Method for detecting foreign matter in a semiconductor workpiece storage device to be cleaned and cleaning equipment

Abstract

The present application relates to a method and cleaning equipment for detecting foreign matter in a semiconductor workpiece storage device to be cleaned. The method comprises obtaining label information of the semiconductor workpiece storage device; obtaining the current weight value of the semiconductor workpiece storage device; retrieving a reference weight value of the semiconductor workpiece storage device associated with the label information from a database; triggering a first detection instruction if the reference weight value does not exist in the database; otherwise, comparing the current weight value with the reference weight value; triggering a first detection instruction when the difference between the current weight value and the reference weight value exceeds a preset threshold, wherein the first detection instruction is to perform a separation action between the box body and the cover body of the semiconductor workpiece storage device and to detect whether there are foreign matter inside the box body; and completing the detection when the difference between the current weight value and the reference weight value is within the preset threshold. This detection method can ensure both the accuracy and efficiency of detection.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a method for detecting foreign matter in a semiconductor workpiece storage device to be cleaned and a cleaning device. Background Art

[0002] During the semiconductor wafer manufacturing process, wafers are stored in FOUPs (Front Opening Unified Pods) and transferred between different process equipment. After undergoing various processes, especially wet chemical processes, contaminants may adhere to the wafer surface. When stored inside the FOUP, these contaminants can contaminate the FOUP, potentially contaminating the next batch of wafers. Therefore, FOUPs are regularly cleaned in specialized equipment to ensure their cleanliness.

[0003] In fact, there are cases where there are residual wafers in the FOUP that is sent to the fully automatic cleaning machine for cleaning. The wafers or wafer fragments remaining in the FOUP will not only damage the fully automatic cleaning machine, but the remaining wafers will also be damaged, causing great losses to the wafer processing plant.

[0004] Therefore, it is necessary to confirm whether there are any wafers remaining in the FOUP before cleaning the FOUP.

[0005] However, the current FOUP inspection process is cumbersome and inefficient, affecting the cleaning efficiency of the entire cleaning equipment. Summary of the Invention

[0006] In view of this, embodiments of the present application provide a method for detecting foreign matter in a semiconductor workpiece storage device to be cleaned and a cleaning device to solve at least one problem existing in the background technology.

[0007] In a first aspect, an embodiment of the present application provides a method for detecting foreign matter in a semiconductor workpiece storage device to be cleaned, the method comprising:

[0008] obtaining label information of a semiconductor workpiece storage device;

[0009] obtaining a current weight value of the semiconductor workpiece storage device;

[0010] Retrieving from a database a reference weight value of the semiconductor workpiece storage device associated with the tag information;

[0011] If the reference weight value does not exist in the database, triggering a first detection instruction, otherwise, comparing the current weight value with the reference weight value;

[0012] When the difference between the current weight value and the reference weight value exceeds a preset threshold, triggering the first detection instruction, wherein the first detection instruction is to separate the box body and the cover body of the semiconductor workpiece storage device and to detect whether there is any foreign matter inside the box body;

[0013] When the difference between the current weight value and the reference weight value is within the preset threshold range, the detection is completed.

[0014] In conjunction with the first aspect of the present application, in an optional embodiment, the semiconductor workpiece storage device is cleaned using a cleaning device;

[0015] The triggering of the first detection instruction includes:

[0016] placing the semiconductor workpiece storage device to be cleaned at a loading station of a loading unit of the cleaning equipment;

[0017] moving the semiconductor workpiece storage device located at the loading station to the inspection station of the loading unit;

[0018] Unlocking the semiconductor workpiece storage device by using an unlocking mechanism to separate the box body and the cover body, wherein the semiconductor workpiece storage device comprises a box body and a cover body, and the cover body is detachably connected to the box body;

[0019] The interior of the box body is inspected for foreign matter using a detection component, where the foreign matter includes wafers and / or wafer fragments.

[0020] In conjunction with the first aspect of the present application, in an optional embodiment, the detection method further includes:

[0021] In response to the first detection instruction, a detection component is used to confirm whether there is foreign matter inside the semiconductor workpiece storage device, and the detection component includes a visual detection device and a photoelectric detection device.

