Cleaning method and cleaning equipment for semiconductor workpiece storage device

Abstract

The present application relates to a cleaning method and cleaning equipment for a semiconductor workpiece storage device. The cleaning method comprises drying a cover and a box at a drying station, wherein the semiconductor workpiece storage device comprises a cover and a box, the cover being detachably connected to the box; maintaining controlled ambient atmosphere between the cover and the box; locking the cover and the box; and unloading the locked semiconductor workpiece storage device. This cleaning method ensures that the ambient atmosphere surrounding the cover and the box remains dry after drying, thereby reducing the likelihood of moisture in the air adhering to the surfaces of the box and the cover, and thereby significantly reducing the effect of moisture-laden air on the dryness of the box and the cover.

Description

Technical Field

[0001] The present application relates to the field of semiconductor wafer manufacturing technology, and in particular to a cleaning method and cleaning equipment for a semiconductor workpiece storage device. Background Art

[0002] A FOSB (Front Opening Shipping Box) is a packaging and shipping tool used in semiconductor manufacturing. Wafers carried in a FOSB are primarily used for transfer between wafer manufacturers and chip manufacturers.

[0003] In order to keep the silicon wafers inside FOSB clean, dry and stable during transportation and storage, thereby ensuring stability and reliability in the semiconductor manufacturing process, FOSB is not designed with inflation holes and exhaust holes.

[0004] During the cleaning process of FOSB, in order to improve the cleaning effect, the cover and box of the FOSB are separated and cleaned, and then the cover and box are locked together after the cleaning process is completed. Generally, the FOSB is first cleaned using a cleaning device, and then dried using a drying device. After the drying process is completed, the drying device needs to be opened and the cover and box of the FOSB need to be locked together. However, since the cleaning device and the drying device are located in the same enclosed space, even if the drying device has thoroughly dried the cover and box, when the cleaning device is opened, high-humidity air will escape from the cleaning device into the enclosed space. The water vapor in the air may adhere to the surface of the cover and box of the dried FOSB, thereby affecting the drying effect of the dried FOSB. Summary of the Invention

[0005] In view of this, embodiments of the present application provide a cleaning method and a cleaning device for a semiconductor workpiece storage device to solve at least one problem existing in the background technology.

[0006] In a first aspect, an embodiment of the present application provides a method for cleaning a semiconductor workpiece storage device, the method comprising:

[0007] Drying the cover and the box at a drying station, wherein the semiconductor workpiece storage device comprises a cover and a box, and the cover is detachably connected to the box;

[0008] Maintaining environmental atmosphere control on the cover and the box body;

[0009] Locking the cover and the box body;

[0010] unloading the semiconductor workpiece storage device after the locking is completed;

[0011] Wherein, maintaining the environmental atmosphere of the cover and the box body includes:

[0012] The cover and the box body are purged during the locking process using clean dry gas; the relative humidity of the clean dry gas is less than 1%.

[0013] In conjunction with the first aspect of the present application, in an optional embodiment, before locking the cover and the box body, the method includes:

[0014] Moving the cover body and the box body after the drying process to a locking station;

[0015] Clean dry gas is used to purge the cover body and the box body in the process of moving from the drying station to the locking station, and the cover body and the box body located at the locking station.

[0016] In conjunction with the first aspect of the present application, in an optional embodiment, moving the cover body and the box body after the drying process to a locking station includes:

[0017] Transferring one of the box body and the cover body to the locking station first;

[0018] Then, transferring the other of the box body and the cover body to the locking station;

[0019] While the other of the box body and the cover body is being transferred, the box body or the cover body in the locking station is purged.

[0020] In conjunction with the first aspect of the present application, in an optional embodiment, before locking the cover and the box body, the method further includes:

[0021] The clean dry gas is used to purge the surface of the cover and the box body, and the surface temperature of the cover and the box body is made to be lower than a preset temperature range.

