Automatic silicon rod processing and stacking device

Abstract

The invention relates to an industrial device for automatic processing and stacking of silicon rods, in particular to an automatic cutting and transferring device for hard and brittle materials on a production line, and automatic grinding, cooling, polishing and stacking of the cut materials. The device comprises a cutting device 1, a transfer device 2, a grinding and polishing device 3, a grinding and polishing device 5, a multifunctional turnover device 4 and a stacking device 6, the cutting device is used for cutting hard and brittle materials, and the transfer device is used for transferring and returning the cut materials. The grinding device is used for grinding the surfaces of the cut raw materials, the multifunctional overturning device is used for cooling, stripping, overturning and transferring the cut sheets, the polishing device is used for polishing the cooled and transferred sheets, and the stacking device is used for transferring and stacking the polished materials. Wherein the cutting device mainly uses a laser invisible cutting technology, the multifunctional turnover mechanism adopts a mechanical arm structure, a cooling device, a turnover device and a transfer device are loaded on a mechanical arm, and a transfer part in the stacking device can rotate in all directions to adsorb and transfer polished sheets. Through the design and integration of the devices, the problems that at present, the cutting quality of large-size hard and brittle slices is low, manual participation is much, and all working procedures are highly separated are effectively solved. The device has the advantages of being good in cutting quality, high in efficiency and less in manual participation. And the method has a wide application prospect in hard and brittle material cutting processing.

Description

Technical Field:

[0001] The present invention belongs to the technical field of wafer automated production, and specifically relates to a device for automatically cutting, transporting, grinding, cooling, flipping, polishing, and stacking silicon rods. Background Art:

[0002] In the fields of semiconductor, photovoltaic, and microelectronics manufacturing, the automated processing of silicon rods is a key link to improve production efficiency and ensure product quality. As a basic material, silicon rods are widely used in the production and processing of precision chips, the manufacturing of semiconductor materials, and the processing of high-precision products. During the processing of silicon rods, multiple processing steps such as cutting, transporting, grinding, cooling, flipping, polishing, and stacking are required to ensure their dimensional accuracy, surface quality, and final performance. However, traditional silicon rod processing methods have many problems, which limit production efficiency and it is difficult to improve product quality.

[0003] Currently, the cutting of silicon rods is usually carried out using equipment such as wire cutters, laser cutters, or circular saws. After cutting, the silicon wafers and the original silicon rods need to be transported either manually or by simple mechanical devices, and then surface treatment is completed through separate grinding, cooling, flipping, and polishing equipment. Finally, stacking and storage are carried out manually or by mechanical equipment. Since each process of this traditional processing method is independent and each link relies on manual operation, especially during the transportation, flipping, and stacking processes, the labor intensity is high, the production cost is high, the method is relatively inefficient, which will affect the overall processing rhythm. Moreover, the silicon rods need to be frequently transferred between different processes, and surface damage and other problems may occur. All the above problems indicate that the traditional method is difficult to meet the processing requirements of different specifications of silicon rods, affecting flexibility and production efficiency. Summary of the Invention:

[0004] To solve the above technical problems, the present invention provides a device for automatically cutting, transporting, grinding, cooling, flipping, polishing, and stacking silicon rods. This device can integrate multiple processing steps and achieve fully automated processing of silicon rods from cutting to final stacking. The device coordinates the cutting, transporting, cooling, grinding, flipping, polishing, and stacking links through an intelligent control system, and can efficiently complete the processing of silicon rods without manual intervention, improving production efficiency, reducing labor costs, and ensuring the stability of product quality.

[0005] The technical solution adopted by the present invention is: a device for automatically cutting, transporting, cooling, grinding, polishing, and stacking silicon rods, including a cutting device, a transporting device, a multi-functional flipping mechanism, a grinding device, a polishing device, and a stacking device. Each device works in coordination to achieve a high-precision and high-efficiency processing flow through an automated control system, thereby optimizing the production mode of silicon rod processing.

