A semiconductor cleaning device that prevents dropping

Abstract

The present invention discloses a semiconductor cleaning device that prevents dropping, relating to the technical field of semiconductor cleaning. The present invention includes a frame, wherein a cleaning module is fixed to the inner wall of the frame, and the cleaning module is used for cleaning semiconductor wafers. A control box is fixed to the right side of the inner wall of the frame, and the control box is used to start the cleaning module. An H-shaped frame is fixed to the top surface of the frame. A chute is formed in the middle of the top surface of the H-shaped frame. Two H-shaped blocks are fixed to the top surface of the H-shaped frame. A screw rod is rotatably installed in the inner wall of the H-shaped block. A non-self-locking thread groove is formed in the outer wall of the screw rod. A servo motor is fixed to the left side of the top surface of the H-shaped frame, and the right end of the rotating shaft of the servo motor is fixedly connected to the left end of the screw rod. An inner groove block is slidably installed on the outer wall of the screw rod. In the present invention, the displacement of the semiconductor wafer is restricted by the semi-circular groove of the bottom frame, thereby avoiding the problem that the semiconductor wafer rolls out of the bottom frame and causes the semiconductor wafer to be broken and damaged.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor cleaning, and specifically provides a semiconductor cleaning device that prevents falling. Background Art

[0002] During the semiconductor manufacturing process, various particles, natural oxide layers, metal impurities, etc. may be generated on the surface of the wafer. These contaminants will affect the yield and performance of the chip. The semiconductor cleaning device that prevents falling is specifically used to clean the surface of the wafer, stably put the wafer frame into the ultrasonic cleaning chamber, and through the radiation of ultrasonic waves in the cleaning liquid, tiny bubbles are generated. These bubbles continuously expand and close under the action of the sound field, thereby generating impact and vibration on the surface of the wafer, so as to remove the contaminants on the surface. This device has the advantages of good cleaning effect, high speed, easy automation, etc., and is suitable for mass production.

[0003] The patent with the publication number of CN113770113B discloses a semiconductor cleaning device, including an installation box. A mounting frame is fixedly connected to the outer side wall of the installation box. A cylinder is fixedly connected to the top of the mounting frame. The bottom end of the telescopic rod of the cylinder is fixedly connected to a semiconductor mounting box. The installation box is directly above the installation box. A first sliding rod is fixedly connected to the bottom end of the installation box. A hollow mounting plate is slidably connected to the surface of the first sliding rod. A fixed block is fixedly connected to the top end of the first sliding rod. This patent can inject the cleaning liquid used multiple times into the cleaning box through the filter plate and the circulation pipeline by setting a circulating cleaning mechanism, and clean the mounting box carrying the semiconductor, so as to automatically filter the cleaning liquid used multiple times, ensure the cleanliness of the cleaning liquid, remove stains, improve the cleaning effect on the semiconductor, and at the same time, there is no need for manual replacement of the cleaning liquid multiple times, reducing labor and improving work efficiency.

[0004] However, the current semiconductor cleaning device has the following problems: Since the outer circle of the semiconductor wafer is arc-shaped during the process of transporting and cleaning the semiconductor wafer, the semiconductor wafer is extremely easy to roll down from the device, which may lead to the problem of fragmentation and damage of the semiconductor wafer. Therefore, we propose a semiconductor cleaning device that prevents falling. Summary of the Invention

[0005] Aiming at the deficiencies of the prior art, the present invention provides a semiconductor cleaning device that prevents falling, and solves the problems raised in the above background art.

[0006] To achieve the above objectives, the present invention is realized through the following technical solutions: A semiconductor cleaning device that prevents dropping, including a frame. A cleaning module is fixed to the inner wall of the frame, and the cleaning module is used to clean semiconductor wafers. A control box is fixed to the right side of the inner wall of the frame, and the control box is used to start the cleaning module. An H-shaped frame is fixed to the top surface of the frame. A chute is opened in the middle of the top surface of the H-shaped frame. Two H-shaped blocks are fixed to the top surface of the H-shaped frame. A screw rod is rotatably installed inside the H-shaped block. A non-self-locking thread groove is opened on the outer wall of the screw rod. A servo motor is fixed to the left side of the top surface of the H-shaped frame. The right end of the rotating shaft of the servo motor is fixedly connected to the left end of the screw rod. An inner groove block is slidably installed on the outer wall of the screw rod. The inner wall of the inner groove block meshes with the thread groove of the screw rod. The bottom of the outer wall of the inner groove block is slidably connected to the inner wall of the chute of the frame. A return frame is fixed to the top and bottom of the outer wall of the inner groove block. An electric telescopic rod is fixedly installed through and on the bottom surface of the return frame. The bottom surface of the telescopic end of the electric telescopic rod is fixedly connected to a U-shaped frame. A bottom frame is fixedly installed at the bottom of the inner wall of the U-shaped frame, and the bottom frame is used to load semiconductor wafers. When the screw rod rotates forward in the H-shaped block, restricted by the chute of the H-shaped frame, the inner groove block moves to the right in the thread groove of the screw rod. The inner groove block slides to the right in the chute of the H-shaped frame. The inner groove block drives the return frame to move to the right. The return frame drives the electric telescopic rod to move to the right. The telescopic end of the electric telescopic rod drives the U-shaped frame to move to the right. The U-shaped frame drives the bottom frame to move to the right. The bottom frame drives the semiconductor wafer to move to the right. The telescopic end of the electric telescopic rod drives the U-shaped frame to move downward. The U-shaped frame drives the bottom frame to move downward. The bottom frame drives the semiconductor wafer to move downward.

