Semiconductor substrate laser cutting fixing jig

Abstract

The invention discloses a semiconductor substrate laser cutting fixing jig, and relates to the technical field of substrate laser cutting, the semiconductor substrate laser cutting fixing jig comprises a fixing shell, the side wall of one end of the fixing shell is fixedly connected with a first motor, and the inner wall of the fixing shell is rotatably connected with a fixing frame; the output end of the first motor penetrates through the side wall of the fixing shell and is fixedly connected with the side wall of the fixing frame, and two first grooves are symmetrically formed in the inner walls of the two ends of the fixing frame. When a semiconductor substrate composed of three side edges needs to be subjected to laser cutting, the inclination angle of the third clamping plate can be adjusted according to the angles of the side edges of the semiconductor substrate composed of the three side edges, and therefore two side edges of the semiconductor substrate composed of the three side edges are fixed; meanwhile, the inclination angle of the fourth clamping plate can be adjusted according to the inclination angle of the inner wall of the mounting groove formed in one side of the semiconductor substrate, and the fourth clamping plate can be conveniently used for fixing the inner wall of the mounting groove formed in one side of the semiconductor substrate.

Description

Technical Field

[0001] The present invention belongs to the technical field of substrate laser cutting, and particularly relates to a semiconductor substrate laser cutting fixture. Background Art

[0002] A semiconductor substrate is a key basic material in semiconductor manufacturing. It provides physical support and the basis for electrical connection for the manufacturing of semiconductor devices, and plays a crucial role in the operation of electronic devices.

[0003] During the production process of semiconductor substrates, when the produced semiconductor substrates need to be applied in new energy vehicles, due to space and weight limitations, special-shaped semiconductor substrates are required to meet the requirements of compact design so that the semiconductor substrates can be installed in new energy vehicles. After the semiconductor substrates are produced, they need to be laser cut so that they can be installed in new energy vehicles. When laser cutting a semiconductor substrate composed of three sides, since the inclination angles of the three sides of the semiconductor substrates produced in each batch are not the same, the staff also needs to replace the corresponding fixing parts according to the inclination angles of the three sides, and then use the replaced fixing parts to fix the semiconductor substrate composed of the three sides. Only after that can a laser cutting gun be used to laser cut the semiconductor substrate composed of the three sides, resulting in low efficiency and greatly reducing the cutting efficiency and reliability when laser cutting the semiconductor substrate.

[0004] Therefore, we propose a semiconductor substrate laser cutting fixture to solve the above problems. Summary of the Invention

[0005] In order to achieve the above object, the present invention adopts the following technical solutions:

[0006] A semiconductor substrate laser cutting fixture includes a fixed shell. One end side wall of the fixed shell is fixedly connected with a first motor. The inner wall of the fixed shell is rotatably connected with a fixed frame. The output end of the first motor penetrates the side wall of the fixed shell and is fixedly connected with the side wall of the fixed frame. Two first grooves are symmetrically opened on the inner walls at both ends of the fixed frame. A first electric slide rail is fixedly connected to the inner wall of the first groove. One end side wall of the first electric slide rail is slidably connected with three first sliding plates. Fixing plates are fixedly connected to the side walls of the first sliding plates. A second electric slide rail is fixedly connected to the inner wall of the fixing plate. A second sliding plate is slidably connected to the side wall of the second electric slide rail. A substrate fixing component for fixing the side wall of the semiconductor substrate and the installation groove is fixedly connected to one end side wall of the second sliding plate. A laser cutting component is opened on the bottom end inner wall of the fixed shell.

[0007] Preferably, the substrate fixing assembly includes a first electric telescopic rod fixedly connected to the side wall of one end of one of the second sliding plates. The telescopic end of the first electric telescopic rod is fixedly connected to a connecting plate. Two second electric telescopic rods are symmetrically and fixedly connected to the inner walls of the upper and lower ends of the connecting plate. The telescopic ends of the second electric telescopic rods are fixedly connected to first clamping plates. Side plates are fixedly connected to the side walls of both ends of one of the second sliding plates. Ninth electric telescopic rods are fixedly connected to the side walls of one end of the side plates. The telescopic ends of the ninth electric telescopic rods are fixedly connected to first U-shaped plates. Third electric telescopic rods are fixedly connected to the inner walls of the upper and lower ends of the first U-shaped plates.

