Pluggable assembly preparation method and device

Abstract

The invention provides a plug-in assembly preparation method and device, and the method comprises the steps: building a fitting relation according to a size measurement data set of a plurality of sample assemblies, each sample assembly is composed of a plug-in unit entity and a plug-in hole position entity, and the size measurement data set comprises the measurement size of the plug-in unit entity in each sample assembly, the measurement size of the plug-in unit entity in each sample assembly, and the measurement size of the plug-in unit entity in each sample assembly; the fitting relationship between the size deviation value and the measured size of the corresponding plug hole position entity is the linear relationship between the size deviation value and the design size of the corresponding plug hole position entity; selecting a target plug-in unit, and identifying a corresponding target plug-in hole position in the slice file of the target plug-in unit according to the characteristics of the target plug-in unit; and calculating a target compensation amount according to the fitting relationship, and generating a target data file for printing the target plug-in component according to the target compensation amount and the slice file. Based on the above mode, the precision of the finally obtained plugging assembly entity can be improved, the plugging tightness can be ensured to meet the application requirements, the cost is low, and the operation is convenient.

Description

Technical Field

[0001] The present invention mainly relates to the technical field of 3D printing, and particularly relates to a preparation method and device for a plug-in component. Background Art

[0002] 3D printing technology is an additive manufacturing technology that realizes printing by establishing a three-dimensional model, slicing it, and then manufacturing it layer by layer. During the layer-by-layer manufacturing process, due to insufficient material properties and equipment accuracy, etc., the accuracy of the finally obtained model entity is relatively low. For plug-in components, the printed model entity often cannot meet the actual tightness requirements. Summary of the Invention

[0003] The purpose of the present invention is to provide a preparation method and device for a plug-in component to solve the above technical problems.

[0004] In a first aspect, a preparation method for a plug-in component is provided, including:

[0005] Construct a fitting relationship based on the size measurement data sets of a number of sample components, where each sample component consists of a plug-in entity and a plug-in hole entity, and the size measurement data set includes: the size deviation amount between the measured size of the plug-in entity in each sample component and the measured size of the corresponding plug-in hole entity, and the fitting relationship is a linear relationship between the size deviation amount and the designed size of the corresponding plug-in hole entity;

[0006] Select a target plug-in, and identify the corresponding target plug-in hole in the slice file of the target plug-in component according to the characteristics of the target plug-in;

[0007] Calculate a target compensation amount according to the fitting relationship, and generate a target data file for printing the target plug-in component according to the target compensation amount and the slice file.

[0008] In some embodiments, the fitting relationship is:

[0009] Deviation(i) = Size(i)*k + β

[0010] Wherein, Deviation(i) represents the size deviation amount between the measured size of the i-th plug-in hole entity and the measured size of its corresponding plug-in entity, Size(i) represents the designed size of the i-th plug-in hole entity, k represents the slope, β represents the intercept, and i represents the serial number of the sample component.

[0011] In some embodiments, the identifying the corresponding target plug-in hole in the slice file of the target plug-in component according to the characteristics of the target plug-in includes:

[0012] Identify the unplugging hole positions that match the size and / or shape of the target unplugging component in the slice file as the target unplugging hole positions.

[0013] In some embodiments, generating a target data file for printing the target unplugging component according to the target compensation amount and the slice file includes:

[0014] Restore the three-dimensional data file of the target unplugging component according to the slice file, and identify the three-dimensional model surface information of the target unplugging hole positions according to the three-dimensional data file;

[0015] For the three-dimensional data file, perform a displacement operation on the three-dimensional model surface information according to the target compensation amount to obtain the target data file; the target compensation amount satisfies: Comp = S * k + β, where Comp is the target compensation amount, S is the designed size of the target unplugging hole position, k is the slope determined by the fitting relationship, and β is the intercept determined by the fitting relationship.

