Electrochemical cell system with multi-chamber cooling device and method for producing same
By using a multi-chamber cooling device and a cooling fluid flow path in the electrochemical cell system, the safety hazards caused by heating of the electrochemical cell are solved, and effective heat removal and temperature gradient reduction are achieved.
Patent Information
- Application Number
- CN202380076329.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2022-12-16
- Filing Date
- 2023-12-15
- Publication Date
- 2025-06-10
AI Technical Summary
Heat in electrochemical cell units may cause material ignition and thermal decomposition, posing safety hazards.
An electrochemical cell system is designed, using a multi-chamber cooling device to maximize heat transfer from the electrochemical cell through the flow path of cooling fluid between the electrochemical cell. The system includes an electrochemical cell unit disposed on the outer surface of the heat transfer plate, and a structure for guiding the cooling fluid from the outer chamber to the inner chamber through the chamber return portion.
It effectively reduces the temperature gradient in the electrochemical cell system, reduces the risk of material ignition and thermal decomposition, and improves the safety of the system.
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Figure CN120129985A_ABST
Abstract
Description
[0001] Cross - reference to Related Applications
[0002] This application claims the priority and benefit of U.S. Provisional Patent Application No. 63 / 433,234, filed on December 16, 2022, and titled "Electrochemical Cell Systems with Multi - Chamber Cooling Devices, and Methods of Producing the Same", the disclosure of which is hereby incorporated by reference in its entirety. Technical Field
[0003] The embodiments described herein relate to heat transfer in electrochemical cell systems. Background Art
[0004] Heat generation in electrochemical cells is a safety concern that can have hazardous consequences. Heat dissipation can cause ignition and thermal decomposition of electrochemical cell materials. Heat can be removed from an electrochemical cell along its surface by an air or other gas flow, similar to how a fan is applied to a processor in a computer. The flow path of the flow can be designed to maximize heat transfer from the electrochemical cell. Summary of the Invention
[0005] The embodiments described herein relate to heat transfer plates and adjacent chambers for transferring heat away from an electrochemical cell. In some aspects, an electrochemical cell system can include a cooling device having: a first plate; a second plate coupled to the first plate to form a first outer chamber; a third plate coupled to the second plate to form an inner chamber; a fourth plate coupled to the third plate to form a second outer chamber; and a chamber return coupled to the first, second, third, and fourth plates and configured to direct a fluid flow from the first and second outer chambers to the inner chamber. The electrochemical cell system includes: a first electrochemical cell disposed on an outer surface of the first plate, and a second electrochemical cell disposed on an outer surface of the fourth plate. In some embodiments, the first plate and / or the fourth plate can include pits that cause turbulence in the fluid flowing through the first and / or second outer chambers. Brief Description of the Drawings
[0006] Figure 1 is a block diagram of an electrochemical cell system according to an embodiment.
[0007] Figures 2A to 2J is an illustration of a heat transfer device and its various components according to an embodiment.
[0008] Figures 3A to 3D is an illustration of a heat transfer device and its various components according to an embodiment.
[0009] Figures 4A to 4D is a diagram of a heat transfer device and its various components (according to one embodiment).
[0010] Figure 5 is a flowchart of a method for cooling an electrochemical cell unit system according to an embodiment. Detailed Description
[0011] The embodiments described herein relate to removing heat from electrochemical cell units and arrays of electrochemical cell units. Flow paths for a cooling fluid can be designed between arrays of electrochemical cell units to maximize the heat transferred away from the electrochemical cell units. A heat transfer device (e.g., a cooling device) can be positioned between two cell units or arrays of cell units, and the cooling fluid can flow through chambers in the heat transfer device. The heat transfer device can include an inlet port and an inlet chamber, as well as an outlet port and an outlet chamber. In some embodiments, a warming device can be positioned between two cell units or arrays of cell units.
[0012] Temperature gradients in electrochemical cell units and electrochemical cell unit systems can have an adverse effect on cell unit capacity and capacity retention. The embodiments described herein can reduce the temperature gradient in an electrochemical cell unit system. The embodiments described herein can include flowing a cold fluid into two side chambers such that the cold fluid contacts plates that contact the isothermal electrochemical cell units. In some embodiments, the side chambers can include turbulizers and / or pits, such as those described in U.S. Provisional Patent Application No. 63 / 416,774, titled “Heat Transfer Plates in Electrochemical Cell Systems, and Methods of Producing the Same” (“the ‘774 application”), which is hereby incorporated by reference in its entirety. The turbulizers and / or pits can increase turbulence in the cold fluid to enhance heat transfer from the electrochemical cell units to the cold fluid. The cold fluid becomes hot in the side chambers and becomes a warm liquid as it approaches the chamber return and reverses direction. After reversing direction, the fluid moves through an additional chamber between the two side chambers and exits the heat transfer device.
[0013] In some embodiments, if the electrochemical cell units are cold, a warming device can be positioned between two electrochemical cell units or arrays of electrochemical cell units. A hot fluid can be sent through two side chambers of the warming device and fed back through an additional chamber between the two side chambers to exit the warming device.
[0014] In some embodiments, the electrodes described herein may include conventional solid electrodes. In some embodiments, the solid electrodes may include a binder. In some embodiments, the electrodes described herein may include semi-solid electrodes. The semi-solid electrodes described herein may be made to be: (i) thicker (e.g., greater than 100 μm to at most 2,000 μm or even greater) due to the reduced tortuosity and higher electronic conductivity of the semi-solid electrodes, (ii) have a higher active material loading, and (iii) have a simplified manufacturing process that utilizes less equipment. These relatively thick semi-solid electrodes reduce the volume, mass, and cost contributions of the inactive components relative to the active components, thereby enhancing the commercial attractiveness of the batteries made from the semi-solid electrodes. In some embodiments, the semi-solid electrodes described herein are binder-free and / or do not use the binders used in conventional battery manufacturing. Instead, the volume in the electrode that is typically occupied by the binder in a conventional electrode is now occupied by: 1) an electrolyte, which serves to reduce tortuosity and increase the total salt available for ion diffusion, thereby offsetting the typical salt depletion effect of thick conventional electrodes when used at high rates, 2) an active material, which serves to increase the charge capacity of the battery, or 3) a conductive additive, which serves to increase the electronic conductivity of the electrode, thereby offsetting the high internal impedance of the thick conventional electrodes. The reduced tortuosity and higher electronic conductivity of the semi-solid electrodes described herein result in excellent rate performance and charge capacity of the electrochemical cell units formed from the semi-solid electrodes. Since the semi-solid electrodes described herein can be made much thicker than conventional electrodes, the ratio of active material (i.e., semi-solid cathode and / or anode) to inactive material (i.e., current collector and separator) in the batteries formed from stacks of electrochemical cell units including semi-solid electrodes may be much higher than in similar batteries formed from stacks of electrochemical cell units including conventional electrodes. This significantly increases the total charge capacity and energy density of the batteries including the semi-solid electrodes described herein.
[0015] In some embodiments, the electrode materials described herein can be flowable semi-solid or gelled liquid compositions. In some embodiments, the electrode materials described herein can be binder-free or substantially binder-free. The flowable semi-solid electrodes can comprise a suspension of electrochemically active materials (anode or cathode particles or microparticles) and optionally an electronically conductive material (e.g., carbon) in a non-aqueous liquid electrolyte. In other words, the active electrode particles and the conductive particles are co-suspended in the electrolyte to produce a semi-solid electrode. Examples of battery architectures utilizing semi-solid suspensions are described in International Patent Publication No. WO 2012 / 024499, entitled "Stationary, Fluid Redox Electrode" and International Patent Publication No. WO 2012 / 088442, entitled "Semi-Solid Filled Battery and Method of Manufacture", the entire disclosures of which are hereby incorporated by reference.
[0016] As used in this specification, unless the context clearly dictates otherwise, the singular forms "a", "an", and "the" include plural referents. Thus, for example, the term "member" is intended to mean a single member or a combination of members, and the term "material" is intended to mean one or more materials or combinations thereof.
[0017] When used in conjunction with "cylindrical", "linear", and / or other geometric relationships, the term "substantially" is intended to convey that the structure so qualified is nominally cylindrical, linear, etc. As an example, a portion of a support member described as "substantially linear" is intended to convey that while linearity of the portion is desired, some non-linearity may be present in the "substantially linear" portion. Such non-linearity can be produced by manufacturing tolerances or other practical considerations such as, for example, pressure or force applied to the support member. Thus, a geometric structure modified by the term "substantially" includes such geometric properties within a tolerance range of plus or minus 5% of the geometric structure. For example, a "substantially linear" portion is a portion where the linearity error defining an axis or centerline is within plus or minus 5%.