[0007] According to the above technical solution, notch openings are provided on both the left and right sides of the bottom frame, notch openings are provided on the front and back sides of the bottom frame, a semi-circular arc groove is provided on the top surface of the bottom frame, and a plurality of circular holes are provided on the bottom surface of the bottom frame.

[0008] According to the above technical solution, a control tabletop is provided at the top of the front surface of the control box. The return frame is sleeved on the H-shaped frame. The bottom end inside the return frame is in sliding contact with the bottom surface of the H-shaped frame. The bottom frame is suspended above the control box.

[0009] According to the above technical solution, the control box is located on the right side of the cleaning module. The screw rod is located above the chute of the H-shaped frame. The electric telescopic rods are respectively located in front of and behind the H-shaped frame.

[0010] According to the above technical solution, the cleaning module includes a housing, a washing pool, an orifice plate, an ultrasonic transducer, and a solenoid valve. The housing is fixed to the right side of the inner wall of the frame. The washing pool penetrates and is fixedly installed in the middle of the top surface of the housing. The orifice plate is fixedly installed at the bottom of the inner wall of the washing pool. The ultrasonic transducer is fixedly installed at the bottom end inside the housing. The top surface of the ultrasonic transducer is fixedly connected to the bottom surface of the washing pool. The solenoid valve penetrates and is fixedly installed at the bottom left of the washing pool. The right end of the solenoid valve penetrates and is fixedly connected to the right side of the inner wall of the housing.

[0011] According to the above technical solution, a heating device is provided on the outer wall of the U-shaped frame. The heating device is used to heat the cleaning liquid in the washing pool. A flushing device is provided on the outer wall of the heating device. The flushing device is used to spray the cleaning liquid to flush the semiconductor wafer in the bottom frame.

[0012] According to the above technical solution, the heating device includes a U-shaped plate. The U-shaped plate is fixed to the bottom of the outer wall of the U-shaped frame. The U-shaped plate is located on the right side of the bottom frame. A long shell is fixed to the right side of the inner wall of the U-shaped plate. A plurality of resistance heating rods are fixedly installed inside the long shell. A waterproof cover is fixedly installed on the right side of the long shell. During the downward movement of the long shell, the long shell enters the cleaning liquid in the washing pool. The resistance heating rods transfer heat to the waterproof cover, and the waterproof cover transfers heat to the cleaning liquid.

[0013] According to the above technical solution, U-shaped vertical frames are fixed to the front and back of the inner wall of the U-shaped plate. A plurality of sliding rods penetrate and are slidably installed at the bottom surface of the U-shaped vertical frames. A double-arc plate is fixed to the bottom surface of the sliding rods. The double-arc plate is located below the bottom frame. A circular plate is fixed to the top surface of the sliding rods. A spring is provided between the bottom surface of the circular plate and the bottom end inside the U-shaped vertical frame. The elastic force when the spring stretches is used to reduce the collision between the bottom surface of the bottom frame and the orifice plate. During the downward movement of the double-arc plate, the double-arc plate contacts the surface of the orifice plate. The surface of the orifice plate generates an amplitude under the impact of the double-arc plate. And under the action of the extrusion force, the sliding rods slide upward in the U-shaped vertical frames. The sliding rods drive the circular plate to move upward, and the spring is stretched by the circular plate.

