High-integration hybrid integrated circuit thermal management method and system

Abstract

The invention relates to the technical field of circuit data processing, and particularly discloses a high-integration hybrid integrated circuit thermal management method and system, and the method comprises the steps: obtaining integrated circuit structure data; performing data processing according to the integrated circuit structure to obtain a circuit structure heat dissipation demand index of each integrated area, and performing matching to obtain an initial heat dissipation strategy of each integrated area; according to working state data processing of the integrated circuit, working state heat dissipation demand indexes of all the integrated areas are obtained, and an initial heat dissipation strategy is triggered for heat dissipation; and performing comprehensive analysis to obtain a circuit heat dissipation effect evaluation value, and performing heat dissipation effect evaluation. According to the thermal management method and system for the high-integration hybrid integrated circuit, the potential heat dissipation problem can be found and solved in time, it is ensured that the circuit can stably operate under various working conditions, the optimal circuit layout, element packaging and heat dissipation strategies can be selected, and the service life of the circuit is prolonged. And furthermore, the product is ensured to have good heat dissipation performance in actual use, so that the product quality is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit data processing, and particularly to a thermal management method and system for high-integration hybrid integrated circuits. Background Art

[0002] Currently, with the continuous development of semiconductor technology, the integration and power consumption of chips are getting higher and higher, resulting in a continuous increase in the operating temperature of the chips. High temperature will lead to a decline in the performance of integrated circuits and may even cause damage. Therefore, integrated circuit thermal management has become a key technology to improve the reliability and performance of integrated circuits. Due to the integration of a large number of electronic components, the thermal management problem of high-integration hybrid integrated circuits is particularly prominent.

[0003] For example, the invention patent with the publication number CN117369612B is a server hardware management system and method, including: this invention changes the PWRBRK# signal from unidirectional to bidirectional. When the IPU / DPU board is running, when it is detected that the board-level power status is abnormal or the thermal management is abnormal and the host needs to enter the power management and thermal management states, the IPU / DPU board can actively and quickly pull down the PWRBRK# signal. When the server receives this signal, it reads the status information of the IPU / DPU board through the BMC, confirms the type of abnormality, and performs corresponding power management or thermal management. Conversely, if the host needs to perform power management and thermal management on the IPU / DPU board, it can still send the PWRBRK# signal to the IPU / DPU board through the polling mechanism for management.

[0004] For example, the invention patent with the publication number CN115220553A is a system and method for adaptively adjusting the thermal upper limit. The system includes a plurality of computing circuits and a thermal management module coupled to the plurality of computing circuits. Among them, the thermal management module is used for: detecting a change in the operating conditions affecting the power consumption in the system; when detecting a change in the operating conditions, determining an adjustment value for the thermal upper limit of the computing circuits in the plurality of computing circuits; and adjusting the thermal upper limit of the computing circuits according to the adjustment value, where the thermal upper limit values corresponding to different operating conditions are different.

[0005] However, in the process of implementing the technical solutions of the present invention in the embodiments of the present application, it is found that the above technologies have at least the following technical problems: Currently, integrated circuit thermal management methods pay more attention to the real-time monitoring and warning of temperature, but the influence of integrated circuit components' performance in a high-temperature environment becomes more significant and complex, and it is difficult to guarantee the overall performance and efficiency of high-integration hybrid integrated circuits. Summary of the Invention

[0006] In view of the deficiencies of the prior art, the present invention provides a thermal management method and system for high-integration hybrid integrated circuits, which can effectively solve the problems involved in the above background art.

[0007] To achieve the above object, the present invention is implemented through the following technical solutions: In the first aspect of the present invention, a thermal management method for high-integration hybrid integrated circuits is provided, including: monitoring the working state data of the integrated circuit and obtaining the integrated circuit structure data.

[0008] The integrated circuit is divided into regions to obtain each integrated region, and the circuit structure heat dissipation requirement index of each integrated region is processed according to the integrated circuit structure data, and the initial heat dissipation strategy of each integrated region is obtained by matching according to the circuit structure heat dissipation requirement index of each integrated region.

[0009] The working state heat dissipation requirement index of each integrated region is processed according to the integrated circuit working state data, and the initial heat dissipation strategy is triggered according to the working state heat dissipation requirement index of each integrated region for heat dissipation.

[0010] According to the working state heat dissipation requirement index of each integrated region and the circuit structure heat dissipation requirement index of each integrated region, a circuit heat dissipation effect evaluation value is comprehensively analyzed, and the heat dissipation effect is evaluated and fed back according to the circuit heat dissipation effect evaluation value.

[0011] As a further method, the process of processing the circuit structure heat dissipation requirement index of each integrated region according to the integrated circuit structure data is as follows: The circuit structure data includes the number of component types, component density, wiring density, and package thickness of each integrated region.

[0012] The critical number of component types, critical component density, critical wiring density, and critical package thickness are extracted from the integrated circuit database, and the circuit structure heat dissipation requirement index of each integrated region is comprehensively analyzed.

[0013] As a further method, the process of matching the initial heat dissipation strategy of each integrated region according to the circuit structure heat dissipation requirement index of each integrated region is as follows: The initial heat dissipation strategy includes the heat dissipation channel size and the heat dissipation medium flow rate.

[0014] The circuit structure heat dissipation requirement index of each integrated region is input into the integrated circuit database to match the heat dissipation channel size and the heat dissipation medium flow rate of each integrated region corresponding to each circuit structure heat dissipation requirement index range.

[0015] As a further method, the process of processing the working state heat dissipation requirement index of each integrated region according to the integrated circuit working state data is as follows: The working state data includes the static power consumption, working temperature, mechanical stress, and heat dissipation medium flow rate at each time node.