[0018] As used herein, the terms "group" and "plurality" can refer to multiple features or a single feature having multiple parts. For example, when referring to a group of electrodes, the group of electrodes can be considered as one electrode having multiple parts, or the group of electrodes can be considered as multiple different electrodes. Additionally, for example, when referring to a plurality of electrochemical cell units, the plurality of electrochemical cell units can be considered as multiple different electrochemical cell units or as one electrochemical cell unit having multiple parts. Thus, a group of parts or a plurality of parts can include multiple parts that are continuous or discontinuous with each other. A plurality of particles or a plurality of materials can also be made from multiple articles that are produced separately and then joined together (e.g., via mixing, adhesives, or any suitable method).
[0019] As used herein, the term "semi-solid" refers to a material that is a mixture of a liquid phase and a solid phase, such as a particle suspension, slurry, colloidal suspension, emulsion, gel, or micelle.
[0020] Figure 1 is a block diagram of an electrochemical cell unit system 100 according to an embodiment. As shown, the electrochemical cell unit system 100 includes a heat transfer device 110. The heat transfer device 110 includes a port block 112 coupled to plates 120a, 120b, 120c, 120d (collectively referred to as plates 120). The plates 120 are coupled to a chamber return 140. The port block 112 includes inlet ports 115a, 115b (collectively referred to as inlet ports 115) and an outlet port 150. A first inlet chamber 125a is formed between the first plate 120a and the second plate 120b. A second inlet chamber 125b is formed between the third plate 120c and the fourth plate 120d. An outlet chamber 127 is formed between the second plate 120b and the third plate 120c. Electrochemical cell units 160 are disposed on either side of the heat transfer device 110, and heat is transferred between the electrochemical cell units 160 and the heat transfer device 110.
[0021] In use, a heat transfer fluid (i.e., a cooling fluid or a heating fluid) flows through the inlet ports 115 and into the inlet chambers 125a, 125b (collectively referred to as inlet chambers 125). The heat transfer fluid flows through the inlet chambers 125, and the heat transfer fluid flow is combined into the outlet chamber 127 via the chamber return 140. Then, the heat transfer fluid flows through the outlet chamber 127 and out of the heat transfer device 110 via the outlet port 150.
[0022] As shown, the inlet port 115 and the outlet port 150 are incorporated into the port block 112. The heat transfer fluid enters and exits the heat transfer device 110 via the port block 112. In some embodiments, the heat transfer fluid may include a gas. In some embodiments, the heat transfer fluid may include a liquid. In some embodiments, the heat transfer fluid may include air. In some embodiments, the heat transfer fluid may include an inert gas such as nitrogen, argon, helium, carbon dioxide, or any combination thereof. In some embodiments, the heat transfer fluid may include a liquid that does not react with lithium. In some embodiments, the heat transfer fluid may include a non-aqueous electrolyte solvent.
[0023] In some embodiments, the heat transfer fluid may include a cooling fluid. In some embodiments, the heat transfer fluid may include a heating fluid. In some embodiments, upon entering the inlet port 115, the temperature of the heat transfer fluid may be at least about -50°C, at least about -40°C, at least about -30°C, at least about -20°C, at least about -10°C, at least about 0°C, at least about 10°C, at least about 20°C, at least about 30°C, at least about 40°C, at least about 50°C, at least about 60°C, at least about 70°C, at least about 80°C, at least about 90°C, at least about 100°C, at least about 110°C, at least about 120°C, at least about 130°C, at least about 140°C, at least about 150°C, at least about 160°C, at least about 170°C, at least about 180°C, or at least about 190°C. In some embodiments, upon entering the inlet port 115, the temperature of the heat transfer fluid may be no more than about 200°C, no more than about 190°C, no more than about 180°C, no more than about 170°C, no more than about 160°C, no more than about 150°C, no more than about 140°C, no more than about 130°C, no more than about 120°C, no more than about 110°C, no more than about 100°C, no more than about 90°C, no more than about 80°C, no more than about 70°C, no more than about 60°C, no more than about 50°C, no more than about 40°C, no more than about 30°C, no more than about 20°C, no more than about 10°C, no more than about 0°C, no more than about -10°C, no more than about -20°C, no more than about -30°C, or no more than about -40°C. Combinations of the temperatures mentioned above are also possible (e.g., at least about -50°C and no more than about 200°C, or at least about 20°C and no more than about 60°C), including all values and ranges therebetween. In some embodiments, upon entering the inlet port 115, the temperature of the heat transfer fluid may be about -50°C, about -40°C, about -30°C, about -20°C, about -10°C, about 0°C, about 10°C, about 20°C, about 30°C, about 40°C, about 50°C, about 60°C, about 70°C, about 80°C, about 90°C, about 100°C, about 110°C, about 120°C, about 130°C, about 140°C, about 150°C, about 160°C, about 170°C, about 180°C, about 190°C, or about 200°C.
[0024] In some embodiments, upon exiting the outlet port 150, the temperature of the heat transfer fluid can be at least about -50 °C, at least about -40 °C, at least about -30 °C, at least about -20 °C, at least about -10 °C, at least about 0 °C, at least about 10 °C, at least about 20 °C, at least about 30 °C, at least about 40 °C, at least about 50 °C, at least about 60 °C, at least about 70 °C, at least about 80 °C, at least about 90 °C, at least about 100 °C, at least about 110 °C, at least about 120 °C, at least about 130 °C, at least about 140 °C, at least about 150 °C, at least about 160 °C, at least about 170 °C, at least about 180 °C, or at least about 190 °C. In some embodiments, upon exiting the outlet port 150, the temperature of the heat transfer fluid can be no more than about 200 °C, no more than about 190 °C, no more than about 180 °C, no more than about 170 °C, no more than about 160 °C, no more than about 150 °C, no more than about 140 °C, no more than about 130 °C, no more than about 120 °C, no more than about 110 °C, no more than about 100 °C, no more than about 90 °C, no more than about 80 °C, no more than about 70 °C, no more than about 60 °C, no more than about 50 °C, no more than about 40 °C, no more than about 30 °C, no more than about 20 °C, no more than about 10 °C, no more than about 0 °C, no more than about -10 °C, no more than about -20 °C, no more than about -30 °C, or no more than about -40 °C. Combinations of the temperatures mentioned above are also possible (e.g., at least about -50 °C and no more than about 200 °C, or at least about 20 °C and no more than about 60 °C), including all values and ranges therebetween. In some embodiments, upon exiting the outlet port 150, the temperature of the heat transfer fluid can be about -50 °C, about -40 °C, about -30 °C, about -20 °C, about -10 °C, about 0 °C, about 10 °C, about 20 °C, about 30 °C, about 40 °C, about 50 °C, about 60 °C, about 70 °C, about 80 °C, about 90 °C, about 100 °C, about 110 °C, about 120 °C, about 130 °C, about 140 °C, about 150 °C, about 160 °C, about 170 °C, about 180 °C, about 190 °C, or about 200 °C.
[0025] In some embodiments, the magnitude of (the temperature of the heat transfer fluid entering inlet port 115) – (the temperature of the heat transfer fluid exiting outlet port 150) can be at least about -50 °C, at least about -40 °C, at least about -30 °C, at least about -20 °C, at least about -10 °C, at least about 0 °C, at least about 10 °C, at least about 20 °C, at least about 30 °C, at least about 40 °C, at least about 50 °C, at least about 60 °C, at least about 70 °C, at least about 80 °C, or at least about 90 °C. In some embodiments, the magnitude of (the temperature of the heat transfer fluid entering inlet port 115) – (the temperature of the heat transfer fluid exiting outlet port 150) can be no more than about 100 °C, no more than about 90 °C, no more than about 80 °C, no more than about 70 °C, no more than about 60 °C, no more than about 50 °C, no more than about 40 °C, no more than about 30 °C, no more than about 20 °C, no more than about 10 °C, no more than about 0 °C, no more than about -10 °C, no more than about -20 °C, no more than about -30 °C, or no more than about -40 °C. Combinations of the magnitudes mentioned above are also possible (e.g., at least about -50 °C and no more than about 100 °C, or at least about 10 °C and no more than about 60 °C), including all values and ranges therebetween. In some embodiments, the magnitude of (the temperature of the heat transfer fluid entering inlet port 115) – (the temperature of the heat transfer fluid exiting outlet port 150) can be about -50 °C, about -40 °C, about -30 °C, about -20 °C, about -10 °C, about 0 °C, about 10 °C, about 20 °C, about 30 °C, about 40 °C, about 50 °C, about 60 °C, about 70 °C, about 80 °C, about 90 °C, or about 100 °C.