[0008] Preferably, the telescopic ends of the third electric telescopic rods are fixedly connected to second U-shaped plates. Two second round rods are symmetrically and rotatably connected to the inner walls of the second U-shaped plates. Two second motors are symmetrically and fixedly connected to the side wall of one end of the second U-shaped plate. The output ends of the second motors penetrate through the side wall of the second U-shaped plate and are fixedly connected to one end of the corresponding second round rod. Fourth electric telescopic rods are fixedly connected to the rod walls of the second round rods. The telescopic ends of the fourth electric telescopic rods are fixedly connected to second clamping plates.

[0009] Preferably, third motors are fixedly connected to the side walls of one end of the other two second sliding plates. The output ends of the third motors are fixedly connected to fifth electric telescopic rods. The telescopic ends of the fifth electric telescopic rods are fixedly connected to third U-shaped plates. A third round rod is rotatably connected to the inner wall of the third U-shaped plate. A fourth motor is fixedly connected to the side wall of the third U-shaped plate. The output end of the fourth motor penetrates through the side wall of the third U-shaped plate and is fixedly connected to one end of the third round rod. A fourth U-shaped plate is fixedly connected to the rod wall of the third round rod. A fourth round rod is rotatably connected to the inner wall of the fourth U-shaped plate. A fifth motor is fixedly connected to the side wall of the fourth U-shaped plate.

[0010] Preferably, the output end of the fifth motor penetrates through the side wall of the fourth U-shaped plate and is fixedly connected to one end of the fourth round rod. A fixing block is fixedly connected to the rod wall of the fourth round rod. Sixth electric telescopic rods are fixedly connected to the inner walls of both ends of the fixing block. The telescopic ends of the sixth electric telescopic rods are fixedly connected to third clamping plates.

[0011] Preferably, a connecting frame is fixedly connected to the inner wall of the fixing block. Two rotating rods are symmetrically and rotatably connected to the inner wall of the connecting frame. Two sixth motors are symmetrically and fixedly connected to the side wall of the top end of the connecting frame. The output ends of the sixth motors penetrate through the side wall of the connecting frame and are fixedly connected to one end of the corresponding rotating rod. Seventh electric telescopic rods are fixedly connected to the rod walls of the rotating rods. The telescopic ends of the seventh electric telescopic rods are fixedly connected to fourth clamping plates.

[0012] Preferably, the laser cutting assembly includes a second groove opened on the inner wall of the bottom end of the fixed shell. A third electric slide rail is fixedly connected to the inner wall of the second groove. A third slide plate is slidably connected to the top side wall of the third electric slide rail. A connecting block is fixedly connected to the top side wall of the third slide plate. A fourth electric slide rail is fixedly connected to the inner wall of the connecting block. A fourth slide plate is slidably connected to the top side wall of the fourth electric slide rail. An eighth electric telescopic rod is fixedly connected to the top side wall of the fourth slide plate. The telescopic end of the eighth electric telescopic rod is fixedly connected to a fifth U-shaped plate.

[0013] Preferably, a fifth round rod is rotatably connected to the inner wall of the fifth U-shaped plate. A seventh motor is fixedly connected to the side wall of the fifth U-shaped plate. The output end of the seventh motor penetrates through the side wall of the fifth U-shaped plate and is fixedly connected to one end of the fifth round rod. A sixth U-shaped plate is fixedly connected to the rod wall of the fifth round rod. A sixth round rod is rotatably connected to the inner wall of the sixth U-shaped plate. An eighth motor is fixedly connected to the inner wall of the sixth U-shaped plate. The output end of the eighth motor penetrates through the side wall of the sixth U-shaped plate and is fixedly connected to one end of the sixth round rod. A laser cutting gun is fixedly connected to the rod wall of the sixth round rod.

