An LED light emitting diode with a side tangent line of a light string

Abstract

The present invention relates to the technical field of LED light string production, and discloses an LED light-emitting diode with a side tangent of the light string, comprising: an insulating substrate, a light-emitting die die bonding area, a wire bonding area, and a control chip pad being provided on the front side, and a first pad, a second pad, a third pad, and a fourth pad being provided on the back side; the third pad and the fourth pad being located on the same horizontal line, and an isolation area with a spacing of 0.05 mm to 1.5 mm being formed by a hollow structure in the middle; a power supply parallel circuit comprising a positive power supply terminal and a negative power supply terminal, which are respectively connected to the first pad and the second pad; by arranging the first pad, the second pad, the third pad, and the fourth pad on the back side of the insulating substrate, and adopting a power supply parallel circuit and a signal series circuit, a plurality of circuit boards are sequentially connected in series and in parallel; this design reduces the number of welding steps and the complex wiring process, effectively simplifies the wiring packaging process, and improves production efficiency.

Description

Technical Field

[0001] The invention relates to the technical field of LED light string production, in particular to an LED light emitting diode with a side tangent of a light string. Background Art

[0002] The mainstream manufacturing method for LED light strings on the market is to use encapsulation glue to encapsulate light-emitting diodes (LEDs) and driver IC chips within the fixed function of LED PCB boards to form LED lamp beads. Multiple LED lamp beads are then connected in series and parallel via power cables, signal cables, etc. to form LED light strings.

[0003] After searching, the Chinese patent number CN116885083A discloses an LED light-emitting diode, including a shell, a wick assembly and two conductive pins, and also includes a mounting base arranged in the shell, the mounting base includes an upper base body and a lower base body; the upper base body is fixedly connected to the shell, and a pair of first conductive terminals are provided at the bottom of the upper base body, the wick assembly is arranged at the top of the upper base body, and the first conductive terminals are electrically connected to the wick assembly through a first conductive wire arranged in the upper base body; the lower base body is rotatably embedded in the shell and is located below the lower base body, and a pair of second conductive terminals and a pair of third conductive terminals are provided at intervals along the circumferential direction on the top of the lower base body; an accommodating cavity is provided inside the lower base body, and a rectifier module is provided in the accommodating cavity, and the upper ends of the conductive pins are electrically connected to the second conductive terminal and the input end of the rectifier module respectively; the third conductive terminal is electrically connected to the output end of the rectifier module.

[0004] In the manufacturing process of the above-mentioned LED light string, due to the structure of the LED bracket and the pin spacing, the power line and the signal line are directly welded to the pins, and then the part of the signal line between the two pins is cut off to obtain the signal input line and the signal transmission line. However, the power line and the signal line are prone to cold soldering or loose welding during welding. The signal line needs to be cut off in advance, and early cutting is not convenient for welding. At the same time, the wire may not be cut cleanly, resulting in a short circuit, and it is easy to cause the pin to deform, resulting in a high defective rate and poor reliability of the light strip, and a risk of failure during the service life. Based on this, the present invention designs an LED light-emitting diode with a side cut line of the light string to solve the above-mentioned problems. Summary of the Invention

[0005] The object of the present invention is to provide an LED light emitting diode with a side tangent line of a light string, which solves the problems of inconvenient welding and pin deformation in the background art.

[0006] In order to solve the above technical problems, the present invention provides the following technical solutions:

[0007] An LED light emitting diode for a side tangent line of a light string, comprising:

[0008] An insulating substrate, wherein a light-emitting die bonding area, a wire bonding area, and a control chip bonding pad are provided on the front side thereof, and a first bonding pad, a second bonding pad, a third bonding pad, and a fourth bonding pad are provided on the back side thereof;

[0009] The third pad and the fourth pad are located on the same horizontal line, and are separated by a hollow structure to form an isolation area with a spacing of 0.05mm-1.5mm;

[0010] A power parallel circuit, comprising a positive power terminal and a negative power terminal, connected to the first pad and the second pad respectively;

[0011] A signal series circuit, comprising a signal input terminal and a signal output terminal, connected to the third pad and the fourth pad respectively;

[0012] A circuit board is cascaded through the power parallel circuit and the signal series circuit in sequence, and the circuit board is equipped with an RGB three-color light-emitting chip and a control IC;

[0013] The pins of the control IC are defined as follows: the first pin is connected to the positive terminal of the power supply, the second pin is connected to the negative terminal of the power supply, the third pin is connected to the signal input terminal, and the fourth pin is connected to the signal output terminal.

