Manifold
By setting separate high-temperature and low-temperature flow paths in the flow path housing, the problem of heat exchange between refrigerants in the existing thermal management system is solved, and more efficient and stable thermal management is achieved.
Patent Information
- Application Number
- CN202380076087.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2022-11-30
- Filing Date
- 2023-11-02
- Publication Date
- 2025-06-10
AI Technical Summary
In the existing thermal management system, heat exchange is prone to occur between high-temperature refrigerant steam and low-temperature refrigerant steam, resulting in reduced system efficiency and thermal stress generation.
A manifold structure is designed, which is provided with separate high-temperature flow paths and low-temperature flow paths in the flow path housing. The high-temperature flow paths from the compressor to the condenser are arranged on one end side, and the low-temperature flow paths from the condenser to the evaporator are arranged on the other end side to ensure that the high-temperature flow paths and the low-temperature flow paths are separated and operated.
By separating the high-temperature and low-temperature flow paths, the heat exchange between the refrigerant is effectively suppressed, the thermal stress is reduced, and the efficiency and stability of the system are improved.
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Figure CN120129809A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to a manifold. Background Art
[0002] There are known systems related to the thermal management of an air conditioning system or the like of a vehicle (for example, Patent Document 1). A thermal management system including a compressor that compresses low-temperature refrigerant vapor in a subsystem into high-temperature refrigerant vapor is disclosed in Patent Document 1.
[0003] Patent Document 1: Japanese Unexamined Patent Application Publication No. 2011-255879
[0004] In the thermal management system disclosed in Patent Document 1, for example, if a high-temperature flow path through which high-temperature refrigerant vapor compressed by the compressor flows and a low-temperature flow path through which low-temperature refrigerant vapor flows are arranged close to each other, there is a concern that heat exchange may occur between the high-temperature refrigerant and the low-temperature refrigerant. Summary of the Invention
[0005] The present invention has been completed in view of the above problems, and an object thereof is to provide a manifold that suppresses heat exchange between high-temperature refrigerant flowing in a high-temperature flow path and low-temperature refrigerant flowing in a low-temperature flow path.
[0006] The manifold of the present invention is characterized in the following aspects, that is, it includes: a flow path housing having a first flow path through which refrigerant flows from a compressor toward a condenser and a second flow path through which the refrigerant flows from the condenser toward an evaporator, the first flow path being provided on one end side of the flow path housing, the second flow path being provided on the other end side of the flow path housing, and the first flow path and the second flow path being separated and provided.
[0007] According to this structure, in the flow path housing, the first flow path through which high-temperature refrigerant flowing from the compressor toward the condenser flows is provided on one end side of the flow path housing, the second flow path through which low-temperature refrigerant flowing from the condenser toward the evaporator flows is provided on the other end side of the flow path housing, and the first flow path and the second flow path are separated and provided, so that heat exchange between the high-temperature refrigerant and the low-temperature refrigerant can be suppressed. Brief Description of the Drawings
[0008] Figure 1 It is a diagram showing a refrigerant circuit of an embodiment.
[0009] Figure 2 It is a diagram showing the structure of a flow path housing of an embodiment. Detailed Description of the Invention
[0010] Hereinafter, the manifold of the embodiment of the present invention will be described with reference to the drawings. However, it is not limited to the following embodiments, and various modifications can be made without departing from the gist thereof.
[0011] 〔Refrigerant Circuit〕
[0012] First, with reference to Figure 1 the refrigerant circuit C mounted on a vehicle such as an electric vehicle or a hybrid vehicle will be described. The refrigerant circuit C is composed of a refrigerant flow path L through which a refrigerant F1 for refrigeration and heating that adjusts the temperature inside the vehicle flows. The refrigerant F1 is, for example, a refrigerant such as hydrofluorocarbon (HFC) or hydrofluoroolefin (HFO). The refrigerant flow path L is provided inside a flow path housing 11 of a manifold 10 described later. Figure 2 As described above, the refrigerant circuit C includes a compressor 1 (an example of a compressor), a cockpit condenser 2 (a condenser for heating), a water-cooled condenser 3 (an example of a condenser), an evaporator 4 (an example of an evaporator), a battery cooler 5 (an example of an evaporator), an accumulator 6, and a valve V. The compressor 1, the cockpit condenser 2, the water-cooled condenser 3, the evaporator 4, the battery cooler 5, the accumulator 6, and the valve V are connected via the refrigerant flow path L.
[0013] As Figure 1 shown, the valve V includes an on-off valve V1 provided between the water-cooled condenser 3 and the accumulator 6. In addition, the valve V further includes a first expansion valve VE1 provided between the cockpit condenser 2 and the water-cooled condenser 3 and a second expansion valve VE2 provided between the water-cooled condenser 3 and the evaporator 4.
[0014] The on-off valve V1 controls (flows or cuts off) the flow of the refrigerant F1 between the water-cooled condenser 3 and the accumulator 6. If the on-off valve V1 is set to the open state, the refrigerant F1 flows in the order of the compressor 1, the cockpit condenser 2, the first expansion valve VE1, the water-cooled condenser 3, the on-off valve V1, the accumulator 6, and the compressor 1. Hereinafter, the refrigerant circuit C composed of the compressor 1, the cockpit condenser 2, the water-cooled condenser 3, the on-off valve V1, and the accumulator 6 will be referred to as the "main circuit Cm".
