Electronic module, preparation method of electronic module and electronic equipment
By stacking electronic devices in the electronic module and using a heat dissipation network of metal wires and metal layers, the existing storage module has been solved, and high capacity density and good heat dissipation performance have been achieved.
Patent Information
- Application Number
- CN202311695837.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-11
- Publication Date
- 2025-06-13
AI Technical Summary
The existing storage modules have complex structures, high cost and low miniaturization, making it difficult to meet the needs of high capacity density.
By stacking at least two electronic devices in the electronic module, the first metal wire and the second metal wire are used to achieve electrical connection, simplify the structure, improve the degree of miniaturization, and improve the heat dissipation ability through the heat dissipation network of the first metal layer and the second metal layer.
The structure of electronic modules is simplified, the degree of miniaturization is improved and the cost is reduced, while the heat dissipation capacity and integration are improved, meeting the needs of high capacity density.
Smart Images
Figure CN120152301A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the technical field of electronic devices, and particularly to an electronic module, a preparation method of the electronic module, and an electronic device. Background Art
[0002] The storage module is an important component structure in an electronic device, and the capacity of the storage module has an important impact on the performance of the electronic device. With the development of electronic device technology, the demand for the capacity of the storage module is also increasing.
[0003] Traditional storage modules are implemented in the form of memory sticks or by directly soldering on-board particles onto the board. In order to achieve higher capacity density, the capacity density can be improved by changing from traditional 2D to 3D vertical stacking. In the prior art, in the process of forming a vertically stacked storage module, a carrier board is required. Specifically, memory chips are mounted on the carrier board and then stacked. For example, the carrier board can be a silicon substrate or a circuit board. Therefore, the structure of the stacked storage module in the prior art is relatively complex, the cost is high, and the degree of miniaturization is low. Summary of the Invention
[0004] This application provides an electronic module, a preparation method of the electronic module, and an electronic device, which simplifies the structure of the electronic module, improves the degree of miniaturization of the electronic module, and is beneficial to reducing costs.
[0005] In a first aspect, this application provides an electronic module. The electronic module includes at least two electronic devices. The electronic devices include a first side and a second side facing away from each other. A pin and a first metal wire are provided on the first side of the electronic device. The two ends of the first metal wire are respectively a first end and a second end. The first end is connected to the pin, and the second end is located at the edge of the first side. Thus, the first metal wire extends the pin to the side of the electronic device, and the pin of the electronic device can be connected from the side of the electronic device. At least two electronic devices of the electronic module include a first electronic device and a second electronic device stacked on top of each other. The second end of the first metal wire of the first electronic device and the second end of the first metal wire of the second electronic device are connected by a second metal wire. Thus, the electrical connection between the first electronic device and the second electronic device is realized, enabling the first electronic device and the second electronic device to work together. During the stacking process of different electronic devices, there is no need to first mount the electronic devices on a carrier board, which is beneficial to simplifying the structure of the electronic module, improving the degree of miniaturization of the electronic module, and reducing costs.
[0006] In a specific technical solution, the first side of the first electronic device is connected to the second side of the second electronic device. For example, the pin on the first side of the first electronic device can be soldered to the second electronic device.
[0007] In one technical solution, the second side of the electronic device is fixedly connected with a first metal layer. The first metal layer serves as a heat dissipation structure of the electronic device, which is conducive to improving the heat dissipation capacity of the electronic device. In particular, for the electronic device located in the middle of the electronic module among the multiple electronic devices stacked in the electronic module, the first metal layer can reduce the thermal resistance in the heat conduction path of the electronic device, improve the heat dissipation capacity of the electronic module, and help improve the power density of the electronic module, and further improve the integration of the electronic module.
[0008] In a further technical solution, the electronic module includes a side surface, and a second metal layer is disposed on the side surface of the electronic device. The second metal layer also serves as a heat dissipation structure of the electronic device, increasing the heat dissipation area of the electronic device to improve the heat dissipation capacity of the electronic device.
[0009] The second metal layer specifically connects the first metal layer of the first electronic device and the first metal layer of the second electronic device, so that the first metal layer and the second metal layer form a heat dissipation network, and the heat generated by the electronic device can be quickly transferred to the second metal layer through the first metal layer to dissipate the heat as quickly as possible, thereby improving the heat dissipation capacity of the electronic module.
[0010] In one technical solution, a first solder resist layer is provided on the surface of the first metal wire of the electronic device, and the first solder resist layer at least covers the first metal wire. The first solder resist layer can protect the first metal wire, making the first metal wire less susceptible to corrosion and less susceptible to short circuit, thereby improving the service life and reliability of the electronic module.
[0011] Specifically, the first solder resist layer may further include a through hole, the orthographic projection of the through hole on the first side covering the orthographic projection of the pin on the first side. The pin is exposed from the through hole of the first solder resist layer, and the pin of an electronic device can be connected to the surface of an adjacent electronic device by welding. In addition, the pin of the electronic device at the lowest layer of the electronic assembly can be connected to a connection structure such as a solder ball for connection with other electronic structures.
