the temperature of the components in the electronic device 1 adjacent to the first circuit board 110 is the same as or approximately the same as the temperature of the components in the electronic device 1 adjacent to the second circuit board 130. Thereby, the experience of the user holding the electronic device 1 is improved.

[0061] In this embodiment, the third heat conducting member 190 is also referred to as a thermal interface material (TIM). The third heat conducting member 190 can be, but is not limited to, thermal grease, thermal silica gel, thermal glue, etc. The third heat conducting member 190 is disposed in the assembly gap 131c for thermally connecting the first board body 111 and the second board body 131. Thus, the third heat conducting member 190 can fill the holes on the surface of the first board body 111 and the empty barrels on the surface of the second board body 131, thereby effectively increasing the heat conduction between the first board body 111 and the second board body 131, reducing the contact thermal resistance between the first board body 111 and the second board body 131, and enhancing the heat dissipation effect between the first board body 111 and the second board body 131.

[0062] In another embodiment, the first circuit board 110 further includes a first functional device (not shown in the figure), and the first functional device is disposed on the surface of the first board body 111 facing away from the first heat generating device 112. Correspondingly, the second circuit board 130 further includes a second functional device (not shown in the figure), and the second functional device is disposed on the surface of the second circuit board 130 facing away from the second heat generating device 132. Therefore, the first functional device and the second functional device are located between the first board body 111 and the second board body 131. The support is disposed between the first board body 111 and the second board body 131, so that a space for accommodating the first functional device and the second functional device can be formed between the first board body 111 and the second board body 131, so as to reduce or even avoid the probability that the first functional device touches the second board body 131 or touches the second functional device and is damaged, and can reduce or even avoid the probability that the second functional device touches the first board body 111 or touches the first functional device and is damaged.

[0063] Please refer to Figure 5 , the heat transfer path is identified by a line with an arrow. In this embodiment, taking the heat generated by the first heat generating device 112 being greater than the heat generated by the second heat generating device 132 and the temperature of the first heat generating device 112 being higher than the temperature of the second heat generating device 132 as an example for illustration, it can be understood that it should not be construed as a limitation on the embodiments of the present application. The heat generated by the first heat generating device 112 is transferred to the first shielding cover 120 via the first heat conducting member 160, and is transferred to the heat conducting connection member 150 via the first shielding cover 120, and is transferred to the part of the heat conducting connection member 150 connecting the second shielding cover 140. In addition, the heat generated by the first heat generating device 112 is also transferred to the second heat generating device 132 via the first board body 111 and the third heat conducting member 190. The heat of the second heat generating device 132 is transferred to the second shielding cover 140 via the second heat conducting member 170, and the heat of the second shielding cover 140 is transferred to the part of the heat conducting connection member 150 connecting the second shielding cover 140.

[0064] As can be seen, the circuit board assembly 10 provided by the embodiment of the present application can quickly transfer the heat on the high-temperature side (the first circuit board 110 side in the present application) to the low-temperature side of the circuit board assembly 10 (i.e., the second circuit board 130 side), and can increase the heat conduction area, reduce the conduction thermal resistance, and effectively reduce the temperature difference between the high-temperature side and the low-temperature side of the circuit board assembly 10. Thereby, the temperature on the side where the first circuit board 110 is located of the circuit board assembly 10 is the same as or approximately the same as the temperature on the side where the second circuit board 130 is located of the circuit board assembly 10. When the circuit board assembly 10 is applied to the electronic device 1, the temperature of the components adjacent to the first circuit board 110 in the electronic device 1 is the same as or approximately the same as the temperature of the components adjacent to the second circuit board 130 in the electronic device 1. Thereby, the experience when the user holds the electronic device 1 is improved.

[0065] In one embodiment, the thermal conductivity of the thermal connection member 150 in the extending direction is greater than or equal to 10 W / mK, and the thickness of the thermal connection member 150 is 0.05 mm to 0.5 mm.