[0016] The critical static power consumption, critical working temperature, critical mechanical stress, and critical heat dissipation medium flow rate are extracted from the integrated circuit database, and the working state heat dissipation requirement index of each integrated region is comprehensively analyzed.

[0017] As a further method, the initial heat dissipation strategy is triggered according to the heat dissipation requirement index of each integrated area for heat dissipation. The specific process is as follows: Extract the heat dissipation requirement threshold of the working state from the integrated circuit database, compare the heat dissipation requirement index of each integrated area with the heat dissipation requirement threshold of the working state. If the heat dissipation requirement index of a certain integrated area is greater than or equal to the heat dissipation requirement threshold of the working state, heat dissipation is carried out according to the initial heat dissipation strategy of this integrated area. If the heat dissipation requirement index of a certain integrated area is less than the heat dissipation requirement threshold of the working state, no additional operation is performed.

[0018] As a further method, the circuit heat dissipation effect evaluation value is obtained through comprehensive analysis. The specific analysis process is as follows: Weights are assigned to the heat dissipation requirement index of the working state and the heat dissipation requirement index of the circuit structure of each integrated area respectively, and the weighted heat dissipation requirement index of the working state and the heat dissipation requirement index of the circuit structure of each integrated area are added and then subjected to a hyperbolic sine function operation. The results of the hyperbolic sine function operation are summed to obtain the circuit heat dissipation effect evaluation value, and the circuit heat dissipation effect evaluation value is used to quantify the heat dissipation effect of the circuit.

[0019] As a further method, heat dissipation effect evaluation and feedback are carried out according to the circuit heat dissipation effect evaluation value. The specific evaluation process is as follows: Extract the circuit heat dissipation effect evaluation threshold from the integrated circuit database, compare the circuit heat dissipation effect evaluation value with the circuit heat dissipation effect evaluation threshold. If the circuit heat dissipation effect evaluation value is greater than or equal to the circuit heat dissipation effect evaluation threshold, the circuit heat dissipation effect is evaluated as qualified. If the circuit heat dissipation effect evaluation value is less than the circuit heat dissipation effect evaluation threshold, the circuit heat dissipation effect is evaluated as unqualified and the initial heat dissipation strategy is adjusted.

[0020] As a further method, the adjustment of the initial heat dissipation strategy includes: Input the circuit heat dissipation effect evaluation value into the integrated circuit database to match and obtain the heat dissipation channel size compensation value and the heat dissipation medium flow compensation value corresponding to each circuit heat dissipation effect evaluation value interval. Add the heat dissipation channel size and the heat dissipation medium flow to the heat dissipation channel size compensation value and the heat dissipation medium flow compensation value respectively to obtain the updated heat dissipation channel size and the updated heat dissipation medium flow, and carry out heat dissipation according to the updated heat dissipation channel size and the updated heat dissipation medium flow.

[0021] As a further method, the specific numerical expression of the circuit heat dissipation effect evaluation value is: ; Wherein, represents the circuit heat dissipation effect evaluation value, represents the heat dissipation requirement index of the circuit structure of the i-th integrated area, represents the heat dissipation requirement index of the working state of the i-th integrated area, represents the influence factor for evaluating the circuit heat dissipation effect corresponding to the set circuit structure heat dissipation requirement index represents the influence factor for evaluating the circuit heat dissipation effect corresponding to the set working state heat dissipation requirement index, where i represents the number of each integrated area, i = 1, 2, 3,..., m, and m represents the total number of integrated areas.

[0022] In the second aspect of the present invention, a high-integration hybrid integrated circuit thermal management system is provided, including: a circuit data acquisition module for monitoring the working state data of the integrated circuit and obtaining the integrated circuit structure data.

[0023] An initial heat dissipation strategy matching module for dividing the integrated circuit into each integrated area, processing the integrated circuit structure data to obtain the circuit structure heat dissipation requirement index of each integrated area, and matching the initial heat dissipation strategy of each integrated area according to the circuit structure heat dissipation requirement index of each integrated area.

[0024] A working state heat dissipation requirement index analysis module for processing the working state data of the integrated circuit to obtain the working state heat dissipation requirement index of each integrated area, and triggering the initial heat dissipation strategy for heat dissipation according to the working state heat dissipation requirement index of each integrated area.

[0025] A circuit heat dissipation effect evaluation module for comprehensively analyzing the working state heat dissipation requirement index and the circuit structure heat dissipation requirement index of each integrated area to obtain the circuit heat dissipation effect evaluation value, and evaluating and feeding back the heat dissipation effect according to the circuit heat dissipation effect evaluation value.

[0026] Compared with the prior art, the embodiments of the present invention have at least the following advantages or beneficial effects: (1) By providing a high-integration hybrid integrated circuit thermal management method and system, the present invention can timely discover and solve potential heat dissipation problems, ensure the stable operation of the circuit under various working conditions, help to select the best circuit layout, component packaging and heat dissipation strategy, improve production efficiency, and further ensure that the product has good heat dissipation performance in actual use, thereby improving product quality.

[0027] (2) By evaluating the circuit structure heat dissipation requirement index of each integrated area, the present invention helps to reasonably allocate heat dissipation resources, can design heat dissipation solutions targeted, thereby improving the overall heat dissipation efficiency, can reduce the adverse effects of temperature on circuit performance, helps to improve the energy efficiency ratio of the product, avoids circuit failure rates caused by poor heat dissipation, and further improves the reliability of the product.

