Polymer composition suitable for electrostatic discharge applications
By adding conductive carbon nanofillers and non-fiber fillers to the poly(aryl etherketone) polymer, the polyaryl ether composition is blended to form, which solves the problems of insufficient conductivity uniformity and poor mechanical properties, and achieves better conductivity uniformity and mold shrinkage in ESD applications.
Patent Information
- Application Number
- CN202280101130.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2022-10-17
- Publication Date
- 2025-06-13
AI Technical Summary
In the electrostatic discharge (ESD) application, existing poly(aryl etherketone) polymers have problems such as insufficient conductivity uniformity, poor toughness and impact resistance, and low thermal deformation temperature.
Using a polyarylether composition comprising at least one PAEK polymer, at least one conductive carbon nanofiller (component A1) and at least one non-fiber filler (component A2), the uniformity of conductivity and mold shrinkage are optimized by blending techniques.
A more uniform conductivity and optimized mold shrinkage in ESD applications while maintaining mechanical properties, suitable for electrostatic discharge protection.
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Abstract
Description
Technical Field
[0001] The present invention relates to an enhanced polyarylether composition, notably suitable for electrostatic discharge applications, and to an article comprising or made of the same. Background Art
[0002] It is known that conductive thermoplastic polymer compositions can be used to prevent electrostatic discharge (ESD). These specialty polymer compositions are typically tailored to span the surface resistivity spectrum and can often be formulated for injection molding or extrusion processes.
[0003] A variety of techniques can be used to impart conductive properties to an otherwise insulating thermoplastic resin, thereby providing the precise degree of conductivity required for ESD protection. Among them, conductive fillers can be added to the thermoplastic polymer.
[0004] Small-sized carbon materials (such as nanotubes) are one of the most important filler materials. It can advantageously increase the strength of the polymer material and render the polymer material conductive. However, the fibrous shape combined with its small size makes it difficult to disperse them uniformly in the polymer.
[0005] US2010 / 0311869 A1 teaches that better dispersion can be obtained when using non-commercially available hollow carbon nanospheres. To obtain the desired shape, complex processes are required to prepare the carbon nanospheres.
[0006] US 8,128,844 B2 discloses the use of organophilic nanoclay in a conductive thermoplastic resin composition to minimize or prevent the tendency of carbon nanotubes to aggregate or unexpectedly orient, and can render the carbon nanotubes uniformly dispersed in the resin. The organophilic nanoclay is typically prepared from organically modified nanoscale layered silicates.
[0007] Among other thermoplastic polymers, poly(aryl ether ketone) (PAEK), in particular polyetheretherketone (PEEK) and polyetherketoneketone (PEKK), offer excellent thermal stability, very high stiffness and strength, and truly excellent chemical resistance, including excellent resistance to environmental stress cracking. However, they have drawbacks such as poor toughness and impact resistance (with brittle failure), and a rather low heat distortion temperature, which generally makes them unsuitable for ESD applications. Therefore, many efforts have been made to improve the properties of conductive PAEK polymers. For example, WO 2008 / 003659A1 discloses a polymer composition (C) comprising at least one poly(aryl ether ketone) (PAEK), at least one poly(biphenyl ether sulfone), and at least one fibrous carbon nano filler, which provides excellent anti-static discharge protection, especially by providing excellent anti-static discharge protection, having substantially the same level of toughness as pure poly(biphenyl ether sulfone) (i.e., not breaking in the notched Izod ASTM D4812 test), and having much higher chemical resistance than poly(biphenyl ether sulfone). However, there is no teaching on how to uniformly disperse the conductive filler. Summary of the Invention
[0008] Accordingly, a first object of the present invention relates to a polyaryl ether composition (C) comprising:
[0009] at least one poly(aryl ether ketone) polymer (hereinafter referred to as "PAEK polymer"),
[0010] at least one conductive carbon nano filler (hereinafter referred to as "component A1"), and
[0011] at least one non-fibrous filler (hereinafter referred to as "component A2").
[0012] Another object of the present invention relates to an article comprising or made from the polyaryl ether composition (C), the article having a volume resistivity measured according to ASTM D257 of from 1·10 +5 Ω.cm to 5·10 +12 Ω.cm.
