Ultrasonic imaging system and equipment

Abstract

The invention provides an ultrasonic imaging system and device, and relates to the technical field of medical instruments.The ultrasonic imaging system comprises a system interface module and an ultrasonic imaging catheter, and one end of the system interface module is connected with a host; one end, far away from the system interface module, of the ultrasonic imaging catheter comprises a sheathing canal and a sheathing canal component, and the sheathing canal component comprises a main control chip, a flexible conduction structure and at least two ultrasonic transducers; the ultrasonic transducer and the flexible conduction structure are connected with the first connecting part and the second connecting part of the main control chip respectively to realize signal conduction, so that the main control chip is connected to the system interface module, the overall size and weight can be reduced, and the ultrasonic transducer adapts to the sizes of the main control chip and the ultrasonic transducer. The multiple ultrasonic transducers are integrated, selection of multiple imaging parameters of one catheter can be achieved, the operation time is shortened, the operation cost is reduced, the application range of the system can be expanded, and convenience is provided for integration of more functional modules in the future.

Description

Technical Field

[0001] The present invention relates to the technical field of medical devices, and particularly to an ultrasonic imaging system and device. Background Art

[0002] Ultrasonic imaging, as a fast and non-radioactive imaging diagnosis method, has been widely used. The ultrasonic imaging technology has experienced the development from 1D ultrasonic signals, 2D gray-scale images, 3D non-real-time images to 3D real-time images (i.e., 4D ultrasonic images). Among them, 4D ultrasonic images can reconstruct the 3D model of organs in real time, and lead the development direction of the next generation of ultrasonic imaging technology by providing doctors with more dimensional diagnostic basis.

[0003] Among them, the intracardiac 4D ultrasound imaging (4D ICE) technology has attracted much attention due to its great application potential in structural heart and interventional electrophysiology. However, the current 4D ICE technology only uses one ultrasonic transducer, so it is limited in terms of center frequency, bandwidth, etc., and thus cannot be flexibly changed in terms of resolution, imaging depth, etc. If doctors need different imaging depth and other parameters in actual applications, multiple catheters need to be inserted, which directly leads to an increase in the operation time and cost. Summary of the Invention

[0004] In view of this, the purpose of the present invention is to provide an ultrasonic imaging system and device, which integrate multiple different ultrasonic transducer devices, can realize the selection of multiple imaging parameters with one catheter, shorten the operation time, and reduce the operation cost.

[0005] In a first aspect, an embodiment of the present invention provides an ultrasonic imaging system, including a system interface module and an ultrasonic imaging catheter connected to the system interface module; one end of the system interface module is connected to the host, and the other end is connected to the ultrasonic imaging catheter; one end of the ultrasonic imaging catheter is connected to the system interface module, and the other end is provided with a sheath assembly; the sheath assembly includes a sheath and a sheath component connected in sequence, and the sheath component is integrated at one end of the sheath away from the system interface module; the sheath component includes a main control chip, a flexible conduction structure, and at least two ultrasonic transducer devices; the main control chip includes a chip body, a first connection part, and a second connection part, the first connection part is arranged on the surface of the chip body, and the second connection part is arranged at a relative edge position of the package body of the chip body; the number of the first connection parts is the same as the number of the ultrasonic transducer devices, and the preset ultrasonic transducer devices are connected to the surface of the chip body through the first connection parts; the flexible conduction structure is connected to the second connection part to connect the main control chip to the system interface module through the second connection part; the system interface module is used to transmit the control signal of the host to the main control chip, so that the main control chip controls the operating state of the preset ultrasonic transducer devices based on the control signal.

[0006] In combination with the first aspect, an embodiment of the present invention provides a first implementation manner of the first aspect. In this case, the sheath component further includes a backing layer; the backing layer is disposed on an end face of the main control chip away from the ultrasonic transducer device.

[0007] In combination with the first aspect, an embodiment of the present invention provides a second implementation manner of the first aspect. In this case, there are multiple main control chips; at least two ultrasonic transducer devices are distributed on the multiple main control chips; among them, the multiple main control chips are spliced and connected in the same plane, or the multiple main control chips are stacked; when the multiple main control chips are stacked, the backing layer is disposed between the multiple main control chips.

