Optical engine chip and photoelectric sealing module

Abstract

The embodiment of the invention provides an optical engine chip and a photoelectric sealing module, and relates to the technical field of communication, the optical engine chip comprises an optical signal processing module, a first optical splitter, a modulator and a coupling module, and the optical signal processing module comprises a semiconductor optical amplifier; the input end of the optical signal processing module is connected with the coupling module, the output end of the semiconductor optical amplifier is connected with the input end of the first optical splitter, each output end of the first optical splitter is connected with one modulator, and the output ends of the modulators are connected with the coupling module; the optical signal processing module improves the optical power of the received pump light through a semiconductor optical amplifier; the first optical splitter is used for splitting the received pump light into multiple paths of pump light and outputting the multiple paths of pump light through the output ends respectively; the modulator is used for modulating the electric signal to the pump light to form an optical signal. By applying the scheme provided by the embodiment of the invention, multi-channel optical signal transmission in the optical engine chip can be realized.

Description

Technical Field

[0001] This application relates to the field of communication technologies, and particularly to an optical engine chip and an optical-electrical co-packaged module. Background Art

[0002] Under the CPO (Co-packaged Optics or Co-packaging) architecture, the light source and the optical engine chip are separated from the original single optical module into two independent devices: the optical engine chip and the external light source. The external light source provides the light source for the optical engine chip through an optical fiber. The optical engine chip loads the electrical signal onto the light source through a modulator and outputs the signal light. With the continuous improvement of the rate and integration of CPO switches, many channels will be integrated in the optical engine chip. However, the optical power of the pump light input to each channel obtained after splitting the pump light input from the external light source will decrease, and thus may not meet the optical power requirements of each channel. Summary of the Invention

[0003] The purpose of the embodiments of this application is to provide an optical engine chip and an optical-electrical co-packaged module to achieve multi-channel optical signal transmission in the optical engine chip. The specific technical solutions are as follows:

[0004] In a first aspect, the embodiments of this application provide an optical engine chip, which includes an optical signal processing module, a first optical splitter, a modulator, and a coupling module. The optical signal processing module includes a semiconductor optical amplifier.

[0005] The input end of the optical signal processing module is connected to the coupling module. The output end of the semiconductor optical amplifier is connected to the input end of the first optical splitter. Each output end of the first optical splitter is connected to a modulator, and the output end of the modulator is connected to the coupling module.

[0006] The coupling module is used to receive the pump light input from the light source and output the optical signal modulated by the modulator.

[0007] The optical signal processing module increases the optical power of the received pump light through the semiconductor optical amplifier.

[0008] The first optical splitter is used to split the received pump light into multiple paths of pump light and output them respectively through each output end.

[0009] The modulator is used to modulate the electrical signal onto the pump light to form an optical signal.

[0010] In an embodiment of this application, the optical signal processing module only includes the semiconductor optical amplifier. The input end of the semiconductor optical amplifier is directly connected to the coupling module, and the number of output ends of the first optical splitter is the number of optical signals output by the optical engine chip.

[0011] In one embodiment of the present application, the optical signal processing module further includes a second optical splitter. The coupling module is connected to the input end of the second optical splitter, and each output end of the second optical splitter is respectively connected to the input end of a semiconductor optical amplifier;

[0012] Each output end of the semiconductor optical amplifier is connected to a first optical splitter;

[0013] The second optical splitter is configured to split the received pump light into multiple paths of pump light and output them through respective output ends;

[0014] The product of the number of output ends of the first optical splitter and the number of output ends of the second optical splitter is the number of optical signals output by the optical engine chip.

[0015] In one embodiment of the present application, the optical signal processing module includes a semiconductor optical amplifier. All output ends of the second optical splitter are connected to the input end of the semiconductor optical amplifier, and each output end of the semiconductor optical amplifier is connected to a first optical splitter.