[0026] In some embodiments, inlet port 115 and / or outlet port 150 can have a smooth inner surface. In some embodiments, inlet port 115 and / or outlet port 150 can have grooves, bumps, and / or pits to make the heat transfer fluid turbulent and enhance heat transfer. In some embodiments, inlet port 115 and / or outlet port 150 can have a circular shape, rectangular shape, square shape, oval shape, slot shape, or any other suitable shape or combination thereof. In some embodiments, inlet port 115 and / or outlet port 150 can follow a straight path. In some embodiments, inlet port 115 and / or outlet port 150 can follow a tortuous path.
[0027] As shown, the inlet port 115 and the inlet chamber 125 are located on the outer side of the heat transfer device 110 and extend along the length of the heat transfer device 110. The heat transfer fluid moves along the inlet chamber 125 while contacting the plate 120. The plate 120 contacts the electrochemical cell unit 160. In some embodiments, the heat transfer fluid may carry away heat from the plate 120, which carries away heat from the electrochemical cell unit 160. In some embodiments, the heat transfer fluid may heat the plate 120, which heats the electrochemical cell unit 160. In some embodiments, the plate 120 may include pits, such as those described in the '774 application.
[0028] The inlet chamber 125 interacts with the chamber return 140 and redirects the fluid path of the heat transfer fluid to the outlet chamber 127. The inlet chamber 125 is fluidly coupled to the outlet chamber 127 via the chamber return 140. In some embodiments, the outlet chamber 140 may have a rounded surface to direct the fluid flow into the outlet chamber 127.
[0029] In some embodiments, the heat transfer fluid may be fed into the heat transfer device 110 via the outlet port 150 (i.e., the outlet port 150 may act as an inlet port). Then, the heat transfer fluid may flow through the outlet chamber 127 (i.e., the outlet chamber 127 may act as an inlet chamber). Then, the heat transfer fluid may reverse direction via the chamber return 140 and flow through the inlet chamber 125 (i.e., the inlet chamber 125 may act as an outlet chamber) and then out of the heat transfer device 110 via the inlet port 115 (i.e., the inlet port 115 may act as an outlet port).
[0030] Figures 2A to 2JFIG. 0 is a diagrammatic illustration of a heat transfer device 210 according to an embodiment. As shown, the heat transfer device 210 includes a port block 212 having inlet ports 215a, 215b (collectively inlet ports 215) and an outlet port 250. The port block 212 is coupled to plates 220a, 220b, 220c, 220d (collectively plates 220). Plates 220a and 220b define an inlet chamber 225a therebetween. Plates 220c and 220d define an inlet chamber 225b therebetween. Plates 220b and 220c define an outlet chamber 227 therebetween. Each of the plates 220 includes a ridge 221. The ridge 221 includes a contact surface for contact between the plates 220. Plates 220a and 220d include pits 222 thereon to induce turbulence in the inlet chambers 225a, 225b (collectively inlet chamber 225). The plates 220 are coupled to a chamber return 240. The chamber return 240 includes a curved surface 242 for directing a heat transfer fluid flow from the inlet chamber 225 to the outlet chamber 227. The heat transfer fluid exits the heat transfer device 210 via the outlet port 250. In some embodiments, the heat transfer device 210, port block 212, inlet ports 215, plates 220, inlet chamber 225, outlet chamber 227, chamber return 240, and outlet port 250 may be the same as or substantially similar to the heat transfer device 110, port block 112, inlet ports 115, plates 120, inlet chamber 125, outlet chamber 127, chamber return 140, and outlet port 150 described above with reference to Figure 1 The heat transfer device 210, port block 212, inlet ports 215, plates 220, inlet chamber 225, outlet chamber 227, chamber return 240, and outlet port 250 are not described in more detail herein.
[0031] Figure 2A FIG. 6 shows an auxiliary view of the heat transfer device 210 as viewed from the outside. Figure 2B FIG. 8 shows a view of the proximal end of the heat transfer device 210, where the inlet ports 215 and the outlet port 250 are visible. Figure 2C FIG. 10 shows a view of a portion of the heat transfer device 210 as viewed from the proximal end thereof, where the port block 212 has been removed to show more details of the inlet chamber 225 and the outlet chamber 227. Figure 2D FIG. 12 shows the plate 220d with the ridge 221 and the pits 222. Figure 2E FIG. 14 shows the plate 220c with the ridge 221 and without the pits 222. Figure 2F FIG. 16 shows a detailed view of the chamber return 242 having a curved surface for directing a heat transfer fluid flow from the inlet chamber 225 to the outlet chamber 227. Figure 2G FIG. 18 shows a transparent view of the port block 212 such that details of the inlet ports 215 and the outlet port 250 and their interaction with the inlet chamber 225 and the outlet chamber 227 are visible. Figure 2HShows a view of port block 212 as seen from the distal side of port block 212, with portions of inlet port 215 and outlet port 250 visible. Figure 2I Shows a detailed view of outlet port 250, with threads 252 visible. Figure 2J Shows a cross-sectional view of heat transfer device 210, with the flow path of the heat transfer fluid visible.
[0032] As shown, inlet port 215 and outlet port 250 include threads 252 for coupling to a fluid feed device (not shown). In some embodiments, the diameter of inlet port 215 can be at least about 1 mm, at least about 2 mm, at least about 3 mm, at least about 4 mm, at least about 5 mm, at least about 6 mm, at least about 7 mm, at least about 8 mm, at least about 9 mm, at least about 1 cm, at least about 1.5 cm, at least about 2 cm, at least about 2.5 cm, at least about 3 cm, at least about 3.5 cm, at least about 4 cm, or at least about 4.5 cm. In some embodiments, the diameter of inlet port 215 can be no more than about 5 cm, no more than about 4.5 cm, no more than about 4 cm, no more than about 3.5 cm, more than about 3 cm, no more than about 2.5 cm, no more than about 2 cm, no more than about 1.5 cm, no more than about 1 cm, no more than about 9 mm, no more than about 8 mm, no more than about 7 mm, no more than about 6 mm, no more than about 5 mm, no more than about 4 mm, no more than about 3 mm, or no more than about 2 mm. Combinations of the diameters mentioned above are also possible (e.g., at least about 1 mm and no more than about 5 mm, or at least about 5 mm and no more than about 3 cm), including all values and ranges therebetween. In some embodiments, the diameter of inlet port 215 can be about 1 mm, about 2 mm, about 3 mm, about 4 mm, about 5 mm, about 6 mm, about 7 mm, about 8 mm, about 9 mm, about 1 cm, about 1.5 cm, about 2 cm, about 2.5 cm, about 3 cm, about 3.5 cm, about 4 cm, about 4.5 cm, or about 5 cm.
[0033] In some embodiments, the diameter of the outlet port 250 can be at least about 2 mm, at least about 3 mm, at least about 4 mm, at least about 5 mm, at least about 6 mm, at least about 7 mm, at least about 8 mm, at least about 9 mm, at least about 1 cm, at least about 1 cm, at least about 2 cm, at least about 2 cm, at least about 3 cm, at least about 3 cm, at least about 4 cm, at least about 5 cm, at least about 6 cm, at least about 7 cm, at least about 8 cm, or at least about 9 cm. In some embodiments, the diameter of the outlet port 250 can be no more than about 10 cm, no more than about 9 cm, no more than about 8 cm, no more than about 7 cm, no more than about 6 cm, no more than about 5 cm, no more than about 4 cm, no more than about 3 cm, no more than about 2 cm, no more than about 1 cm, no more than about 9 mm, no more than about 8 mm, no more than about 7 mm, no more than about 6 mm, no more than about 5 mm, no more than about 4 mm, or no more than about 3 mm. Combinations of the diameters mentioned above are also possible (e.g., at least about 2 mm and no more than about 10 cm, or at least about 8 mm and no more than about 4 cm), including all values and ranges therebetween. In some embodiments, the diameter of the outlet port 250 can be about 2 mm, about 3 mm, about 4 mm, about 5 mm, about 6 mm, about 7 mm, about 8 mm, about 9 mm, about 1 cm, about 2 cm, about 3 cm, about 4 cm, about 5 cm, about 6 cm, about 7 cm, about 8 cm, about 9 cm, or about 10 cm.