[0016] In some embodiments, generating a target data file for printing the target unplugging component according to the target compensation amount and the slice file includes:

[0017] Extract the edges of the vector graphics in the slice file;

[0018] For the slice file, perform a displacement operation on the edges of the vector graphics according to the target compensation amount; the target compensation amount satisfies: Comp = S * k + β, where Comp is the target compensation amount, S is the designed size of the target unplugging hole position, k is the slope determined by the fitting relationship, and β is the intercept determined by the fitting relationship;

[0019] Generate the target data file according to the slice file after the displacement operation.

[0020] In some embodiments, generating a target data file for printing the target unplugging component according to the target compensation amount and the slice file includes:

[0021] Convert the slice file into a pixel image, and extract the target pixel points in the pixel image, where the target pixel points refer to some pixel points inside or outside the contour of the corresponding target pattern;

[0022] Modify all the target pixel points according to the target compensation amount to achieve the movement of the pattern contour; the target compensation amount satisfies: Comp = S * k + β, where Comp is the target compensation amount, S is the designed size of the target unplugging hole position, k is the slope determined by the fitting relationship, and β is the intercept determined by the fitting relationship;

[0023] Generate the target data file based on all the modified target pixel points.

[0024] In some embodiments, it further includes:

[0025] Print the target data file using the same printing material as the several sample components to obtain the target plug-and-play component.

[0026] In a second aspect, there is provided a device for preparing a plug-and-play component, including:

[0027] A fitting module, configured to construct a fitting relationship according to the size measurement data sets of several sample components, where each sample component is composed of a plug entity and a plug hole entity, and the size measurement data sets include: the size deviation amount between the measured size of the plug entity in each sample component and the measured size of the corresponding plug hole entity, and the fitting relationship is a linear relationship between the size deviation amount and the designed size of the corresponding plug hole entity;

[0028] An identification module, configured to select a target plug and identify the corresponding target plug hole in the slice file of the target plug-and-play component according to the characteristics of the target plug;

[0029] A processing module, configured to calculate a target compensation amount according to the fitting relationship, and generate a target data file for printing the target plug-and-play component according to the target compensation amount and the slice file.

[0030] In a third aspect, there is provided an electronic device. The electronic device includes: one or more processors; and one or more memories coupled to the one or more processors and storing instructions thereon. When the instructions are executed by the one or more processors alone or jointly, the electronic device is caused to execute the above-mentioned method for preparing a plug-and-play component.

[0031] In a fourth aspect, there is provided a non-transitory computer-readable storage medium storing machine-executable instructions. When the machine-executable instructions are executed by one or more processors of the machine, the machine is caused to execute any one of the above-mentioned methods.

[0032] Compared with the prior art, the present invention has the following advantages:

[0033] The embodiments of the present application provide a method and a device for preparing a plug-and-play component. By correcting the data file of the target plug-and-play component through a fitting relationship constructed based on the measured sizes of the sample components, and then realizing 3D printing according to the processed target data file, the accuracy of the finally obtained plug-and-play component entity can be improved, ensuring that the plugging tightness meets the application requirements, and the cost is low and the operation is convenient.

[0034] It should be understood that the Summary of the Invention section is not used to identify the key or essential features of the embodiments of the present disclosure, nor is it used to limit the scope of the present disclosure. Through the following description, other features of the present disclosure will become readily understandable. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] The inclusion of the drawings is to provide a further understanding of the present application, and they are incorporated into and constitute a part of this application. The drawings illustrate embodiments of the present application and, together with this specification, serve to explain the principles of the present application. In the drawings:

[0036] Figure 1 is a flowchart 100 of a method for preparing a plug-in component provided by way of example;

[0037] Figure 2 is a schematic diagram 200 of a device for preparing a plug-in component provided by way of example;

[0038] Figure 3 is a schematic diagram 300 of an electronic device provided by way of example. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0039] Now, the principles of the present disclosure will be described with reference to some embodiments. It should be understood that the description of these embodiments is for illustrative purposes only and helps those skilled in the art to understand and implement the present disclosure, without imposing any limitation on the scope of the present disclosure. The disclosure described herein can be implemented in a manner different from that described below.