[0066] When the extending direction of the heat conducting member is the horizontal direction, it can also be said that the thermal conductivity of the thermal connection member 150 in the horizontal direction is greater than or equal to 10 W / mK. The embodiment of the present application does not require the thermal conductivity of the thermal connection member 150 in the horizontal direction.

[0067] The thickness of the thermal connection member 150 can be, but is not limited to, 0.05 mm, or 0.06 mm, or 0.07 mm, or 0.08 mm, or 0.09 mm, or 0.1 mm, or 0.15 mm, or 0.2 mm, or 0.25 mm, or 0.3 mm, or 0.35 mm, or 0.4 mm, or 0.45 mm, or 0.5 mm.

[0068] When the thermal conductivity of the heat-conducting connecting member 150 in the extending direction is greater than or equal to 10 W / mK and the thickness of the heat-conducting connecting member 150 is 0.05 mm to 0.5 mm, the heat transfer effect is better when the heat-conducting connecting member 150 connects the first shielding cover 120 and the second shielding cover 140. The heat-conducting connecting member 150 can quickly transfer heat from the one with a higher temperature among the first shielding cover 120 and the second shielding cover 140 to the one with a lower temperature among the first shielding cover 120 and the second shielding cover 140. Thereby, the temperature on the side of the circuit board assembly 10 where the first circuit board 110 is located is the same as or approximately the same as the temperature on the side of the circuit board assembly 10 where the second circuit board 130 is located. When the circuit board assembly 10 is applied to the electronic device 1, the temperature of the components in the electronic device 1 adjacent to the first circuit board 110 is the same as or approximately the same as the temperature of the components in the electronic device 1 adjacent to the second circuit board 130. Thereby, the experience of the user holding the electronic device 1 is improved.

[0069] In another embodiment, the thermal conductivity of the heat-conducting connecting member 150 in the extending direction is greater than or equal to 10 W / mK, the thickness of the heat-conducting connecting member 150 is not limited, and the area of the heat-conducting connecting member 150 is not limited.

[0070] In one embodiment, the thickness of the heat-conducting connecting member 150 is 0.05 mm to 0.1 mm, the heat-conducting connecting member 150 is a graphite sheet, and the thermal conductivity (also known as the heat conductivity) of the heat-conducting connecting member 150 is or is about 500 W / mK to 2000 W / mK.

[0071] In another embodiment, the thickness of the heat-conducting connecting member 150 is 0.05 mm to 0.1 mm, the material of the heat-conducting connecting member 150 includes one or both of copper foil and aluminum foil, and the thermal conductivity of the heat-conducting connecting member 150 is or is about 200 W / mK to 400 W / mK.

[0072] In still another embodiment, the thickness of the heat-conducting connecting member 150 is 0.05 mm to 0.1 mm, the material of the heat-conducting connecting member 150 includes one or both of ultra-high molecular weight polyethylene heat-conducting film and boron carbide heat-conducting film, and the thermal conductivity of the heat-conducting connecting member 150 is or is about 50 W / mK.

[0073] In yet another embodiment, the thickness of the heat-conducting connecting member 150 is 0.15 mm to 0.3 mm, the heat-conducting connecting member 150 is a liquid-cooling film, and the thermal conductivity of the heat-conducting connecting member 150 is greater than or equal to 2000 W / mK.

[0074] In yet another embodiment, the thickness of the heat conducting connector 150 is 0.2 mm to 0.5 mm. The heat conducting connector 150 is a vapor chamber (VC), and the heat conductivity coefficient of the heat conducting connector 150 is greater than or equal to 2000 W / mK.