[0013] The applicant has found that due to the blending of the PAEK polymer with component A1 and component A2, the polyaryl ether composition (C) of the present invention as detailed herein is effective in improving the uniformity of conductivity and thus optimizing the volume and surface resistivity, making the polymer material more suitable for ESD applications. In addition, the polyaryl ether composition (C) of the present invention also optimizes the molding shrinkage rate of the filled ESD polymer material without sacrificing its mechanical properties. Detailed Description
[0014] The polyaryl ether composition (C) according to the present invention may comprise:
[0015] - At least 40 wt.% to less than 89 wt.% of at least one PAEK polymer,
[0016] - At least 1 wt.% and at most 10 wt.% of this component A1, and
[0017] - At least 10 wt.% and at most 50 wt.% of component A2,
[0018] The wt.% is based on the total weight of the polyarylether composition (C).
[0019] The polyarylether composition (C) according to the present invention may comprise:
[0020] - At least 40 wt.% and at most 78 wt.% of at least one PAEK polymer,
[0021] - At least 2 wt.% and at most 10 wt.% of this component A1, and
[0022] - At least 20 wt.% and at most 50 wt.% of component A2,
[0023] The wt.% is based on the total weight of the polyarylether composition (C).
[0024] The polyarylether composition (C) according to the present invention may comprise:
[0025] - At least 55 wt.% and at most 79 wt.% of at least one PAEK polymer,
[0026] - At least 1 wt.% and at most 5 wt.% of this component A1, and
[0027] - At least 20 wt.% and at most 40 wt.% of component A2,
[0028] The wt.% is based on the total weight of the polyarylether composition (C).
[0029] The polyarylether composition (C) according to the present invention may further comprise at least one other polymer different from the PAEK polymer. The other polymer may include a polymer carrier in which component A1 is dispersed before being mixed with the other components of the polyarylether composition (C). Alternatively or additionally, the other polymer may comprise at least one poly(biphenyl ether sulfone) (hereinafter referred to as "component A3") and / or at least one polyethersulfone (hereinafter referred to as "component A4"). In such a case, the combined weight of at least one PAEK polymer, component A1, one or more optional other polymers (e.g., polymer carrier, component A3, component A4) and component A2 is equal to or less than 100 wt.% of the polyarylether composition (C).
[0030] The polyarylether composition (C) according to the present invention may further comprise one or more optional additives, which are generally not more than 10 wt.% based on the total weight of the polyarylether composition (C). The combined weight of at least one PAEK polymer, component A1, optional other polymers, component A2, and one or more optional additives is equal to or less than 100 wt.% of the polyarylether composition (C).
[0031] Poly(aryl ether ketone) (PAEK) polymer
[0032] As previously mentioned, the polyarylether composition (C) comprises at least one PAEK polymer.
[0033] For the purposes of the present invention, the term "poly(aryl ether ketone)" or "PAEK" is intended to mean any polymer in which greater than 50 wt.%, at least 60 wt.%, at least 70 wt.%, at least 80 wt.%, at least 90 wt.%, at least 95 wt.%, at least 99 wt.% of the repeating units are repeating units (R1) having one or more of the following formulas (I) to (V):
[0034]
[0035] Wherein:
[0036] - Ar is independently a divalent aromatic group selected from phenylene, biphenylene or naphthylene,
[0037] - X is independently O, C(=O) or a direct bond,
[0038] - n is an integer from 0 to 3,
[0039] - b, c, d and e are 0 or 1,
[0040] - a is an integer from 1 to 4, and
[0041] - Preferably, when b is 1, d is 0.
[0042] The repeating unit (R1) may notably be selected from:
[0043]
[0044]
[0045]
[0046] And
[0047]
[0048] Preferably, the repeat (R1) is selected from:
[0049]
[0050] and
[0051]
[0052] More preferably, the repeating unit (R1) is:
[0053]
[0054] For the purposes of the present invention, a polyetheretherketone (PEEK) polymer is intended to mean any polymer in which more than 50 wt.% of the repeating units are repeating units (R1) having formula (VII). Preferably, at least 60 wt.%, at least 70 wt.%, at least 80 wt.%, at least 90 wt.%, at least 95 wt.%, at least 99 wt.% of the repeating units of the PEEK polymer are repeating units (R1) having formula (VII). Even more preferably, substantially all of the repeating units of the PEEK polymer are repeating units (R1) having formula (VII). Most preferably, all of the repeating units of the PEEK polymer are repeating units (R1) having formula (VII).