[0028] (3) By evaluating the heat dissipation requirement index of the working state of each integrated area, the present invention can accurately determine which areas require stronger heat dissipation measures, avoid unnecessary energy consumption, contribute to optimizing the design and layout of the heat dissipation system, make it more in line with the actual heat dissipation requirements, effectively reduce the generation of thermal noise, improve the signal-to-noise ratio of the signal, and thus enhance the performance of the circuit. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The present invention will be further described with reference to the accompanying drawings. However, the embodiments in the drawings do not constitute any limitation to the present invention. For those of ordinary skill in the art, other drawings can also be obtained based on the following drawings without creative efforts.

[0030] Figure 1 It is a schematic flowchart of the method of the present invention.

[0031] Figure 2 It is a schematic diagram of the connection of system modules of the present invention.

[0032] Figure 3 It is a schematic diagram of the functional relationship between the heat dissipation effect evaluation value of the circuit of the present invention and the heat dissipation requirement index of the working state. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0033] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts belong to the scope of protection of the present invention.

[0034] Referring to Figure 1 As shown, the first aspect of the present invention provides a high-integration hybrid integrated circuit thermal management method, including: monitoring the integrated circuit working state data and obtaining the integrated circuit structure data.

[0035] Divide the integrated circuit into each integrated area, process the integrated circuit structure data to obtain the circuit structure heat dissipation requirement index of each integrated area, and match the initial heat dissipation strategy of each integrated area according to the circuit structure heat dissipation requirement index of each integrated area.

[0036] Process the integrated circuit working state data to obtain the working state heat dissipation requirement index of each integrated area, and trigger the initial heat dissipation strategy for heat dissipation according to the working state heat dissipation requirement index of each integrated area.

[0037] According to the heat dissipation requirement index of the working state of each integrated area and the heat dissipation requirement index of the circuit structure of each integrated area, the heat dissipation effect evaluation value of the circuit is obtained through comprehensive analysis, and the heat dissipation effect is evaluated and fed back according to the heat dissipation effect evaluation value of the circuit.

[0038] Specifically, the heat dissipation requirement index of the circuit structure of each integrated area is obtained by processing the integrated circuit structure data. The specific processing process is as follows: The circuit structure data includes the number of component types, component density, wiring density, and package thickness of each integrated area.

[0039] The critical number of component types, critical component density, critical wiring density, and critical package thickness are extracted from the integrated circuit database, and the heat dissipation requirement index of the circuit structure of each integrated area is obtained through comprehensive analysis.

[0040] In a specific embodiment, the number of component types refers to the number of different components used in the integrated area. These components together constitute the basic functional units of the circuit. By reasonably selecting the number of component types, the integrity and flexibility of the circuit function can be ensured, and unnecessary component redundancy can be avoided, thereby improving the overall performance of the circuit, which can be obtained by statistics; the component density refers to the number of components per square millimeter, which reflects the integration degree and compactness of the integrated circuit. Integrating more components in a limited space can shorten the connection path between components, reduce signal transmission delay and loss, and improve the operating speed of the circuit. First, the area of the integrated area is measured by a laser rangefinder, then the number of components is observed and counted by a microscope, and then the number of components obtained by statistics is divided by the area of the integrated area to obtain the component density; the wiring density refers to the number of interconnecting lines per square millimeter. The interconnecting lines are the wires connecting each component. A reasonable wiring design can reduce signal interference and noise, improve the transmission quality and integrity of the signal, and thus ensure the stability and reliability of the circuit, which can be calculated by a wiring analysis tool; the package thickness refers to the thickness of the integrated circuit package, that is, the total thickness of the integrated circuit chip and its peripheral protective materials. A more reasonable package thickness can provide better heat dissipation performance and mechanical strength, ensuring the stable operation of the circuit in harsh environments such as high temperature and high pressure, which can be measured by a vernier caliper.

[0041] Furthermore, the heat dissipation requirement index of the circuit structure of each integrated area, the specific numerical expression is: ; Among them, represents the heat dissipation requirement index of the circuit structure of the i-th integrated area, represents the number of component types of the i-th integrated area, represents the critical number of component types, represents the component density of the i-th integrated area, represents the critical component density, and e represents the natural constant. represents the wiring density of the i-th integrated region, represents the critical wiring density, represents the package thickness of the i-th integrated region, represents the critical package thickness, Indicates the influence factor of the circuit structure heat dissipation demand corresponding to the set number of component types, Indicates the influence factor of the circuit structure heat dissipation demand corresponding to the set component density, Indicates the influence factor of the circuit structure heat dissipation demand corresponding to the set wiring density, It represents the heat dissipation demand influencing factor of the circuit structure corresponding to the set package thickness, i represents the number of each integrated area, i=1,2,3,...,m, and m represents the total number of integrated areas.

[0042] The algorithm of this embodiment combines the number of component types, component density, wiring density and package thickness, and comprehensively analyzes to obtain the circuit structure heat dissipation demand index of each integrated area. The increase in the number of component types may affect the distribution of component density. In a limited space, if the number of component types increases, the footprint and connection space required for each component will also increase accordingly, which may reduce the component density; an increase in component density usually means an increase in wiring density, because the connection between components requires more wiring to achieve, and the higher density of component layout will limit the wiring space, making the wiring more dense and complex; there is a certain correlation between wiring density and package thickness. A higher wiring density may lead to an increase in package thickness because more protective materials and packaging structures are required to ensure the stability and reliability of the wiring; and different types of components may require different packaging forms and thicknesses to ensure their normal operation. For example, some high-power or high-frequency components may require thicker packages to provide good heat dissipation and shielding effects. Comprehensive analysis can obtain a more comprehensive circuit structure heat dissipation demand index.