[0075] Please refer to Figure 6 , Figure 6 which is a schematic cross-sectional view of a circuit board assembly provided by yet another embodiment of the present application. In this embodiment, the circuit board assembly 10 includes a first circuit board 110, a first shielding cover 120, a second circuit board 130, a second shielding cover 140, and a heat conducting connector 150. The first circuit board 110 includes a first board body 111 and a first heat generating device 112 carried on the first board body 111. The first shielding cover 120 and the first board body 111 form a first receiving cavity 120a to receive the first heat generating device 112, and the first shielding cover 120 is thermally connected to the first heat generating device 112. The second circuit board 130 includes a second board body 131 and a second heat generating device 132 carried on the second board body 131. The second shielding cover 140 and the second board body 131 form a second receiving cavity 140a to receive the second heat generating device 132, and the second shielding cover 140 is thermally connected to the second heat generating device 132. The second shielding cover 140 is disposed opposite to the first shielding cover 120. The heat conducting connector 150 is connected to the first shielding cover 120 and the second shielding cover 140.

[0076] Specifically, the heat conducting connector 150 includes a first sub-heat conducting connector 150a and a second sub-heat conducting connector 150b. The first sub-heat conducting connector 150a is connected to the first shielding cover 120. The second sub-heat conducting connector 150b is connected to the second shielding cover 140 and is connected to the first sub-heat conducting connector 150a.

[0077] In one embodiment, the materials of the first sub-heat conducting connector 150a and the second sub-heat conducting connector 150b are different. For example, in one embodiment, the first sub-heat conducting connector 150a is a vapor chamber (VC), and the second sub-heat conducting connector 150b is graphite. Alternatively, in another embodiment, the first sub-heat conducting member is graphite, and the second sub-heat conducting member is a vapor chamber (VC).

[0078] The circuit board assembly 10 provided by the embodiment of the present application, the heat conduction connection member 150 includes a first sub-heat conduction connection member 150a and a second sub-heat conduction connection member 150b. The first sub-heat conduction connection member 150a is connected to the first shielding cover 120. The second sub-heat conduction connection member 150b is connected to the second shielding cover 140 and is connected to the first sub-heat conduction connection member 150a. Therefore, the heat of the first shielding cover 120 and the heat of the second shielding cover 140 can be transferred through the first sub-heat conduction connection member 150a and the second sub-heat conduction connection member 150b of the heat conduction connection member 150, so that the temperature of the circuit board assembly 10 on the side where the first circuit board 110 is located is the same as or approximately the same as the temperature of the circuit board assembly 10 on the side where the second circuit board 130 is located. When the circuit board assembly 10 is applied to the electronic device 1, the temperature of the components in the electronic device 1 adjacent to the first circuit board 110 is the same as or approximately the same as the temperature of the components in the electronic device 1 adjacent to the second circuit board 130. Thus, the experience of the user holding the electronic device 1 is improved. In addition, the heat conduction connection member 150 is connected to the first shielding cover 120 and the second shielding cover 140, which can also prevent the temperature of the first heating device 112 from being too high and causing the performance of the first heating device 112 to decline.

[0079] Please further refer to Figure 6 , the second sub-heat conduction connection member 150b and the first sub-heat conduction connection member 150a are partially stacked and connected.

[0080] In this embodiment, one end of the second sub-heat conduction connection member 150b is stacked and connected to one end of the first sub-heat conduction connection member 150a, so that the connection performance between the first sub-heat conduction connection member 150a and the second sub-heat conduction connection member 150b is better. Therefore, the heat of the first shielding cover 120 and the heat of the second shielding cover 140 can be transferred through the first sub-heat conduction member and the second sub-heat conduction member, so that the temperature of the circuit board assembly 10 on the side where the first circuit board 110 is located is the same as or approximately the same as the temperature of the circuit board assembly 10 on the side where the second circuit board 130 is located. When the circuit board assembly 10 is applied to the electronic device 1, the temperature of the components in the electronic device 1 adjacent to the first circuit board 110 is the same as or approximately the same as the temperature of the components in the electronic device 1 adjacent to the second circuit board 130. Thus, the experience of the user holding the electronic device 1 is improved.

