Optical waveguide processing device and processing method

Abstract

The embodiment of the invention provides a processing device and a processing method of an optical waveguide. The optical waveguide processing device comprises a laser used for emitting laser; the light beam adjusting module is used for receiving the laser emitted by the laser and adjusting the laser; the light spot shaping module is used for receiving the laser emitted by the light beam adjusting module and shaping a laser spot into a target light spot; wherein the target light spot is provided with a first connecting line and a second connecting line, the length of the first connecting line is larger than that of the second connecting line, and the first connecting line and the second connecting line both pass through the center of the target light spot; the rotating module is used for driving the light spot shaping module to rotate, so that the first connecting line is collinear with a preset cutting line of the optical waveguide; and the Bessel module is used for cutting the optical waveguide along the first connecting line.

Description

Technical Field

[0001] Embodiments of the present application relate to the field of optical waveguide processing. More specifically, embodiments of the present application relate to an optical waveguide processing apparatus and a processing method. Background Art

[0002] The most widely used cutting method for existing AR optical waveguides is laser cutting. In existing laser cutting, a circular light spot is usually used to act on the optical waveguide to be cut. During the cutting process, small holes are drilled at a certain interval according to the shape of the product, and cracks are formed between the holes by controlling the interval of the control points, so as to form the shape of the product in subsequent chip separation.

[0003] After the existing technology uses a circular light spot to drill holes and perform chip separation, the edge of the product is prone to chipping defects, and the edge effect of the product cut by this method is poor, resulting in a decrease in the overall strength of the waveguide lens and reducing the anti-drop ability of the lens.

[0004] In view of this, a technical solution is needed to solve the above technical problems. Summary of the Invention

[0005] The purpose of the present application is to provide a new technical solution for an optical waveguide processing apparatus and a processing method.

[0006] In a first aspect, the present application provides an optical waveguide processing apparatus. The optical waveguide processing apparatus includes: a laser for emitting laser light;

[0007] a beam adjustment module for receiving the laser light emitted by the laser and adjusting the laser light;

[0008] a light spot shaping module for receiving the laser light emitted by the beam adjustment module and shaping the laser light spot into a target light spot; wherein the target light spot has a first connection line and a second connection line, the length of the first connection line is greater than the length of the second connection line, and both the first connection line and the second connection line pass through the center of the target light spot;

[0009] a rotation module for driving the light spot shaping module to rotate so that the first connection line is collinear with a preset cutting line of the optical waveguide;

[0010] a Bessel module for cutting the optical waveguide along the first connection line.

[0011] Optionally, the beam adjustment module includes a beam expander for receiving the laser light emitted by the laser and performing beam expansion processing on the received laser light.

[0012] Optionally, the beam adjustment module further includes at least one reflector for receiving the laser light emitted by the beam expander and adjusting the transmission path of the laser light.

[0013] Optionally, the target light spot is an elliptical light spot, the second connection line is the major axis of the elliptical light spot, and the first connection line is the minor axis of the elliptical light spot.

[0014] Optionally, the target light spot is a rectangular light spot, the first connection line is a connection line parallel to the long side of the rectangular light spot, and the second connection line is a connection line parallel to the short side of the rectangular light spot.

[0015] Optionally, the rotation module includes a rotation platform and a rotation driving part, the rotation driving part drives the rotation platform to rotate, and the rotation platform is used to carry the light spot shaping module.

[0016] Optionally, the material of the optical waveguide is sapphire or glass.

[0017] Optionally, the processing device of the optical waveguide further includes a CO 2 laser, and the CO 2 laser is located above the Bessel module.

[0018] In a second aspect, a method for processing an optical waveguide is provided. The method for processing the optical waveguide is applied to the processing device of the optical waveguide as described in the first aspect;

[0019] The method for processing the optical waveguide includes:

[0020] Providing an optical waveguide to be cut;

[0021] Starting the laser, the laser emits laser light, and the laser light is adjusted by the beam adjustment module and shaped by the light spot shaping module to form a target light spot;

[0022] Making the first connection line of the target light spot collinear with the preset cutting line of the optical waveguide to be cut through the rotation module;

[0023] Cutting the optical waveguide to be cut along the first connection line through the Bessel module.

[0024] Optionally, the adjustment of the laser light by the beam adjustment module specifically includes:

[0025] Performing beam expansion processing on the laser light; or

[0026] Performing beam expansion processing on the laser light and adjusting the transmission path of the beam after beam expansion.