[0015]
[0016] The first expansion valve VE1 and the second expansion valve VE2 expand the refrigerant F1 to adjust the pressure of the refrigerant F1. If the second expansion valve VE2 is set to the open state, the refrigerant F1 flows in the order of the second expansion valve VE2 and the evaporator 4, and then flows into the main circuit Cm between the on-off valve V1 and the accumulator 6. Hereinafter, the refrigerant circuit C branched from the main circuit Cm and provided with the second expansion valve VE2 and the evaporator 4 is referred to as the "first branch circuit Cb1". For example, when raising the temperature inside the vehicle compartment (during heating operation of the vehicle compartment), the on-off valve V1 is set to the open state, and the second expansion valve VE2 is set to the closed state. On the other hand, when lowering the temperature inside the vehicle compartment (during cooling operation of the vehicle compartment), the on-off valve V1 is set to the closed state, and the second expansion valve VE2 is set to the open state.
[0017] The battery cooler 5 includes an expansion valve, and the expansion valve of the battery cooler 5 is set to the open state when adjusting the temperature of the battery. If the expansion valve of the battery cooler 5 is set to the open state, the refrigerant F1 flows into the main circuit Cm between the on-off valve V1 and the accumulator 6 after flowing through the battery cooler 5. Hereinafter, the refrigerant circuit C branched from the main circuit Cm and provided with the battery cooler 5 is referred to as the "second branch circuit Cb2".
[0018] The compressor 1 compresses the refrigerant F1 to make the refrigerant F1 a high-temperature and high-pressure gas. Hereinafter, the temperature of the refrigerant F1 compressed by the compressor 1 is referred to as the first temperature. In addition, the first temperature is, for example, 80 degrees to 90 degrees.
[0019] The refrigerant F1 compressed by the compressor 1 is sent to the cockpit condenser 2, exchanges heat with the air inside the vehicle compartment during heating operation (absorbs heat and cools down), and is then sent to the water-cooled condenser 3 via the first expansion valve VE1. The first heat transfer agent F2 that circulates in a circuit different from the refrigerant circuit C (for example, a cooling circuit for cooling electronic circuits mounted on the vehicle, etc.) flows in the water-cooled condenser 3. The first heat transfer agent F2 is a long-life coolant (LLC) such as cooling water, an insulating oil such as paraffin, a refrigerant such as hydrofluorocarbon (HFC), or hydrofluoroolefin (HFO). The refrigerant F1 sent to the water-cooled condenser 3 exchanges heat with the first heat transfer agent F2 flowing in the water-cooled condenser 3 (absorbs heat and cools down). Hereinafter, the temperature of the refrigerant F1 cooled by the water-cooled condenser 3 is referred to as the second temperature. In addition, the second temperature is, for example, 15 degrees to 25 degrees.
[0020] The refrigerant F1 sent to the second expansion valve VE2 is expanded and becomes a state mixed with liquid and gas (misty state) and is sent to the evaporator 4. In the evaporator 4, the refrigerant F1 exchanges heat with the air introduced from the outside (absorbs heat and warms up) and vaporizes.
[0021] In addition, the refrigerant F1 supplied to the battery cooler 5 expands through the expansion valve of the battery cooler 5. A second refrigerant F3 circulating in another circuit different from the refrigerant circuit C (for example, a cooling circuit for cooling the battery mounted on a vehicle) flows into the battery cooler 5. The second refrigerant F3 is a coolant such as long-life coolant (LLC), an insulating oil such as a paraffin-based oil, a refrigerant such as hydrofluorocarbon (HFC), or hydrofluoroolefin (HFO). The refrigerant F1 supplied to the battery cooler 5 exchanges heat with the second refrigerant F3 flowing in the battery cooler 5 (absorbs heat and warms up), and then vaporizes. Hereinafter, the temperature of the refrigerant F1 after heat exchange in the evaporator 4 or the battery cooler 5 is referred to as the third temperature. In addition, the third temperature is, for example, 60 degrees to 70 degrees.
[0022] The refrigerant F1 after heat exchange in the evaporator 4 is supplied to the accumulator 6, and the liquid contained in the refrigerant F1 is separated. The refrigerant F1 from which the liquid has been separated returns to the compressor 1. In addition, the refrigerant F1 after heat exchange in the battery cooler 5 is also supplied to the accumulator 6, and the liquid contained in the refrigerant F1 is separated. The gaseous refrigerant F1 from which the liquid has been separated returns to the compressor 1.
[0023] As described above, the temperature of the refrigerant F1 circulating in the refrigerant circuit C changes. Specifically, for the temperature of the refrigerant F1, the first temperature of the refrigerant F1 from the compressor 1 toward the water-cooled condenser 3 is the highest, the third temperature of the refrigerant F1 from the evaporator 4 and / or the battery cooler 5 toward the compressor 1 is the second highest, and the second temperature of the refrigerant F1 from the water-cooled condenser 3 toward the evaporator 4 and / or the battery cooler 5 is the lowest. In addition, the temperature of the refrigerant F1 flowing from the water-cooled condenser 3 through the on-off valve V1 and merging with the main circuit Cm varies between the second temperature and the third temperature according to the operating conditions such as heating and cooling (becoming the second temperature at the lowest and the third temperature at the highest).
