Display panel mother board, display panel and manufacturing method of display panel mother board

Abstract

The invention relates to a display panel mother board, a display panel and a manufacturing method of the display panel mother board. The display panel mother board is provided with a plurality of display panels arranged at intervals and partition areas arranged on the peripheries of the display panels, and each display panel is provided with a display area and a binding area; the display area is provided with a plurality of signal lines; the binding area is provided with a plurality of conductive welding pads, and the conductive welding pads are connected with the display area through signal lines; the partition area is provided with an electrostatic discharge structure, and one end of the electrostatic discharge structure is connected with the conductive welding pad. Thus, static electricity generated in the manufacturing process of the display panel can be released to the static electricity release structures of the partition areas through the signal lines and the conductive welding pads, the static electricity generated in the manufacturing process is prevented from being accumulated in the display panel, static electricity damage in the display panel is avoided, the yield of products can be improved, and the productivity and benefits of the products are improved.

Description

Technical Field

[0001] The present application relates to the field of display technologies, and particularly to a display panel mother board, a display panel and a manufacturing method thereof. Background Art

[0002] An organic light emitting diode (OLED) is an active light emitting device, which has advantages such as high contrast ratio, wide viewing angle, low power consumption, and thinner thickness.

[0003] With the expansion of the OLED market scale, how to improve the product yield, production capacity and efficiency are important issues in the development of OLEDs. Summary of the Invention

[0004] Based on this, in view of the above technical problems, it is necessary to provide a display panel mother board, a display panel and a manufacturing method thereof that can improve the product yield.

[0005] In a first aspect, the present application provides a display panel mother board, which has a plurality of display panels arranged at intervals, and a dividing area provided on the periphery of the display panels. The display panel has a display area and a bonding area;

[0006] The display area has a plurality of signal lines;

[0007] The bonding area has a plurality of conductive pads, and the conductive pads are connected to the display area through the signal lines;

[0008] The dividing area has an electrostatic discharge structure, and one end of the electrostatic discharge structure is connected to the conductive pad.

[0009] In the above display panel mother board, an electrostatic discharge structure is formed in the dividing area, and the electrostatic discharge structure is connected to the display area through the conductive pad. In this way, the static electricity generated during the manufacturing process of the display panel can be released to the electrostatic discharge structure in the dividing area via the signal lines and the conductive pads, avoiding the accumulation of static electricity generated during the manufacturing process in the display panel, preventing electrostatic injury in the display panel, and being beneficial to improving the product yield, production capacity and efficiency.

[0010] In one embodiment, the electrostatic discharge structure includes:

[0011] An electrostatic lead-out wire, the first end of the electrostatic lead-out wire is connected to the conductive pad, and the second end of the electrostatic lead-out wire extends to the dividing area;

[0012] A capacitor, the capacitor includes a first electrode, an organic layer and a second electrode stacked in sequence, and the first electrode is connected to the second end of the electrostatic lead-out wire.

[0013] In this way, the static electricity leading wire leads the static electricity inside the display panel to the first electrode of the capacitor. When the static electricity accumulation amount of the first electrode reaches the breakdown voltage of the capacitor, the static electricity breaks down the organic layer and is released to the second electrode. Since the second electrode is not connected to a potential, the static electricity is released to the outside of the display panel through the second electrode, preventing static electricity from accumulating in the static electricity release structure. The static electricity release structure can continuously release static electricity, improving the anti-static ability of the display panel.

[0014] In one embodiment, the second end of the static electricity leading wire has a discharge tip, and the first electrode is connected to the discharge tip.

[0015] Preferably, the size of the second end of the static electricity leading wire is smaller than that of the first end.

[0016] Preferably, in the direction from the first end to the second end, the size of the static electricity leading wire gradually decreases.

[0017] Preferably, the projection of the static electricity leading wire on the mother board of the display panel is trapezoidal, and the short side of the trapezoid is located at the second end.

[0018] In this way, a discharge tip is provided at the second end where the static electricity leading wire is connected to the capacitor. Using the principle of tip discharge, the static electricity inside the display panel is led to the discharge tip of the static electricity leading wire for intermittent discharge, and is released to the outside of the panel through the capacitor. This can ensure that the static electricity release structure effectively releases the static electricity of the display panel, improving the static electricity release efficiency of the static electricity release structure, enhancing the anti-static ability of the display panel, and improving the yield and production capacity of the product.

[0019] In one embodiment, the organic layer of the capacitor has at least one breakdown area, and the thickness of the breakdown area is smaller than that of other areas of the organic layer.

[0020] Preferably, the breakdown areas are arranged in a grid pattern.

[0021] Preferably, the breakdown areas are arranged in a mesh pattern.

[0022] In this way, by thinning the thickness of the organic layer in the breakdown area, the breakdown voltage of the breakdown area is reduced, the static electricity accumulation amount for the first electrode to break down the organic layer is decreased, and the frequency of the static electricity accumulated on the first electrode to break down the organic layer is increased, so as to release the static electricity accumulated on the first electrode to the outside through the second electrode, thereby emptying the static electricity on the first electrode. This is conducive to the static electricity leading wire leading the internal static electricity of the display panel to the first electrode of the capacitor, improving the static electricity release efficiency of the static electricity release structure and the ability of the static electricity release structure to release the static electricity of the display panel.

[0023] In a second aspect, the present application provides a display panel obtained by cutting the division area of the display panel mother board described in the first aspect.

[0024] On the one hand, for the above display panel, the static electricity generated during the manufacturing process of the display panel can be released to the static electricity release structure in the dividing area via the signal line and the conductive solder pad, avoiding the accumulation of static electricity generated during the manufacturing process in the display panel, preventing electrostatic injury inside the display panel, and being beneficial to improving the yield, production capacity, and efficiency of the product. On the other hand, the dividing area is cut to remove the static electricity release structure, preventing the static electricity release structure from existing in the display panel and affecting the use of the display panel.

[0025] Thirdly, the present application provides a manufacturing method for a display panel, including the following steps:

[0026] Provide a substrate, where the substrate has a plurality of function areas arranged at intervals and a dividing area provided on the periphery of the function areas. The function areas correspond to forming a display panel with a predetermined specification, and the display panel has a display area and a bonding area;

[0027] Form a plurality of signal lines in the display area;

[0028] Form a plurality of conductive solder pads in the bonding area, and the conductive solder pads are connected to the display area through the signal lines;

[0029] Form a static electricity release structure in the dividing area, and one end of the static electricity release structure is connected to the conductive solder pad.

