Heat dissipation structure and terminal with same

Abstract

The invention relates to the field of terminal heat dissipation, particularly provides a heat dissipation structure and a terminal with the heat dissipation structure, and aims to solve the problem of insufficient heat dissipation capability of existing terminal equipment. In order to achieve the purpose, the terminal comprises a first side and a second side which are oppositely arranged and further comprises a first structural member, a heat dissipation component and a heating component, the first structural member and the first side define a first cavity, the first structural member and the second side define a second cavity, a first through hole is formed in the first structural member, a first heat conductor is arranged in the first through hole, and a second heat conductor is arranged in the second through hole. The heat dissipation component is arranged in the first cavity, the heating component is arranged in the second cavity, and the heating component is in heat conduction connection with the heat dissipation component through the first heat conductor. By means of the arrangement mode, heat dissipation of the whole machine can be more uniform, the heat dissipation efficiency is higher, and the problem that the heat dissipation capacity of the terminal is insufficient due to heat accumulation is avoided.

Description

Technical Field

[0001] This application relates to the technical field of terminal heat dissipation, and specifically provides a heat dissipation structure and a terminal having the heat dissipation structure. Background Art

[0002] In modern terminal devices, such as smart phones and tablet computers, the integration of processors and other high-power components is getting higher and higher, so more and more heat is generated. Due to the size and thickness limitations of the device, the heat dissipation capacity of the back shell is limited. This means that some heat may accumulate in the back shell, resulting in too high temperatures in some areas of the back shell.

[0003] This phenomenon of uneven temperature may cause a series of problems. First, the high-temperature area may have a negative impact on the performance of the device and the working efficiency of the processor, and even lead to performance degradation or crashes. Second, the high temperature may also have an adverse effect on the battery life, reducing the battery capacity, slowing down the charging speed, and even causing the battery to overheat, expand or explode.

[0004] Correspondingly, there is a need in the art for a new heat dissipation structure and a terminal having the heat dissipation structure to solve the above problems. Application Content

[0005] This application aims to solve the above technical problems, that is, to solve the problem of insufficient heat dissipation capacity of existing terminal devices.

[0006] This application provides a heat dissipation structure, characterized in that the heat dissipation structure includes: a first side and a second side arranged opposite to each other; a first structural member, the first structural member and the first side enclose a first cavity, and enclose a second cavity with the second side, the first structural member is provided with a first through hole, and a first heat conductor is arranged in the first through hole; a heat dissipation component, the heat dissipation component is arranged in the first cavity; a heat generating component, the heat generating component is arranged in the second cavity, and the heat generating component is connected to the heat dissipation component through the first heat conductor.

[0007] When the device is working, the heat-generating components will generate a large amount of heat. The heat-dissipating components are arranged in the first cavity and are connected to the heat-generating components in the second cavity through the first heat conductor in the first through hole, which can quickly and efficiently absorb the heat generated by the heat-generating components, conduct the absorbed heat to the area of the first cavity, that is, the area far from the heat-generating components. Due to the blockage of the first structural member, very little heat transferred to the first cavity will return to the second cavity, so as to avoid heat concentration. The heat generated by the heat-generating components that is not transferred to the first cavity will radiate to the corresponding area of the second cavity, so that heat dissipation can be carried out at both the first cavity and the second cavity, thereby dispersing the heat into the cavities of the entire heat dissipation structure, and then being transferred to the outside air by the first side, the first structural member and the second side of the external part. The overall heat dissipation is more uniform and the heat dissipation efficiency is higher, avoiding the problem of insufficient heat dissipation capacity of the terminal due to heat accumulation.

[0008] In an alternative technical solution of the above heat dissipation structure, the heat dissipation structure further includes a thermoelectric cooler, the thermoelectric cooler is arranged in the first cavity, and the cold end of the thermoelectric cooler is connected to the heat-dissipating component.

[0009] In the case of adopting the above technical solution, the heat-dissipating component can be cooled by the thermoelectric cooler to take away the heat of the heat-dissipating component. Since the thermoelectric cooler can perform active heat dissipation, the heat transfer efficiency from the second cavity to the first cavity can be adjusted by controlling the on / off and power of the thermoelectric cooler. Furthermore, through active adjustment, the desired chip temperature can be achieved. For example, by adjusting the power and duty cycle of the thermoelectric cooler, the heat dissipation between the first cavity and the second cavity can be balanced, thereby improving the heat dissipation efficiency and avoiding a series of problems caused by overheating of the terminal.