[0012] Similarly, the surface of the second metal wire of the electronic module may also be provided with a second solder resist layer, which at least covers the second metal wire. The second solder resist layer can protect the second metal wire, making the second metal wire less susceptible to corrosion and less susceptible to short circuits, thereby improving the service life and reliability of the electronic module.
[0013] In one technical solution, the first side further includes a plastic encapsulation layer, which is arranged in the same layer as the pin, and the first metal wire is located on a surface of the plastic encapsulation layer that is away from the first side. In this technical solution, the plastic encapsulation layer can support the pin and can also serve as a base surface for the first metal wire. The first metal wire is prepared on the surface of the plastic encapsulation layer, which is conducive to improving the stability of the first metal wire and is less likely to cause a short circuit.
[0014] In a specific technical solution, the above-mentioned electronic module is a storage module, and the electronic device is a storage chip. In this technical solution, by stacking multiple storage chips, the storage space of the storage module can be increased, and the integrated circuit of the stacked electronic module is better and the volume is smaller. Therefore, a large storage space can be formed with a small volume.
[0015] In a second aspect, the present application also provides a method for manufacturing an electronic module, and this manufacturing method can be used to manufacture the electronic module provided in the first aspect above. The above-mentioned manufacturing method specifically includes: preparing a first metallization pattern on the first side of the electronic component to form an electronic device. The pins of the electronic component are located on the first side of the electronic component. The first metallization pattern includes a first metal wire, and the two ends of the first metal wire are respectively a first end and a second end. The first end of the first metal wire is connected to the pin of the electronic component, and the second end is located at the edge of the first side. The above-mentioned first metal wire can be formed by processes such as etching. After that, stack the first electronic device and the second electronic device in the electronic device. Specifically, the above-mentioned electronic devices can be stacked by using the encapsulation lamination technology. After that, prepare a second metallization pattern on the side of the second electronic device; the second metallization pattern includes a second metal wire, and the second metal wire connects the second end of the first metal wire of the first electronic device and the second end of the first metal wire of the second electronic device. The above-mentioned second metal wire can also be formed by processes such as etching. Directly using the encapsulation lamination technology to stack the electronic devices makes the volume of the electronic module smaller, and the connection between different electronic devices can be realized by using the second metal wire at the edge of the electronic module, without introducing additional structures, and the volume of the electronic module can also be reduced, and the integration degree of the electronic module can be improved.
[0016] In a technical solution, before preparing the first metallization pattern on the first side of the electronic component, it includes: forming a plastic encapsulation structure on the first side of the electronic component, and the plastic encapsulation structure covers the pins of the electronic component; grinding the plastic encapsulation structure to form a plastic encapsulation layer and expose the pins. The plastic encapsulation structure can protect the pins, and the plastic encapsulation layer serves as the base surface of the first metal wire, which is beneficial to improving the fixing reliability of the first metal wire.
[0017] In addition, after preparing the first metallization pattern on the first side of the electronic component, it includes: forming a first solder mask layer on the first side of the electronic component, and the first solder mask layer at least covers the first metal wire. By using the first solder mask layer to cover the first metal wire, the first metal wire is not easily short-circuited and oxidized, etc., which is beneficial to improving the service life of the electronic device.
[0018] A first metallization pattern is prepared on a first side of an electronic component, including, before or after that: forming a first metal layer on a second side of the electronic component, where the second side is the side of the electronic component facing away from the first side, or in other words, the first side and the second side are opposite sides of the electronic component. The first metal layer is a heat dissipation structure of the electronic device, thereby improving the heat dissipation capacity of the electronic component, which is beneficial to increasing the number of electronic devices stacked in the electronic module layer and improving the integration degree of the electronic module.
[0019] In order to improve the heat dissipation capacity of the electronic module, after the first electronic device and the second electronic device in the above-mentioned stacked electronic devices, it includes: forming a second metal layer on the side surfaces of the stacked first electronic device and second electronic device, and the second metal layer connects the first metal layer of the first electronic device and the first metal layer of the second electronic device. On the one hand, it can increase the heat dissipation area of the electronic module; on the other hand, it can also enable the first metal layer and the second metal layer to form a heat dissipation network to improve the heat dissipation capacity of the electronic module.
[0020] Thirdly, the present application also provides an electronic component. The electronic component includes a circuit board and the electronic module provided in the first aspect above, and the electronic module is electrically connected to the circuit of the circuit board. In the case where the integration degree of the electronic module is relatively high, it can improve the performance of the electronic module, and further improve the performance of the electronic component.