[0040] In the following description and claims, unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the present disclosure pertains.

[0041] References to "one embodiment", "an embodiment", "exemplary embodiment", etc. in the present disclosure indicate that the described embodiment may include a specific feature, structure, or characteristic, but not every embodiment necessarily includes the specific feature, structure, or characteristic. Moreover, such phrases do not necessarily refer to the same embodiment. Additionally, when a specific feature, structure, or characteristic is described in connection with an exemplary embodiment, whether explicitly described or not, those skilled in the art will be aware of such feature, structure, or characteristic in connection with other embodiments.

[0042] Figure 1 is a flowchart 100 of a method for preparing a plug-in component provided by way of example, including:

[0043] S101, constructing a fitting relationship based on the dimensional measurement data sets of a plurality of sample components.

[0044] Among them, each sample component consists of a plug-in entity and a plug-in hole entity. The plug-in entity and the plug-in hole entity are used in a matching manner, such as teeth and tooth shells, etc., and there is no limitation on this.

[0045] The dimensional measurement data set includes: the dimensional deviation amount between the measured dimension of the plug-in entity in each sample component and the measured dimension of the corresponding plug-in hole entity.

[0046] Exemplarily, n plug-in entities and n plug-in hole entities printed in a set are used as sample components, where n is an integer greater than 2. Taking one of the sample components as an example, the dimensional deviation amount of this set of sample components is determined by comparing the measured dimension of the plug-in entity and the measured dimension of the plug-in hole entity.

[0047] The fitting relationship is a linear relationship between the dimensional deviation amount and the designed dimension of the corresponding plug-in hole entity.

[0048] In some embodiments, the fitting relationship is:

[0049] eviation(i)=Size(i)*k+β

[0050] Among them, Deviation(i) represents the dimensional deviation amount between the measured dimension of the i-th plug-in hole entity and the measured dimension of its corresponding plug-in entity, Size(i) represents the designed dimension of the i-th plug-in hole entity, k represents the slope, β represents the intercept, and i represents the number of the sample component.

[0051] Exemplarily, taking the dimensional deviation amounts corresponding to n plug-in hole entities as the output and the designed dimensions corresponding to n plug-in hole entities as the input, the above fitting relationship is constructed by using the linear regression method.

[0052] The intercept and slope in the fitting relationship reflect the linear relationship between the designed dimension and the actual dimension caused by 3D printing. Furthermore, combined with the current designed dimension of the target plug-in component, the target compensation amount required for this target plug-in component can be calculated.

[0053] S102. Select a target plug-in and identify the corresponding target plug-in hole in the slice file of the target plug-in component according to the characteristics of the target plug-in.

[0054] In some embodiments, identifying the corresponding target plug-in hole in the slice file of the target plug-in component according to the characteristics of the target plug-in includes:

[0055] Identifying the plug-in hole that matches the size and / or shape of the target plug-in in the slice file as the target plug-in hole.

[0056] Among them, the slice file is obtained by slicing the three-dimensional model of the target plug-in.

[0057] Exemplarily, the target plug-in can be circular, square, regular hexagon, etc. Taking the circular shape as an example, the recognizable circular plug-in hole positions are selected as the target plug-in hole positions.

[0058] It will be understood that in practical applications, the target plug-in hole positions can also be selected, the target plug-ins corresponding to the target plug-in hole positions are identified, and then the data files of the target plug-ins are corrected.

[0059] S103. Calculate the target compensation amount according to the fitting relationship, and generate a target data file for printing the target plug-in component according to the target compensation amount and the slice file.

[0060] In some embodiments, the target compensation amount satisfies:

[0061] Comp = S * k + β

[0062] Wherein, Comp is the target compensation amount, S is the design size of the target plug-in hole position, k is the slope determined by the fitting relationship, and β is the intercept determined by the fitting relationship.