[0016] In one embodiment of the present application, the optical engine chip in the optical signal processing module includes multiple semiconductor optical amplifiers. Each output end of the second optical splitter is connected to a semiconductor optical amplifier, and each output end of each semiconductor optical amplifier is connected to a first optical splitter.

[0017] In one embodiment of the present application, the light source and the coupling module are connected by a non-polarization-maintaining optical fiber.

[0018] In one embodiment of the present application, the modulator is a Mach-Zehnder interferometric modulator or a microring modulator.

[0019] In one embodiment of the present application, the semiconductor optical amplifier is further configured to amplitude-modulate the received pump light by loading a signal.

[0020] In one embodiment of the present application, the material of the semiconductor optical amplifier is a III-V compound;

[0021] and / or

[0022] The first optical splitter, the modulator, and the coupling module are silicon photonic passive devices.

[0023] In one embodiment of the present application, the semiconductor optical amplifier is mounted in the optical engine chip by bonding.

[0024] In a second aspect, an optoelectronic co-packaged module provided by an embodiment of the present application includes an optical engine chip as described in any one of the first aspect.

[0025] Advantages of the embodiments of the present application:

[0026] The optical engine chip provided by the embodiments of the present application includes an optical signal processing module, a first optical splitter, a modulator, and a coupling module. The optical signal processing module includes a semiconductor optical amplifier, and the semiconductor optical amplifier can amplify the optical power of the pump light input by the light source. Since the optical power of the pump light in the present application is amplified by the semiconductor optical amplifier, the optical power requirements of the pump light in each channel obtained after the first optical splitter splits the light can be met. Moreover, the increase in optical power in the present application is achieved by the semiconductor optical amplifier in the optical engine chip, rather than by increasing the number of light sources or increasing the optical power output by the light sources. Therefore, the solution provided by the embodiments of the present application can increase the optical power of each channel without changing the external light source, thereby meeting the power requirements for transmitting optical signals in each channel. Description of the Drawings

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present application, and those of ordinary skill in the art can also obtain other embodiments based on these drawings.

[0028] Figure 1 It is a schematic diagram of a power supply structure in the related art;

[0029] Figure 2 It is a schematic diagram of the structure of the first optical engine chip provided by the embodiments of the present application;

[0030] Figure 3 It is a schematic diagram of the structure of the second optical engine chip provided by the embodiments of the present application;

[0031] Figure 4 It is a schematic diagram of the structure of the third optical engine chip provided by the embodiments of the present application;

[0032] Figure 5 It is a schematic diagram of the structure of the fourth optical engine chip provided by the embodiments of the present application. Detailed Embodiments

[0033] The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some embodiments of the present application, rather than all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art based on the present application belong to the scope protected by the present application.

[0034] In the related art, there is a need to integrate multiple channels in an optical engine chip. However, after the pump light is split and enters each channel, the optical power of the pump light will decrease, resulting in the optical power of each channel not meeting the application requirements. To solve the above problems, an embodiment of the present application provides an optical engine chip and an optical and electrical co-packaged module.

[0035] To illustrate the differences between the embodiments of the present application and the related art, the related art will be described first.

[0036] To ensure that the optical power of each channel can meet the application requirements, in one case, more external light sources need to be configured. In another case, while keeping the number of external light sources unchanged, the output optical power of the external light sources is increased.

[0037] However, the output optical power of the external light source cannot be increased indefinitely. On the one hand, the increase in its output optical power makes the total power consumption of the external light source increase exponentially, and there are significant safety problems and conversion efficiency problems. Moreover, it will also cause a sharp increase in the heat generation of the external light source. If more external light sources are used, more internal wiring is required, which will occupy more panel space. Since the pump light will generate huge losses when transmitted in the silicon optical waveguide after being input into the OE (Optical Engines), this is also the link with the largest optical link loss in the entire CPO. Therefore, if the substrate is increased, the pump light needs to pass through a longer waveguide wiring in the substrate, resulting in a higher total power consumption of the optical power in the wiring.

