Film sealing structure for semiconductor photoetching equipment and production process of film sealing structure

Abstract

The invention discloses a film sealing structure for semiconductor photoetching equipment and a production process thereof, and relates to the technical field of semiconductor photoetching equipment, and the film sealing structure comprises a film main body which is made of 304 stainless steel, is tightly attached to the curved surface of the photoetching equipment and the surface of a special-shaped structure, and is used for blocking the permeation of photoetching liquid; the thin film supporting frame is matched with the thin film body, and the structural strength and stability of the thin film body in the using process are enhanced; and the adhesive layer adopts a high-temperature-resistant and corrosion-resistant adhesive to tightly combine the thin film main body with the thin film supporting frame. According to the thin film sealing structure of the semiconductor photoetching equipment prepared by adopting the production process provided by the invention, the thin film main body is subjected to special molecular design and surface treatment, has extremely low liquid permeability, can effectively block the permeation of photoetching liquid, has excellent flexibility, and can be applied to the field of photoetching equipment. The sealing structure can be tightly attached to the complex curved surface and the special-shaped structure surface of the photoetching equipment, and the omnibearing sealing effect is ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor lithography equipment, and particularly to a film sealing structure for semiconductor lithography equipment and its production process. Background Art

[0002] In the semiconductor manufacturing process, immersion lithography technology, as a key means to improve lithography resolution, is widely used. During the immersion lithography process, a high refractive index liquid, such as deionized water, needs to be filled between the projection objective lens and the wafer of the lithography equipment to increase the numerical aperture of the exposure system and achieve a more precise lithography pattern transfer. However, this special working environment poses extremely high challenges to the sealing performance of the equipment. The film sealing structures of semiconductor lithography equipment in the prior art are difficult to meet the requirements of the sealing performance of the equipment in this special working environment. Therefore, we propose a film sealing structure for semiconductor lithography equipment and its production process. Summary of the Invention

[0003] The purpose of the present invention is to provide a film sealing structure for semiconductor lithography equipment and its production process to solve the problem that the film sealing structures of semiconductor lithography equipment in the prior art are difficult to meet the requirements of the sealing performance of the equipment in a special working environment.

[0004] To achieve the above purpose, the present invention provides the following technical solutions: A film sealing structure for semiconductor lithography equipment, comprising:

[0005] A film main body, made of 304 stainless steel, with a thickness of 10 ± 1 μm, closely attached to the curved surface and the surface of the special-shaped structure of the lithography equipment, for blocking the penetration of lithography liquid;

[0006] A film support frame, cooperating with the film main body to enhance the structural strength and stability of the film main body during use;

[0007] An adhesive layer, made of a high-temperature resistant and corrosion-resistant adhesive, tightly bonding the film main body and the film support frame, and the thickness of the adhesive layer is 10 ± 1 μm.

[0008] A production process of a film sealing structure for semiconductor lithography equipment, comprising the following steps:

[0009] Step S1, surface treatment;

[0010] Step S2, waterproof glue coating;

[0011] Step S3, fixed transfer glue coating;

[0012] Step S4, laser cutting of the sealing film sheet;

[0013] Step S5, cutting of the fixed transfer high and low glue;

[0014] Step S6, cutting of the anti-static PE locator;

[0015] Step S7, stacking and assembling;

[0016] Step S8, packaging and transportation.

[0017] Preferably, in the step S1, 304 rolled stainless steel foil is used, with a thickness of 10μm ± 1μm, and the surface color is non-bright annealed 2B cold-rolled state, showing a silver-gray matte finish, without obvious reflection and mirror reflection;

[0018] By plasma-enhanced chemical vapor deposition, an anti-reflection material and a hydrophobic material are deposited and transitioned on the surface of the steel foil to form an anti-reflection and hydrophobic coating. The reflectivity of the coating to ultraviolet light is < 2%, the water contact angle is ≥ 110°, the thickness of the entire coating is < 1μm, and a 50μm thick polyester protective film needs to be covered on the surface of the coating.