[0063] As a first implementation manner, generating a target data file for printing the target plug-in component according to the target compensation amount and the slice file may include:

[0064] Restore the three-dimensional data file of the target plug-in component according to the slice file, and identify the three-dimensional model surface information of the target plug-in hole position; and,

[0065] For the three-dimensional data file, perform a displacement operation on the three-dimensional model surface information according to the target compensation amount to obtain the target data file.

[0066] Exemplarily, in the first manner, the three-dimensional model surface information of the target plug-in hole position can be displaced, and the displacement amount is the value of the target compensation amount calculated according to the fitting relationship.

[0067] As a second implementation manner, generating a target data file for printing the target plug-in component according to the target compensation amount and the slice file may include:

[0068] Extract the edges of the vector graphics in the slice file;

[0069] For the slice file, perform a displacement operation on the edges of the vector graphics according to the target compensation amount; and,

[0070] Generate a target data file according to the slice file after the displacement operation.

[0071] Exemplarily, in the second method, the edge of the vector graphic can be displaced, and the displacement amount is the value of the target compensation amount calculated according to the fitting relationship.

[0072] As a third implementation manner, generating a target data file for printing the target plug-in component according to the target compensation amount and the slice file may include:

[0073] Converting the slice file into a pixel image, and extracting target pixel points in the pixel image, where the target pixel points refer to some pixel points inside or outside the contour of the corresponding target pattern;

[0074] Modifying all the target pixel points according to the target compensation amount to realize the movement of the pattern contour; and,

[0075] Generating the target data file according to all the modified target pixel points.

[0076] Exemplarily, in the third method, all the target pixel points can also be modified to realize the movement of the pattern contour, and the movement amount is the value of the target compensation amount.

[0077] In some embodiments, it further includes:

[0078] Printing the target data file with the same printing material as several sample components to obtain the target plug-in component.

[0079] Figure 2 It is a schematic diagram 200 of a plug-in component preparation device provided exemplarily. Refer to Figure 2 This device includes: a fitting module 201, an identification module 202, and a processing module 203.

[0080] The fitting module 201 is used to construct a fitting relationship according to the size measurement data sets of several sample components, where each sample component is composed of a plug-in entity and a plug-in hole position entity, and the size measurement data sets include: the measurement sizes of the plug-in entities in each sample component, the size deviation amounts between the measurement sizes of the corresponding plug-in hole position entities, and the fitting relationship is a linear relationship between the size deviation amounts and the design sizes of the corresponding plug-in hole position entities;

[0081] The identification module 202 is used to select a target plug-in and identify the corresponding target plug-in hole position in the slice file of the target plug-in component according to the characteristics of the target plug-in;

[0082] The processing module 203 is used to calculate the target compensation amount according to the fitting relationship, and generate a target data file for printing the target plug-in component according to the target compensation amount and the slice file.

[0083] In some embodiments, the identification module 202 is specifically used for:

[0084] Identify the unplugging hole positions that match the size and / or shape of the target unplugging component in the slice file as the target unplugging hole positions.

[0085] In some embodiments, the processing module 203 is specifically configured to:

[0086] Restore the three-dimensional data file of the target unplugging component according to the slice file, and identify the three-dimensional model surface information of the target unplugging hole positions according to the three-dimensional data file;

[0087] For the three-dimensional data file, perform a displacement operation on the three-dimensional model surface information according to the target compensation amount to obtain the target data file; the target compensation amount satisfies: Comp = S * k + β, where Comp is the target compensation amount, S is the design size of the target unplugging hole position, k is the slope determined by the fitting relationship, and β is the intercept determined by the fitting relationship.

