A welding device and method for processing a mobile phone mainboard

Abstract

The application discloses a welding device and method for mobile phone mainboard processing, which comprises a welding mechanism, an integrated power supply device rotating in the mounting frame, and an electric welding pen connected with the integrated power supply device, wherein one end of the electric welding pen is provided with an electric welding head; an auxiliary welding assembly is arranged on the side wall of the electric welding pen and comprises an extension frame and a mounting cylinder installed in the extension frame, wherein the mounting cylinder is obliquely installed in the extension frame, and one end of the mounting cylinder is located on one side of the electric welding head. The auxiliary welding assembly can be used for single-handedly holding the electric welding pen to perform soldering during the welding process. During the welding process, the pressing control key is used to control the operation of the servo motor, so that the anti-skid piece in the mounting cylinder rotates to convey the soldering wire in the mounting cylinder. Meanwhile, the processing frame can be used for limiting the mobile phone mainboard, so that the welding is more convenient, and the welding effect is better.

Description

Technical Field

[0001] This invention relates to the field of mobile phone motherboard processing and welding technology, and in particular to a welding apparatus and method for processing mobile phone motherboards. Background Technology

[0002] The mobile phone motherboard is a core component of a mobile phone, responsible for connecting and controlling various hardware devices such as the processor, memory, storage, camera, and sensors. It is one of the core components inside the phone, similar to the motherboard in a computer, but specifically designed for mobile phones, integrating all the phone's functions. The manufacturing process of the mobile phone motherboard requires the use of a soldering pen to solder components onto the motherboard, completing the soldering process. This process necessitates the use of soldering equipment specifically designed for mobile phone motherboard manufacturing.

[0003] In the process of soldering mobile phone motherboards, it is necessary to hold a soldering pen in one hand and solder wire in the other to solder the components. This two-handed operation is inconvenient, and the motherboard cannot be stabilized by hand during the soldering process, which makes it difficult to ensure the stability of the motherboard and easily leads to poor soldering results. In order to make soldering more convenient and achieve better soldering results, a soldering device for mobile phone motherboard processing is proposed. Summary of the Invention

[0004] The purpose of this invention is to provide a welding device and method for processing mobile phone motherboards, so as to solve the problems mentioned in the background art, such as the inconvenience of two-handed operation and the inability to hold the mobile phone motherboard steady during the welding process, which makes it impossible to ensure the stability of the mobile phone motherboard and easily leads to poor welding results.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a welding apparatus for processing mobile phone motherboards, comprising,

[0006] The welding mechanism includes a mounting frame and an integrated power supply device that rotates inside the mounting frame, as well as an electric welding pen connected to the integrated power supply device, wherein one end of the electric welding pen is provided with a welding head;

[0007] An auxiliary welding assembly includes an extension frame disposed on the side wall of the welding pen and a mounting cylinder installed inside the extension frame. The mounting cylinder is installed obliquely inside the extension frame, and one end of the mounting cylinder is located on one side of the welding head.

[0008] A servo motor is fixedly installed on one side of the extension frame, and an installation shaft is fixedly installed on the output end of the servo motor. An anti-slip component is installed on the side wall of the installation shaft, and the anti-slip component is located inside the installation cylinder.

[0009] A plurality of fourth springs are fixedly installed on the inner wall of the mounting cylinder. A pressure plate is fixedly installed on one end of each fourth spring. The pressure plate is an arc-shaped part and corresponds to the anti-slip part.

[0010] The motherboard fixing mechanism includes a processing frame that slides on the bottom of the mounting bracket and an elastic element disposed inside the processing frame, wherein the elastic element is an arc-shaped element;

[0011] The placement assembly includes a placement rack mounted on one side of the mounting frame and a clamping plate disposed on one side of the placement rack.