[0021] Fourthly, the present application also provides an electronic device. The electronic device includes a housing and the electronic module provided in the first aspect above, and the electronic module is disposed in the housing. In the case where the integration degree of the electronic module is relatively high, it can improve the performance of the electronic module, and further improve the performance of the electronic device. Description of the Drawings
[0022] Figure 1 It is a schematic structural diagram of an electronic module in an embodiment of the present application;
[0023] Figure 2 It is a schematic structural diagram of an electronic device in an embodiment of the present application;
[0024] Figure 3 It is a schematic structural diagram of the first side of an electronic device in an embodiment of the present application;
[0025] Figure 4 It is a schematic structural diagram of the second side of an electronic device in an embodiment of the present application;
[0026] Figure 5 It is a schematic structural diagram of a side surface of an electronic module in an embodiment of the present application;
[0027] Figure 6 It is a schematic structural diagram of a side surface of an electronic module in an embodiment of the present application;
[0028] Figure 7It is a schematic side structure diagram of an electronic module in an embodiment of the present application;
[0029] Figure 8 It is a schematic structural diagram of a first side of an electronic device in an embodiment of the present application;
[0030] Figure 9 It is a schematic side structure diagram of an electronic module in an embodiment of the present application;
[0031] Figure 10 It is another schematic side structure diagram of an electronic module in an embodiment of the present application;
[0032] Figure 11 It is a schematic diagram of a preparation process of an electronic module in an embodiment of the present application;
[0033] Figure 12 It is a schematic diagram of a preparation process of an electronic module in an embodiment of the present application;
[0034] Figure 13 It is a schematic diagram of a preparation process of an electronic module in an embodiment of the present application;
[0035] Figure 14 It is a schematic diagram of a preparation process of an electronic module in an embodiment of the present application.
[0036] Reference numerals:
[0037] 1 - Electronic device; 1' - First electronic device;
[0038] 1" - Second electronic device; 11 - First side;
[0039] 12 - Second side; 13 - Pin;
[0040] 14 - First metal wire; 141 - First end;
[0041] 142 - Second end; 15 - Second metal wire;
[0042] 16 - First metal layer; 17 - Second metal layer;
[0043] 18 - First solder mask layer; 181 - Through hole;
[0044] 19 - Encapsulation layer; 110 - Solder ball. Detailed implementation manners
[0045] In order to make the objectives, technical solutions, and advantages of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings.
[0046] The terms used in the following embodiments are only for the purpose of describing specific embodiments and are not intended to limit the present application. As used in the specification and appended claims of the present application, the singular forms "a", "an", "the", "above-mentioned", "said", and "this" are also intended to include expressions such as "one or more", unless the context clearly indicates otherwise.
[0047] Reference to "one embodiment" or "specific embodiments" described in this specification means that a particular feature, structure, or characteristic described in connection with that embodiment is included in one or more embodiments of the present application. The terms "comprising", "including", "having", and their variants mean "including but not limited to", unless otherwise specifically emphasized in other ways.
[0048] To facilitate the understanding of the electronic module, the preparation method of the electronic module, and the electronic device provided by the embodiments of the present application, the application scenarios thereof will be introduced first below.
[0049] The electronic device in the embodiments of the present application can be an electronic device such as an information and communications technology (ICT) device, a communication device (such as a router), a computing device (such as a server), a network device (such as a switch), or a storage device (such as a storage array), or it can also be an electronic device such as an optical module, a vehicle-mounted device, or a terminal device. The present application does not limit the specific type of the electronic device, and as long as the electronic device includes the electronic module, the technical solution provided by the present application can be adopted.
[0050] In one application scenario, the electronic module provided by the embodiments of the present application can be a memory module for storing data for the electronic device. The electronic module provided by the technical solution of the present application has a relatively high storage density and a relatively low cost. In some other application scenarios, the electronic module provided by the embodiments of the present application can also be other electronic modules to improve the performance of the electronic module.
[0051] In a specific embodiment, the above-mentioned electronic device may include a housing, and the above-mentioned electronic module is disposed in the housing of the electronic device. The above-mentioned electronic module is assembled in the housing. In a specific embodiment, the electronic module can be accommodated inside the housing, so that the housing can protect the electronic module. In another specific embodiment, the electronic module can also be disposed outside the housing.
[0052] When the electronic module is applied, it can be disposed on a circuit board to form an electronic component. Specifically, the above-mentioned circuit board includes circuits, and the electronic module is connected to the circuits of the circuit board so that the electronic module can be connected to other components through the circuit board. The above-mentioned electronic component may further include other electronic devices other than the electronic module to enrich the functions of the electronic component. In a specific embodiment, the above-mentioned electronic component may be a single board.
[0053] Figure 1 FIG. is a schematic structural diagram of an electronic module in an embodiment of the present application, as Figure 1 shown, the electronic module provided in the present application includes at least two electronic devices 1, and the above-mentioned at least two electronic devices 1 are stacked. For the convenience of description, as Figure 1 shown, in a specific embodiment, taking the electronic module including two stacked electronic devices 1 as an example to introduce the electronic module provided in the present application. As Figure 1 shown, the two stacked electronic devices 1 are respectively a first electronic device 1' and a second electronic device 1".
