Combined preparation method of aluminum target material and copper back plate

Abstract

The invention discloses a combined preparation method of an aluminum target material and a copper back plate, which relates to the technical field of target materials, and comprises the following steps: preparing an aluminum target blank and a copper back plate, and arranging a clamping mechanism for mutually buckling the aluminum target blank and the copper back plate on the welding surfaces of the aluminum target blank and the copper back plate; cleaning and drying the welding surfaces of the aluminum target blank and the copper back plate; buckling the welding surfaces of the aluminum target blank and the copper back plate through a clamping mechanism, and then welding edge gaps of the welding surfaces at the buckling position through electron beams to form a combined body; heating the combined body; the heated combination is subjected to composite rolling, leveled through a hydraulic machine after rolling is completed, and then air-cooled to the room temperature; the aluminum target material and the copper back plate are combined into a whole through a method of composite rolling after heat treatment, and the grain shape of the aluminum target material cannot be damaged; as for the welding faces of the aluminum target and the copper back plate, ultrasonic treatment is conducted through dispersion liquid before heat treatment, the interface bonding energy of the aluminum target and the copper back plate is improved during follow-up hot rolling, and then the bonding strength is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of target materials, and particularly relates to a method for bonding and preparing an aluminum target and a copper backplane. Background Art

[0002] In the technical field of metal target material preparation, high-purity aluminum targets are widely used in manufacturing fields such as semiconductors. The welding quality during their bonding with copper backplanes directly affects the performance and service life of the targets. Common welding methods include brazing, electron beam welding, diffusion welding, and explosion welding. Among them, brazing usually uses indium solder and has problems such as low welding strength. Electron beam welding can only weld the same metal or metals with similar melting points and cannot weld large areas. Diffusion welding equipment is expensive, the process is complex, and grain growth is serious. The explosion welding process is complex, costly, and the grain size of the aluminum target grows after welding. Therefore, exploring and optimizing new welding processes is crucial for ensuring the reliability and application effect of high-purity aluminum targets and reducing costs.

[0003] The patent document with the publication number CN114807691A discloses an aluminum-copper composite material with high strength, high conductivity, and high elastic modulus and its preparation process. The preparation process of the aluminum-copper composite material given is as follows: grinding and polishing the surface of the copper alloy, cleaning its surface with alcohol and preheating, then pouring the aluminum alloy melt onto the preheated surface of the copper alloy and immediately performing repeated rolling on it, and performing solution treatment and aging treatment on the rolled aluminum-copper composite material to obtain an aluminum-copper composite material with high strength, high conductivity, and high elastic modulus. Although this solid-liquid composite method can obtain a layered composite material with high bonding strength, it is difficult to be applied in the field of sputtering targets with strict requirements for purity, grain size, etc.

[0004] The patent document with the publication number CN103394510A discloses a production process for cold-rolled copper-aluminum composite materials. It uses an aluminum strip as the base material and a copper strip as the clad material; the thickness of the copper strip is 18-22% of the thickness of the aluminum strip; the surface roughness of the aluminum strip is Rz = 95-115 μm; the surface roughness of the copper strip is Rz = 80-95 μm; after composite rolling, it is kept at a temperature of 605-610 °C for 8-10 minutes, and finally water-cooled and forced to cool to room temperature; it can achieve the best match of deformation amount, layer thickness ratio, and composite strength, and has the advantages of high interfacial composite strength and good dynamic thermal stability. However, the grain size of the composite material prepared by it is large and it is not suitable for the target material field.

[0005] The patent document with the publication number CN111515484A relates to a welding method for high-purity aluminum targets, including: brazing the high-purity aluminum target and the backplane, and cooling after welding; wherein, a groove is provided on the welding surface of the high-purity aluminum target; a solder groove is provided in the groove; the backplane includes a reusable backplane. In the present invention, through the special design of the welding surface of the target and the reasonable selection of the welding method, the problem of welding detachment when welding the target and the reused backplane is solved. Through this method, the welding rate after welding can reach ≥99.8%, and the single defect rate ≤0.2%; however, this patent still has the problem that the welding quality and stability need to be further improved.