[0027] According to an embodiment of the present application, a processing device for an optical waveguide is provided, which is applied to the cutting of the optical waveguide. By adding a spot shaping module and a rotation module between the beam adjustment module and the Bessel module, the edge effect of the finished optical waveguide after cutting and the strength of the finished optical waveguide are improved, the edge chipping size of the finished optical waveguide is reduced, and the strength of the finished optical waveguide is provided.

[0028] Other features and advantages of the present specification will become clear through the following detailed description of the exemplary embodiments of the present specification with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The drawings incorporated in the specification and constituting a part of the specification illustrate embodiments of the present specification, and together with the description thereof are used to explain the principles of the present specification.

[0030] Figure 1 The figure shows a schematic diagram of a processing device for an optical waveguide provided by an embodiment of the present application.

[0031] Figures 2a - 2b The figure shows a schematic diagram of a target spot.

[0032] Figures 3 - 4 It is a strength diagram of the optical waveguide after cutting.

[0033] DESCRIPTION OF REFERENCE NUMERALS:

[0034] 1. Laser; 2. Beam expander; 3. Reflector; 4. Spot shaping module; 5. Rotation module; 6. Bessel module; 7. Target spot; 71. First connection line; 72. Second connection line. DETAILED DESCRIPTION

[0035] Now, various exemplary embodiments of the present application will be described in detail with reference to the accompanying drawings. It should be noted that: Unless otherwise specifically stated, the relative arrangements of components and steps, numerical expressions, and numerical values set forth in these embodiments do not limit the scope of the present application.

[0036] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the present application, its application, or its use.

[0037] Technologies and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such technologies and devices should be regarded as part of the specification.

[0038] In all the examples shown and discussed herein, any specific value should be construed as merely exemplary and not as a limitation. Therefore, other examples of the exemplary embodiments may have different values.

[0039] It should be noted that like reference numerals and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0040] An embodiment of the present application provides a processing device for an optical waveguide. Referring to Figure 1 , the processing device for the optical waveguide includes: a laser 1, a beam adjustment module, a spot shaping module 4, a rotation module 5, and a Bessel module 6. The laser 1 is used to emit laser light. The beam adjustment module is used to receive the laser light emitted by the laser 1 and adjust the laser light. The spot shaping module 4 is used to receive the laser light emitted by the beam adjustment module and shape the laser spot into a target spot 7; wherein the target spot 7 has a first connection line 71 and a second connection line 72, the length of the first connection line 71 is greater than the length of the second connection line 72, and both the first connection line 71 and the second connection line 72 pass through the center of the target spot 7. The rotation module 5 drives the spot shaping module 4 to rotate so that the first connection line 71 is collinear with a preset cutting line of the optical waveguide. The Bessel module 6 is used to cut the optical waveguide along the first connection line 71.

[0041] In the embodiment of the present application, the processing device for the optical waveguide mainly includes a laser 1, a spot shaping module 4, a rotation module 5, and a Bessel module 6.

[0042] The laser 1 is used to emit laser light. The laser light emitted by the laser 1 is adjusted by the beam adjustment module so that the size of the laser spot emitted by the laser is more suitable for subsequent cutting of the optical waveguide; or the laser light emitted by the laser 1 is adjusted by the beam adjustment module. On the one hand, the size of the laser spot is modulated so that the size of the laser spot emitted by the laser is more suitable for subsequent cutting of the optical waveguide to be cut, and on the other hand, it is used to adjust the transmission path of the laser so that the transmission path of the laser more conforms to the placement position of the optical waveguide. For example, generally, the processing device for the optical waveguide includes an operation platform for placing the optical waveguide to be cut, and by adjusting the transmission path of the laser, the laser can be projected onto the optical waveguide to be cut placed on the operation platform.

[0043] In the embodiment of the present application, the processing device for the optical waveguide further includes a spot shaping module 4 and a rotation module 5. The spot shaping module 4 is used to change the shape of the laser spot.