[0054] Figure 2 FIG. is a schematic structural diagram of an electronic device in an embodiment of the present application, as Figure 2 shown, the electronic device 1 in the embodiment of the present application includes a first side 11 and a second side 12 facing away from each other. Figure 3 FIG. is a schematic structural diagram of the first side 11 of the electronic device in an embodiment of the present application. Please refer to Figure 2 and Figure 3 , pins 13 and a first metal wire 14 are provided on the first side 11 of the electronic device 1. The two ends of the above-mentioned first metal wire 14 are respectively a first end 141 and a second end 142. The first end 141 of the first metal wire 14 is connected to the pin 13, and the second end 142 is located at the edge of the first side 11. The first metal wire 14 is connected to the pin 13 of the electronic device 1 and extends to the edge of the first side 11 of the electronic device 1. Then, the above-mentioned first metal wire 14 can be exposed from the side of the electronic device 1, and the pin 13 of the electronic device 1 can be connected by connecting to the first metal wire 14 on the side of the electronic device 1. Thus, it is possible to connect to the first metal wire 14 on the side of the electronic device 1 and further connect to the pin 13 of the electronic device 1.
[0055] Please refer to Figures 1 to 3, in the embodiments of the present application, the first electronic device 1' and the second electronic device 1" of the electronic module are stacked. There are various options for the connection manner of the above-mentioned first electronic device 1' and the second electronic device 1", for example, it may include any manner such as welding, plastic encapsulation, die attach film (DAF), or gluing. The above-mentioned electronic module may further include a second metal wire 15, and the second ends 142 of the first metal wires 14 of the first electronic device 1' and the second electronic device 1" are connected by the second metal wire 15. Since the first metal wire 14 connected to the pin 13 of the first electronic device 1' extends to the edge of the first side 11, and the first metal wire 14 connected to the pin 13 of the second electronic device 1" also extends to the edge of the first side 11. Therefore, after the first electronic device 1' and the second electronic device 1" are stacked, the second ends 142 of the first metal wires 14 of the first electronic device 1' and the second electronic device 1" are both exposed on the side of the electronic module, and thus the second ends 142 of the first metal wires 14 of the first electronic device 1' and the second electronic device 1" can be connected by the second metal wire 15, so as to realize the electrical connection between the first electronic device 1' and the second electronic device 1", enabling the first electronic device 1' and the second electronic device 1" to work together. For example, if the above-mentioned first electronic device 1' and the second electronic device 1" are both storage devices, then the storage capacity of the electronic module can be expanded by connecting the first electronic device 1' and the second electronic device 1" through the above-mentioned second metal wire 15. In a specific embodiment, the second metal wire 15 can be fixed on the side of the electronic module. For example, the second metal wire 15 can be mainly located on the side of the second electronic device 1", so as to connect the first metal wires 14 on both sides of the second electronic device 1". It can be understood that the above-mentioned second metal wire 15 extends from the first side 11 of the second electronic device 1" to the first side 11 of the first electronic device 1', so as to connect the first metal wires 14 of the two electronic devices 1.
[0056] In a specific embodiment, the first side 11 of the first electronic device 1' can be connected to the second side 12 of the second electronic device 1". For example, the pin 13 on the first side 11 of the first electronic device 1' can be welded to the second electronic device 1".
[0057] In the embodiments of the present application, different electronic devices 1 can be stacked by using the package on package (POP) technology to form an electronic module. During the stacking process of different electronic devices 1, it is not necessary to first mount the electronic devices 1 on a carrier board, which is beneficial to simplifying the structure of the electronic module, improving the miniaturization degree of the electronic module, and reducing costs.
[0058] In an alternative embodiment, the specific type of the above-mentioned electronic device 1 is not limited. For example, the above-mentioned electronic device 1 can be a memory chip or a high-power chip, etc. In addition, the electronic device 1 in the embodiments of the present application can be a semiconductor device.
[0059] When the electronic device 1 in the embodiments of the present application is a memory chip, at least two electronic devices 1 can be integrated into an electronic module with a larger storage capacity, and this electronic module is a memory module.