[0014] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0015] By providing the substrate fixing assembly and the laser cutting assembly, when laser cutting a semiconductor substrate composed of three sides is required, the inclination angle of the third clamping plate can be adjusted according to the angle of the sides of the semiconductor substrate composed of three sides, so as to fix two of the sides of the semiconductor substrate composed of three sides. At the same time, the inclination angle of the fourth clamping plate can be adjusted according to the inclination angle of the inner wall of the installation groove opened on one side of the semiconductor substrate side, which is convenient for fixing the inner wall of the installation groove opened on one side of the semiconductor substrate by using the fourth clamping plate. The inclination angle of the second clamping plate can also be adjusted according to the inclination angle of the inner wall of the installation groove opened above the side of the semiconductor substrate, which is convenient for fixing the inner wall of the installation groove with the side facing up by using the second clamping plate, avoiding the need for the staff to replace the corresponding fixing parts according to the inclination angles of the three sides. When the laser cutting gun cuts the semiconductor substrate composed of three sides, the cutting end of the laser cutting gun can be perpendicular to the side wall of the semiconductor substrate composed of three sides, which is convenient for laser cutting the semiconductor substrate composed of three sides, and greatly improves the cutting efficiency and reliability of the device when laser cutting the semiconductor substrate. Description of the Drawings

[0016] Figure 1 is a schematic diagram of the overall structure of the present invention;

[0017] Figure 2 is a schematic diagram of the structure of the present invention from other angles;

[0018] Figure 3 For the present invention Figure 2 Enlarged view of part B;

[0019] Figure 4 Schematic diagram of part of the structure of the present invention Figure 1 ;

[0020] Figure 5 Schematic diagram of part of the structure of the present invention Figure 2 ;

[0021] Figure 6 For the present invention Figure 5 Enlarged view of part A;

[0022] Figure 7 Schematic diagram of part of the structure of the present invention Figure 3 ;

[0023] Figure 8 Schematic diagram of part of the structure of the present invention Figure 4 ;

[0024] Figure 9 Schematic diagram of part of the structure of the present invention Figure 5 。

[0025] In the figure: 1, fixed shell; 2, first motor; 3, fixed frame; 4, first groove; 5, first electric slide rail; 6, first slide plate; 7, fixed plate; 8, second electric slide rail; 9, second slide plate; 10, substrate fixing assembly; 101, first electric telescopic rod; 102, connecting plate; 103, second electric telescopic rod; 104, first clamping plate; 105, side plate; 106, first U-shaped plate; 107, third electric telescopic rod; 108, second U-shaped plate; 109, second round rod; 1010, second motor; 1011, fourth electric telescopic rod; 1012, second clamping plate; 1013, third motor; 1014, fifth electric telescopic rod; 1015, third U-shaped plate; 1016, third round rod; 1017, fourth motor; 1018, fourth U-shaped plate; 1019, fourth round rod; 1020, fifth motor; 1021, fixed block; 1022, sixth electric telescopic rod; 1023, third clamping plate; 1024, connecting frame; 1025, rotating rod; 1026, sixth motor; 1027, seventh electric telescopic rod; 1028, fourth clamping plate; 11, laser cutting assembly; 111, second groove; 112, third electric slide rail; 113, third slide plate; 114, connecting block; 115, fourth electric slide rail; 116, fourth slide plate; 117, eighth electric telescopic rod; 118, fifth U-shaped plate; 119, fifth round rod; 1110, seventh motor; 1111, sixth U-shaped plate; 1112, sixth round rod; 1113, eighth motor; 1114, laser cutting gun; 12, ninth electric telescopic rod. Detailed implementation manners

[0026] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments.

[0027] The following electrical components are all electrically connected to the external PLC controller.