[0006] The cutting device includes a laser emitter, a backing plate, Lens I, Lens II, Lens III, an aluminum profile bracket, a shock absorber, a support plate, a triangular support bracket, a guide rail, a synchronous belt linear module, a sliding seat, a transverse aluminum profile bracket, and a reflector. The laser emitter is installed on the backing plate. A shock absorber is provided below the backing plate and supported by a shock absorber base to reduce vibrations during laser cutting. Lens I, Lens II, and Lens III are arranged in sequence on the laser transmission path for focusing and adjusting the laser light path. Lens I and II are installed on the aluminum profile bracket, and Lens III is installed on the transverse aluminum profile bracket. The two ends of the transverse aluminum profile bracket are fixed on the guide rail. The two guide rails are arranged in parallel and connected to the synchronous belt linear module to ensure the stable movement of the sliding seat.

[0007] The bottom of the transfer device is a support plate, and above the support plate is the transfer device main body. The support platforms are fixedly installed on the support plate, arranged on the left and right sides of the support plate respectively, and placed parallel to each other. Linear guide rails are installed above the support platforms. The silicon rod support platform is installed on the linear guide rails and can slide along the guide rails to adjust the position of the silicon rod. The silicon rod is placed in the silicon rod support platform. A synchronous belt linear module is installed in parallel between the two support platforms. This module is driven by a motor and is used to control the movement of the silicon rod support platform along the linear guide rails. The transfer device can efficiently transfer materials or workpieces and reduce manual intervention.

[0008] The grinding and polishing device adopts a specific rotational grinding and polishing method. The grinding device is equipped with a grinding support platform for supporting and fixing the main part of the grinding device to ensure stable operation during grinding. The grinding wheel is installed on the grinding wheel seat in an axially fixed manner, and the grinding wheel seat is also connected to the bearing seat in an axially fixed manner to ensure stable rotation. Inside the bearing seat, a end cover (for protecting the bearing), a rolling bearing (for reducing friction and improving rotational accuracy), and a positioning sleeve (for ensuring the accurate alignment of the transmission shaft) are installed in sequence from bottom to top. There are two bearing seats, and the upper bearing seat is installed in a mirror image, with the same internal structure. The transmission shaft is installed inside the positioning sleeve and fixed by axial restraint to ensure its stability during operation. The transmission shaft is driven by a motor to achieve the rotational movement of the grinding wheel. The bearing seat is fixed on the support plate, and the linear module is installed vertically and fixed on the grinding support platform through an L-shaped plate to achieve the height adjustment and precise control of the grinding device. The structure of the polishing device is the same as that of the main body of the grinding device. A stacking tray is placed under the polishing device grinding wheel, and the stacking tray is installed on the linear module.

[0009] The multifunctional flipping device includes a base, a first rotating arm mounted on the base, a hydraulic cylinder, a cylinder, a bevel gear mechanism, a second motor, and a flipping mechanism. The hydraulic cylinder is fixedly installed at the other end of the first rotating arm and is used to drive the rotational movement of the first rotating arm to achieve workpiece flipping. The cylinder is fixed to the side plate of the second rotating arm by bolts and is used to adjust the flipping angle or provide auxiliary driving force. The other end of the second rotating arm is connected to the bevel gear mechanism, which is used to change the power transmission direction to make the flipping process smoother, thereby achieving precise flipping of the workpiece.

[0010] The stacking device includes a moving device, a stacking device base plate, stacking columns, Guide Rail 1, an adsorption and transfer mechanism, an annular steering block, and a motor. Guide Rail 2 The stacking device base plate is fixed on the moving device. The stacking columns are installed on the linear guide rails. The annular steering block is installed on the stacking columns and can move up and down along Guide Rail 1. The adsorption and transfer mechanism is installed on the annular steering block. The annular steering block is provided with a guide rail structure, and the adsorption and transfer mechanism can move around the stacking columns along the guide rails. A motor is installed at the bottom of the stacking columns. Through the coordinated movement of the annular steering block and the adsorption and transfer mechanism, it can adapt to workpieces of different sizes and complete precise automatic stacking.

[0011] Furthermore, Lens I and Lens II in the cutting device are fixedly installed on the aluminum profile bracket to stably adjust the laser path; Lens III is installed on the synchronous belt linear module to perform dynamic adjustment during the cutting process.