[0019] Preferably, in the step S2, the mixing ratio of the glue is that the curing agent: main glue = 0.2:99.8. Dilute 0.2% of the curing agent with a mixed solvent of ethyl acetate: isopropanol = 85:15 until it is clear and transparent, and then add it to the modified acrylic main glue with a solid content of 33% and a quantity of 99.8 and stir evenly;

[0020] The prepared acrylic glue is evenly coated on the non-coated surface of the 10μm thick steel foil through a precision doctor blade coating equipment, with a coating thickness of 10μm. It is cured at a high temperature of 135°C for 5 minutes in an oven, and then a 50μm thick polyester release film is laminated. Finally, it is placed in an environment of 55°C and left to cure for 48H;

[0021] After curing, it is the stainless steel foil hydrophobic and waterproof tape, with a glue thickness of 10μm ± 1μm and a total thickness of 20μm ± 2μm.

[0022] Preferably, in the step S3, the fixed transfer adhesive is a high-low viscosity double-sided tape. The high-viscosity side is adhered to the 100μm thick anti-static PE film locator, and the low-viscosity side is attached to the coated surface of the steel foil tape. Because the adhesion between the low-viscosity side and the coated surface of the steel foil tape is relatively low, it plays a temporary fixing role and can be easily peeled off; through the different adhesion strengths and peeling force differences of the fixed transfer double-sided tape, the process of sealing the thin film to fit the quartz glass and silicon dioxide is realized;

[0023] The mixing ratio of the glue on the high-viscosity side is that the curing agent: main glue = 0.2:99.8. Dilute 0.2% of the curing agent with a mixed solvent of ethyl acetate: isopropanol = 85:15 until it is clear and transparent, and then add it to the modified acrylic main glue with a solid content of 33% and a quantity of 99.8 and stir evenly;

[0024] The prepared high-tack surface glue is evenly coated on a 36-μm thick polyester film substrate with a precision doctor blade coating equipment at a coating thickness of 15 μm, cured in an oven at 135°C for 5 minutes, and then laminated with a 50-μm thick polyester release film.

[0025] For the preparation ratio of the low-tack surface glue, the curing agent: main glue = 1:99. Dilute 1% of the curing agent with a mixed solvent of ethyl acetate: isopropanol = 85:15 until it is clear and transparent, and then add it to the modified acrylic main glue with a solid content of 33% and a quantity of 99 and stir evenly.

[0026] The prepared low-tack surface glue is evenly coated on the non-glue surface of the 36-μm thick polyester film on which the high-tack surface has been coated with a precision doctor blade coating equipment at a coating thickness of 15 μm, cured in an oven at 135°C for 5 minutes, and then laminated with a 50-μm thick polyester release film. Finally, it is placed in an environment at 55°C and left to age for 48 hours.

[0027] After aging, it becomes a high-low adhesion fixed transfer tape with polyester release films attached on both sides. The high-tack surface has a light peel strength, and the low-tack surface has a heavy peel strength. The total thickness is 166 μm ± 2 μm, and the usable layer thickness is 66 μm ± 2 μm. The peel strength of the high-tack tape surface is ≥ 1000 g, and the peel strength of the low-tack surface is 600 g.

[0028] Preferably, in step S4, first, according to the product graphic size, design a product cutting drawing with a positioning device. The positioning device can control the assembly accuracy and is used for the lamination combination in subsequent processes. The cutting process is divided into semi-cutting and full-cutting. When cutting the steel foil tape, the polyester release film is not cut, which is semi-cutting; when cutting through together with the polyester release film, it is full-cutting.

[0029] Tear off the polyester protective film on the coated surface, place the coated surface facing up into the laser cutting machine, adjust the laser cutting parameters, use the semi-cutting process to cut out the product body of the steel foil tape, without cutting the polyester release film, and then use the full-cutting process to cut through the steel foil tape and the polyester release film to cut out the outer frame and positioning holes of the polyester release film. Finally, use tweezers to remove the waste and take out the excess waste. At this time, the sealed film sheet is already a semi-finished product.