[0012] In a preferred embodiment of the welding device for mobile phone motherboard processing of the present invention, a mounting ring is fixedly installed on the side wall of the mounting shaft, a plurality of third springs are fixedly installed on the side wall of the mounting ring, and the other end of the third spring is fixedly installed on the inner wall of the anti-slip component.

[0013] As a preferred embodiment of the welding device for mobile phone motherboard processing of the present invention, wherein: a fan is fixedly installed inside the integrated power supply device, a grille is fixedly installed on one side of the integrated power supply device, a protective rod is fixedly installed on the surface of the grille, and a first control component and a second control component are installed on one side of the integrated power supply device.

[0014] In a preferred embodiment of the welding device for processing mobile phone motherboards according to the present invention, a control key is fixedly installed on one side of the welding pen, and the control key is connected to the servo motor through a wire.

[0015] In a preferred embodiment of the welding device for mobile phone motherboard processing of the present invention, a rotating shaft is rotatably connected to the inner wall of the mounting bracket, one end of the rotating shaft is fixedly installed on one side of the integrated power supply device, and the integrated power supply device is rotatably connected inside the mounting bracket through the rotating shaft.

[0016] As a preferred embodiment of the welding device for mobile phone motherboard processing of the present invention, the mounting frame has an internal mounting cavity, a first spring is fixedly installed on the inner wall of the mounting cavity, a snap-fit ​​component is fixedly installed on one end of the first spring, and a plurality of snap-fit ​​grooves that fit with the snap-fit ​​component are opened on the side wall of the rotating shaft.

[0017] In a preferred embodiment of the welding device for mobile phone motherboard processing of the present invention, the mounting frame has a sliding groove at its bottom, the processing frame is slidably connected inside the sliding groove, the processing frame has a processing groove at its top, the processing groove has a movable groove on its inner wall, a guide rail is fixedly installed on the inner wall of the movable groove, sliders are fixedly installed at both ends of the elastic element, the sliders are slidably connected to the side wall of the guide rail, a second spring is installed on the side wall of the guide rail, one end of the second spring contacts the slider, and the other end of the second spring contacts the movable groove.

[0018] As a preferred embodiment of the welding device for mobile phone motherboard processing of the present invention, wherein: a connecting shaft is rotatably connected to one side of the placement frame via a torsion spring, the clamping plate is fixedly installed on the side wall of the connecting shaft, and a protective pad is fixedly installed on the inner wall of the clamping plate.

[0019] In a preferred embodiment of the welding device for mobile phone motherboard processing of the present invention, a fixed frame is fixedly installed on the side wall of the mounting frame, a winding reel is rotatably connected inside the fixed frame, a connecting wire is wound inside the winding reel, and the welding pen is connected to the integrated power supply device through the connecting wire.

[0020] A method for using a welding device for processing mobile phone motherboards includes the following steps:

[0021] Step (A): Before use, slide the processing rack out from the groove at the bottom of the mounting rack, then turn the integrated power supply device to adjust the air outlet position of the fan in the integrated power supply device so that the fan is aligned with the processing groove in the processing rack. Then take the soldering pen out of the placement rack and insert the solder wire into the mounting tube.

[0022] Step (B): When using, adjust the rotation of the first control component to control the fan speed and the rotation of the second control component to control the temperature of the welding pen according to the specific situation.

[0023] Step (C): During the processing, the mobile phone motherboard that needs to be soldered is first placed into the processing slot at the top of the processing rack, so that the elastic element in the processing slot clamps the mobile phone motherboard. Then, the soldering pen is held with one hand to perform soldering. During the soldering process, the servo motor is controlled by pressing the control key to make the anti-slip part in the mounting cylinder rotate to transport the solder wire in the mounting cylinder. The fan speeds up the cooling of the solder, thereby quickly completing the soldering processing of the mobile phone motherboard components.