[0081] Embodiments of the present application provide an electronic device 1, which may be, but is not limited to, devices such as mobile phones, watches, tablet computers, laptop computers, etc. In the embodiments of the present application, the electronic device 1 is taken as an example of a mobile phone for illustration and description. It can be understood that this should not be construed as a limitation on the embodiments of the present application.

[0082] Please refer to Figures 1 to 6 the circuit board assembly 10 provided in any of the embodiments, and also refer to Figure 7 and Figure 8 , Figure 7 which is a schematic diagram of an electronic device provided in an embodiment of the present application; Figure 8 is a cross-sectional view of the electronic device shown in an embodiment Figure 7 along line I-I. The electronic device 1 includes a circuit board assembly 10. The circuit board assembly 10 may be the circuit board assembly 10 provided in any of the previous embodiments. In the schematic diagram of this embodiment, the circuit board assembly 10 is taken as an example of the circuit board assembly 10 provided in the previous embodiment for illustration. It can be understood that this should not be construed as a limitation on the circuit board assembly 10 provided in the embodiments of the present application. The circuit board assembly 10 is referred to the previous description and will not be elaborated here.

[0083] In summary, the electronic device 1 provided in the embodiments of the present application includes a circuit board assembly 10. The first shielding cover 120 in the circuit board assembly 10 is thermally connected to the first heating device 112. Therefore, the heat dissipated by the first heating device 112 can be transferred to the first shielding cover 120. The second shielding cover 140 is thermally connected to the second heating device 132. Therefore, the heat dissipated by the second heating device 132 can be transferred to the second shielding cover 140. Further, the circuit board assembly 10 provided in the embodiments of the present application further includes a heat conducting connector 150, and the heat conducting connector 150 is connected to the first shielding cover 120 and the second shielding cover 140. Therefore, the heat of the first shielding cover 120 and the heat of the second shielding cover 140 can be transferred via the heat conducting connector 150, so that the temperature on the side of the circuit board assembly 10 where the first circuit board 110 is located is the same as or approximately the same as the temperature on the side of the circuit board assembly 10 where the second circuit board 130 is located. When the circuit board assembly 10 is applied to the electronic device 1, the temperature of the components in the electronic device 1 adjacent to the first circuit board 110 is the same as or approximately the same as the temperature of the components in the electronic device 1 adjacent to the second circuit board 130. Thus, the experience of the user holding the electronic device 1 is improved. In addition, since the heat conducting connector 150 is connected to the first shielding cover 120 and the second shielding cover 140, it can also prevent the temperature of the first heating device 112 from being too high and causing the performance of the first heating device 112 to decline.

[0084] In addition, in one embodiment, the stacking direction of the first circuit board 110 and the second circuit board 130 is the thickness direction of the electronic device 1. In other words, the first circuit board 110 and the second circuit board 130 are stacked along the thickness direction of the electronic device 1. The first circuit board 110 and the second circuit board 130 in the circuit board assembly 10 are stacked, and the stacking direction of the first circuit board 110 and the second circuit board 130 is the thickness direction of the electronic device 1, which can effectively utilize the space in the thickness direction of the electronic device 1. When the number of devices in the circuit board assembly 10 is certain, the area of the plane of the electronic device 1 perpendicular to the thickness can be effectively saved.

[0085] Furthermore, the first circuit board 110 and the second circuit board 130 of the circuit board assembly 10 provided in the embodiment of the present application are stacked along the thickness direction of the electronic device 1, which can enable the electronic device 1 to have more space to set a battery with a larger capacity, meeting the user's demand for high battery endurance. In addition, the first circuit board 110 and the second circuit board 130 of the circuit board assembly 10 are stacked along the thickness direction of the electronic device 1, which can also better layout the power management chip and other circuits related to the power management chip. In this way, higher battery endurance can be achieved. In one embodiment, the power management chip and other circuits related to the power management chip are arranged on the second board body 131.