[0010] In an alternative technical solution of the above heat dissipation structure, the first side is a display screen, the second side is a back shell, and the hot end of the thermoelectric cooler faces the second side.

[0011] In the case of adopting the above technical solution, the heat can be removed from the display screen area, reducing the phenomenon of local hot spots on the display screen, preventing problems such as unresponsive touch and color distortion caused by overheating of the display screen area, and affecting the user's operation and viewing experience. In addition, since the display screen is one of the core components of a mobile phone, too high a temperature may have an adverse impact on its lifespan and performance. The above setting can effectively control the temperature of the display screen, protect the display screen from overheating, and extend its service life. On the other hand, since the internal space of terminals such as mobile phones is limited, this setting method is beneficial to arranging the thermoelectric cooler between the heat-dissipating component and the first structural member, which can better utilize the internal space and is also beneficial to dissipating heat in a larger range.

[0012] In an alternative technical solution of the above terminal heat dissipation structure, the hot end of the semiconductor refrigerator is connected to the first structural member.

[0013] In the case of adopting the above technical solution, heat dissipation through the first structural member can utilize the metal frame as a heat dissipation surface, which can provide a larger heat dissipation area and improve the heat dissipation efficiency.

[0014] In an alternative technical solution of the above heat dissipation structure, the hot end and the first structural member are connected through a second heat conductor.

[0015] In the case of adopting the above technical solution, the second heat conductor can bond the semiconductor refrigerator and the heat dissipation component to the first structural member, and can also play a role in heat conduction to transfer the heat at the hot end to the first structural member, and then the first structural member dissipates the heat to the external air.

[0016] In an alternative technical solution of the above heat dissipation structure, the heat dissipation component and the first structural member are connected through a third heat conductor.

[0017] In the case of adopting the above technical solution, if the semiconductor refrigerator is turned off, the heat dissipation component can transfer the heat to the first structural member through the third heat conductor, thereby improving the heat dissipation efficiency and the heat dissipation area.

[0018] In an alternative technical solution of the above heat dissipation structure, the heat generating component includes a circuit board and a processor integrated on the circuit board, and the processor is connected to the heat dissipation component through the first heat conductor.

[0019] In the case of adopting the above technical solution, the circuit board and the processor can be cooled.

[0020] In an alternative technical solution of the above heat dissipation structure, the heat dissipation structure further includes a shielding cover, the shielding cover is disposed on the circuit board and covers the processor, a second through hole is provided on the shielding cover, a fourth heat conductor is provided in the second through hole, and the processor is connected to the first heat conductor through the fourth heat conductor.

[0021] In the case of adopting the above technical solution, electromagnetic shielding and physical protection can be provided for the processor, and on this premise, the heat generated by the processor can be transferred to the heat dissipation component through the fourth heat conductor and the first heat conductor, avoiding blocking the heat transfer.

[0022] In an alternative technical solution of the above heat dissipation structure, the first heat conductor is made of a metal material and is welded to the heat dissipation component.

[0023] In the case of adopting the above technical solution, it is possible to minimize the contact thermal resistance between the first heat conductor and the heat dissipation component on the basis of ensuring the connection strength with the heat dissipation component, thereby improving the heat conduction effect.

[0024] In an alternative technical solution of the above heat dissipation structure, the heat generating component includes a circuit board and a processor integrated on the circuit board. The processor is connected to the heat dissipation component through the first heat conductor. The heat dissipation structure further includes a temperature sensor disposed on the circuit board and electrically connected to the processor.

[0025] In the case of adopting the above technical solution, it is possible to provide a threshold for turning on the semiconductor refrigerator. For example, when the temperature monitored by the temperature sensor is greater than the temperature threshold, the semiconductor refrigerator is controlled to be powered on, and the rest of the states are in the off state. Due to the characteristics of the semiconductor refrigerator, after the hot end reaches thermal saturation, the COP (Coefficient of Performance, the ratio of the cooling capacity (unit: watt) to the power consumed (unit: watt)) will decrease significantly. Therefore, by reasonably utilizing the heat capacity of the hot end of the semiconductor refrigerator and adopting PWM (Pulse Width Modulation) to control the intermittent working mode of the semiconductor refrigerator, the energy efficiency ratio of the semiconductor refrigerator can be improved and the energy consumption of the semiconductor refrigerator can be reduced.