[0034] As shown, the outlet port 250 is aligned parallel to the inlet port 215 such that the heat transfer fluid exiting the outlet port 250 exits the heat transfer device and thus flows in a direction opposite to the heat transfer fluid entering the inlet port 215. In other words, the centerline axially extending from the outlet port 250 is parallel to the centerline axially extending from the inlet port 215. In some embodiments, the angle formed by the centerline axially extending from the outlet port 250 and the centerline axially extending from the inlet port 215 can be about 5 °C, about 10 °C, about 15 °C, about 20 °C, about 25 °C, about 30 °C, about 35 °C, about 40 °C, about 45 °C, about 50 °C, about 55 °C, about 60 °C, about 65 °C, about 70 °C, about 75 °C, about 80 °C, about 85 °C, or about 90 °C, including all values and ranges therebetween.
[0035] As shown, inlet port 215a is oriented parallel to inlet port 215b. In some embodiments, the angle formed by the centerline axially extending from inlet port 215a and the centerline axially extending from inlet port 215b can be about 5°, about 10°, about 15°, about 20°, about 25°, about 30°, about 35°, about 40°, about 45°, about 50°, about 55°, about 60°, about 65°, about 70°, about 75°, about 80°, about 85°, or about 90°, including all values and ranges therebetween. As shown, inlet port 215 and outlet port 250 are incorporated into a single surface of port block 212. In some embodiments, inlet port 215 can be incorporated into a first surface of port block 212, and outlet port 250 can be incorporated into a second surface of port block 212. In some embodiments, the second surface can be perpendicular or substantially perpendicular to the first surface.
[0036] In some embodiments, heat transfer device 210 can include a fluid distributor (not shown) that distributes heat transfer fluid over the entire height of heat transfer device 210 as the heat transfer fluid enters heat transfer device 210. Upon entering inlet port 215, the heat transfer fluid can be at least partially confined to a vertical position within heat transfer device 210 where the heat transfer fluid initially enters heat transfer device 210. This can cause a temperature gradient within heat transfer device 210 and adjacent electrochemical cell units that can negatively impact the energy capacity of the electrochemical cell units. The fluid distributor can distribute the heat transfer fluid as it enters into heat transfer device 210. In some embodiments, the fluid distributor can include one or more posts or protrusions attached to the inner wall of plate 220 that direct the flow path of the heat transfer fluid as it enters heat transfer device 210. In some embodiments, the fluid distributor can include one or more posts or protrusions attached to the inner wall of port block 212.
[0037] In some embodiments, the thickness of the 220 plate can be at least about 100 μm, at least about 200 μm, at least about 300 μm, at least about 400 μm, at least about 500 μm, at least about 600 μm, at least about 700 μm, at least about 800 μm, at least about 900 μm, at least about 1 mm, at least about 2 mm, at least about 3 mm, at least about 4 mm, at least about 5 mm, at least about 6 mm, at least about 7 mm, at least about 8 mm, at least about 9 mm, at least about 1 cm, at least about 2 cm, at least about 3 cm, or at least about 4 cm. In some embodiments, the thickness of the plate 220 can be no more than about 5 cm, no more than about 4 cm, no more than about 3 cm, no more than about 2 cm, no more than about 1 cm, no more than about 9 mm, no more than about 8 mm, no more than about 7 mm, no more than about 6 mm, no more than about 5 mm, no more than about 4 mm, no more than about 3 mm, no more than about 2 mm, no more than about 1 mm, no more than about 900 μm, no more than about 800 μm, no more than about 700 μm, no more than about 600 μm, no more than about 500 μm, no more than about 400 μm, no more than about 300 μm, or no more than about 200 μm. Combinations of the above-mentioned thicknesses are also possible (e.g., at least about 100 μm and no more than about 5 cm, or at least about 500 μm and no more than about 5 mm), including all values and ranges therebetween. In some embodiments, the thickness of the plate 220 can be about 100 μm, about 200 μm, about 300 μm, about 400 μm, about 500 μm, about 600 μm, about 700 μm, about 800 μm, about 900 μm, about 1 mm, about 2 mm, about 3 mm, about 4 mm, about 5 mm, about 6 mm, about 7 mm, about 8 mm, about 9 mm, about 1 cm, about 2 cm, about 3 cm, about 4 cm, or about 5 cm.
[0038] In some embodiments, the material of the plate 220 can be metal, alloy, ceramic, composite material, polymer, or a combination thereof. In some embodiments, the material of the plate 220 can include metal matrix composite material, cermet composite material, or carbon composite material. In some embodiments, the material of the plate 220 can include carbon steel, copper, nickel, copper-nickel alloy (90 / 10 copper-nickel alloy, 80 / 20 copper-nickel alloy, 70 / 30 copper-nickel alloy), Inconel, Incoloy, Admiralty Brass, stainless steel (304 / L stainless steel, 316 / L stainless steel, 317 / L stainless steel, 321 / L stainless steel), duplex steel, alloy 20 (nickel-chromium-molybdenum), Monel 400, Hastelloy B, Hastelloy C, titanium, aluminum, nickel 200, Al-6XN super austenitic stainless steel, brass (70Cu-30 Zn), aluminum brass (76Cu-22Zn-2Al), red brass (85Cu-15Zn), carbon molybdenum (0.5Mo), chrome molybdenum steel, lead, zinc, tungsten, silicon carbide, aluminum nitride, graphite, polypropylene, or a combination thereof.
[0039] In some embodiments, the thermal conductivity of the material of the plate 220 can be at least about 0.1 W / m-K, at least about 0.5 W / m-K, 1 W / m-K, at least about 5 W / m-K, 10 W / m-K, at least about 50 W / m-K, 100 W / m-K, at least about 500 W / m-K, at least about 1,000 W / m-K, or at least about 2,500 W / m-K. In some embodiments, the thermal conductivity of the material of the plate 220 can be no more than about 5,000 W / m-K, no more than about 2,500 W / m-K, no more than about 1,000 W / m-K, no more than about 500 W / m-K, no more than about 100 W / m-K, no more than about 50 W / m-K, no more than about 10 W / m-K, no more than about 5 W / m-K, no more than about 1 W / m-K, or no more than about 0.5 W / m-K.
[0040] In some embodiments, the length of the inlet chamber 225 (i.e., the distance from the port block 212 to the chamber return 240) can be at least about 2 cm, at least about 3 cm, at least about 4 cm, at least about 5 cm, at least about 6 cm, at least about 7 cm, at least about 8 cm, at least about 9 cm, at least about 10 cm, at least about 20 cm, at least about 30 cm, at least about 40 cm, at least about 50 cm, at least about 60 cm, at least about 70 cm, at least about 80 cm, at least about 90 cm, at least about 1 m, at least about 1.5 m, at least about 2 m, at least about 2.5 m, at least about 3 m, at least about 3.5 m, at least about 4 m, or at least about 4.5 m. In some embodiments, the length of the inlet chamber 225 can be no more than about 5 m, no more than about 4.5 m, no more than about 4 m, no more than about 3.5 m, no more than about 3 m, no more than about 2.5 m, no more than about 2 m, no more than about 1.5 m, no more than about 1 m, no more than about 90 cm, no more than about 80 cm, no more than about 70 cm, no more than about 60 cm, no more than about 50 cm, no more than about 40 cm, no more than about 30 cm, no more than about 20 cm, no more than about 10 cm, no more than about 9 cm, no more than about 8 cm, no more than about 7 cm, no more than about 6 cm, no more than about 5 cm, no more than about 4 cm, or no more than about 2 cm. Combinations of the above-mentioned lengths of the inlet chamber 225 are also possible (e.g., at least about 2 cm and no more than about 5 m, or at least about 5 cm and no more than about 2 m), including all values and ranges therebetween. In some embodiments, the length of the inlet chamber 225 can be about 2 cm, about 3 cm, about 4 cm, about 5 cm, about 6 cm, about 7 cm, about 8 cm, about 9 cm, about 10 cm, about 20 cm, about 30 cm, about 40 cm, about 50 cm, about 60 cm, about 70 cm, about 80 cm, about 90 cm, about 1 m, about 1.5 m, about 2 m, about 2.5 m, about 3 m, about 3.5 m, about 4 m, about 4.5 m, or about 5 m.