[0022] In combination with the first aspect of the present application, in an optional embodiment, the relative humidity of the clean dry gas is less than 0.1%, and the temperature is less than 25 degrees.

[0023] In conjunction with the first aspect of the present application, in an optional embodiment, locking the cover and the box body further includes:

[0024] The inner cavity of the box body is purged with clean dry gas for a first preset time period.

[0025] In conjunction with the first aspect of the present application, in an optional embodiment, the cleaning method further includes:

[0026] Before drying, the semiconductor workpiece storage device is cleaned.

[0027] In combination with the first aspect of the present application, in an optional embodiment, the purge flow rate of the clean dry gas is 1000 LPM-3000 LPM; the clean dry gas includes nitrogen and / or compressed dry air.

[0028] In a second aspect, an embodiment of the present application provides a cleaning device for a semiconductor workpiece storage device, the cleaning device comprising:

[0029] A drying unit, used for drying the cover and the box, wherein the semiconductor workpiece storage device comprises a cover and a box, and the cover is detachably connected to the box;

[0030] An environmental atmosphere control unit, used to maintain environmental atmosphere control on the cover and the box body;

[0031] A locking mechanism, used to lock or unlock the cover and the box body;

[0032] a blanking unit for blanking the semiconductor workpiece storage device after the locking is completed;

[0033] Wherein, the environmental atmosphere control unit further includes:

[0034] The sub-airflow supply component is used to provide clean dry air with a relative humidity of less than 1%, and is used to use the clean dry air to purge the cover and the box body during the locking process.

[0035] The cleaning method of the semiconductor workpiece storage device provided in the embodiment of the present application maintains control of the ambient atmosphere of the cover and the box after the drying process is completed, so that the ambient atmosphere of the cover and the box after the drying process is always a dry ambient atmosphere, which can reduce the occurrence of water vapor in the air adhering to the surface of the box and the cover, and thus can greatly reduce the influence of air containing water vapor on the dryness of the box and the cover; in addition, it can further effectively ensure the dryness and humidity of the internal space after the box and the cover are locked in a dry ambient atmosphere.

[0036] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0038] Figure 1 A top view of the internal structure of a cleaning device for a semiconductor workpiece storage device provided by an embodiment of the present application;

[0039] Figure 2 A schematic diagram of the three-dimensional structure of a cleaning device for a semiconductor workpiece storage device provided in an embodiment of the present application;

[0040] Figure 3 A schematic structural diagram of a semiconductor workpiece storage device and a locking mechanism in a cleaning device for a semiconductor workpiece storage device provided in an embodiment of the present application;

[0041] Figure 4 This is a schematic diagram of the overall process of a cleaning method for a semiconductor workpiece storage device provided in an embodiment of the present application.

[0042] Reference numerals:

[0043] 10. Loading unit; 20. Cleaning unit; 210. Cleaning device; 30. Drying unit; 310. Drying device; 40. Unloading unit; 50. Robot; 60. Frame; 70. Locking mechanism; 80. Semiconductor workpiece storage device; 810. Cover; 820. Box; 90. Environmental atmosphere control unit; 910. Fan filter unit. DETAILED DESCRIPTION

[0044] To make the technical solutions and beneficial effects of the present invention more clearly understood, the following detailed description is given by way of specific embodiments. The accompanying drawings are not necessarily drawn to scale, and local features may be enlarged or reduced to more clearly illustrate the details of the local features. Unless otherwise defined, the technical and scientific terms used herein have the same meanings as those in the technical field to which this application belongs.

[0045] In the description of the present invention, the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "height", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like to indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of simplifying the description of the present invention, and do not indicate that the device or element referred to must have a specific direction, be constructed and operate in a specific direction, and should not be understood as a limitation to the present invention.

[0046] In this disclosure, the terms "first" and "second" are used solely for descriptive purposes and should not be construed as indicating the relative importance of the features indicated or the number of technical features indicated. Therefore, a feature specified as "first" or "second" may explicitly include at least one such feature. In the description of this disclosure, "plurality" means at least two, such as two or three, and "several" means at least one, such as one, two, or three, unless otherwise specifically defined.