[0026] On the other hand, the present application also provides a terminal, which includes the heat dissipation structure described in any of the above embodiments. Among them, the first structural member is a middle frame. After the terminal has the above heat dissipation structure, the heat equalization ability of the whole machine can be improved, heat dissipation can be realized on both the front and back of the terminal, and the heat dissipation efficiency can be improved. The problem of insufficient heat dissipation capacity of the whole machine caused by heat accumulation is avoided. Description of the Drawings

[0027] The following describes the alternative embodiments of the present application with reference to the accompanying drawings. In the drawings:

[0028] Figure 1 is an exploded view of the structure of the terminal of the present application;

[0029] Figure 2 is a cross-sectional view of the structure of the terminal of the present application;

[0030] Figure 3 is a partial structural schematic diagram of the terminal of the present application;

[0031] Figure 4 is a schematic diagram of the power supply structure of the semiconductor refrigerator of the terminal of the present application;

[0032] Figure 5 is a curve graph of chip temperature - time under different duty cycle states.

[0033] Description of the reference numerals:

[0034] 10 - Display screen; 11 - First structural member; 111 - First through - hole; 112 - Partition; 113 - Outer frame; 12 - Rear case; 20 - First cavity; 21 - Second cavity; 30 - First heat conductor; 40 - Heat dissipation component; 411 - Circuit board; 412 - SOC; 41 - Heat - generating component; 42 - Semiconductor refrigerator; 31 - Second heat conductor; 32 - Third heat conductor; 50 - Shielding cover; 501 - Second through - hole; 33 - Fourth heat conductor; 60 - Temperature sensor; 70 - PMU. Detailed implementation manners

[0035] The following describes the alternative implementation manners of the present application with reference to the accompanying drawings. Those skilled in the art should understand that these implementation manners are only used to explain the technical principle of the present application and are not intended to limit the protection scope of the present application. Those skilled in the art can adjust them as needed to adapt to specific application scenarios.

[0036] It should be noted that in the description of the present application, the terms "first", "second", and "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. In addition, it should also be noted that in the description of the present application, unless otherwise clearly specified and limited, the terms "connected" and "coupled" should be understood in a broad sense. For example, it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. For those skilled in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.

[0037] The terminal described in the present application can be, for example, a mobile device, a computer, or an in - vehicle device built into a mobile vehicle, etc., or any combination of the above. In some embodiments, the mobile device can include a mobile phone, a smart home device, a wearable device, a smart mobile device, a virtual reality device, etc., or any combination of the above.

[0038] Figure 1 An exploded view of a terminal device is shown, in which the spatial coordinate system of the terminal is shown in the figure. The x - axis direction is the thickness direction of the terminal, the y - axis direction is the length direction of the terminal, and the z - axis direction is the width direction of the terminal. Figure 2 A cross - sectional view of the terminal device is shown. Figure 3The partial structure of the terminal device is shown. The terminal includes a heat dissipation structure, which includes a first side 10 and a second side 12 oppositely arranged in the x-axis direction, and also includes a heat dissipation component 40, a heat generating component 41, and a first structural member 11 located between the first side and the second side in the x-axis direction. The first structural member 11 and the first side enclose a first cavity 20, and enclose a second cavity 21 with the second side. A first through hole 111 is provided on the first structural member 11, and a first heat conductor 30 is provided in the first through hole 111. The heat dissipation component 40 is arranged in the first cavity 20, and the heat generating component 41 is arranged in the second cavity 21. The heat generating component 41 is thermally connected to the heat dissipation component 40 through the first heat conductor 30. Optionally, the above-mentioned first structural member is the middle frame of the terminal.

[0039] Possibly, the heat generating component 41 of the present application includes a circuit board 411 and a processor 412 integrated on the circuit board 411. The processor is connected to the heat dissipation component 40 through the first heat conductor 30. The processor can be one or more chips. Optionally, the processor is a system-on-chip (SOC). It can be understood that in other embodiments, the processor can be other chips, such as a baseband chip, a coprocessor chip, an RF chip (full English name: Radio Frequency Chip), a touch screen controller chip, a Memory (random access memory), a wireless communication chip, and a power management chip, etc., which are not limited herein. It should be noted that the above-mentioned heat generating component 41 is only an optional embodiment. In other possible embodiments, the heat generating component 41 can also be a battery, etc. For the convenience of description, the heat generating component 41 of the present application will be introduced by taking the circuit board 411 and the SOC 412 integrated on the circuit board 411 as an example in the following text.