[0028] Referring to Figure 1 - Figure 9 , a laser cutting fixture for fixing a semiconductor substrate, including a fixing shell 1. One end side wall of the fixing shell 1 is fixedly connected with a first motor 2. The inner wall of the fixing shell 1 is rotatably connected with a fixing frame 3. The output end of the first motor 2 penetrates the side wall of the fixing shell 1 and is fixedly connected with the side wall of the fixing frame 3. Two first grooves 4 are symmetrically opened on the inner walls at both ends of the fixing frame 3. The inner wall of the first groove 4 is fixedly connected with a first electric slide rail 5. One end side wall of the first electric slide rail 5 is slidably connected with three first slide plates 6. The side walls of the first slide plates 6 are all fixedly connected with fixing plates 7. The inner wall of the fixing plate 7 is fixedly connected with a second electric slide rail 8. The side wall of the second electric slide rail 8 is slidably connected with a second slide plate 9. One end side wall of the second slide plate 9 is fixedly connected with a substrate fixing component 10 for fixing the side wall of the semiconductor substrate and the installation groove. A laser cutting component 11 is opened on the bottom inner wall of the fixing shell 1. By controlling the first motor 2 to start, the fixing frame 3 is driven to rotate, so that the semiconductor substrate rotates, facilitating the laser cutting gun 1114 to perform laser cutting on different positions of the semiconductor substrate.

[0029] In the embodiment, the substrate fixing component 10 includes a first electric telescopic rod 101 fixedly connected to one end side wall of one of the second slide plates 9. The telescopic end of the first electric telescopic rod 101 is fixedly connected with a connecting plate 102. Two second electric telescopic rods 103 are symmetrically and fixedly connected to the upper and lower inner walls of the connecting plate 102. The telescopic ends of the second electric telescopic rods 103 are all fixedly connected with first clamping plates 104. Side plates 105 are fixedly connected to both end side walls of one of the second slide plates 9. Ninth electric telescopic rods 12 are fixedly connected to one end side walls of the side plates 105. The telescopic ends of the ninth electric telescopic rods 12 are all fixedly connected with first U-shaped plates 106. Third electric telescopic rods 107 are fixedly connected to the upper and lower inner walls of the first U-shaped plates 106;

[0030] The telescopic ends of the third electric telescopic rod 107 are fixedly connected with second U-shaped plates 108. Two second round rods 109 are symmetrically and rotatably connected to the inner walls of the second U-shaped plates 108. Two second motors 1010 are symmetrically and fixedly connected to one side wall of the second U-shaped plates 108. The output ends of the second motors 1010 penetrate through the side walls of the second U-shaped plates 108 and are fixedly connected to one ends of the corresponding second round rods 109. Fourth electric telescopic rods 1011 are fixedly connected to the rod walls of the second round rods 109. The telescopic ends of the fourth electric telescopic rods 1011 are fixedly connected with second clamping plates 1012;

[0031] Third motors 1013 are fixedly connected to one side walls of the other two second sliding plates 9. Fifth electric telescopic rods 1014 are fixedly connected to the output ends of the third motors 1013. Third U-shaped plates 1015 are fixedly connected to the telescopic ends of the fifth electric telescopic rods 1014. A third round rod 1016 is rotatably connected to the inner wall of the third U-shaped plate 1015. A fourth motor 1017 is fixedly connected to the side wall of the third U-shaped plate 1015. The output end of the fourth motor 1017 penetrates through the side wall of the third U-shaped plate 1015 and is fixedly connected to one end of the third round rod 1016. A fourth U-shaped plate 1018 is fixedly connected to the rod wall of the third round rod 1016. A fourth round rod 1019 is rotatably connected to the inner wall of the fourth U-shaped plate 1018. A fifth motor 1020 is fixedly connected to the side wall of the fourth U-shaped plate 1018;

[0032] The output end of the fifth motor 1020 penetrates through the side wall of the fourth U-shaped plate 1018 and is fixedly connected to one end of the fourth round rod 1019. A fixing block 1021 is fixedly connected to the rod wall of the fourth round rod 1019. Sixth electric telescopic rods 1022 are fixedly connected to the inner walls of both ends of the fixing block 1021. Third clamping plates 1023 are fixedly connected to the telescopic ends of the sixth electric telescopic rods 1022;

[0033] A connecting frame 1024 is fixedly connected to the inner wall of the fixing block 1021. Two rotating rods 1025 are symmetrically and rotatably connected to the inner wall of the connecting frame 1024. Two sixth motors 1026 are symmetrically and fixedly connected to the top side wall of the connecting frame 1024. The output ends of the sixth motors 1026 penetrate through the side wall of the connecting frame 1024 and are fixedly connected to one ends of the corresponding rotating rods 1025. Seventh electric telescopic rods 1027 are fixedly connected to the rod walls of the rotating rods 1025. Fourth clamping plates 1028 are fixedly connected to the telescopic ends of the seventh electric telescopic rods 1027.