[0060] Please continue to refer to Figure 1 and Figure 2 In the embodiments of the present application, a first metal layer 16 is fixedly connected to the second side 12 of the electronic device 1. Specifically, there is no limitation on the way the first metal layer 16 is formed on the second side 12 of the electronic device 1. In one possible embodiment, the first metal layer 16 can be adhesively fixed to the second side 12 of the electronic device 1, or alternatively, the first metal layer 16 can be formed on the second side 12 of the electronic device 1 by electroless nickel and immersion gold (ENIG) process. The first metal layer 16 has good thermal conductivity, thereby improving the heat dissipation ability of the electronic device 1. Especially for the electronic devices 1 located in the middle of the electronic module and the electronic devices 1 located at the bottom of the electronic module among the stacked multiple electronic devices 1 in the electronic module layer, the first metal layer 16 provided by this solution can reduce the thermal resistance in the heat conduction path of the electronic device 1, so that the heat generated by the electronic devices 1 located in the middle and at the bottom of the electronic module can also be conducted out quickly, thereby improving the heat dissipation ability of the electronic module, which is beneficial to improving the power density of the electronic module and further improving the integration degree of the electronic module.
[0061] Figure 4 is a schematic structural diagram of the second side 12 of the electronic device in the embodiments of the present application. As Figure 4 shown, when specifically setting the first metal layer 16, in one specific embodiment, the first metal layer 16 can completely cover the second side 12 of the electronic device 1 to increase the heat dissipation area of the electronic device 1 and improve the heat dissipation ability of the electronic device 1. In other embodiments, the first metal layer 16 may not completely cover the second side 12 of the electronic device 1. For example, the pattern of the first metal layer 16 can be designed according to actual requirements. Specifically, the larger the area of the first metal layer 16, the stronger the heat dissipation ability of the electronic device 1.
[0062] Figure 5 is a schematic structural diagram of one side of the electronic module in the embodiments of the present application. As Figure 5As shown, in one embodiment, the above-mentioned electronic module is further provided with a second metal layer 17. Specifically, the above-mentioned electronic module includes a side surface that intersects the first side 11 of the electronic device 1. The second metal layer 17 is disposed on the side surface of the electronic module, so that the heat dissipation area of the electronic device 1 is relatively large, and the second metal layer 17 is located on the outer surface of the electronic module. Compared with the first metal layer 16 located between two adjacent electronic devices 1, the second metal layer 17 has stronger heat dissipation ability. Therefore, the heat dissipation ability of the electronic module can be further improved.
[0063] In a further embodiment, please continue to refer to Figure 5 , the above-mentioned second metal layer 17 is connected to the first metal layer 16 of the first electronic device 1' and the first metal layer 16 of the second electronic device 1". In this embodiment, the first metal layer 16 and the second metal layer 17 can be formed into a heat dissipation network, and the heat generated by the electronic device 1 can be quickly transmitted to the second metal layer 17 through the first metal layer 16 for heat dissipation as soon as possible, thereby improving the heat dissipation ability of the electronic module.
[0064] When specifically setting the second metal layer 17, the second metal layer 17 can be made to only connect the first metal layer 16 of the first electronic device 1' and the first metal layer 16 of the second electronic device 1", as Figure 5 shown. Or, in some embodiments, Figure 6 is a schematic structural diagram of a side surface of the electronic module in an embodiment of the present application. As Figure 6 shown, the second metal layer 17 can also cover the side surface of the electronic module along the thickness direction of the electronic module to increase the area of the second metal layer 17, increase the heat dissipation area of the electronic module, and improve the heat dissipation ability of the electronic module.
[0065] In a specific embodiment, the electronic module includes multiple side surfaces. Taking the first side 11 as a rectangle as an example, the above-mentioned electronic module includes two longer side surfaces and two shorter side surfaces. It can be understood that the length of the above-mentioned longer side surface is greater than the length of the shorter side surface. As Figure 1 and Figure 6 shown, Figure 1 shows the longer side surface of the electronic module, Figure 2 shows the shorter side surface of the electronic module. In a specific embodiment, there is more space for wiring in the longer side surface, which can be used to form the second metal wire 15, so that a relatively large number of second metal wires 15 can be provided, and the second metal wires 15 are not prone to problems such as short circuits. Then, the second metal layer 17 can be provided on the shorter side surface, so that the second metal wire 15 and the second metal layer 17 are formed on different side surfaces.
[0066] Of course, in some embodiments, the shorter side may have enough space to set the second metal wire 15, so the second metal wire 15 can be set on the shorter side, and the second metal layer 17 can be set on the longer side. The second metal layer 17 has a larger area, which is conducive to improving the heat dissipation capacity of the electronic module.
[0067] Figure 7 FIG. 1 is a schematic diagram of a side structure of an electronic module in an embodiment of the present application. Figure 7 As shown, in some embodiments, the same side may be provided with both the second metal wire 15 and the second metal layer 17. For example, the second metal layer 17 may be provided in the area where the second metal wire 15 is not provided in the electronic module, and the second metal wire 15 and the second metal layer 17 are disconnected. This solution can make full use of the surface of the electronic module to set the heat dissipation structure, thereby facilitating the improvement of the heat dissipation capacity of the electronic module.