[0030] Preferably, in step S5, the sealed film sheet and the high-low adhesion transfer glue are ultrathin and prone to wrinkling. To better solve the wrinkling problem, according to the product form, combined with the structural dimensions of the sealed film sheet and the PE film locator, design a high-low adhesion transfer glue with a positioning structure. The positioning device is used for the lamination combination in subsequent processes. The designed size of the fixed transfer glue is 1 mm smaller than the sealed film sheet, and a hollow with a depth of 2 mm is cut at a fixed position of the glue as the starting position for using the sealed film sheet during lamination. This can better separate the sealed film sheet during assembly to ensure no wrinkling.

[0031] The cutting process is divided into semi-cutting and full-cutting. When using the high-adhesive surface of the fixed transfer adhesive facing upwards, perform semi-cutting without cutting the low-adhesive surface polyester release film. Then, perform full-cutting on the outer frame and positioning holes of the polyester release film together. Finally, use tweezers to remove the waste, taking out the excess waste material. At this time, the fixed transfer adhesive layer of the sealed film sheet is ready.

[0032] Preferably, in step S6, the anti-static PE locator is made of an anti-static material with a thickness of 100μm and is designed according to the lithography stage of the lithography machine and different installation positions.

[0033] During the assembly process of the anti-static PE locator, a set of positioning devices corresponding to the sealed film sheet and the fixed transfer adhesive need to be designed respectively, such as the design of positioning holes and fixtures. Control the accuracy well. The sizes of the two sets of positioning holes need to be exactly the same as those of the sealed film sheet and the fixed transfer adhesive. The specific design depends on the product, but the principle is the same.

[0034] After the locator is cut and set aside, the stacking and assembly process is entered next.

[0035] Preferably, in step S7, the prepared components are stacked and assembled:

[0036] Part A, the sealed film sheet;

[0037] Part B, the fixed transfer adhesive;

[0038] Part C, the locator;

[0039] Place Part C correctly on the flat fixture with a positioning device. Use tweezers to peel off the polyester release film on the high-adhesive surface of Part B. Slowly attach and bond the high-adhesive surface of Part B to the matching position of Part C through the positioning device. Use a cotton swab or a special tool to repeatedly press the polyester release film on the low-adhesive surface of Part B in turn to make it fully bond with Part C.

[0040] Use tweezers to peel off the polyester release film on the low-adhesive surface of Part B. Use tweezers to peel off the polyester release film on the coated surface of Part A. Slowly attach and bond the coated surface of Part A to the low-adhesive surface of Part B through the positioning device, and then press it with a cotton swab or a special tool in turn.

[0041] Assemble the label and instructions, such as model number, size, and warning label. At this time, the finished product of the sealed film sheet is completed.

[0042] Preferably, in step S8, if a 3D transportation packaging box is required finally, it can be designed and manufactured according to the product and requirements.

[0043] Compared with the prior art, the beneficial effects of the present invention are as follows: The film sealing structure of the semiconductor lithography equipment prepared by the production process provided by the present invention, in which the film body undergoes special molecular design and surface treatment, has an extremely low liquid penetration rate, can effectively block the penetration of lithography liquid. At the same time, it has excellent flexibility and can closely fit on the complex curved and irregular structure surfaces of the lithography equipment to ensure an all-round sealing effect. In order to enhance the structural strength and stability of the film body during use, a matching film support frame is designed. While providing uniform support force for the film body, it can also effectively disperse external pressure and prevent the film body from being damaged due to uneven stress. The anti-reflection coating can effectively suppress and avoid product quality problems caused by stray light interference. At the same time, the coating has excellent hydrophobicity and there is no worry about residual water on the surface. Detailed implementation manners