[0024] 〔Structure of the manifold〕
[0025] Next, with reference to Figure 2 the structure of the manifold 10 provided with the refrigerant flow path L will be described. Figure 2 FIG. is a diagram showing the structure of the flow path housing 11 of the manifold 10. The manifold 10 has, for example, a flow path housing 11 formed (for example, molded) using a metal material such as aluminum or a resin, and a plate member 13, and is constituted by joining the flow path housing 11 and the plate member 13. With reference to Figure 1 the refrigerant flow path L described is formed inside the flow path housing 11 (between the flow path housing 11 and the plate member 13). In addition, the manifold 10 is mounted on a vehicle.
[0026] As Figure 2As shown, the compressor 1, the cockpit condenser 2, the water-cooled condenser 3, the evaporator 4, the battery cooler 5, and the accumulator 6 are provided outside the flow path housing 11. In addition, the on-off valve V1, the first expansion valve VE1, and the second expansion valve VE2 are also provided outside the flow path housing 11. Further, in Figure 2 although the on-off valve V1, the first expansion valve VE1, and the second expansion valve VE2 are provided outside the flow path housing 11, they are shown by solid lines in order to indicate their respective positions.
[0027] In the present embodiment, the flow path housing 11 has a box shape with a rectangular plane (hereinafter referred to as the "main surface 11s"). The main surface 11s of the flow path housing 11 is rectangular, and a refrigerant flow path L is formed on the main surface 11s. Hereinafter, the four end portions constituting the flow path housing 11 are referred to as the "first end portion 12a" (the right end portion in the figure), the "second end portion 12b" (the left end portion in the figure), the "third end portion 12c" (the lower end portion in the figure), and the "fourth end portion 12d" (the upper end portion in the figure). In addition, the long side direction of the main surface 11s is simply referred to as the "long side direction", and the short side direction of the main surface 11s is simply referred to as the "short side direction".
[0028] The on-off valve V1, the first expansion valve VE1, and the second expansion valve VE2 are provided so as to overlap the flow path housing 11 when viewed in a direction orthogonal to the main surface 11s. Specifically, the on-off valve V1, the first expansion valve VE1, and the second expansion valve VE2 are provided on the side closer to the third end portion 12c (the lower side in the figure) than the midpoint Pm in the short side direction. In addition, the midpoint Pm is the center of the flow path housing 11 and is the point where the two diagonals of the flow path housing 11 intersect.
[0029] The first expansion valve VE1, the on-off valve V1, and the second expansion valve VE2 are arranged in this order from the first end portion 12a side (the right side in the figure) along the long side direction. Specifically, the first expansion valve VE1 is provided on the side closer to the first end portion 12a than the midpoint Pm in the long side direction, the on-off valve V1 is provided on the side closer to the midpoint Pm than the first expansion valve VE1 in the long side direction, and the second expansion valve VE2 is provided on the side closer to the second end portion 12b (the left side in the figure) than the midpoint Pm in the long side direction.
[0030] In the flow path housing 11, there is formed an outlet through which the refrigerant F1 flows out from the flow path housing 11 to the first expansion valve VE1, the on-off valve V1, and the second expansion valve VE2. Further, in the flow path housing 11, there is formed an inlet through which the refrigerant F1 flows into the flow path housing 11 from the first expansion valve VE1, the on-off valve V1, and the second expansion valve VE2. In addition, hereinafter, the outlet among the outlets formed in the flow path housing 11, through which the refrigerant F1 from the water-cooled condenser 3 flows out to the on-off valve V1, is referred to as "outlet H1", and the inlet among the inlets, through which the refrigerant F1 flows into the flow path housing 11 from the on-off valve V1, is referred to as "inlet H2". The outlet H1 and the inlet H2 are provided to face the on-off valve V1. Further, in the flow path housing 11, there are also formed a condenser outlet H3 (an example of a condenser outlet) through which the refrigerant F1 flows out toward the water-cooled condenser 3 and a condenser inlet H4 (an example of a condenser inlet) through which the refrigerant F1 flows into the flow path housing 11 from the water-cooled condenser 3. The condenser outlet H3 and the condenser inlet H4 are separated by a separation distance D1 in the long side direction.
[0031] 〔Structure of refrigerant flow path〕
[0032] As described with reference to Figure 1 for the temperature of the refrigerant F1, the first temperature of the refrigerant F1 from the compressor 1 toward the water-cooled condenser 3 is the highest, the third temperature of the refrigerant F1 from the evaporator 4 and / or the battery cooler 5 toward the compressor 1 is the second highest, and the second temperature of the refrigerant F1 from the water-cooled condenser 3 toward the evaporator 4 and / or the battery cooler 5 is the lowest. That is, the flow path housing 11 serves as a refrigerant flow path L (refer to Figure 1 ) and includes: a high-temperature flow path LH (an example of a first flow path) through which the high-temperature refrigerant F1 from the compressor 1 flows toward the cockpit condenser 2, a medium-temperature flow path LM (an example of a third flow path) through which the medium-temperature refrigerant F1 from the evaporator 4 and / or the battery cooler 5 flows toward the compressor 1, and a low-temperature flow path LL (an example of a second flow path) through which the low-temperature refrigerant F1 from the water-cooled condenser 3 flows toward the evaporator 4 and / or the battery cooler 5. Further, in the present embodiment, the flow path housing 11 also serves as a refrigerant flow path L and includes a medium-low temperature flow path LML through which the low-temperature to medium-temperature refrigerant F1 from the water-cooled condenser 3 flows toward the on-off valve V1.