[0044] In the prior art, the general configuration for laser cutting of optical waveguides is to expand the Gaussian spot emitted by the laser 1 and then focus and cut through a Bessel cutting head. In this way, the focused spot is circular. When the circular spot acts on the glass lens, a circular hole effect of about 2 μm is formed. During the cutting process, such small holes are drilled at a certain interval according to the circular spot, and the spacing between the control points is used to form cracks between the holes on the optical waveguide to be cut, so as to form the shape of the finished optical waveguide after subsequent splitting. After punching and splitting using a circular spot in the prior art, the edge of the formed finished optical waveguide is prone to chipping defects, and the poor edge effect of the product cut in this way results in a lower overall strength of the waveguide lens, reducing the anti-drop ability of the lens.

[0045] Based on this, in the embodiment of the present application, a spot shaping module 4 and a rotation module 5 are arranged between the beam adjustment module and the Bessel module 6, and the circular spot is shaped into a target spot 7 by the spot shaping module 4. The rotation module 5 is used to control in real time that the direction of the first connection line 71 of the target spot 7 is the same as the cutting direction of the optical waveguide to be cut. For example, the preset cutting direction can be defined by a preset cutting line, and the preset cutting line can be a virtual line. For example, by combining the shape of the finished optical waveguide and the shape of the optical waveguide to be cut, according to experience, the first connection line 71 is made to be the same as the cutting direction of the product, and the optical waveguide to be cut is cut along the first connection line 71; or the preset cutting line is a solid line. For example, the shape of the finished optical waveguide and the shape of the optical waveguide to be cut can be combined in advance, and a cutting line is simulated on the optical waveguide to be cut, so that the first connection line 71 and the preset cutting line are collinear, and the optical waveguide to be cut is cut along the first connection line 71.

[0046] Specifically, in the prior art, when a circular spot hits the optical waveguide and drills holes along the diameter of the circular spot, the energy around the circular spot is relatively uniform. Corresponding to the optical waveguide, some cracks or micro-cracks will be generated on the optical waveguide. For example, uniform cracks will be generated around the circular spot. In this way, after punching and splitting using a circular spot, the edge of the formed finished optical waveguide is prone to chipping defects, and the poor edge effect of the product cut in this way results in a lower overall strength of the waveguide lens.

[0047] The circular light spot is shaped into a target light spot 7 by the light spot shaping module 4. For example, the light spot shaping module 4 is a light spot shaping lens. The target light spot 7 has a first connection line 71 and a second connection line 72. The length of the first connection line 71 is greater than that of the second connection line 72. Both the first connection line 71 and the second connection line 72 pass through the center of the target light spot 7. By defining the first connection line 71 and the second connection line 72 of the target light spot 7, the target light spot 7 is a non-centrosymmetric figure. In this way, when the target light spot 7 hits the optical waveguide, holes are drilled along the first connection line 71 of the target light spot 7 (for example, there are multiple target light spots 7 corresponding to the optical waveguide to be cut, and a plurality of dense holes are drilled along the first connection line 71 of the multiple target light spots 7). The crack distribution around the target light spot 7 will be uneven, avoiding the edge chipping defect that is likely to occur at the edge of the finished optical waveguide due to the generation of uniformly distributed cracks as in the case of a circular light spot.

[0048] For example, if the length of the first connection line 71 is greater than that of the second connection line 72, the directivity of the first connection line 71 will be better. That is, the directivity of the first connection line 71 is greater than that of the second connection line 72. When drilling holes along the direction of the first connection line 71, larger cracks will be diffracted in the direction of the first connection line 71. Smaller cracks will be generated in other directions or no cracks will be generated. The smaller cracks can be ignored compared with the larger cracks formed along the first connection line 71. In this way, the edge effect of the optical waveguide after cutting and the strength of the optical waveguide can be improved. The edge chipping size of the optical waveguide after cutting is smaller, and the strength of the finished optical waveguide is improved.

[0049] For example, the target light spot 7 can be an elliptical light spot, a rectangular light spot or a light spot with other geometric shapes. Taking the elliptical light spot as an example, the elliptical light spot has a major axis (the first connection line 71) and a minor axis (the second connection line 72). When drilling holes along the major axis direction of the elliptical light spot, the energy distribution of the elliptical light spot is uneven, and the cracks basically extend along the major axis direction of the elliptical light spot. The directivity of the cracks will be better. The cracks formed in other directions are relatively small or no cracks will be generated. In this way, the edge effect of the optical waveguide after cutting and the strength of the optical waveguide can be improved. The edge chipping size of the optical waveguide after cutting is smaller, and the strength of the finished optical waveguide is improved.