[0008] In combination with the first aspect, an embodiment of the present invention provides a third implementation manner of the first aspect. In this case, there are multiple flexible conduction structures; a preset ultrasonic transducer device among at least two ultrasonic transducer devices is close to the system interface module, and the other ultrasonic transducer devices are close to the end of the sheath; when the multiple main control chips are spliced and connected, the second connection part is disposed on opposite side edges of the package body of the main control chip; the preset flexible conduction structure is connected to the second connection part corresponding to the ultrasonic transducer device close to the end of the sheath, and is bent around the edge of the package body of the main control chip, and the other end extends in the direction of the system interface module; the other flexible conduction structures are connected to the second connection parts corresponding to the ultrasonic transducer devices close to the system interface module; when the multiple main control chips are stacked, the second connection part is disposed on a side of the package body of the main control chip close to the system interface module; the multiple flexible conduction structures are respectively connected to the second connection parts of the corresponding main control chips.

[0009] In combination with the first aspect, an embodiment of the present invention provides a fourth implementation manner of the first aspect. In this case, the ultrasonic transducer device includes multiple transducer elements; the multiple transducer elements form a transducer array in a preset array manner; the main control chip includes an element control circuit corresponding to each transducer element, and the main control chip transmits signals to the transducer elements through the element control circuit.

[0010] In combination with the first aspect, an embodiment of the present invention provides a fifth implementation manner of the first aspect. In this case, the main control chip includes a time gain compensation circuit, and the time gain compensation circuit is disposed on the element control circuit, or is disposed on a connection channel between the main control chip and the system interface module.

[0011] In combination with the first aspect, an embodiment of the present invention provides a sixth implementation manner of the first aspect. In this case, the system interface module includes a system connector, and a first catheter connector connected to the system connector through a cable; among them, the system connector is used to connect to a host; the first catheter connector is used to connect to an ultrasonic imaging catheter.

[0012] In combination with the first aspect, an embodiment of the present invention provides a seventh implementation manner of the first aspect. One end of the ultrasonic imaging catheter is provided with a second catheter connector; the second catheter connector is matched with the first catheter connector; and the ultrasonic imaging catheter is connected to the first catheter connector through the second catheter connector.

[0013] In combination with the first aspect, an embodiment of the present invention provides an eighth implementation manner of the first aspect. The ultrasonic imaging catheter further includes a manipulation structure, the manipulation structure is arranged at a preset position of the sheath tube, and the manipulation structure is connected to the second catheter connector through a cable.

[0014] In a second aspect, an embodiment of the present invention provides an ultrasonic imaging device, where the ultrasonic imaging device is the ultrasonic imaging system according to any of the above embodiments.

[0015] The embodiments of the present invention bring the following beneficial effects: An ultrasonic imaging system and device provided by the embodiments of the present invention integrate at least two ultrasonic transducer devices, which can expand the application range of the system and facilitate the integration of more functional modules in the future. By designing a corresponding number of first connection parts and second connection parts on the main control chip, a flexible modular design is realized, which can adapt to different numbers of ultrasonic transducer devices and support the connection of flexible conduction structures at the same time. This can not only reduce the overall volume and weight, but also adapt to the sizes of the main control chip and ultrasonic transducer devices, improving the operation flexibility and integration degree of the ultrasonic imaging system.

[0016] In addition, the signal path from the ultrasonic transducer device to the main control chip and then to the flexible conduction structure in the embodiments of the present invention is short, reducing signal attenuation and noise interference, reducing signal transmission loss, and improving the imaging quality. It is also possible to replace or upgrade components only by replacing the corresponding flexible conduction structure, simplifying the maintenance process. The embodiments of the present invention are small in overall volume and light in weight, can adapt to complex interventional environments, and have a convenient signal conduction method, flexible operation, and can also flexibly select the required ultrasonic transducer devices according to needs.

[0017] Other features and advantages of the present invention will be described in the following specification, and some of them will become obvious from the specification or be understood by implementing the present invention. The objectives and other advantages of the present invention are achieved and obtained by the structures specifically pointed out in the specification, claims, and drawings.