[0014] Preferably, the wire diameter range of the first pad, the second pad, the third pad and the fourth pad is 0.4mm-1.5mm, and the distance between adjacent pads satisfies: the distance between the first pad and the second pad is 0.5mm-1mm, the distance between the second pad and the third pad is 0.05mm-0.9mm, and the third pad and the fourth pad are isolated by the hollow structure, with a spacing of 0.05mm-1.5mm.

[0015] Preferably, the ratio of the area of ​​the light-emitting wafer bonding area to the area of ​​the wire bonding area is in the range of (1:0.5)-(1:2), which is used to ensure stable bonding of the light-emitting wafer and reliability of the wire bonding and meet the electrical connection requirements inside the device.

[0016] Preferably, the connection line between the control IC 10 and the RGB three-color light-emitting chip adopts an impedance matching design, and its characteristic impedance Z satisfies the formula:

[0017] , where L is the line inductance and C is the line capacitance. When the signal transmission frequency is f, the integrity of the signal transmission is ensured. The range of f is 1MHz-100MHz, which is used to ensure the signal control accuracy and stability of the light string.

[0018] Preferably, the thickness of the insulating substrate is in the range of 0.2 mm to 0.8 mm, and the material thereof is ceramic or composite insulating material, and the thermal conductivity of the insulating substrate is λ≥1.0 W / (m K), used to meet the heat dissipation requirements of the device during operation and ensure the performance of the LED light-emitting diode. The top of the insulating substrate is also equipped with a light-emitting die bonding area and a control chip pad.

[0019] Preferably, the wiring width of the power parallel circuit and the signal series circuit ranges from 0.3 mm to 1.2 mm. At the connection between adjacent circuit boards, the wiring line spacing gradually expands, and the expansion angle α is 30° to 60°, which is used to improve the anti-interference ability and connection reliability of the circuit; the signal transmission rate of the power parallel circuit meets:

[0020] Tprop≤(1 / 10) Tclock, where Tprop is the signal transmission delay time and Tclock is the clock period of the control IC.

[0021] Preferably, the signal series circuit includes a control signal line, a positive power line and a negative power line, the control signal line is connected to the signal input end of the corresponding circuit board, the positive power line is connected to the positive power end of the corresponding circuit board, and the negative power line is connected to the negative power end of the corresponding circuit board.

[0022] Preferably, the luminous efficiency η of the RGB three-color light-emitting chip is ≥80lm / W, and the wavelength ranges of the light-emitting chips of each color are: the wavelength of the red chip is 620nm-630nm, the wavelength of the green chip is 520nm-530nm, and the wavelength of the blue chip is 460nm-470nm, so as to achieve good color performance and brightness output.

[0023] Multiple circuit boards are cascaded using parallel power supply circuits and series signal circuits. The positive power supply terminal is connected to the first pad, and the negative power supply terminal is connected to the second pad, providing a stable 12V or 5V power supply to the circuit. The signal input and output terminals are connected to the third and fourth pads, respectively, ensuring sequential signal transmission between the various circuit boards. The light-emitting die bonding area and wire bonding area on the front of the insulating substrate provide a stable bonding foundation for the light-emitting die. Internal electrical connections are achieved through wire bonding, ensuring the proper functioning of the RGB light-emitting chips and achieving different color luminescence effects.