[0022] In conjunction with the first aspect of the present application, in an optional embodiment, the detection method further includes:

[0023] If the detection result of the detection component is qualified or the difference between the current weight value and the reference weight value is within the preset threshold value, the semiconductor workpiece storage device is transferred to a buffer station of the loading unit or to a cleaning unit of the cleaning equipment for cleaning, wherein the buffer station is located inside the cleaning equipment;

[0024] If the detection result of the detection component is unqualified, the semiconductor workpiece storage device is returned to the loading station, and the loading station is located outside the cleaning equipment.

[0025] In combination with the first aspect of the present application, in an optional embodiment, when the difference between the current weight value and the reference weight value exceeds a preset threshold and the foreign matter detection result is qualified, the reference weight value of the semiconductor workpiece storage device stored in the database is updated based on the current weight value and electronically marked.

[0026] In conjunction with the first aspect of the present application, in an optional embodiment, the detection method further includes:

[0027] Each acquired current weight value of the semiconductor workpiece storage device is recorded to correct the preset threshold.

[0028] In conjunction with the first aspect of the present application, in an optional embodiment, the detection method further includes:

[0029] The semiconductor workpiece storage device is transferred between the loading station and the inspection station by using a slide rail assembly.

[0030] In combination with the first aspect of the present application, in an optional implementation, if the foreign matter detection result is qualified, the reference weight value of the semiconductor workpiece storage device stored in the database is updated based on the current weight value.

[0031] In combination with the first aspect of the present application, in an optional embodiment, the preset threshold is set based on a first parameter of the semiconductor workpiece storage device and a second parameter of the wafer held by the semiconductor workpiece storage device, the first parameter including the type, material, and thickness of the semiconductor workpiece storage device, and the second parameter including the type, material, and thickness of the wafer.

[0032] In a second aspect, an embodiment of the present application provides a device for cleaning foreign matter in a semiconductor workpiece storage device, the cleaning device comprising:

[0033] a first acquiring unit, configured to acquire label information of the semiconductor workpiece storage device;

[0034] a second acquiring unit, configured to acquire a current weight value of the semiconductor workpiece storage device;

[0035] a control unit, configured to retrieve a reference weight value of the semiconductor workpiece storage device associated with the tag information from a database, and to trigger a first detection instruction when the reference weight value does not exist in the database, and otherwise compare the current weight value with the reference weight value;

[0036] A detection unit is used to trigger the first detection instruction when the difference between the current weight value and the reference weight value exceeds a preset threshold value, and the first detection instruction is to detect whether there is foreign matter in the semiconductor workpiece storage device; when the difference between the current weight value and the reference weight value is within the preset threshold value range, the detection is completed.

[0037] An embodiment of the present application provides a method for detecting foreign matter in a semiconductor workpiece storage device to be cleaned. The detection method compares the current weight value of the semiconductor workpiece storage device obtained with a reference weight value stored in a database. When the reference weight value does not exist in the database or the difference between the current weight value and the reference weight value exceeds a threshold range, a first detection instruction is triggered. The first detection instruction executes the separation action of the box body and the cover body of the semiconductor workpiece storage device and detects whether there is foreign matter inside the box body; and when the difference between the current weight value and the reference weight value is within a preset threshold range, the detection is completed. During the detection process, the detection method first performs detection in a weighing detection mode. When an abnormality occurs in the weighing detection mode, the cover opening detection is performed. The detection method can ensure both the accuracy and efficiency of the detection.

[0038] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0040] Figure 1 A schematic structural diagram of a cleaning device for a semiconductor workpiece storage device provided in an embodiment of the present application;

[0041] Figure 2 A top view of the overall structure of a cleaning device for a semiconductor workpiece storage device provided in an embodiment of the present application;

[0042] Figure 3 A schematic structural diagram of a semiconductor workpiece storage device and an unlocking mechanism in a cleaning device for a semiconductor workpiece storage device provided in an embodiment of the present application;

[0043] Figure 4 A schematic diagram of the overall process of a method for detecting foreign matter in a semiconductor workpiece storage device to be cleaned provided in an embodiment of the present application;

[0044] Figure 5 A logical diagram of a method for detecting foreign matter in a semiconductor workpiece storage device to be cleaned provided in an embodiment of the present application;

[0045] Figure 6 This is a module diagram of a device for detecting foreign matter in a semiconductor workpiece storage device to be cleaned provided in an embodiment of the present application.