[0012] Furthermore, the grinding device and the polishing device are equipped with two bearing seats. Among them, the upper bearing seat is installed in a mirror image manner and has the same structure as the lower bearing seat to ensure the stable support of the transmission shaft and improve the operation accuracy of the system.

[0013] Furthermore, the main structure of the polishing device is the same as that of the grinding device. A stacking tray is arranged below its grinding wheel for placing the workpieces that have completed cooling. The cooled workpieces are placed on the stacking tray, and the polishing device performs polishing treatment on them to further optimize the surface quality of the workpieces. The stacking tray is installed on the linear module and can be adjusted according to needs to ensure the stability of the polishing process and adapt to workpieces of different sizes, realizing efficient and automated polishing operations.

[0014] Furthermore, Guide Rail 1 in the stacking device is used to control the vertical movement of the annular steering block, and Guide Rail 2 is used for the horizontal movement of the stacking column mechanism.

[0015] Furthermore, the adsorption and transfer mechanism in the stacking device is installed on the annular steering block and can rotate around the stacking columns along the guide rails on the annular steering block to achieve multi-directional grasping and precise stacking.

[0016] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0017] 1. The present invention adopts high-energy laser cutting technology. During the cutting process, by utilizing the principle of multi-lens refraction and focusing, it optimizes the laser energy distribution, improves the cutting accuracy, reduces the heat-affected zone, and enhances the material utilization rate.

[0018] 2. The present invention adopts an automatic cooling system with an intelligent cooling method (spray cooling), precisely controls the cooling process, replaces manual and natural cooling, and improves the efficiency and reduces errors.

[0019] 3. The present invention uses an automated grinding system driven by a linear module, which can automatically grind the surface of the silicon rod after cutting and ensure that the device returns to its original position, improving the continuous operation ability. It can automatically grind the surface of the silicon rod that has completed cutting and return to its original position after grinding.

[0020] 4. The present invention uses a multi-functional flipping device combined with a hydraulic cylinder and a bevel gear mechanism, which can achieve precise flipping of the workpiece and adapt to different processing requirements.

[0021] 5. The present invention adopts an integrated transportation, polishing, and stacking system: through the coordination of a ring-shaped turning block and an adsorption transportation mechanism, it realizes efficient automated transmission and processing without manual intervention.

[0022] 6. The present invention adopts an intelligent stacking method. The ring-shaped turning block cooperates with the guide rail, and can automatically adjust the adsorption transportation mechanism according to the workpiece size, improving the adaptability and stacking accuracy.

[0023] 7. The present invention realizes a fully automated integrated system, optimizes the production process, improves the overall production efficiency, reduces the processing time, and increases the output per unit time. Description of the Drawings:

[0024] Figure 1 It is the overall assembly drawing of the device;

[0025] Figure 2 It is the cutting device drawing;

[0026] Figure 3 It is the accessory drawing of the synchronous belt linear module in the cutting device of the present invention;

[0027] Figure 4 It is the transportation device drawing;

[0028] Figure 5 It is the enlarged drawing of the linear guide rail in the transportation device of the present invention;

[0029] Figure 6 It is the grinding device drawing;

[0030] Figure 7 It is the partial enlarged drawing of the transmission part in the grinding device;

[0031] Figure 8It is a diagram of a multi-functional flipping device;

[0032] Figure 9 It is a schematic structural diagram of a bevel gear structure;

[0033] Figure 10 It is a schematic diagram of the synchronous belt rotating part;

[0034] Figure 11 It is a sectional view of the synchronous belt rotating part;

[0035] Figure 12 It is a schematic structural diagram of a cylinder and a vacuum flipping head;

[0036] Figure 13 It is the ground cooling pipeline and vacuum suction holes of the vacuum suction cup flipping head for installing a cooling valve;

[0037] Figure 14 It is a diagram of a polishing device;

[0038] Figure 15 It is a diagram of a stacking device;

[0039] Figure 16 It is a diagram of the moving device in the stacking device;

[0040] Figure 17 It is a diagram of the adsorption and transfer mechanism in the stacking device; Specific implementation method:

[0041] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0042] As Figure 1 shown, the present invention includes a cutting device 1, a transfer device 2, a grinding device 3, a multi-functional flipping device 4, a polishing device 5, and a stacking device 6;