[0018] To make the above objectives, features, and advantages of the present invention more obvious and understandable, the following specific preferred embodiments are given below in conjunction with the accompanying drawings for detailed description. Description of the Drawings

[0019] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following will briefly introduce the drawings required for the description of the specific embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0020] Figure 1 Schematic diagram of a structure of an ultrasonic imaging system provided by an embodiment of the present invention;

[0021] Figure 2 Schematic diagram of a structure of a sheath tube component provided by an embodiment of the present invention;

[0022] Figure 3 Schematic diagram of another structure of a sheath tube component provided by an embodiment of the present invention;

[0023] Figure 4 Schematic diagram of another structure of an ultrasonic imaging system provided by an embodiment of the present invention;

[0024] Figure 5 Schematic diagram of an array element control circuit provided by an embodiment of the present invention;

[0025] Figure 6 Schematic diagram of another array element control circuit provided by an embodiment of the present invention. Specific embodiments

[0026] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the following will clearly and completely describe the technical solutions of the present invention in conjunction with the embodiments. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0027] The embodiments of the present invention provide an ultrasonic imaging system and device, which can realize the selection of multiple imaging parameters for one catheter, shorten the operation time, and reduce the operation cost.

[0028] For ease of understanding of this embodiment, first, a detailed introduction will be given to an ultrasonic imaging system disclosed in the embodiments of the present invention. Figure 1 Shows a schematic diagram of a structure of an ultrasonic imaging system provided by an embodiment of the present invention, as Figure 1As shown in the figure, the ultrasonic imaging system includes a system interface module 10 and an ultrasonic imaging catheter 20 connected to the system interface module. One end of the system interface module is connected to the host, and the other end is connected to the ultrasonic imaging catheter. In one implementation, the diameter of the ultrasonic imaging catheter is 12Fr (4mm) or less. The system interface module is responsible for signal communication between the catheter and the ultrasonic host, and is located outside the sterilization area during the operation and can be reused. The ultrasonic imaging catheter is the core component responsible for 4D ultrasonic imaging, and is located inside the sterilization area during the operation and is generally a disposable consumable. The embodiment of the present invention tightly combines the system interface module and the catheter, which not only reduces the overall volume and complexity of the device, but also facilitates quick installation and configuration, making the operation more convenient.

[0029] One end of the ultrasonic imaging catheter is connected to the system interface module, and the other end is provided with a sheath assembly. The sheath assembly includes a sheath 20 and a sheath component 21 connected in sequence. The sheath component is integrated at one end of the sheath away from the system interface module. The sheath component includes a main control chip, a flexible conduction structure, and at least two ultrasonic transducer devices. The main control chip includes a chip body, a first connection portion, and a second connection portion. The first connection portion is provided on the surface of the chip body, and the second connection portion is provided at a relative edge position of the package body of the chip body. The number of the first connection portions is the same as the number of the ultrasonic transducer devices, and the preset ultrasonic transducer devices are connected to the surface of the chip body through the first connection portions. The flexible conduction structure is connected to the second connection portion to connect the main control chip to the system interface module through the second connection portion.

[0030] The main control chips in the prior art are usually of a single package structure, and the connection method is simple and fixed. In the embodiment of the present invention, the first connection portion and the second connection portion are provided on the main control chip for signal transmission, which can reduce signal transmission loss and improve imaging quality. Moreover, in the embodiment of the present invention, through modular design, the number of ultrasonic transducer devices can be flexibly adjusted according to requirements and can be adapted to different ultrasonic transducer devices. In addition, a flexible conduction structure is introduced for signal transmission, which can be directly connected to the second connection portion of the main control chip, and the assembly is quick and convenient, which helps with mass production, helps to improve the yield rate, and improves the adaptability and reliability of the ultrasonic imaging system.