[0055] Preferably, the PAEK polymers (such as PEEK polymers) used in the present invention are not sulfonated.
[0056] Excellent results are obtained when the PAEK polymer is a polyetheretherketone (PEEK) homopolymer, i.e., a polymer in which substantially all (if not all) of the repeating units are those having formula (VII). Non-limiting examples of suitable commercially available PEEK homopolymers are those from Victrex Manufacturing Ltd., PEEK, those from Solvay Specialty Polymers, PEEK and those from Jilin Joinature Polymer Co., Ltd
[0057] The PAEK polymer may have an intrinsic viscosity (IV) of at least 0.50 dl / g, preferably at least 0.60 dl / g, more preferably at least 0.70 dl / g as measured in 95%-98% sulfuric acid (d = 1.84 g / ml) at a PAEK concentration of 0.1 g / 100 ml.
[0058] PAEK polymers, such as PEEK polymers, can have a melt viscosity of up to 0.25 kPa-s, but preferably less than 0.20 kPa-s and most preferably less than 0.18 kPa-s, at a shear rate of 400 °C and 1000 s as measured using a capillary rheometer in accordance with ASTM D3835. PAEK polymers, such as PEEK polymers, can have a melt viscosity as low as 0.05 kPa-s. -1 PAEK polymers, such as PEEK polymers, can have a melt viscosity in the range from 0.05 kPa-s to 0.25 kPa-s, preferably from 0.06 kPa-s to 0.20 kPa-s, preferably from 0.07 kPa-s to 0.18 kPa-s, preferably from 0.08 kPa-s to 0.15 kPa-s, at a shear rate of 400 °C and 1000 s as measured using a capillary rheometer in accordance with ASTM D3835.
[0059] PAEK polymers, such as PEEK polymers, can have a melt viscosity of up to 0.25 kPa-s, but preferably less than 0.20 kPa-s and most preferably less than 0.18 kPa-s, at a shear rate of 400 °C and 1000 s as measured using a capillary rheometer in accordance with ASTM D3835. -1 PAEK polymers, such as PEEK polymers, can have a melt viscosity in the range from 0.05 kPa-s to 0.25 kPa-s, preferably from 0.06 kPa-s to 0.20 kPa-s, preferably from 0.07 kPa-s to 0.18 kPa-s, preferably from 0.08 kPa-s to 0.15 kPa-s, at a shear rate of 400 °C and 1000 s as measured using a capillary rheometer in accordance with ASTM D3835.
[0060] For the capillary rheometer, a Kayeness Galaxy V rheometer (model 8052DM) can be used.
[0061] PAEK polymers, such as PEEK polymers, can be prepared by any method.
[0062] A well-known method in the art involves reacting a substantially equimolar mixture of at least one bisphenol and at least one dihalobenzene-type compound or at least one halophenol compound, as described in Canadian Patent No. 847,963. Non-limiting examples of bisphenols that can be used in this method are hydroquinone, 4,4'-dihydroxybiphenyl, and 4,4'-dihydroxybenzophenone; non-limiting examples of dihalobenzene-type compounds that can be used in this method are 4,4'-difluorobenzophenone, 4,4'-dichlorobenzophenone, and 4-chloro-4'-fluorobenzophenone; non-limiting examples of halophenol compounds that can be used in this method are 4-(4-chlorobenzoyl)phenol and (4-fluorobenzoyl)phenol. Thus, PEEK homopolymers can notably be produced by a nucleophilic method as described, for example, in U.S. Patent No. 4,176,222, the entire content of which is incorporated herein by reference.