[0043] The cutting device 1 includes an aluminum profile bracket 1-1, a backing plate 1-2, a laser emitter 1-3, a lens I 1-4, a shock absorber 1-5, a linear guide 1-6, a lens II 1-7, a lens III 1-8, a reflector 1-9, a transverse aluminum profile bracket 1-10, a synchronous belt linear module 1-11, a support plate 1-12, and a triangular support frame 1-13. When the cutting device 1 is working, the laser emitter 1-3 emits high-energy laser, which first directly hits the lens I 1-4, and the lens I 1-4 emits linearly downward to the lens II 1-7. The lens II 1-7 reflects again to the lens III 1-8, and the lens III 1-8 reflects through the small hole of the reflector 1-9 to the silicon rod 2-3 for laser stealth cutting; during the cutting process, the synchronous belt linear module 1-11 is in the startup state, driving the transverse aluminum profile bracket 1-10 to move left and right repeatedly to cut the silicon rod and complete the lower surface splitting;

[0044] The transfer device 2 includes a support plate 2-1, a linear guide 2-2, a silicon rod 2-3, a synchronous belt linear module 2-4, a motor 2-5, and a silicon rod support table 2-6. The transfer device 2 has two functions. One is to cooperate with the cutting of the cutting device 1, and the other is to transfer the silicon rod 2-3. During the cutting process of the cutting device, the synchronous belt linear module 2-4 drives the silicon rod support table 2-6 to move slowly. When one cutting is completed, the vacuum chuck turning head (14-7-5) of the multi-functional flipping mechanism sucks the cut silicon wafer. The grinding wheel 3-2 in the grinding device 3 grinds the upper surface of the silicon rod 2-3. After grinding, the transfer device 2 drives the silicon rod 2-3 back to its original position;

[0045] The grinding device 3 includes a grinding support table 3-1, a grinding wheel 3-2, a bearing seat I 3-3, a transmission part 3-4, a motor 3-5, a bearing seat II 3-6, a support plate 3-7, a linear module 3-8, and an L-shaped plate 3-9. The transmission part includes a grinding wheel seat 3-4-1, an end cover 3-4-2, a rolling bearing 3-4-3, a positioning sleeve 3-4-4, a bearing 3-4-5, a positioning ring 3-4-6, and a transmission shaft 3-4-7. The grinding wheel seat 3-4-1 is used to connect the grinding wheel 3-2. The end cover 3-4-2 is used to seal the bearing seat I 3-3. The rolling bearing 3-4-3 is used to support the transmission shaft 3-4-7 and reduce friction during transmission. The positioning sleeve 3-4-4 and the positioning ring 3-4-6 are used for the axial positioning of the rolling bearing 3-4-3. The transmission shaft 3-4-7 is used for transmission. The grinding device 2 is mainly used to grind the surface of the silicon rod 2-3 after cutting to remove burrs. When the silicon rod 2-3 is transferred below the grinding device 2, the linear module 3-8 moves up and down. Driven by the motor 3-5, the transmission shaft 3-4-7 drives the grinding wheel 3-2 to rotate and grind the surface of the silicon rod 2-3.

[0046] The multi-functional flipping mechanism 4 includes a base 4-1, a first rotating arm 4-2, a cylinder part 4-3, a second motor 4-4, a bevel gear mechanism 4-5, a hydraulic cylinder 4-6, and a flipping mechanism 4-7. Among them, the first rotating arm (4-2) is driven by a motor inside the base to rotate and drive the entire flipping mechanism. The vacuum chuck turning head (14-7-5) is connected by two rotating shafts (rotating shaft 1: 4-7-2, rotating shaft 2: 4-7-9), both of which are installed on the bearing (4-7-13), and the bearing (4-7-13) is fixed on the large U-shaped plate (4-7-1). The back of the large U-shaped plate (4-7-1) is connected to the support plate (4-7-4) and is integrally installed on the first motor (4-7-6). At the same time, the support plate (4-7-4) is connected to the hydraulic cylinder (4-6). The first motor (4-7-6) drives the small pulley (4-7-8), and the small pulley drives the large pulley (4-7-10) through the synchronous belt (4-7-11), and then drives the rotating shaft 2 (4-7-9) to achieve synchronous rotation control.