[0024] Compared with the prior art, the beneficial effects of the present invention are:

[0025] This invention, by setting up an auxiliary welding component, enables one-handed soldering of the electric soldering pen during the welding process. During the welding process, the servo motor is controlled by pressing the control key, which rotates the anti-slip part in the mounting cylinder to deliver the solder wire in the mounting cylinder. At the same time, the processing frame can limit the mobile phone motherboard, making the welding more convenient and the welding effect better. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0027] Figure 2 This is a schematic diagram of the installation structure of the integrated power supply device of the present invention;

[0028] Figure 3 This is a schematic diagram of one side of the structure of the present invention;

[0029] Figure 4 This is a partial cross-sectional view of the mounting bracket of the present invention;

[0030] Figure 5 This is a partial cross-sectional view of the processing frame of the present invention;

[0031] Figure 6 This is a schematic diagram of the structure of the welding pen of the present invention;

[0032] Figure 7 This is a partial cross-sectional view of the extension frame and mounting cylinder of the present invention;

[0033] Figure 8 This is a schematic diagram of the placement rack structure of the present invention.

[0034] In the diagram: 1. Mounting bracket; 11. Slide groove; 12. Rotating shaft; 13. Mounting cavity; 14. First spring; 15. Snap-fit ​​component; 16. Snap-fit ​​groove; 2. Integrated power supply device; 21. Grille; 22. Protective rod; 23. Fan; 24. First control component; 25. Second control component; 3. Welding pen; 31. Connecting wire; 32. Fixing bracket; 33. Rewind reel; 34. Welding head; 4. Processing frame; 41. Processing groove; 42. Movable groove; 43. Guide rail; 44. Slider; 45. Second spring; 46. Elastic component; 5. Placement frame; 51. Connecting shaft; 52. Clamping plate; 53. Protective pad; 6. Control key; 61. Extension frame; 62. Servo motor; 63. Mounting cylinder; 64. Mounting shaft; 65. Mounting ring; 66. Third spring; 67. Anti-slip component; 68. Fourth spring; 69. Pressure plate. Detailed Implementation

[0035] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0036] Please see Figures 1-8 A welding apparatus for processing mobile phone motherboards, comprising:

[0037] The welding mechanism includes a mounting frame 1 and an integrated power supply device 2 that rotates inside the mounting frame 1, as well as an electric welding pen 3 connected to the integrated power supply device 2, with an electric welding head 34 provided at one end of the electric welding pen 3.

[0038] The auxiliary welding assembly includes an extension frame 61 disposed on the side wall of the welding pen 3 and a mounting cylinder 63 installed inside the extension frame 61. The mounting cylinder 63 is installed obliquely inside the extension frame 61, and one end of the mounting cylinder 63 is located on one side of the welding head 34.

[0039] A servo motor 62 is fixedly installed on one side of the extension frame 61. A mounting shaft 64 is fixedly installed on the output end of the servo motor 62. An anti-slip part 67 is installed on the side wall of the mounting shaft 64. The anti-slip part 67 is located inside the mounting cylinder 63.

[0040] Several fourth springs 68 are fixedly installed on the inner wall of the mounting cylinder 63. A pressure plate 69 is fixedly installed on one end of the fourth spring 68. The pressure plate 69 is an arc-shaped part and corresponds to the anti-slip part 67.

[0041] The motherboard fixing mechanism includes a processing frame 4 that slides at the bottom of the mounting frame 1 and an elastic element 46 disposed inside the processing frame 4. The elastic element 46 is an arc-shaped element.

[0042] The placement assembly includes a placement rack 5 mounted on one side of the mounting frame 1 and a clamping plate 52 disposed on one side of the placement rack 5.

[0043] In this embodiment, a mounting ring 65 is fixedly mounted on the side wall of the mounting shaft 64, and a plurality of third springs 66 are fixedly mounted on the side wall of the mounting ring 65. The other end of the third springs 66 is fixedly mounted on the inner wall of the anti-slip component 67. A control key 6 is fixedly mounted on one side of the welding pen 3. The control key 6 is connected to the servo motor 62 through a wire.