[0031] Among them, the system interface module of the embodiment of the present invention is used to transmit the control signal of the host to the main control chip, so that the main control chip controls the operating state of the preset ultrasonic transducer device based on the control signal. As a key part connecting the host and the ultrasonic imaging catheter, the system interface module is responsible for transmitting control signals and data, transmitting the ultrasonic signals received by the ultrasonic transducer device to the host, and realizing the transmission of the control signal of the host to control the operating state of the ultrasonic transducer device. The ultrasonic imaging catheter is a flexible catheter body, providing a flexible channel to allow internal components to safely reach the target position through the body cavity. At least two 4D ICE ultrasonic transducer devices are installed at its distal end. In one embodiment, the ultrasonic transducer device is composed of a 2D acoustic element array and an ASIC, and can perform real-time 2D, 3D and multi-plane intracardiac imaging. The sheath is an elongated, hollow catheter used in medical procedures, usually made of a soft and elastic material. In the embodiment of the present invention, the sheath is used to protect the device, and the main control chip and the ultrasonic imaging device are integrated at the end of the sheath to provide a protection channel for the interventional device.

[0032] Among them, the main control chip of the embodiment of the present invention is provided with a plurality of ultrasonic transducer devices, and each ultrasonic transducer device can be designed differently. For example, different acoustic parameters (such as center frequency, bandwidth, number of array elements, etc.) are selected and integrated into the sheath component of the embodiment of the present invention to select a specific ultrasonic transducer device for ultrasonic imaging according to requirements. For example, if an image with high resolution but not deep imaging depth is required, an ultrasonic transducer device with a high center frequency and a wide bandwidth can be used; if an image with low resolution but deep imaging depth is required, an ultrasonic transducer device with a low center frequency can be used. The parameters of the ultrasonic transducer devices complement each other.

[0033] In summary, an ultrasonic imaging system provided by the embodiment of the present invention can reduce the overall volume and weight through the flexible conduction structure for signal conduction of the main control chip, and adapt to the sizes of the main control chip and the ultrasonic transducer device. It not only improves the operation flexibility of the catheter, but also can replace or upgrade components only by replacing the corresponding flexible conduction structure, simplifying the maintenance process. In the embodiment of the present invention, at least two ultrasonic transducer devices are arranged on the surface of the main control chip. Combining with the connection mode of the flexible conduction structure can expand the application range of the system, providing convenience for integrating more functional modules in the future. The embodiment of the present invention has a small overall volume and a light weight, can adapt to complex interventional environments, and has a convenient signal conduction method, flexible operation, and can also flexibly select the required ultrasonic transducer device according to requirements.

[0034] Furthermore, based on the above embodiments, the embodiments of the present invention further provide another ultrasonic imaging system. In the embodiments of the present invention, the number of ultrasonic transducer devices may be two. Correspondingly, the main control chip has sufficient interfaces (i.e., the first connection portions) to connect and drive each ultrasonic transducer. In addition, multiple ultrasonic transducer devices can be selected according to actual requirements and engineering practice. The number of main control chips (ASICs) can be multiple. At least two ultrasonic transducer devices are distributed on multiple main control chips, and each main control chip corresponds to a preset ultrasonic transducer device. The multiple main control chips are electrically connected. For example, wire bonding can be used for connection, or a flexible circuit board can be used for connection. Among them, the multiple main control chips are spliced and connected on the same plane, or the multiple main control chips are stacked to meet different product requirements.

[0035] Furthermore, the sheath component further includes a backing layer 52, and the backing layer is disposed on the end face of the main control chip away from the ultrasonic transducer device. The backing serves to absorb the ultrasonic waves propagating in the reverse direction. When the multiple main control chips are stacked, the backing layer is disposed between the multiple main control chips. Among them, Figure 3 is a schematic structural diagram corresponding to the stacked arrangement of the main control chips. The main control chips can be stacked in two layers, and each layer of main control chips is connected to several corresponding ultrasonic transducer devices. The backing layer is disposed between the two layers of main control chips. Or, the multiple main control chips can be stacked in sequence according to actual needs, and each layer of main control chips is supported by the backing layer. Or, the multiple main control chips can be surrounded in sequence according to requirements to form a three-dimensional structure to meet more usage scenarios. Correspondingly, the backing is disposed between the multiple main control chips.