[0030] For the above manufacturing method of the display panel, a static electricity release structure is formed in the dividing area, and the static electricity release structure is connected to the display area through the conductive solder pad. In this way, the static electricity generated during the manufacturing process of the display panel can be released to the static electricity release structure in the dividing area via the signal line and the conductive solder pad, avoiding the accumulation of static electricity generated during the manufacturing process in the display panel, preventing electrostatic injury inside the display panel, and being beneficial to improving the yield, production capacity, and efficiency of the product.

[0031] In one embodiment, the manufacturing method includes:

[0032] Form a first metal layer, and the first metal layer covers the bonding area and the dividing area;

[0033] Pattern the first metal layer; form a plurality of initial conductive solder pads in the bonding area; simultaneously form a static electricity lead-out wire, with the first end of the static electricity lead-out wire connected to the conductive solder pad and the second end of the static electricity lead-out wire extending to the dividing area; simultaneously form a first electrode in the dividing area, and the first electrode is connected to the second end of the static electricity lead-out wire;

[0034] Form an organic layer, and the organic layer covers the bonding area and the dividing area;

[0035] Pattern the organic layer and remove the organic layer on the initial conductive pad;

[0036] Form a second metal layer that covers the bonding region and the dividing region;

[0037] Pattern the second metal layer; retain the second metal layer on the initial conductive pad to form the conductive pad; retain the second metal layer on the first electrode to form a second electrode. The first electrode, the organic layer, and the second electrode stacked in sequence form a capacitor, and the static electricity lead-out line and the capacitor constitute the electrostatic discharge structure;

[0038] Preferably, while removing the organic layer on the initial conductive pad, at least one breakdown region is formed in the organic layer on the first electrode, and the thickness of the breakdown region is smaller than the thickness of other regions of the organic layer.

[0039] In this way, the static electricity lead-out line leads the static electricity inside the display panel to the first electrode of the capacitor. When the static electricity accumulation amount of the first electrode reaches the breakdown voltage of the capacitor, the static electricity breaks down the organic layer and is released to the second electrode. The second electrode is not connected to a potential, and the static electricity is released to the outside of the display panel through the second electrode, avoiding the accumulation of static electricity in the electrostatic discharge structure. The electrostatic discharge structure can continuously release static electricity, improving the anti-static ability of the display panel.

[0040] In one embodiment, the patterning of the first metal layer includes:

[0041] Form a first mask layer on the first metal layer, and pattern the first mask layer to form a first mask pattern. The first mask pattern includes a first part, a second part, and a third part connected in sequence. The first part is disposed in the bonding region, the third part is disposed in the dividing region, and the second part connects the first part and the third part;

[0042] Etch the first metal layer according to the first mask layer, and remove the first metal layer exposed by the first mask pattern. The first metal layer covered by the first part forms the first electrode, the first metal layer covered by the second part forms the static electricity lead-out line, and the first metal layer covered by the third part forms the first electrode;

[0043] Preferably, the size of one end of the second part close to the third part is smaller than the size of the end close to the first part. The size of the second end of the static electricity lead-out line is smaller than the size of the first end, and a discharge tip is formed at the second end. The first electrode is connected to the discharge tip;

[0044] Preferably, in the direction from the first part to the third part, the size of the second part gradually decreases, and the size of the static electricity lead-out line gradually decreases from the first end to the second end;

[0045] Preferably, the projection of the static electricity lead-out line on the substrate is a trapezoid, and the short side of the trapezoid is located at the second end.

[0046] In this way, a discharge tip is arranged at the second end where the static electricity lead-out line is connected to the capacitor. By using the principle of tip discharge, the internal static electricity of the display panel is led out to the discharge of the static electricity lead-out line, and is released to the outside of the screen body through the capacitor, which can ensure that the static electricity release structure effectively releases the static electricity of the display panel, improve the static electricity release efficiency of the static electricity release structure, improve the anti-static ability of the display panel, and improve the yield and production capacity of the product.

[0047] In one embodiment, the patterning of the organic layer includes:

[0048] Forming a second mask layer on the organic layer, patterning the second mask layer to form discrete first sub-mask patterns and second sub-mask patterns, the first sub-mask patterns being disposed on the initial conductive pads, and the second sub-mask patterns being disposed on the first electrodes;

[0049] Etching the organic layer according to the second mask layer, etching away the initial conductive pads exposed by the first sub-mask patterns, etching away a part of the organic layer exposed by the second sub-mask patterns, and thinning the thickness of the organic layer exposed by the second sub-mask patterns to form the breakdown region;

[0050] Preferably, the second sub-mask patterns are arranged in a grid pattern, and the breakdown regions are arranged in a grid pattern;

[0051] Preferably, the second sub-mask patterns are arranged in a mesh pattern, and the breakdown regions are arranged in a mesh pattern.

[0052] In this way, by thinning the thickness of the organic layer in the breakdown region, the breakdown voltage of the breakdown region is reduced, the static electricity accumulation amount of the first electrode breaking through the organic layer is reduced, and the frequency of the static electricity accumulated by the first electrode breaking through the organic layer is increased, so as to release the static electricity accumulated by the first electrode to the outside through the second electrode, thereby emptying the static electricity of the first electrode, which is beneficial to the static electricity lead-out line leading the internal static electricity of the display panel to the first electrode of the capacitor, improving the static electricity release efficiency of the static electricity release structure, and improving the ability of the static electricity release structure to release the static electricity of the display panel.

[0053] In one embodiment, it further includes:

[0054] Cutting the dividing area to obtain the display panel, and the display panel has the display area and the bonding area.