[0086] Furthermore, compared with the circuit board assembly 10 including only one circuit board, the circuit board assembly 10 includes the first circuit board 110 and the second circuit board 130 stacked, which can integrate more functional devices to achieve more functions. For example, the circuit board assembly 10 can integrate multiple functional devices such as a camera, a communication module, and a sensor. It can be seen that the circuit board assembly 10 provided in the embodiment of the present application and the electronic device 1 including the circuit board assembly 10 can efficiently integrate multiple functional devices in a limited space, enhancing the functionality of the electronic device 1.

[0087] Please refer to Figures 1 to 6 the circuit board assembly 10 provided in any of the embodiments in Figure 7 and Figure 8 , the electronic device 1 further includes a display screen 20 and a rear cover 30. The display screen 20 is arranged on one side of the circuit board assembly 10, and the first circuit board 110 of the circuit board assembly 10 is closer to the display screen 20 than the second circuit board 130. The rear cover 30 is arranged on the other side of the circuit board assembly 10, and the second circuit board 130 of the circuit board assembly 10 is closer to the rear cover 30 than the first circuit board 110.

[0088] For the electronic device 1 provided by the embodiment of the present application, the first shielding cover 120 is thermally connected to the first heat generating component 112. Therefore, the heat dissipated by the first heat generating component 112 can be transferred to the first shielding cover 120. The second shielding cover 140 is thermally connected to the second heat generating component 132. Therefore, the heat dissipated by the second heat generating component 132 can be transferred to the second shielding cover 140. Further, the circuit board assembly 10 of the electronic device 1 provided by the embodiment of the present application further includes a heat conducting connecting member 150, and the heat conducting connecting member 150 is connected to the first shielding cover 120 and the second shielding cover 140. Therefore, the heat of the first shielding cover 120 and the heat of the second shielding cover 140 can be transferred through the heat conducting connecting member 150, so that the temperature of the circuit board assembly 10 on the side where the first circuit board 110 is located is the same as or approximately the same as the temperature of the circuit board assembly 10 on the side where the second circuit board 130 is located. When the circuit board assembly 10 is applied to the electronic device 1, the temperature of the display screen 20 adjacent to the first circuit board 110 in the electronic device 1 is the same as or approximately the same as the temperature of the rear cover 30 adjacent to the second circuit board 130 in the electronic device 1. Thus, when the user holds the electronic device 1, the temperature difference between the side where the display screen 20 of the electronic device 1 is located (also referred to as the front of the electronic device 1) and the side where the rear cover 30 of the electronic device 1 is located (also referred to as the back of the electronic device 1) is small. Thereby, the comfort experience when the user holds the electronic device 1 is improved.

[0089] Further, the electronic device 1 further includes a middle frame 50 and a heat conducting filling member. The middle frame 50 is used to carry the display screen 20. The middle frame 50 is closer to the first circuit board 110 than the display screen 20, and there is a gap between the middle frame 50 and the circuit board assembly 10. The heat conducting filling member is disposed in the gap to thermally connect the middle frame 50 and the circuit board assembly 10.

[0090] In one embodiment, for the convenience of naming, the gap between the middle frame 50 and the circuit board assembly 10 is also referred to as the first gap 60a. Correspondingly, the heat conducting filling member disposed in the first gap 60a is also referred to as the first heat conducting filling member 60. The first heat conducting filling member 60 is also referred to as a thermal interface material (TIM). The heat conducting filling member can be, but is not limited to, heat conducting silicone grease, or heat conducting silica gel, or heat conducting glue (also referred to as heat conducting gel), etc.

[0091] In one embodiment, the thickness of the first heat-conducting filler 60 may be, but is not limited to, 0.05 mm to 0.2 mm. For example, the thickness of the first heat-conducting filler 60 may be, but is not limited to, 0.05 mm, or 0.06 mm, or 0.07 mm, or 0.08 mm, or 0.09 mm, or 0.1 mm, or 0.11 mm, or 0.12 mm, or 0.13 mm, or 0.14 mm, or 0.15 mm, or 0.16 mm, or 0.17 mm, or 0.18 mm, or 0.19 mm, or 0.2 mm.