[0041] In some embodiments, the width of the inlet chamber 225 (i.e., the distance between the plates 220) can be at least about 100 μm, at least about 200 μm, at least about 300 μm, at least about 400 μm, at least about 500 μm, at least about 600 μm, at least about 700 μm, at least about 800 μm, at least about 900 μm, at least about 1 mm, at least about 2 mm, at least about 3 mm, at least about 4 mm, at least about 5 mm, at least about 6 mm, at least about 7 mm, at least about 8 mm, at least about 9 mm, at least about 1 cm, at least about 2 cm, at least about 3 cm, at least about 4 cm, at least about 5 cm, at least about 6 cm, at least about 7 cm, at least about 8 cm, or at least about 9 cm. In some embodiments, the width of the inlet chamber 225 can be no more than about 10 cm, no more than about 9 cm, no more than about 8 cm, no more than about 7 cm, no more than about 6 cm, no more than about 5 cm, no more than about 4 cm, no more than about 3 cm, no more than about 2 cm, no more than about 1 cm, no more than about 9 mm, no more than about 8 mm, no more than about 7 mm, no more than about 6 mm, no more than about 5 mm, no more than about 4 mm, no more than about 3 mm, no more than about 2 mm, no more than about 1 mm, no more than about 900 μm, no more than about 800 μm, no more than about 700 μm, no more than about 600 μm, no more than about 500 μm, no more than about 400 μm, no more than about 300 μm, or no more than about 200 μm. Combinations of the widths mentioned above are also possible (e.g., at least about 100 μm and no more than about 10 cm, or at least about 1 mm and no more than about 1 cm), including all values and ranges therebetween. In some embodiments, the width of the inlet chamber 225 can be about 100 μm, about 200 μm, about 300 μm, about 400 μm, about 500 μm, about 600 μm, about 700 μm, about 800 μm, about 900 μm, about 1 mm, about 2 mm, about 3 mm, about 4 mm, about 5 mm, about 6 mm, about 7 mm, about 8 mm, about 9 mm, about 1 cm, about 2 cm, about 3 cm, about 4 cm, about 5 cm, about 6 cm, about 7 cm, about 8 cm, about 9 cm, or about 10 cm.
[0042] In some embodiments, the aspect ratio of the length to the width of the inlet chamber 225 can be at least about 2, at least about 3, at least about 4, at least about 5, at least about 6, at least about 7, at least about 8, at least about 9, at least about 10, at least about 20, at least about 30, at least about 40, at least about 50, at least about 60, at least about 70, at least about 80, at least about 90, at least about 100, at least about 200, at least about 300, at least about 400, at least about 500, at least about 600, at least about 700, at least about 800, at least about 900, at least about 1,000, or at least about 1,500. In some embodiments, the aspect ratio of the length to the width of the inlet chamber 225 can be no more than about 2,000, no more than about 1,500, no more than about 1,000, no more than about 900, no more than about 800, no more than about 700, no more than about 600, no more than about 500, no more than about 400, no more than about 300, no more than about 200, no more than about 100, no more than about 90, no more than about 80, no more than about 70, no more than about 60, no more than about 50, no more than about 40, no more than about 30, no more than about 20, no more than about 10, no more than about 9, no more than about 8, no more than about 7, no more than about 6, no more than about 5, no more than about 4, or no more than about 3. Combinations of the above-mentioned aspect ratios are also possible (e.g., at least about 2 and no more than about 2,000, or at least about 50 and no more than about 500), including all values and ranges therebetween. In some embodiments, the aspect ratio of the length to the width of the inlet chamber 225 can be about 2, about 3, about 4, about 5, about 6, about 7, about 8, about 9, about 10, about 20, about 30, about 40, about 50, about 60, about 70, about 80, about 90, about 100, about 200, about 300, about 400, about 500, about 600, about 700, about 800, about 900, about 1,000, about 1,500, or about 2,000.
[0043] The outlet chamber 227 extends along the length of the inlet chamber 225. In some embodiments, the length of the outlet chamber 227 (i.e., the distance from the port block 212 to the chamber return 240) can be at least about 2 cm, at least about 3 cm, at least about 4 cm, at least about 5 cm, at least about 6 cm, at least about 7 cm, at least about 8 cm, at least about 9 cm, at least about 10 cm, at least about 20 cm, at least about 30 cm, at least about 40 cm, at least about 50 cm, at least about 60 cm, at least about 70 cm, at least about 80 cm, at least about 90 cm, at least about 1 m, at least about 1.5 m, at least about 2 m, at least about 2.5 m, at least about 3 m, at least about 3.5 m, at least about 4 m, or at least about 4.5 m. In some embodiments, the length of the outlet chamber 227 can be no more than about 5 m, no more than about 4.5 m, no more than about 4 m, no more than about 3.5 m, no more than about 3 m, no more than about 2.5 m, no more than about 2 m, no more than about 1.5 m, no more than about 1 m, no more than about 90 cm, no more than about 80 cm, no more than about 70 cm, no more than about 60 cm, no more than about 50 cm, no more than about 40 cm, no more than about 30 cm, no more than about 20 cm, no more than about 10 cm, no more than about 9 cm, no more than about 8 cm, no more than about 7 cm, no more than about 6 cm, no more than about 5 cm, no more than about 4 cm, or no more than about 2 cm. Combinations of the above-mentioned lengths of the outlet chamber 227 are also possible (e.g., at least about 2 cm and no more than about 5 m, or at least about 5 cm and no more than about 2 m), including all values and ranges therebetween. In some embodiments, the length of the outlet chamber 227 can be about 2 cm, about 3 cm, about 4 cm, about 5 cm, about 6 cm, about 7 cm, about 8 cm, about 9 cm, about 10 cm, about 20 cm, about 30 cm, about 40 cm, about 50 cm, about 60 cm, about 70 cm, about 80 cm, about 90 cm, about 1 m, about 1.5 m, about 2 m, about 2.5 m, about 3 m, about 3.5 m, about 4 m, about 4.5 m, or about 5 m.
[0044] In some embodiments, the width of the outlet chamber 227 (i.e., the distance between the plates 220) can be at least about 100 μm, at least about 200 μm, at least about 300 μm, at least about 400 μm, at least about 500 μm, at least about 600 μm, at least about 700 μm, at least about 800 μm, at least about 900 μm, at least about 1 mm, at least about 2 mm, at least about 3 mm, at least about 4 mm, at least about 5 mm, at least about 6 mm, at least about 7 mm, at least about 8 mm, at least about 9 mm, at least about 1 cm, at least about 2 cm, at least about 3 cm, at least about 4 cm, at least about 5 cm, at least about 6 cm, at least about 7 cm, at least about 8 cm or at least about 9 cm. In some embodiments, the width of the outlet chamber 227 can be no more than about 10 cm, no more than about 9 cm, no more than about 8 cm, no more than about 7 cm, no more than about 6 cm, no more than about 5 cm, no more than about 4 cm, no more than about 3 cm, no more than about 2 cm, no more than about 1 cm, no more than about 9 mm, no more than about 8 mm, no more than about 7 mm, no more than about 6 mm, no more than about 5 mm, no more than about 4 mm, no more than about 3 mm, no more than about 2 mm, no more than about 1 mm, no more than about 900 μm, no more than about 800 μm, no more than about 700 μm, no more than about 600 μm, no more than about 500 μm, no more than about 400 μm, no more than about 300 μm or no more than about 200 μm. Combinations of the widths mentioned above are also possible (e.g., at least about 100 μm and no more than about 10 cm, or at least about 1 mm and no more than about 1 cm), including all values and ranges therebetween. In some embodiments, the width of the outlet chamber 227 can be about 100 μm, about 200 μm, about 300 μm, about 400 μm, about 500 μm, about 600 μm, about 700 μm, about 800 μm, about 900 μm, about 1 mm, about 2 mm, about 3 mm, about 4 mm, about 5 mm, about 6 mm, about 7 mm, about 8 mm, about 9 mm, about 1 cm, about 2 cm, about 3 cm, about 4 cm, about 5 cm, about 6 cm, about 7 cm, about 8 cm, about 9 cm or about 10 cm.