[0055] In this way, the electrostatic discharge structure is removed by cutting the partition area, avoiding the influence of the electrostatic discharge structure on the use of the display panel when it exists in the display panel. Description of the Drawings

[0056] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0057] Figure 1 Schematic diagram of a display panel mother board provided by an embodiment of the present application;

[0058] Figure 2 For Figure 1 Partial enlarged view of the S1 area in

[0059] Figure 3 For Figure 2 Cross-sectional view taken along the line a-a in

[0060] Figure 4 Schematic diagram of the connection of a conductive pad, an electrostatic lead-out wire, and a capacitor provided by an embodiment of the present application;

[0061] Figure 5 Schematic diagram of the connection of a conductive pad, an electrostatic lead-out wire, and a capacitor provided by another embodiment of the present application;

[0062] Figure 6 Process flow chart of a method for manufacturing a display panel provided by an embodiment of the present application;

[0063] Figure 7 Schematic diagram of a substrate provided by an embodiment of the present application;

[0064] Figure 8 Schematic diagram after forming a first metal layer and a first mask layer on a substrate provided by an embodiment of the present application;

[0065] Figure 9 Schematic diagram after forming a first mask pattern provided by an embodiment of the present application;

[0066] Figure 10 Schematic diagram after patterning the first metal layer provided by an embodiment of the present application;

[0067] Figure 11 Projection diagram formed in the S1 area of the substrate after patterning the first metal layer provided by an embodiment of the present application;

[0068] Figure 12 Schematic diagram after forming the organic layer and the second mask layer provided by an embodiment of the present application;

[0069] Figure 13 Schematic diagram after forming the first sub-mask pattern and the second sub-mask pattern provided by an embodiment of the present application;

[0070] Figure 14 Projection diagram formed by the first sub-mask pattern and the second sub-mask pattern in the S1 area of the substrate provided by an embodiment of the present application;

[0071] Figure 15 Schematic diagram after forming the breakdown region in the patterned organic layer provided by an embodiment of the present application;

[0072] Figure 16 Schematic diagram after forming the second metal layer and the third mask layer provided by an embodiment of the present application;

[0073] Figure 17 Schematic diagram after forming the third sub-mask pattern and the fourth sub-mask pattern provided by an embodiment of the present application;

[0074] Figure 18 Schematic diagram after forming the electrostatic discharge structure provided by an embodiment of the present application;

[0075] Figure 19 Projection diagram formed by the electrostatic discharge structure in the S1 area of the substrate provided by an embodiment of the present application.

[0076] Explanation of reference numerals:

[0077] 1. Mother board of display panel; A1. Functional area; A11. Display area; A12. Bonding area; A2. Partition area; 10. Display panel; 100. Substrate; 11. Signal line; 12. Conductive pad; 12-1. Initial conductive pad; 20. Electrostatic discharge structure; 21. Electrostatic lead-out wire; 211. Discharge tip; 22. Capacitor; 221. First electrode; 222. Organic layer; 2221. Breakdown region; 223. Second electrode; 31. First metal layer; 32. Second metal layer; 51. First mask layer; 51a. First mask pattern; 511a. First part; 512a. Second part; 513a. Third part; 52. Second mask layer; 52a. First sub-mask pattern; 52b. Second sub-mask pattern; 53. Third mask layer; 53a. Third sub-mask pattern; 53b. Fourth sub-mask pattern. Detailed implementation manners

[0078] To facilitate the understanding of the present application, the present application will be described more comprehensively below with reference to the relevant drawings. The preferred embodiments of the present application are shown in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the understanding of the disclosure of the present application more thorough and comprehensive.

[0079] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which this application belongs. The terms used in the description of the present application in this specification are only for the purpose of describing specific embodiments and are not intended to limit the present application. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0080] When describing positional relationships, unless otherwise specified, when an element such as a layer, film, or substrate is referred to as being "on" another element, it can be directly on the other element or there can also be intermediate elements. Further, when a layer is referred to as being "under" another layer, it can be directly below or there can be one or more light-emitting units. It can also be understood that when a layer is referred to as being "between" two layers, it can be the only layer between the two layers or there can also be one or more light-emitting units.

[0081] In the case of using "comprising", "having", and "including" as described herein, unless explicit limiting terms are used, such as "only", "consisting of", etc., another component can also be added. Unless otherwise mentioned, terms in the singular form can include the plural form and should not be construed as having a quantity of one.

[0082] It should be understood that although terms such as "first" and "second" can be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, without departing from the scope of the present application, the first element can be referred to as the second element, and similarly, the second element can be referred to as the first element.

[0083] It should also be understood that when interpreting an element, although not explicitly described, the element is interpreted as including an error range, and this error range should be within the acceptable deviation range of a specific value determined by those skilled in the art. For example, "about", "approximately", or "substantially" can mean within one or more standard deviations, which are not defined herein.

[0084] In addition, in the specification, the phrase "schematic diagram of planar distribution" refers to the drawing when observing the target part from above, and the phrase "schematic cross-sectional view" refers to the drawing when observing the cross-section intercepted by vertically cutting the target part from the side.

[0085] In addition, the accompanying drawings are not drawn to a scale of 1:1, and the relative sizes of the components are only drawn by way of example in the accompanying drawings and not necessarily to the actual scale.

[0086] As described in the background art, with the expansion of the OLED market scale, issues such as how to improve the product yield, productivity, and efficiency of products are important problems in the development of OLEE. After research by the inventor, it is found that among the reasons affecting the product yield of OLEE products currently, electrostatic damage generated during the manufacturing process is a problem that exists throughout the entire manufacturing stage, and the electrostatic damage generated during the manufacturing process has a great impact on the product yield.

[0087] For the above reasons, the present application provides a display panel mother board, a display panel, and a manufacturing method thereof. During the manufacturing process, an electrostatic discharge structure is formed in the dividing area, and the electrostatic discharge structure is connected to the display area through a conductive pad. In this way, on the one hand, the static electricity generated during the manufacturing process of the display panel can be released to the electrostatic discharge structure in the dividing area via the signal line and the conductive pad, avoiding the accumulation of static electricity generated during the manufacturing process in the display panel and preventing electrostatic damage from occurring in the display panel, which is beneficial to improving the product yield, productivity, and efficiency of the product; on the other hand, by cutting the dividing area, the electrostatic discharge structure can be removed, avoiding the electrostatic discharge structure existing in the display panel and affecting the use of the display panel.

[0088] In a first aspect, the present application provides a display panel mother board 1. Referring to Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 、 Figure 5 as shown, the display panel mother board 1 has a plurality of display panels 10 arranged at intervals, and a dividing area A2 provided on the periphery of the display panel 10. Among them, the display panel 10 may include a flexible display panel 10 with only a display function, or may include a flexible display panel with both touch functions. The flexible display panel may be, for example, a flexible OLED (Organic Light-Emitting Diode) display panel, an active organic light-emitting diode display panel (AMOLED), or other types of flexible display panels. The display panel 10 has a display area A11 and a bonding area A12; the display area A11 has a plurality of signal lines 11; the bonding area A12 has a plurality of conductive pads 12, and the conductive pads 12 are connected to the display area A11 through the signal lines 11; the dividing area A2 has an electrostatic discharge structure 20, and one end of the electrostatic discharge structure 20 is connected to the conductive pad 12.