[0006] The patent document with the publication number CN103785911A discloses a welding method for a target assembly, including: providing an aluminum target blank and a backplane; performing surface infiltration treatment on the welding surface of the aluminum target blank using molten zinc-tin solder; performing surface infiltration treatment on the welding surface of the backplane using molten indium solder; welding the welding surface of the surface-infiltrated aluminum target blank and the welding surface of the backplane together using zinc-tin solder and indium solder. In the present invention, the welding method of the target assembly effectively improves the bonding rate and welding strength between the aluminum target blank and the backplane, making the bonding rate between the aluminum target blank and the backplane reach more than 97%, and can effectively reduce the probability of target detachment or deformation of the welded target assembly. However, this patent still has the problem that the welding strength needs to be further improved. Summary of the Invention

[0007] The purpose of the present invention is to provide a method for preparing the combination of an aluminum target and a copper backplane to solve the following technical problems:

[0008] How to improve the bonding strength between the aluminum target and the copper backplane.

[0009] The purpose of the present invention can be achieved through the following technical solutions:

[0010] The present invention discloses a method for preparing the combination of an aluminum target and a copper backplane, including the following steps:

[0011] Step 1: Prepare an aluminum target blank and a copper backplane, and provide a clamping mechanism on the welding surfaces of the aluminum target blank and the copper backplane for clamping the aluminum target blank and the copper backplane to each other;

[0012] Step 2: Clean and dry the welding surfaces of the aluminum target blank and the copper backplane;

[0013] Step 3: Clamp the welding surfaces of the aluminum target blank and the copper backplane through the clamping mechanism, and then electron beam weld the edge gaps of the welding surfaces at the clamped part to form a combined body;

[0014] Step 4: Heat the combined body;

[0015] Step Five: Subject the heated combination to composite rolling. After rolling is completed, use a hydraulic press to flatten it, and then air-cool it to room temperature.

[0016] In a further embodiment of the present invention: In Step One, the thickness of the aluminum target is 30 - 50 mm, and the thickness of the copper backplane is 10 - 15 mm.

[0017] Preferably, the thickness of the aluminum target is 40 mm, and the thickness of the copper backplane is 12 mm.

[0018] In a further embodiment of the present invention: In Step One, the engaging mechanism includes a groove provided on the welding surface of the aluminum target blank and a protrusion provided on the welding surface of the copper backplane, and the protrusion is embedded in the groove.

[0019] In a further embodiment of the present invention: The groove is provided in a circle around the edge of the welding surface of the aluminum target blank, and the depth of the groove is 0.5 - 2 mm.

[0020] Preferably, the depth of the groove is 1 mm.

[0021] In a further embodiment of the present invention: In Step Two, the method for cleaning the welding surfaces of the aluminum target blank and the copper backplane is as follows: Use hot water at 40 - 50 °C combined with a cleaning agent to clean the welding surfaces of the aluminum target blank and the copper backplane, then place the aluminum target blank in a dispersion liquid and ultrasonically clean it at 40 Hz and 100 W for 1 - 2 min, and place the copper backplane in the dispersion liquid and ultrasonically clean it at 40 Hz and 100 W for 5 - 10 min.

[0022] Preferably, in Step Two, the method for cleaning the welding surfaces of the aluminum target blank and the copper backplane is as follows: Use hot water at 45 °C combined with a cleaning agent to clean the welding surfaces of the aluminum target blank and the copper backplane, then place the aluminum target blank in a dispersion liquid and ultrasonically clean it at 40 Hz and 100 W for 1.5 min, and place the copper backplane in the dispersion liquid and ultrasonically clean it at 40 Hz and 100 W for 8 min.

[0023] In a further embodiment of the present invention: The preparation method of the dispersion liquid is as follows: Add nano-ceria and graphene quantum dots to deionized water and stir evenly.

[0024] In a further embodiment of the present invention: The weight ratio of nano-ceria to graphene quantum dots is (2 - 4):1.

[0025] Preferably, the weight ratio of nano-ceria to graphene quantum dots is 3:1.

[0026] In a further embodiment of the present invention: The mass fraction of the total amount of nano-ceria and graphene quantum dots in the dispersion liquid is 0.15 - 0.25 wt%.

[0027] Preferably, the mass fraction of the total amount of nano-ceria and graphene quantum dots in the dispersion liquid is 0.2 wt%.

[0028] In a further aspect of the present invention: in step four, the method for heating the combination is: placing the combination in a box-type heating furnace and keeping it at 300 - 500 °C for 15 - 60 min;

[0029] Preferably, the method for heating the combination is: placing the combination in a box-type heating furnace and keeping it at 400 °C for 30 min.