[0014] According to the above technical solution, the flushing device includes a U-shaped cross frame. The U-shaped cross frame is fixed to the bottom of the outer wall of the U-shaped vertical frame. Two L-shaped strip plates are fixed to the right side of the U-shaped vertical frame. The outer walls of the L-shaped strip plates are fixedly connected to the top surface of the return frame. A liquid storage tank is fixedly installed on the top surface of the L-shaped strip plates. A liquid inlet pipe penetrates and is fixedly installed at the top of the front of the liquid storage tank. A plurality of hoses penetrate and are fixed to the bottom of the liquid storage tank. The end of the hose away from the liquid storage tank is fixed with an electric control spray head. The outer wall of the electric control spray head penetrates and is fixedly connected to the right side of the U-shaped cross frame. The U-shaped cross frame drives the electric control spray head to move downward. The U-shaped cross frame drives the L-shaped strip plates to move downward. The L-shaped strip plates drive the liquid storage tank to move downward. The liquid storage tank drives the hoses to move downward. The hoses convey new cleaning liquid to the electric control spray head, and the electric control spray head sprays the new cleaning liquid below the semiconductor wafer.

[0015] According to the above technical solution, a straight plate is fixed to the left side of the L-shaped strip plate, several ring blocks are fixed to the left side of the straight plate, a rubber ring is fixed to the inner wall of the ring block, the rubber ring is sleeved on the outer wall of the hose, the straight plate drives the ring block to move downward, the ring block drives the rubber ring to move downward, and the rubber ring is used to limit the displacement of the hose.

[0016] The present invention provides a semiconductor cleaning device that prevents falling. It has the following beneficial effects:

[0017] (1) In the present invention, through the cooperation of a frame, a cleaning module, a control box, an H-shaped frame, an H-shaped block, a screw rod, a servo motor, an inner groove block, a return frame, an electric telescopic rod, and a U-shaped frame with a bottom frame, the screw rod rotates forward in the H-shaped block. Under the restriction of the sliding groove of the H-shaped frame, the inner groove block moves to the right in the thread groove of the screw rod, and the inner groove block slides to the right in the sliding groove of the H-shaped frame. The inner groove block drives the return frame to move to the right, the return frame drives the electric telescopic rod to move to the right, the telescopic end of the electric telescopic rod drives the U-shaped frame to move to the right, the U-shaped frame drives the bottom frame to move to the right, and the bottom frame drives the semiconductor wafer to move to the right. When the bottom frame moves above the washing pool, the telescopic end of the electric telescopic rod drives the U-shaped frame to move downward, the U-shaped frame drives the bottom frame to move downward, and the bottom frame drives the semiconductor wafer to move downward. During the process of moving and cleaning the semiconductor wafer, the semi-circular groove of the bottom frame restricts the displacement of the semiconductor wafer, allowing the semiconductor wafer to firmly stay in the semi-circular groove of the bottom frame, preventing the semiconductor wafer from rolling out of the bottom frame and causing fragmentation and damage to the semiconductor wafer. (2) Through the setting of the heating device in the present invention, the U-shaped plate, the long shell, and the resistance heating rod cooperate with the waterproof cover. During the downward movement of the long shell, the long shell enters the cleaning liquid in the washing pool, the resistance heating rod transfers heat to the waterproof cover, and the waterproof cover transfers heat to the cleaning liquid, heating the cleaning liquid to clean the surface of the semiconductor wafer, preventing the oil stains on the surface of the semiconductor wafer from being difficult to clean and resulting in poor cleaning effect of the equipment for oil stains. (3) Through the setting of the heating device in the present invention, the U-shaped vertical frame, the sliding rod, the double-arc plate, and the circular plate cooperate with the spring. During the downward movement of the double-arc plate, the double-arc plate contacts the surface of the orifice plate, and the surface of the orifice plate generates an amplitude under the impact of the double-arc plate, preventing stain particles from accumulating in the pores of the orifice plate. And under the action of the extrusion force, the sliding rod slides upward in the U-shaped vertical frame, the sliding rod drives the circular plate to move upward, the spring is stretched by the circular plate, and under the elastic force of the spring, the bottom frame does not collide with the surface of the orifice plate, preventing the semiconductor wafer in the bottom frame from vibrating and being damaged due to the bottom frame hitting the surface of the orifice plate. (4) Through the setting of the flushing device in the present invention, the U-shaped cross frame, the L-shaped strip plate, the liquid storage tank, the liquid inlet pipe, and the hose cooperate with the electric control spray head. The U-shaped cross frame drives the electric control spray head to move downward, the U-shaped cross frame drives the L-shaped strip plate to move downward, the L-shaped strip plate drives the liquid storage tank to move downward, the liquid storage tank drives the hose to move downward, the hose transports the new cleaning liquid to the electric control spray head, and the electric control spray head sprays the new cleaning liquid below the semiconductor wafer for secondary flushing of the semiconductor wafer, preventing stains from accumulating below the semiconductor wafer and resulting in poor cleaning effect below the semiconductor wafer. (5) Through the setting of the flushing device in the present invention, the straight plate and the ring block cooperate with the rubber ring. The straight plate drives the ring block to move downward, the ring block drives the rubber ring to move downward, and the rubber ring restricts the displacement of the hose, preventing multiple hoses from being entangled with each other and resulting in poor liquid transportation effect of the hose. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a schematic diagram of the whole of the present invention;