[0038] It can be seen that the solution in the related art that adjusts the external light source cannot well meet the application requirements of the optical power of each channel.

[0039] In the related art, if the output optical power of the light source is to be increased, there is a solution of adding an SOA (Semiconductor Optical Amplifier) to the light source.

[0040] See Figure 1 , which is a schematic diagram of a power supply structure in the related art.

[0041] As can be seen from the figure, the power supply includes a DFB (Distributed Feedback Laser) and an SOA. The DFB is used to emit pump light, and the SOA is used to amplify the optical power of the pump light. The gray part on the left side of the DFB is an antireflection coating (HR Coating, High Reflection Coating), and the right side of the SOA is an anti-reflection coating (AR Coating, Anti-Reflectance coating). The area with double arrows in both is the active region (Active Region). The part of the DFB other than the active region is the DFB pad metal, and the part of the SOA other than the active region is the SOA pad metal. However, the optical power output by the DFB is limited and will operate in the saturation region after reaching a certain optical power. In this case, if the current input to the DFB is further increased, it will cause a significant increase in the power consumption of the DFB, but the conversion efficiency of the DFB will decrease in this case. In this case, a large current can be injected into the SOA for optical power amplification, so as to balance the power and efficiency of the overall power supply.

[0042] However, although the power supply in the related technology can output pump light with a relatively high optical power, the optical power of the output pump light can theoretically reach about 350 mW, but the 350 mW laser will cause harm to the human eye. And the DFB and the SOA are connected through a blind plug interface, and in the actual use process, the connector between the two will be damaged due to dust entering the blind plug interface. Moreover, due to the increase in the optical power of the pump light output by the light source, a more serious heat generation problem will occur, and a higher-power TEC (Thermo Electric Cooler) is required for heat dissipation. In addition, the high-power pump light output by the light source will generate higher losses in the link when input into the OE. Therefore, in order to reduce the losses, additional special configurations are required for each coupling point in the pump light transmission link.

[0043] In addition, in the related technology, in addition to amplifying the optical power of the pump light at the pump light sending end (i.e., the light source), there is also a solution to amplify the optical power of the received optical signal at the receiving end of the optical signal.

[0044] However, such a receiving end can only be applied to specific scenarios (such as long-distance communication), and the setting of the entire scenario needs to be declared in advance. Such a receiving end cannot be directly docked with ordinary modules.

[0045] As can be seen from the above, there are various problems in the solutions for improving the optical power in the related technology. For this reason, the embodiments of the present application provide an optical engine chip.

[0046] See Figure 2, which is a schematic structural diagram of the first optical engine chip provided by the embodiments of the present application. The above optical engine chip includes an optical signal processing module 201, a first optical splitter 202, a modulator 203, and a coupling module 204. The above optical signal processing module 201 includes a semiconductor optical amplifier 2011. The above modulator includes a phase shifter.

[0047] The input end of the above optical signal processing module is connected to the above coupling module. The output end of the above semiconductor optical amplifier is connected to the input end of the above first optical splitter. Each output end of the above first optical splitter is connected to a modulator, and the output end of the modulator is connected to the above coupling module.

[0048] The above coupling module is used to receive the pump light input by the light source and output the optical signal modulated by the modulator.

[0049] There are different paths in the above coupling module, including an input path and multiple output paths. The input path is connected to the input end of the optical signal processing module, and is used to receive the pump light input by the light source and transmit the pump light to the input end of the optical signal processing module. Each output path is connected to the output end of a modulator, and is used to output the optical signal modulated by the modulator.

[0050] When in use, the coupling module is connected to an optical fiber. The coupling module is respectively connected to the light source and the receiving end of the optical signal through the optical fiber.

[0051] The above light source is connected to the above coupling module through a non-polarization-maintaining optical fiber. Since the semiconductor optical amplifier has a polarization selection function, there is no need to connect the light source and the coupling module through a polarization-maintaining optical fiber, but it can be connected through an ordinary optical fiber, thereby saving the cost of connecting the light source and the coupling module.