[0024] Preferably, the data shaping processing circuit built into the control IC adopts adaptive equalization technology, and its equalization coefficient K can be automatically adjusted according to the amplitude and frequency of the input signal to meet the formula:

[0025] , where A_in and A_out are the amplitudes of the input and output signals, respectively, and f_in and f_out are the frequencies of the input and output signals, respectively, which are used to ensure the stability of the signal during transmission and achieve precise flicker control of the light string.

[0026] The control IC is mounted on the control chip pads on the front of the insulating substrate. Its pins connect to the positive and negative power terminals, as well as the signal input and output terminals, thereby controlling signal transmission and processing. When the control IC is operating, it receives signals from the signal input terminal, processes them, and transmits them from the signal output terminal to the next circuit board, achieving sequential control and a flashing effect for the light string. The hollow structure between the third and fourth pads creates a spacing of 0.05mm to 1.5mm, helping to prevent signal interference and ensure stable signal transmission.

[0027] Preferably, the shape of the circuit board is rectangular, circular or polygonal, and the connection angle between adjacent circuit boards can be adjusted in the range of 0°-180°, so as to adapt to the design of light strings with different shapes and layout requirements.

[0028] Compared with the prior art, the present invention has the following beneficial effects:

[0029] 1. The present invention arranges first, second, third, and fourth solder pads on the back of an insulating substrate and employs a parallel power supply circuit and a series signal circuit to sequentially connect multiple circuit boards in series and parallel. This design reduces soldering steps and the complex wiring process, effectively simplifying the wiring and packaging process and improving production efficiency.

[0030] 2. The present invention significantly improves the robustness and reliability of welding, and reduces the problems of cold joints and weak welding by optimizing the layout and spacing of pads and using appropriate wire diameters. Traditional welding methods are prone to problems such as cold joints or weak welding. The present invention also avoids the risk of short circuits and pin deformation caused by premature cutting by using a hollow structure to isolate the third and fourth pads and performing wire cutting after the circuit board is manufactured.

[0031] 3. This invention reduces unnecessary material usage and improves production efficiency through optimized circuit design and wiring, effectively reducing production and maintenance costs. Impedance matching and adaptive equalization ensure signal integrity and stability during transmission. The data shaping circuitry built into the control IC repairs the signal, ensuring accurate transmission to each LED, thereby achieving precise flicker control. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention;

[0033] Figure 2 For the present invention Figure 1 A sectional view of the part;

[0034] Figure 3 It is a structural schematic diagram of the working process of the present invention;

[0035] Figure 4 This is a connection diagram of the working circuit of the present invention.

[0036] Among them: 1. Positive power terminal; 2. Negative power terminal; 3. Signal input terminal; 4. Signal output terminal; 5. RGB three-color light-emitting chip; 6. Insulating substrate; 7. Light-emitting crystal die bonding area; 8. Control chip pad; 9. Circuit board; 10. Control IC; 13. Positive power line; 14. Negative power line; 15. Control signal line. DETAILED DESCRIPTION

[0037] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0038] Example 1; please refer to Figure 1-Figure 4 In an embodiment of the present invention, a light string side tangent line LED light emitting diode includes:

[0039] An insulating substrate 6, on the front of which a light-emitting die bonding area, a wire bonding area, and a control chip pad are provided, and on the back of which a first pad, a second pad, a third pad, and a fourth pad are provided;

[0040] The third pad and the fourth pad are located on the same horizontal line, and are separated by a hollow structure to form an isolation area with a spacing of 0.05mm-1.5mm;

[0041] A power parallel circuit includes a power positive terminal 1 and a power negative terminal 2, which are connected to a first soldering pad and a second soldering pad respectively;

[0042] A signal series circuit includes a signal input terminal 3 and a signal output terminal 4, which are connected to a third pad and a fourth pad respectively;

[0043] The circuit board 9 is cascaded through the power parallel circuit and the signal series circuit in sequence, and the RGB three-color light-emitting chip 5 and the control IC 10 are installed on the circuit board 9;

[0044] The pins of the control IC10 are defined as follows: the first pin is connected to the positive terminal 1 of the power supply, the second pin is connected to the negative terminal 2 of the power supply, the third pin is connected to the signal input terminal 3, and the fourth pin is connected to the signal output terminal 4.