[0046] Reference numerals:

[0047] 100. Cleaning equipment;

[0048] 10. Frame;

[0049] 20. Loading unit; 210. Loading station; 220. Inspection station; 230. Slide rail assembly;

[0050] 30. Cleaning unit;

[0051] 40. Semiconductor workpiece storage device; 410. Cover; 420. Box;

[0052] 50. Unlocking mechanism. DETAILED DESCRIPTION

[0053] To make the technical solutions and beneficial effects of the present invention more clearly understood, the following detailed description is given by way of specific embodiments. The accompanying drawings are not necessarily drawn to scale, and local features may be enlarged or reduced to more clearly illustrate the details of the local features. Unless otherwise defined, the technical and scientific terms used herein have the same meanings as those in the technical field to which this application belongs.

[0054] In the description of the present invention, the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "height", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like to indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of simplifying the description of the present invention, and do not indicate that the device or element referred to must have a specific direction, be constructed and operate in a specific direction, and should not be understood as a limitation to the present invention.

[0055] In this disclosure, the terms "first" and "second" are used solely for descriptive purposes and should not be construed as indicating the relative importance of the features indicated or the number of technical features indicated. Therefore, a feature specified as "first" or "second" may explicitly include at least one such feature. In the description of this disclosure, "plurality" means at least two, such as two or three, and "several" means at least one, such as one, two, or three, unless otherwise specifically defined.

[0056] In the present invention, unless otherwise expressly defined, the terms "installed," "connected," "connect," "fixed," and "disposed" should be understood broadly. For example, "connection" can mean fixed, removable, or integrated; it can mean mechanical or electrical; it can mean direct or indirect connection through an intermediary; it can also mean internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of these terms in the present invention based on specific circumstances.

[0057] In the present invention, unless otherwise clearly defined, when a first feature is “on,” “above,” “above,” “above,” “below,” “below,” or “below” a second feature, the first feature and the second feature may be in direct contact, or the first feature and the second feature may be in indirect contact via an intermediate medium. Moreover, when a first feature is “on,” “above,” or “above” a second feature, it may mean that the first feature is directly above or obliquely above the second feature, or simply means that the horizontal height of the first feature is higher than the horizontal height of the second feature. When a first feature is “below,” “below,” or “below” a second feature, it may mean that the first feature is directly below or obliquely below the second feature, or simply means that the horizontal height of the first feature is lower than the horizontal height of the second feature.

[0058] In some embodiments, the semiconductor workpiece storage device can be a FOUP (front-opening wafer transfer box), a FOSB (Front Opening Shipping Box), a mask box for storing masks, etc., and of course it can also be a storage box for other purposes. The embodiments of the present application do not specifically limit the specific structural style or type of the semiconductor workpiece storage device to be cleaned.

[0059] Please refer to Figures 1 to 3 An embodiment of the present application provides a cleaning device 100 for a semiconductor workpiece storage device, which includes a frame 10, a loading unit 20, a weighing component (not shown in the figure), a cleaning unit 30 and a detection component (not shown in the figure).

[0060] The frame 10 provides the cleaning apparatus 100 with an enclosed processing space, and the cleanliness level of the space inside the frame 10 is significantly greater than the cleanliness level of the space outside the frame 10. The cleaning unit 30 is located within the frame 10 and is used to clean the semiconductor workpiece storage device 40. The detection assembly is used to detect foreign matter in the semiconductor workpiece storage device 40, including wafers and / or wafer fragments.

[0061] The loading unit 20 is provided with a loading station 210, an inspection station 220 and a cache station (not shown in the figure). The loading station 210 is a station area for loading the semiconductor workpiece storage device 40 to be cleaned; the inspection station 220 is a station area for performing foreign matter detection on the semiconductor workpiece storage device 40; the cache station is a station area that can receive the semiconductor workpiece storage device 40 after passing the foreign matter detection, so as to facilitate subsequent delivery to the cleaning unit 30 for cleaning.

[0062] The loading unit 20 further includes a slide rail assembly 230 , and the semiconductor workpiece storage device 40 utilizes the slide rail assembly 230 to achieve transfer between the loading station 210 , the inspection station 220 , and the buffer station.