[0019] Figure 2 Schematic diagram of the internal components of the present invention;

[0020] Figure 3 Cross-sectional schematic diagram at the frame of the present invention;

[0021] Figure 4 Bottom schematic diagram of the bottom frame of the present invention

[0022] Figure 5 Schematic diagram of the heating device of the present invention;

[0023] Figure 6 For the present invention Figure 5 Partial enlarged schematic diagram at position A in;

[0024] Figure 7 Schematic diagram of the bottom of the flushing device of the present invention;

[0025] Figure 8 Schematic diagram of the flushing device of the present invention;

[0026] Figure 9 For the present invention Figure 8 Partial enlarged schematic diagram at position B in.

[0027] In the figure: 1. Frame; 2. Cleaning module; 201. Shell; 202. Washing pool; 203. Orifice plate; 204. Ultrasonic transducer; 205. Solenoid valve; 3. Control box; 4. H-shaped frame; 5. H-shaped block; 6. Screw; 7. Servo motor; 8. Inner groove block; 9. Return-shaped frame; 10. Electric telescopic rod; 11. U-shaped frame; 12. Bottom frame; 13. Heating device; 131. U-shaped plate; 132. Long shell; 133. Resistance heating rod; 134. Waterproof cover; 135. U-shaped vertical frame; 136. Slide bar; 137. Double arc plate; 138. Circular plate; 139. Spring; 14. Flushing device; 141. U-shaped cross frame; 142. L-shaped strip plate; 143. Liquid storage tank; 144. Liquid inlet pipe; 145. Hose; 146. Electric control spray head; 147. Straight plate; 148. Ring block; 149. Rubber ring. Detailed implementation manners

[0028] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments.

[0029] Please refer to Figures 1-9, an embodiment of the present invention is: an anti-falling semiconductor cleaning device, including a frame 1, a cleaning module 2 is fixed on the inner wall of the frame 1, the cleaning module 2 is used to clean semiconductor wafers, the cleaning module 2 includes a housing 201, a scrubbing pool 202, an orifice plate 203, an ultrasonic transducer 204 and a solenoid valve 205. The housing 201 is fixed on the right side of the inner wall of the frame 1. The scrubbing pool 202 penetrates and is fixedly installed in the middle of the top surface of the housing 201. The orifice plate 203 is fixedly installed at the bottom of the inner wall of the scrubbing pool 202. The ultrasonic transducer 204 is fixedly installed at the bottom end inside the housing 201. The top surface of the ultrasonic transducer 204 is fixedly connected to the bottom surface of the scrubbing pool 202. The solenoid valve 205 penetrates and is fixedly installed at the bottom left of the scrubbing pool 202. The right end of the solenoid valve 205 penetrates and is fixedly connected to the right side inner wall of the housing 201;

[0030] A control box 3 is fixed on the right side of the inner wall of the frame 1. The control box 3 is located on the right side of the cleaning module 2. A control table is provided at the top of the front of the control box 3. The control box 3 is used to start the cleaning module 2;

[0031] An H-shaped frame 4 is fixed on the top surface of the frame 1. A chute is opened in the middle of the top surface of the H-shaped frame 4. Two H-shaped blocks 5 are fixed on the top surface of the H-shaped frame 4. A screw rod 6 is rotatably installed inside the H-shaped block 5. The screw rod 6 is located above the chute of the H-shaped frame 4. A non-self-locking thread groove is provided on the outer wall of the screw rod 6. A servo motor 7 is fixed on the left side of the top surface of the H-shaped frame 4. The right end of the rotating shaft of the servo motor 7 is fixedly connected to the left end of the screw rod 6. An inner groove block 8 is slidably installed on the outer wall of the screw rod 6. The inner wall of the inner groove block 8 meshes with the thread groove of the screw rod 6. The bottom of the outer wall of the inner groove block 8 is slidably connected to the inner wall of the chute of the frame 1. A return frame 9 is fixed on the top and bottom surfaces of the inner groove block 8. The return frame 9 is sleeved on the H-shaped frame 4. The bottom end inside the return frame 9 is in sliding contact with the bottom surface of the H-shaped frame 4. An electric telescopic rod 10 penetrates and is fixed at the bottom of the return frame 9. The electric telescopic rods 10 are respectively located in front of and behind the H-shaped frame 4. The bottom surface of the telescopic end of the electric telescopic rod 10 is fixedly provided with a U-shaped frame 11. A bottom frame 12 is fixedly installed at the bottom of the inner wall of the U-shaped frame 11. The bottom frame 12 is suspended above the control box 3. Notches are provided on both the left and right sides of the bottom frame 12, on the front and back of the bottom frame 12, a semi-circular groove is opened on the top surface of the bottom frame 12, and a number of round holes are opened on the bottom surface of the bottom frame 12. The bottom frame 12 is used to load semiconductor wafers;