[0033] The high-temperature flow path LH includes a first high-temperature flow path LH1 through which the refrigerant F1 from the compressor 1 flows toward the cockpit condenser 2 and a second high-temperature flow path LH2 through which the refrigerant F1 from the cockpit condenser 2 flows toward the water-cooled condenser 3.
[0034] The first high-temperature flow path LH1 extends from the first end portion 12a of the flow path housing 11 as a base end toward the second end portion 12b, bends toward the fourth end portion 12d, and reaches the fourth end portion 12d.
[0035] The second high-temperature flow path LH2 extends from the fourth end portion 12d (specifically, on the second end portion 12b side of the fourth end portion 12d that is closer to the second end portion 12b than the terminal of the first high-temperature flow path LH1) toward the third end portion 12c, passes through the first expansion valve VE1, bends toward the second end portion 12b, and reaches the third end portion 12c on the second end portion 12b side of the midpoint Pm in the long side direction.
[0036] The second high-temperature flow path LH2 is set such that the first end portion 12a side of the midpoint Pm in the long side direction straddles the on-off valve V1. The refrigerant F1 outlet H1 of the on-off valve V1 (the outlet H1 where the medium-low temperature refrigerant F1 from the water-cooled condenser 3 flows out from the flow path housing 11 to the on-off valve V1) is formed at a position in the position facing the on-off valve V1 that is far from the second high-temperature flow path LH2 (the portion straddled by the second high-temperature flow path LH2). In addition, an inlet H2 is provided between the outlet H1 and the portion straddled by the second high-temperature flow path LH2.
[0037] The medium-temperature flow path LM includes a first medium-temperature flow path LM1 through which the refrigerant F1 flows from the evaporator 4 toward the accumulator 6, a second medium-temperature flow path LM2 through which the refrigerant F1 flows from the battery cooler 5 toward the accumulator 6, and a confluence medium-temperature flow path LM3 that connects (merges the refrigerant F1) the first medium-temperature flow path LM1 and the second medium-temperature flow path LM2.
[0038] The first medium-temperature flow path LM1 extends from the fourth end portion 12d toward the third end portion 12c in a manner inclined with respect to the fourth end portion 12d (the farther away from the fourth end portion 12d, the farther away from the second end portion 12b), changes its orientation to be parallel to the second end portion 12b (including approximately parallel, the same hereinafter) on the fourth end portion 12d side of the midpoint Pm in the short side direction, and extends to the first bending point P1 (the fourth end portion 12d side of the medium-low temperature flow path LML). The first medium-temperature flow path LM1 bends toward the first end portion 12a at the first bending point P1 and reaches the confluence medium-temperature flow path LM3.
[0039] The second medium-temperature flow path LM2 extends from the fourth end portion 12d (specifically, on the first end portion 12a side of the fourth end portion 12d that is closer to the first end portion 12a than the base end of the first medium-temperature flow path LM1) toward the third end portion 12c and extends to the confluence medium-temperature flow path LM3 in parallel with the first medium-temperature flow path LM1.
[0040] The confluent medium-temperature flow path LM3 extends along the long side direction from the terminal of the first medium-temperature flow path LM1 toward the first end portion 12a, and is connected to the refrigerant flow path L that has passed through the on-off valve V1 from the water-cooled condenser 3 at the confluence point P2. The confluent medium-temperature flow path LM3 bends at the confluence point P2 toward the fourth end portion 12d, and extends toward the fourth end portion 12d along the short side direction. The confluent medium-temperature flow path LM3 further bends toward the first end portion 12a at the second bending point P3 (on the side closer to the fourth end portion 12d than the middle point Pm in the short side direction), extends along the long side direction, and reaches the first end portion 12a. In addition, the confluent medium-temperature flow path LM3 is arranged to straddle the high-temperature flow path LH between the second bending point P3 and the terminal.
[0041] The medium-low temperature flow path LML is a refrigerant flow path L through which the refrigerant F1 flows from the water-cooled condenser 3 toward the accumulator 6 via the on-off valve V1. The medium-low temperature flow path LML reaches the branch point P4 along the short side direction from the third end portion 12c (specifically, on the side closer to the second end portion 12b than the terminal of the second high-temperature flow path LH2) toward the fourth end portion 12d. The branch point P4 is the position where the refrigerant F1 from the water-cooled condenser 3 branches into the refrigerant F1 toward the on-off valve V1, the refrigerant F1 toward the evaporator 4, and the refrigerant F1 toward the second expansion valve VE2.
[0042] The medium-low temperature flow path LML bends at the branch point P4 toward the first end portion 12a, extends toward the first end portion 12a along the long side direction, and reaches the confluence point P2 with the confluent medium-temperature flow path LM3 via the on-off valve V1.