[0063] Another method for producing PEEK homopolymers, well-known in the art, involves using an alkanesulfonic acid as a solvent and subjecting phenoxybenzoyl benzoic acid to electrophilic polymerization in the presence of a condensing agent, as described in U.S. Patent 6,566,484, the entire content of which is incorporated herein by reference. Other poly(aryl ether ketones) can be produced by the same method, starting from monomers other than phenoxybenzoyl benzoic acid, such as those described in U.S. Patent Application 2003 / 0130476, the entire content of which is also incorporated herein by reference.
[0064] The polyaryl ether composition (C) can comprise one and only one PAEK polymer. Alternatively, it can comprise two, three, or even more than three PAEK polymers. Some preferred mixtures of PAEK polymers are mixtures consisting of: (i) at least one poly(aryl ether ketone) (PAEK)-a in which more than 50 wt.%, preferably substantially all, and still more preferably all of the repeating units have the following formula:
[0065]
[0066] (ii) at least one poly(aryl ether ketone) (PAEK)-b in which more than 50 wt.%, preferably substantially all, and still more preferably all of the repeating units have the following formula:
[0067]
[0068] And, optionally in addition, (iii) at least one other poly(aryl ether ketone) (PAEK)-c different from (PAEK)-a and (PAEK)-b; in particular, a mixture consisting of: (i) at least one poly(aryl ether ketone) (PAEK)-a in which substantially all (if not all) of the repeating units have formula (VII), (ii) at least one poly(aryl ether ketone) (PAEK)-b in which substantially all (if not all) of the repeating units have formula (IX); even more particularly, a binary mixture consisting of: (i) one poly(aryl ether ketone) (PAEK)-a in which all of the repeating units have formula (VII), (ii) one poly(aryl ether ketone) (PAEK)-b in which all of the repeating units have formula (IX).
[0069] The amount of the PAEK polymer is at least 40 wt.%, preferably at least 41 wt.%, or at least 42 wt.%, or at least 43 wt.%, or at least 44 wt.%, or at least 45 wt.%, or at least 47 wt.%, or at least 49 wt.%, or at least 55 wt.%, or at least 55 wt.% and / or less than 89 wt.%, preferably at most 88 wt.%, or at most 87 wt.%, at most 86 wt.%, or at most 85 wt.%, or at most 80 wt.%, or at most 79 wt.%, or at most 78 wt.%, or at most 75 wt.%, based on the total weight of the polyarylether composition (C).
[0070] Conductive carbon nanofiller (Component A1)
[0071] Component A1 is at least one electrically conductive carbon nanomaterial filler containing elemental carbon. Generally, more than 90 wt.% of the nanomaterial filler consists of elemental carbon. Preferably, more than 95 wt.% of the nanomaterial filler consists of elemental carbon. Even more preferably, more than 99 wt.% of the nanomaterial filler consists of elemental carbon. Good results are obtained when the nanomaterial filler consists essentially of elemental carbon.
[0072] At least one electrically conductive carbon nanomaterial filler useful in the present invention can be metallized. However, at least one electrically conductive carbon nanomaterial filler is preferably not metallized.
[0073] From a practical point of view, any nanomaterial filler is three-dimensional and can thus notably be characterized by three characteristic dimensions ("length", "width", and "height"). However, some nanomaterial fillers are such that two of their characteristic dimensions are significantly lower than the third characteristic dimension respectively. The term "significantly lower" should generally be understood as "lower by more than 10 times" and preferably as "lower by more than 100 times". Exactly, for the purposes of the present invention, the carbon nanomaterial filler has a fibrous shape, which means that two of its characteristic dimensions ("width" and "height") are on average (counting) significantly smaller than the third dimension ("length"); since the width of the fibrous nanomaterial filler is usually close to the height and the base of the fibrous nanomaterial filler usually has a circular shape, the width and height are generally understood by those skilled in the art as a unique parameter, i.e., the diameter of the fibrous nanomaterial filler. Thus, the fibrous nanomaterial filler will generally be characterized by a number-average diameter and a number-average length. Generally, such a material has an aspect ratio defined as the ratio of the number-average length to the number-average diameter of at least 5, at least 10, at least 20, or at least 50, or at least 100.
[0074] Component A1 is at least one fibrous carbon nanomaterial filler, the number-average diameter of which is generally less than 1000 nm, preferably less than 500 nm, and more preferably at most 200 nm.