[0043] It should be explained that the present embodiment takes into account four key factors, namely, the number of component types, component density, wiring density, and package thickness of each integrated region, which can reduce waste and redundancy in the production process, thereby improving production efficiency, helping to optimize the layout and wiring of the circuit, reducing defects and failures in the production process, thereby improving the yield rate and product quality, and improving the reliability and stability of the components, thereby extending the service life of the circuit. It can also reduce signal interference and noise, reduce the wiring failure rate, and prevent the circuit from being interfered with and damaged by the external environment, further improving the reliability and stability of the circuit. By standardizing the number of component types, component density, wiring density, and package thickness of each integrated region, ensuring that they are compared at the same level, the fairness and comparability of the evaluation are improved, and at the same time , and The setting can avoid abnormal circuit performance caused by too low component type number, component density, and wiring density. The setting can avoid package quality problems caused by too low package thickness. By weighting the influences of the component type number, component density, wiring density, and package thickness of each integration region, their relative importance in the evaluation index is reflected. Different factor weights can be adjusted according to different requirements, making the formula highly adaptable. It is not difficult to see that the greater the component type number, component density, wiring density, or package thickness, the greater the heat dissipation demand index of the circuit structure. By evaluating the heat dissipation demand index of the circuit structure in each integration region, it helps to reasonably allocate heat dissipation resources, avoid unnecessary waste, design heat dissipation solutions targeted, thereby improving the overall heat dissipation efficiency, reducing the adverse effects of temperature on circuit performance, extending the service life of the entire circuit by reducing the operating temperature of the circuit, helping to improve the energy efficiency ratio of the product, avoiding circuit failure rates caused by poor heat dissipation, thus reducing the number of repairs, and further improving the reliability of the product.

[0044] In a specific embodiment, the value range of the influence factors of the circuit structure heat dissipation demand corresponding to the component type number, component density, wiring density, and package thickness is between 0 and 1, representing the numerical values of the influence degrees of the component type number, component density, wiring density, and package thickness on the circuit structure heat dissipation demand index. Each circuit structure heat dissipation demand influence factor can be obtained from the integrated circuit database. By adjusting the values of the influence factors, the influence degrees of different factors on the final circuit structure heat dissipation demand index can be flexibly adjusted. Their corresponding relationship can be a pre-set mapping relationship. For example, the component type number, component density, wiring density, and package thickness form a mapping set with the weight factors corresponding to the pre-set component type number, component density, wiring density, and package thickness in the integrated circuit database. Substituting the real-time component type number, component density, wiring density, and package thickness into the mapping set to obtain the weight factors corresponding to the component type number, component density, wiring density, and package thickness, and the mapping relationship therein can be a one-to-one or many-to-one relationship.

[0045] It should be explained that in this embodiment, the integrated circuit chip is extremely sensitive to temperature. Excessive temperature will cause the chip performance to decline, resulting in problems such as slow running speed and data processing errors. The increase in static power consumption will generate more heat, and the working temperature will rise accordingly; mechanical stress may change the internal structure of the chip, affect electron migration, and thus affect power consumption and heat generation; the flow rate of the heat dissipation medium directly determines the heat dissipation efficiency. By forming a mapping set, the heat dissipation demand influence factors can be precisely matched according to the specific conditions of these parameters, so as to accurately adjust the heat dissipation strategy, ensure that the chip is always at an appropriate working temperature, and maintain its performance stability.

[0046] Further, the initial heat dissipation strategies for each integrated area are obtained by matching the heat dissipation requirement indexes of the circuit structures in each integrated area. The specific matching process is as follows: The initial heat dissipation strategy includes the heat dissipation channel size and the heat dissipation medium flow rate.

[0047] The heat dissipation requirement indexes of the circuit structures in each integrated area are input into the integrated circuit database to match the heat dissipation channel size and the heat dissipation medium flow rate corresponding to the heat dissipation requirement index intervals of each integrated area.

[0048] Specifically, the heat dissipation requirement indexes of the working states of each integrated area are obtained by processing the integrated circuit working state data. The specific processing process is as follows: The working state data includes the static power consumption, the working temperature, the mechanical stress, and the heat dissipation medium flow rate at each time node.

[0049] The critical static power consumption, the critical working temperature, the critical mechanical stress, and the critical heat dissipation medium flow rate are extracted from the integrated circuit database, and the heat dissipation requirement indexes of the working states of each integrated area are obtained through comprehensive analysis.

[0050] In a specific embodiment, the static power consumption refers to the power consumption of the circuit when it is powered on but not working. By accurately measuring and controlling the static power consumption of each integrated area, the stable operation of the circuit in the low-power state can be ensured, and unnecessary energy loss can be reduced. It can be measured by a power consumption tester; the working temperature refers to the actual temperature of the integrated circuit when it is working. Monitoring and controlling the working temperature can prevent the circuit from overheating and avoid the damage caused by thermal stress to the circuit structure and materials. It can be monitored in real time by a temperature sensor; the mechanical stress refers to the internal stress generated in the integrated circuit during the manufacturing and use processes due to factors such as temperature changes, material differences, and external loads. The control of mechanical stress helps to extend the service life of the circuit and prevent circuit failure caused by stress concentration. It can be measured by a strain gauge; the heat dissipation medium flow rate refers to the flow rate of the gas or liquid medium used for heat dissipation around the integrated circuit. A more reasonable heat dissipation medium flow rate can ensure that the heat generated inside the circuit is taken away in time and keep the temperature of the circuit within a reasonable range. It can be monitored in real time by a flow rate sensor.