[0030] In a further aspect of the present invention: in step five, the parameters for compound rolling of the heated combination are: the total rolling deformation rate is 40 - 70% and the deformation rate per rolling pass is 20 - 40%;

[0031] Preferably, in step five, the parameters for compound rolling of the heated combination are: the total rolling deformation rate is 50% and the deformation rate per rolling pass is 30%.

[0032] Based on this, a preferred method for preparing the combination of an aluminum target and a copper backplane is obtained, including the following steps:

[0033] Step one: Prepare an aluminum target blank with a thickness of 40 mm and a copper backplane with a thickness of 12 mm. Open a groove with a depth of 1 mm around the edge of the welding surface of the aluminum target blank, and set a protrusion corresponding to the groove on the welding surface of the copper backplane, so that the protrusion can be fitted into the groove in a matching manner, and the matching protrusion and groove form a clamping mechanism;

[0034] Step two: Use hot water at 45 °C combined with a cleaning agent to clean the welding surfaces of the aluminum target blank and the copper backplane, and rinse them clean; then prepare a dispersion liquid: add nano-ceria and graphene quantum dots with a weight ratio of 3:1 to deionized water and stir evenly. The mass fraction of the total amount of nano-ceria and graphene quantum dots is 0.15 - 0.25 wt% to form a dispersion liquid; then place the aluminum target blank in the dispersion liquid and ultrasonically clean it at 40 Hz and 100 W for 1.5 min, place the copper backplane in the dispersion liquid and ultrasonically clean it at 40 Hz and 100 W for 8 min, take them out and air-dry to make the welding surfaces dry;

[0035] Step three: Buckle the welding surfaces of the aluminum target blank and the copper backplane through the clamping mechanism, and then electron beam weld the edge gaps of the welding surfaces at the buckled part to achieve edge sealing and form a combination;

[0036] Step four: Place the combination in a box-type heating furnace and keep it at 400 °C for 30 min;

[0037] Step 5: Perform composite rolling on the heated combination body, with a total rolling deformation rate of 50% and a rolling pass deformation rate of 30%. After rolling, level it with a hydraulic press and then air-cool it to room temperature.

[0038] Advantages of the present invention:

[0039] The present invention combines an aluminum target with a copper backplane into one body through a method of heat treatment followed by composite rolling. Compared with various existing welding methods, not only is the processing technology simpler, but also the processing intensity on the aluminum target is lower, and the grain morphology of the aluminum target will not be damaged. For the welding surface between the aluminum target and the copper backplane, ultrasonic treatment is carried out with a dispersion liquid before heat treatment. The dispersion liquid contains nano-ceria and graphene quantum dots. The nano-ceria therein scavenges oxygen free radicals on the welding surface through redox reactions to prevent its secondary oxidation. At the same time, the nitrogen-containing functional groups in the graphene quantum dots will form a strong adsorption layer with the welding surface, enhancing the interfacial binding energy between the two during subsequent hot rolling. Moreover, during the processing, edge sealing treatment is also carried out by electron beam welding to further prevent secondary oxidation of the bonding interface, which is beneficial to improving the bonding strength during the hot rolling process. Description of the drawings

[0040] The present invention will be further described below with reference to the accompanying drawings.

[0041] Figure 1 is a schematic diagram of the combination body of the aluminum target and the copper backplane prepared in Example 1 of the present invention;

[0042] Figure 2 is a morphology map of the grain size distribution of the aluminum target in the combination body of the aluminum target and the copper backplane prepared in Example 1 of the present invention;

[0043] Figure 3 is a morphology map of the grain size distribution of the aluminum target in the combination body of the aluminum target and the copper backplane prepared in Comparative Example 1 of the present invention. Specific embodiments

[0044] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0045] The experimental methods in the following embodiments are all conventional methods unless otherwise specified, and are carried out according to the technologies or conditions described in the literature in the field or according to the product specifications. The materials, reagents, etc. used in the following embodiments can be obtained from commercial channels unless otherwise specified.