[0044] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0045] Embodiment 1

[0046] The present invention provides a technical solution: A film sealing structure for a semiconductor lithography equipment, including:

[0047] A film body, made of 304 stainless steel, with a thickness of 10 ± 1 μm, closely fitting on the curved and irregular structure surfaces of the lithography equipment to block the penetration of lithography liquid. The core component of the film sealing structure of the present invention is the film body, made of 304 stainless steel, with a thickness of 10 ± 1 μm. This material undergoes special molecular design and surface treatment, has an extremely low liquid penetration rate, and can effectively block the penetration of lithography liquid. At the same time, it has excellent flexibility and can closely fit on the complex curved and irregular structure surfaces of the lithography equipment to ensure an all-round sealing effect.

[0048] A film support frame, cooperating with the film body to enhance the structural strength and stability of the film body during use. In order to enhance the structural strength and stability of the film body during use, a matching film support frame is designed. The frame is made of PVC material and is closely connected to the film body through a special pasting process. The film support frame has a specific geometric shape and structural design. There are multiple uniformly distributed cylindrical support grids inside it, etc. These support structures can provide uniform support force for the film body while effectively dispersing external pressure and preventing the film body from being damaged due to uneven stress.

[0049] The adhesive layer uses a high-temperature and corrosion-resistant adhesive to tightly bond the film body to the film support frame. The thickness of the adhesive layer is 10 ± 1 μm.

[0050] During specific implementation, to achieve the above functions, it is further through: Sealing mechanism: The film sealing structure forms a stable liquid film sealing layer by utilizing the surface tension of the liquid and the difference in wettability between the film and the surface, creating an efficient sealing barrier in the deionized water area between the projection objective lens and the wafer. When the immersion lithography equipment is working, deionized water fills the area between the film sealing structure and the lithography area. Under the action of the glue, the film body closely adheres to the equipment surface, effectively preventing the leakage of deionized water to other parts of the equipment.

[0051] Stability: The film is fixed to the equipment pasting site with the help of the film support frame, with an accuracy of ±1 mm. The film can be immersed in deionized water for a long time without de-bonding. Even when the equipment is running at high speed, the position of the film does not shift at all.

[0052] Anti-reflection coating: The special coating used has no reflection effect on ultraviolet light with a wavelength of 193 nm, which can effectively suppress and avoid product quality problems caused by stray light interference. At the same time, this coating has excellent hydrophobicity, and there is no worry about residual water on the surface.

[0053] Embodiment 2

[0054] The present invention provides a technical solution: A production process for a film sealing structure used in semiconductor lithography equipment, including the following steps:

[0055] Step S1, Surface treatment:

[0056] 304 rolled stainless steel foil with a thickness of 10 μm ± 1 μm is used. The surface color is a non-bright annealed 2B cold-rolled state, showing a silver-gray matte finish, without obvious reflection and no specular reflection.

[0057] Through plasma-enhanced chemical vapor deposition, an anti-reflection material and a hydrophobic material are deposited and transitioned on the surface of the steel foil to form an anti-reflection and hydrophobic coating. The reflectivity of the coating to ultraviolet light is <2%, the water contact angle is ≥110°, the thickness of the entire coating is <1 μm, and a polyester protective film with a thickness of about 50 μm needs to be covered on the surface of the coating to protect the coating from being contaminated and scratched, and at the same time protect the steel foil from being easily wrinkled.

[0058] Step S2, Waterproof glue coating:

[0059] The mixing ratio of the glue is curing agent: main glue = 0.2:99.8. Dilute 0.2% of the curing agent with a mixed solvent of ethyl acetate: isopropanol = 85:15 until it is clear and transparent, and then add it to the modified acrylic main glue with a solid content of 33% and a quantity of 99.8 and stir evenly.