[0092] In one embodiment, the thermal conductivity of the first heat-conducting filler 60 is 3.5 W / mK to 6.5 W / mK, and the thickness of the first heat-conducting filler 60 is at least 0.05 mm. In another embodiment, the thermal conductivity of the first heat-conducting filler 60 is greater than 10 W / mK, and the thickness of the first heat-conducting filler 60 is at least 0.1 mm. The thermal conductivity and thickness of the first heat-conducting filler 60 can be selected as needed, not limited only to the examples here. The above selection of the thermal conductivity and the above range of the thickness of the first heat-conducting filler 60 can enable the first heat-conducting filler 60 to have a good heat conduction effect and make the thickness of the electronic device 1 thinner.

[0093] In the present embodiment, the first heat-conducting filler 60 is thermally connected to the circuit board assembly 10 and the middle frame 50. Specifically, the first heat-conducting filler 60 is thermally connected to the heat-conducting connector 150 and the middle frame 50.

[0094] The first heat-conducting filler 60 fills the first gap 60a between the heat-conducting connector 150 and the middle frame 50, so that the heat of the circuit board assembly 10 can be transmitted to the middle frame 50 through the first heat-conducting filler 60 and dissipated through the middle frame 50, thereby improving the heat dissipation effect of the electronic device 1, and further improving the functional stability of the first heat-generating device 112 and the second heat-generating device 132 in the circuit board assembly 10 of the electronic device 1.

[0095] Please refer to Figures 1 to 6 the circuit board assembly 10 provided in any embodiment, and also refer to Figure 7 and Figure 9 , Figure 9 For another embodiment Figure 7A cross-sectional view of the electronic device shown along line I-I. In the present embodiment, the electronic device 1 further includes a middle frame 50, a first thermal conductive filling member 60, and a second thermal conductive filling member 70. The middle frame 50 is used to carry the display screen 20. The middle frame 50 is closer to the first circuit board 110 than the display screen 20. There is a first gap 60a between the middle frame 50 and the circuit board assembly 10. The first thermal conductive filling member 60 is disposed in the first gap 60a to thermally connect the middle frame 50 and the circuit board assembly 10.

[0096] In one embodiment, for the convenience of naming, the gap between the middle frame 50 and the circuit board assembly 10 is also called the first gap 60a. Correspondingly, the thermal conductive filling member disposed in the first gap 60a is also called the first thermal conductive filling member 60.

[0097] There is a second gap 70a between the rear cover 30 and the circuit board assembly 10. The second thermal conductive filling member 70 fills the second gap 70a. Specifically, there is a second gap 70a between the rear cover 30 and the thermal conductive connecting member 150 of the circuit board assembly 10. The second thermal conductive filling member 70 fills the second gap 70a.

[0098] The first thermal conductive filling member 60 is also called a thermal interface material (Thermal Interface Material, TIM). The first thermal conductive filling member 60 can be, but is not limited to, thermal grease, or thermal silica gel, or thermal glue, etc. The second thermal conductive filling member 70 is also called a thermal interface material (Thermal Interface Material, TIM). The second thermal conductive filling member 70 can be, but is not limited to, thermal grease, or thermal silica gel, or thermal glue, etc. The first thermal conductive filling member 60 can be the same as or different from the second thermal conductive filling member 70, which is not limited herein.

[0099] The first thermal conductive filling member 60 fills the first gap 60a between the thermal conductive connecting member 150 and the middle frame 50, so that the heat of the circuit board assembly 10 can be transmitted to the middle frame 50 via the first thermal conductive filling member 60 and dissipated through the middle frame 50, thereby improving the heat dissipation effect of the electronic device 1, and further improving the functional stability of the first heating device 112 and the second heating device 132 in the circuit board assembly 10 of the electronic device 1.