[0045] The wire diameter range of the first pad, the second pad, the third pad and the fourth pad is 0.4mm-1.5mm, and the spacing between adjacent pads meets the following requirements: the spacing between the first pad and the second pad is 0.5mm-1mm, the spacing between the second pad and the third pad is 0.05mm-0.9mm, and the third pad and the fourth pad are isolated by a hollow structure with a spacing of 0.05mm-1.5mm.

[0046] The ratio of the area of ​​the light-emitting wafer bonding area to the area of ​​the wire bonding area is in the range of 1:0.5-1:2, which is used to ensure the stable bonding of the light-emitting wafer and the reliability of the wire bonding and meet the electrical connection requirements inside the device.

[0047] The connection line between the control IC10 and the RGB three-color light-emitting chip 5 adopts an impedance matching design, and its characteristic impedance Z satisfies the formula:

[0048] , where L is the line inductance and C is the line capacitance. When the signal transmission frequency is f, the integrity of the signal transmission is ensured. The range of f is 1MHz-100MHz, which is used to ensure the signal control accuracy and stability of the light string.

[0049] The working principle of the embodiment of the present invention is: an LED light-emitting diode on the side of the light string realizes the cascade of multiple circuit boards 9 through a power parallel circuit and a signal series circuit. The positive terminal 1 of the power supply is connected to the first pad, and the negative terminal 2 of the power supply is connected to the second pad, providing a stable 12V or 5V power supply for the entire circuit. The signal input terminal 3 and the signal output terminal 4 are respectively connected to the third pad and the fourth pad to ensure that the signal is transmitted in sequence between each circuit board 9. The light-emitting crystal solidification area and the welding wire area on the front of the insulating substrate 6 provide a stable solidification foundation for the light-emitting crystal, and realize internal electrical connection through welding wires to ensure that the RGB three-color light-emitting chip 5 can work normally and achieve light-emitting effects of different colors.

[0050] The control IC 10 is mounted on the control chip pad on the front of the insulating substrate 6. Its first pin is connected to the positive power supply terminal 1, the second pin is connected to the negative power supply terminal 2, the third pin is connected to the signal input terminal 3, and the fourth pin is connected to the signal output terminal 4, thereby controlling the transmission and processing of signals. When the control IC 10 is in operation, it receives a signal from the signal input terminal 3, processes it, and transmits it from the signal output terminal 4 to the next circuit board 9, achieving sequential control and a flashing effect for the light string.

[0051] The hollow structure between the third pad and the fourth pad forms an isolation spacing of 0.05mm-1.5mm, which helps to avoid signal interference and ensure the stability of signal transmission; at the same time, the wire diameter range of the first pad, the second pad, the third pad and the fourth pad is 0.4mm-1.5mm, and the spacing between adjacent pads meets the following requirements: the spacing between the first pad and the second pad is 0.5mm-1mm, and the spacing between the second pad and the third pad is 0.05mm-0.9mm. These designs ensure the stable solidification of the light-emitting wafer and the reliability of the bonding wire, and meet the electrical connection requirements inside the device.

[0052] The connection line between the control IC10 and the RGB three-color light-emitting chip 5 adopts an impedance matching design. Its characteristic impedance Z satisfies the formula Z=\sqrt{\frac{L}{C}}, where L is the line inductance and C is the line capacitance. When the signal transmission frequency is f (range 1MHz-100MHz), the integrity of the signal transmission is ensured, thereby ensuring the signal control accuracy and stability of the light string.

[0053] Example 2: Please refer to Figure 1-Figure 4 In the embodiment of the present invention, the thickness of the insulating substrate 6 is in the range of 0.2 mm to 0.8 mm, and the material thereof is ceramic or composite insulating material, and the thermal conductivity λ of the insulating substrate 6 is ≥ 1.0 W / (m K), used to meet the heat dissipation requirements of the device during operation and ensure the performance of the LED light emitting diode. The top of the insulating substrate 6 is also equipped with a light emitting die bonding area 7 and a control chip pad 8.