[0050] The embodiment of the present application further includes a Bessel module 6, where the Bessel module 6 has a Bessel cutting head, and the Bessel cutting head is used to perform cutting processing on the optical waveguide to be cut. Specifically, the Bessel module 6 cuts the optical waveguide to be cut along the first connection line 71 to form a finished optical waveguide. The cutting of the optical waveguide by the Bessel module 6 is a well-known technology to those skilled in the art, and the structure of the Bessel module 6 will not be described in detail in this application.

[0051] Therefore, the embodiment of the present application provides a processing device for an optical waveguide, which is applied to the cutting of the optical waveguide. By adding a spot shaping module 4 and a rotation module 5 between the beam adjustment module and the Bessel module 6, the edge effect of the finished optical waveguide after cutting and the strength of the finished optical waveguide are improved, the edge chipping size of the finished optical waveguide is reduced, and the strength of the finished optical waveguide is provided.

[0052] In one embodiment, referring to Figure 1 , the beam adjustment module includes a beam expander 2, and the beam expander 2 is configured to receive the laser emitted by the laser 1 and perform beam expansion processing on the received laser.

[0053] In this embodiment, the beam adjustment module includes a beam expander 2. The beam expander 2 is arranged in the light-emitting direction of the laser 1. Specifically, the beam expander 2 receives the laser emitted by the laser 1 and performs beam expansion processing on the received laser. For example, the beam expander 2 can change the diameter and divergence angle of the laser beam, and the beam expander 2 can play a role in making the laser focusing effect better and can also play a role in collimation.

[0054] In one embodiment, referring to Figure 1 , the beam adjustment module further includes at least one mirror 3, and the mirror 3 is configured to receive the laser emitted by the beam expander 2 and adjust the transmission path of the laser.

[0055] In this embodiment, referring to Figure 1 , the beam adjustment module includes three mirrors 3. The three mirrors 3 include a first mirror, a second mirror and a third mirror. After the light emitted from the beam expander 2 passes through the first mirror, the second mirror and the third mirror in sequence, the transmission path of the light emitted by the laser 1 is adjusted to a transmission path that can be directly projected onto the optical waveguide to be cut. The light emitted from the third mirror 3 passes through the spot shaping module 4, and the circular spot is shaped into a target spot 7. By rotating the spot shaping module 4 through the rotation module 5, the direction of the first connection line 71 of the target spot 7 is made the same as the preset cutting direction of the optical waveguide to be cut. Then, the target spot 7 is projected onto the optical waveguide to be cut through the Bessel module 6, and the optical waveguide to be cut is cut by the Bessel module 6 to form a finished optical waveguide.

[0056] It should be noted that when the beam adjustment module includes a mirror 3 and a beam expander 2, the setting order of the mirror 3 and the beam expander 2 can be exchanged. For example, the laser emitted from the laser 1 can first pass through the mirror 3 and then through the beam expander 2, or the laser emitted from the laser 1 can first pass through the beam expander 2 and then through the mirror 3.

[0057] In one embodiment, referring to Figure 2a, the target light spot 7 is an elliptical light spot, the first connection line 71 is the major axis of the elliptical light spot, and the second connection line 72 is the minor axis of the elliptical light spot.

[0058] In a specific embodiment, the target light spot 7 is an elliptical light spot. The elliptical light spot has a major axis and a minor axis. The major axis of the elliptical light spot is the first connection line 71, and the minor axis of the elliptical light spot is the second connection line 72. During the process of cutting the optical waveguide to be cut, the major axis direction of the elliptical light spot is made to be the same as the cutting direction of the optical waveguide to be cut in real time.

[0059] Optionally, the major axis dimension of the elliptical light spot is two to three times the minor axis dimension. For example, the major axis dimension ranges from 2 μm to 4 μm, and the minor axis dimension ranges from 1 μm to 2 μm. In this embodiment, the major axis and minor axis dimensions of the elliptical light spot are defined so that when the elliptical light spot hits the optical waveguide to be cut and a hole is drilled along the major axis direction of the elliptical light spot, the energy distribution of the elliptical light spot is uneven, making the energy of the elliptical light spot more concentrated in the major axis direction of the elliptical light spot, improving the edge effect of the cut optical waveguide and the strength of the finished optical waveguide, and reducing the edge chipping size of the cut optical waveguide.

[0060] In one embodiment, referring to Figure 2b , the target light spot 7 is a rectangular light spot, the first connection line 71 is a connection line parallel to the long side of the rectangular light spot, and the second connection line 72 is a connection line parallel to the short side of the rectangular light spot.