[0047] In the present invention, unless otherwise expressly defined, the terms "installed," "connected," "connect," "fixed," and "disposed" should be understood broadly. For example, "connection" can mean fixed, removable, or integrated; it can mean mechanical or electrical; it can mean direct or indirect connection through an intermediary; it can also mean internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of these terms in the present invention based on specific circumstances.

[0048] In the present invention, unless otherwise clearly defined, when a first feature is “on,” “above,” “above,” “above,” “below,” “below,” or “below” a second feature, the first feature and the second feature may be in direct contact, or the first feature and the second feature may be in indirect contact via an intermediate medium. Moreover, when a first feature is “on,” “above,” or “above” a second feature, it may mean that the first feature is directly above or obliquely above the second feature, or simply means that the horizontal height of the first feature is higher than the horizontal height of the second feature. When a first feature is “below,” “below,” or “below” a second feature, it may mean that the first feature is directly below or obliquely below the second feature, or simply means that the horizontal height of the first feature is lower than the horizontal height of the second feature.

[0049] The semiconductor workpiece storage device is used to accommodate or place substrates. For example, the substrates are semiconductor workpiece products such as wafers. The semiconductor workpiece storage device in the embodiment of the present application is a FOSB (Front Opening Shipping Box), although other storage devices are also possible.

[0050] The present invention provides a cleaning device for a semiconductor workpiece storage device. Figures 1 to 3The cleaning apparatus includes a loading unit 10, a cleaning unit 20, a drying unit 30, an unloading unit 40, and a robot 50. The cleaning unit 20, the drying unit 30, and the robot 50 are located within a closed space formed by a frame 60 of the cleaning apparatus. The loading unit 10 and the unloading unit 40 extend through the frame 60. The loading unit 10 is used to transfer a semiconductor workpiece storage device 80 to be cleaned from outside the frame 60 to inside the frame 60, and the unloading unit 40 is used to transfer a cleaned semiconductor workpiece storage device 80 from inside the frame 60 to outside the frame 60. The robot 50 is used to pick up the semiconductor workpiece storage device 80 and move it between the loading unit 10, the cleaning unit 20, the drying unit 30, and the unloading unit 40. The semiconductor workpiece storage device 80 includes a cover 810 and a box body 820. The cover 810 is detachably connected to the box body 820.

[0051] The cleaning unit 20 includes a cleaning device 210. When the cleaning device 210 cleans the semiconductor workpiece storage device 80, the semiconductor workpiece storage device 80 is located in a closed cleaning space of the cleaning device 210. After cleaning is completed, the cleaning device 210 is opened. When the semiconductor workpiece storage device 80 is taken out of the cleaning space of the cleaning device 210, the gas with high humidity in the cleaning space will also escape, increasing the humidity of the air in the space where the cleaning unit 20 and the drying unit 30 are located.

[0052] The drying unit 30 includes a drying device 310, which is used to dry the semiconductor workpiece storage device 80 after cleaning. The semiconductor workpiece storage device 80 is located in a closed drying space of the drying device 310. After the drying operation is completed, the drying device 310 is opened, which may affect the dryness of the semiconductor workpiece storage device 80.

[0053] The cleaning apparatus further includes a locking mechanism 70 for locking or unlocking a cover 810 and a box body 820 of the semiconductor workpiece storage device 80. The cover 810 and the box body 820 can be locked or unlocked using a knob assembly of the locking mechanism 70. That is, the knob assembly can achieve a sealed connection between the cover 810 and the box body 820, or can also achieve separation of the cover 810 and the box body 820. The locking mechanism 70 can be integrated into the robot arm 50, but is not limited thereto.