[0060] The prepared acrylic glue is coated evenly on the non-coated surface of the steel foil with a thickness of 10 μm through a precision doctor blade coating equipment. The coating thickness is 10 μm, cured at 135 °C for 5 min in an oven, then laminated with a polyester release film about 50 μm thick, and finally left to stand and cure in an environment of 55 °C for 48H;

[0061] After curing, it becomes a hydrophobic and waterproof tape for stainless steel foil, with a glue thickness of 10 μm ± 1 μm and a total thickness of 20 μm ± 2 μm; the steel foil tape has strong adhesion to silica such as quartz or glass, excellent waterproof performance and super heat resistance. Even when attached for a long time, no residual glue remains when removed.

[0062] Step S3: Fixed transfer adhesive coating:

[0063] The fixed transfer adhesive is a double-sided tape with high and low adhesiveness. The high-adhesion side is bonded to a 100-μm-thick anti-static PE film locator, and the low-adhesion side is attached to the coated surface of the steel foil tape. Because the adhesion between the low-adhesion side and the coated surface of the steel foil tape is relatively low, it plays a temporary fixing role and can be easily peeled off; through the different adhesion strengths and peel force differences of the fixed transfer double-sided tape, the process of sealing the thin film to fit quartz glass and silica is realized.

[0064] The mixing ratio of the high-adhesion side glue is curing agent: main glue = 0.2:99.8. Dilute 0.2% curing agent with a mixed solvent of ethyl acetate: isopropanol = 85:15 until it is clear and transparent, and then add it to the modified acrylic main glue with a solid content of 33% and a quantity of 99.8 and stir evenly;

[0065] The prepared high-adhesion side glue is coated evenly on the polyester film with a thickness of 36 μm through a precision doctor blade coating equipment. The coating thickness is 15 μm, cured at 135 °C for 5 min in an oven, and then laminated with a polyester release film about 50 μm thick;

[0066] The mixing ratio of the low-adhesion side glue is curing agent: main glue = 1:99. Dilute 1% curing agent with a mixed solvent of ethyl acetate: isopropanol = 85:15 until it is clear and transparent, and then add it to the modified acrylic main glue with a solid content of 33% and a quantity of 99 and stir evenly;

[0067] The prepared low-adhesion side glue is coated evenly on the non-glue surface of the polyester film with a thickness of 36 μm that has been coated with the high-adhesion side through a precision doctor blade coating equipment. The coating thickness is 15 μm, cured at 135 °C for 5 min in an oven, then laminated with a polyester release film about 50 μm thick, and finally left to stand and cure in an environment of 55 °C for 48H;

[0068] After curing, it becomes a high-low viscosity fixed transfer tape, with polyester release films attached on both sides. The high-adhesion side has a light peel, and the low-adhesion side has a heavy peel. The total thickness is 166μm ± 2μm, and the thickness of the used layer is 66μm ± 2μm. The peel strength of the high-tape side is ≥1000g, and the peel strength of the low-adhesion side is about 600g. The high-adhesion side has a strong adhesion to PE, PET, etc., and the low-adhesion side has a good temporary fixing effect on the coated surface of the steel foil. Even after long-term adhesion, it can be easily peeled off when removed.

[0069] Step S4: Laser cutting of the sealing film sheet:

[0070] First, according to the product graphic size, design a product cutting drawing with a positioning device. The positioning device can effectively control the assembly accuracy and is used for the laminated combination in subsequent processes. The cutting process is divided into half-cut and full-cut. The steel foil tape is cut out, but the polyester release film is not cut, which is a half-cut; cutting through together with the polyester release film is a full-cut.

[0071] Tear off the polyester protective film on the coated surface, place the coated surface facing up in the laser cutting machine, adjust the laser cutting parameters, use the half-cut process to cut out the product body of the steel foil tape, and do not cut the polyester release film. Then use the full-cut process to cut through the steel foil tape and the polyester release film to cut out the outer frame and positioning holes of the polyester release film. Finally, use tweezers to remove the waste and take out the excess waste. At this time, the sealing film sheet is already a semi-finished product.