[0075] At least one fibrous carbon nano filler may have a number average diameter of from 1 nanometer (nm) to 3.5 nm or 4 nm (when in bundles or strips). At least one fibrous carbon nano filler may have a number average length of at least 1 μm. At least one fibrous carbon nano filler may have an average aspect ratio, defined as the number average length divided by the number average diameter, of 100 or greater. The fibrous carbon nano filler may have an average aspect ratio of 1000 or greater.
[0076] The number average diameter and the number average length of the fibrous carbon nano filler can be determined by any technique known to those skilled in the art; advantageously, direct measurements of micrographs obtained by scanning electron microscopy (SEM) combined with software image analysis techniques can be used.
[0077] At least one fibrous carbon nano filler contains more than 65% carbon. Preferably, at least one fibrous carbon nano filler contains at least 90% carbon, and more preferably at least 95% carbon.
[0078] Component A1 preferably has a volume resistivity of less than 2·10 -2 Ω.cm, or at most 1·10 -2 Ω.cm, or at most 5·10 -3 Ω.cm, or at most 3·10 -3 Ω.cm, or at most 2·10 -3 Ω.cm, or at most 1·10 -3 Ω.cm. Component A1 preferably has a volume resistivity of at least 1·10 -6 Ω.cm, or at least 5·10 -6 Ω.cm, or at least 1·10 -5 Ω.cm. Component A1 may have a volume resistivity ranging from 1·10 -4 Ω.cm to 20·10 -4 Ω.cm.
[0079] At least one carbon nano filler (Component A1) is selected from the group consisting of carbon nanotubes, surface-modified carbon nanotubes, carbon nanostructures, and any combination thereof.
[0080] Carbon nanotubes (CNTs) are intended to denote any material whose structure comprises at least one graphene layer wound in the form of a hollow cylinder, at least one of the ends of which, and preferably at each end, is covered by a hemispherical fullerene. The term "cylinder", which has a broad geometric meaning, must be understood as the surface generated by the rotation of a straight line parallel to a fixed straight axis, thereby generating a curve around said axis. As examples of possible shapes of this curve, mention may be worthily made of a circle and an ellipse.
[0081] When the structure of the carbon nanotubes useful in the present invention comprises no more than one graphene monolayer, in which case the carbon nanotubes are generally referred to as "single-walled carbon nanotubes" (SWCNT).
[0082] When the structure of the carbon nanotubes useful in the present invention can include a coaxial assembly of two SWCNTs (meaning one SWCNT nested within another), in which case the carbon nanotubes are generally referred to as "double-walled carbon nanotubes" (DWCNT).
[0083] When the structure of the carbon nanotubes useful in the present invention includes a coaxial assembly of several SWCNTs (nested SWCNTs), in which case the carbon nanotubes are generally referred to as "multi-walled carbon nanotubes" (MWCNT). MWCNT generally contain more than 3, preferably more than 6, and more preferably more than 10 coaxial SWCNTs and / or less than 60, preferably less than 40, and more preferably less than 20 coaxial SWCNTs.
[0084] In the context of the present disclosure, the term "carbon nanotubes" also includes carbon nanotapes (e.g., tapes of SWCNT or MWCNT) representing bundles of carbon nanotubes.
[0085] Such carbon nanotubes are preferably selected from the group consisting of SWCNT, DWCNT, MWCNT, their tapes, and any combination thereof, and more preferably from MWCNT.
[0086] The number-average diameter of the carbon nanotubes useful in the present invention can vary to a great extent, which notably depends on whether SWCNT, DWCNT, or MWCNT are used. Thus, the number-average diameter of SWCNT is generally greater than 0.3 nm and preferably greater than 0.6 nm; furthermore, the diameter of SWCNT is generally less than 3.0 nm and preferably less than 2.0 nm. The number-average diameter of DWCNT is generally at least 0.5 nm and preferably greater than 0.8 nm; it is generally less than 6 nm, preferably less than 5 nm, and more preferably less than 4 nm. The number-average diameter of MWCNT is generally at least 3 nm and preferably greater than 6 nm; it is generally less than 60 nm, preferably less than 40 nm, and more preferably less than 20 nm. Some suitable MWCNT have a number-average diameter from about 10 to about 15 nm.