[0032] The operator pours the cleaning liquid into the washing pool 202 of the cleaning module 2. The operator places the semiconductor wafer on the semi-circular groove of the bottom frame 12 with the robotic arm. At the same time, the frame 1 supports the H-shaped frame 4. The operator starts the servo motor 7 on the H-shaped frame 4. The rotating shaft of the servo motor 7 starts to rotate forward. The rotating shaft of the servo motor 7 drives the screw 6 to rotate forward. The screw 6 rotates forward in the H-shaped block 5. Under the restriction of the sliding groove of the H-shaped frame 4, the inner groove block 8 moves to the right in the thread groove of the screw 6. The inner groove block 8 slides to the right in the sliding groove of the H-shaped frame 4. The inner groove block 8 drives the loop-shaped frame 9 to move to the right. The loop-shaped frame 9 drives the electric telescopic rod 10 to move to the right. The telescopic end of the electric telescopic rod 10 drives the U-shaped frame 11 to move to the right. The U-shaped frame 11 drives the bottom frame 12 to move to the right. The bottom frame 12 drives the semiconductor wafer to move to the right. At the same time, the frame 1 supports the housing 201 of the cleaning module 2. The housing 201 supports the washing pool 202. The washing pool 202 supports the orifice plate 203. The operator starts the ultrasonic transducer 204 with the control box 3. The ultrasonic wave of the ultrasonic transducer 204 is transmitted into the washing pool 202, causing the cleaning liquid in the washing pool 202 to generate an amplitude. When the bottom frame 12 moves above the washing pool 202, the operator starts the electric telescopic rod 10. The telescopic end of the electric telescopic rod 10 drives the U-shaped frame 11 to move downward. The U-shaped frame 11 drives the bottom frame 12 to move downward. The bottom frame 12 drives the semiconductor wafer to move downward. The semiconductor wafer enters the washing pool 202. The cleaning liquid vibrates to clean the surface of the semiconductor wafer. The stains on the surface of the semiconductor wafer pass through the orifice plate 203 and are deposited below the washing pool 202. The operator starts the solenoid valve 205 on the washing pool 202. The cleaning wastewater in the washing pool 202 is discharged from the solenoid valve 205. During the process of moving and cleaning the semiconductor wafer, the semi-circular groove of the bottom frame 12 restricts the displacement of the semiconductor wafer, keeping the semiconductor wafer firmly in the semi-circular groove of the bottom frame 12. Thus, when the semiconductor cleaning device transports and cleans the semiconductor wafer, the problem of the semiconductor wafer rolling out of the bottom frame 12 and being broken and damaged is avoided;

[0033] A heating device 13 is provided on the outer wall of the U-shaped frame 11. The heating device 13 is used to heat the cleaning liquid in the washing pool 202. A flushing device 14 is provided on the outer wall of the heating device 13. The flushing device 14 is used to spray the cleaning liquid to flush the semiconductor wafer in the bottom frame 12.

[0034] Working principle: Pour the cleaning liquid into the washing pool 202 of the cleaning module 2. Place the semiconductor wafer on the semi-circular groove of the bottom frame 12 with the robotic arm. The rotating shaft of the servo motor 7 drives the screw 6 to rotate forward. The screw 6 rotates forward in the H-shaped block 5. Under the restriction of the sliding groove of the H-shaped frame 4, the inner groove block 8 moves to the right in the thread groove of the screw 6. The inner groove block 8 slides to the right in the sliding groove of the H-shaped frame 4. The inner groove block 8 drives the loop frame 9 to move to the right. The loop frame 9 drives the electric telescopic rod 10 to move to the right. The telescopic end of the electric telescopic rod 10 drives the U-shaped frame 11 to move to the right. The U-shaped frame 11 drives the bottom frame 12 to move to the right. The bottom frame 12 drives the semiconductor wafer to move to the right. At the same time, the ultrasonic wave of the ultrasonic transducer 204 is transmitted into the washing pool 202. When the bottom frame 12 moves above the washing pool 202, the telescopic end of the electric telescopic rod 10 drives the U-shaped frame 11 to move downward. The U-shaped frame 11 drives the bottom frame 12 to move downward. The bottom frame 12 drives the semiconductor wafer to move downward. The semiconductor wafer enters the washing pool 202. After cleaning, the cleaning wastewater in the washing pool 202 is discharged from the solenoid valve 205.