[0046] Example 1

[0047] This embodiment discloses a method for preparing the combination of an aluminum target and a copper backplane, which is characterized by including the following steps:

[0048] Step 1: Prepare an aluminum target blank with a thickness of 40 mm and a copper backplane with a thickness of 12 mm. Open a groove with a depth of 1 mm around the edge of the welding surface of the aluminum target blank, and set a protrusion corresponding to the groove on the welding surface of the copper backplane, so that the protrusion can be fitted into the groove in a matching manner, and the matching protrusion and groove form a clamping mechanism;

[0049] Step 2: Use hot water at 45 °C combined with a cleaner to clean the welding surfaces of the aluminum target blank and the copper backplane, and rinse them clean; then prepare a dispersion: Add cerium oxide nanoparticles and graphene quantum dots with a weight ratio of 3:1 to deionized water and stir evenly. The total mass fraction of cerium oxide nanoparticles and graphene quantum dots is 0.2 wt%, forming a dispersion; then place the aluminum target blank in the dispersion and ultrasonically clean it at 40 Hz and 100 W for 1.5 min, place the copper backplane in the dispersion and ultrasonically clean it at 40 Hz and 100 W for 8 min, take it out and air-dry it to make the welding surface dry;

[0050] Step 3: Fasten the welding surfaces of the aluminum target blank and the copper backplane through the clamping mechanism, and then electron beam weld the edge gap of the welding surface at the fastening part to achieve edge sealing and form a combination;

[0051] Step 4: Place the combination in a box-type heating furnace and keep it at 400 °C for 30 min;

[0052] Step 5: Perform composite rolling on the heated combination. The total rolling deformation rate is 50% and the rolling pass deformation rate is 30%. After rolling, use a hydraulic press to flatten it, and then air-cool it to room temperature to achieve the combination of the aluminum target and the copper backplane.

[0053] Embodiment 2

[0054] This embodiment discloses a method for preparing the combination of an aluminum target and a copper backplane, which is characterized by including the following steps:

[0055] Step 1: Prepare an aluminum target blank with a thickness of 30 mm and a copper backplane with a thickness of 10 mm. Open a groove with a depth of 0.5 mm around the edge of the welding surface of the aluminum target blank, and set a protrusion corresponding to the groove on the welding surface of the copper backplane, so that the protrusion can be fitted into the groove in a matching manner, and the matching protrusion and groove form a clamping mechanism;

[0056] Step 2: Clean the welding surfaces of the aluminum target blank and the copper backplane with 40°C hot water combined with a cleaning agent, and rinse them thoroughly; then prepare a dispersion: Add cerium oxide nanoparticles and graphene quantum dots with a weight ratio of 3:1 to deionized water and stir evenly. The total mass fraction of cerium oxide nanoparticles and graphene quantum dots is 0.2 wt%, forming a dispersion; then place the aluminum target blank in the dispersion and ultrasonically clean it at 40 Hz and 100 W for 1 min, place the copper backplane in the dispersion and ultrasonically clean it at 40 Hz and 100 W for 5 min, take them out and air-dry to make the welding surfaces dry;

[0057] Step 3: Snap the welding surfaces of the aluminum target blank and the copper backplane through the engaging mechanism, and then electron beam weld the edge gaps of the welding surfaces at the snap joint to achieve edge sealing and form a combined body;

[0058] Step 4: Place the combined body in a box-type heating furnace and keep it at 300°C for 60 min;

[0059] Step 5: Perform composite rolling on the heated combined body. The total rolling deformation rate is 40% and the rolling deformation rate per pass is 20%. After rolling, use a hydraulic press to flatten it, and then air-cool it to room temperature to achieve the combination of the aluminum target material and the copper backplane.

[0060] Example 3

[0061] This example discloses a preparation method for the combination of an aluminum target material and a copper backplane, which is characterized by including the following steps:

[0062] Step 1: Prepare an aluminum target blank with a thickness of 50 mm and a copper backplane with a thickness of 15 mm. Open a groove with a depth of 2 mm around the edge of the welding surface of the aluminum target blank, and set a protrusion corresponding to the groove on the welding surface of the copper backplane, so that the protrusion can be fitted into the groove in a matching manner. The matching protrusion and groove form an engaging mechanism;

[0063] Step 2: Clean the welding surfaces of the aluminum target blank and the copper backplane with 50°C hot water combined with a cleaning agent, and rinse them thoroughly; then prepare a dispersion: Add cerium oxide nanoparticles and graphene quantum dots with a weight ratio of 3:1 to deionized water and stir evenly. The total mass fraction of cerium oxide nanoparticles and graphene quantum dots is 0.2 wt%, forming a dispersion; then place the aluminum target blank in the dispersion and ultrasonically clean it at 40 Hz and 100 W for 2 min, place the copper backplane in the dispersion and ultrasonically clean it at 40 Hz and 100 W for 10 min, take them out and air-dry to make the welding surfaces dry;