[0072] Step S5: Cutting of the fixed transfer high-low adhesive:

[0073] The sealing film sheet and the high-low viscosity transfer adhesive are ultrathin and prone to wrinkling. To better solve the wrinkling problem, according to the product form and combining the structural dimensions of the sealing film sheet and the PE film locator, design a high-low viscosity transfer adhesive with a positioning structure. The positioning device is used for the laminated combination in subsequent processes and can effectively control the assembly accuracy. The designed size of the fixed transfer adhesive is 1mm smaller than the sealing film sheet, and a hollow with a depth of about 2mm is cut at a fixed position as the starting position for using the sealing film sheet during fitting. It can better separate the sealing film sheet during assembly to ensure no wrinkling.

[0074] The cutting process is divided into half-cut and full-cut. Use the half-cut to cut the high-adhesion side of the fixed transfer adhesive with the high-adhesion side facing up, and do not cut the low-adhesion side polyester release film. Then cut the outer frame and positioning holes of the polyester release film together with a full-cut. Finally, use tweezers to remove the waste and take out the excess waste. At this time, the fixed transfer adhesive layer of the sealing film sheet is ready.

[0075] Step S6: Cutting of the anti-static PE locator:

[0076] The anti-static PE locator is made of 100μm thick anti-static material, hereinafter referred to as the locator; the locator is designed according to the lithography stage of the lithography machine and different installation positions, and its main function is to better install the sealing film sheet, and can well solve the wrinkles and accuracy during installation;

[0077] The role of the locator in the laminated assembly is also crucial. During the assembly process, the locator needs to design a set of positioning devices corresponding to the sealing film sheet and the fixed transfer adhesive respectively, such as the design of positioning holes and jigs, and control the accuracy. The sizes of the two sets of positioning holes need to be exactly the same as the sealing film sheet and the fixed transfer adhesive. The specific design depends on the product, but the scheme is the same;

[0078] After the locator is cut, it is reserved for later use, and then the stacking and assembly process is entered.

[0079] Step S7, Stacking and Assembly:

[0080] The prepared components are stacked and assembled:

[0081] Part A, Sealing Film Sheet

[0082] Part B, Fixed Transfer Adhesive

[0083] Part C, Locator

[0084] Place Part C correctly on the flat jig with a positioning device. Use tweezers to peel off the polyester release film on the high-adhesive surface of Part B, and slowly attach and bond the high-adhesive surface of Part B to the matching position of Part C through the positioning device. Use a cotton swab or a special tool to press the polyester release film on the low-adhesive surface of Part B repeatedly in turn to make it fully bond with Part C;

[0085] Use tweezers to peel off the polyester release film on the low-adhesive surface of Part B, and use tweezers to peel off the polyester release film on the coated surface of Part A. Slowly attach and bond the coated surface of Part A to the low-adhesive surface of Part B through the positioning device, and then press it with a cotton swab or a special tool in turn;

[0086] Assemble labels and instructions, such as model number, size, warning labels, etc. At this time, the finished product of the sealing film sheet is completed.

[0087] Step S8, Packaging and Transportation:

[0088] Finally, if a 3D transportation packaging box is required, it can be designed and manufactured according to the product and requirements.

[0089] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A thin film sealing structure for semiconductor lithography equipment, characterized in that: include: The main body of the film is made of 304 stainless steel with a thickness of 10±1 microns. It fits tightly on the curved surface and special-shaped structure surface of the lithography equipment to prevent the penetration of the lithography liquid. The film support frame cooperates with the film body to enhance the structural strength and stability of the film body during use; The bonding layer uses a high temperature resistant and corrosion resistant adhesive to tightly bond the film body to the film support frame, and the thickness of the bonding layer is 10±1 microns.