[0052] The above optical signal processing module increases the optical power of the received pump light through the above semiconductor optical amplifier.

[0053] The semiconductor optical amplifier is a PN junction device with a strained quantum well structure. An external forward bias makes the medium population inverted. When an external excitation light is incident, stimulated emission occurs to achieve pump light amplification. The optical power of the amplified pump light should meet the optical splitting ratio requirements of the optical engine chip. For example, if the optical splitting ratio of 1:8 is to be achieved, the optical power of the amplified pump light should theoretically be about 200 mW. If the optical splitting ratio of 1:16 is to be achieved, the optical power of the amplified pump light should theoretically be about 400 mW.

[0054] The above first optical splitter is used to split the received pump light into multiple paths of pump light and output them respectively through each output end.

[0055] The total number of multiple pump lights obtained after the first optical splitter splits the received pump light should be equal to the total number of optical signal paths set in the optical engine chip, and it needs to meet the optical splitting ratio requirement that the optical engine chip hopes to achieve. For example, if the optical splitting ratio requirement is 1:8, the total number of multiple pump lights is 8; if the optical splitting ratio requirement is 1:16, the total number of multiple pump lights is 16, and so on.

[0056] The above modulator is used to modulate an electrical signal onto the pump light to form an optical signal.

[0057] Among them, the above modulator is used to adjust the phase of each arm, so that the intensity of the output optical signal changes. The above modulator is a Mach-Zehnder (MZ) interferometric modulator or a microring modulator.

[0058] In an embodiment of the present application, the material of the above semiconductor optical amplifier is a III-V compound;

[0059] and / or

[0060] The above first optical splitter, the above modulator, and the above coupling module are silicon photonics passive devices.

[0061] The above semiconductor optical amplifier is installed in the above optical engine chip by bonding, or the semiconductor optical amplifier can also be installed in the optical engine chip as an independent module. The above first optical splitter, the above modulator, and the above coupling module can be directly processed on the substrate of the optical engine chip.

[0062] As can be seen from the above, the optical engine chip provided by the embodiment of the present application includes an optical signal processing module, a first optical splitter, a modulator, and a coupling module. The optical signal processing module includes a semiconductor optical amplifier, and the semiconductor optical amplifier can amplify the optical power of the pump light input by the light source. Since the optical power of the pump light in the present application is amplified by the semiconductor optical amplifier, it can meet the optical power requirements of the pump lights in each channel obtained after the first optical splitter splits the light. Moreover, the increase in optical power in the present application is achieved through the semiconductor optical amplifier in the optical engine chip, rather than by increasing the number of light sources or increasing the optical power output by the light source. Therefore, the solution provided by the embodiment of the present application can increase the optical power of each channel without changing the external light source, thereby meeting the power requirements for transmitting optical signals in each channel.

[0063] Moreover, since the number of light sources does not need to be increased in the embodiment of the present application, therefore, in the optical engine chip, there is no need to perform complex wiring design to adapt to multiple light sources, and the wiring will not occupy more panel space, nor will it cause a large amount of power consumption of the optical power in the wiring.

[0064] In addition, since it is not necessary to increase the optical power output by the light source in the embodiments of the present application, the total power consumption of the light source will not increase too much, so there will be no safety problems and conversion efficiency problems, nor will it cause a sharp increase in the heat generation of the external light source.

[0065] Moreover, in the present application, the optical power of the pump light is amplified by a semiconductor optical amplifier before the first optical splitter, which can compensate for the optical power loss of the coupling module and the optical power loss of the transmission link between the coupling module and the semiconductor optical amplifier.

[0066] Furthermore, since the optical power is amplified before the first optical splitter, the optical power of the pump light input to the first optical splitter is relatively large. The pump light with a relatively large optical power can be split into more paths of pump light, enabling the solution provided by the embodiments of the present application to support an optical splitter with a larger optical splitting ratio and meet the transmission requirements of the optical engine chip for multiple paths of pump light.