[0088] In some embodiments, the processing module 203 is specifically configured to:

[0089] Extract the edges of the vector graphics in the slice file;

[0090] For the slice file, perform a displacement operation on the edges of the vector graphics according to the target compensation amount; the target compensation amount satisfies: Comp = S * k + β, where Comp is the target compensation amount, S is the design size of the target unplugging hole position, k is the slope determined by the fitting relationship, and β is the intercept determined by the fitting relationship;

[0091] Generate the target data file according to the slice file after the displacement operation.

[0092] In some embodiments, the processing module 203 is specifically configured to:

[0093] Convert the slice file into a pixel image, and extract the target pixel points in the pixel image, where the target pixel points refer to some pixel points inside or outside the contour of the corresponding target pattern;

[0094] Modify all the target pixel points according to the target compensation amount to realize the movement of the pattern contour; the target compensation amount satisfies: Comp = S * k + β, where Comp is the target compensation amount, S is the design size of the target unplugging hole position, k is the slope determined by the fitting relationship, and β is the intercept determined by the fitting relationship;

[0095] Generate the target data file according to all the modified target pixel points.

[0096] In some embodiments, it further includes a printing module 204, which is used for:

[0097] Print the target data file using the same printing material as the plurality of sample components to obtain the target pluggable component.

[0098] Further, as Figure 3 , an exemplary embodiment of the present application further provides an electronic device, including one or more memories 301 and one or more processors 302. One or more memories 301 are coupled to and store instructions on one or more processors 302, and the instructions can be executed by one or more processors 302 alone or jointly, so that the electronic device executes the method according to any one of the first aspect.

[0099] It should be understood that the processor mentioned in the embodiments of the present application may be a CPU, or may also be other general-purpose processors, DSPs, ASICs, FPGAs or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. The general-purpose processor may be a microprocessor or the processor may also be any conventional processor, etc.

[0100] It should also be understood that the memory mentioned in the embodiments of the present application may be a volatile memory or a non-volatile memory, or may include both volatile and non-volatile memories. Among them, the non-volatile memory may be a read-only memory (ROM), a programmable read-only memory, an erasable programmable read-only memory, an electrically erasable programmable read-only memory or a flash memory. The volatile memory may be a random access memory (RAM), which is used as an external cache. By way of example but not limitation, many forms of RAM are available, such as static random access memory, dynamic random access memory, synchronous dynamic random access memory, double data rate synchronous dynamic random access memory, enhanced synchronous dynamic random access memory, synchronous link dynamic random access memory and direct memory bus random access memory.

[0101] The present application also provides a non-transitory computer-readable storage medium storing machine-executable instructions, and the machine-executable instructions can be executed by one or more processors of the machine. The machine may include the above-mentioned electronic device, etc. When the machine-executable instructions are executed by one or more processors, the machine executes any of the methods mentioned above.

[0102] A computer-readable storage medium may contain a propagated data signal with computer program code embodied therein, for example, on a baseband or as part of a carrier wave. The propagated signal may take various forms, including electromagnetic forms, optical forms, etc., or a suitable combination thereof. The computer-readable storage medium may be connected to an instruction execution system, apparatus, or device to effect communication, propagation, or transmission for use of the program. The program code located on the computer-readable storage medium may be propagated through any appropriate medium, including radio, cable, fiber optic cable, radio frequency signal, or similar media, or any combination of the foregoing media.

[0103] The basic concepts have been described above. Obviously, for those skilled in the art, the above invention disclosure is only an example and does not constitute a limitation to this application. Although not explicitly stated here, those skilled in the art may make various modifications, improvements, and corrections to this application. Such modifications, improvements, and corrections are proposed in this application, so such modifications, improvements, and corrections still fall within the spirit and scope of the exemplary embodiments of this application.

[0104] Meanwhile, this application uses specific terms to describe the embodiments of this application. Such as "an embodiment", "one embodiment", and / or "some embodiments" mean a certain feature, structure, or characteristic related to at least one embodiment of this application. Therefore, it should be emphasized and noted that the "one embodiment" or "an embodiment" or "an alternative embodiment" mentioned twice or more at different positions in this specification does not necessarily refer to the same embodiment. In addition, certain features, structures, or characteristics in one or more embodiments of this application may be appropriately combined.