2. A production process for a thin film sealing structure for semiconductor lithography equipment according to claim 1, characterized in that: The steps include: Step S1, surface treatment; Step S2, waterproof glue coating; Step S3, fixing the transfer adhesive coating; Step S4, laser cutting of the sealing film sheet; Step S5, fixing the cutting of the high and low glue transfer; Step S6, cutting the anti-static PE positioner; Step S7, stacking and assembling; Step S8: packaging and transportation.

3. The production process of a thin film sealing structure for semiconductor lithography equipment according to claim 2, characterized in that: In the step S1, a 304 rolled stainless steel foil is used, with a thickness of 10 μm±1 μm, and a surface color of a non-bright annealed 2B cold-rolled state, a silver-grey matte surface, no obvious reflection, and no specular reflection; Through plasma enhanced chemical vapor deposition, anti-reflective materials and hydrophobic materials are deposited and transitioned on the surface of steel foil to form anti-reflective and hydrophobic coatings. The reflectivity of the coating to ultraviolet light is <2%, the water contact angle is ≥110°, the thickness of the entire coating is <1μm, and the surface of the coating needs to be covered with a 50μm thick polyester protective film.

4. The production process of a thin film sealing structure for semiconductor lithography equipment according to claim 2, characterized in that: In the step S2, the mixing ratio of the glue is curing agent: main glue = 0.2:99.8, 0.2% curing agent is diluted with a mixed solvent of ethyl acetate: isopropanol = 85:15 until clear and transparent, and then added to the modified acrylic main glue with a solid content of 33% and a quantity of 99.8 and stirred evenly; The prepared acrylic glue is evenly coated on the non-coated surface of the steel foil with a 10μm thick steel foil as the substrate through a precision scraper coating device. The coating thickness is 10μm, and then cured in an oven at 135℃ for 5min. Then, a layer of 50μm thick polyester release film is laminated, and finally placed in a 55℃ environment for 48 hours. After aging, it becomes a stainless steel foil hydrophobic waterproof tape with a thickness of 10μm±1μm and a total thickness of 20μm±2μm.

5. The production process of a thin film sealing structure for semiconductor lithography equipment according to claim 2, characterized in that: In the step S3, the fixed transfer adhesive is a high-low adhesive double-sided adhesive, the high adhesive surface is adhered to the 100 μm thick antistatic PE film positioner, and the low adhesive surface is attached to the coating surface of the steel foil tape. Since the low adhesive surface has a low adhesive force with the coating surface of the steel foil tape, it plays a temporary fixing role and can be easily peeled off; by fixing the transfer double-sided adhesive with different adhesive strengths and peeling force differences, the process of bonding the sealing film sheet to the quartz glass and silicon dioxide is realized; The mixing ratio of high-glue surface glue is curing agent: main glue = 0.2:99.

8. Dilute 0.2% curing agent with a mixed solvent of ethyl acetate: isopropanol = 85:15 until clear and transparent, then add it into the modified acrylic main glue with a solid content of 33% and a quantity of 99.8 and stir evenly; The prepared high-glue surface glue is evenly coated on the polyester film with a thickness of 15 μm using a precision scraper coating device, with a 36 μm thick polyester film as the substrate. It is cured in an oven at 135°C for 5 minutes, and then a layer of 50 μm thick polyester release film is laminated. The mixing ratio of low-glue surface glue is curing agent: main glue = 1:

99. Dilute 1% curing agent with a mixed solvent of ethyl acetate: isopropanol = 85:15 until it is clear and transparent, then add it into the modified acrylic main glue with a solid content of 33% and a quantity of 99 and stir evenly; The prepared low-glue glue is evenly coated on the non-glue surface of the polyester film with a thickness of 15 μm by a precision scraper coating device, using the 36 μm thick polyester film coated with the high-glue surface as the substrate, and then cured in an oven at 135°C for 5 minutes, and then a layer of 50 μm thick polyester release film is laminated, and finally placed in a 55°C environment for aging for 48 hours; After aging, it becomes a high-low adhesive fixed transfer tape with polyester release film on both sides. The high-adhesive side is lightly peeled and the low-adhesive side is heavily peeled. The total thickness is 166μm±2μm, and the use layer thickness is 66μm±2μm; the peeling force of the high-adhesive tape side is ≥1000g, and the peeling force of the low-adhesive side is 600g.