[0054] The cleaning device also includes an ambient atmosphere control unit 90, which is used to maintain ambient atmosphere control for the lid 810 and the box body 820. The ambient atmosphere control unit 90 includes a fan filter unit 910 (FFU) and a purge unit (not shown). An exhaust unit is provided at the bottom of the cleaning device. Under the operation of the exhaust unit, the fan filter unit 910 can distribute the generated clean air from top to bottom throughout the entire device, acting on the entire interior of the device, that is, at least on the cleaning unit 20 and drying unit 30 within the frame. The purge unit includes a pipeline assembly and a nozzle connected to the fan filter unit 910, through which clean, dry air is blown toward the surfaces of the lid and box body. Specifically, the nozzle is located at the locking station and is used to purge the lid and box body during the locking process. The nozzle can also be located along the path where the lid or box body is transferred from the drying station to the locking station, and is used to purge the lid or box body during the transfer process.

[0055] In an optional embodiment, the environmental atmosphere control unit further includes a clean dry gas supply unit, which is used to supply clean dry gas to the purge unit. Specifically, the clean dry gas is nitrogen and / or compressed dry air. In this embodiment, the relative humidity of the clean dry gas is less than 1%.

[0056] In related technologies, the ambient humidity in semiconductor process factories is generally controlled at 45+ / -3%RH (temperature is 22+ / -0.5°C), and the environmental atmosphere control unit 90 of the cleaning equipment usually directly extracts the gas in the semiconductor process factory environment and sends it into the cleaning equipment after filtering. However, due to factors such as filter materials and filtration costs, the filtration unit of the cleaning equipment generally only filters particulate matter and lacks effective means of filtering moisture. Therefore, the humidity inside the cleaning equipment will also be maintained at around 45+ / -3%RH.

[0057] The cleaning requirements for semiconductor workpiece storage devices in semiconductor process factories generally require that the humidity inside the cleaned semiconductor workpiece storage devices be less than 5% (less than 3% is required in advanced processes). Therefore, if the box body and the cover are directly locked after drying, the humidity of the atmosphere remaining in the box body will be maintained at around 45%RH, which is much higher than the control requirement of less than 5%. That is, if the water vapor in the atmosphere inside the semiconductor workpiece storage device is not effectively treated, the humidity inside the semiconductor workpiece storage device will exceed the standard.

[0058] Based on this, the embodiment of the present application utilizes multiple sub-airflow supply components, and the air supply sources of the multiple sub-airflow supply components are clean dry gases that have been further dried. Gas with a relative humidity value lower than the humidity control requirements in the semiconductor workpiece storage device is used to replace the high-humidity atmosphere inside the box body, ensuring that the humidity level of the atmosphere inside the box body is lower than the humidity control requirements in the semiconductor workpiece storage device before the box body and the cover body are closed, and preferably the relative humidity of the clean dry gas is less than 1% RH.

[0059] It should be noted that the relative humidity (RH) in the embodiment of the present application refers to the ratio of the actual water vapor content in the air to the maximum water vapor content that the air can accommodate at that temperature. The humidity in the embodiment of the present application corresponds to a temperature of 22+ / -0.5°C. Specifically, in an optional embodiment, please refer to Figure 3 The fan filter unit 910 includes multiple sub-airflow supply assemblies, which can purge the surfaces of the cover 810 and box body 820 of the dried semiconductor workpiece storage device 80 at different workstations. Of course, they can also dry and clean the space where the semiconductor workpiece storage device 80 is located, so that the semiconductor workpiece storage device 80 can be continuously maintained in a dry environment. It should be noted that during the drying process of the semiconductor workpiece storage device 80 in the drying device 310, in order to improve the drying effect, the cover 810 and box body 820 of the semiconductor workpiece storage device 80 are separated. After the drying operation is completed, it is necessary to open the drying device 310 and lock the cover 810 and box body 820. Before locking the cover 810 and box body 820, during the process of opening the drying device 310, water vapor in the air may adhere to the surfaces of the box body 820 and the cover 810, thereby affecting the dryness of the cover 810 and box body 820.