[0051] Further, the heat dissipation requirement indexes of the working states of each integrated area are specifically expressed numerically as: ; where represents the heat dissipation requirement index of the i-th integrated area for the working state, represents the static power consumption of the i-th integrated area at the j-th time node, represents the critical static power consumption, represents the working temperature of the i-th integrated area at the j-th time node, represents the critical working temperature, and e represents the natural constant. Denote the mechanical stress at the j-th time node in the i-th integration region, Denote the critical mechanical stress, Denote the flow rate of the heat dissipation medium at the j-th time node in the i-th integration region, Denote the critical flow rate of the heat dissipation medium, Denote the influence factor of the heat dissipation demand in the working state corresponding to the set static power consumption, Denote the influence factor of the heat dissipation demand in the working state corresponding to the set working temperature, Denote the influence factor of the heat dissipation demand in the working state corresponding to the set mechanical stress, Denote the influence factor of the heat dissipation demand in the working state corresponding to the set flow rate of the heat dissipation medium. Here, i represents the number of each integration region, i = 1, 2, 3,..., m, where m represents the total number of integration regions; j represents the number of each time node, j = 1, 2, 3,..., n, where n represents the total number of time nodes.

[0052] The algorithm in this embodiment combines the static power consumption, working temperature, mechanical stress, and flow rate of the heat dissipation medium at each time node, and comprehensively analyzes to obtain the heat dissipation demand index of the working state of each integration region. The heat generated by the static power consumption will directly affect the working temperature of the integrated circuit. As the static power consumption increases, the heat generated inside the integrated circuit also increases, resulting in an increase in the working temperature. At the same time, the increase in the working temperature will lead to a decrease in the transistor threshold voltage, thereby increasing the leakage current. The leakage current will continue to flow through these components when the circuit is in a static or low-power mode and most components are not in a working state, thereby generating static power consumption and increasing the static power consumption; mechanical stress may cause deformation of the internal materials of the integrated circuit, thereby affecting the heat conduction path and heat dissipation efficiency between components. For example, a stress concentration area may form a thermal resistance, resulting in a local increase in the working temperature. Mechanical stress may also cause minor changes in the circuit structure, such as wire breakage or component loosening. These changes may lead to a decline in circuit performance, thereby generating additional power consumption and heat; the increase in the flow rate of the heat dissipation medium can improve the heat dissipation efficiency, thereby reducing the working temperature of the integrated circuit. And the increase in the working temperature may lead to an increase in the heat dissipation demand, thereby requiring a higher flow rate of the heat dissipation medium to maintain the stable operation of the circuit. Through comprehensive analysis, a more comprehensive heat dissipation demand index of the working state can be obtained.

[0053] It should be noted that in this embodiment, four key factors are considered, namely the static power consumption, working temperature, mechanical stress, and heat dissipation medium flow rate at each time node. This helps to improve the operating speed and processing ability of the circuit, reduce the thermal noise inside the circuit, increase the signal-to-noise ratio of the signal, thereby improving the performance of the circuit. It helps to maintain the integrity of the circuit structure, prevent performance degradation caused by structural deformation, and can also improve the heat dissipation efficiency of the circuit, further reduce the working temperature, thus enhancing the performance of the circuit. It can also detect the abnormal state of the circuit in a timely manner, facilitate maintenance and repair, and further improve the heat dissipation efficiency of the circuit. By standardizing the static power consumption, working temperature, mechanical stress, and heat dissipation medium flow rate at each time node, ensuring that they are compared on the same order of magnitude, the fairness and comparability of the evaluation are improved. At the same time 、 and settings can avoid circuit unreliability problems caused by excessive static power consumption, working temperature, and mechanical stress. settings can prevent overheating caused by too low a heat dissipation medium flow rate. By weighting the effects of the static power consumption, working temperature, mechanical stress, and heat dissipation medium flow rate at each time node, their relative importance in the evaluation index is reflected, and the weights of different factors can be adjusted according to different requirements, making the formula highly adaptable. It is not difficult to see that when the static power consumption is larger, or the working temperature is higher, or the mechanical stress is greater, or the heat dissipation medium flow rate is smaller, the working state heat dissipation demand index is larger. By evaluating the working state heat dissipation demand index of each integrated area, it is possible to accurately determine which areas require stronger heat dissipation measures, avoid unnecessary energy consumption, help optimize the design and layout of the heat dissipation system, make it more in line with the actual heat dissipation requirements, effectively reduce the generation of thermal noise, increase the signal-to-noise ratio of the signal, thereby enhancing the performance of the circuit. It can also slow down the aging speed of components, extend the overall life of the circuit, and reduce the circuit failure rate caused by overheating, thus enhancing the stability and reliability of the entire circuit.

[0054] In a specific embodiment, the value range of the influencing factors of the heat dissipation requirements in the working state corresponding to the static power consumption, operating temperature, mechanical stress, and flow rate of the heat dissipation medium is between 0 and 1, which represents the numerical values of the influence degrees of the static power consumption, operating temperature, mechanical stress, and flow rate of the heat dissipation medium on the heat dissipation requirements index in the working state. Each influencing factor of the heat dissipation requirements in the working state can be obtained from the integrated circuit database. By adjusting the values of the influencing factors, the influence degrees of different factors on the heat dissipation requirements index in the final working state can be flexibly adjusted. The corresponding relationship can be a pre-set mapping relationship. For example, the static power consumption, operating temperature, mechanical stress, and flow rate of the heat dissipation medium form a mapping set with the weight factors corresponding to the pre-set static power consumption, operating temperature, mechanical stress, and flow rate of the heat dissipation medium in the integrated circuit database. The real-time static power consumption, operating temperature, mechanical stress, and flow rate of the heat dissipation medium are brought into the mapping set to obtain the weight factors corresponding to the static power consumption, operating temperature, mechanical stress, and flow rate of the heat dissipation medium. The mapping relationship therein can be a one-to-one or many-to-one relationship.