[0043] The low-temperature flow path LL includes a first low-temperature flow path LL1 through which the refrigerant F1 flows from the water-cooled condenser 3 toward the evaporator 4, and a second low-temperature flow path LL2 through which the refrigerant F1 flows from the water-cooled condenser 3 toward the battery cooler 5. In addition, in the present embodiment, the base ends of the first low-temperature flow path LL1 and the second low-temperature flow path LL2 are the branch point P4.
[0044] The first low-temperature flow path LL1 extends along the short side direction toward the fourth end portion 12d via the second expansion valve VE2, and changes its orientation in a manner inclined with respect to the fourth end portion 12d (the closer to the fourth end portion 12d, the closer to the second end portion 12b) on the side closer to the fourth end portion 12d than the middle point Pm in the short side direction, and reaches the second end portion 12b.
[0045] The second low-temperature flow path LL2 extends along the short side direction. The second low-temperature flow path LL2 changes its orientation in a manner inclined with respect to the fourth end portion 12d (the closer to the fourth end portion 12d, the closer to the second end portion 12b) on the side closer to the fourth end portion 12d than the bending point of the first low-temperature flow path LL1 in the short side direction, and reaches the corner portion between the second end portion 12b and the fourth end portion 12d.
[0046] 〔Region of the flow path housing〕
[0047] As Figure 2 shown, the main surface 11s of the flow path housing 11 is divided into regions each including the high-temperature flow path LH, the medium-temperature flow path LM, the medium-low-temperature flow path LML, and the low-temperature flow path LL. Specifically, the flow path housing 11 is divided into a high-temperature region RH (an example of the first region) including the high-temperature flow path LH, a medium-temperature region RM (an example of the third region) including the medium-temperature flow path LM, a medium-low-temperature region RML including the medium-low-temperature flow path LML, and a low-temperature region RL (an example of the second region) including the low-temperature flow path LL.
[0048] The high-temperature region RH (high-temperature flow path LH) is provided on the first end portion 12a side. Specifically, the high-temperature region RH is provided on the first end portion 12a side, extending from the fourth end portion 12d side to the third end portion 12c side. A part of the high-temperature region RH (the region on the third end portion 12c side) protrudes toward the second end portion 12b side. In addition, the size (area) of the protruding region RH1 where the high-temperature region RH protrudes is smaller than that of the other regions of the high-temperature region RH (hereinafter referred to as "main region RH2").
[0049] The low-temperature region RL is provided away from the high-temperature region RH. That is, the high-temperature flow path LH is provided away from the low-temperature flow path LL. Specifically, the high-temperature flow path LH and the low-temperature flow path LL are separated by a distance (hereinafter referred to as "separation distance D1") between the condenser flow outlet H3 and the condenser flow inlet H4 or more. In the present embodiment, the low-temperature region RL (low-temperature flow path LL) is provided on the second end portion 12b side. The low-temperature region RL is provided on the second end portion 12b side, extending from the fourth end portion 12d side to the third end portion 12c side, and a part of the third end portion 12c is recessed toward the second end portion 12b side.
[0050] A medium-low-temperature region RML and a medium-temperature region RM are provided between the low-temperature region RL and the high-temperature region RH. The medium-low-temperature region RML is provided on the third end portion 12c side with respect to the medium-temperature region RM. In other words, the medium-temperature region RM is provided on the fourth end portion 12d side with respect to the medium-low-temperature region RML.
[0051] A part of the medium-temperature region RM is disposed between the high-temperature region RH and the low-temperature region RL. The remaining part of the medium-temperature region RM is set to overlap with a part of the high-temperature region RH (a part of the main region). That is, a part of the medium-temperature flow path LM is disposed between the high-temperature flow path LH and the low-temperature flow path LL. In the present embodiment, a part of the medium-temperature flow path LM is disposed near the midpoint Pm (the midpoint in the long-side direction and the short-side direction) of the flow path housing 11 (an example of the central part). That is, the medium-temperature region RM includes an intermediate region RM1 disposed between the high-temperature flow path LH and the low-temperature flow path LL, and an overlapping region RM2 that overlaps with a part of the main region RH2 of the high-temperature region RH. In addition, the size of a part of the medium-temperature region RM (the intermediate region RM1 disposed between the high-temperature region RH and the low-temperature region RL) is larger than the size of the remaining part of the medium-temperature region RM (the overlapping region RM2 that overlaps with the high-temperature region RH).
[0052] 〔Effects of the Embodiment〕
[0053] As described above, according to the present embodiment, the high-temperature flow path LH (including the high-temperature region RH of the high-temperature flow path LH) through which the high-temperature refrigerant F1 flows from the compressor 1 toward the water-cooled condenser 3 is disposed on the first end portion 12a side of the flow path housing 11, and the low-temperature flow path LL (including the low-temperature region RL of the low-temperature flow path LL) through which the low-temperature refrigerant F1 flows from the water-cooled condenser 3 toward the evaporator 4 and / or the battery cooler 5 is disposed on the second end portion 12b side of the flow path housing 11. The high-temperature flow path LH and the low-temperature flow path LL are separated and disposed, so that heat exchange between the high-temperature refrigerant F1 and the low-temperature refrigerant F1 can be suppressed. For example, if heat exchange occurs between the high-temperature refrigerant F1 and the low-temperature refrigerant F1, there is a concern that thermal expansion and thermal contraction of the manifold 10 may occur, resulting in thermal stress. However, according to the present embodiment, heat exchange between the high-temperature refrigerant F1 and the low-temperature refrigerant F1 can be suppressed, and generation of thermal stress can also be suppressed.