[0034] Specifically, when laser cutting a semiconductor substrate composed of three side edges is required, the inclination angle of the third clamping plate 1023 can be adjusted according to the angle of the side edges of the semiconductor substrate composed of three side edges, so as to fix two of the side edges of the semiconductor substrate composed of three side edges. At the same time, the inclination angle of the fourth clamping plate 1028 can be adjusted according to the inclination angle of the inner wall of the installation groove opened on one side of the side edge of the semiconductor substrate, which is convenient for fixing the inner wall of the installation groove opened on one side of the semiconductor substrate by using the fourth clamping plate 1028. The inclination angle of the second clamping plate 1012 can also be adjusted according to the inclination angle of the inner wall of the installation groove opened above the side edge of the semiconductor substrate, which is convenient for fixing the inner wall of the installation groove with the side edge facing upward by using the second clamping plate 1012, avoiding the need for workers to replace corresponding fixing parts according to the inclination angles of the three side edges.

[0035] In the embodiment, the laser cutting assembly 11 includes a second groove 111 opened on the inner wall of the bottom end of the fixed shell 1. A third electric slide rail 112 is fixedly connected to the inner wall of the second groove 111. A third slide plate 113 is slidably connected to the top side wall of the third electric slide rail 112. A connecting block 114 is fixedly connected to the top side wall of the third slide plate 113. A fourth electric slide rail 115 is fixedly connected to the inner wall of the connecting block 114. A fourth slide plate 116 is slidably connected to the top side wall of the fourth electric slide rail 115. An eighth electric telescopic rod 117 is fixedly connected to the top side wall of the fourth slide plate 116. The telescopic end of the eighth electric telescopic rod 117 is fixedly connected to a fifth U-shaped plate 118;

[0036] A fifth round rod 119 is rotatably connected to the inner wall of the fifth U-shaped plate 118. A seventh motor 1110 is fixedly connected to the side wall of the fifth U-shaped plate 118. The output end of the seventh motor 1110 penetrates through the side wall of the fifth U-shaped plate 118 and is fixedly connected to one end of the fifth round rod 119. A sixth U-shaped plate 1111 is fixedly connected to the rod wall of the fifth round rod 119. A sixth round rod 1112 is rotatably connected to the inner wall of the sixth U-shaped plate 1111. An eighth motor 1113 is fixedly connected to the inner wall of the sixth U-shaped plate 1111. The output end of the eighth motor 1113 penetrates through the side wall of the sixth U-shaped plate 1111 and is fixedly connected to one end of the sixth round rod 1112. A laser cutting gun 1114 is fixedly connected to the rod wall of the sixth round rod 1112.

[0037] Specifically, when the laser cutting gun 1114 cuts a semiconductor substrate composed of three side edges, the cutting end of the laser cutting gun 1114 can be perpendicular to the side wall of the semiconductor substrate composed of three side edges, which is convenient for laser cutting the semiconductor substrate composed of three side edges, greatly improving the cutting efficiency and reliability of the device when laser cutting the semiconductor substrate.

[0038] The operating principle of the present invention is described as follows:

[0039] In the present invention, when a semiconductor substrate composed of three sides needs to be laser cut, a staff member places the semiconductor substrate composed of three sides into the fixed housing 1, and makes one of the sides of the semiconductor substrate with the mounting groove facing upward located on one side of the first clamping plate 104. Then, the first electric slide rail 5 and the second electric slide rail 8 on one side of the first clamping plate 104 are controlled to start, driving the corresponding first slide plate 6 and the second slide plate 9 to move, so that the connecting plate 102 is located on one side of the side of the semiconductor substrate composed of three sides with the mounting groove facing upward. Then, the corresponding first electric telescopic rod 101 is controlled to start, driving the connecting plate 102 to move towards the semiconductor substrate, so that the first clamping plate 104 is located on the upper and lower sides of the side of the semiconductor substrate with one mounting groove facing upward. Then, the second electric telescopic rod 103 is controlled to start, driving the first clamping plate 104 to move, and using the first clamping plate 104 to fix the side of the semiconductor substrate with one mounting groove facing upward. Then, the ninth electric telescopic rod 12 is controlled to start, driving the first U-shaped plate 106 to move towards the side of the semiconductor substrate with one mounting groove facing upward, so that the third electric telescopic rod 107 is located on the upper and lower sides of the side of the semiconductor substrate with one mounting groove facing upward. Then, the third electric telescopic rod 107 is controlled to start, driving the second U-shaped plate 108 to move, so that the second U-shaped plate 108 moves into the corresponding mounting groove of the semiconductor substrate. Then, the second motor 1010 is controlled to start, driving the second round rod 109 to rotate, so that the second round rod 109 drives the fourth electric telescopic rod 1011 and the second clamping plate 1012 to rotate. After the inclination angle of the second clamping plate 1012 matches the inclination angle of the inner wall of the corresponding mounting groove, the second motor 1010 is controlled to turn off. Then, the fourth electric telescopic rod 1011 is controlled to start, driving the second clamping plate 1012 to move, and using the second clamping plate 1012 to fix the inner wall of the corresponding mounting groove. Then, the first electric slide rail 5 is controlled to start, driving the other two first slide plates 6 to move, so that the third U-shaped plate 1015 is located on one side of the other two sides of the corresponding semiconductor substrate. Then, the corresponding second electric slide rail 8 is controlled to start, driving the second slide plate 9 to move, so that the third U-shaped plate 1015 and the corresponding side of the semiconductor substrate are in the same plane. Then, by controlling the third motor 1013, the fourth motor 1017 and the fifth motor 1020 to start, driving the fifth electric telescopic rod 1014, the third round rod 1016 and the fourth round rod 1019 to rotate, so that the inclination angle of the fixed block 1021 corresponds to and is perpendicular to the corresponding side of the semiconductor substrate. Then, the fifth electric telescopic rod 1014 is controlled to start, so that the fixed block 1021 moves towards the corresponding side of the semiconductor substrate. After the sixth electric telescopic rod 1022 is located on the upper and lower sides of the corresponding side of the semiconductor substrate, the sixth electric telescopic rod 1022 is controlled to start, driving the third clamping plate 1023 to move, and using the third clamping plate 1023 to fix the other two sides of the semiconductor substrate. And at this time, the connecting frame 1024 enters the mounting groove opened on the corresponding side of the semiconductor substrate. Then, the sixth motor 1026 is controlled to start,Drive the rotating rod 1025 to rotate, so that the inclination angle of the fourth clamping plate 1028 is the same as the inclination angle of the inner wall of the corresponding installation groove. Then, control the seventh electric telescopic rod 1027 to start, drive the fourth clamping plate 1028 to move, and use the fourth clamping plate 1028 to fix the inner wall of the corresponding installation groove. At this time, the fixation of the semiconductor substrate composed of three sides is completed. Then, by controlling the third electric slide rail 112 and the fourth electric slide rail 115 to start, drive the corresponding third slide plate 113 and the fourth slide plate 116 to move, so that the laser cutting gun 1114 can move at the bottom of the semiconductor substrate composed of three sides. By controlling the seventh motor 1110 and the eighth motor 1113 to start, drive the fifth round rod 119 and the sixth round rod 1112 to rotate to adjust the angle of the laser cutting gun 1114, so that when the laser cutting gun 1114 cuts the semiconductor substrate composed of three sides, the cutting end of the laser cutting gun 1114 can be perpendicular to the side wall of the semiconductor substrate composed of three sides, which is convenient for laser cutting the semiconductor substrate composed of three sides. By controlling the eighth electric telescopic rod 117 to start, the laser cutting gun 1114 can approach the semiconductor substrate composed of three sides, so as to perform laser cutting on it. When it is necessary to perform laser cutting on the semiconductor substrate composed of three sides, the inclination angle of the third clamping plate 1023 can be adjusted according to the angle of the side of the semiconductor substrate composed of three sides, so as to fix two sides of the semiconductor substrate composed of three sides. At the same time, the inclination angle of the fourth clamping plate 1028 can be adjusted according to the inclination angle of the inner wall of the installation groove opened on one side of the semiconductor substrate side, which is convenient for using the fourth clamping plate 1028 to fix the inner wall of the installation groove opened on one side of the semiconductor substrate. The inclination angle of the second clamping plate 1012 can also be adjusted according to the inclination angle of the inner wall of the installation groove opened above the semiconductor substrate side, which is convenient for using the second clamping plate 1012 to fix the inner wall of the installation groove with the side facing up. This avoids the need for staff to replace the corresponding fixing parts according to the inclination angles of the three sides. When the laser cutting gun 1114 cuts the semiconductor substrate composed of three sides, the cutting end of the laser cutting gun 1114 can be perpendicular to the side wall of the semiconductor substrate composed of three sides, which is convenient for laser cutting the semiconductor substrate composed of three sides. This greatly improves the cutting efficiency and reliability of the device when laser cutting the semiconductor substrate.