[0063] The weighing assembly is used to weigh the semiconductor workpiece storage device 40 to obtain its current weight. The weighing assembly can be located at the loading station 210. When the semiconductor workpiece storage device 40 is located at the loading station 210, the current weight of the semiconductor workpiece storage device 40 can be obtained. Of course, the weighing assembly can also be located at other stations, and this embodiment of the application is not limited thereto. The weighing assembly can be a strain gauge sensor, an electromagnetic force balance sensor, or a piezoelectric sensor, and the embodiment of the application is not specifically limited thereto.

[0064] The semiconductor workpiece storage device 40 includes a box body 420 and a cover 410. The cover 410 is detachably connected to the box body 420, and the box body 420 and the cover 410 can be unlocked or locked. The cover 410 and the box body 420 are locked or unlocked using the knob assembly of the unlocking mechanism 50. That is, the knob assembly can achieve a sealed connection between the cover 410 and the box body 420, and can also achieve separation of the cover 410 and the box body 420. Specifically, when the semiconductor workpiece storage device 40 needs to be inspected for foreign objects, the knob assembly of the unlocking mechanism 50 is used to unlock the cover 410 and separate the cover 410 from the box body 420. After the inspection is completed, the knob assembly of the unlocking mechanism 50 is used to lock the cover 410 to the box body 420.

[0065] The detection component is arranged inside the frame 10 to better ensure its own cleanliness. The detection component can use an image capture or scanning device such as a camera. In an optional embodiment, the detection component can use a laser scanning device. In an optional embodiment, the laser scanning device uses a beam-type laser scanning device to detect foreign objects. The transmitting and receiving parts can be installed relative to each other. When the substrate or wafer blocks the light, the output signal is immediately triggered. At the same time, combined with the servo-matched encoder, the thickness of the substrate or wafer can also be accurately calculated. Due to its small size, the small and bright light spot is easy to align, the response time is relatively fast (exemplarily 0.25ms), and it has strong detection accuracy and reliability. In some embodiments, the laser scanning device uses a reflective laser scanning device to detect foreign objects, which also requires a very small light spot laser diffuse reflection technology, combined with a fast response time, to ensure accurate counting and abnormality judgment of substrates or wafers.

[0066] In addition, the scanning device is not limited to a laser scanning device, and can also be a high-frequency light wave scanning device, a radar wave scanning device, etc.

[0067] In some embodiments, after obtaining a scanned image through foreign object detection scanning using the detection component of a camera, the scanned image is also identified and judged, so that it is possible to intuitively determine whether there are foreign objects in the semiconductor workpiece storage device 40, improve the accuracy of the identification and judgment results, and accurately determine the specific location of the foreign object.

[0068] According to the related technology, before cleaning the semiconductor workpiece storage device 40, it is necessary to determine whether there are any wafers or wafer fragments remaining inside it. In order to improve the production capacity of the semiconductor workpiece storage device 40, it is generally detected by weighing. However, this detection method requires setting a fixed qualified value, and there are large differences between different semiconductor workpiece storage devices 40, so it is easy to miss detection or make a wrong detection.

[0069] Furthermore, with the advancement of process technology, wafer costs have increased, and the losses caused by missed inspections have also increased. Therefore, missed inspections must be avoided. During actual use of the semiconductor workpiece storage device 40, semiconductor wafer processing plants or semiconductor chip manufacturing plants may perform certain modifications to the semiconductor workpiece storage device 40. When the semiconductor workpiece storage device 40 becomes damaged, components of the semiconductor workpiece storage device 40 (e.g., handles, lid 410, etc.) may need to be replaced, which can cause the weight of the semiconductor workpiece storage device 40 to change. Therefore, if a fixed acceptable weight value is set, the accuracy of traditional weighing tests will be significantly reduced, making them unsuitable. Furthermore, opening the lid of the semiconductor workpiece storage device for inspection consumes a significant amount of time, reducing the efficiency of cleaning equipment.

[0070] Based on this, an embodiment of the present application provides a method for detecting foreign matter in a semiconductor workpiece storage device to be cleaned. The detection method compares the current weight value of the semiconductor workpiece storage device obtained with the reference weight value stored in a database. When the reference weight value does not exist in the database or the difference between the current weight value and the reference weight value exceeds the threshold range, the first detection instruction is triggered, that is, the separation action of the box body and the cover body of the semiconductor workpiece storage device is executed and the interior thereof is detected to determine whether there is foreign matter; and when the difference between the current weight value and the reference weight value is within the preset threshold range, the detection is completed; during the detection process, the detection method first performs detection by weighing, and when the weighing detection method is abnormal, the cover opening detection is performed. The detection method can ensure both the accuracy and efficiency of the detection.