[0068] Please continue to refer to Figure 2 In one embodiment, a first solder resist layer 18 is disposed on the surface of the first metal wire 14 of the electronic device 1, and the first solder resist layer 18 is disposed on the side away from the first side 11, and the first solder resist layer 18 at least covers the first metal wire 14. The first solder resist layer 18 can protect the first metal wire 14, so that the first metal wire 14 is not easily corroded and short-circuited, thereby improving the service life and reliability of the electronic module.
[0069] In one embodiment, the first solder resist layer 18 may completely cover the first side 11 of the electronic device 1 . Figure 8 1 is a schematic diagram of a structure of a first side 11 of an electronic device 1 in an embodiment of the present application, such as Figure 8 As shown, in another embodiment, the first solder resist layer 18 may include a through hole 181, the orthographic projection of the through hole 181 on the first side 11 covers the orthographic projection of the pin 13 on the first side 11. The pin 13 may be exposed from the through hole 181 so that the pin 13 can be used for welding connection with other structures. For example, it is used to achieve welding connection with adjacent electronic devices 1. In addition, the pin 13 may be used to connect structures such as solder balls for connection with other electronic structures, such as welding to a circuit board.
[0070] In addition, in one embodiment, a second solder resist layer may be provided on the surface of the second metal wire 15 of the electronic module. Specifically, the second solder resist layer is formed on the side of the electronic module. The second solder resist layer can protect the second metal wire 15, making the second metal wire 15 less susceptible to corrosion and less susceptible to short circuit, thereby improving the service life and reliability of the electronic module.
[0071] Please continue to refer to Figure 2, In one embodiment, the first side 11 further includes a molding layer 19. The molding layer 19 is disposed on the same layer as the pins 13 of the electronic device 1, and the first metal wire 14 is located on the surface of the molding layer 19 facing away from the first side 11. In this embodiment, the pins 13 are exposed from the molding layer 19, and the molding layer 19 can serve as the base surface of the first metal wire 14. Preparing the first metal wire 14 on the surface of the molding layer 19 is beneficial to improving the stability of the first metal wire 14 and is not prone to short - circuit conditions.
[0072] In the drawings of the above - mentioned embodiments, the case where the electronic module includes two electronic devices 1 is taken as an example to illustrate the present solution. In practical applications, the number of electronic devices 1 included in the electronic module can be designed and selected according to the product performance requirements. In particular, since the electronic device 1 includes a first metal layer 16 and has good heat dissipation ability, and the heat dissipation ability has less limitation on the stacked electronic devices 1 in the electronic module, a relatively large number of electronic devices 1 can be stacked in the electronic module. For example, Figure 9 is a schematic side - view structure diagram of an electronic module in an embodiment of the present application, Figure 10 is another schematic side - view structure diagram of an electronic module in an embodiment of the present application. As shown in Figure 9 and Figure 10 in the illustrated embodiment, the electronic module includes four stacked electronic devices 1.
[0073] In the embodiment of the present application, the pins 13 of the electronic device 1 located at the bottom layer of the electronic module can be directly connected to other electronic structures. Therefore, the pin layout of the electronic module in the embodiment of the present application is the same as the pin layout of a single electronic device 1, and compatibility between the electronic module and the electronic device 1 can be achieved.
[0074] In order to realize the connection between the electronic module and other electronic structures, in one embodiment, solder balls 110 are connected to the pins 13 of the electronic device 1 located at the bottom layer of the above - mentioned electronic module. Alternatively, in some embodiments, terminals can also be connected to the pins 13 of the electronic device 1 located at the bottom layer of the above - mentioned electronic module, and the terminals are used to connect to other electronic devices 1.
[0075] Based on the same inventive concept, the present application also provides a preparation method for the above - mentioned electronic module. This preparation method uses electronic components to prepare the electronic module. The electronic component has pins 13. For the convenience of description, the surface of the electronic component with pins 13 is considered as the first side 11, and the surface of the electronic component facing away from the first side 11 is the second side 12.
[0076] S101, Prepare a first metallization pattern on the first side 11 of the electronic component to form an electronic device 1;
[0077] For the electronic device 1 formed in this step, please refer to Figure 2, please refer to the first metallization pattern Figure 3 . The first metallization pattern includes a first metal line 14, and the two ends of the first metal line 14 are a first end 141 and a second end 142 respectively. Among them, the first end 141 of the first metal line 14 is connected to the pin 13 of the electronic component, and the second end 142 is located at the edge of the first side 11. The first metal line 14 is connected to the pin 13 of the electronic device 1 and extends to the edge of the first side 11 of the electronic device 1, so that it can be connected to the first metal line 14 on the side of the electronic device 1, and then connected to the pin 13 of the electronic device 1. When specifically forming the above first metallization pattern, a metal layer can be prepared on the surface of the electronic component first, and then etched to form the first metallization pattern.