[0040] The above is only a preferred specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution of the present invention and its inventive concept, makes equivalent substitutions or changes, and should be covered by the protection scope of the present invention.

Claims

1. A semiconductor substrate laser cutting fixture, comprising a fixing shell (1), characterized in that: A first motor (2) is fixedly connected to a side wall at one end of the fixed shell (1); a fixed frame (3) is rotatably connected to the inner wall of the fixed shell (1); an output end of the first motor (2) passes through the side wall of the fixed shell (1) and is fixedly connected to the side wall of the fixed frame (3); two first grooves (4) are symmetrically provided on the inner walls at both ends of the fixed frame (3); a first electric slide rail (5) is fixedly connected to the inner wall of the first groove (4); three first slide plates (6) are slidably connected to the side wall of one end of the first electric slide rail (5); the side walls of the first slide plates (6) are all fixedly connected to a fixed plate (7); the inner wall of the fixed plate (7) is fixedly connected to a second electric slide rail (8); the side wall of the second electric slide rail (8) is slidably connected to a second slide plate (9); a substrate fixing component (10) for fixing the side wall of the semiconductor substrate and the mounting groove is fixedly connected to the side wall of the second slide plate (9); a laser cutting component (11) is provided on the inner wall of the bottom end of the fixed shell (1).

2. The semiconductor substrate laser cutting fixture according to claim 1, characterized in that: The base plate fixing assembly (10) comprises a first electric telescopic rod (101) to which a side wall at one end of one of the second slide plates (9) is fixedly connected; the telescopic end of the first electric telescopic rod (101) is fixedly connected to a connecting plate (102); the inner walls at upper and lower ends of the connecting plate (102) are symmetrically fixedly connected to two second electric telescopic rods (103); the telescopic ends of the second electric telescopic rods (103) are both fixedly connected to a first clamping plate (104); the side walls at both ends of one of the second slide plates (9) are both fixedly connected to a side plate (105); the side walls at one end of the side plate (105) are both fixedly connected to a ninth electric telescopic rod (12); the telescopic ends of the ninth electric telescopic rod (12) are both fixedly connected to a first U-plate (106); the inner walls at upper and lower ends of the first U-plate (106) are both fixedly connected to a third electric telescopic rod (107).

3. The semiconductor substrate laser cutting fixture according to claim 2, characterized in that: The telescopic ends of the third electric telescopic rod (107) are fixedly connected to the second U-plate (108); the inner wall of the second U-plate (108) is symmetrically rotatably connected to two second round rods (109); one end side wall of the second U-plate (108) is symmetrically fixedly connected to two second motors (1010); the output end of the second motor (1010) passes through the side wall of the second U-plate (108) and is fixedly connected to one end of the corresponding second round rod (109); the rod wall of the second round rod (109) is fixedly connected to the fourth electric telescopic rod (1011); the telescopic end of the fourth electric telescopic rod (1011) is fixedly connected to the second clamping plate (1012).