[0100] In one embodiment, the thickness of the first heat-conducting filler 60 can be, but is not limited to, 0.05 mm to 0.2 mm. For example, the thickness of the first heat-conducting filler 60 can be, but is not limited to, 0.05 mm, or 0.06 mm, or 0.07 mm, or 0.08 mm, or 0.09 mm, or 0.1 mm, or 0.11 mm, or 0.12 mm, or 0.13 mm, or 0.14 mm, or 0.15 mm, or 0.16 mm, or 0.17 mm, or 0.18 mm, or 0.19 mm, or 0.2 mm.

[0101] In one embodiment, the thermal conductivity of the first heat-conducting filler 60 is 3.5 W / mK to 6.5 W / mK, and the thickness of the first heat-conducting filler 60 is at least 0.05 mm. In another embodiment, the thermal conductivity of the first heat-conducting filler 60 is greater than 10 W / mK, and the thickness of the first heat-conducting filler 60 is at least 0.1 mm. The thermal conductivity and thickness of the first heat-conducting filler 60 can be selected as needed, not limited only to the examples here. The above selection of the thermal conductivity and the above range of the thickness of the first heat-conducting filler 60 can enable the first heat-conducting filler 60 to have a good heat conduction effect and make the thickness of the electronic device 1 thinner.

[0102] Furthermore, the second heat-conducting filler 70 fills the second gap 70a, so that the heat of the circuit board assembly 10 can be transmitted to the rear cover 30 via the second heat-conducting filler 70 and dissipated through the rear cover 30, thereby improving the heat dissipation effect of the electronic device 1, and further improving the functional stability of the first heat-generating device 112 and the second heat-generating device 132 in the circuit board assembly 10 of the electronic device 1.

[0103] In one embodiment, the thickness of the first heat-conducting filler 60 can be, but is not limited to, 0.05 mm to 0.2 mm. For example, the thickness of the first heat-conducting filler 60 can be, but is not limited to, 0.05 mm, or 0.06 mm, or 0.07 mm, or 0.08 mm, or 0.09 mm, or 0.1 mm, or 0.11 mm, or 0.12 mm, or 0.13 mm, or 0.14 mm, or 0.15 mm, or 0.16 mm, or 0.17 mm, or 0.18 mm, or 0.19 mm, or 0.2 mm.

[0104] In one embodiment, the thermal conductivity of the second thermal filling member 70 is 3.5 W / mK to 6.5 W / mK, and the thickness of the second thermal filling member 70 is at least 0.05 mm. In another embodiment, the thermal conductivity of the second thermal filling member 70 is greater than 10 W / mK, and the thickness of the second thermal filling member 70 is at least 0.1 mm. The thermal conductivity and thickness of the second thermal filling member 70 can be selected as needed, not limited only to the examples here. The above selection of the thermal conductivity and the above range of the thickness of the second thermal filling member 70 can enable the second thermal filling member 70 to have a good heat conduction effect and make the thickness of the electronic device 1 thinner.

[0105] The thermal conductivity of the second thermal filling member 70 described above can be the same as or different from the thermal conductivity of the first thermal filling member 60, which is not limited here. Correspondingly, the thickness of the second thermal filling member 70 described above can be the same as or different from the thickness of the first thermal filling member 60, which is not limited here.

[0106] The above are some embodiments of the present application. It should be noted that for those of ordinary skill in the art, without departing from the principle of the present application, several improvements and refinements can be made, and these improvements and refinements are also regarded as the protection scope of the present application.

Claims

1. A circuit board assembly, characterized in that: The circuit board assembly comprises: A first circuit board, the first circuit board comprising a first board body and a first heating device carried by the first board body; A first shielding cover, wherein the first shielding cover and the first plate body form a first receiving cavity for receiving the first heating element, and the first shielding cover is thermally connected to the first heating element; A second circuit board, the second circuit board comprising a second board body and a second heating device carried by the second board body; A second shielding cover, wherein the second shielding cover and the second plate body form a second receiving cavity for receiving the second heating device, and the second shielding cover is thermally connected to the second heating device, and the second shielding cover is disposed opposite to the first shielding cover; and A heat-conducting connector is heat-conductingly connected to the first shielding cover and the second shielding cover.