[0071] Specifically, please refer to Figure 4 and Figure 5 The present invention provides a method for detecting foreign matter in a semiconductor workpiece storage device to be cleaned, including the following steps:

[0072] S1. Obtain label information of a semiconductor workpiece storage device.

[0073] Each semiconductor workpiece storage device has its own unique label. This label not only contains information such as the brand, model, type, and weight of the device, but also contains information about the wafers, such as wafer type, batch number, and process route. The label information is a QR code printed on the surface of the device, but it is not limited to this.

[0074] Label information not only enables seamless connection between semiconductor workpiece storage devices and equipment during transportation, but also enables quality traceability and batch management, as well as logistics optimization and inventory management.

[0075] S2. Obtain the current weight value of the semiconductor workpiece storage device.

[0076] S3. Retrieve from a database a reference weight value of the semiconductor workpiece storage device associated with the tag information.

[0077] S4. If the reference weight value does not exist in the database, trigger the first detection instruction; otherwise, compare the current weight value with the reference weight value.

[0078] S5. When the difference between the current weight value and the reference weight value exceeds a preset threshold, a first detection instruction is triggered. The first detection instruction is to separate the box body and the cover body of the semiconductor workpiece storage device and to detect whether there is any foreign matter inside the box body.

[0079] S6. When the difference between the current weight value and the reference weight value is within the preset threshold range, the detection is completed.

[0080] The above detection method first uses a weighing detection method to obtain the current weight value of the semiconductor workpiece storage device. Then, based on the label information of the semiconductor workpiece storage device, it obtains the reference weight value of the semiconductor workpiece storage device stored in a database. When the difference between the current weight value of the semiconductor workpiece storage device and the reference weight value is within a preset threshold range, the detection is completed, which can greatly improve detection efficiency. If the reference weight value does not exist in the database or the difference between the current weight value of the semiconductor workpiece storage device and the reference weight value exceeds the preset threshold, the cover opening detection is performed. That is, the box body and cover of the semiconductor workpiece storage device are separated and the interior is checked for foreign objects to ensure detection accuracy.

[0081] In addition, by establishing a database, a mapping relationship is established between the label information of each semiconductor workpiece storage device and its weight information when empty. In the actual judgment process, different judgment criteria are determined based on the different situations of each semiconductor workpiece storage device. This can greatly reduce the situation where different types of semiconductor workpiece storage devices have reduced accuracy due to sharing a judgment criterion.

[0082] By establishing a database, the current weight value of the semiconductor workpiece storage device is compared with the reference weight value stored in the database. When the difference between the two exceeds a preset threshold, it can be determined that there is an abnormality in the semiconductor workpiece storage device. Then, through the cover opening detection, it can be further determined whether the abnormality is caused by the presence of foreign matter in the semiconductor workpiece storage device or the change in the weight of the semiconductor workpiece storage device itself. Compared with the traditional weighing detection method, the minimum value of the preset threshold in this detection method can be zero, which can greatly improve the accuracy of weighing detection.

[0083] It should be noted that cleaning equipment can complete weighing inspections of semiconductor workpiece storage devices in a very short time (e.g., 2 seconds). This weighing inspection method is far more efficient than cleaning equipment performing lid-opening inspections of semiconductor workpiece storage devices. In the actual processing of semiconductor workpiece storage devices, the vast majority of semiconductor workpiece storage devices are free of foreign matter, with the number of semiconductor workpiece storage devices containing foreign matter accounting for less than 1% of the total number. Therefore, the vast majority of semiconductor workpiece storage devices do not require lid-opening inspections during the inspection process, significantly improving inspection efficiency.

[0084] In an optional embodiment, in step S4, when the semiconductor workpiece storage device is cleaned for the first time, since its weight information is not recorded in the database, it is necessary to perform a cover opening detection on the semiconductor workpiece storage device.

[0085] In an optional embodiment, the detection method further includes recording the current weight value of each acquired semiconductor workpiece storage device to correct the preset thresholds in step S5 and step S6.