4. The semiconductor substrate laser cutting fixture according to claim 2, characterized in that: The side walls of one end of the other two second slide plates (9) are both fixedly connected to a third motor (1013); the output end of the third motor (1013) is fixedly connected to a fifth electric telescopic rod (1014); the telescopic end of the fifth electric telescopic rod (1014) is both fixedly connected to a third U-plate (1015); the inner wall of the third U-plate (1015) is rotatably connected to a third round rod (1016); the side wall of the third U-plate (1015) is fixedly connected to a fourth motor (1017); the output end of the fourth motor (1017) passes through the side wall of the third U-plate (1015) and is fixedly connected to one end of the third round rod (1016); the rod wall of the third round rod (1016) is fixedly connected to a fourth U-plate (1018); the inner wall of the fourth U-plate (1018) is rotatably connected to a fourth round rod (1019); and the side wall of the fourth U-plate (1018) is fixedly connected to a fifth motor (1020).

5. The semiconductor substrate laser cutting fixture according to claim 4, characterized in that: The output end of the fifth motor (1020) passes through the side wall of the fourth U-plate (1018) and is fixedly connected to one end of the fourth round rod (1019); the rod wall of the fourth round rod (1019) is fixedly connected to a fixing block (1021); the inner walls at both ends of the fixing block (1021) are fixedly connected to a sixth electric telescopic rod (1022); and the telescopic ends of the sixth electric telescopic rod (1022) are fixedly connected to a third clamping plate (1023).

6. The semiconductor substrate laser cutting fixture according to claim 5, characterized in that: The inner wall of the fixed block (1021) is fixedly connected to a connecting frame (1024); the inner wall of the connecting frame (1024) is symmetrically connected to two rotating rods (1025); the top side wall of the connecting frame (1024) is symmetrically fixedly connected to two sixth motors (1026); the output end of the sixth motor (1026) passes through the side wall of the connecting frame (1024) and is fixedly connected to one end of the corresponding rotating rod (1025); the rod wall of the rotating rod (1025) is fixedly connected to a seventh electric telescopic rod (1027); the telescopic end of the seventh electric telescopic rod (1027) is fixedly connected to a fourth clamping plate (1028).

7. The semiconductor substrate laser cutting fixture according to claim 1, characterized in that: The laser cutting assembly (11) comprises a second groove (111) formed on the inner wall of the bottom end of the fixed shell (1); the inner wall of the second groove (111) is fixedly connected to a third electric slide rail (112); the top side wall of the third electric slide rail (112) is slidably connected to a third slide plate (113); the top side wall of the third slide plate (113) is fixedly connected to a connecting block (114); the inner wall of the connecting block (114) is fixedly connected to a fourth electric slide rail (115); the top side wall of the fourth electric slide rail (115) is slidably connected to a fourth slide plate (116); the top side wall of the fourth slide plate (116) is fixedly connected to an eighth electric telescopic rod (117); and the telescopic end of the eighth electric telescopic rod (117) is fixedly connected to a fifth U-plate (118).

8. The semiconductor substrate laser cutting fixture according to claim 7, characterized in that: The inner wall of the fifth U-plate (118) is rotatably connected to a fifth round rod (119); the side wall of the fifth U-plate (118) is fixedly connected to a seventh motor (1110); the output end of the seventh motor (1110) passes through the side wall of the fifth U-plate (118) and is fixedly connected to one end of the fifth round rod (119); the rod wall of the fifth round rod (119) is fixedly connected to a sixth U-plate (1111); the inner wall of the sixth U-plate (1111) is rotatably connected to a sixth round rod (1112); the inner wall of the sixth U-plate (1111) is fixedly connected to an eighth motor (1113); the output end of the eighth motor (1113) passes through the side wall of the sixth U-plate (1111) and is fixedly connected to one end of the sixth round rod (1112); and the rod wall of the sixth round rod (1112) is fixedly connected to a laser cutting gun (1114).

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