[0054] The wiring width of the power parallel circuit and the signal series circuit ranges from 0.3mm to 1.2mm. At the connection between adjacent circuit boards 9, the wiring line spacing gradually expands, and the expansion angle α is 30°-60°, which is used to improve the circuit's anti-interference ability and connection reliability; the signal transmission rate of the power parallel circuit meets:

[0055] Tprop≤(1 / 10) Tclock, where Tprop is the signal transmission delay time, and Tclock is the clock period of the control IC10.

[0056] The signal series circuit includes a control signal line 15, a positive power line 13 and a negative power line 14. The control signal line 15 is connected to the signal input terminal 3 of the corresponding circuit board 9, the positive power line 13 is connected to the positive power terminal 1 of the corresponding circuit board 9, and the negative power line 14 is connected to the negative power terminal 2 of the corresponding circuit board 9.

[0057] The working principle of the embodiment of the present invention is: the thickness of the insulating substrate 6 is in the range of 0.2mm-0.8mm, the material is ceramic or composite insulating material, and the thermal conductivity λ is ≥1.0W / (m K), which can meet the heat dissipation requirements of the device during operation and ensure the stable performance of the LED light-emitting diode; the top of the insulating substrate 6 is equipped with a light-emitting wafer solidifying area 7 and a control chip pad 8, which provide a basis for installation and fixation of the light-emitting wafer and the control IC.

[0058] The wiring width range of the power parallel circuit and the signal series circuit is 0.3mm-1.2mm. At the connection between adjacent circuit boards 9, the wiring line spacing gradually expands, and its expansion angle α is 30°-60°. This design helps to improve the circuit's anti-interference ability and connection reliability, and ensure the stability and accuracy of signals and power during transmission.

[0059] The signal transmission rate of the power parallel circuit satisfies Tprop≤(1 / 10) Tclock, where Tprop is the signal transmission delay time and Tclock is the clock cycle of the control IC 10. This ensures that signals are transmitted promptly and accurately to each circuit board 9, avoiding abnormal light string control caused by signal delay. The signal series circuit includes a control signal line 15, a positive power line 13, and a negative power line 14. The control signal line 15 is connected to the signal input terminal 3 of the corresponding circuit board 9, the positive power line 13 is connected to the positive power terminal 1 of the corresponding circuit board 9, and the negative power line 14 is connected to the negative power terminal 2 of the corresponding circuit board 9. This connection method achieves orderly transmission and distribution of signals and power throughout the light string.

[0060] When the control IC 10 is working, it receives and processes signals through the control signal line 15 and controls the positive power line 13 and the negative power line 14 to supply power to the RGB three-color light-emitting chip 5, thereby realizing the flashing and lighting control of the light string.

[0061] Example 3; please refer to Figure 1-Figure 4 In the embodiment of the present invention, the luminous efficiency η of the RGB three-color light-emitting chip 5 is ≥80lm / W, and the wavelength ranges of the light-emitting chips of each color are: the wavelength of the red chip is 620nm-630nm, the wavelength of the green chip is 520nm-530nm, and the wavelength of the blue chip is 460nm-470nm, which is used to achieve good color performance and brightness output.

[0062] The data shaping processing circuit built into the control IC10 adopts adaptive equalization technology. Its equalization coefficient K can be automatically adjusted according to the amplitude and frequency of the input signal to meet the formula:

[0063] , where A_in and A_out are the amplitudes of the input and output signals, respectively, and f_in and f_out are the frequencies of the input and output signals, respectively, which are used to ensure the stability of the signal during transmission and achieve precise flicker control of the light string.

[0064] The shape of the circuit board 9 is rectangular, circular or polygonal, and the connection angle between adjacent circuit boards 9 can be adjusted in the range of 0°-180°, so as to adapt to the design of light strings with different shapes and layout requirements.