[0044] Among them, a fixed frame 32 is fixedly installed on the side wall of the mounting frame 1, and a winding reel 33 is rotatably connected inside the fixed frame 32. A connecting wire 31 is wound inside the winding reel 33, and the welding pen 3 is connected to the integrated power supply device 2 through the connecting wire 31.

[0045] It should be noted that the mounting cylinder 63 can be used to hold solder wire. After the solder wire is placed inside the mounting cylinder 63, it can be directly fed to the soldering head 34 at one end of the soldering pen 3 for heating and melting. The solder wire inside the mounting cylinder 63 can be clamped by the third spring 66, the anti-slip part 67, the fourth spring 68, and the pressure plate 69. The rotation of the mounting shaft 64 can be controlled by the servo motor 62, and the operation of the servo motor 62 can be controlled by the control key 6. The rotation of the mounting shaft 64 can drive the anti-slip part 67 connected to it via the third spring 66 to rotate, thereby feeding the solder wire inside the mounting cylinder 63. By holding the soldering pen 3 with one hand and pressing the control key 6, one-handed soldering can be performed more conveniently.

[0046] In this embodiment, a fan 23 is fixedly installed inside the integrated power supply device 2, a grille 21 is fixedly installed on one side of the integrated power supply device 2, a protective rod 22 is fixedly installed on the surface of the grille 21, and a first control component 24 and a second control component 25 are installed on one side of the integrated power supply device 2.

[0047] It should be noted that the first control component 24 can be used to control the power output of the integrated power supply device 2 to the fan 23 by rotating the first control component 24, thereby adjusting the rotation of the fan 23. The second control component 25 can be used to control the power output of the integrated power supply device 2 to the soldering pen 3 by rotating the second control component 25, thereby adjusting the soldering temperature of the soldering pen 3. The fan 23 can be set to accelerate the cooling of the solder, thereby making the soldering more efficient.

[0048] In this embodiment, a rotating shaft 12 is rotatably connected to the inner wall of the mounting frame 1. One end of the rotating shaft 12 is fixedly installed on one side of the integrated power supply device 2, and the integrated power supply device 2 is rotatably connected to the inside of the mounting frame 1 through the rotating shaft 12.

[0049] The mounting frame 1 has a mounting cavity 13 inside, a first spring 14 is fixedly installed on the inner wall of the mounting cavity 13, a snap-fit ​​piece 15 is fixedly installed on one end of the first spring 14, and a number of snap-fit ​​grooves 16 that fit with the snap-fit ​​piece 15 are opened on the side wall of the rotating shaft 12.

[0050] It should be noted that both the snap-fit ​​component 15 and the snap-fit ​​groove 16 are triangular. The first spring 14 can be used to support the snap-fit ​​component 15, so that the snap-fit ​​component 15 can be snapped into the snap-fit ​​groove 16. This can fix the rotating shaft 12 after rotation without affecting its rotation, thus preventing the integrated power supply device 2 from rotating arbitrarily.

[0051] In this embodiment, the mounting frame 1 has a sliding groove 11 at the bottom, the processing frame 4 is slidably connected inside the sliding groove 11, the processing frame 4 has a processing groove 41 at the top, the processing groove 41 has a movable groove 42 on the inner wall of the processing groove 41, the movable groove 42 is fixedly installed on the inner wall of the movable groove 42, the elastic element 46 has a slider 44 fixedly installed at both ends, the slider 44 is slidably connected to the side wall of the guide rail 43, the side wall of the guide rail 43 is installed with a second spring 45, one end of the second spring 45 is in contact with the slider 44, and the other end of the second spring 45 is in contact with the movable groove 42;

[0052] It should be noted that by setting the slide groove 11, the processing rack 4 can be slidably placed in the slide groove 11 at the bottom of the mounting rack 1, which facilitates the storage of the processing rack 4. The processing groove 41 can be used to place the mobile phone motherboard that needs to be soldered. The guide rail 43 allows the slider 44 to slide in the movable groove 42. The second spring 45 can push the slider 44 to one side. By pressing the mobile phone motherboard into the processing groove 41, the elastic element 46 bends and deforms. With the support force of the second spring 45, the elastic element 46 can elastically clamp the side wall of the mobile phone motherboard in the processing groove 41.