6. The production process of a thin film sealing structure for semiconductor lithography equipment according to claim 2, characterized in that: In the step S4, firstly, a product cutting drawing with a positioning device is designed according to the product graphic size, and the positioning device can control the assembly accuracy and is used for the lamination combination of the subsequent process; the cutting process is divided into half-cutting and full-cutting, and the steel foil tape is cut, but the polyester release film is not cut, which is half-cutting; and the polyester release film is cut together, which is full-cutting; Tear off the polyester protective film on the coated surface, put it into the laser cutting machine with the coated surface facing up, adjust the laser cutting parameters, use the half-cut process to cut out the steel foil tape product body, do not cut the polyester release film, and then use the full-cut process to cut through the steel foil tape and the polyester release film, cut out the polyester release film outer frame and positioning holes, and finally use tweezers to remove the waste and take out the excess waste. At this time, the sealing film sheet is a semi-finished product.

7. The production process of a thin film sealing structure for semiconductor lithography equipment according to claim 2, characterized in that: In step S5, the sealing film sheet and the high-low viscosity transfer adhesive are ultra-thin and easy to wrinkle. In order to better solve the wrinkles, according to the product form, combined with the structural dimensions of the sealing film sheet and the PE film positioner, a high-low viscosity transfer adhesive with a positioning structure is designed, and the positioning device is used for the stacking combination of the subsequent process; the fixed transfer adhesive is designed to be 1mm smaller than the sealing film sheet, and a hollow adhesive with a depth of 2mm is cut at a fixed position as the starting position for the sealing film sheet to be used for lamination; The cutting process is divided into half-cutting and full-cutting. Use half-cutting with the high-glue side of the fixed transfer glue facing up, and the polyester release film on the low-glue side is not cut. Then the outer frame and positioning holes of the polyester release film are fully cut together. Finally, use tweezers to remove the waste and take out the excess waste. At this time, the fixed transfer glue layer of the sealing film is ready.

8. The production process of a thin film sealing structure for semiconductor lithography equipment according to claim 2, characterized in that: In the step S6, the anti-static PE positioner is made of 100 μm thick anti-static material, and the anti-static PE positioner is designed according to the lithography table of the lithography machine and different installation positions; During the assembly process of the anti-static PE positioner, a set of positioning devices corresponding to the sealing film and the fixed transfer glue should be designed separately, such as the design of the positioning holes and the fixtures, and the accuracy should be controlled. The sizes of the two sets of positioning holes should be completely consistent with the sealing film and the fixed transfer glue. The specific design depends on the product, but the scheme is consistent. After the locator is cut, it is ready for use and then enters the stacking assembly process.

9. The production process of a thin film sealing structure for semiconductor lithography equipment according to claim 2, characterized in that: In step S7, the finished components are stacked and assembled: Part A, sealing film; Part B, fixed transfer glue; C-part, locator; Place part C correctly on a flat jig with a positioning device, peel off the polyester release film on the high-glue side of part B with tweezers, slowly attach the high-glue side of part B to the matching position of part C through the positioning device, and repeatedly press the polyester release film on the low-glue side of part B with a cotton swab or special tools to fully bond it to part C; Use tweezers to peel off the polyester release film on the low-glue side of part B, and peel off the polyester release film on the coated side of part A. Use the positioning device to slowly adhere the coated side of part A to the low-glue side of part B, and press them in sequence with a cotton swab or special tools; Assemble labels and instructions, such as model, size, and reminder labels, and the sealed film sheet is now complete.

10. The production process of a thin film sealing structure for semiconductor lithography equipment according to claim 2, characterized in that: In step S8, if a 3D transport packaging box is needed, it can be designed and produced according to the product and requirements.