[0035] Please refer to Figures 1-9 , on the basis of the above embodiments, in another embodiment of the present invention, the heating device 13 includes a U-shaped plate 131. The U-shaped plate 131 is fixed to the bottom of the outer wall of the U-shaped frame 11. The U-shaped plate 131 is located on the right side of the bottom frame 12. A long shell 132 is fixed to the right side of the inner wall of the U-shaped plate 131. A plurality of resistance heating rods 133 are fixedly installed on the inner wall of the long shell 132. A waterproof cover 134 is fixedly installed on the right side of the long shell 132. While the U-shaped frame 11 drives the bottom frame 12 to move downward, the U-shaped frame 11 drives the U-shaped plate 131 to move downward. The U-shaped plate 131 drives the long shell 132 to move downward. The long shell 132 drives the resistance heating rods 133 to move downward. The long shell 132 drives the waterproof cover 134 to move downward. During the downward movement of the long shell 132, the long shell 132 enters the cleaning liquid in the washing pool 202. The operator starts the resistance heating rods 133. The resistance heating rods 133 start to heat up. The resistance heating rods 133 transfer heat to the waterproof cover 134. The waterproof cover 134 transfers heat to the cleaning liquid. The cleaning liquid heats and cleans the surface of the semiconductor wafer, so that the oil stains on the surface of the semiconductor wafer are dissolved by high temperature, thus avoiding the problem that the oil stains on the surface of the semiconductor wafer are difficult to clean during the cleaning of the semiconductor wafer by the semiconductor cleaning device, resulting in poor cleaning effect of the equipment for oil stains.

[0036] On the front and back inner walls of the U-shaped plate 131, there are U-shaped vertical frames 135 fixed. A number of sliding rods 136 are installed through and slidably on the bottom surface of the U-shaped vertical frame 135. A double-arc plate 137 is fixed to the bottom surface of the sliding rod 136. The double-arc plate 137 is located below the bottom frame 12. A circular plate 138 is fixed to the top surface of the sliding rod 136. A spring 139 is arranged between the bottom surface of the circular plate 138 and the inner bottom end of the U-shaped vertical frame 135. While the U-shaped frame 11 drives the U-shaped plate 131 to move downward, the U-shaped plate 131 drives the U-shaped vertical frame 135 to move downward. The U-shaped vertical frame 135 drives the spring 139 to move downward. The spring 139 drives the circular plate 138 to move downward. The circular plate 138 drives the sliding rod 136 to move downward. The sliding rod 136 drives the double-arc plate 137 to move downward. During the downward movement of the double-arc plate 137, the double-arc plate 137 contacts the surface of the orifice plate 203. The surface of the orifice plate 203 generates an amplitude under the impact of the double-arc plate 137, so that no stain particles will accumulate in the pores of the orifice plate 203. At the same time, under the action of the extrusion force, the sliding rod 136 slides upward in the U-shaped vertical frame 135. The sliding rod 136 drives the circular plate 138 to move upward. The spring 139 is stretched by the circular plate 138. The elastic force when the spring 139 is stretched is used to reduce the collision between the bottom surface of the bottom frame 12 and the orifice plate 203. Under the elastic force of the spring 139, the bottom frame 12 will not collide with the surface of the orifice plate 203, thereby avoiding the vibration damage of the semiconductor wafer in the bottom frame 12 caused by the bottom frame 12 hitting the surface of the orifice plate 203 when the semiconductor cleaning device cleans the semiconductor wafer.

[0037] The flushing device 14 includes a U-shaped cross frame 141 which is fixed to the bottom of the outer wall of the U-shaped vertical frame 135. Two L-shaped strip plates 142 are fixed to the right side of the U-shaped vertical frame 135. The outer wall of the L-shaped strip plate 142 is fixedly connected to the top surface of the return frame 9. A liquid storage tank 143 is fixedly installed on the top surface of the L-shaped strip plate 142. A liquid inlet pipe 144 penetrates and is fixedly installed through the top of the front of the liquid storage tank 143. A plurality of flexible hoses 145 penetrate and are fixed to the bottom surface of the liquid storage tank 143. One end of the flexible hose 145 away from the liquid storage tank 143 is fixed with an electric control spray head 146. The outer wall of the electric control spray head 146 penetrates and is fixedly connected to the right side of the U-shaped cross frame 141. While the U-shaped plate 131 drives the U-shaped vertical frame 135 to move downward, the U-shaped vertical frame 135 drives the U-shaped cross frame 141 to move downward, the U-shaped cross frame 141 drives the electric control spray head 146 to move downward. At the same time, the U-shaped cross frame 141 drives the L-shaped strip plate 142 to move downward, the L-shaped strip plate 142 drives the liquid storage tank 143 to move downward, the liquid storage tank 143 drives the flexible hose 145 to move downward, and the liquid storage tank 143 drives the liquid inlet pipe 144 to move downward. When the new cleaning liquid is injected into the liquid inlet pipe 144, the new cleaning liquid enters the liquid storage tank 143. The new cleaning liquid in the liquid storage tank 143 enters the flexible hose 145. The flexible hose 145 transports the new cleaning liquid to the electric control spray head 146. After the cleaning waste water is discharged from the solenoid valve 205, the solenoid valve 205 is closed. The electric control spray head 146 sprays the new cleaning liquid under the semiconductor wafer, so that the semiconductor wafer is secondarily rinsed, thus avoiding the problem that when the semiconductor cleaning device cleans the semiconductor wafer, stains accumulate under the semiconductor wafer, resulting in poor cleaning effect under the semiconductor wafer.