[0040] Possibly, the heat dissipation component 40 of the present application is a VC vapor chamber, a heat pipe, a heat conductive foam, etc. As long as it can dissipate heat, its specific form can be adjusted, and these adjustments do not deviate from the principle of the present application and are all within the protection scope of the present application. Among them, in order to achieve better heat dissipation, the size of the heat dissipation component 40 can be reasonably adjusted according to the actual size of the terminal. For example, the area of the heat dissipation component 40 projected orthographically on the first side is greater than half of the area of the first side, or the length of the heat dissipation component 40 in the y-axis direction is greater than half of the length of the first side in the y-axis direction, and the length of the heat dissipation component 40 in the z-axis direction is greater than half of the length of the first side in the z-axis direction, etc.

[0041] Since the circuit board 411 and the SOC 412 are disposed in the second cavity 21 formed by enclosing the second side and the first structural member 11, considering aspects such as heat dissipation, signal transmission, and impact, the first side can be the display screen 10, and the second side can be the back shell 12. Among them, the display screen 10 plays a display role and can be various OLED (Organic Light-Emitting Diode) or LCD (Liquid Crystal Display) type screens; among them, the first side and the second side can be selected according to specific applications and requirements. For example, the terminal can also adopt a double-sided screen design. In this case, both the first side and the second side are display screens; or the first side is a display screen and the second side is a touch panel, etc. For the convenience of description, in the following text application, the first side will be described by taking the display screen 10 as an example, and the second side will be described by taking the back shell 12 as an example.

[0042] It should be noted that the first structural member 11 is a structural framework connecting the display screen 10 and the back shell 12, and can play a role of support and fixation. As a possible implementation manner, the first structural member 11 includes a partition plate 112 and an annular outer frame 113. The outer periphery of the partition plate 112 is connected to the middle of the inner ring of the outer frame 113 to block the hollow part of the outer frame 113. The first through hole 111 is provided on the partition plate 112. In this case, the partition plate 112, the display screen 10, and the outer frame 113 enclose to form the first cavity 20 on the side of the partition plate 112 close to the display screen 10, and the partition plate 112, the back shell 12, and the outer frame 113 enclose to form the second cavity 21 on the side of the partition plate 112 close to the back shell 12; of course, the above introduction is not restrictive, and its specific structural form can be adjusted. For example, connecting the outer periphery of the partition plate 112 to the middle of the inner ring of the outer frame 113 is replaced by connecting the outer periphery of the partition plate 112 to the edge of the outer frame 113, so that only one side of the first structural member 11 forms a groove-like structure, and this side is connected to the display screen 10 to form the first cavity 20; the back shell 12 is a groove-like structure, and the back shell 12 is connected to the other side of the first structural member 11 to form the second cavity 21.

[0043] The SOC 412 is the main heat-generating component 41, and the heat it dissipates is transferred by the first heat conductor 30 to the heat dissipation component 40, causing the heat to be transferred from the second cavity 21 to the first cavity 20. Due to the blockage of the first structural member 11, most of the heat dissipated by the heat dissipation component 40 will not return to the second cavity 21 to avoid heat concentration. The heat dissipation component 40 dissipates the heat from the first cavity 20 away from the heat-generating component 41 to the outside. The heat of the circuit board 411 and the residual heat of the SOC 412 are dissipated to the outside in the second cavity 21, that is, transferred to the outside air through the first side, the first structural member 11, and the second side that form the external part of the terminal device, making the overall heat dissipation more uniform and the heat dissipation efficiency higher, and avoiding the problem of insufficient heat dissipation capacity caused by heat accumulation.

[0044] As a possible implementation manner, the heat dissipation structure of the present application further includes a thermoelectric cooler 42 (TEC, the full English name is Thermoelectric Cooler). The thermoelectric cooler 42 is disposed in the first cavity 20, and its cold end is connected to the heat dissipation component 40. The cold end can be combined with the heat dissipation component 40 through a fusion technology, and specifically, thermal conductive glue or silicone filling can be used, etc.