[0060] In addition, FOSB is not designed with inflation holes and exhaust holes. Compared with FOUP (Front Opening Unified Pod) which has inflation holes and exhaust holes, FOSB cannot reduce the humidity inside FOSB by replacing the high-humidity gas inside by filling it with clean dry gas through the inflation holes.

[0061] Based on this, an embodiment of the present application provides a cleaning method for a semiconductor workpiece storage device, which maintains environmental atmosphere control for the cover and box body that have completed the drying process to reduce the adhesion of water vapor in the air to the surface of the box body and the cover body, and can ensure the humidity of the internal space after the box body and the cover body are locked, greatly reducing the impact on the dryness of the box body and the cover body.

[0062] Specifically, please refer to Figure 4A method for cleaning a semiconductor workpiece storage device provided in an embodiment of the present application includes the following steps:

[0063] S1. Drying the cover and the box at a drying station. The semiconductor workpiece storage device comprises a cover and a box. The cover is detachably connected to the box.

[0064] S2. Maintain environmental atmosphere control on the cover and the box body.

[0065] S3. Lock the cover and the box body.

[0066] S4, unloading the semiconductor workpiece storage device after the locking is completed.

[0067] The above cleaning method maintains the environmental atmosphere control of the cover and the box body after completing the drying process. It can be understood that the environmental atmosphere of the cover and the box body after the drying process is always a dry environment atmosphere, which can reduce the occurrence of water vapor in the air adhering to the surface of the box body and the cover body, and thus can greatly reduce the influence of air containing water vapor on the dryness of the box body and the cover body.

[0068] In an optional embodiment, step S2 includes:

[0069] Use clean dry gas to purge the cover and box body.

[0070] It can be understood that after the cover and the box body have completed the drying process, the cover and the box body are continuously purged with clean dry gas, which can prevent the air containing water vapor in the same space from moving toward the surface of the cover and the box body, and further prevent the water vapor from adhering to the surface of the cover and the box body, so that the cover and the box body are kept in a dry environment, thereby reducing the impact of water vapor in the air on the dryness of the cover and the box body.

[0071] In an optional embodiment, the relative humidity of the clean dry gas is less than 0.1%, and the temperature of the clean dry gas is less than 25°C.

[0072] By blowing low-humidity, low-temperature gas through the cover and box surface, the surface temperature and humidity are quickly reduced. This also controls the temperature and humidity of the environment surrounding the box and cover, ensuring that the temperature and humidity of the gas remaining in the box interior when the box and cover are locked are constant. Purging the box and cover with clean, dry gas at a relative humidity of less than 0.1% RH further improves the drying effect of the box and cover.

[0073] The clean dry gas is one or more of nitrogen, compressed dry air, and clean dry air, which is not specifically limited in the embodiments of the present application.

[0074] In an optional embodiment, clean dry gas is used to purge the lid and box body during the locking process. Purging the lid and box body with clean dry gas during the locking process can prevent moisture in the atmosphere inside the cleaning device from reattaching to the surface of the box body and lid before the box body and lid are sealed, thereby ensuring a dry effect after the box body and lid are locked.

[0075] In an optional embodiment, before step S3, the method further includes:

[0076] Move the dried cover and box body to the locking station.

[0077] Clean dry gas is used to purge the cover and box body during the process of moving from the drying station to the locking station, as well as the cover and box body at the locking station.

[0078] It can be understood that after the drying device completes the drying process on the cover and the box body, the drying device is opened, and the cover and the box body in the drying device are moved to the locking station, where they are locked by the locking mechanism. During the process of moving the cover and the box body from the drying station to the locking station, and during the process of locking the cover and the box body in the locking station, the cover and the box body are continuously purged with clean dry gas to ensure that the cover and the box body are always in a dry environment, thereby greatly reducing the impact of air containing water vapor on the dryness of the cover and the box body.