[0089] The display area A11 of the display panel 10 is provided with display units (not shown in the figure) arranged in an array. The display units include light-emitting elements and driving elements, and the driving elements are used to drive the light-emitting elements to emit light. The display units of the display panel 10 are connected to the conductive pads 12 in the bonding area A12 through signal lines 11. Among them, each column of display units is connected to one signal line 11. The signal lines 11 lead out the static electricity in the display area A11 to the conductive pads 12, and then lead it out through the conductive pads 12 to the static electricity release structure 20 for release.

[0090] In the above display panel mother board 1, a static electricity release structure 20 is formed in the dividing area A2. The static electricity release structure 20 is connected to the display area A11 through the conductive pads 12. In this way, the static electricity generated during the manufacturing process of the display panel 10 can be released to the static electricity release structure 20 in the dividing area A2 via the signal lines 11 and the conductive pads 12, avoiding the accumulation of static electricity generated during the manufacturing process in the display panel 10 and preventing electrostatic injury inside the display panel 10, which is beneficial to improving the yield, production capacity and efficiency of the product.

[0091] In one embodiment, referring to Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 、 Figure 5 As shown, the static electricity release structure 20 includes a static electricity lead-out wire 21 and a capacitor 22; the first end of the static electricity lead-out wire 21 is connected to the conductive pad 12, and the second end of the static electricity lead-out wire 21 extends to the dividing area A2; the capacitor 22 includes a first electrode 221, an organic layer 222 and a second electrode 223 stacked in sequence, and the first electrode 221 is connected to the second end of the static electricity lead-out wire 21.

[0092] In this way, the static electricity lead-out wire 21 leads out the static electricity inside the display panel 10 to the first electrode 221 of the capacitor 22. When the static electricity accumulation amount of the first electrode 221 reaches the breakdown voltage of the capacitor 22, the static electricity breaks down the organic layer 222 and is released to the second electrode 223. The second electrode 223 is not connected to a potential, and the static electricity is released to the outside of the display panel 10 through the second electrode 223, avoiding the accumulation of static electricity in the static electricity release structure 20. The static electricity release structure 20 can continuously release static electricity, improving the anti-static ability of the display panel 10.

[0093] In one embodiment, referring to Figure 3 As shown, the conductive pad 12 may include a first metal layer 31 and a second metal layer 32 stacked in sequence; the first metal layer 31 of the conductive pad 12, the static electricity lead-out wire 21 and the first electrode 221 of the capacitor 22 are arranged in the same layer; the second metal layer 32 of the conductive pad 12 is arranged in the same layer as the second electrode 223 of the capacitor 22. It can be understood that the "arranged in the same layer" in this application means being formed in the same deposition process.

[0094] The materials of the first metal layer 31 of the conductive pad 12, the static electricity lead-out wire 21, and the first electrode 221 of the capacitor 22 may include conductive metal materials such as tungsten, titanium, or ITO.

[0095] The materials of the second metal layer 32 of the conductive pad 12 and the second electrode 223 of the capacitor 22 may include conductive metal materials such as tungsten, titanium, or ITO.

[0096] The material of the organic layer 222 may include organic materials such as photosensitive polyimide.

[0097] In one embodiment, referring to Figure 3 as shown, the top surface of the static electricity lead-out wire 21 is covered by the organic layer 222, and the organic layer 222 is used for electrical isolation between adjacent static electricity lead-out wires 21 and between the static electricity lead-out wire 21 and the second electrode 223 of the capacitor 22, so as to prevent the short circuit between the static electricity lead-out wire 21 and the second electrode 223 from affecting the static electricity release effect.

[0098] In one embodiment, referring to Figure 3 、 Figure 4 、 Figure 5 as shown, the second end of the static electricity lead-out wire 21 has a discharge tip 211, and the first electrode 221 is connected to the discharge tip 211; it can be understood that the discharge tip 211 discharges under the action of an electrostatic field, that is, tip discharge. Tip discharge belongs to a kind of corona discharge, which is a discharge phenomenon that occurs at the sharp part of an object under the action of a strong electric field. By setting the discharge tip 211 at the second end of the static electricity lead-out wire 21, the static electricity inside the display panel 10 discharges to the capacitor 22 at the discharge tip 211, thereby releasing the static electricity of the display panel 10.

[0099] One or more discharge tips 211 may be provided at the second end of the static electricity lead-out wire 21, and the number of the discharge tips 211 provided can be flexibly set according to process conditions and production requirements.

[0100] In one example, referring to Figure 4 as shown, the size of the second end of the static electricity lead-out wire 21 is smaller than that of the first end, and the second end forms the discharge tip 211; in another example, referring to Figure 5 as shown, in the direction from the first end to the second end, the size of the static electricity lead-out wire 21 gradually decreases, and the second end forms the discharge tip 211; in yet another example, the projection of the static electricity lead-out wire 21 on the display panel mother board 1 is trapezoidal, and the short side of the trapezoid is located at the second end.

[0101] In this way, a discharge tip 211 is provided at the second end where the static electricity lead-out wire 21 is connected to the capacitor 22. By using the principle of point discharge, the internal static electricity of the display panel 10 is led out to the discharge intermittent discharge of the static electricity lead-out wire 21, and is released to the outside of the screen body through the capacitor 22, which can ensure that the static electricity release structure 20 effectively releases the static electricity of the display panel 10, improve the static electricity release efficiency of the static electricity release structure 20, improve the anti-static ability of the display panel 10, and improve the yield and production capacity of the product.

[0102] In one embodiment, referring to Figure 3 As shown, the organic layer 222 of the capacitor 22 has at least one breakdown region 2221, and the thickness of the breakdown region 2221 is less than the thickness of other regions of the organic layer 222. The organic layer 222 of the capacitor 22 may have one or more breakdown regions 2221; for example, the organic layer 222 of the capacitor 22 has one breakdown region 2221, and the breakdown region 2221 is provided in the middle region of the organic layer 222 of the capacitor 22; for another example, the organic layer 222 of the capacitor 22 may have multiple breakdown regions 2221, and the multiple breakdown regions 2221 may be arranged at intervals, or the multiple breakdown regions 2221 may also be connected in sequence.

[0103] In one example, the breakdown regions 2221 are arranged in a grid pattern; in another example, the breakdown regions 2221 are arranged in a mesh pattern.