[0045] It can be understood that the thermoelectric cooler 42 is a refrigeration technology based on the thermoelectric effect, and the cooling effect is achieved by the inflow and outflow of current. The thermoelectric effect refers to the fact that when current passes through the contact of two different materials, heat transfer and voltage generation will occur. This is due to the difference in conductivity of different materials. In the thermoelectric cooler 42, the materials usually used are semiconductor materials with positive and negative thermoelectric coefficients, such as Bismuth Telluride. The inside of the thermoelectric cooler 42 is composed of multiple positive and negative thermoelectric materials connected alternately to form a thermoelectric module (Thermoelectric Module). When current passes through the thermoelectric module, a temperature difference will be generated between the positive electrode (P-type material) and the negative electrode (N-type material). According to the Peltier effect, when current flows through, heat will be absorbed from one side of the thermoelectric material and transferred to the other side, thereby achieving cooling or heating. Specifically, when current passes through the thermoelectric cooler 42, the side of the positive electrode (cold end) will absorb heat, while the side of the negative electrode (hot end) will release heat. When current flows in from the cold end, the cold end will cool down, thereby achieving the cooling effect.

[0046] With the above setting method, the heat dissipation component 40 can be cooled by the semiconductor refrigerator 42 to remove the heat of the heat dissipation component 40. Since the semiconductor refrigerator 42 can perform active heat dissipation, the heat transfer efficiency from the second cavity 21 to the first cavity 20 can be adjusted by controlling the on / off and power of the semiconductor refrigerator 42. Furthermore, through active adjustment, the desired chip temperature can be achieved. For example, by adjusting the power and duty cycle of the semiconductor refrigerator 42, the heat dissipation between the first cavity 20 and the second cavity 21 can be balanced, thereby improving the heat dissipation efficiency and avoiding a series of problems caused by overheating of the terminal.

[0047] As a possible implementation, the hot end of the semiconductor refrigerator 42 faces the second side, so that the hot end faces away from the display screen 10. With this setting method, the heat can be removed from the display screen 10 area, reducing the phenomenon of local hot spots on the display screen 10 and preventing problems such as unresponsive touch and color distortion caused by overheating in the display screen 10 area, which may affect the user's operation and viewing experience. In addition, since the display screen 10 is one of the core components of the mobile phone, too high a temperature may have an adverse impact on its lifespan and performance. The above setting can effectively control the temperature of the display screen 10, protect the display screen 10 from overheating, and extend its service life. On the other hand, since the space inside the terminal such as the mobile phone is limited, this setting method is conducive to arranging the semiconductor refrigerator 42 between the heat dissipation component 40 and the first structural member 11, which can better utilize the internal space of the terminal and also facilitate the dissipation of heat over a larger area.

[0048] As a possible implementation, the hot end of the semiconductor refrigerator 42 is connected to the first structural member 11. Further, the hot end and the first structural member 11 are connected through a second heat conductor 31. Specifically, the second heat conductor 31 can be thermal gel, thermal grease, thermal patch, etc. The second heat conductor 31 can bond the semiconductor refrigerator 42 and the heat dissipation component 40 to the first structural member 11 and also play a role in heat conduction to transfer the heat at the hot end to the first structural member 11, and then the heat is dissipated to the external air by the first structural member 11. Among them, when dissipating heat through the first structural member 11, the metal frame can be used as the heat dissipation surface, which can provide a larger heat dissipation area and improve the heat dissipation efficiency.

[0049] As a possible implementation, the heat dissipation component 40 is also connected to the first structural member 11 through a third heat conductor 32. Among them, the third heat conductor 32 and the semiconductor refrigerator 42 can be arranged at intervals in the y-axis direction. The third heat conductor 32 can be a thermal gel, thermal grease, thermal patch, etc., which can play a role in bonding and heat conduction. Among them, the contact area between the third heat conductor 32 and the heat dissipation component 40 can be designed according to the actual situation. For example, the contact area is greater than one-third of the area of the heat dissipation component 40. The above settings can enable the heat dissipation component 40 to transfer heat to the first structural member 11 through the third heat conductor 32 when the semiconductor refrigerator 42 is turned off, thereby improving the heat dissipation efficiency and heat dissipation area.