[0086] It can be understood that the role of the preset threshold is to provide a certain tolerance for the weight information of the semiconductor workpiece storage device, thereby avoiding misjudgment caused by factors such as wear of the semiconductor workpiece storage device and sensor errors. By analyzing historical data to optimize the preset threshold, the accuracy of detection can be improved.

[0087] In an optional embodiment, the preset thresholds in steps S5 and S6 are set based on a first parameter of the semiconductor workpiece storage device and a second parameter of the wafers held by the semiconductor workpiece storage device. The first parameter includes the type and material of the semiconductor storage device, and the second parameter includes the type, material, and thickness of the wafers. The type and material of the semiconductor workpiece storage device determine its weight, and the type, material, and thickness of the wafers also determine their weight. When wafers remain in the semiconductor workpiece storage device, the current weight of the semiconductor workpiece storage device is determined by both its empty weight and the weight of the remaining wafers. To improve detection accuracy, different preset thresholds are used for different types of semiconductor workpiece storage devices.

[0088] In an optional embodiment, in step S4 and step S5, triggering the first detection instruction includes:

[0089] S41 , placing the semiconductor workpiece storage device to be cleaned at a loading station of a loading unit of the cleaning equipment.

[0090] S42: Move the semiconductor workpiece storage device located at the loading station to the inspection station of the loading unit.

[0091] S43: unlocking by using an unlocking mechanism to separate the box body and the cover body of the semiconductor workpiece storage device.

[0092] S44: Detect foreign matter inside the box body using a detection component, where the foreign matter includes wafers and / or wafer fragments.

[0093] In an embodiment of the present application, when the reference weight value of the semiconductor workpiece storage device does not exist in the database, or the difference between the current weight value of the semiconductor workpiece storage device and the reference weight value exceeds a preset threshold, the first detection instruction is triggered to perform a cover opening detection to further confirm whether there is foreign matter in the semiconductor workpiece storage device and improve the detection accuracy.

[0094] In an optional embodiment, in response to the first detection instruction, a detection component is used to confirm whether there is foreign matter inside the semiconductor workpiece storage device, and the detection component includes a visual detection device and a photoelectric detection device.

[0095] The visual detection device and the photoelectric detection device detect whether there are foreign objects inside the semiconductor workpiece storage device, which can greatly improve the detection accuracy.

[0096] In an optional embodiment, the detection method further includes:

[0097] If the inspection result of the inspection component is qualified or the difference between the current weight value and the reference weight value is within the preset threshold range, the semiconductor workpiece storage device is moved to the cache station of the loading unit or to the cleaning unit of the cleaning equipment for cleaning, and the cache station is located inside the cleaning equipment.

[0098] Confirm whether the cleaning unit of the cleaning equipment is idle. If the cleaning unit is idle, the semiconductor workpiece storage device that has passed the inspection will be moved to the cleaning unit for cleaning. When the cleaning unit is in working condition, the semiconductor workpiece storage device that has passed the inspection will be moved to the cache station, waiting for the cleaning unit to complete the cleaning operation, so as not to affect the subsequent inspection of the semiconductor workpiece storage device, thereby improving the inspection efficiency of the inspection process; in addition, the cache station is located inside the cleaning equipment, which can improve the flexibility of scheduling and transportation.

[0099] If the inspection result of the inspection component is unqualified, the semiconductor workpiece storage device is returned to the loading station, which is located outside the cleaning equipment.

[0100] The semiconductor workpiece storage device with an unqualified detection result is returned to the loading station located outside the cleaning equipment, so as to transfer the unqualified semiconductor workpiece storage device to the next process or the next station.

[0101] In an optional embodiment, if the foreign matter detection result is qualified, the reference weight value of the semiconductor workpiece storage device stored in the database is updated based on the current weight value.

[0102] It can be understood that when the difference between the current weight value and the reference weight value exceeds a preset threshold, a first detection instruction is triggered. The first detection instruction is to separate the cover and box body of the semiconductor workpiece storage device and perform a foreign object detection on the interior of the box body. If the foreign object detection result is qualified, the reference weight value of the semiconductor workpiece storage device stored in the database is updated based on this detection result and the current weight value of the semiconductor workpiece storage device obtained in step S2. During the use of semiconductor workpiece storage devices, there may be changes in weight caused by modifications, maintenance, etc. Using this method to update the weight of the semiconductor workpiece storage device after determining that there are no foreign objects inside the semiconductor workpiece storage device can effectively avoid the misidentification of foreign objects in the semiconductor workpiece storage device due to such reasons.