[0053] In this embodiment, a connecting shaft 51 is rotatably connected to one side of the placement rack 5 via a torsion spring, a clamping plate 52 is fixedly installed on the side wall of the connecting shaft 51, and a protective pad 53 is fixedly installed on the inner wall of the clamping plate 52.

[0054] It should be noted that by setting a torsion spring, the clamping plate 52 can be rotated to one side. By cooperating with the two clamping plates 52, the welding pen 3 can be clamped and fixed to one side of the placement rack 5, which makes it convenient to place and take out the welding pen 3. By setting a protective pad 53, the surface of the welding pen 3 can be protected during the clamping process.

[0055] The method of using the welding device for mobile phone motherboard processing of the present invention includes the following steps:

[0056] Step (A): Before use, slide the processing rack 4 out of the bottom slide groove 11 of the mounting rack 1, then move the integrated power supply device 2 to adjust the air outlet position of the fan 23 in the integrated power supply device 2 so that the fan 23 is aligned with the processing groove 41 in the processing rack 4. Then take the soldering pen 3 out of the placement rack 5 and insert the solder wire into the mounting cylinder 63.

[0057] Step (B): When using, adjust the rotation of the first control component 24 to control the speed of the fan 23 and the rotation of the second control component 25 to control the temperature of the welding pen 3 according to the specific situation.

[0058] Step (C): During the processing, the mobile phone motherboard to be soldered is first placed into the processing groove 41 at the top of the processing rack 4, so that the elastic element 46 in the processing groove 41 clamps the mobile phone motherboard. Then, the soldering pen 3 can be held with one hand to perform soldering. During the soldering process, the servo motor 62 is controlled by pressing the control key 6, so that the anti-slip element 67 in the mounting cylinder 63 rotates to transport the solder wire in the mounting cylinder 63. The fan 23 can accelerate the cooling of the solder, thereby quickly completing the soldering of the mobile phone motherboard components.

[0059] In summary, this mobile phone motherboard processing welding device, by setting up auxiliary welding components, allows for single-handed soldering of the soldering pen 3 during the welding process. During the welding process, pressing the control key 6 controls the servo motor 62 to rotate the anti-slip part 67 in the mounting cylinder 63 to transport the solder wire in the mounting cylinder 63. At the same time, the processing frame 4 can limit the mobile phone motherboard, making the welding more convenient and the welding effect better.