[0104] It can be understood that the thicker the thickness of the organic layer 222, the higher the breakdown voltage of the capacitor 22. The static electricity of the display panel 10 is led to the first electrode 221, and the static electricity accumulated on the first electrode 221 is large and the accumulation time is long. It is difficult to reach the breakdown voltage of the capacitor 22, and the static electricity accumulated on the first electrode 221 is difficult to release, which affects the static electricity release effect and affects the release of the internal static electricity of the display panel 10 to the capacitor 22.

[0105] In this application, a breakdown region 2221 is provided in the organic layer 222 of the capacitor 22. The thickness of the breakdown region 2221 is relatively thin, and the breakdown voltage of the breakdown region 2221 is low. The static electricity accumulated on the first electrode 221 can break down the breakdown region 2221 without being very large, and release the static electricity to the second electrode 223.

[0106] In this way, by thinning the thickness of the organic layer 222 in the breakdown region 2221, the breakdown voltage of the breakdown region 2221 is reduced, the electrostatic accumulation amount of the first electrode 221 for breaking through the organic layer 222 is reduced, and the frequency of the electrostatic breakdown of the organic layer 222 accumulated by the first electrode 221 is increased, so as to release the electrostatic accumulated by the first electrode 221 to the outside through the second electrode 223, thereby emptying the electrostatic of the first electrode 221, which is beneficial to the electrostatic lead-out line 21 to lead out the internal electrostatic of the display panel 10 to the first electrode 221 of the capacitor 22, improving the electrostatic release efficiency of the electrostatic release structure 20, and improving the ability of the electrostatic release structure 20 to release the electrostatic of the display panel 10.

[0107] In a second aspect, the present application provides a display panel 10, which is obtained by cutting and dividing the cutting and dividing area A2 of the display panel mother board 1 in the first aspect.

[0108] For the above display panel 10, on the one hand, the static electricity generated during the production process of the display panel 10 can be released to the electrostatic release structure 20 in the cutting and dividing area A2 via the signal line 11 and the conductive pad 12, avoiding the accumulation of static electricity generated during the production process in the display panel 10 and avoiding electrostatic injury in the display panel 10, which is beneficial to improving the yield of the product, improving the production capacity and efficiency of the product; on the other hand, the cutting and dividing area A2 removes the electrostatic release structure 20, avoiding the influence of the electrostatic release structure 20 existing in the display panel 10 on the use of the display panel 10.

[0109] In a third aspect, the present application provides a manufacturing method of a display panel 10, wherein the display panel 10 can include a flexible display panel with only a display function, or can also include a flexible display panel with both touch functions. The flexible display panel can be, for example, a flexible OLED (Organic Light-Emitting Diode) display panel, an active organic light-emitting diode display panel (AMOLED), or other types of flexible display panels.

[0110] As Figure 6 shown, the manufacturing method of the display panel 10 of the present application includes the following steps:

[0111] Step S11: Provide a substrate 100, the substrate 100 has a plurality of function areas A1 arranged at intervals, and a cutting and dividing area A2 arranged outside the function area A1. The function area A1 corresponds to forming a display panel 10 with a predetermined specification. The display panel 10 has a display area A11 and a bonding area A12;

[0112] Refer to Figure 7 and combine with Figure 1As shown, the substrate 100 is used to form the display panel mother board 1 before the display panel 10 is cut; the functional area A1 of the substrate 100 is used to form the display panel 10, and a plurality of display panels 10 are separated by the dividing area A2, and the bonding area A12 of each display panel 10 is adjacent to the dividing area A2 of the substrate 100.

[0113] Step S12: Form a plurality of signal lines 11 in the display area A11;

[0114] Referring to Figure 1 , Figure 2 , a metal layer can be deposited and formed in the display area A11, and the metal layer is patterned to form a plurality of signal lines 11, and the plurality of signal lines 11 extend to the bonding area A12;

[0115] In this embodiment, it further includes: forming display units arranged in an array in the display area A11 of the display panel 10, the display units include light-emitting elements and driving elements, and the driving elements are used to drive the light-emitting elements to emit light. Each column of display units is connected to one signal line 11.

[0116] Step S13: Form a plurality of conductive pads 12 in the bonding area A12, and the conductive pads 12 are connected to the display area A11 through the signal lines 11;

[0117] A metal layer can be deposited and formed in the bonding area A12, and the metal layer is patterned to form a plurality of conductive pads 12, and the plurality of conductive pads 12 are connected to the plurality of signal lines 11 in a one-to-one correspondence to be connected to the display area A11.

[0118] The display units of the display panel 10 are connected to the conductive pads 12 in the bonding area A12 through the signal lines 11. The signal lines 11 lead out the static electricity in the display area A11 to the conductive pads 12 and are led out through the conductive pads 12.

[0119] Step S14: Form an electrostatic discharge structure 20 in the dividing area A2, and one end of the electrostatic discharge structure 20 is connected to the conductive pad 12.

[0120] The electrostatic discharge structure 20 can include an electrostatic lead-out line 21 and a capacitor 22; the first end of the electrostatic lead-out line 21 is connected to the conductive pad 12, and the second end of the electrostatic lead-out line 21 extends to the dividing area A2; the capacitor 22 includes a first electrode 221, an organic layer 222, and a second electrode 223 stacked in sequence, and the first electrode 221 is connected to the second end of the electrostatic lead-out line 21.

[0121] The manufacturing method of the above display panel 10 forms an electrostatic discharge structure 20 in the division area A2. The electrostatic discharge structure 20 is connected to the display area A11 through the conductive pad 12. In this way, the static electricity generated during the manufacturing process of the display panel 10 can be released to the electrostatic discharge structure 20 in the division area A2 via the signal line 11 and the conductive pad 12, avoiding the accumulation of static electricity generated during the manufacturing process in the display panel 10 and preventing electrostatic injury inside the display panel 10, which is beneficial to improving the yield, production capacity, and efficiency of the product.

[0122] In one embodiment, referring to Figure 3 , the conductive pad 12 includes a first metal layer 31 and a second metal layer 32 stacked in sequence; the first metal layer 31 of the conductive pad 12, the static electricity lead-out line 21, and the first electrode 221 of the capacitor 22 are formed in the same manufacturing process; the second metal layer 32 of the conductive pad 12 and the second electrode 223 of the capacitor 22 are formed in the same layer in the same manufacturing process. In this embodiment, step S13 forms a plurality of conductive pads 12 in the bonding area A12, the conductive pads 12 are connected to the display area A11 through the signal line 11, and step S14: forms an electrostatic discharge structure 20 in the division area A2, and one end of the electrostatic discharge structure 20 is connected to the conductive pad 12; specifically, it includes the following manufacturing steps:

[0123] Step S101: Form the first metal layer 31, and the first metal layer 31 covers the bonding area A12 and the division area A2;

[0124] Referring to Figure 8 , the first metal layer 31 can be deposited by atomic layer deposition (ALD) or chemical vapor deposition (CVD), and the first metal layer 31 entirely covers the bonding area A12 and the division area A2.