[0038] A straight plate 147 is fixed to the left side of the L-shaped strip plate 142. A plurality of ring blocks 148 are fixed to the left side of the straight plate 147. A rubber ring 149 is fixed to the inner wall of the ring block 148. The rubber ring 149 is sleeved on the outer wall of the flexible hose 145. The rubber ring 149 is used to limit the displacement of the flexible hose 145. While the U-shaped cross frame 141 drives the L-shaped strip plate 142 to move downward, the L-shaped strip plate 142 drives the straight plate 147 to move downward, the straight plate 147 drives the ring block 148 to move downward, and the ring block 148 drives the rubber ring 149 to move downward. During the downward movement of the rubber ring 149, the rubber ring 149 limits the displacement of the flexible hose 145, thus avoiding the problem that when the semiconductor cleaning device cleans the semiconductor wafer, a plurality of flexible hoses 145 are wound together, resulting in poor liquid transportation effect of the flexible hose 145.

[0039] Working principle: The U-shaped frame 11 drives the U-shaped plate 131 to move downward, the U-shaped plate 131 drives the long shell 132 to move downward, the long shell 132 drives the resistance heating rod 133 to move downward, and the long shell 132 drives the waterproof cover 134 to move downward; The U-shaped plate 131 drives the U-shaped vertical frame 135 to move downward, the U-shaped vertical frame 135 drives the spring 139 to move downward, the spring 139 drives the circular plate 138 to move downward, the circular plate 138 drives the slide bar 136 to move downward, and the slide bar 136 drives the double arc plate 137 to move downward.

[0040] The U-shaped vertical frame 135 drives the U-shaped horizontal frame 141 to move downward, the U-shaped horizontal frame 141 drives the electric control nozzle 146 to move downward. At the same time, the U-shaped horizontal frame 141 drives the L-shaped strip plate 142 to move downward, the L-shaped strip plate 142 drives the liquid storage tank 143 to move downward, the liquid storage tank 143 drives the hose 145 to move downward, and the liquid storage tank 143 drives the liquid inlet pipe 144 to move downward; The L-shaped strip plate 142 drives the straight plate 147 to move downward, the straight plate 147 drives the ring block 148 to move downward, the ring block 148 drives the rubber ring 149 to move downward, and the rubber ring 149 restricts the displacement of the hose 145.

[0041] The above is only a preferred specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution of the present invention and its inventive concept, makes equivalent substitutions or changes, and should be covered by the protection scope of the present invention.

Claims

1. A semiconductor cleaning device that prevents dropping, comprising a frame (1), wherein a cleaning module (2) is fixed to the inner wall of the frame (1), and is characterized in that: The cleaning module (2) is used to clean semiconductor wafers; On the right side of the inner wall of the frame (1), a control box (3) is fixed, and the control box (3) is used to start the cleaning module (2); On the top surface of the frame (1), an H-shaped frame (4) is fixed. In the middle of the top surface of the H-shaped frame (4), a chute is provided. On the top surface of the H-shaped frame (4), two H-shaped blocks (5) are fixed. Inside the H-shaped block (5), a screw rod (6) is rotatably installed. On the outer wall of the screw rod (6), a non-self-locking thread groove is provided. On the left side of the top surface of the H-shaped frame (4), a servo motor (7) is fixed. The right end of the rotating shaft of the servo motor (7) is fixedly connected to the left end of the screw rod (6). On the outer wall of the screw rod (6), an inner groove block (8) is slidably installed. The inner wall of the inner groove block (8) meshes with the thread groove of the screw rod (6). The bottom of the outer wall of the inner groove block (8) is slidably connected to the inner wall of the chute of the frame (1). On the top and bottom surfaces of the inner groove block (8), a return frame (9) is fixed. The bottom surface of the return frame (9) penetrates and is fixed with an electric telescopic rod (10). The bottom surface of the telescopic end of the electric telescopic rod (10) is fixed with a U-shaped frame (11). At the bottom of the inner wall of the U-shaped frame (11), a bottom frame (12) is fixedly installed, and the bottom frame (12) is used to load semiconductor wafers; On the outer wall of the U-shaped frame (11), a heating device (13) is provided, and the heating device (13) is used to heat the cleaning liquid in the washing pool (202); On the outer wall of the heating device (13), a flushing device (14) is provided, and the flushing device (14) is used to spray the cleaning liquid to flush the semiconductor wafers in the bottom frame (12); The heating device (13) includes a U-shaped plate (131), and the U-shaped plate (131) is fixed to the bottom of the outer wall of the U-shaped frame (11). The U-shaped plate (131) is located on the right side of the bottom frame (12). On the right side of the inner wall of the U-shaped plate (131), a long shell (132) is fixed. Inside the long shell (132), a number of resistance heating rods (133) are fixedly installed. On the right side of the long shell (132), a waterproof cover (134) is fixedly installed; On the front and back of the inner wall of the U-shaped plate (131), U-shaped vertical frames (135) are fixed. Through the bottom surface of the U-shaped vertical frame (135), a number of sliding rods (136) are slidably installed. The bottom surface of the sliding rod (136) is fixed with a double-arc plate (137). The double-arc plate (137) is located below the bottom frame (12). The top surface of the sliding rod (136) is fixed with a circular plate (138). Between the bottom surface of the circular plate (138) and the inner bottom end of the U-shaped vertical frame (135), a spring (139) is provided. The elastic force when the spring (139) stretches is used to reduce the collision between the bottom surface of the bottom frame (12) and the orifice plate (203).