[0047] The hydraulic cylinder (4-6) is fixed to the other end of the first rotating arm (4-2), and a double-ribbed circular base (4-5-10) is installed at the top of its cylinder block (4-6). A bearing (4-5-7) is provided on the double-ribbed circular base (4-5-10), and a motor support plate is installed thereon. A second motor (4-4) is fixed on the motor support plate. The second motor (4-4) drives the input shaft (4-5-8) to rotate. A sleeve (4-5-6) and a small bevel gear (4-5-5) are installed on the input shaft. The small bevel gear (4-5-5) meshes with the large bevel gear (4-5-3) to drive the output shaft (4-5-2) to rotate. The output shaft (4-5-2) is fixed to the small U-shaped plate (4-5-1) by bolts. At the same time, the small U-shaped plate (4-5-1) is also connected to the double-ribbed circular base (4-5-10) to ensure the stability of the entire transmission system. In addition, the output shaft (4-5-2) is connected to the second rotating arm (4-3-3), and the second rotating arm (4-3-3) is fixed to the cylinder (4-3-2) by bolts. The cylinder (4-3-2) drives the piston rod to extend and retract, and is connected to the vacuum chuck turning head 2 (4-3-1) through its end, so as to realize the precise turning control of the chuck.

[0048] During the working process, the base (4-1) is fixed on the workbench, and the first rotating arm (4-2) is driven by a motor to rotate to the initial position. The first motor (4-7-6) drives the small pulley (4-7-8) to rotate. Through the transmission of the synchronous belt (4-7-11) and the large pulley (4-7-10), the rotation shafts 1 (4-7-2) and 2 (4-7-9) are driven, driving the vacuum suction cup flipping head 1 (14-7-5) to flip downward. When the flipping head 1 (14-7-5) is parallel to the silicon wafer, the second motor (4-4) stops working, and the hydraulic rod starts to move downward. When the vacuum suction cup flipping head 1 (14-7-5) touches or is about to touch the surface of the silicon wafer, the cooling valve (4-7-3) installed on the vacuum suction cup releases the coolant through the pipeline to cool the surface of the silicon wafer. After cooling is completed, the vacuum suction cup flipping head 1 (14-7-5) adsorbs the silicon wafer and drives the silicon wafer to rotate by a certain angle to complete the peeling of the silicon wafer. After peeling is completed, the hydraulic rod rises, and the first motor (4-7-6) rotates in reverse. The synchronous belt (4-7-11) is used to drive the flipping head to flip upward until the silicon wafer flips to be parallel to the horizontal plane. At this time, the first motor stops working, and the second motor (4-4) starts. Through the cooperation of the small bevel gear (4-5-5) and the large bevel gear (4-5-3), the second rotating arm (4-3-3) is driven to rotate, driving the vacuum suction cup flipping head 2 (4-3-1) to rotate. When the flipping head 2 (4-3-1) is concentric with the silicon wafer, the second motor (4-4) stops working, and the air rod starts to move up and down. When the vacuum suction cup flipping head 2 (4-3-1) coincides with the lower surface of the silicon wafer, the movement stops, and the vacuum suction cup flipping head 2 (4-3-1) adsorbs the silicon wafer. Subsequently, the pneumatic rod moves upward, and the second motor (4-4) starts to work, driving the silicon wafer to rotate in the direction of the polishing process until the silicon wafer reaches the specified position. After the second motor stops working, the pneumatic rod moves downward until the silicon wafer is concentrically matched with the stacking tray (5-13), and the vacuum suction cup flipping head 2 (4-3-1) stops adsorbing, completing the cooling, flipping and transportation of the silicon wafer.

[0049] The main part of the polishing device 5 is the same as that of the grinding device 3. The difference is that the polishing device does not have the support table 3-1, but there is a stacking tray (5-13) below the polishing device. The stacking tray is installed on the linear module (5-14). When the silicon wafer is cooled, the multi-functional flipping device 4 transports the silicon wafer to the stacking tray (5-13), and the linear module (5-14) moves. The polishing disc (5-12) in the polishing device 5 polishes the surface of the silicon wafer.