[0103] It can also be understood that if there is no reference weight value in the database, that is, the semiconductor workpiece storage device has never been cleaned by the cleaning equipment, and therefore the database has not recorded its weight information, then the current weight value of the semiconductor workpiece storage device obtained in step S2 is added to the database and used as the reference weight value of the semiconductor workpiece storage device.

[0104] In an optional embodiment, when the difference between the current weight value and the reference weight value exceeds a preset threshold and the foreign matter detection result is qualified, the reference weight value of the semiconductor workpiece storage device stored in the database is updated based on the current weight value and electronically marked.

[0105] Electronically marking semiconductor workpiece storage devices whose current weight differs from a reference weight by more than a preset threshold and whose foreign object detection result is acceptable can be understood as adding an abnormality annotation to such devices. This can alert maintenance personnel to promptly inspect the abnormal device and further identify the cause of the abnormality. For example, a change in weight due to component replacement or damage could occur.

[0106] In an optional embodiment, the inspection method further includes utilizing a slide rail assembly to transfer the semiconductor workpiece storage device between the loading station and the inspection station. The use of the slide rail assembly can improve the efficiency of transferring the semiconductor workpiece storage device between the loading station and the inspection station. Compared to the prior art method of utilizing a high-precision, high-speed manipulator to coordinate between different workstations, the slide rail assembly can reduce equipment failure rates and lower equipment costs.

[0107] The present application also provides a device for cleaning foreign matter in a semiconductor workpiece storage device. Figure 6 The cleaning device includes a first acquisition unit, a second acquisition unit, a control unit and a detection unit.

[0108] The first acquiring unit is used to acquire label information of the semiconductor workpiece storage device.

[0109] The second acquiring unit is used to acquire a current weight value of the semiconductor workpiece storage device.

[0110] The control unit is used to retrieve the reference information value of the semiconductor workpiece storage device associated with the tag information from the database, and to trigger the first detection instruction when the reference weight value does not exist in the database, otherwise, compare the current weight value with the reference weight value.

[0111] The detection unit is used to trigger a first detection instruction when the difference between the current weight value and the reference weight value exceeds a preset threshold value. The first detection instruction is to detect whether there is foreign matter in the semiconductor workpiece storage device; when the difference between the current weight value and the reference weight value is within the preset threshold value range, the detection is completed.

[0112] The present invention also provides a method for cleaning a semiconductor workpiece storage device, the method comprising the following steps:

[0113] The semiconductor workpiece storage device is inspected using the inspection method provided by any of the above embodiments.

[0114] When the inspection result of the semiconductor workpiece storage device is qualified, the semiconductor workpiece storage device is moved to a cleaning unit.

[0115] The semiconductor workpiece storage device is cleaned using a cleaning unit.

[0116] When the inspection result of the semiconductor workpiece storage device is unqualified, the semiconductor workpiece storage device is moved to a loading station of a loading unit, and then the loading station is moved to the outside of the frame.

[0117] The above cleaning method first detects whether there are foreign objects inside the semiconductor workpiece storage device before cleaning it. The semiconductor workpiece storage device with residual foreign objects can be picked out before cleaning the semiconductor workpiece storage device, thereby preventing the residual foreign objects in the semiconductor workpiece storage device from damaging the cleaning equipment. At the same time, the residual foreign objects will also be damaged, further avoiding losses to the wafer processing plant.

[0118] It should be understood that the above embodiments are exemplary and are not intended to include all possible implementation methods. Various modifications and changes may be made to the above embodiments without departing from the scope of the present disclosure. Similarly, the various technical features of the above embodiments may be arbitrarily combined to form other embodiments of the present application that may not be explicitly described. Therefore, the above embodiments merely express several implementation methods of the present application and do not limit the scope of protection of the patent application.