[0054] In addition, according to the present embodiment, a part of the medium-temperature flow path LM through which the medium-temperature refrigerant F1 flows from the evaporator 4 and / or the battery cooler 5 toward the compressor 1 is disposed between the high-temperature flow path LH through which the high-temperature refrigerant F1 flows and the low-temperature flow path LL, so that heat exchange between the high-temperature refrigerant F1 and the low-temperature refrigerant F1 can be suppressed.
[0055] In addition, according to the present embodiment, at least a part of the medium-temperature flow path LM through which the medium-temperature refrigerant F1 flows is disposed in the central part of the flow path housing 11, so that heat exchange between the high-temperature refrigerant F1 and the low-temperature refrigerant F1 can be suppressed.
[0056] In addition, according to the present embodiment, the outlet H1 from which the medium- and low-temperature refrigerant F1 flows from the water-cooled condenser 3 to the on-off valve V1 is formed at a position of the flow path housing 11 facing the on-off valve V1 and away from the high-temperature flow path LH through which the high-temperature refrigerant F1 flows. Therefore, heat exchange between the medium- and low-temperature refrigerant F1 and the high-temperature refrigerant F1 can be suppressed.
[0057] 〔Other Embodiments〕
[0058] In addition to the above-described embodiments, the present invention may be configured as follows (components having the same functions as those in the embodiments are denoted by the same reference numerals).
[0059] (1) The configurations of the high-temperature flow path LH, the medium-temperature flow path LM, the medium- and low-temperature flow path LML, and the low-temperature flow path LL provided inside the manifold 10 (flow path housing 11) described in the above embodiment are examples. The configurations of the high-temperature flow path LH, the medium-temperature flow path LM, the medium- and low-temperature flow path LML, and the low-temperature flow path LL are not limited to those described in the above embodiment as long as the high-temperature flow path LH (high-temperature region RH) and the low-temperature flow path LL (low-temperature region RL) can be separated and provided.
[0060] (2) In addition, in the present embodiment, although the case where the flow path housing 11 has a box shape with a rectangular main surface 11s is described, the shape of the flow path housing 11 is not limited to the above shape and can be appropriately changed as long as the high-temperature flow path LH (high-temperature region RH) and the low-temperature flow path LL (low-temperature region RL) can be separated and provided. In this case, the structures of the high-temperature flow path LH, the medium-temperature flow path LM, the medium- and low-temperature flow path LML, and the low-temperature flow path LL formed inside the flow path housing 11 can also be appropriately changed according to the shape of the flow path housing 11.
[0061] (3) In addition, in the present embodiment, although the case where a part of the medium-temperature flow path LM is provided between the high-temperature flow path LH and the low-temperature flow path LL is described, the entire medium-temperature flow path LM may be provided between the high-temperature flow path LH and the low-temperature flow path LL. In this case, for example, referring to Figure 2 the merged medium-temperature flow path LM3 described may also be configured not to bend at the second bending point P3 but to reach the fourth end portion 12d and be connected to the accumulator 6 outside the flow path housing 11.
[0062] (4) In the present embodiment, although the refrigerant circuit C (second branch circuit Cb2) having the battery cooler 5 is described as an example, the refrigerant circuit C may include a cooler instead of the battery cooler 5. In addition, when the refrigerant circuit C includes a cooler instead of the battery cooler 5, the refrigerant circuit C further includes an expansion valve as the valve V between the water-cooled condenser 3 and the cooler.
[0063] In addition, the high-temperature region RH described in the present embodiment is a region including the entire first high-temperature flow path LH1 and the second high-temperature flow path LH2. The high-temperature region RH is, for example, a region surrounded by any one of the outer edges of the first high-temperature flow path LH1, the second high-temperature flow path LH2, and the flow path housing 11. The same applies to the medium-temperature region RM, the medium-low temperature region RML, and the low-temperature region RL. Specifically, the medium-temperature region RM is a region including the entire first medium-temperature flow path LM1 and the second medium-temperature flow path LM2. The medium-temperature region RM is, for example, a region surrounded by any one of the outer edges of the first medium-temperature flow path LM1, the second medium-temperature flow path LM2, and the flow path housing 11. The medium-low temperature region RML is also a region including the entire medium-low temperature flow path LML, and is, for example, a region surrounded by any one of the outer edges of the medium-low temperature flow path LML and the flow path housing 11. The low-temperature region RL is a region including the entire first low-temperature flow path LL1 and the second low-temperature flow path LL2. The low-temperature region RL is, for example, a region surrounded by any one of the outer edges of the first low-temperature flow path LL1, the second low-temperature flow path LL2, and the flow path housing 11.
[0064] In the above embodiment, the following structure can be considered.