[0105] Some aspects of this application may be executed entirely by hardware, entirely by software (including firmware, resident software, microcode, etc.), or by a combination of hardware and software. The above hardware or software may be referred to as "block", "module", "engine", "unit", "component", or "system". The processor may be one or more application specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DAPDs), programmable logic devices (PLDs), field programmable gate arrays (FPGAs), processors, controllers, microcontrollers, microprocessors, or combinations thereof. In addition, aspects of this application may be embodied as a computer product located on one or more computer-readable media, which includes computer-readable program code. For example, the computer-readable media may include, but is not limited to, magnetic storage devices (such as hard disks, floppy disks, magnetic tapes...), optical disks (such as compact disk CDs, digital versatile disks DVDs...), smart cards, and flash memory devices (such as cards, sticks, key drives...).

[0106] A computer-readable medium may include a propagated data signal having computer program code embodied therein, for example, on a baseband or as part of a carrier wave. The propagated signal may take many forms, including electromagnetic, optical, and the like, or any suitable combination thereof. The computer-readable medium may be any computer-readable medium other than a computer-readable storage medium that can communicate, propagate, or transport a program for use by an instruction execution system, apparatus, or device. The program code located on the computer-readable medium may be propagated via any suitable medium, including radio, cable, fiber optic cable, RF signals, or similar media, or any combination of the foregoing media.

[0107] Similarly, it should be noted that, for the sake of simplicity in the presentation of the disclosure of the present application and to assist in the understanding of one or more embodiments of the invention, in the foregoing description of the embodiments of the present application, various features are sometimes grouped together in one embodiment, drawing, or description thereof. However, this method of disclosure does not imply that the features required by the subject matter of the present application are more than those recited in the claims. In fact, the features of the embodiments are fewer than all the features of the individual embodiments disclosed above.

[0108] In some embodiments, numbers are used to describe components and attribute quantities. It should be understood that such numbers used in the description of the embodiments are modified by the modifiers "about", "approximately", or "substantially" in some examples. Unless otherwise stated, "about", "approximately", or "substantially" indicates that the recited number allows a variation of ±20%. Accordingly, in some embodiments, the numerical parameters used in the specification and claims are approximate values, and such approximate values may vary according to the characteristics required by individual embodiments. In some embodiments, the numerical parameters should take into account the specified significant digits and use the method of retaining the general number of digits. Although the numerical ranges and parameters used to define the scope of the present application in some embodiments are approximate values, in specific embodiments, such numerical settings are as precise as possible within the feasible range.

[0109] Although the present application has been described with reference to the current specific embodiments, those of ordinary skill in the art in the technical field of the present application should recognize that the above embodiments are only used to illustrate the present application, and various equivalent changes or substitutions can be made without departing from the spirit of the present application. Therefore, as long as the changes and modifications to the above embodiments are within the scope of the spirit of the present application, they will fall within the scope of the claims of the present application.

Claims

1. A method for preparing a plug-in assembly, characterized in that: include: Constructing a fitting relationship according to a plurality of dimension measurement data sets of sample components, wherein each sample component is composed of a plug-in plug entity and a plug-in hole entity, the dimension measurement data set includes: a dimension deviation between a measured dimension of the plug-in plug entity in each sample component and a measured dimension of a corresponding plug-in hole entity, and the fitting relationship is a linear relationship between the dimension deviation and a design dimension of the corresponding plug-in hole entity; Selecting a target plug-in plug-in, and identifying a corresponding target plug-in hole position in a slice file of the target plug-in plug-in component according to the characteristics of the target plug-in plug-in; A target compensation amount is calculated according to the fitting relationship, and a target data file for printing the target plug-in / unplug component is generated according to the target compensation amount and the slice file.