[0050] The stacking device includes a moving device (6-1), a stacking device bottom plate (6-2), a stacking column (6-3), a guide rail 1 (6-4), an adsorption and transfer mechanism (6-5), an annular steering block (6-6), and a motor (6-7). Among them, a steering wheel (6-1-1) is installed on a bevel gear steering box (6-1-2), and the bevel gear steering box (6-1-2) is fixedly installed on a vehicle frame (6-1-5). The bevel gear steering box (6-1-2) is connected to a motor (6-1-4), and the motor (6-1-4) is fixedly installed on the vehicle frame (6-1-5). The wheel at the rear end of the wheel assembly is a driving wheel, which is connected to an axle coupling (6-1-3), and the axle coupling (6-1-3) is connected to the motor (6-1-4). The motor (6-1-4) is fixedly installed on the vehicle frame (6-1-5), and the vehicle frame (6-1-5) is fixedly installed on the stacking device bottom plate (6-2). A guide rail 1 (6-4) is provided on the stacking column (6-3) for the up and down movement of the annular steering block (6-6). The annular steering block (6-6) is installed on the stacking column (6-3). A double-ribbed plate base (6-5-1) is fixedly installed on the annular steering block (6-6). The motor (6-5-7) and a reducer (6-5-8) are fixedly installed on the double-ribbed plate base (6-5-1) by bolts. A rolling bearing (6-5-6) is installed on the double-ribbed plate base (6-5-1) and positioned by a shaft-end sleeve and a bearing end cover. A rotating shaft (6-5-9) is installed on the double-ribbed plate base (6-5-1). Two retractable rods (6-5-3) are installed on the rotating shaft (6-5-9), and the retractable rods are fixedly installed on a linear module (6-5-4). A slider of the linear module (6-5-4) is fixedly installed with a vacuum suction cup (6-5-5). The double-ribbed plate base (6-5-1) is fixedly installed on a support base (6-5-2).

[0051] The stacking device includes a moving device (6-1), a stacking device bottom plate (6-2), a stacking column (6-3), a guide rail 1 (6-4), an adsorption and transfer mechanism (6-5), an annular steering block (6-6), and a motor (6-7). Among them, a steering wheel (6-1-1) is installed on a bevel gear steering box (6-1-2), and the bevel gear steering box (6-1-2) is fixedly installed on a vehicle frame (6-1-5) and connected to a motor (6-1-4), and the motor (6-1-4) is also fixed on the vehicle frame (6-1-5). The rear end of the wheel assembly is a drive wheel, and the drive wheel is connected to the motor (6-1-4) through an axle coupling (6-1-3), and the vehicle frame (6-1-5) is installed and fixed on the stacking device bottom plate (6-2). A guide rail 1 (6-4) is provided on the stacking column (6-3) for supporting the up and down movement of the annular steering block (6-6). The annular steering block (6-6) is installed on the stacking column (6-3), and a double ribbed plate base (6-5-1) is fixed on the annular steering block (6-6). A motor (6-5-7) and a reducer (6-5-8) are installed and fixed on the double ribbed plate base (6-5-1) through bolts. A rolling bearing (6-5-6) is installed on the double ribbed plate base (6-5-1) and positioned through a shaft end sleeve and a bearing end cover. A rotating shaft (6-5-9) is installed on the double ribbed plate base (6-5-1), two retractable rods (6-5-3) are fixed on the rotating shaft (6-5-9), a linear module (6-5-4) is installed and fixed on the retractable rods, and a vacuum suction cup (6-5-5) is fixedly installed on the slider of the linear module. The double ribbed plate base (6-5-1) is fixedly installed on a support seat (6-5-2).