[0079] In an optional embodiment, moving the lid and the box body that have completed the drying process to a locking station includes:

[0080] Transfer one of the box body and the cover body to the locking station first.

[0081] Then transfer the other one of the box body and the cover body to the locking station.

[0082] While the other of the box body and the cover body is being transferred, the box body or the cover body in the locking station is purged.

[0083] It can be understood that after the lid and box body are dried, the box body is first transferred to the locking station, and then the lid is transferred to the locking station. During the transfer of the lid body, the box body in the locking station is purged, and the lid body in the transfer process is also purged. Of course, it is also possible to first transfer the lid body to the locking station, and then transfer the box body to the locking station. During the transfer of the box body, the lid body in the locking station is purged. The embodiment of the present application can greatly reduce the situation where moisture adheres to the surface of the lid body or box body waiting in the locking station.

[0084] In practice, during the drying process in the drying apparatus, the cover of the semiconductor workpiece storage device is connected to the cover of the drying apparatus, and the box body of the semiconductor workpiece storage device is located within the enclosed drying space of the drying apparatus. After the drying process is completed, the drying apparatus is opened, and the cover of the semiconductor workpiece storage device opens accordingly and moves to a locking station. A robot then moves the box body within the drying space to the cover, i.e., the locking station. It can be understood that after the cover of the drying apparatus is opened, the cover of the semiconductor workpiece storage device is moved to the locking station. Clean dry gas is then used to purge the box body that has been moved from the drying space to the locking station, and the cover of the semiconductor workpiece storage device that has been moved to the locking station first is also purged.

[0085] In an optional embodiment, the cover body and the box body that have completed the drying process are locked at a locking station, and the locking station is located at the drying unit.

[0086] It can be implemented as follows: after the drying device completes the drying process on the cover and the box, the drying device is opened, the cover is connected to the door of the drying device, the locking mechanism picks up the box in the drying device, and locks the box and the cover.

[0087] In an optional embodiment, the cover body that has completed the drying process is locked with the box body.

[0088] It can be implemented as follows: after the drying device completes the drying process of the cover and the box body, the drying device is opened, the opening of the box body faces upward and is located in the drying chamber of the drying device, and the robot carrying the locking mechanism picks up the cover body and locks the cover body with the box body located in the drying chamber.

[0089] In an optional embodiment, before locking the cover and the box body, the method further includes:

[0090] Use clean dry gas to purge the surface of the cover and the box body, and make the surface temperature of the cover and the box body lower than the preset temperature range.

[0091] On the one hand, during the cooling process of the semiconductor workpiece storage device, water vapor will liquefy on its surface. Using clean dry gas to purge the surface of the cover and the box body and making the surface temperature of the cover and the box body lower than the preset temperature range can greatly reduce the possibility of water vapor liquefying on the surface of the cover and the box body. On the other hand, when the FOSB is closed, as its internal temperature decreases, the internal pressure of the FOSB decreases accordingly, and negative pressure is generated inside the FOSB. Compared with the situation where the interior of the FOSB is under positive pressure, when the interior of the FOSB is in a negative pressure environment, external pollutants are more likely to enter the interior under the action of atmospheric pressure, affecting the cleanliness of the interior of the FOSB.

[0092] In an optional embodiment, the preset temperature range is less than 45 degrees.

[0093] In an optional embodiment, step S4 further includes:

[0094] The inner cavity of the box body is purged with clean dry gas for a first preset time period.

[0095] Using clean, dry gas to purge the interior of the case for a predetermined time period before closing further ensures the drying of the interior space of the semiconductor workpiece storage device before closing. This predetermined time period can be 30 seconds, 50 seconds, 1 minute, 2 minutes, 3 minutes, etc., and is not specifically limited in this embodiment and can be set as needed.

[0096] In an optional embodiment, before step S1, the method further includes:

[0097] Before drying the semiconductor workpiece storage device, the semiconductor workpiece storage device is cleaned. Cleaning the semiconductor workpiece storage device can remove pollutants such as particles, metals, and AMC inside the semiconductor workpiece storage device, thereby improving the cleaning effect of the semiconductor workpiece storage device.