[0055] Further, the initial heat dissipation strategy is triggered according to the heat dissipation requirements index in the working state of each integrated area for heat dissipation. The specific process is as follows: The heat dissipation requirements threshold in the working state is extracted from the integrated circuit database, and the heat dissipation requirements index in the working state of each integrated area is compared with the heat dissipation requirements threshold in the working state. If the heat dissipation requirements index in the working state of a certain integrated area is greater than or equal to the heat dissipation requirements threshold in the working state, heat dissipation is carried out according to the initial heat dissipation strategy of the integrated area. If the heat dissipation requirements index in the working state of a certain integrated area is less than the heat dissipation requirements threshold in the working state, no additional operation is performed.

[0056] Specifically, the circuit heat dissipation effect evaluation value is obtained through comprehensive analysis. The specific analysis process is as follows: Weights are respectively assigned to the heat dissipation requirements index in the working state of each integrated area and the heat dissipation requirements index of the circuit structure, and the weighted heat dissipation requirements index in the working state of each integrated area and the heat dissipation requirements index of the circuit structure are added and then subjected to a hyperbolic sine function operation. The results of the hyperbolic sine function operation are summed to obtain the circuit heat dissipation effect evaluation value, and the circuit heat dissipation effect evaluation value is used to quantify the heat dissipation effect of the circuit.

[0057] Further, the circuit heat dissipation effect evaluation value, the specific numerical expression is: ; Wherein, represents the circuit heat dissipation effect evaluation value, represents the heat dissipation requirements index of the circuit structure of the i-th integrated area, represents the heat dissipation requirements index in the working state of the i-th integrated area, represents the influencing factor of the circuit heat dissipation effect evaluation corresponding to the set heat dissipation requirements index of the circuit structure, represents the influencing factor for evaluating the circuit heat dissipation effect corresponding to the set heat dissipation requirement index for the working state. i represents the number of each integrated area, where i = 1, 2, 3,..., m, and m represents the total number of integrated areas.

[0058] As Figure 3 shown, in a specific embodiment, = 0.3, = 0.4, m = 1. When = 0.1, the functional relationship between the circuit heat dissipation effect evaluation value and the heat dissipation requirement index for the working state is as shown by curve a; when = 0.5, the functional relationship between the circuit heat dissipation effect evaluation value and the heat dissipation requirement index for the working state is as shown by curve b; when = 1, the functional relationship between the circuit heat dissipation effect evaluation value and the heat dissipation requirement index for the working state is as shown by curve c.

[0059] The algorithm of this embodiment combines the heat dissipation requirement index for the working state of each integrated area and the heat dissipation requirement index for the circuit structure, and comprehensively analyzes to obtain the circuit heat dissipation effect evaluation value. The change in the heat dissipation requirement index for the working state will directly affect the heat dissipation requirement index for the circuit structure. For example, when the power consumption of a certain integrated area increases, its heat dissipation requirement will also increase accordingly, thus requiring the circuit structure to make corresponding adjustments in heat dissipation; at the same time, the optimization of the heat dissipation requirement index for the circuit structure can also reduce the heat dissipation requirement index for the working state. For example, by improving the packaging material and heat dissipation design, the heat dissipation efficiency can be improved, thereby reducing the heat dissipation requirement of the integrated area. Through comprehensive analysis, a more comprehensive circuit heat dissipation effect evaluation value can be obtained.

[0060] It should be noted that in this embodiment, two key factors are considered, namely, the heat dissipation requirement index of the working state of each integrated area and the heat dissipation requirement index of the circuit structure. Precise design can be carried out according to the specific heat dissipation requirements of each integrated area, avoiding the situations of overheating or insufficient heat dissipation, which helps to optimize the heat dissipation path, ensure that heat can be quickly and effectively transferred from the integrated area to the heat dissipation device, thereby improving the overall heat dissipation efficiency, enabling support for higher operating frequencies, thus enhancing the overall performance of the circuit. It can also reduce the power consumption of the integrated area, improve the energy efficiency ratio of the circuit, further improve the versatility and flexibility of the circuit, and ensure the stable operation of the circuit under extreme conditions. By weighting the impacts of the heat dissipation requirement index of the working state of each integrated area and the heat dissipation requirement index of the circuit structure, the relative importance of them in the evaluation index is reflected. Different factor weights can be adjusted according to different requirements, making the formula highly adaptable. It is not difficult to see that when the heat dissipation requirement index of the working state or the heat dissipation requirement index of the circuit structure is smaller, the evaluation value of the circuit heat dissipation effect is larger. Among them, the smaller the heat dissipation requirement, the better the heat dissipation effect of the initial heat dissipation strategy, so the larger the evaluation value of the circuit heat dissipation effect. By evaluating the evaluation value of the circuit heat dissipation effect, potential heat dissipation problems can be discovered and solved in a timely manner, ensuring the stable operation of the circuit under various working conditions, helping to timely discover quality problems in the production process, and thus making timely adjustments and optimizations. It helps to select the best circuit layout, component packaging, and heat dissipation strategy, improve production efficiency, and further ensure that the product has good heat dissipation performance during actual use, thereby improving product quality.