[0078] S102. Stack the first electronic device 1' and the second electronic device 1" in the electronic device 1 formed in the stacking step S101;
[0079] There are various options for the connection method of the above first electronic device 1' and the second electronic device 1", such as any method including soldering, encapsulation, die attach film (DAF), or gluing. Specifically, the first side 11 of the first electronic device 1' and the second side 12 of the second electronic device 1" can be fixedly connected.
[0080] S103. Prepare a second metallization pattern on the side of the second electronic device 1" to form an electronic module;
[0081] Please refer to the electronic module formed in this step Figure 1 . Specifically, the above second metallization pattern includes a second metal line 15, and the second metal line 15 connects the second end 142 of the first metal line 14 of the first electronic device 1' and the second end 142 of the first metal line 14 of the second electronic device 1". Thus, the electrical connection between the first electronic device 1' and the second electronic device 1" is realized, so that the first electronic device 1' and the second electronic device 1" can work together. In a specific embodiment, the second metal line 15 can be located on the side of the electronic module. For example, the second metal line 15 can be mainly located on the side of the second electronic device 1", so as to connect the first metal lines 14 on both sides of the second electronic device 1". When specifically forming the above second metallization pattern, a metal layer can be prepared on the surface of the electronic component first, and then etched to form the second metallization pattern.
[0082] The preparation method of the electronic module provided by the present application uses the package on package (POP) technology to stack different electronic devices 1 to form an electronic module. And during the stacking process of different electronic devices 1, it is not necessary to first mount the electronic devices 1 on a carrier board, which is beneficial to simplifying the structure of the electronic module, improving the miniaturization degree of the electronic module, and reducing costs.
[0083] In one embodiment, before the step S1011 in the above step S101 of preparing a first metallization pattern on the first side 11 of the electronic component, it includes:
[0084] Step S1012, encapsulating on the first side 11 of the electronic component to form an encapsulation structure, and the encapsulation structure covers the pins 13 of the electronic component, as Figure 11 shown;
[0085] Step S1013, grinding the encapsulation structure to form an encapsulation layer 19 and expose the pins 13, as Figure 12 shown.
[0086] In this embodiment, the first metallization pattern can be prepared on the surface of the encapsulation layer 19. The encapsulation layer 19 can serve as the base surface of the first metal wire 14. Preparing the first metal wire 14 on the surface of the encapsulation layer 19 is beneficial to improving the stability of the first metal wire 14 and is not prone to short - circuit situations.
[0087] In one embodiment, after the step S1011 in the above step S101 of preparing a first metallization pattern on the first side 11 of the electronic component, it includes:
[0088] S1014, forming a first solder mask layer 18 on the first side 11 of the electronic component, and the first solder mask layer 18 at least covers the first metal wire 14, as Figure 13 shown.
[0089] It is convenient to make the pins 13 capable of being welded and connected to other structures. The first solder mask layer 18 can protect the first metal wire 14, making the first metal wire 14 not easily corroded and not prone to short - circuit situations, improving the service life and reliability of the electronic module. In a specific embodiment, the via hole 181 can be formed by processes such as etching or drilling.
[0090] In one embodiment, before or after the step S1011 in the above step S101 of preparing a first metallization pattern on the first side 11 of the electronic component, it includes:
[0091] Step S1015, forming a first metal layer 16 on the second side 12 of the electronic component, as Figure 14 shown.
[0092] The above-mentioned first metal layer 16 can be adhesively fixed to the second side 12 of the electronic device 1, or alternatively, the first metal layer 16 can be formed on the second side 12 of the electronic device 1 by an electroless nickel and immersion gold (ENIG) process. The first metal layer 16 has good thermal conductivity, thereby improving the heat dissipation capacity of the electronic device 1. Especially for the electronic devices 1 in the middle of the electronic module and the electronic devices 1 at the bottom of the electronic module among the multiple stacked electronic devices 1, the first metal layer 16 provided by this solution can reduce the thermal resistance in the heat conduction path of the electronic device 1, enabling the heat generated by the electronic devices 1 in the middle and at the bottom of the electronic module to be conducted out more quickly, thereby improving the heat dissipation capacity of the electronic module, which is beneficial to improving the power density of the electronic module and further enhancing the integration degree of the electronic module.
[0093] In a further embodiment, after step S102, it includes:
[0094] S1021. A second metal layer 17 is formed on the side surfaces of the stacked first electronic device 1' and second electronic device 1", and the second metal layer 17 connects the first metal layer 16 of the first electronic device 1' and the first metal layer 16 of the second electronic device 1", as Figure 6 shown.
[0095] In this embodiment, the first metal layer 16 and the second metal layer 17 can be formed into a heat dissipation network, and the heat generated by the electronic device 1 can be quickly transmitted to the second metal layer 17 through the first metal layer 16 for heat dissipation as soon as possible, improving the heat dissipation capacity of the electronic module. In addition, the heat dissipation area of the electronic device 1 is large, and the second metal layer 17 is located on the outer surface of the electronic module. Compared with the first metal layer 16 located between two adjacent electronic devices 1, the second metal layer 17 has stronger heat dissipation capacity, so the heat dissipation capacity of the electronic module can be further improved.