[0036] Furthermore, there are multiple flexible conduction structures in the embodiments of the present invention; among at least two ultrasonic transducer devices, the preset ultrasonic transducer device is close to the system interface module, and the other ultrasonic transducer devices are close to the end of the sheath. Among them, when the multiple main control chips are spliced and connected, the second connection portion is disposed on the opposite side edges of the package body of the main control chip. The preset flexible conduction structure (refer to Figure 2 , shown as the second flexible conduction structure 23) is connected to the second connection portion corresponding to the ultrasonic transducer device close to the end of the sheath, and is bent around the edge of the package body of the main control chip, and the other end extends in the direction of the system interface module. The other flexible conduction structure (refer to Figure 2 , shown as the first flexible conduction structure 22) is connected to the second connection portion corresponding to the ultrasonic transducer device close to the system interface module.

[0037] When the multiple main control chips are stacked, the second connection portion is disposed on the side of the package body of the main control chip close to the system interface module. The multiple flexible conduction structures are respectively connected to the second connection portions of the corresponding main control chips, Figure 3Another schematic structural diagram corresponding to an embodiment of the present invention is shown. A plurality of flexible conductive structures are distinguished by a first flexible conductive structure 22 and a second flexible conductive structure 23. Based on this, the signal of the ultrasonic transducer device can be led out from the main control chip to the second connection part at the side end, and even if the number of ultrasonic transducer devices increases, the structure of the main control chip does not need to be changed. In one embodiment, the second connection part can be welded by a reflow soldering process.

[0038] Furthermore, the sheath component further includes passive devices 53, mainly including decoupling capacitors, thermistors, etc. Figure 2 A schematic structural diagram of the sheath component is shown. Referring to Figure 2 , in the embodiment of the present invention, the passive devices are installed on the first flexible conductive structure.

[0039] Figure 4 A schematic structural diagram of another ultrasonic imaging system provided by an embodiment of the present invention is shown. Except for Figure 1 the structure of, Figure 4 it further includes a system connector 11, a first catheter connector 31, a second catheter connector 32, and a manipulation structure 40. Referring to Figure 2 , the above system interface module includes a system connector, and a first catheter connector connected to the system connector through a cable; wherein, the system connector is used to connect to the host; the first catheter connector is used to connect to the ultrasonic imaging catheter. Further, one end of the ultrasonic imaging catheter is provided with a second catheter connector; the second catheter connector matches the first catheter connector; the ultrasonic imaging catheter is connected to the first catheter connector through the second catheter connector.

[0040] In the embodiment of the present invention, it is connected to a preset host through a system connector. Physically, the socket of the system connector is directly connected to the socket of the host, playing a dual role of electrical connection and mechanical fixation. Among them, a circuit can be placed inside the system connector to implement functions such as a harmonic circuit, a low-voltage power supply module, digital signal level conversion, and storing the catheter ID. The low-voltage power supply module is responsible for further dividing and stabilizing the low-voltage power supply provided by the ultrasonic host system. In actual use, due to different design requirements of the chips inside the catheter, multiple different low-voltage power supplies may be required. While the host generally only provides 1 to 2 low-voltage power supplies, so multiple low-voltage power supplies need to be generated inside the system connector. At the same time, in order to further compensate for the cable voltage drop caused by the cable, the low-voltage power supply module also provides a cable voltage drop compensation function. Further, a matching pair of catheter connectors is used to connect the system connector and the ultrasonic imaging catheter, and the two catheter connectors are docked to achieve electrical and mechanical connections. Usually, an EEPROM is integrated as the catheter identifier. According to needs, a digital circuit buffer can be set inside the catheter connector to buffer the attenuation of the digital signal caused by the cable length.

[0041] The sheath tube assembly according to the embodiment of the present invention further includes a manipulation structure 40. The manipulation structure is arranged at a preset position of the sheath tube, and the sheath tube component is integrated at the end of the sheath tube on the side away from the manipulation structure. Among them, in the embodiment of the present invention, the sheath tube is bent by controlling the manipulation structure (such as a handle), and the doctor can conveniently control the bending direction and bending degree of the distal end of the sheath tube during operation. In one implementation manner, the manipulation structure includes two rotary wheels to pull 4 traction ropes to achieve the function of bending the sheath tube. Among them, a knob and a bending adjustment knob can be arranged on the manipulation structure, allowing the catheter to deflect left and right and rotate 360° to meet different surgical requirements. The sheath tube is the part entering the blood vessel, which plays the role of mechanically connecting the manipulation structure and the distal end of the sheath tube (i.e., the sheath tube component), and also has the function of protecting the internal electrical connection. Generally speaking, the wall of the sheath tube will be bent in four directions at the distal end of the sheath tube through 4 traction wires.