[0125] It can be understood that the first metal layer 31 also covers the display area A11. According to the process design of the devices in the display area A11, this step can be formed in the same manufacturing process as the film layers of the devices in the display area A11 to save manufacturing processes.

[0126] The material of the first metal layer 31 can include conductive metal materials such as tungsten, titanium, or ITO.

[0127] Step S102: Pattern the first metal layer 31; form a plurality of initial conductive pads 12-1 in the bonding area A12; at the same time, form the static electricity lead-out line 21, the first end of the static electricity lead-out line 21 is connected to the conductive pad 12, and the second end of the static electricity lead-out line 21 extends to the division area A2; at the same time, form the first electrode 221 in the division area A2, and the first electrode 221 is connected to the second end of the static electricity lead-out line 21;

[0128] Refer to Figure 9 , Figure 10 , Figure 11 , etch the first metal layer 31, and simultaneously form an initial conductive pad 12-1, an electrostatic lead-out wire 21, and a first electrode 221 that are connected in sequence.

[0129] Step S103: Form an organic layer 222 that covers the bonding region A12 and the dividing region A2;

[0130] Refer to Figure 12 , the organic layer 222 can be formed by atomic layer deposition or chemical vapor deposition, and the organic layer 222 covers the initial conductive pad 12-1, the electrostatic lead-out wire 21, and the first electrode 221.

[0131] The material of the organic layer 222 can include organic materials such as photosensitive polyimide.

[0132] Step S104: Pattern the organic layer 222 and remove the organic layer 222 on the initial conductive pad 12-1;

[0133] Refer to Figure 13 , Figure 14 , Figure 15 , etch the organic layer 222 to remove the organic layer 222 on the initial conductive pad 12-1, expose the top surface of the initial conductive pad 12-1, and retain the organic layer 222 that covers the electrostatic lead-out wire 21 and the first electrode 221.

[0134] Step S105: Form a second metal layer 32 that covers the bonding region A12 and the dividing region A2;

[0135] Refer to Figure 16 , the second metal layer 32 can be formed by atomic layer deposition or chemical vapor deposition, and the second metal layer 32 covers the top surface of the initial conductive pad 12-1 and the top surface of the organic layer 222.

[0136] The material of the second metal layer 32 can include conductive metal materials such as tungsten, titanium, or ITO.

[0137] Step S106: Pattern the second metal layer 32; retain the second metal layer 32 on the initial conductive pad 12-1 to form a conductive pad 12; retain the second metal layer 32 on the first electrode 221 to form a second electrode 223. The first electrode 221, the organic layer 222, and the second electrode 223 that are stacked in sequence form a capacitor 22, and the electrostatic lead-out wire 21 and the capacitor 22 form an electrostatic discharge structure 20;

[0138] Refer to Figure 17 , Figure 18 , Figure 19, etch the second metal layer 32, and retain the second metal layer 32 on the initial conductive pad 12-1 and the second metal layer 32 on the first electrode 221.

[0139] In this way, the static electricity inside the display panel 10 is led out to the first electrode 221 of the capacitor 22 by the static electricity lead-out wire 21. When the static electricity accumulation amount of the first electrode 221 reaches the breakdown voltage of the capacitor 22, the static electricity breaks down the organic layer 222 and is released to the second electrode 223. The second electrode 223 is not connected to a potential, and the static electricity is released to the outside of the display panel 10 through the second electrode 223, avoiding the accumulation of static electricity in the static electricity release structure 20. The static electricity release structure 20 can continuously release static electricity, improving the antistatic ability of the display panel 10.

[0140] In one embodiment, as shown in Figure 15 , while removing the organic layer 222 on the initial conductive pad 12-1, at least one breakdown region 2221 is formed on the organic layer 222 on the first electrode 221, and the thickness of the breakdown region 2221 is less than the thickness of other regions of the organic layer 222.

[0141] One or more breakdown regions 2221 can be formed on the organic layer 222 on the first electrode 221; for example, one breakdown region 2221 is formed on the organic layer 222 on the first electrode 221, and the breakdown region 2221 is disposed in the middle region of the first electrode 221; for another example, multiple breakdown regions 2221 are formed on the organic layer 222 on the first electrode 221, and the multiple breakdown regions 2221 can be arranged at intervals, or the multiple breakdown regions 2221 can also be connected in sequence.

[0142] It can be understood that the thicker the thickness of the organic layer 222, the higher the breakdown voltage of the capacitor 22. When the static electricity of the display panel 10 is led to the first electrode 221, the static electricity accumulated on the first electrode 221 is large and the accumulation time is long, making it difficult to reach the breakdown voltage of the capacitor 22. The static electricity accumulates on the first electrode 221 and is difficult to release, affecting the static electricity release effect and the release of the internal static electricity of the display panel 10 to the capacitor 22.

[0143] In this application, a breakdown region 2221 is provided in the organic layer 222 of the capacitor 22. The thickness of the breakdown region 2221 is relatively thin, and the breakdown voltage of the breakdown region 2221 is low. The static electricity accumulated on the first electrode 221 can break down the breakdown region 2221 without being very large, and release the static electricity to the second electrode 223.

[0144] In this way, by thinning the thickness of the organic layer 222 in the breakdown region 2221, the breakdown voltage of the breakdown region 2221 is reduced, the amount of electrostatic charge accumulated by the first electrode 221 for breaking through the organic layer 222 is reduced, and the frequency of the electrostatic charge accumulated by the first electrode 221 for breaking through the organic layer 222 is increased, so as to release the electrostatic charge accumulated by the first electrode 221 to the outside through the second electrode 223, thereby emptying the electrostatic charge of the first electrode 221, which is beneficial for the electrostatic lead 21 to lead the internal electrostatic charge of the display panel 10 to the first electrode 221 of the capacitor 22, improving the electrostatic discharge efficiency of the electrostatic discharge structure 20, and enhancing the ability of the electrostatic discharge structure 20 to discharge the electrostatic charge of the display panel 10.