[0065] (1) The manifold 10 of the present invention is characterized in the following aspects: it includes a flow path housing 11 having a high-temperature flow path LH (first flow path) through which the refrigerant F1 flows from the compressor 1 (compressor) toward the water-cooled condenser 3 (condenser), and a low-temperature flow path LL (second flow path) through which the refrigerant F1 flows from the water-cooled condenser 3 (condenser) toward the evaporator 4 and the battery cooler 5 (evaporator). The high-temperature flow path LH (first flow path) is provided on one end side of the flow path housing 11, and the low-temperature flow path LL (second flow path) is provided on the other end side of the flow path housing 11. The high-temperature flow path LH (first flow path) and the low-temperature flow path LL (second flow path) are separated and provided.
[0066] According to this structure, in the flow path housing 11, the high-temperature flow path LH (first flow path) through which the high-temperature refrigerant F1 flows from the compressor 1 (compressor) toward the water-cooled condenser 3 (condenser) is provided on one end side of the flow path housing 11, and the low-temperature flow path LL (second flow path) through which the low-temperature refrigerant F1 flows from the water-cooled condenser 3 (condenser) toward the evaporator 4 and the battery cooler 5 (evaporator) is provided on the other end side of the flow path housing 11. The high-temperature flow path LH (first flow path) and the low-temperature flow path LL (second flow path) are separated and provided, so that heat exchange between the high-temperature refrigerant F1 and the low-temperature refrigerant F1 can be suppressed.
[0067] (2) In the manifold 10 of (1), the high-temperature flow path LH (first flow path) and the low-temperature flow path LL (second flow path) may also be separated by a distance greater than the distance between the condenser outlet H3 (condenser outlet) from which the refrigerant F1 flowing out toward the water-cooled condenser 3 (condenser) exits and the condenser inlet H4 (condenser inlet) into which the refrigerant F1 from the water-cooled condenser 3 (condenser) flows.
[0068] According to this structure, since the high-temperature flow path LH and the low-temperature flow path LL are separated by a distance greater than the distance between the condenser outlet H3 and the condenser inlet H4 (hereinafter referred to as "separation distance D1"), heat exchange between the high-temperature refrigerant F1 and the low-temperature refrigerant F1 can be more reliably suppressed.
[0069] (3) In the manifold 10 of (1) or (2), one end and the other end may also be opposed to each other with the intermediate point Pm of the flow path housing 11 therebetween.
[0070] According to this structure, since one end and the other end are opposed to each other with the intermediate point Pm of the flow path housing 11 therebetween, heat exchange between the high-temperature refrigerant F1 and the low-temperature refrigerant F1 can be more reliably suppressed.
[0071] (4) In the manifold 10 of (3), when the flow path housing 11 is viewed in a direction orthogonal to the surface forming the high-temperature flow path LH (first flow path), it may be rectangular, and the intermediate point Pm may be an intermediate position in the long side direction of the flow path housing 11.
[0072] According to this structure, since the intermediate point Pm is an intermediate position in the long side direction of the rectangular flow path housing 11 and one end and the other end are opposed to each other with the intermediate point Pm of the flow path housing 11 therebetween, heat exchange between the high-temperature refrigerant F1 and the low-temperature refrigerant F1 can be more reliably suppressed.
[0073] (5) In any one of the manifolds 10 of (1) to (4), the flow path housing 11 in which the high-temperature flow path LH (first flow path) and the low-temperature flow path LL (second flow path) are formed inside may also be joined to the plate member 13.
[0074] According to this structure, a flow path through which the refrigerant F1 flows can be formed more simply.
[0075] (6) In any one of the manifolds 10 of (1) to (5), the high-temperature region RH (first region) including the high-temperature flow path LH (first flow path) may also include a protruding region RH1 protruding toward one side where the low-temperature region RL (second region) including the low-temperature flow path LL (second flow path) is provided; and a main region RH2 larger than the protruding region RH1 on one end side of the protruding region RH1.
[0076] According to this structure, the main region RH2 is larger than the protruding region RH1, so the heat exchange between the high-temperature refrigerant F1 and the low-temperature refrigerant F1 can be suppressed.
[0077] (7) In any one of the manifolds 10 in (1) to (6), the flow path housing 11 may further have an intermediate-temperature flow path LM (third flow path) through which the refrigerant F1 flows from the evaporator 4 and the battery cooler 5 (evaporator) toward the compressor 1 (compressor), and at least a part of the intermediate-temperature flow path LM (third flow path) may be provided between the high-temperature flow path LH (first flow path) and the low-temperature flow path LL (second flow path).
[0078] According to this structure, at least a part of the intermediate-temperature flow path LM (third flow path) through which the intermediate-temperature refrigerant F1 flows from the evaporator 4 and the battery cooler 5 (evaporator) toward the compressor 1 (compressor) is provided between the high-temperature flow path LH (first flow path) through which the high-temperature refrigerant F1 flows and the low-temperature flow path LL (second flow path) through which the low-temperature refrigerant F1 flows, so the heat exchange between the high-temperature refrigerant F1 and the low-temperature refrigerant F1 can be suppressed.
[0079] (8) In the manifold 10 in (7), at least a part of the intermediate-temperature flow path LM (third flow path) may also be provided in the central portion of the flow path housing 11.