[0087] The carbon nanotubes useful in the present invention generally have a length that is significantly higher than their diameter (see, for example, Kirk-Othmer Encyclopedia of Chemical Technology (John Wiley and Sons 2005), Volume 17, Nanotechnology, pages 2 to 4). Specifically, the number average length diameter of the carbon nanotubes (measured along their longitudinal axis) that can be used according to the present invention can be hundreds or even thousands of times higher than their number average diameter. This number average length is generally greater than 100 nm, preferably greater than 1 micron, and more preferably greater than 3 microns and / or generally less than 100 microns, preferably less than 50 microns, more preferably less than 30 microns.
[0088] The number average diameter and number average length of the carbon nanotubes can be determined by any technique known to those skilled in the art; advantageously, direct measurements of micrographs obtained by scanning electron microscopy (SEM) combined with software image analysis techniques can be used.
[0089] The carbon nanotubes that can be used in the present invention can be manufactured by any known technique. Non-limiting examples of such methods include: arc discharge, pulsed laser vaporization (PLV), chemical vapor deposition (CVD), and gas phase processes. Arc discharge is a plasma-based process that uses solid carbon electrodes for MWCNT or carbon composites for SWCNT. The pulsed laser vaporization (PLV) method is basically used to produce SWCNT, which uses a high-power pulsed laser aimed at powdered graphite loaded with a metal catalyst. Chemical vapor deposition (CVD) can be used to manufacture both SWCNT and MWCNT by flowing a heated precursor gas over a metal catalyst. In addition, gas phase processes can be used to produce both SWCNT and MWCNT.
[0090] Carbon nanotubes generally have an elemental carbon purity of greater than 65%, and the remainder may consist of residual catalytic impurities. Preferably, the carbon nanotubes contain at least 90% elemental carbon, and more preferably at least 95% elemental carbon.
[0091] Preferably, the carbon nanotubes have a volume resistivity of from 10 -2 to 10 -6 Ω.cm, preferably from 10 -3 to 10 -5 Ω.cm.
[0092] SWCNTs are notably commercially available from Sumitomo Shoji (Japan). DWCNTs are commercially available from Nanograf. MWCNTs are notably commercially available from Hyperion Catalysis, Mitsui Bussan (Japan), Nikkisou, Nanocyl, Applied Sciences, Shenzhen Nanotech, CNI, Sun Nanotech (Nanchang) and Iljin Nanotech. Suitable MWCNTs include those having a purity as low as 90% C purity of the NC7000 MWCNT grade or having a C purity of 95% C purity of the NC3100 MWCNT grade, both from Nanocyl (Belgium). The NC7000 MWCNT has an average diameter of 9.5 nm, an average length of 1.5 µm, a BET surface area of 250 - 300 m 2 / g and a volume resistivity of 1·10 -4 Ω.cm. Other suitable sources of carbon nanotubes are the MWCNTs from Hyperion Catalysis International, which have an outer diameter of about 10 nm and a length of more than 10 µm.
[0093] As previously mentioned, the component A1 useful in the present invention can be at least one surface - modified carbon nanotube, i.e., the outer surface of the carbon nanotube can be chemically modified with functional groups, for example to increase its compatibility with at least one PAEK polymer. The functionalization of the carbon nanotubes can be of non - covalent or covalent nature, notably as explained in Kirk - Othmer, Encyclopedia of Chemical Technology, supra, pages 8 - 9). Covalent functionalization is generally preferred and can be achieved in a conventional manner by treating the carbon nanotubes with reagents such as oxidants, acids and bases. The functional groups can notably be carboxyl, ester, ketone, sulfonic acid, sulfonyl or amino groups.
[0094] In a preferred embodiment, the surface - modified carbon nanotube is an amino - grafted carbon nanotube, notably as disclosed by Z. Cao et al. / Applied Surface Science, 353 (2015), pages 873 - 881.
[0095] The number average diameter and number average length of the surface-modified carbon nanotubes useful in the present invention can vary to a large extent, notably depending on the SWCNT, DWCNT or MWCNT before modification.