2. The circuit board assembly according to claim 1, wherein: The first shielding cover comprises a first shielding portion and a second shielding portion, the first shielding portion is thermally connected to the first heating element, and the second shielding portion is bent and connected to the periphery of the first shielding portion; The second shielding cover comprises a third shielding portion and a fourth shielding portion, the third shielding portion is thermally connected to the second heating element, and the fourth shielding portion is bent and connected to the periphery of the third shielding portion; The heat-conducting connecting member includes a first heat-conducting connecting portion and a second heat-conducting connecting portion connected to each other, the first heat-conducting connecting portion is connected to the first shielding portion, and the second heat-conducting connecting portion is connected to the third shielding portion.

3. The circuit board assembly according to claim 2, wherein: The first plate body has a first bearing surface and a first side surface, the first bearing surface is used to bear the first heating element, and the first side surface is bent and connected to the first bearing surface; The second plate body has a second bearing surface and a second side surface, the second bearing surface is used to bear the second heating element, and the second side surface is bent and connected to the first bearing surface; The thermally conductive connecting member further includes a third thermally conductive connecting portion, which is connected between the first thermally conductive connecting portion and the second thermally conductive connecting portion, and is disposed on one side of the first side surface and the second side surface.

4. The circuit board assembly according to claim 2, wherein: The circuit board assembly also includes: a first heat-conducting member, the first heat-conducting member being connected to the first heat-generating device and the first shielding portion, an orthographic projection of the first heat-conducting member on the first shielding portion falling within an orthographic projection range of the first heat-conducting connecting portion on the first shielding portion; and A second heat conducting member is connected to the second heat generating device and the third shielding portion, and an orthographic projection of the second heat conducting member on the third shielding portion falls within an orthographic projection range of the second heat conducting connecting portion on the third shielding portion.

5. The circuit board assembly according to claim 1, wherein: The circuit board assembly also includes: A support member, wherein the support member is disposed between the first plate body and the second plate body, and the support member, the first plate body, and the second plate body jointly define an assembly gap; and A third heat conducting member is disposed in the assembly gap and is used for thermally connecting the first plate body and the second plate body.

6. The circuit board assembly according to claim 1, wherein: The thermal conductivity of the thermally conductive connecting member in the extension direction is greater than or equal to 10 W / mK, and the thickness of the thermally conductive connecting member is 0.05 mm to 0.5 mm.

7. The circuit board assembly according to claim 1, wherein: The thermally conductive connecting member comprises: a first sub-heat-conducting connecting member, the first sub-heat-conducting connecting member being connected to the first shielding cover; and A second sub-heat-conducting connecting member, wherein the second sub-heat-conducting connecting member is connected to the second shielding cover and to the first sub-heat-conducting connecting member.

8. The circuit board assembly according to claim 7, wherein: The second sub-heat-conducting connecting member is partially stacked and connected to the first sub-heat-conducting connecting member.

9. An electronic device, characterized in that: The electronic device comprises the circuit board assembly as claimed in any one of claims 1-8.

10. The electronic device according to claim 9, characterized in that: The electronic device further comprises: a display screen, wherein the display screen is disposed on one side of the circuit board assembly, and the first circuit board of the circuit board assembly is disposed closer to the display screen than the second circuit board; and A back cover is disposed on the other side of the circuit board assembly, and the second circuit board of the circuit board assembly is disposed adjacent to the back cover compared to the first circuit board.

11. The electronic device according to claim 10, characterized in that: The electronic device further comprises: A middle frame, the middle frame is used to carry the display screen, the middle frame is closer to the first circuit board than the display screen, and there is a gap between the middle frame and the circuit board assembly; A heat-conducting filling piece is disposed in the gap to connect the middle frame and the circuit board assembly through heat conduction.

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