[0050] As a possible implementation, the heat dissipation structure further includes a shielding cover 50. The shielding cover 50 is disposed on the circuit board 411 and covers the SOC 412. A second through hole 501 is provided on the shielding cover 50, and a fourth heat conductor 33 is provided in the second through hole 501. The SOC 412 is connected to the first heat conductor 30 through the fourth heat conductor 33. The fourth heat conductor 33 can be a thermal gel, thermal grease, thermal patch, etc. Among them, the shielding cover 50 is a metal cover for shielding electromagnetic radiation or protecting electronic devices, and it is used to encapsulate the SOC 412. Its main function is to provide electromagnetic shielding and physical protection, which can ensure that the SOC 412 and the surrounding electronic components are fully electromagnetically shielded to avoid interference and leakage. In the case of providing the shielding cover 50, in order to ensure the transfer of the heat dissipated by the SOC 412, the second through hole 501 is designed on the shielding cover 50 so that the heat can be directly transferred to the heat dissipation component 40 through the fourth heat conductor 33 and the first heat conductor 30.

[0051] As a possible implementation, the first heat conductor 30 can be selected as a metal material, which is a high thermal conductivity material. For example, it can be pure copper, high thermal conductivity aluminum alloy, copper alloy, etc. Among them, the high thermal conductivity aluminum alloy can be 6061 aluminum alloy, 6063 aluminum alloy, 6082 aluminum alloy or 7075 aluminum alloy, etc. Its specific model can be evaluated and selected according to specific applications and requirements. The specific implementation manner of connecting the first heat conductor 30 to the heat dissipation component 40 can be fusion welding or laser spot welding, etc., so as to minimize the contact thermal resistance between the first heat conductor 30 and the heat dissipation component 40 on the basis of ensuring the connection strength between them and improve the heat conduction effect.

[0052] Among them, there may be a gap between the heat dissipation component 40 of the present application and the display screen 10, or they may be in direct contact. Similarly, there may be a gap between the circuit board 411 and the back shell 12, or they may be in direct contact. The present application does not limit this.

[0053] As can be seen from the above introduction, the heat dissipated by the circuit board 411 and the SOC 412 of the present application is divided into two paths. One path is transferred from the back shell 12 to the external air, and the other path is through the fourth heat conductor 33 - the first heat conductor 30 - the heat dissipation component 40. The heat dissipated by the heat dissipation component 40 is further divided into three paths. The first path is sequentially transferred from the cold end of the thermoelectric cooler 42, the hot end of the thermoelectric cooler 42, the second heat conductor 31, and the first structural member 11 to the external air. The second path is transferred to the external air through the display screen 10. The third path is transferred to the first structural member 11 through the third heat conductor 32, and then transferred to the external air through the first structural member 11. Thus, it can be seen that the terminal of the present application can achieve uniform heat dissipation of the whole machine, making the overall heat of the terminal more uniform, avoiding the problem of insufficient heat dissipation capacity of the terminal due to heat accumulation, improving the overall efficiency value, and keeping the terminal within a comfortable temperature range all the time.

[0054] As Figure 4 shown, as a possible implementation manner, the heat dissipation structure of the present application further includes a temperature sensor 60 (NTC, full English name Negative Temperature Coefficient). The temperature sensor 60 is disposed on the circuit board 411 and is electrically connected to the SOC 412. For example, if the temperature sensor 60 outputs an analog voltage signal, the SOC 412 converts the analog voltage signal into a digital signal for processing and reading to achieve the purpose of detecting the temperature at the circuit board 411. Among them, a PMU 70 (full English name Phasor Measurement Unit, power management unit) is integrated on the circuit board 411 of the present application, which is a module for managing and regulating the power supply. It can provide power to the thermoelectric cooler 42 and adjust the voltage and current of the power supply as needed, and it supports the PWM mode and is connected to the SOC 412. Among them, the thermoelectric cooler 42 of the present application can be connected to the PMU 70 on the circuit board 411 through a wire, and the wire can be arranged through the first structural member 11. In the SOC 412 system, the duty cycle of the power-on of the thermoelectric cooler 42 can be adjusted by PWM, and through the intermittent working mode of the thermoelectric cooler 42, the working efficiency of the thermoelectric cooler 42 can be improved. In addition, the temperature sensor 60 provides a threshold for the activation of the thermoelectric cooler 42 by detecting the board temperature. For example, when the temperature monitored by the temperature sensor 60 is greater than the temperature threshold, the thermoelectric cooler 42 is controlled to be powered on, and the rest of the states are in the off state. Due to the characteristics of the thermoelectric cooler 42, the COP value will decrease extremely after the hot end is thermally saturated. Therefore, the heat capacity of the hot end of the thermoelectric cooler 42 is reasonably utilized, and the PWM control is used to make the thermoelectric cooler 42 work in an intermittent mode to improve the energy efficiency ratio of the thermoelectric cooler 42 and reduce the energy consumption of the thermoelectric cooler 42.