[0145] In one embodiment, step S102 of patterning the first metal layer 31 includes:

[0146] Step S102-1: Form a first mask layer 51 on the first metal layer 31, and pattern the first mask layer 51 to form a first mask pattern 51a. The first mask pattern 51a includes a first part 511a, a second part 512a, and a third part 513a that are connected in sequence. The first part 511a is disposed in the bonding region A12, the third part 513a is disposed in the dividing region A2, and the second part 512a connects the first part 511a and the third part 513a; Refer to Figure 8 , coat a photoresist on the first metal layer 31 to form the first mask layer 51, and perform exposure and development on the first mask layer 51 to form the first mask pattern 51a;

[0147] Step S102-2: Etch the first metal layer 31 according to the first mask layer 51, and remove the first metal layer 31 exposed by the first mask pattern 51a. The first metal layer 31 covered by the first part 511a forms the first electrode 221, the first metal layer 31 covered by the second part 512a forms the electrostatic lead 21, and the first metal layer 31 covered by the third part 513a forms the first electrode 221; The first metal layer 31 can be etched using a dry process.

[0148] Preferably, refer to Figure 9 、 Figure 10 、 Figure 11 , the size of one end of the second part 512a close to the third part 513a is smaller than the size of the end close to the first part 511a, the size of the second end of the electrostatic lead 21 is smaller than the size of the first end, a discharge tip 211 is formed at the second end, and the first electrode 221 is connected to the discharge tip 211.

[0149] It can be understood that the discharge tip 211 discharges under the action of an electrostatic field, that is, tip discharge. Tip discharge belongs to a type of corona discharge, which is a discharge phenomenon that occurs at the sharp part of an object under the action of a strong electric field. A discharge tip 211 is provided at the second end of the electrostatic lead-out wire 21, and the static electricity inside the display panel 10 discharges to the capacitor 22 at the discharge tip 211, thereby releasing the static electricity of the display panel 10.

[0150] One or more discharge tips 211 can be provided at the second end of the electrostatic lead-out wire 21, and the number of discharge tips 211 provided can be flexibly set according to process conditions and production requirements.

[0151] In one example, referring to Figure 9 、 Figure 10 、 Figure 11 , in the direction from the first part 511a to the third part 513a, the size of the second part 512a gradually decreases, and the size of the electrostatic lead-out wire 21 gradually decreases from the first end to the second end; in another example, the projection of the electrostatic lead-out wire 21 on the substrate 100 is trapezoidal, and the short side of the trapezoid is located at the second end.

[0152] In this way, a discharge tip 211 is provided at the second end where the electrostatic lead-out wire 21 is connected to the capacitor 22. Using the principle of tip discharge, the internal static electricity of the display panel 10 is led out to the discharge discontinuity of the electrostatic lead-out wire 21 and released to the outside of the screen body through the capacitor 22, which can ensure that the static electricity release structure 20 effectively releases the static electricity of the display panel 10, improve the static electricity release efficiency of the static electricity release structure 20, improve the antistatic ability of the display panel 10, and improve the yield and production capacity of the product.

[0153] In one of the embodiments, step S104 of patterning the organic layer 222 includes:

[0154] Step S104-1: Form a second mask layer 52 on the organic layer 222, and pattern the second mask layer 52 to form discrete first sub-mask patterns 52a and second sub-mask patterns 52b. The first sub-mask pattern 52a is disposed on the initial conductive pad 12-1, and the second sub-mask pattern 52b is disposed on the first electrode 221; referring to Figure 12 , a photoresist is coated on the second metal layer 32 to form the second mask layer 52, referring to Figure 13 、 Figure 14 , the second mask layer 52 is exposed and developed to form the first sub-mask pattern 52a and the second sub-mask pattern 52b;

[0155] Step S104-2: Etch the organic layer 222 according to the second mask layer 52, etch and remove the initial conductive pad 12-1 exposed by the first sub-mask pattern 52a, etch and remove a part of the organic layer 222 exposed by the second sub-mask pattern 52b, and thin the thickness of the organic layer 222 exposed by the second sub-mask pattern 52b to form a breakdown region 2221;

[0156] In one example, referring to Figure 15 , the second sub-mask pattern 52b is arranged in a grid pattern, and the breakdown region 2221 is arranged in a grid pattern; in another example, not shown in the drawings of this example, the second sub-mask pattern 52b is arranged in a mesh pattern, and the breakdown region 2221 is arranged in a mesh pattern.

[0157] In this way, by thinning the thickness of the organic layer 222 in the breakdown region 2221, the breakdown voltage of the breakdown region 2221 is reduced, the electrostatic accumulation amount of the first electrode 221 breaking through the organic layer 222 is reduced, and the frequency of the electrostatic accumulated by the first electrode 221 breaking through the organic layer 222 is increased, so as to release the electrostatic accumulated by the first electrode 221 to the outside through the second electrode 223, thereby emptying the static electricity of the first electrode 221, which is beneficial to the static electricity lead-out line 21 to lead out the internal static electricity of the display panel 10 to the first electrode 221 of the capacitor 22, improving the static electricity release efficiency of the static electricity release structure 20, and improving the ability of the static electricity release structure 20 to release the static electricity of the display panel 10.

[0158] In one of the embodiments, step S106 of patterning the second metal layer 32 includes:

[0159] Step S106-1: Form a third mask layer 53 on the second metal layer 32, pattern the third mask layer 53 to form discrete third sub-mask patterns 53a and fourth sub-mask patterns 53b, the third sub-mask pattern 53 is disposed above the initial conductive pad 12-1, and the third sub-mask pattern 53a is disposed above the first electrode 221; referring to Figure 16 , coat a photoresist to form the third mask layer 53, referring to Figure 17 , perform exposure and development processing on the third mask layer 53 to form discrete third sub-mask patterns 53a and fourth sub-mask patterns 53b;

[0160] Step S106-2: Etch the second metal layer 32 according to the patterned third mask layer 53, etch and remove the second metal layer 32 exposed by the third sub-mask pattern 53a and the fourth sub-mask pattern 53b, referring to Figure 18 , Figure 19, the second metal layer 32 on the initial conductive pad 12-1 is etched and retained to form the conductive pad 12 together with the initial conductive pad 12-1. The second metal layer 32 above the first electrode 221 is etched and retained to form the second electrode 223 of the capacitor 22. The static electricity lead-out wire 21 and the capacitor 22 constitute the static electricity release structure 20.