[0067] In one embodiment of the present application, the above-mentioned semiconductor optical amplifier is further configured to amplitude-modulate the received pump light by loading a signal.

[0068] Specifically, the semiconductor optical amplifier can amplitude-modulate the pump light at a low frequency by loading a signal, so that some basic information of the optical engine chip can be loaded on the pump light to implement an optical label.

[0069] Based on the foregoing optical engine chip, the present application proposes a pre-amplification scheme. Refer to Figure 3 , which is a schematic structural diagram of the second optical engine chip provided by the embodiments of the present application.

[0070] Compared with the foregoing Figure 2 , only the above-mentioned semiconductor optical amplifier 2011 is included in the above-mentioned optical signal processing module 201. The input end of the above-mentioned semiconductor optical amplifier 2011 is directly connected to the above-mentioned coupling module 204, and the number of output ends of the above-mentioned first optical splitter is the number of optical signals output by the optical engine chip.

[0071] As can be seen from the figure, in the embodiments of the present application, the semiconductor optical amplifier 2011 is directly connected to the coupling module 204, that is, the semiconductor optical amplifier 2011 directly receives the pump light input by the light source. After the optical power is amplified, it is directly split by the first optical splitter 202, splitting one path of pump light into multiple paths of pump light. Since the first optical splitter 202 will evenly distribute the optical power of the input pump light to the output pump light of each path, due to the relatively large number of pump light paths after the first optical splitter 202 splits, in order to ensure that the optical power of the pump light output by the first optical splitter 202 can meet the requirements, the optical power of the pump light amplified by the semiconductor optical amplifier 2011 should be large enough. Therefore, this embodiment is applicable to scenarios where the optical power amplification ability of the semiconductor optical amplifier 2011 is relatively strong.

[0072] corresponding to Figure 2 the embodiment shown, the present application also proposes a post-amplification scheme.

[0073] The above optical signal processing module further includes a second optical splitter. The above coupling module is connected to the input end of the second optical splitter, and each output end of the second optical splitter is respectively connected to the input end of a semiconductor optical amplifier.

[0074] Each output end of the semiconductor optical amplifier is connected to a first optical splitter.

[0075] The above second optical splitter is used to split the received pump light into multiple paths of pump light and output them through each output end respectively.

[0076] The product of the number of output ends of the above first optical splitter and the number of output ends of the above second optical splitter is the number of optical signals output by the optical engine chip.

[0077] That is, in the embodiment of the present application, the pump light input through the coupling module is first split by the second optical splitter into multiple paths of pump light. The multiple paths of pump light obtained by splitting are all subjected to optical power amplification processing by the semiconductor optical amplifier. The amplified pump light is then split by the first optical splitter, and finally is modulated by the modulator. That is, the number of pump lights obtained after the pump light input through the coupling module is split twice reaches the number of channels required by the optical engine chip. For example, if the desired splitting ratio is 1:8, and the number of channels required by the optical engine chip is 8. If the second optical splitter splits 1 path of pump light into 4 paths of pump light, then each first optical splitter can split 1 path of pump light into 2 paths of pump light to make the number of pump lights obtained after two splits equal to 8.

[0078] It can be seen that compared with the foregoing pre-amplification scheme, the number of pump lights obtained after splitting by the first optical splitter in this embodiment is smaller. Therefore, in this embodiment, the optical power of the pump light input to the first optical splitter is less than the optical power of the pump light input to the first optical splitter in the pre-amplification scheme, so that the optical power of the pump light obtained after splitting can meet the requirements.