[0061] In a specific embodiment, the target light spot 7 is a rectangular light spot, and the rectangular light spot is a non-centrosymmetric figure. The first connection line 71 is the connection line of the rectangular light spot relative to the center of the short side, and the second connection line 72 is the connection line of the rectangular light spot relative to the center of the long side. During the process of cutting the optical waveguide to be cut, the first connection line 71 of the rectangular light spot is made to be the same as the cutting direction of the optical waveguide to be cut in real time.

[0062] Optionally, the length of the first connection line 71 of the rectangular light spot is two to three times the length of the second connection line 72.

[0063] In an alternative embodiment, the target light spot 7 can also be a parallelogram light spot or other types of geometric shape light spots with a non-centrosymmetric structure.

[0064] In one embodiment, the rotation module 5 includes a rotation platform and a rotation driving part. The rotation driving part drives the rotation platform to rotate, and the rotation platform is used to carry the light spot shaping module 4.

[0065] In this embodiment, the rotary die includes a rotary platform and a rotary drive unit. For example, the rotary drive unit can be a motor or the like. The rotary platform is used to carry the spot shaping module 4. For example, the spot shaping module 4 is placed on the rotary platform and can rotate with the rotary platform.

[0066] Optionally, a limit block is provided on the rotary platform to limit the placement position of the spot shaping module 4.

[0067] In one embodiment, the material of the optical waveguide is sapphire or glass.

[0068] In this embodiment, the material of the optical waveguide is sapphire. For example, the processing device of the optical waveguide can cut sapphire. In the application of cutting special-shaped sapphire, since sapphire itself not only has high optical transmittance but also has high strength and hardness, it can replace tempered glass as the protective layer of the AR glasses and be attached to the surface of the optical waveguide to play a protective role. The target spot 7 (such as an elliptical spot) configuration can be used to process sapphire with a certain thickness.

[0069] For example, in a specific embodiment, sapphire with a thickness of 0.2 mm - 0.4 mm can be processed. Taking sapphire with a thickness of 0.25 mm as an example, the refractive index of sapphire is 1.78 (both sides of the sapphire are AR antireflection films). The selected perforating laser 1 is Edge wave infrared picosecond 40W, and the dicing laser is coherent CO 2 of 55W.

[0070] The core parameter range for use: Parameters of the perforating laser (laser 1): speed is 50 mm / s, power is 10W - 15W, dot pitch is 10μm - 18μm, burst is 6, frequency is 50 kHz, and focal position is 21.0 mm - 21.2 mm;

[0071] Parameters of the dicing laser (CO 2 laser 1): speed is 50 mm / s, power is 5W - 10W, and focal position is 10 mm - 22 mm;

[0072] The cutting effect is as follows (100X): chipping < 20μm, HAZ (heat affected zone) < 20μm. Specifically, HAZ (heat affected zone) = 11.63μm.

[0073] When using the processing device of the optical waveguide provided by the embodiment of the present application to cut the sapphire to be cut, the edge effect of the cut lens and the strength of the lens are improved. The chipping of the cut edge is controlled below 20μm, and the strength is increased by 30%.

[0074] In this embodiment, the material of the optical waveguide is glass. For example, the material of the optical waveguide is high-refractive-index glass. When cutting the special-shaped high-refractive-index glass, the processing device for the optical waveguide provided by the embodiment of the present application has better directivity during the laser dotting process, and it is easier to form a perfect crack along the direction of point to point (i.e., the cutting line of the optical waveguide to be cut). The processing parameters can be operated with a smaller power and a larger point spacing.

[0075] In a specific embodiment, high-refractive-index glass with a thickness of 0.3 mm - 1 mm can be processed, and the refractive index can cover 1.5 - 2.0. Taking 0.6 mm thick ho ya glass as an example, the refractive index of the glass is 1.8 (the front of the glass is embossed with glue and the back is an AR antireflection film). The selected perforating laser 1 is Edge wave infrared picosecond 40W, and the splitting laser is coherent CO 2 of 55W.

[0076] The core parameter range is used: Perforating laser parameters: speed is 50 mm / s, power is 10W - 15W, point spacing is 10μm - 18μm, burst is 3, frequency is 50 khz, and focus position is 21.0 mm - 21.2 mm.