Claims

1. A method for detecting foreign matter in a semiconductor workpiece storage device to be cleaned, characterized in that: The detection method comprises: obtaining label information of a semiconductor workpiece storage device; obtaining a current weight value of the semiconductor workpiece storage device; Retrieving from a database a reference weight value of the semiconductor workpiece storage device associated with the tag information; If the reference weight value does not exist in the database, triggering a first detection instruction, otherwise, comparing the current weight value with the reference weight value; When the difference between the current weight value and the reference weight value exceeds a preset threshold, the first detection instruction is triggered, wherein the first detection instruction is to separate the box body and the cover body of the semiconductor workpiece storage device and to detect whether there is any foreign matter inside the box body; When the difference between the current weight value and the reference weight value is within the preset threshold range, the detection is completed.

2. The method for detecting foreign matter in a semiconductor workpiece storage device to be cleaned according to claim 1, wherein: Cleaning the semiconductor workpiece storage device using a cleaning device; The triggering of the first detection instruction includes: placing the semiconductor workpiece storage device to be cleaned at a loading station of a loading unit of the cleaning equipment; moving the semiconductor workpiece storage device located at the loading station to the inspection station of the loading unit; Unlocking the semiconductor workpiece storage device by using an unlocking mechanism to separate the box body and the cover body, wherein the semiconductor workpiece storage device comprises a box body and a cover body, and the cover body is detachably connected to the box body; The interior of the box body is inspected for foreign matter using a detection component, where the foreign matter includes wafers and / or wafer fragments.

3. The method for detecting foreign matter in a semiconductor workpiece storage device to be cleaned according to claim 2, wherein: The detection method further comprises: In response to the first detection instruction, a detection component is used to confirm whether there is foreign matter inside the semiconductor workpiece storage device, and the detection component includes a visual detection device and a photoelectric detection device.

4. The method for detecting foreign matter in a semiconductor workpiece storage device to be cleaned according to claim 3, wherein: The detection method further comprises: If the detection result of the detection component is qualified or the difference between the current weight value and the reference weight value is within the preset threshold value, the semiconductor workpiece storage device is transferred to a buffer station of the loading unit or to a cleaning unit of the cleaning equipment for cleaning, wherein the buffer station is located inside the cleaning equipment; If the detection result of the detection component is unqualified, the semiconductor workpiece storage device is returned to the loading station, and the loading station is located outside the cleaning equipment.

5. The method for detecting foreign matter in a semiconductor workpiece storage device to be cleaned according to claim 1, wherein: When the difference between the current weight value and the reference weight value exceeds a preset threshold and the detection result of the foreign matter is qualified, the reference weight value of the semiconductor workpiece storage device stored in the database is updated based on the current weight value and electronically marked.

6. The method for detecting foreign matter in a semiconductor workpiece storage device to be cleaned according to claim 1, wherein: The detection method further comprises: Each acquired current weight value of the semiconductor workpiece storage device is recorded to correct the preset threshold.

7. The method for detecting foreign matter in a semiconductor workpiece storage device to be cleaned according to claim 2, wherein: The detection method further comprises: The semiconductor workpiece storage device is transferred between the loading station and the inspection station by using a slide rail assembly.

8. The method for detecting foreign matter in a semiconductor workpiece storage device to be cleaned according to any one of claims 1 to 7, characterized in that: If the detection result of the foreign matter is qualified, the reference weight value of the semiconductor workpiece storage device stored in the database is updated based on the current weight value.

9. The method for detecting foreign matter in a semiconductor workpiece storage device to be cleaned according to any one of claims 1 to 7, characterized in that: The preset threshold is set based on a first parameter of the semiconductor workpiece storage device and a second parameter of the wafer held by the semiconductor workpiece storage device. The first parameter includes the type and material of the semiconductor workpiece storage device, and the second parameter includes the type, material, and thickness of the wafer.

10. A device for cleaning foreign matter in a semiconductor workpiece storage device, characterized in that: The cleaning equipment comprises: a first acquiring unit, configured to acquire label information of the semiconductor workpiece storage device; a second acquiring unit, configured to acquire a current weight value of the semiconductor workpiece storage device; a control unit, configured to retrieve a reference weight value of the semiconductor workpiece storage device associated with the tag information from a database, and to trigger a first detection instruction when the reference weight value does not exist in the database, and otherwise compare the current weight value with the reference weight value; A detection unit is used to trigger the first detection instruction when the difference between the current weight value and the reference weight value exceeds a preset threshold value, and the first detection instruction is to detect whether there is foreign matter in the semiconductor workpiece storage device; when the difference between the current weight value and the reference weight value is within the preset threshold value range, the detection is completed.

Images