[0045] In some embodiments, the aspect ratio of the length to the width of the exit chamber 227 can be at least about 2, at least about 3, at least about 4, at least about 5, at least about 6, at least about 7, at least about 8, at least about 9, at least about 10, at least about 20, at least about 30, at least about 40, at least about 50, at least about 60, at least about 70, at least about 80, at least about 90, at least about 100, at least about 200, at least about 300, at least about 400, at least about 500, at least about 600, at least about 700, at least about 800, at least about 900, at least about 1,000, or at least about 1,500. In some embodiments, the aspect ratio of the length to the width of the exit chamber 227 can be no more than about 2,000, no more than about 1,500, no more than about 1,000, no more than about 900, no more than about 800, no more than about 700, no more than about 600, no more than about 500, no more than about 400, no more than about 300, no more than about 200, no more than about 100, no more than about 90, no more than about 80, no more than about 70, no more than about 60, no more than about 50, no more than about 40, no more than about 30, no more than about 20, no more than about 10, no more than about 9, no more than about 8, no more than about 7, no more than about 6, no more than about 5, no more than about 4, or no more than about 3. Combinations of the aforementioned aspect ratios are also possible (e.g., at least about 2 and no more than about 2,000, or at least about 50 and no more than about 500), including all values and ranges therebetween. In some embodiments, the aspect ratio of the length to the width of the exit chamber 227 can be about 2, about 3, about 4, about 5, about 6, about 7, about 8, about 9, about 10, about 20, about 30, about 40, about 50, about 60, about 70, about 80, about 90, about 100, about 200, about 300, about 400, about 500, about 600, about 700, about 800, about 900, about 1,000, about 1,500, or about 2,000.
[0046] Figures 3A to 3DIllustrated is a heat transfer device 310 according to an embodiment and various components thereof. As shown, the heat transfer device 310 includes a port block 312 with inlet ports 315a, 315b (collectively referred to as inlet port 315) and an outlet port 350. The port block 312 is coupled to plates 320a, 320b, 320c, 320d (collectively referred to as plates 320). Plates 320a and 320b form an inlet chamber 325a therebetween. Plates 320c and 320d form an inlet chamber 325b therebetween. Plates 320b and 320c form an outlet chamber 327 therebetween. Each of the plates 320 includes ridges 321. The ridges 321 include contact surfaces for contact between the plates 320. Plates 320a and 320d include pits 322 therein to induce turbulence in the inlet chambers 325a, 325b (collectively referred to as inlet chamber 325). The plates 320 are coupled to a chamber return portion 340. The chamber return portion 340 includes a curved surface 342 for guiding the flow of heat transfer fluid from the inlet chamber 325 to the outlet chamber 327. The outlet chamber 327 includes a curved surface 328 to guide the heat transfer fluid out of the heat transfer device 310 via the outlet port 350. The heat transfer fluid exits the heat transfer device 310 through the outlet port 350. In some embodiments, the heat transfer device 310, port block 312, inlet port 315, plates 320, ridges 321, pits 322, inlet chamber 325, outlet chamber 327, chamber return portion 340, curved surface 342 and outlet port 350 may be the same as or substantially similar to the heat transfer device 210, port block 212, inlet port 215, plates 220, ridges 221, pits 222, inlet chamber 225, outlet chamber 227, chamber return portion 240, curved surface 242 and outlet port 250 described above with reference to Figures 2A to 2J The heat transfer device 210, port block 212, inlet port 215, plates 220, ridges 221, pits 222, inlet chamber 225, outlet chamber 227, chamber return portion 240, curved surface 242 and outlet port 250. Accordingly, certain aspects of the heat transfer device 310, port block 312, inlet port 315, plates 320, ridges 321, pits 322, inlet chamber 325, outlet chamber 327, chamber return portion 340, curved surface 342 and outlet port 350 are not described in more detail herein.
[0047] Figure 3A An auxiliary view of the heat transfer device 310 is shown. Figure 3B A transparent view of the heat transfer device 310 is shown such that the fluid flow path through the heat transfer device 310 is visible. Figure 3C The negative space between the components of the heat transfer device 310 is shown. Figure 3D A cross-sectional view of the heat transfer device 310 is shown in which the flow path of the heat transfer fluid is visible.
[0048] As shown, the inlet port 315 is incorporated into the first surface of the port block 312, and the outlet port 350 is incorporated into the second surface of the port block 312. As shown, the second surface is substantially perpendicular to the first surface. Such an orientation can be employed in an electrochemical cell unit system in which a heat transfer fluid enters the heat transfer device 310 from a first container and exits the heat transfer device 310 into a second container. This may be beneficial for keeping the incoming heat transfer fluid separate from the outgoing heat transfer fluid.
[0049] In some embodiments, the angle formed between the inlet port 315 and the outlet port 350 can be at least about 45°, at least about 50°, at least about 55°, at least about 60°, at least about 65°, at least about 70°, at least about 75°, at least about 80°, at least about 85°, at least about 90°, at least about 95°, at least about 100°, at least about 105°, at least about 110°, at least about 115°, at least about 120°, at least about 125°, or at least about 130°. In some embodiments, the angle formed between the inlet port 315 and the outlet port 350 can be no more than about 135°, no more than about 130°, no more than about 125°, no more than about 120°, no more than about 115°, no more than about 110°, no more than about 105°, no more than about 100°, no more than about 95°, no more than about 90°, no more than about 85°, no more than about 80°, no more than about 75°, no more than about 70°, no more than about 65°, no more than about 60°, no more than about 55°, or no more than about 50°. Combinations of the angles mentioned above are also possible (e.g., at least about 45° and no more than about 135°, or at least about 80° and no more than about 100°), including all values and ranges therebetween. In some embodiments, the angle formed between the inlet port 315 and the outlet port 350 can be about 45°, about 50°, about 55°, about 60°, about 65°, about 70°, about 75°, about 80°, about 85°, about 90°, about 95°, about 100°, about 105°, about 110°, about 115°, about 120°, about 125°, about 130°, or about 135°.
[0050] As shown, the inlet port 315 is a long slit having width and height dimensions that are substantially the same as those of the inlet chamber 315. In some embodiments, the height dimension of the inlet port 315 can be about 10%, about 20%, about 30%, about 40%, about 50%, about 60%, about 70%, about 80%, or about 90% of the height dimension of the inlet chamber 325. In some embodiments, the width dimension of the inlet port 315 can be about 10%, about 20%, about 30%, about 40%, about 50%, about 60%, about 70%, about 80%, or about 90% of the width dimension of the inlet chamber 325.
[0051] As shown, the outlet chamber 327 is coupled to the outlet port 350 via the curved surface 328. The curved surface 328 guides the flow of the heat transfer fluid as it exits the heat transfer device 310. As shown, the outlet port 350 has a slot shape. In some embodiments, the length of the outlet port 350 (i.e., the dimension along the direction of travel of the heat transfer fluid) can be at least about 1 mm, at least about 2 mm, at least about 3 mm, at least about 4 mm, at least about 5 mm, at least about 6 mm, at least about 7 mm, at least about 8 mm, at least about 9 mm, at least about 1 cm, at least about 2 cm, at least about 3 cm, at least about 4 cm, at least about 5 cm, at least about 6 cm, at least about 7 cm, at least about 8 cm, at least about 9 cm, at least about 10 cm, at least about 15 cm, at least about 20 cm, at least about 25 cm, at least about 30 cm, at least about 35 cm, at least about 40 cm, or at least about 45 cm. In some embodiments, the length of the outlet port 350 can be no more than about 50 cm, no more than about 45 cm, no more than about 40 cm, no more than about 35 cm, no more than about 30 cm, no more than about 25 cm, no more than about 20 cm, no more than about 15 cm, no more than about 10 cm, no more than about 9 mm, no more than about 8 mm, no more than about 7 mm, no more than about 6 mm, no more than about 5 mm, no more than about 4 mm, no more than about 3 mm, or no more than about 2 mm. Combinations of the lengths mentioned above are also possible (e.g., at least about 1 mm and no more than about 50 cm, or at least about 5 mm and no more than about 10 cm), including all values and ranges therebetween. In some embodiments, the length of the outlet port 350 (i.e., the dimension along the direction of travel of the heat transfer fluid) can be about 1 mm, about 2 mm, about 3 mm, about 4 mm, about 5 mm, about 6 mm, about 7 mm, about 8 mm, about 9 mm, about 1 cm, about 2 cm, about 3 cm, about 4 cm, about 5 cm, about 6 cm, about 7 cm, about 8 cm, about 9 cm, about 10 cm, about 15 cm, about 20 cm, about 25 cm, about 30 cm, about 35 cm, about 40 cm, about 45 cm, or about 50 cm.