[0079] For example, if it is also necessary to achieve an optical splitting ratio of 1:8, and the optical power of each pump light obtained after splitting by the first optical splitter needs to reach 25 mW. Then if the pre-amplification scheme is adopted, the optical power of the pump light input to the first optical splitter needs to reach 200 mW. However, if the post-amplification scheme is adopted, if the second optical splitter splits 1 path of pump light into 4 paths of pump light, and each first optical splitter splits 1 path of pump light into 2 paths of pump light, then the optical power of the pump light input to the first optical splitter is 50 mW, which is significantly less than 200 mW.

[0080] It can be seen that the present post-amplification solution is applicable to scenarios where the optical power amplification ability of a semiconductor optical amplifier is weak, and the requirements of the optical engine chip can be met by an ordinary semiconductor optical amplifier.

[0081] See Figure 4 , which is a schematic structural diagram of the third optical engine chip provided by the embodiment of the present application.

[0082] Compared with the foregoing Figure 2 shown embodiment, the above optical signal processing module 201 further includes a second optical splitter 2012, and includes a semiconductor optical amplifier 2011 therein. The above optical engine chip includes a plurality of first optical splitters 202.

[0083] All output ends of the above second optical splitter 2012 are connected to the input end of the semiconductor optical amplifier 2011, and each output end of the semiconductor optical amplifier 2011 is connected to a first optical splitter 202.

[0084] That is, each pump light obtained after the second optical splitter 2012 splits light in this embodiment is amplified in optical power by the same semiconductor optical amplifier 2011.

[0085] It should be noted that Figure 4 after the second optical splitter 2012 splits light, 4 pump lights are obtained, and 2 pump lights are obtained after each first optical splitter 202 splits light. This quantity is only an example, and the embodiments of the present application do not limit the quantity of the pump lights obtained by splitting the second optical splitter 2012 and the first optical splitter 202, and the specific quantity can be set according to specific requirements.

[0086] See Figure 5 , which is a schematic structural diagram of the fourth optical engine chip provided by the embodiment of the present application.

[0087] Compared with the foregoing Figure 2 shown embodiment, the above optical signal processing module 201 further includes a second optical splitter 2012, and includes a plurality of semiconductor optical amplifiers 2011 therein.

[0088] Each output end of the above second optical splitter 2012 is connected to a semiconductor optical amplifier 2011, and the output end of each semiconductor optical amplifier 2011 is connected to a first optical splitter 202. That is, each pump light obtained after the first optical splitter 202 splits light in the embodiments of the present application is amplified by different semiconductor optical amplifiers 2011 respectively.

[0089] In the figure, 4 pump lights are obtained after the second optical splitter 2012 splits light, so there are 4 semiconductor optical amplifiers 2011. It should be noted that Figure 5After the second optical splitter 2012 splits the light, four pump lights are obtained. After each first optical splitter 202 splits the light, two pump lights are obtained, and there are four semiconductor optical amplifiers 2011. This quantity is only an example. In the embodiments of the present application, the quantity of the pump lights obtained by splitting the second optical splitter 2012 and the first optical splitter 202 is not limited, and the specific quantity can be set according to specific requirements.

[0090] Corresponding to the foregoing optical engine chip, an optoelectronic co-packaging module is further provided in the embodiments of the present application, and the optical engine chip included in the foregoing optoelectronic co-packaging module is the optical engine chip described in any one of the foregoing items.

[0091] As can be seen from the above, the optical engine chip in the optoelectronic co-packaging module provided in the embodiments of the present application includes an optical signal processing module, a first optical splitter, a modulator, and a coupling module. The optical signal processing module includes a semiconductor optical amplifier, and the semiconductor optical amplifier can amplify the optical power of the pump light input by the light source. Since the optical power of the pump light in the present application is amplified by the semiconductor optical amplifier, the optical power requirements of the pump lights in each channel obtained after splitting by the first optical splitter can be met. Moreover, the increase in optical power in the present application is achieved by the semiconductor optical amplifier in the optical engine chip, rather than by increasing the number of light sources or increasing the optical power output by the light sources. Therefore, the solution provided in the embodiments of the present application can increase the optical power of each channel without changing the external light source, so as to meet the power requirements for transmitting optical signals in each channel.