[0042] In specific implementation, the ultrasonic transducer device includes a plurality of transducer elements, and the plurality of transducer elements form a transducer array in a preset array manner. Among them, the ultrasonic transducer device can be a common 1D linear array, and can also include ultrasonic transducers made of various materials such as PZT, CMUT, or PMUT. The main control chip (ASIC) includes an element control circuit corresponding to each transducer element, and each transducer element is connected to the main control chip through a flexible circuit board. In specific implementation, the main control chip is used for transmitting, receiving, and time delay control, and each transducer element corresponds to a transmitting, receiving, and time delay circuit to achieve independent control of the transducer element.

[0043] In the embodiment of the present invention, for each element in the transducer array, there is a set of high-voltage pulse generator, high-voltage switch, amplifier, TGC, and corresponding control circuits. This ensures that a single element can be independently controlled by the ultrasonic host. Correspondingly, the control end of the control circuit corresponds to the above-mentioned first connection part, and the second connection part corresponds to the signal receiving and transmitting ends of the main control chip. The main control chip controls the emission period, frequency, amplitude, time delay, etc. of each transducer element of the ultrasonic transducer device according to the control signal provided by the ultrasonic system host. When receiving ultrasonic waves, the return signals of several elements are amplified and delayed and superimposed according to the time delay signal provided by the ultrasonic system host and then transmitted to the system host channel. Specifically, Figure 5 、 Figure 6Schematic diagrams of the array element control circuit are respectively shown. As shown in the figure, the HV Pulser generates high-voltage pulse signals for driving the ultrasonic transducer to emit ultrasonic waves. The TR Switch is used to switch between the transmit and receive modes. In the transmit mode, it transmits the high-voltage pulse signals to the ultrasonic transducer device; in the receive mode, it transmits the weak signals received by the ultrasonic transducer device to the subsequent circuit. The LNA is a low-noise amplifier for amplifying the weak signals received by the transducer while maintaining a low noise level. The SH Delay is a sample-and-hold circuit for sampling signals at specific time points and holding the value for a period of time for subsequent processing. The Σ represents analog addition, which is used to add signals from various channels and forms an analog delay addition circuit together with the preceding SH Delay. The Cable Driver is used to drive signal transmission in the cable to ensure that the signals are not distorted during long-distance transmission. Further, the sheath component further includes a time gain compensation circuit for adjusting the gain of echo signals at different depths to compensate for the energy attenuation of ultrasonic waves during propagation in the medium. Referring to Figure 6 , the time gain compensation circuit is provided on the array element control circuit to perform TGC compensation amplification for each array element. Alternatively, referring to Figure 5 , the time gain compensation circuit is provided on the connection channel between the main control chip and the system interface module to ensure that the received signals of each channel can be timely and accurately gain-adjusted, thereby improving the response speed and accuracy of the entire system.

[0044] Further, based on the above embodiments, the embodiments of the present invention further provide an ultrasonic imaging device, which includes the ultrasonic imaging system of any of the above embodiments. For the ultrasonic imaging device provided by the embodiments of the present invention, the implementation principle and the technical effects produced are the same as those of the foregoing ultrasonic imaging system embodiments. For the sake of brief description, for the parts not mentioned in the embodiments of the ultrasonic imaging device, reference can be made to the corresponding contents in the foregoing embodiments of the ultrasonic imaging system.

[0045] Finally, it should be noted that: the above embodiments are only specific implementation manners of the present invention, used to illustrate the technical solutions of the present invention, rather than limiting it. The protection scope of the present invention is not limited thereto. Although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: any person skilled in the art within the technical scope disclosed by the present invention can still modify the technical solutions recorded in the foregoing embodiments or can easily think of changes, or perform equivalent replacements for some of the technical features; and these modifications, changes or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope of the claims.