[0080] According to this structure, at least a part of the intermediate-temperature flow path LM (third flow path) through which the intermediate-temperature refrigerant F1 flows from the evaporator 4 and the battery cooler 5 (evaporator) toward the compressor 1 (compressor) is provided in the central portion of the flow path housing 11, so the heat exchange between the high-temperature refrigerant F1 and the low-temperature refrigerant F1 can be suppressed.
[0081] (9) In the manifold 10 in (7) or (8), in the flow path housing 11, the intermediate-temperature region RM (third region) including the intermediate-temperature flow path LM (third flow path) may include an intermediate region RM1 provided between the high-temperature region RH (first region) including the high-temperature flow path LH (first flow path) and the low-temperature region RL (second region) including the low-temperature flow path LL (second flow path), and an overlapping region RM2 overlapping with the high-temperature region RH (first region), and the intermediate region RM1 may be larger than the overlapping region RM2 in size.
[0082] According to this structure, the intermediate region RM1 in the intermediate-temperature region RM (third region) including the intermediate-temperature flow path LM (third flow path) and provided between the high-temperature region RH (first region) including the high-temperature flow path LH (first flow path) and the low-temperature region RL (second region) including the low-temperature flow path LL (second flow path) is larger than the overlapping region RM2 overlapping with the high-temperature region RH (first region), so the heat exchange between the high-temperature refrigerant F1 and the low-temperature refrigerant F1 can be suppressed.
[0083] (10) In any one of the manifolds 10 in (1) to (9), an outlet port H1 through which the refrigerant F1 from the water-cooled condenser 3 (condenser) flows out from the flow path housing 11 to the on-off valve V1 may be formed in the flow path housing 11, and the outlet port H1 may be formed at a position away from the high-temperature flow path LH (first flow path) in the position facing the on-off valve V1.
[0084] According to this structure, the outlet port H1 through which the medium-low temperature refrigerant F1 from the water-cooled condenser 3 (condenser) flows out from the flow path housing 11 to the on-off valve V1 is formed at a position away from the high-temperature flow path LH (first flow path) through which the high-temperature refrigerant F1 flows in the position facing the on-off valve V1, so that heat exchange between the medium-low temperature refrigerant F1 and the high-temperature refrigerant F1 can be suppressed.
[0085] Industrial applicability
[0086] The present invention can be used for a manifold.
[0087] Explanation of reference numerals
[0088] 1: Compressor, 3: Water-cooled condenser (condenser), 4: Evaporator, 5: Battery cooler (evaporator), 10: Manifold, 11: Flow path housing, 12a: First end (one end), 12b: Second end (the other end), 13: Plate member, F1: Refrigerant, H1: Outlet port, H3: Condenser outlet port (condenser outlet port), H4: Condenser inlet port (condenser inlet port), L: Refrigerant flow path, LH: High-temperature flow path (first flow path), LL: Low-temperature flow path (second flow path), LM: Medium-temperature flow path (third flow path), Pm: Intermediate point, RH: High-temperature region (first region), RH1: Protruding region, RH2: Main region, RL: Low-temperature region (second region), RM: Medium-temperature region (third region), RM1: Intermediate region, RM2: Overlapping region, V1: On-off valve.
Claims
1. A manifold, comprising: A flow path housing having a first flow path through which refrigerant flows from a compressor toward a condenser and a second flow path through which the refrigerant flows from the condenser toward an evaporator, The first flow path is provided on one end side of the flow path housing, The second flow path is provided on the other end side of the flow path housing, The first flow path and the second flow path are provided separately.
2. The manifold according to claim 1, Wherein, The first flow path and the second flow path are separated by a distance greater than the distance between a condenser outlet through which the refrigerant flowing toward the condenser flows out and a condenser inlet through which the refrigerant from the condenser flows in.
3. The manifold according to claim 1 or 2, Wherein, The one end and the other end are opposed to each other with an intermediate point of the flow path housing therebetween.
4. The manifold according to claim 3, Wherein, The flow path housing is rectangular when viewed in a direction orthogonal to the plane forming the first flow path, The intermediate point is an intermediate position in the long side direction of the flow path housing.
5. The manifold according to claim 1 or 2, Wherein, The flow path housing in which the first flow path and the second flow path are formed inside is joined to a plate member.
6. The manifold according to claim 1 or 2, Wherein, A first region including the first flow path includes a protruding region protruding toward a side where a second region including the second flow path is provided; and a main region on the one end side of the protruding region and larger than the size of the protruding region.
7. The manifold according to claim 1 or 2, Wherein, The flow path housing further has a third flow path through which the refrigerant flows from the evaporator toward the compressor, At least a part of the third flow path is provided between the first flow path and the second flow path.
8. The manifold according to claim 7, Wherein, At least a part of the third flow path is provided in a central portion of the flow path housing.
9. The manifold according to claim 7, Wherein, In the flow path housing, a third region including the third flow path includes an intermediate region provided between a first region including the first flow path and a second region including the second flow path, and an overlapping region overlapping with the first region, The intermediate region is larger than the size of the overlapping region.
10. The manifold according to claim 1 or 2, Wherein, An outlet through which the refrigerant from the condenser flows out of the flow path housing is formed in the flow path housing, The outlet is formed at a position opposed to the on-off valve and away from the first flow path.
Citation Information
Patent Citations
Thermal management system with dual mode coolant loops
JP2011255879A