2. The semiconductor cleaning device for preventing dropping according to claim 1, wherein: On both the left and right sides of the bottom frame (12), notch openings are provided. On the front and back of the bottom frame (12), notch openings are provided. On the top surface of the bottom frame (12), a semi-circular arc groove is provided. On the bottom surface of the bottom frame (12), a number of round holes are provided.

3. The semiconductor cleaning device for preventing dropping according to claim 2, characterized in that: A control console is provided at the top of the front surface of the control box (3). The loop-shaped frame (9) is sleeved on the H-shaped frame (4). The inner bottom end of the loop-shaped frame (9) is in sliding contact with the bottom surface of the H-shaped frame (4). The bottom frame (12) is suspended above the control box (3).

4. The semiconductor cleaning device for preventing falling according to claim 3, wherein: The control box (3) is located on the right side of the cleaning module (2). The screw rod (6) is located above the chute of the H-shaped frame (4). The electric telescopic rods (10) are respectively located in front of and behind the H-shaped frame (4).

5. The semiconductor cleaning device for preventing dropping according to claim 4, wherein: The cleaning module (2) includes a housing (201), a washing pool (202), an orifice plate (203), an ultrasonic transducer (204), and a solenoid valve (205). The housing (201) is fixed to the right side inner wall of the frame (1). The washing pool (202) penetrates and is fixedly installed in the middle of the top surface of the housing (201). The orifice plate (203) is fixedly installed at the bottom of the inner wall of the washing pool (202). The ultrasonic transducer (204) is fixedly installed at the inner bottom end of the housing (201). The top surface of the ultrasonic transducer (204) is fixedly connected to the bottom surface of the washing pool (202). The solenoid valve (205) penetrates and is fixedly installed at the bottom left of the washing pool (202). The right end of the solenoid valve (205) penetrates and is fixedly connected to the right side inner wall of the housing (201).

6. The semiconductor cleaning device for preventing dropping according to claim 5, wherein: The flushing device (14) includes a U-shaped cross frame (141). The U-shaped cross frame (141) is fixed to the bottom of the outer wall of the U-shaped vertical frame (135). Two L-shaped strip plates (142) are fixed to the right side of the U-shaped vertical frame (135). The outer wall of the L-shaped strip plate (142) is fixedly connected to the top surface of the loop-shaped frame (9). A liquid storage tank (143) is fixedly installed on the top surface of the L-shaped strip plate (142). A liquid inlet pipe (144) penetrates and is fixedly installed at the top of the front surface of the liquid storage tank (143). A plurality of hoses (145) penetrate and are fixed to the bottom of the liquid storage tank (143). The end of the hose (145) away from the liquid storage tank (143) is fixed to an electric control spray head (146). The outer wall of the electric control spray head (146) penetrates and is fixedly connected to the right side of the U-shaped cross frame (141).

7. The semiconductor cleaning device for preventing dropping according to claim 6, wherein: A straight plate (147) is fixed to the left side of the L-shaped strip plate (142). A plurality of ring blocks (148) are fixed to the left side of the straight plate (147). A rubber ring (149) is fixed to the inner wall of the ring block (148). The rubber ring (149) is sleeved on the outer wall of the hose (145). The rubber ring (149) is used to limit the displacement of the hose (145).

Images