[0052] In some embodiments, the length of the outlet port 350 can be at least about 1%, at least about 2%, at least about 3%, at least about 4%, at least about 5%, at least about 6%, at least about 7%, at least about 8%, at least about 9%, at least about 10%, at least about 15%, at least about 20%, at least about 25%, at least about 30%, at least about 35%, at least about 40%, at least about 45%, at least about 50%, at least about 55%, at least about 60%, at least about 65%, at least about 70%, or at least about 75% of the total length of the heat transfer device 310. In some embodiments, the length of the outlet port 350 can be no more than about 80%, no more than about 75%, no more than about 70%, no more than about 65%, no more than about 55%, no more than about 50%, no more than about 45%, no more than about 40%, no more than about 35%, no more than about 30%, no more than about 25%, no more than about 20%, no more than about 15%, no more than about 10%, no more than about 9%, no more than about 8%, no more than about 7%, no more than about 6%, no more than about 5%, no more than about 4%, no more than about 3%, or no more than about 2% of the total length of the heat transfer device 310. Combinations of the percentages mentioned above are also possible (e.g., at least about 1% and no more than about 80%, or at least about 10% and no more than about 60%), including all values and ranges therebetween. In some embodiments, the length of the outlet port 350 can be about 1%, about 2%, about 3%, about 4%, about 5%, about 6%, about 7%, about 8%, about 9%, about 10%, about 15%, about 20%, about 25%, about 30%, about 35%, about 40%, about 45%, about 50%, about 55%, about 60%, about 65%, about 70%, about 75%, or about 80% of the total length of the heat transfer device 310.
[0053] Figures 4A to 4DFigure (according to one embodiment) of the heat transfer device 410 and its various components. As shown, the heat transfer device 410 includes a port block 412 with an inlet port 415 that is split into sub-inlet ports 415a, 415b via a splitter 416. The port block 412 also includes an outlet port 450. The port block 412 is coupled to plates 420a, 420b, 420c, 420d (collectively referred to as plates 420). An inlet chamber 425a is formed between plates 420a and 420b. An inlet chamber 425b is formed between plates 420c and 420d. An outlet chamber 427 is formed between plates 420b and 420c. Each of the plates 420 includes ridges 421. The ridges 421 include contact surfaces for contact between the plates 420. Plates 420a and 420d include pits 422 therein to induce turbulence in the inlet chambers 425a, 425b (collectively referred to as inlet chambers 425). The plates 420 are coupled to a chamber return 440. The chamber return 440 includes a curved surface 442 for guiding the flow of heat transfer fluid from the inlet chambers 425 to the outlet chamber 427. The outlet chamber 427 includes a curved surface 428 through which heat transfer fluid can be guided from the heat transfer device 410 through the outlet port 450. The heat transfer fluid exits the heat transfer device 410 through the outlet port 450. In some embodiments, the heat transfer device 410, port block 312, sub-inlet ports 415a, 415b, plates 420, ridges 421, pits 422, inlet chambers 425, outlet chamber 427, curved surface 428, chamber return 440, curved surface 442, and outlet port 450 may be the same as or substantially similar to the heat transfer device 310, port block 312, inlet ports 315a, 315b, plates 320, ridges 321, pits 322, inlet chambers 325, outlet chamber 327, curved surface 328, chamber return 340, curved surface 342, and outlet port 350 described above with reference to Figures 3A to 3D The heat transfer device 310, port block 312, inlet ports 315a, 315b, plates 320, ridges 321, pits 322, inlet chambers 325, outlet chamber 327, curved surface 328, chamber return 340, curved surface 342, and outlet port 350. Accordingly, certain aspects of the heat transfer device 410, port block 412, sub-inlet ports 415a, 415b, plates 420, ridges 421, pits 422, inlet chambers 425, outlet chamber 427, curved surface 428, chamber return 440, curved surface 442, and outlet port 450 are not described in more detail herein.
[0054] Figure 4A An auxiliary view of the heat transfer device 410 is shown. Figure 4B A transparent view of the heat transfer device 410 is shown, so the visible fluid flow path is through the heat transfer device 410. Figure 4C The negative space between the components of the heat transfer device 410 is shown. Figure 4D A cross-sectional view of the heat transfer device 410 is shown, and the flow path of the flowing fluid is visible.
[0055] In use, a heat transfer fluid flows into the heat transfer device 410 via the inlet port 415 and splits into the sub-inlet ports 415a, 415b upon contact with the diverter 416. The heat transfer fluid then enters the inlet chamber 425 via the sub-inlets 415a, 415b and flows towards the outlet chamber 427 via the chamber return 440. The heat transfer fluid then exits the heat transfer device 410 via the outlet port 450. As shown, the diverter 416 shapes the outlet port 450. In other words, the outlet port 450 has an angled surface corresponding to the shape of the diverter 416. The material of the heat transfer device 410 has sharp surfaces on both the inlet and outlet sides. In some embodiments, the material of the heat transfer device 410 may be rounded or smoother on the outlet side.
[0056] Figure 5 is a flow chart of a method 500 for cooling an electrochemical cell unit system according to an embodiment. As shown, the method 500 includes flowing a heat transfer fluid through an inlet port at step 501, flowing the heat transfer fluid through a plurality of flow paths along a plate in physical contact with the electrochemical cell unit at step 502, converging the heat transfer fluid flows into a common flow path at step 503, flowing the heat transfer fluid along the common flow path at step 504, and discharging the heat transfer fluid from an outlet port fluidly coupled to the common flow path at step 505.
[0057] Step 501 includes flowing a heat transfer fluid through an inlet port. In some embodiments, the heat transfer fluid may include a cooling fluid. In some embodiments, the heat transfer fluid may include a heating fluid. In some embodiments, step 501 may include flowing the heat transfer fluid through a plurality of inlet ports. In some embodiments, step 501 may include splitting the heat transfer fluid into a plurality of flow paths upon entering the inlet port.
[0058] Step 502 includes flowing the heat transfer fluid through a plurality of flow paths along a plate in physical contact with the electrochemical cell unit. When the heat transfer fluid is a cooling fluid, it removes heat from the electrochemical cell unit. When the heat transfer fluid is a heating fluid, it transfers heat to the electrochemical cell unit. Step 503 includes converging the heat transfer fluid flows into a common flow path. In some embodiments, the convergence may be via the chamber return.
[0059] Step 504 includes flowing a heat transfer fluid along a common flow path. The common flow path can be formed by a plate. In some embodiments, the common flow path can be between the plurality of flow paths mentioned in step 502. In some embodiments, the fluid can flow along the common flow path in a direction opposite to the direction in which the fluid flows during step 502. Step 505 includes discharging the heat transfer fluid from an outlet port of the fluid coupled to the common flow path. In some embodiments, the outlet port can be integrated into the same surface as the inlet port mentioned in step 501. In some embodiments, the outlet port can be integrated into a different surface from the inlet port mentioned in step 501.
[0060] Various concepts can be implemented as one or more methods, and at least one example has been provided. The actions performed as part of a method can be ordered in any suitable manner. Thus, embodiments can be constructed in which the actions are performed in an order different from the order shown, which can include performing some actions simultaneously, even if the actions are shown as sequential actions in the illustrative embodiments. In other words, it should be understood that such features are not necessarily limited to a particular order of execution, but can be performed serially, asynchronously, concurrently, in parallel, simultaneously, synchronously, and / or in any number of threads, processes, services, servers, and / or the like in a manner consistent with the present disclosure. Thus, some of these features may be contradictory because these features cannot exist in a single embodiment simultaneously. Similarly, some features apply to one aspect of the innovation and not to other aspects.
[0061] Furthermore, the present disclosure can include other innovations not currently described. The applicant reserves all rights to such innovations, including the right to embody such innovations, file additional applications, continuations, partial continuations, divisional applications, and / or the like. Thus, it should be understood that the advantages, embodiments, examples, functions, features, logic, operations, organizations, structures, topologies, and / or other aspects of the present disclosure should not be considered as limitations on the present disclosure as defined by the embodiments or on the equivalents of the embodiments. Depending on the specific expectations and / or characteristics of individual and / or enterprise users, database configurations and / or relational models, data types, data transmissions, and / or network architectures, syntactic structures, and / or the like, the various embodiments of the technologies disclosed herein can be implemented in a manner that achieves a great deal of flexibility and customization as described herein.