[0161] In one embodiment, the manufacturing method of the display panel 10 further includes the following steps:

[0162] Step S15: Cut the division area A2 to obtain the display panel 10, and the display panel 10 has a display area A11 and a bonding area A12.

[0163] In this way, the static electricity release structure 20 is removed by cutting the division area A2, avoiding the influence of the static electricity release structure 20 on the use of the display panel 10 when it exists in the display panel 10.

[0164] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope recorded in this specification.

[0165] The above-described embodiments only represent several implementation manners of the present invention. The description is relatively specific and detailed, but it should not be construed as a limitation on the scope of the invention patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several modifications and improvements can still be made, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the invention patent should be subject to the appended claims.

Claims

1. A display panel motherboard, characterized in that: A plurality of display panels arranged at intervals and a partitioning area arranged at the periphery of the display panels, wherein the display panel has a display area and a binding area; The display area has a plurality of signal lines; The binding area has a plurality of conductive pads, and the conductive pads are connected to the display area through the signal lines; The segmentation area has an electrostatic release structure, and one end of the electrostatic release structure is connected to the conductive pad.

2. The display panel motherboard according to claim 1, characterized in that: The electrostatic release structure comprises: An electrostatic lead-out line, wherein a first end of the electrostatic lead-out line is connected to the conductive pad, and a second end of the electrostatic lead-out line extends to the segmentation area; A capacitor includes a first electrode, an organic layer, and a second electrode stacked in sequence, wherein the first electrode is connected to the second end of the static lead-out line.

3. The display panel motherboard according to claim 2, characterized in that: The second end of the electrostatic lead-out line has a discharge tip, and the first electrode is connected to the discharge tip; Preferably, the size of the second end of the electrostatic lead-out line is smaller than the size of the first end; Preferably, the size of the electrostatic lead wire gradually decreases from the first end to the second end; Preferably, the projection of the electrostatic lead-out line on the display panel motherboard is a trapezoid, and the short side of the trapezoid is located at the second end.

4. The display panel motherboard according to claim 2, characterized in that: The organic layer of the capacitor has at least one breakdown region, the thickness of the breakdown region is smaller than the thickness of other regions of the organic layer; Preferably, the breakdown regions are arranged in a grid shape; Preferably, the breakdown regions are arranged in a grid shape.

5. A display panel, characterized in that: The display panel motherboard according to any one of claims 1 to 4 is cut into the segmented area.

6. A method for manufacturing a display panel, characterized in that: The following steps are involved: Providing a substrate, the substrate having a plurality of functional areas arranged at intervals, and a partitioning area arranged outside the functional areas, the functional areas corresponding to a display panel of a predetermined specification, the display panel having a display area and a binding area; forming a plurality of signal lines in the display area; forming a plurality of conductive pads in the binding area, wherein the conductive pads are connected to the display area through the signal lines; An electrostatic release structure is formed in the segmentation area, and one end of the electrostatic release structure is connected to the conductive pad.

7. The method for manufacturing a display panel according to claim 6, characterized in that: The production method comprises: forming a first metal layer, wherein the first metal layer covers the binding area and the segmentation area; Patterning the first metal layer; forming a plurality of initial conductive pads in the binding area; forming an electrostatic lead-out line, wherein a first end of the electrostatic lead-out line is connected to the conductive pad, and a second end of the electrostatic lead-out line extends to the segmentation area; forming a first electrode in the segmentation area, wherein the first electrode is connected to the second end of the electrostatic lead-out line; forming an organic layer, wherein the organic layer covers the binding area and the segmentation area; Patterning the organic layer and removing the organic layer on the initial conductive pad; forming a second metal layer, wherein the second metal layer covers the binding area and the segmentation area; Patterning the second metal layer; retaining the second metal layer on the initial conductive pad to form the conductive pad; retaining the second metal layer on the first electrode to form a second electrode, the first electrode, the organic layer and the second electrode stacked in sequence form a capacitor, and the electrostatic lead wire and the capacitor constitute the electrostatic release structure; Preferably, while removing the organic layer on the initial conductive pad, at least one breakdown region is formed in the organic layer on the first electrode, and the thickness of the breakdown region is smaller than the thickness of other regions of the organic layer.

8. The method for manufacturing a display panel according to claim 7, characterized in that: The patterning of the first metal layer comprises: forming a first mask layer on the first metal layer, patterning the first mask layer to form a first mask pattern, wherein the first mask pattern comprises a first portion, a second portion, and a third portion which are sequentially connected, wherein the first portion is disposed in the binding area, the third portion is disposed in the segmentation area, and the second portion connects the first portion and the third portion; Etching the first metal layer according to the first mask layer to remove the first metal layer exposed by the first mask pattern, so that the first metal layer covered by the first portion forms the first electrode, the first metal layer covered by the second portion forms the electrostatic lead, and the first metal layer covered by the third portion forms the first electrode; Preferably, the size of one end of the second part close to the third part is smaller than the size of one end close to the first part, the size of the second end of the electrostatic lead-out line is smaller than the size of the first end, a discharge tip is formed at the second end, and the first electrode is connected to the discharge tip; Preferably, the size of the second portion gradually decreases from the first portion to the third portion, and the size of the electrostatic lead gradually decreases from the first end to the second end; Preferably, the projection of the electrostatic lead-out line on the substrate is a trapezoid, and the short side of the trapezoid is located at the second end.

9. The method for manufacturing a display panel according to claim 7, characterized in that: The patterning of the organic layer comprises: forming a second mask layer on the organic layer, and patterning the second mask layer to form a discrete first sub-mask pattern and a second sub-mask pattern, wherein the first sub-mask pattern is disposed on the initial conductive pad, and the second sub-mask pattern is disposed on the first electrode; Etching the organic layer according to the second mask layer, etching and removing the initial conductive pad exposed by the first sub-mask pattern, etching and removing a portion of the organic layer exposed by the second sub-mask pattern, and thinning the thickness of the organic layer exposed by the second sub-mask pattern to form the breakdown region; Preferably, the second sub-mask patterns are arranged in a grid shape, and the breakdown regions are arranged in a grid shape; Preferably, the second sub-mask patterns are arranged in a grid shape, and the breakdown regions are arranged in a grid shape.

10. The method for manufacturing a display panel according to claim 6, wherein: Also includes: The segmented area is cut to obtain the display panel, wherein the display panel has the display area and the binding area.

Images