2. The method according to claim 1, characterized in that The fitting relationship is: Deviation(i)=Size(i)*k+β Wherein, Deviation(i) represents the dimensional deviation between the measured dimension of the i-th plug-in hole entity and the measured dimension of its corresponding plug-in entity, Size(i) represents the design dimension of the i-th plug-in hole entity, k represents the slope, β represents the intercept, and i represents the number of the sample component.

3. The method according to claim 1, characterized in that The step of identifying a corresponding target plug-in hole position in a slice file of the target plug-in component according to the characteristics of the target plug-in component comprises: A plug hole position that matches the size and / or shape of the target plug hole is identified in the slice file as the target plug hole position.

4. The method according to any one of claims 1 to 3, characterized in that: The step of generating a target data file for printing the target plug-in component according to the target compensation amount and the slice file includes: Restoring a three-dimensional data file of the target plug-in component according to the slice file, and identifying three-dimensional model surface information of the target plug-in hole according to the three-dimensional data file; For the three-dimensional data file, a displacement operation is performed on the surface information of the three-dimensional model according to a target compensation amount to obtain the target data file; the target compensation amount satisfies: Comp=S*k+β, where Comp is the target compensation amount, S is the design size of the target plug-in hole position, k is the slope determined by the fitting relationship, and β is the intercept determined by the fitting relationship.

5. The method according to any one of claims 1 to 3, characterized in that: The step of generating a target data file for printing the target plug-in component according to the target compensation amount and the slice file includes: Extracting the edge of the vector graphics in the slice file; For the slice file, a displacement operation is performed on the edge of the vector graphic according to a target compensation amount; the target compensation amount satisfies: Comp=S*k+β, where Comp is the target compensation amount, S is the design size of the target plug-in jack, k is the slope determined by the fitting relationship, and β is the intercept determined by the fitting relationship; The target data file is generated according to the slice file after the displacement operation.

6. The method according to any one of claims 1 to 3, characterized in that: The step of generating a target data file for printing the target plug-in component according to the target compensation amount and the slice file includes: Converting the slice file into a pixel image, and extracting target pixel points in the pixel image, wherein the target pixel points refer to some pixel points inside or outside the outline of the corresponding target pattern; All target pixel points are modified according to the target compensation amount to realize the movement of the pattern contour; the target compensation amount satisfies: Comp=S*k+β, Comp is the target compensation amount, S is the design size of the target plug-in jack, k is the slope determined by the fitting relationship, and β is the intercept determined by the fitting relationship; The target data file is generated according to all the modified target pixels.

7. The method according to claim 1, characterized in that Also includes: The target data file is printed using the same printing material as the plurality of sample components to obtain the target pluggable component.

8. A device for preparing a plug-in assembly, characterized in that: include: A fitting module, for constructing a fitting relationship according to a plurality of dimension measurement data sets of sample components, wherein each sample component is composed of a plug-in plug entity and a plug-in hole entity, the dimension measurement data set comprising: a dimension deviation between a measured dimension of the plug-in plug entity in each sample component and a measured dimension of a corresponding plug-in hole entity, and the fitting relationship is a linear relationship between the dimension deviation and a design dimension of the corresponding plug-in hole entity; An identification module, used for selecting a target plug-in and identifying a corresponding target plug-in hole position in a slice file of the target plug-in component according to the characteristics of the target plug-in; A processing module is used to calculate a target compensation amount according to the fitting relationship, and to generate a target data file for printing the target plug-in component according to the target compensation amount and the slice file.

9. An electronic device, characterized in that: include: one or more processors; as well as, One or more memories coupled to the one or more processors and storing instructions thereon, which, when the instructions are executed individually or collectively by the one or more processors, cause the electronic device to perform a method according to any one of claims 1-7.

10. A non-transitory computer-readable storage medium storing machine-executable instructions, which, when executed by one or more processors of a machine, cause the machine to perform the method of any one of claims 1-7.

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