[0052] During operation, the stacking column (6-3) is located at the rear end of the equipment and calibrates the position of the material by moving forward and upward. After the position calibration is completed, the servo motor (6-5-7) on the load platform starts, drives the rotating shaft (6-5-9) to rotate, and makes the retractable rod (6-5-3) and the vacuum chuck (6-5-5) start the first lowering. At the same time, the linear module (6-5-4) starts and drives the vacuum chuck (6-5-5) for the second lowering. When the retractable rod (6-5-3) is parallel to the surface of the material, the servo motor (6-5-7) stops and the first lowering is completed. Subsequently, the linear module (6-5-4) continues to slide, moves the vacuum chuck (6-5-5) to directly above the silicon wafer and then stops, completing the second lowering. At this time, there is still a certain longitudinal distance between the vacuum chuck (6-5-5) and the silicon wafer, and the stacking column (6-3) makes fine adjustments to make the vacuum chuck (6-5-5) almost fit the surface of the material. After the adjustment is completed, the vacuum chuck (6-5-5) starts to adsorb the material. After successful adsorption, the stacking column (6-3) moves to a safe position. The annular turning block (6-6) starts, and makes the adsorption and transfer mechanism (6-5) and the material rotate horizontally by 180° and then stop. Subsequently, the stacking column (6-3) moves to the material stacking area, calibrates the position of the material again, and when the material is almost fitted with the storage location, the vacuum chuck stops adsorbing and the material storage is completed. For the fragile silicon wafer material with an inclined angle in the storage location, the rotating shaft (6-5-9) on the load platform is adjusted to a specific angle by the servo motor (6-5-7) to ensure that the material is parallel to the surface of the storage location, and the material is released after re-calibration. When it is necessary to transfer the materials to other workstations, the wheel assembly at the bottom of the stacker starts. Through the coordinated action of the driving wheel driven by the motor (6-1-4) and the bevel gear steering box (6-1-2), the steering wheel (6-1-1) coordinates the steering, and makes the stacking column (6-3) move to the target workstation to continue the operation. After all the material storage operations are completed, the annular turning block (6-6) starts and rotates the adsorption and transfer mechanism (6-5) back to the initial position. The servo motor (6-5-7) drives the rotating shaft (6-5-9) to rotate again, and makes the retractable rod (6-5-3) drive the vacuum chuck (6-5-5) for the first recovery. Subsequently, the linear module (6-5-4) starts and drives the vacuum chuck to complete the second retraction and extension until it fits with the support seat (6-5-2). The support seat (6-5-2) plays a role in protecting the vacuum chuck (6-5-5), avoiding damage to related components due to the bending moment generated by side placement, thereby protecting the safe operation of the equipment.

Claims

1. An industrial device for braking, processing and stacking silicon rods, comprising a cutting device (1), a transfer device (2), a grinding and polishing device (3 and 5), a multifunctional turning device (4) and a stacking device (6), characterized in that: The cutting device (1) is used for cutting hard and brittle materials; The transfer device (2) is used to transfer the cut materials and workpieces from the cutting device (1) to the grinding device (3) and the multifunctional turning device (4), and to transfer the raw materials to their original positions after the grinding device (3) has finished grinding the cut surfaces of the raw materials; The grinding device (3) is used to grind the surface of the raw material after cutting; The multifunctional turning device (4) cools, peels, turns and transports the cut slices; The polishing device (5) is used to perform surface polishing on the slice that has been cooled after cutting; The stacking device (6) is used to transport and stack the thin slices with polished surfaces at a designated location.

2. The mechanical device according to claim 1, wherein: The cutting device (1) is a laser invisible cutting device. The uppermost end of the cutting device is a laser emitter (1-3) fixed on the pad (1-2) by width matching. The four corners of the pad (1-2) are cut into a square structure so as to be fixed on the aluminum profile bracket (1-1). One end of the pad (1-2) is provided with a large-sized square structure; the lens I (1-4) is fixed on the aluminum profile bracket (1-1); there is a shock absorber (1-5) under the pad (1-2), and the shock absorber (1-5) is distributed around the pad and fixed on the support plate (1-12) by bolt connection; below the support plate (1-12) is a triangular support frame (1-13), and the triangular support frame (1-13) is fixed on the aluminum profile bracket by bolt connection. The cutting device is provided with a linear guide rail (1-6) at the right end of the middle layer, and a synchronous belt linear module (1-11) is installed at the left end; the synchronous belt linear module includes four parts, namely a motor (1-11-1), a sliding seat (1-11-2) and a linear guide rail (1-11-3); a transverse aluminum profile bracket (1-10) is fixed above the sliding seat (1-11-2); a reflector (1-9) is fixed at the midpoint of the transverse aluminum profile bracket (1-10); a lens III (1-8) is installed in the reflector (1-9); and a lens II (1-7) is fixed on the aluminum profile bracket (1-1).