[0055] As Figure 5As shown, it presents the temperature-time curve of the SOC412 chip with different duty cycles under a terminal load of 4W. In this case, the qualified standard is that the chip temperature is controlled below 50 degrees Celsius. It can be seen from the figure that by adopting the terminal structure of the present application, the chip temperature can be controlled below 45 degrees Celsius, and the heat dissipation effect is relatively significant. Among them, when the terminal thermal load is in the state of 4 - 7W and the duty cycle is 75%, the energy efficiency ratio of the semiconductor cooler 42 is the highest, which can effectively improve the working efficiency of the semiconductor cooler 42 and enhance the refrigeration capacity of the system.

[0056] In summary, through the above terminal structure, the heat equalization ability of the whole machine can be improved, heat dissipation can be achieved both at the front and back of the terminal, and the heat dissipation efficiency can be increased. It avoids the problem of insufficient heat dissipation capacity of the whole machine caused by heat accumulation.

[0057] It should be noted that the above embodiments are only used to illustrate the principle of the present application and are not intended to limit the protection scope of the present application. Without departing from the principle of the present application, those skilled in the art can adjust the above structure so that the present application can be applied to more specific application scenarios.

[0058] So far, the technical solution of the present application has been described in combination with the optional embodiments shown in the drawings. However, it is easy for those skilled in the art to understand that the protection scope of the present application is obviously not limited to these specific embodiments. Without departing from the principle of the present application, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will fall within the protection scope of the present application.

Claims

1. A heat dissipation structure, characterized in that, the heat dissipation structure includes: a first side and a second side arranged oppositely; a first structural member, the first structural member and the first side enclose a first cavity, and enclose a second cavity with the second side, the first structural member is provided with a first through hole, and a first heat conductor is arranged in the first through hole; a heat dissipation component, the heat dissipation component is arranged in the first cavity; a heat generating component, the heat generating component is arranged in the second cavity, and the heat generating component is connected to the heat dissipation component through the first heat conductor.

2. The heat dissipation structure according to claim 1, characterized in that, the heat dissipation structure further includes a thermoelectric cooler, the thermoelectric cooler is arranged in the first cavity, and the cold end of the thermoelectric cooler is connected to the heat dissipation component.

3. The heat dissipation structure according to claim 2, characterized in that, the first side is a display screen, the second side is a back shell, and the hot end of the thermoelectric cooler faces the second side.

4. The heat dissipation structure according to claim 3, characterized in that, the hot end of the thermoelectric cooler is connected to the first structural member.

5. The heat dissipation structure according to claim 4, characterized in that, the hot end and the first structural member are connected through a second heat conductor.

6. The heat dissipation structure according to any one of claims 2 to 5, characterized in that, the heat dissipation component and the first structural member are connected through a third heat conductor.

7. The heat dissipation structure according to claim 1, characterized in that, the heat generating component includes a circuit board and a processor integrated on the circuit board, and the processor is connected to the heat dissipation component through the first heat conductor.

8. The heat dissipation structure according to claim 7, characterized in that, the heat dissipation structure further includes a shielding cover, the shielding cover is arranged on the circuit board and covers the processor, the shielding cover is provided with a second through hole, and a fourth heat conductor is arranged in the second through hole, and the processor is connected to the first heat conductor through the fourth heat conductor; and / or the first heat conductor is made of a metal material, and the first heat conductor is connected to the heat dissipation component by welding.

9. The heat dissipation structure according to any one of claims 2 to 5, characterized in that, the heat generating component includes a circuit board and a processor integrated on the circuit board, the processor is connected to the heat dissipation component through the first heat conductor, the heat dissipation structure further includes a temperature sensor, the temperature sensor is arranged on the circuit board and is electrically connected to the processor.

10. A terminal, characterized in that, the terminal includes the heat dissipation structure according to any one of claims 1 to 9, wherein the first structural member is a middle frame.

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