[0065] The working principle of the embodiment of the present invention is: the luminous efficiency η of the RGB three-color light-emitting chip 5 is ≥ 80lm / W, and the wavelength ranges of the light-emitting chips of each color are: the wavelength of the red chip is 620nm-630nm, the wavelength of the green chip is 520nm-530nm, and the wavelength of the blue chip is 460nm-470nm. This parameter setting ensures that the light-emitting chip can achieve good color performance and brightness output, meeting the color and brightness requirements of the light string in different application scenarios.

[0066] The data shaping processing circuit built into the control IC10 adopts adaptive equalization technology. Its equalization coefficient K can be automatically adjusted according to the amplitude and frequency of the input signal to meet the formula , where A_in and A_out are the amplitudes of the input and output signals respectively, and f_in and f_out are the frequencies of the input and output signals respectively. In this way, the stability and integrity of the signal during transmission are ensured, thereby achieving precise flicker control of the light string.

[0067] The shape of the circuit board 9 is rectangular, circular or polygonal, and the connection angle between adjacent circuit boards 9 can be adjusted in the range of 0°-180°. This flexible design enables the light string to adapt to the design requirements of different shapes and layout requirements. In actual applications, it can be adjusted and laid out according to the specific light string shape and installation space.

[0068] After receiving the signal from the signal input terminal, the control IC 10 processes and balances the signal through the data shaping circuit, and then outputs a stable signal to the next circuit board 9. This signal controls the corresponding RGB light-emitting chip 5 to emit light. By combining and controlling the flashing of the different color light-emitting chips, the light string achieves a variety of lighting effects. The adjustable shape and connection angle of the circuit board 9 make the entire light string more flexible during installation and use, meeting various complex design and layout requirements, and also facilitating assembly and debugging during production.

[0069] Working Principle: This patent relates to a side-cut LED light string, which utilizes a parallel power supply circuit and a series signal circuit to achieve cascading of multiple circuit boards. The positive power supply terminal 1 is connected to the first pad, and the negative power supply terminal 2 is connected to the second pad, providing a stable 12V or 5V power supply to the circuit. The signal input terminal 3 and the signal output terminal 4 are connected to the third and fourth pads, respectively, ensuring sequential signal transmission between the circuit boards. The light-emitting die bonding area 7 and the wire bonding area on the front of the insulating substrate 6 provide a stable bonding base for the light-emitting die. The wire bonding area also establishes internal electrical connections, ensuring the proper function of the RGB light-emitting chip 5. The control IC 10 is mounted on the control chip pad 8 on the front of the insulating substrate 6. Its pins connect to the positive power supply terminal 1, the negative power supply terminal 2, the signal input terminal 3, and the signal output terminal 4, thereby controlling signal transmission and processing. When the control IC 10 is operating, it receives signals from the signal input terminal, processes them, and transmits them through the signal output terminal 4 to the next circuit board 9, achieving sequential control and a flashing effect for the light string. The hollow structure between the third pad and the fourth pad forms an isolation spacing of 0.05 mm to 1.5 mm, which helps to avoid signal interference.