[0096] Specifically, the above-mentioned second metal layer 17 can be adhesively fixed to the side surface of the electronic module, or alternatively, the second metal layer 17 can be formed on the side surface of the electronic module by an electroless nickel and immersion gold (ENIG) process.
[0097] In addition, after step S103, it can further include:
[0098] Step S104. Balls are implanted on the first side 11 of the bottommost electronic device 1, as Figure 1 shown.
[0099] Specifically, solder balls 110 are soldered to pin 13 of the electronic device 1, so that the electronic module can be soldered and connected to other electronic structures by using the above solder balls 110.
[0100] The above is only the specific implementation manner of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present application can easily think of changes or substitutions, which should all be covered within the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims
1. An electronic module, characterized in that, it includes at least two electronic devices, the electronic devices include a first side and a second side facing away from each other, the first side is provided with pins and a first metal wire, both ends of the first metal wire are a first end and a second end respectively, the first end is connected to the pin, and the second end is located at the edge of the first side; the at least two electronic devices include a first electronic device and a second electronic device stacked, and the second end of the first metal wire of the first electronic device and the second end of the first metal wire of the second electronic device are connected by a second metal wire.
2. The electronic module according to claim 1, characterized in that, a first metal layer is fixedly connected to the second side of the electronic device.
3. The electronic module according to claim 2, characterized in that, the electronic module includes a side surface, and the side surface is provided with a second metal layer.
4. The electronic module according to claim 3, characterized in that, the second metal layer connects the first metal layer of the first electronic device and the first metal layer of the second electronic device.
5. The electronic module according to any one of claims 1 to 4, characterized in that, a first solder mask layer is provided on the surface of the first metal wire of the electronic device, and the first solder mask layer at least covers the first metal wire.
6. The electronic module according to claim 5, characterized in that, the first solder mask layer includes a through hole, and the positive projection of the through hole on the first side covers the positive projection of the pin on the first side.
7. The electronic module according to any one of claims 1 to 6, characterized in that, a second solder mask layer is provided on the surface of the second metal wire of the electronic module, and the second solder mask layer at least covers the second metal wire.
8. The electronic module according to any one of claims 1 to 7, characterized in that, the first side further includes a plastic encapsulation layer, the plastic encapsulation layer is arranged on the same layer as the pin, and the first metal wire is located on the surface of the side of the plastic encapsulation layer away from the first side.
9. The electronic module according to any one of claims 1 to 8, characterized in that, the electronic module is a storage module, and the electronic device is a storage chip.
10. A method for manufacturing an electronic module, characterized in that, it includes: preparing a first metallization pattern on the first side of an electronic component to form an electronic device; the pins of the electronic component are located on the first side, the first metallization pattern includes a first metal wire, both ends of the first metal wire are a first end and a second end respectively, the first end is connected to the pin of the electronic component, and the second end is located at the edge of the first side; stacking the first electronic device and the second electronic device in the electronic device; preparing a second metallization pattern on the side surface of the second electronic device; the second metallization pattern includes a second metal wire, and the second metal wire connects the second end of the first metal wire of the first electronic device and the second end of the first metal wire of the second electronic device.
11. The method for manufacturing an electronic module according to claim 10, characterized in that, Preparing the first metallization pattern on the first side of the electronic component includes the following steps before: Encapsulating the first side of the electronic component to form an encapsulation structure, where the encapsulation structure covers the pins of the electronic component. Grinding the encapsulation structure to form an encapsulation layer and expose the pins.
12. The method for manufacturing an electronic module according to claim 10 or 11, characterized in that preparing the first metallization pattern on the first side of the electronic component includes the following steps after: Forming a first solder mask layer on the first side of the electronic component, where the first solder mask layer covers at least the first metal wire.
13. The method for manufacturing an electronic module according to any one of claims 10 to 12, characterized in that preparing the first metallization pattern on the first side of the electronic component includes the following steps before or after: Forming a first metal layer on the second side of the electronic component, where the second side is the side of the electronic component facing away from the first side.
14. The method for manufacturing an electronic module according to claim 13, characterized in that stacking the first electronic device and the second electronic device in the electronic device includes the following steps after: Forming a second metal layer on the side surfaces of the stacked first electronic device and the second electronic device, where the second metal layer connects the first metal layer of the first electronic device and the first metal layer of the second electronic device.
15. An electronic component, characterized in that it includes a circuit board and an electronic module according to any one of claims 1 to 9, and the electronic module is electrically connected to the circuit of the circuit board.
16. An electronic device, characterized in that it includes a housing and an electronic module according to any one of claims 1 to 9, and the electronic module is disposed in the housing.