[0077] Splitting laser parameters: speed is 50 mm / s, power is 5W - 10W, and focus position is 10 mm - 22 mm.

[0078] The cutting effect is as follows (100X): chipping < 10um, edge strength B10 > 130 Mpa, HAZ (heat affected zone) < 10um. Specifically, HAZ (heat affected zone) = 7.75μm.

[0079] And with reference to Figure 3 , it shows the strength of the high-refractive-index glass after cutting. The high-refractive-index glass after cutting has a relatively high strength, and the strength of the high-refractive-index glass after cutting is 133.7690 Mpa.

[0080] When using the processing device for the optical waveguide provided by the embodiment of the present application to cut the high-refractive-index glass to be cut, the edge effect of the lens after cutting and the strength of the lens are improved. The chipping of the edge after cutting is controlled below 10μm, and the strength is increased by 30%.

[0081] In this embodiment, the material of the optical waveguide is glass. For example, the material of the optical waveguide is tempered glass. When cutting tempered glass, since the strength of the waveguide itself needs to be very high for some optical waveguide applications, the 4PB strength B10 > 210 MPa, and the ordinary glass and high-refractive-index glass after cutting cannot reach 210 MPa. And because it needs to be cut after the front-end process of making the optical waveguide, it is impossible to cut first and then strengthen, which will damage the grating structure.

[0082] Optimize the cutting parameters through the configuration of the target light spot 7 (such as an elliptical light spot) for strengthened glass cutting. In a specific embodiment, strengthened glass with a thickness of 0.2 mm - 0.6 mm can be processed. Taking GG5 strengthened glass with a thickness of 0.5 mm as an example for illustration. The refractive index of the glass is 1.5 (there is no structure and AR film on the reverse side of the glass with the front side imprinted with glue), and the selected perforation laser 1 is Edge wave infrared picosecond 40W; only perforation cutting is required for strengthened glass cutting. After perforation, it automatically cracks, and there is no need for a splitting laser for thermal expansion and contraction. The core parameter range used is:

[0083] Perforation laser parameters: the speed is 50 mm / s, the power is 4W - 5W, the dot pitch is 8μm - 10μm, the burst is 2, the frequency is 50 kHz, and the focal position is 21.1 mm - 21.2 mm.

[0084] The cutting effect is as follows (100X): the chipping is < 10um, the edge strength B10 > 230 MPa, the HAZ (heat affected zone) < 10um. Specifically, the HAZ (heat affected zone) = 4.48μm.

[0085] And with reference to Figure 4 , the strength of the strengthened glass after cutting is shown. The strengthened glass after cutting has a relatively high strength, and the strength of the strengthened glass after cutting is 236.0589 MPa.

[0086] When using the processing device for optical waveguides provided in the embodiments of the present application to cut the strengthened glass to be cut, the edge effect of the lens after cutting and the strength of the lens are improved. The chipping of the edge after cutting is controlled below 10μm, and the strength is increased by 30%.

[0087] In one embodiment, the processing device for optical waveguides further includes a CO 2 laser, and the CO 2 laser is located above the Bessel module 6.

[0088] In this embodiment, a CO 2 laser is used to perform a splitting process on the optical waveguide. For example, cracks are formed in the optical waveguide to be cut, and the shape of the finished optical waveguide is split out by the CO 2 laser.

[0089] The embodiments of the present application also provide a method for processing an optical waveguide. The method for processing an optical waveguide is applied to the processing device for optical waveguides described above;

[0090] The method for processing an optical waveguide includes:

[0091] Provide an optical waveguide to be cut;

[0092] Turn on the laser 1. The laser 1 emits laser light, which is adjusted by the beam adjustment module and shaped by the spot shaping module 4 to form the target spot 7.

[0093] Rotate the module 5 to make the first connection line 71 of the target spot 7 collinear with the preset cutting line of the optical waveguide to be cut.

[0094] Cut the optical waveguide to be cut along the first connection line 71 through the Bessel module 6.

[0095] In this embodiment, a method for processing an optical waveguide is provided, which is mainly used for cutting the optical waveguide.