[0070] While the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and alterations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. An LED light emitting diode with a side tangent line of a light string, characterized in that: include: An insulating substrate (6), the front side of which is provided with a light-emitting die bonding area, a bonding wire area and a control chip bonding pad, and the back side of which is provided with a first bonding pad, a second bonding pad, a third bonding pad and a fourth bonding pad; The third pad and the fourth pad are located on the same horizontal line, and are separated by a hollow structure to form an isolation area with a spacing of 0.05mm-1.5mm; A power supply parallel circuit, comprising a power supply positive terminal (1) and a power supply negative terminal (2), connected to the first pad and the second pad respectively; A signal series circuit, comprising a signal input terminal (3) and a signal output terminal (4), connected to the third pad and the fourth pad respectively; A circuit board (9) is cascaded through the power parallel circuit and the signal series circuit in sequence, and an RGB three-color light-emitting chip (5) and a control IC (10) are mounted on the circuit board (9); The pins of the control IC (10) are defined as follows: a first pin connected to the positive terminal (1) of the power supply, a second pin connected to the negative terminal (2) of the power supply, a third pin connected to the signal input terminal (3), and a fourth pin connected to the signal output terminal (4); The wire diameter range of the first pad, the second pad, the third pad and the fourth pad is 0.4 mm to 1.5 mm, and the spacing between adjacent pads meets the following requirements: the spacing between the first pad and the second pad is 0.5 mm to 1 mm, the spacing between the second pad and the third pad is 0.05 mm to 0.9 mm, and the third pad and the fourth pad are isolated by the hollow structure, with a spacing of 0.05 mm to 1.5 mm; The connection line between the control IC (10) and the RGB three-color light-emitting chip (5) adopts an impedance matching design, and the characteristic impedance Z of the connection line satisfies the formula: , where L is the line inductance and C is the line capacitance. When the signal transmission frequency is f, the integrity of the signal transmission is ensured. The range of f is 1MHz-100MHz, which is used to ensure the signal control accuracy and stability of the light string. The wiring width of the power parallel circuit and the signal series circuit is in the range of 0.3 mm to 1.2 mm. At the connection between adjacent circuit boards (9), the wiring line spacing is gradually expanded, and the expansion angle α is 30° to 60°, which is used to improve the anti-interference ability and connection reliability of the circuit; the signal transmission rate of the power parallel circuit meets: Tprop≤(1 / 10) Tclock, where Tprop is the signal transmission delay time and Tclock is the clock period of the control IC (10); The data shaping processing circuit built into the control IC (10) adopts adaptive equalization technology, and its equalization coefficient K can be automatically adjusted according to the amplitude and frequency of the input signal to meet the formula: , where A_in and A_out are the amplitudes of the input and output signals, respectively, and f_in and f_out are the frequencies of the input and output signals, respectively, which are used to ensure the stability of the signal during transmission and achieve precise flicker control of the light string.

2. The LED light emitting diode of the side tangent line of the light string according to claim 1, characterized in that: The ratio of the area of ​​the light-emitting wafer solidification area to the area of ​​the wire bonding area is in the range of (1:0.5)-(1:2), which is used to ensure the stable solidification of the light-emitting wafer and the reliability of the wire bonding and meet the electrical connection requirements inside the device.

3. The LED light emitting diode of the side tangent line of the light string according to claim 1, characterized in that: The thickness of the insulating substrate (6) ranges from 0.2 mm to 0.8 mm, and the material thereof is ceramic or composite insulating material, and the thermal conductivity λ of the insulating substrate (6) is ≥1.0 W / (m K), used to meet the heat dissipation requirements of the device during operation and ensure the performance of the LED light-emitting diode, and the top of the insulating substrate (6) is also equipped with a light-emitting crystal solidification area (7) and a control chip pad (8).

4. The LED light emitting diode of the side tangent line of the light string according to claim 1, characterized in that: The signal series circuit includes a control signal line (15), a positive power line (13) and a negative power line (14), wherein the control signal line (15) is connected to the signal input terminal (3) of the corresponding circuit board (9), the positive power line (13) is connected to the positive power terminal (1) of the corresponding circuit board (9), and the negative power line (14) is connected to the negative power terminal (2) of the corresponding circuit board (9).

5. The LED light emitting diode of the side tangent line of the light string according to claim 1, characterized in that: The luminous efficiency η of the RGB three-color light-emitting chip (5) is ≥80lm / W, and the wavelength ranges of the light-emitting chips of each color are: the wavelength of the red chip is 620nm-630nm, the wavelength of the green chip is 520nm-530nm, and the wavelength of the blue chip is 460nm-470nm, so as to achieve good color performance and brightness output.

6. The LED light emitting diode of the side tangent line of the light string according to claim 1, characterized in that: The shape of the circuit board (9) is circular or polygonal, and the connection angle between adjacent circuit boards (9) can be adjusted in the range of 0°-180°, so as to adapt to the design of light strings with different shapes and layout requirements.

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