[0098] In an optional embodiment, the purge flow rate of the clean dry gas is 1000 LPM to 3000 LPM. Purge within this flow rate range can maintain a dry environment in the cover and box of the semiconductor workpiece storage device, effectively isolating the cover and box from moisture-laden air, and significantly reducing the chance of moisture in the air adhering to the cover and box surfaces.

[0099] It should be understood that the above embodiments are exemplary and are not intended to include all possible implementation methods. Various modifications and changes may be made to the above embodiments without departing from the scope of the present disclosure. Similarly, the various technical features of the above embodiments may be arbitrarily combined to form other embodiments of the present application that may not be explicitly described. Therefore, the above embodiments merely express several implementation methods of the present application and do not limit the scope of protection of the patent application.

Claims

1. A method for cleaning a semiconductor workpiece storage device, characterized in that: The cleaning method comprises: Drying the cover and the box at a drying station, wherein the semiconductor workpiece storage device comprises a cover and a box, and the cover is detachably connected to the box; Maintaining environmental atmosphere control on the cover and the box body; Locking the cover and the box body; unloading the semiconductor workpiece storage device after the locking is completed; Wherein, maintaining the environmental atmosphere of the cover and the box body includes: Utilizing clean dry gas to purge the cover and the box body during the locking process; the relative humidity of the clean dry gas is less than 1%; Before locking the cover and the box body, the method includes: Moving the cover body and the box body after the drying process to a locking station; Clean dry gas is used to purge the cover body and the box body in the process of moving from the drying station to the locking station, and the cover body and the box body located at the locking station.

2. The cleaning method of the semiconductor workpiece storage device according to claim 1, wherein: The cover body and the box body that have been dried are moved to a locking station, comprising: Transferring one of the box body and the cover body to the locking station first; Then, transferring the other of the box body and the cover body to the locking station; While the other of the box body and the cover body is being transferred, the box body or the cover body in the locking station is purged.

3. The cleaning method of the semiconductor workpiece storage device according to claim 1, wherein: Before locking the cover and the box body, the method further includes: The clean dry gas is used to purge the surface of the cover and the box body, and the surface temperature of the cover and the box body is made to be lower than a preset temperature range.

4. The cleaning method of the semiconductor workpiece storage device according to claim 3, characterized in that: The relative humidity of the clean dry gas is less than 0.1%, and the temperature is less than 25°C.

5. The cleaning method of the semiconductor workpiece storage device according to claim 1, wherein: The cover and the box body are locked together, further comprising: The inner cavity of the box body is purged with clean dry gas for a first preset time period.

6. The cleaning method of the semiconductor workpiece storage device according to claim 1, wherein: The cleaning method further comprises: Before drying, the semiconductor workpiece storage device is cleaned.

7. The cleaning method of the semiconductor workpiece storage device according to claim 1, wherein: The purge flow rate of the clean dry gas is 1000 LPM-3000 LPM; the clean dry gas includes nitrogen and / or compressed dry air.

8. A cleaning device for a semiconductor workpiece storage device, implementing the steps of the cleaning method for a semiconductor workpiece storage device according to any one of claims 1 to 7, characterized in that: The cleaning equipment comprises: A drying unit, used for drying the cover and the box, wherein the semiconductor workpiece storage device comprises a cover and a box, and the cover is detachably connected to the box; An environmental atmosphere control unit, used to maintain environmental atmosphere control on the cover and the box body; A locking mechanism, used to lock or unlock the cover and the box body; a blanking unit for blanking the semiconductor workpiece storage device after the locking is completed; Wherein, the environmental atmosphere control unit further includes: The sub-airflow supply component is used to provide clean dry air with a relative humidity of less than 1%, and is used to use the clean dry air to purge the cover and the box body during the locking process.

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