[0061] In a specific embodiment, the value range of the influencing factors of the circuit heat dissipation effect corresponding to the heat dissipation requirement index of the working state and the heat dissipation requirement index of the circuit structure is between 0 and 1, representing the numerical values of the influence degrees of the heat dissipation requirement index of the working state and the heat dissipation requirement index of the circuit structure on the evaluation value of the circuit heat dissipation effect. Each influencing factor of the circuit heat dissipation effect can be obtained from the integrated circuit database. By adjusting the values of the influencing factors, the influence degrees of different factors on the final evaluation value of the circuit heat dissipation effect can be flexibly adjusted. Their corresponding relationship can be a pre-set mapping relationship. For example, the heat dissipation requirement index of the working state and the heat dissipation requirement index of the circuit structure form a mapping set with the weight factors corresponding to the pre-set heat dissipation requirement index of the working state and the heat dissipation requirement index of the circuit structure in the integrated circuit database. Substituting the real-time heat dissipation requirement index of the working state and the heat dissipation requirement index of the circuit structure into the mapping set to obtain the weight factors corresponding to the heat dissipation requirement index of the working state and the heat dissipation requirement index of the circuit structure, where the mapping relationship can be a one-to-one or many-to-one relationship.

[0062] Specifically, the heat dissipation effect is evaluated and fed back according to the circuit heat dissipation effect evaluation value. The specific evaluation process is as follows: extract the circuit heat dissipation effect evaluation threshold from the integrated circuit database, compare the circuit heat dissipation effect evaluation value with the circuit heat dissipation effect evaluation threshold. If the circuit heat dissipation effect evaluation value is greater than or equal to the circuit heat dissipation effect evaluation threshold, the circuit heat dissipation effect is evaluated as qualified. If the circuit heat dissipation effect evaluation value is less than the circuit heat dissipation effect evaluation threshold, the circuit heat dissipation effect is evaluated as unqualified and the initial heat dissipation strategy is adjusted.

[0063] Furthermore, adjusting the initial heat dissipation strategy includes: inputting the circuit heat dissipation effect evaluation value into the integrated circuit database to match the heat dissipation channel size compensation value and the heat dissipation medium flow compensation value corresponding to each circuit heat dissipation effect evaluation value range, adding the heat dissipation channel size and the heat dissipation medium flow to the heat dissipation channel size compensation value and the heat dissipation medium flow compensation value respectively to obtain the updated heat dissipation channel size and the updated heat dissipation medium flow, and performing heat dissipation according to the updated heat dissipation channel size and the updated heat dissipation medium flow.

[0064] Refer to Figure 2 As shown, the second aspect of the present invention provides a high-integration hybrid integrated circuit thermal management system, including: a circuit data acquisition module for monitoring the integrated circuit working state data and obtaining the integrated circuit structure data.

[0065] An initial heat dissipation strategy matching module for dividing the integrated circuit into each integrated area, processing the integrated circuit structure data to obtain the circuit structure heat dissipation demand index of each integrated area, and matching the initial heat dissipation strategy of each integrated area according to the circuit structure heat dissipation demand index of each integrated area.

[0066] A working state heat dissipation demand index analysis module for processing the integrated circuit working state data to obtain the working state heat dissipation demand index of each integrated area, and triggering the initial heat dissipation strategy for heat dissipation according to the working state heat dissipation demand index of each integrated area.

[0067] A circuit heat dissipation effect evaluation module for comprehensively analyzing the circuit heat dissipation effect evaluation value according to the working state heat dissipation demand index and the circuit structure heat dissipation demand index of each integrated area, and evaluating and feeding back the heat dissipation effect according to the circuit heat dissipation effect evaluation value.

[0068] An integrated circuit database for storing data related to integrated circuits, including: the number of critical component types, critical component density, critical wiring density, critical package thickness, critical static power consumption, critical operating temperature, critical mechanical stress, critical heat dissipation medium flow rate, impact factors for evaluating the circuit heat dissipation effect corresponding to the set circuit structure heat dissipation requirement index, impact factors for evaluating the circuit heat dissipation effect corresponding to the set operating state heat dissipation requirement index, heat dissipation channel size compensation value, heat dissipation medium flow rate compensation value, and circuit heat dissipation effect evaluation threshold, etc.

[0069] The above content is only an example and explanation of the structure of the present invention. Those skilled in the art of this technology can make various modifications or supplements to the described specific embodiments or use similar ways to replace them. As long as they do not deviate from the structure of the invention or exceed the scope defined by the present invention, they should fall within the protection scope of the present invention.

Claims

1. A thermal management method for a highly integrated hybrid integrated circuit, characterized in that: include: Monitor the working status data of the integrated circuit and obtain the structure data of the integrated circuit; The integrated circuit is divided into regions to obtain various integrated regions, a circuit structure heat dissipation requirement index of each integrated region is obtained according to the integrated circuit structure data processing, and an initial heat dissipation strategy of each integrated region is obtained according to the matching of the circuit structure heat dissipation requirement index of each integrated region; According to the integrated circuit working state data processing, the working state heat dissipation demand index of each integrated area is obtained, and the initial heat dissipation strategy is triggered to dissipate heat according to the working state heat dissipation demand index of each integrated area; According to the working state heat dissipation demand index of each integrated area and the circuit structure heat dissipation demand index of each integrated area, a circuit heat dissipation effect evaluation value is obtained through comprehensive analysis, and the heat dissipation effect is evaluated and fed back according to the circuit heat dissipation effect evaluation value.

2. The highly integrated hybrid integrated circuit thermal management method according to claim 1, characterized in that: The circuit structure heat dissipation requirement index of each integrated region is obtained by processing the integrated circuit structure data, and the specific processing process is as follows: The circuit structure data includes the number of component types, component density, wiring density and package thickness of each integrated area; The critical component type number, critical component density, critical wiring density and critical package thickness are extracted from the integrated circuit database, and the circuit structure heat dissipation demand index of each integrated area is obtained through comprehensive analysis.