3. The mechanical device according to claim 1, wherein: The bottom of the transfer device (2) is a support plate (2-1), and the upper part of the support plate (2-1) is the transfer device body; the linear guide rail (2-2) is fixed on the support plate (2-1), and one is arranged on each of the left and right sides, and is placed in parallel; the linear guide rail (2-2) is divided into three parts, a support platform (2-2-1), a sliding seat (2-2-2), and a guide rail (2-2-3); the upper part of the linear guide rail (2-2) is a silicon rod support platform (2-6), and the silicon rod (2-3) is coaxially assembled in the silicon rod support platform (2-6), and a synchronous belt linear module (2-4) is placed in parallel between the two linear guide rails (2-2), and the synchronous belt linear module (2-4) is driven by a motor (2-5) to drive the movement of the silicon rod support platform (2-6). The transfer device (2) can efficiently transfer materials or workpieces and reduce manual intervention.

4. The mechanical device according to claim 1, wherein: The grinding and polishing devices (3 and 5) adopt a specific rotary grinding and polishing method. The grinding device has a grinding support table (3-1), a grinding wheel (3-2) is connected to a grinding wheel seat (3-4-1) by axial fixation; the grinding wheel seat (3-4-4) is connected to a bearing seat (3-3) by axial fixation, and the inside of the bearing seat (3-3) is axially fixed with an end cover (3-4-2), a rolling bearing (3-4-3) and a positioning sleeve (3-4-4) from bottom to top. There are two bearing seats, and the upper end bearing seat (3-6) is mirror-mounted, and the internal structure The structure is the same as that of the grinding machine. The transmission shaft (3-4-7) is installed in the axial direction of the positioning sleeve (3-4-4). The bearing (3-4-5) is positioned by the positioning ring (3-4-6). The transmission shaft (3-4-7) is driven by the motor (3-5). The bearing seat (3-3) (3-6) is fixed on the support plate (3-7). The linear module (3-8) is vertically installed and fixed by the L-shaped plate (3-9). The L-shaped plate (3-9) is installed on the grinding support table (3-1). The structure of the polishing device is the same as the main structure of the grinding device. A stacking plate (5-12) is placed under the grinding wheel (5-12) of the polishing device, and the stacking plate (5-12) is installed on the linear module (5-14).

5. The mechanical device according to claim 1, wherein: The multifunctional turning device (4) comprises a base (4-1), a first rotating arm (4-2) mounted on the base (4-1), a hydraulic cylinder (4-6), a cylinder part (4-3), a bevel gear mechanism (4-5), a second motor (4-4), and a turning mechanism (4-7), wherein the hydraulic cylinder (4-6) is mounted and fixed on the other end of the first rotating arm (4-2), the cylinder (4-3) is fixed to the side plate of the second rotating arm (4-2) by bolts, and the other end of the second rotating arm (4-2) is connected to the bevel gear mechanism (4-5), so as to realize accurate turning of the workpiece.

6. The mechanical device according to claim 1, wherein: The stacking device (6) comprises a moving device (6-1), a stacking device bottom plate (6-2), a stacking column (6-3), a guide rail 1 (6-4), an adsorption transfer mechanism (6-5), an annular steering block (6-6), a motor (6-7), and a guide rail 2 (6-8). The stacking device bottom plate (6-2) is fixed on the moving device (6-1), the stacking column is installed on the linear guide rail (6-8), the annular steering block (6-6) is installed on the stacking column (6-3), and the annular steering block (6-6) can move up and down along the guide rail 1 (6-4), the adsorption and transfer mechanism (6-5) is installed on the annular steering block (6-6), the annular steering block (6-6) is provided with a guide rail structure, the adsorption and transfer mechanism (6-5) can move around the stacking column (6-3) along the guide rail, and a motor (6-7) is installed at the bottom of the stacking column (6-3). The coordinated movement of the annular steering block (6-6) and the adsorption and transfer mechanism (6-5) can automatically stack workpieces of different sizes.

7. The mechanical device according to claim 1, wherein: The various parts are coordinated and cooperated through mechanical connections to improve the working efficiency of the entire device.

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