[0096] In the embodiment of the present application, by adding the spot shaping module 4 and the rotation module 5 between the beam adjustment module and the Bessel module 6, when cutting the optical waveguide to be cut, the laser spot emitted by the laser 1 is shaped by the spot shaping module 4, and the direction of the first connection line 71 of the target spot 7 is controlled in real time by the rotation module 5 to be the same as the cutting direction of the optical waveguide to be cut in real time, improving the edge effect of the finished optical waveguide after cutting and the strength of the finished optical waveguide, reducing the edge chipping size of the finished optical waveguide, and providing the strength of the finished optical waveguide.

[0097] In one embodiment, the adjustment of the laser by the beam adjustment module specifically includes:

[0098] Performing beam expansion processing on the laser; or

[0099] Performing beam expansion processing on the laser and adjusting the transmission path of the beam after beam expansion.

[0100] In this embodiment, the beam adjustment module mainly includes adjusting the transmission direction of the light emitted by the laser 1 or includes adjusting the diameter and divergence angle of the light emitted by the laser 1.

[0101] In the above embodiments, the differences between the embodiments are mainly described. As long as the different optimization features between the embodiments are not contradictory, they can be combined to form a better embodiment. Considering the simplicity of the text, it will not be elaborated here.

[0102] Although some specific embodiments of the present application have been described in detail by way of examples, those skilled in the art should understand that the above examples are only for illustration and not for limiting the scope of the present application. Those skilled in the art should understand that the above embodiments can be modified without departing from the scope and spirit of the present application. The scope of the present application is defined by the appended claims.

Claims

1. A processing device for an optical waveguide, characterized in that, it includes: a laser (1) for emitting laser light; a beam adjustment module for receiving the laser light emitted by the laser (1) and adjusting the laser light; a spot shaping module (4) for receiving the laser light emitted by the beam adjustment module and shaping the laser spot into a target spot (7); wherein the target spot (7) has a first connection line (71) and a second connection line (72), the length of the first connection line (71) is greater than the length of the second connection line (72), and both the first connection line (71) and the second connection line (72) pass through the center of the target spot (7); a rotation module (5) for driving the spot shaping module (4) to rotate so that the first connection line (71) is the same as the preset cutting direction of the optical waveguide; a Bessel module (6) for cutting the optical waveguide along the first connection line (71).

2. The processing device for an optical waveguide according to claim 1, characterized in that, the beam adjustment module includes a beam expander (2), and the beam expander (2) is used for receiving the laser light emitted by the laser (1) and performing beam expansion processing on the received laser light.

3. The processing device for an optical waveguide according to claim 2, characterized in that, the beam adjustment module further includes at least one reflector (3), and the reflector (3) is used for receiving the laser light emitted by the beam expander (2) and adjusting the transmission path of the laser light.

4. The processing device for an optical waveguide according to claim 1, characterized in that, the target spot (7) is an elliptical spot, the first connection line (71) is the major axis of the elliptical spot, and the second connection line (72) is the minor axis of the elliptical spot.

5. The processing device for an optical waveguide according to claim 1, characterized in that, the target spot (7) is a rectangular spot, the first connection line (71) is a connection line parallel to the long side of the rectangular spot, and the second connection line (72) is a connection line parallel to the short side of the rectangular spot.

6. The processing device for an optical waveguide according to claim 1, characterized in that, the rotation module (5) includes a rotating platform and a rotation driving part, the rotation driving part is used to drive the rotating platform to rotate, and the rotating platform is used to carry the spot shaping module (4).

7. The processing device for an optical waveguide according to claim 1, characterized in that, the material of the optical waveguide is sapphire or glass.

8. The processing device for an optical waveguide according to claim 1, characterized in that, The processing device of the optical waveguide further includes a CO 2 laser, and the CO 2 laser is located above the Bessel module.

9. A processing method for an optical waveguide, characterized in that, the processing method for the optical waveguide is applied to the processing device for an optical waveguide according to any one of claims 1-8; the processing method for the optical waveguide includes: providing an optical waveguide to be cut; starting the laser (1), the laser (1) emits laser light, and the laser light is adjusted by the beam adjustment module and shaped by the spot shaping module (4) to form a target spot (7); using the rotation module (5) to make the first connection line (71) of the target spot (7) collinear with the preset cutting line of the optical waveguide to be cut; Cut the optical waveguide to be cut by the Bessel module (6) along the first connection line (71).

10. The processing method of the optical waveguide according to claim 9, characterized in that the adjustment of the laser by the beam adjustment module specifically includes: performing beam expansion processing on the laser; or performing beam expansion processing on the laser and adjusting the transmission path of the beam after beam expansion.

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