3. The highly integrated hybrid integrated circuit thermal management method according to claim 2, characterized in that: The initial heat dissipation strategy of each integrated area is obtained by matching the heat dissipation demand index of the circuit structure of each integrated area. The specific matching process is: The initial heat dissipation strategy includes the heat dissipation channel size and the heat dissipation medium flow rate; The circuit structure heat dissipation demand index of each integrated area is input into the integrated circuit database to match the heat dissipation channel size and heat dissipation medium flow rate of each integrated area corresponding to each circuit structure heat dissipation demand index interval.

4. The highly integrated hybrid integrated circuit thermal management method according to claim 1, characterized in that: The working state heat dissipation requirement index of each integrated region is obtained by processing the working state data of the integrated circuit, and the specific processing process is: The working status data includes static power consumption, working temperature, mechanical stress and heat dissipation medium flow rate at each time node; The critical static power consumption, critical operating temperature, critical mechanical stress and critical heat dissipation medium flow rate are extracted from the integrated circuit database, and the working state heat dissipation demand index of each integrated area is obtained through comprehensive analysis.

5. The thermal management method for a highly integrated hybrid integrated circuit according to claim 4, characterized in that: The initial heat dissipation strategy is triggered according to the heat dissipation demand index of the working state of each integrated area to perform heat dissipation. The specific process is as follows: A working state heat dissipation requirement threshold is extracted from the integrated circuit database, and the working state heat dissipation requirement index of each integrated area is compared with the working state heat dissipation requirement threshold. If the working state heat dissipation requirement index of an integrated area is greater than or equal to the working state heat dissipation requirement threshold, heat dissipation is performed according to the initial heat dissipation strategy of the integrated area. If the working state heat dissipation requirement index of an integrated area is less than the working state heat dissipation requirement threshold, no additional operation is performed.

6. The highly integrated hybrid integrated circuit thermal management method according to claim 4, characterized in that: The comprehensive analysis obtains the circuit heat dissipation effect evaluation value, and the specific analysis process is as follows: The working state heat dissipation requirement index and the circuit structure heat dissipation requirement index of each integrated area are weighted respectively, and the weighted working state heat dissipation requirement index and circuit structure heat dissipation requirement index of each integrated area are added and subjected to sine hyperbolic function operation, and the results of the sine hyperbolic function operation are summed to obtain a circuit heat dissipation effect evaluation value, which is used to quantify the heat dissipation effect of the circuit.

7. The highly integrated hybrid integrated circuit thermal management method according to claim 6, characterized in that: The heat dissipation effect evaluation and feedback are performed according to the circuit heat dissipation effect evaluation value, and the specific evaluation process is as follows: A circuit heat dissipation effect evaluation threshold is extracted from the integrated circuit database, and the circuit heat dissipation effect evaluation value is compared with the circuit heat dissipation effect evaluation threshold. If the circuit heat dissipation effect evaluation value is greater than or equal to the circuit heat dissipation effect evaluation threshold, the circuit heat dissipation effect is evaluated as qualified; if the circuit heat dissipation effect evaluation value is less than the circuit heat dissipation effect evaluation threshold, the circuit heat dissipation effect is evaluated as unqualified and the initial heat dissipation strategy is adjusted.

8. The thermal management method of a highly integrated hybrid integrated circuit according to claim 7, characterized in that: The adjusting the initial heat dissipation strategy includes: The circuit heat dissipation effect evaluation value is input into the integrated circuit database to match the heat dissipation channel size compensation value and the heat dissipation medium flow compensation value corresponding to each circuit heat dissipation effect evaluation value interval, and the heat dissipation channel size and the heat dissipation medium flow are added to the heat dissipation channel size compensation value and the heat dissipation medium flow compensation value respectively to obtain the updated heat dissipation channel size and the updated heat dissipation medium flow, and heat is dissipated according to the updated heat dissipation channel size and the updated heat dissipation medium flow.

9. The highly integrated hybrid integrated circuit thermal management method according to claim 6, characterized in that: The specific numerical expression of the circuit heat dissipation effect evaluation value is: ； in, Indicates the evaluation value of the circuit heat dissipation effect, represents the circuit structure heat dissipation requirement index of the i-th integrated area, represents the working state heat dissipation demand index of the i-th integrated area, Indicates the circuit heat dissipation effect evaluation impact factor corresponding to the set circuit structure heat dissipation demand index, It represents the circuit heat dissipation effect evaluation impact factor corresponding to the set working state heat dissipation demand index, i represents the number of each integrated area, i=1,2,3,...,m, m represents the total number of integrated areas.

10. A system using the highly integrated hybrid integrated circuit thermal management method according to any one of claims 1 to 9, characterized in that: include: A circuit data acquisition module is used to monitor the working status data of the integrated circuit and obtain the structure data of the integrated circuit; An initial heat dissipation strategy matching module is used to divide the integrated circuit into regions to obtain various integrated regions, obtain the circuit structure heat dissipation requirement index of each integrated region according to the integrated circuit structure data processing, and obtain the initial heat dissipation strategy of each integrated region according to the circuit structure heat dissipation requirement index of each integrated region; A working state heat dissipation requirement index analysis module is used to obtain the working state heat dissipation requirement index of each integrated area according to the integrated circuit working state data processing, and trigger the initial heat dissipation strategy for heat dissipation according to the working state heat dissipation requirement index of each integrated area; The circuit heat dissipation effect evaluation module is used to obtain a circuit heat dissipation effect evaluation value by comprehensive analysis based on the heat dissipation demand index of the working state of each integrated area and the heat dissipation demand index of the circuit structure of each integrated area, and to evaluate the heat dissipation effect and provide feedback based on the circuit heat dissipation effect evaluation value.

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