[0092] It should be noted that, in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device. Without further limitation, the element defined by the statement "including a..." does not exclude the existence of additional identical elements in the process, method, article or device including the said element.

[0093] Each embodiment in this specification is described in a related manner. The same or similar parts between the embodiments can be referred to each other, and the differences between each embodiment and other embodiments are emphasized. In particular, for the optoelectronic co-packaging module embodiment, since it is basically similar to the optical engine chip embodiment, the description is relatively simple, and the relevant parts can be referred to the partial description of the method embodiment.

[0094] The foregoing are only the preferred embodiments of the present application and are not intended to limit the protection scope of the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present application are all included within the protection scope of the present application.

Claims

1. A light engine chip, characterized in that: The optical engine chip includes an optical signal processing module, a first optical splitter, a modulator, and a coupling module, and the optical signal processing module includes a semiconductor optical amplifier; The input end of the optical signal processing module is connected to the coupling module, the output end of the semiconductor optical amplifier is connected to the input end of the first optical splitter, each output end of the first optical splitter is connected to a modulator, and the output end of the modulator is connected to the coupling module; The coupling module is used to receive the pump light input by the light source and output the optical signal modulated by the modulator; The optical signal processing module increases the optical power of the received pump light through the semiconductor optical amplifier; The first optical splitter is used to split the received pump light into multiple pump lights and output them through each output end respectively; The modulator is used to modulate the electrical signal onto the pump light to form an optical signal.

2. The light engine chip according to claim 1, characterized in that: The optical signal processing module only includes the semiconductor optical amplifier, the input end of the semiconductor optical amplifier is directly connected to the coupling module, and the number of output ends of the first optical splitter is the number of optical signals output by the optical engine chip.

3. The light engine chip according to claim 1, characterized in that: The optical signal processing module further comprises a second optical splitter, the coupling module is connected to the input end of the second optical splitter, and each output end of the second optical splitter is connected to the input end of the semiconductor optical amplifier respectively; Each output end of the semiconductor optical amplifier is connected to a first optical splitter; The second optical splitter is used to split the received pump light into multiple pump lights and output them through each output end respectively; The product of the number of output ends of the first optical splitter and the number of output ends of the second optical splitter is the number of optical signals output by the optical engine chip.

4. The light engine chip according to claim 3, characterized in that: The optical signal processing module comprises a semiconductor optical amplifier, all output ends of the second optical splitter are connected to the input end of the semiconductor optical amplifier, and each output end of the semiconductor optical amplifier is connected to a first optical splitter.

5. The light engine chip according to claim 3, characterized in that: The optical signal processing module comprises a plurality of semiconductor optical amplifiers, each output end of the second optical splitter is connected to a semiconductor optical amplifier, and the output end of each semiconductor optical amplifier is connected to a first optical splitter.

6. The light engine chip according to any one of claims 1 to 5, characterized in that: The light source and the coupling module are connected via a non-polarization-maintaining optical fiber.

7. The light engine chip according to any one of claims 1 to 5, characterized in that: The modulator is a Mach-Zehnder interferometer modulator or a micro-ring modulator.

8. The light engine chip according to any one of claims 1 to 5, characterized in that: The semiconductor optical amplifier is also used to perform amplitude modulation on the received pump light by adding a signal.

9. The light engine chip according to any one of claims 1 to 5, characterized in that: The material of the semiconductor optical amplifier is a III-V compound; and / or The first optical splitter, the modulator and the coupling module are silicon photonic passive devices.

10. The light engine chip according to any one of claims 1 to 5, characterized in that: The semiconductor optical amplifier is mounted in the optical engine chip by bonding.

11. A photoelectric sealing module, characterized in that: The optical engine chip included in the optoelectronic sealing module is the optical engine chip according to any one of claims 1-10.

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