Claims

1. An ultrasonic imaging system, characterized in that: It comprises a system interface module and an ultrasonic imaging catheter connected to the system interface module; wherein one end of the system interface module is connected to a host, and the other end is connected to the ultrasonic imaging catheter; one end of the ultrasonic imaging catheter is connected to the system interface module, and the other end is provided with a sheath assembly; The sheath tube assembly comprises a sheath tube and a sheath tube component connected in sequence, wherein the sheath tube component is integrated at one end of the sheath tube away from the system interface module; the sheath tube component comprises a main control chip, a flexible conductive structure and at least two ultrasonic transducer devices; the main control chip comprises a chip body, a first connecting portion and a second connecting portion, wherein the first connecting portion is arranged on the surface of the chip body, and the second connecting portion is arranged at a relative edge position of a package of the chip body; The number of the first connection parts is consistent with the number of the ultrasonic transducer devices, and the preset ultrasonic transducer devices are connected to the surface of the chip body through the first connection parts; the flexible conductive structure is connected to the second connection parts, so as to connect the main control chip to the system interface module through the second connection parts; The system interface module is used to transmit the control signal of the host to the main control chip, so that the main control chip controls the preset operating state of the ultrasonic transducer device based on the control signal.

2. The ultrasonic imaging system according to claim 1, characterized in that: The sheath tube component further comprises a backing layer; the backing layer is arranged on an end surface of the main control chip away from the ultrasonic transducer device.

3. The ultrasonic imaging system according to claim 2, characterized in that: There are multiple main control chips; at least two ultrasonic transducer devices are distributed on the multiple main control chips; Wherein, a plurality of the main control chips are spliced ​​and connected on the same plane, or a plurality of the main control chips are stacked and arranged; when a plurality of the main control chips are stacked and arranged, the backing layer is arranged between the plurality of the main control chips.

4. The ultrasonic imaging system according to claim 3, characterized in that: There are multiple flexible conductive structures; preset ultrasonic transducers of at least two of the ultrasonic transducers are close to the system interface module, and the other ultrasonic transducers are close to the end of the sheath tube; When a plurality of the main control chips are spliced ​​and connected, the second connection parts are arranged at the edges of the opposite sides of the package of the main control chip; a preset flexible conductive structure is connected to the second connection part corresponding to the ultrasonic transducer device near the end of the sheath tube, and is bent around the edge of the package of the main control chip, and the other end extends toward the direction of the system interface module; another flexible conductive structure is connected to the second connection part corresponding to the ultrasonic transducer device near the system interface module; When a plurality of the main control chips are stacked, the second connection portion is arranged on a side of the package of the main control chip close to the system interface module; and a plurality of the flexible conductive structures are respectively connected to the second connection portions of the corresponding main control chips.

5. The ultrasonic imaging system according to claim 1, characterized in that: The ultrasonic transducer device comprises a plurality of transducer array elements; the plurality of transducer array elements are arranged in a preset array manner to form a transducer array; The main control chip includes an array element control circuit corresponding to each of the transducer array elements, and the main control chip transmits signals to the transducer array elements through the array element control circuit.

6. The ultrasonic imaging system according to claim 5, characterized in that: The main control chip comprises a time gain compensation circuit, and the time gain compensation circuit is arranged on the array element control circuit, or arranged on a connection channel between the main control chip and the system interface module.

7. The ultrasonic imaging system according to claim 1, characterized in that: The system interface module includes a system connector, and a first conduit connector connected to the system connector via a cable; Wherein, the system connector is used to connect with the host; The first catheter connector is used to connect with the ultrasound imaging catheter.

8. The ultrasonic imaging system according to claim 7, characterized in that: A second catheter connector is provided at one end of the ultrasound imaging catheter; the second catheter connector matches the first catheter connector; The ultrasound imaging catheter is connected to the first catheter connector via the second catheter connector.

9. The ultrasonic imaging system according to claim 8, characterized in that: The ultrasonic imaging catheter further includes a manipulation structure, which is disposed at a preset position of the sheath tube, and the manipulation structure is connected to the second catheter connector via a cable.

10. An ultrasonic imaging device, characterized in that: The device comprises the ultrasound imaging system according to any one of claims 1-9.

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