[0064] Step 3: Snap the welding surfaces of the aluminum target blank and the copper backplane through the engaging mechanism, and then electron beam weld the edge gaps of the welding surfaces at the snap joint to achieve edge sealing and form a combined body;

[0065] Step 4: Place the combined body in a box-type heating furnace and keep it at 500°C for 15 min;

[0066] Step 5: Perform compound rolling on the heated combination body, with a total rolling deformation rate of 70% and a rolling pass deformation rate of 40%. After rolling, use a hydraulic press to flatten it, and then air-cool it to room temperature to achieve the bonding of the aluminum target and the copper backplane.

[0067] Example 4

[0068] This example discloses a preparation method for bonding an aluminum target and a copper backplane. Compared with Example 1, the difference is only that: in Step 2, the nano-ceria and graphene quantum dots in the dispersion liquid are adjusted to 2:1, and the mass fraction of the total amount of nano-ceria and graphene quantum dots is 0.15 wt%; other steps and conditions remain the same, and finally the bonding of the aluminum target and the copper backplane is achieved.

[0069] Example 5

[0070] This example discloses a preparation method for bonding an aluminum target and a copper backplane. Compared with Example 1, the difference is only that: in Step 2, the nano-ceria and graphene quantum dots in the dispersion liquid are adjusted to 4:1, and the mass fraction of the total amount of nano-ceria and graphene quantum dots is 0.25 wt%; other steps and conditions remain the same, and finally the bonding of the aluminum target and the copper backplane is achieved.

[0071] Comparative Example 1

[0072] This comparative example discloses a preparation method for bonding an aluminum target and a copper backplane. Compared with Example 1, the difference is only that Step 5 is replaced with: performing HIP hot isostatic pressing welding on the heated combination body, with welding parameters of temperature 400 °C, pressure 130 MPa, and time 3 h; other steps and conditions remain the same, and finally the bonding of the aluminum target and the copper backplane is achieved.

[0073] Comparative Example 2

[0074] This comparative example discloses a preparation method for bonding an aluminum target and a copper backplane. Compared with Example 1, the difference is only that Step 5 is replaced with: performing brazing on the heated combination body using indium solder, with a welding layer thickness of 0.3 mm; other steps and conditions remain the same, and finally the bonding of the aluminum target and the copper backplane is achieved.

[0075] Comparative Example 3

[0076] This comparative example discloses a preparation method for bonding an aluminum target and a copper backplane. Compared with Example 1, the difference is only that Step 5 is replaced with: performing explosion welding on the heated combination body, specifically referring to the patent document with the publication number CN 104690410A; other steps and conditions remain the same, and finally the bonding of the aluminum target and the copper backplane is achieved.

[0077] Comparative Example 4

[0078] This comparative example discloses a method for preparing the combination of an aluminum target and a copper backplane. Compared with Example 1, the only difference is that step four is cancelled; other steps and conditions remain the same, and finally the combination of the aluminum target and the copper backplane is achieved.

[0079] Comparative Example 5

[0080] This comparative example discloses a method for preparing the combination of an aluminum target and a copper backplane. Compared with Example 1, the only difference is that in step three, the electron beam welding edge sealing process is cancelled; other steps and conditions remain the same, and finally the combination of the aluminum target and the copper backplane is achieved.

[0081] Comparative Example 6

[0082] This comparative example discloses a method for preparing the combination of an aluminum target and a copper backplane. Compared with Example 1, the only difference is that in step two, the dispersion liquid is cancelled and replaced with clear water; other steps and conditions remain the same, and finally the combination of the aluminum target and the copper backplane is achieved.

[0083] The combinations of the aluminum targets and copper backplanes prepared in Examples 1 - 5 and Comparative Examples 1 - 6 are detected, including the detection of the grain size of the aluminum target blanks and the detection of the welding strength at the bonding interface. The detection methods are as follows:

[0084] Detection of the grain size of the aluminum target blanks: The combination of the aluminum target and the copper backplane is polished with sandpaper, and then the aluminum target blank is electro - polished with an electrolytic polishing solution (perchloric acid + ethanol + water). After polishing, electrolytic corrosion is carried out (the corrosion solution is Keller reagent), and finally clear grains can be observed using a metallographic microscope; among them, the micro - morphological diagram of the grain size of the aluminum target blank in Example 1 is as Figure 1 shown, and the micro - morphological diagram of the grain size of the aluminum target blank in Comparative Example 1 is as Figure 2 shown.