[0062] All definitions as defined and used herein should be understood to control dictionary definitions, definitions in incorporated-by-reference documents, and / or the ordinary meaning of defined terms.
[0063] As used herein, in certain embodiments, the term "about" or "approximately" when preceding a numerical value means a range of plus or minus 10% of that value. Where a range of values is provided, it is understood that each intervening value (to one-tenth of the unit of the lower limit) between the upper and lower limits of the stated range, as well as any other stated value or intervening value within the stated range, is encompassed within the present disclosure. The upper and lower limits of these smaller ranges can independently be included in the smaller ranges and are also encompassed within the present disclosure, subject to any specific exclusionary limitations within the stated range. Where the range includes one or both of the limits, ranges excluding either or both of those included limits are also included in the present disclosure.
[0064] The phrase "and / or" as used herein in the specification and examples should be understood to mean "either or both" of the elements so conjoined, i.e., elements that coexist in some cases and separate in other cases. Multiple elements listed with "and / or" should be construed in the same manner, i.e., "one or more" of the elements so conjoined. Except for the elements specifically identified by the "and / or" clause, other elements may optionally exist, whether related or unrelated to the specifically identified elements. Thus, as a non-limiting example, when used in conjunction with open-ended language such as "comprising", a reference to "A and / or B" can mean: in one embodiment, only A (optionally including elements other than B); in another embodiment, only B (optionally including elements other than A); in yet another embodiment, both A and B (optionally including other elements); and so on.
[0065] As used herein in the specification and examples, "or" should be understood to have the same meaning as "and / or" as defined above. For example, when separating items in a list, "or" or "and / or" should be interpreted as inclusive, i.e., including at least one element of a plurality of elements or a list of elements, but also including more than one element, and optionally additional unlisted items. Only terms specifically stating the contrary such as "only one of..." or "exactly one of..." or when used in the examples, "consisting of..." will refer to including exactly one element of a plurality of elements or a list of elements. In general, when preceded by exclusive terms such as "any one of", "one of...", "only one of...", or "exactly one of...", the term "or" as used herein should be interpreted only to indicate exclusive alternatives (i.e., "one or the other, but not both"). "Consisting essentially of..." when used in the examples should have the ordinary meaning as used in the field of patent law.
[0066] As used herein in the specification and examples, the phrase "at least one" with respect to a list of one or more elements should be understood to mean at least one element selected from any one or more of the elements in the list of elements, but not necessarily including at least one of each particular element listed within the list of elements, and not excluding any combinations of elements in the list of elements. This definition also allows that, optionally, elements may exist in addition to those specifically identified within the list of elements to which the phrase "at least one" refers, whether related or unrelated to those specifically identified elements. Thus, as a non-limiting example, "at least one of A and B" (or equivalently "at least one of A or B", or equivalently "at least one of A and / or B") can mean: in one embodiment, at least one (optionally including more than one) A, with no B present (and optionally including elements other than B); in another embodiment, at least one (optionally including more than one) B, with no A present (and optionally including elements other than A); in yet another embodiment, at least one (optionally including more than one) A and at least one (optionally including more than one) B (and optionally including other elements); and so on.
[0067] In the examples and in the foregoing specification, all transitional phrases such as "comprising", "including", "carrying", "having", "containing", "involving", "holding", "constituting", etc. should be understood to be open-ended, i.e., meaning including but not limited to. As set forth in section 2111.03 of the United States Patent and Trademark Office's Manual of Patent Examining Procedure, only the transitional phrases "consisting of" and "consisting essentially of" should be closed or semi-closed transitional phrases, respectively.
[0068] Although specific embodiments of the present disclosure have been outlined above, many alternatives, modifications, and variations will be apparent to those skilled in the art. Accordingly, the embodiments set forth herein are intended to be illustrative and not limiting. Various changes can be made without departing from the spirit and scope of the present disclosure. In cases where the above methods and steps indicate that specific events occur in a particular order, those of ordinary skill in the art who benefit from the present disclosure will recognize that the order of the specific steps can be modified, and such modifications are variations of the present invention. Additionally, as described above, where possible, some of the steps described may be carried out simultaneously in parallel processes and in sequence. Specific embodiments have been shown and described, but it should be understood that various changes in form and detail can be made.
Claims
1. An electrochemical cell unit system, which comprises: a heat transfer device, which comprises: a first plate; a second plate coupled to the first plate to form a first outer chamber; a third plate coupled to the second plate to form an inner chamber; a fourth plate coupled to the third plate to form a second outer chamber; and a chamber return portion coupled to the first plate, the second plate, the third plate, and the fourth plate, the chamber return portion being configured to direct a fluid flow from the first outer chamber and the second outer chamber to the inner chamber; a first electrochemical cell unit disposed on an outer surface of the first plate; and a second electrochemical cell unit disposed on an outer surface of the fourth plate.
2. The electrochemical cell unit system according to claim 1, wherein at least one of the first plate or the fourth plate comprises pits configured to cause turbulence in a fluid flowing through the first outer chamber and / or the second outer chamber.
3. The electrochemical cell unit system according to claim 1, which further comprises: at least one additional electrochemical cell unit disposed on the outer surface of the first plate; and at least one additional electrochemical cell unit disposed on the outer surface of the second plate.
4. The electrochemical cell unit system according to claim 1, which further comprises: a first inlet port fluidly coupled to the first outer chamber; a second inlet port fluidly coupled to the second outer chamber; and an outlet port fluidly coupled to the inner chamber.
5. The electrochemical cell unit system according to claim 4, wherein at least one of the first inlet port, the second inlet port, and the third inlet port comprises grooves configured to cause turbulence.
6. The electrochemical cell according to claim 4, wherein the first inlet port, the second inlet port, and the outlet port are each integrated into a port block, the port block being coupled to the first plate, the second plate, the third plate, and the fourth plate.
7. The electrochemical cell unit according to claim 6, wherein the outlet port is substantially orthogonal to the first inlet port and the second inlet port.
8. The electrochemical cell unit system according to claim 1, wherein the chamber return portion comprises two curved surfaces configured to direct the fluid flow.
9. The electrochemical cell according to claim 1, which further comprises: a diverter configured to divide a fluid flow between the first outer chamber and the second outer chamber.
10. A cooling device, which comprises: a first plate; a second plate coupled to the first plate to form a first outer chamber; a third plate coupled to the second plate to form an inner chamber; a fourth plate coupled to the third plate to form a second outer chamber; and a chamber return portion having a curved surface, the chamber return portion being coupled to the first plate, the second plate, the third plate, and the fourth plate and being configured to direct a cooling fluid flow from the first outer chamber and the second outer chamber to the inner chamber.
11. The cooling device according to claim 10, wherein at least one of the first plate or the fourth plate includes pits configured to cause turbulence in the fluid flowing through the first outer chamber and / or the second outer chamber.
12. The cooling device according to claim 10 or claim 11, wherein the first outer chamber has a first width, the second outer chamber has a second width, and the inner chamber has a third width, the third width being greater than the first width and the second width.
13. The cooling device according to any one of claims 10 to 12, wherein the first plate is coupled to the second plate via a ridge extending from the first plate.
14. The cooling device according to any one of claims 10 to 13, wherein the fourth plate is coupled to the third plate via a ridge extending from the fourth plate.
15. A method, which comprises: causing a first heat transfer fluid to flow through a first flow path along a first plate, and causing a second heat transfer fluid to flow through a second flow path along a second plate, the first plate being in physical contact with a first electrochemical cell unit and the second plate being in physical contact with a second electrochemical cell unit; causing the heat transfer fluid in the first flow path to converge with the heat transfer fluid in the second flow to form a combined flow; causing the combined flow to flow along a common flow path; and discharging the heat transfer fluid from an outlet port fluidly coupled to the common flow path.
16. The method according to claim 15, which further comprises: causing a precursor heat transfer fluid to flow through an inlet port; and dividing the precursor heat transfer fluid flow into the first heat transfer fluid flow and the second heat transfer fluid flow.
17. The method according to claim 15 or claim 16, wherein the heat transfer fluid comprises an inert gas.
18. The method according to claim 16 or claim 17, wherein the inlet port is substantially orthogonal to the outlet port.
19. The method according to any one of claims 15 to 18, wherein each of the first flow path and the second flow path includes a turbulator.
20. The method according to any one of claims 15 to 19, wherein the first plate is in physical contact with a first plurality of electrochemical cell units and the second plate is in physical contact with a second plurality of electrochemical cell units.
Citation Information
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