[0060] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A welding device for processing mobile phone motherboards, characterized in that: The utility model relates to welding equipment technical field, and particularly a welding equipment. The utility model discloses a welding mechanism, including mounting frame (1) and integrated power supply device (2) that rotates in the inside of mounting frame (1), and electric welding pen (3) is connected with integrated power supply device (2), one end of electric welding pen (3) is provided with electric welding head (34), Auxiliary welding assembly, including the extension frame (61) of setting in the side wall of electric welding pen (3) and the installation cylinder (63) of installing in the inside of extension frame (61), the installation cylinder (63) is obliquely installed in the inside of extension frame (61), one end of installation cylinder (63) is located in electric welding head (34) one side, One side of extension frame (61) is fixedly installed with servo motor (62), the output end of servo motor (62) is fixedly installed with mounting shaft (64), the side wall of mounting shaft (64) is installed with antiskid piece (67), and antiskid piece (67) is located in the inside of installation cylinder (63), The inner wall of installation cylinder (63) is fixedly installed with a plurality of fourth springs (68), one end of fourth spring (68) is fixedly installed with pressing plate (69), pressing plate (69) is arc piece, and pressing plate (69) corresponds with antiskid piece (67), Mainboard fixing mechanism, including the machining frame (4) of sliding in the bottom of mounting frame (1) and the elastic piece (46) of setting in the inside of machining frame (4), and elastic piece (46) is arc piece, Placing assembly, including the placing frame (5) of installing in one side of mounting frame (1) and the clamping plate (52) of setting in one side of placing frame (5), The side wall of mounting shaft (64) is fixedly installed with mounting ring (65), the side wall of mounting ring (65) is fixedly installed with a plurality of third springs (66), and the other end of third spring (66) is fixedly installed in the inner wall of antiskid piece (67), The inside of integrated power supply device (2) is fixedly installed with fan (23), one side of integrated power supply device (2) is fixedly installed with grille (21), the surface of grille (21) is fixedly installed with protection rod (22), and one side of integrated power supply device (2) is installed with first control part (24) and second control part (25), One side of electric welding pen (3) is fixedly installed with control key (6), and control key (6) is connected with servo motor (62) through wire, The inner wall of mounting frame (1) is rotatably connected with pivot (12), one end of pivot (12) is fixedly installed in one side of integrated power supply device (2), and integrated power supply device (2) is rotatably connected in the inside of mounting frame (1) through pivot (12), The inside of mounting frame (1) is provided with installation cavity (13), the inner wall of installation cavity (13) is fixedly installed with first spring (14), one end of first spring (14) is fixedly installed with clamping piece (15), and the side wall of pivot (12) is provided with a plurality of clamping grooves (16) that are matched with clamping piece (15). The mounting frame (1) bottom is provided with a sliding groove (11), the processing frame (4) is slidably connected in the sliding groove (11), the processing frame (4) top is provided with a processing groove (41), the processing groove (41) inner wall is provided with a movable slot (42), the movable slot (42) inner wall is fixedly installed with guide rail (43), the elastic member (46) both ends are fixedly installed with sliding block (44), the sliding block (44) is slidably connected in the guide rail (43) side wall, the guide rail (43) side wall is installed with second spring (45), the second spring (45) one end and the sliding block (44) contact, the second spring (45) other end and the movable slot (42) contact; The placing frame (5) one side is rotatably connected with connecting shaft (51) through torsional spring, the clamping plate (52) is fixedly installed in the connecting shaft (51) side wall, the clamping plate (52) inner wall is fixedly installed with protective pad (53); The mounting frame (1) side wall is fixedly installed with fixed frame (32), the fixed frame (32) is rotatably connected with winding disc (33) in, the winding disc (33) is wound with connecting line (31) in, the electric welding pen (3) is connected with the integrated power supply device (2) through the connecting line (31).

2. A method of using the welding device for processing a mobile phone mainboard according to claim 1, characterized in that: Including the following steps: Step (A), before use, the processing frame (4) is slidably taken out from the sliding groove (11) in the bottom of the mounting frame (1), then the integrated power supply device (2) is actuated, the air outlet position of the fan (23) in the integrated power supply device (2) is adjusted, so that the fan (23) is aligned with the processing groove (41) in the processing frame (4), then the electric welding pen (3) is taken out from the placing frame (5), and the solder wire is inserted into the mounting cylinder (63); Step (B), during use, the first control member (24) is rotated to control the rotating speed of the fan (23), and the second control member (25) is rotated to control the temperature of the electric welding pen (3); Step (C), during the processing, first, the mobile phone mainboard to be welded is placed in the processing groove (41) on the top of the processing frame (4), so that the elastic member (46) in the processing groove (41) clamps the mobile phone mainboard, then one hand holds the electric welding pen (3) to weld and process, during the welding process, the control key (6) is pressed to control the servo motor (62) to run, so that the anti-skid member (67) in the mounting cylinder (63) rotates to convey the solder wire in the mounting cylinder (63), and the fan (23) accelerates the solder cooling, so that the welding and processing of the mobile phone mainboard parts are quickly completed.

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