[0085] Detection of the welding strength: Refer to the national standard GB / T 39163 - 2020 "Test Method for the Bonding Strength of Targets and Backplanes".

[0086] The detection results are listed in Table 1 as follows:

[0087] Table 1

[0088]

[0089]

[0090] By analyzing the data in Table 1, it can be seen that compared with Comparative Examples 1-6, Examples 1-5 simultaneously satisfied the requirements of uniform and fine grain size of the aluminum target blank and high welding strength, while Comparative Examples 1-6 could not meet both requirements at the same time. This shows that the method for preparing the combination of the aluminum target material and the copper backplane of the present invention can achieve high-strength combination of the aluminum target material and the copper backplane without affecting the grain size of the aluminum target blank.

[0091] The above has described in detail multiple embodiments of the present invention, but the content described is only the preferred embodiments of the present invention and cannot be considered as limiting the scope of implementation of the present invention. All equivalent changes and improvements made according to the scope of the application of the present invention should still fall within the scope covered by the patent of the present invention.

Claims

1. A method for preparing a combination of an aluminum target and a copper backing plate, characterized in that: The steps include: Step 1: prepare an aluminum target blank and a copper backing plate, and provide a clamping mechanism on the welding surface of the aluminum target blank and the copper backing plate for buckling the aluminum target blank and the copper backing plate with each other; Step 2: Clean and dry the welding surfaces of the aluminum target blank and the copper back plate; Step 3, buckling the welding surfaces of the aluminum target blank and the copper back plate through a clamping mechanism, and then welding the edge gap of the welding surface at the buckling position by electron beam welding to form a combined body; Step 4: heating the combination; Step 5: Composite rolling is performed on the heated combination. After rolling, a hydraulic press is used to level the combination, and the combination is then air-cooled to room temperature.

2. The method for combining an aluminum target and a copper backing plate according to claim 1, characterized in that: In step 1, the thickness of the aluminum target is 30-50 mm, and the thickness of the copper back plate is 10-15 mm.

3. The method for combining an aluminum target and a copper back plate according to claim 1, characterized in that: In step one, the clamping mechanism includes a groove arranged on the welding surface of the aluminum target blank and a protrusion arranged on the welding surface of the copper back plate, and the protrusion is embedded in the groove.

4. The method for combining an aluminum target and a copper backing plate according to claim 3, characterized in that: The groove is arranged around the edge of the welding surface of the aluminum target blank, and the depth of the groove is 0.5-2 mm.

5. The method for combining an aluminum target and a copper backing plate according to claim 1, characterized in that: In step two, the method for cleaning the welding surface of the aluminum target blank and the copper back plate is: use 40-50°C hot water combined with a detergent to clean the welding surface of the aluminum target blank and the copper back plate, and then place the aluminum target blank in the dispersion and ultrasonically clean it at 40Hz, 100W for 1-2min, and place the copper back plate in the dispersion and ultrasonically clean it at 40Hz, 100W for 5-10min.

6. The method for combining an aluminum target and a copper backing plate according to claim 5, characterized in that: The preparation method of the dispersion liquid is as follows: adding nano-cerium oxide and graphene quantum dots into deionized water and stirring them evenly.

7. The method for combining an aluminum target and a copper backing plate according to claim 6, characterized in that: The weight ratio of the nano-cerium oxide to the graphene quantum dots is (2-4):

1.

8. The method for combining an aluminum target and a copper back plate according to claim 6, characterized in that: The mass fraction of the total amount of nano-cerium oxide and graphene quantum dots in the dispersion is 0.15-0.25wt%.

9. The method for combining an aluminum target and a copper back plate according to claim 1, characterized in that: In step 4, the method for heating the combination is: placing the combination in a box-type heating furnace and keeping it at 300-500° C. for 15-60 minutes.

10. The method for combining an aluminum target and a copper back plate according to claim 1, characterized in that: In step 5, the parameters of composite rolling for the heated combined body are: total rolling deformation rate is 40-70%, and rolling pass deformation rate is 20-40%.

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