[0096] As previously mentioned, the component A1 useful in the present invention can be a carbon nanostructure. The carbon nanostructure is typically a chemically cross-linked carbon nanotube.
[0097] The cross-linked carbon nanotubes are notably the commercial product Athlos available from Cabot Corporation TM .
[0098] The number average diameter and number average length of the nanostructures useful in the present invention, notably the chemically cross-linked carbon nanotubes, can vary to a large extent, notably depending on the SWCNT, DWCNT or MWCNT before they are cross-linked.
[0099] Advantageously, the component A1 does not include hollow carbon nanospheres.
[0100] The component A1 can have a specific surface area (BET) of from 100 to 800 m 2 / g, preferably from 150 to 600 m 2 / g, more preferably from 200 to 350 m 2 / g, and most preferably from 200 to 300 m 2 / g, measured according to the Brunauer-Emmett-Teller method as described in the journal "The Journal of American Chemical Society, 60, 309 (1938)", such as ASTM D6556.
[0101] The amount of the component A1 is at least 1 wt.%, preferably at least 1.5 wt.%, or more preferably at least 2 wt.%, and at most 10 wt.%, preferably at most 5 wt.%, more preferably at most 4 wt.%, based on the total weight of the polyarylether composition (C).
[0102] Since component A1 may be difficult to handle due to its nanostructure, component A1 can first be dispersed in a polymer carrier to form a nanofiller masterbatch ("MB"). Then the PAEK polymer, the nanofiller MB, at least one non-fiber filler (component A2), and any optional components or additives are fed into a mixer (preferably a melt mixer). The polymer carrier is preferably the same as the PAEK polymer of the polyaryletherketone composition (C) but can be different from the PAEK polymer. Generally, the polymer carrier is selected from polyaryletherketone polymers, such as those containing greater than 50 wt.% of the repeating unit (R1) having any one of formulas (I) to (XXI) described herein, but can also include poly(biphenylene ether sulfone) or polyethersulfone or consist thereof. The polymer carrier is preferably the same as the PAEK polymer used in the polyaryletherketone composition (C), and both the polymer carrier and the PAEK polymer contain greater than 50 wt.% of the repeating unit (R1) having formula (VII).
[0103] Non-fiber filler (Component A2)
[0104] The non-fiber filler (component A2) is herein considered to have a three-dimensional structure that has a length, a width, and a thickness (or height).
[0105] The dimensions (length, width, thickness) of the non-fiber filler can be determined by direct measurement on a micrograph obtained by a scanning electron microscope (SEM).
[0106] The average dimensions (i.e., length, width, and thickness) of the non-fiber filler can be taken as the average length of component A2 before incorporation into the polyaryletherketone composition (C), or can be taken as the average dimensions of component A2 in the polyaryletherketone composition (C).
[0107] The non-fiber filler (component A2) can be a particulate filler. The particulate filler has a low aspect ratio of less than 2, which is defined as the ratio of its maximum dimension to its minimum dimension. The particulate filler is generally spherical or oval in shape. Examples of the particulate filler are zinc oxide, zinc sulfide, silica, dolomite, alumina, calcium sulfate, calcium carbonate, titanium oxide, clay, glass powder, nickel carbonate, iron oxide, quartz powder, magnesium carbonate, fluorocarbon resin, barium sulfate, graphite, and carbon powder.
[0108] The non-fiber filler (component A2) can be in the form of flakes or plates. The flake or plate filler can have an aspect ratio defined as the ratio of its maximum dimension to its minimum dimension of greater than 5, preferably at least 10. The flake or plate filler has a substantially two-dimensional shape, meaning that one dimension (thickness or height) is significantly smaller than the other two characteristic dimensions (width and length), like a thin sheet. Examples of the flake or plate filler are talc, kaolin, mica, and glass flakes.
[0109] The glass flakes as Component A2 are silica-based glass compounds containing several metal oxides, which can be customized to produce different types of glass. The main oxide is silica in the form of silica sand; other oxides (such as calcium, sodium, and aluminum) are incorporated to lower the melting temperature and hinder crystallization. Any type of glass can be used in the glass filler, such as A, C, D, E, M, S, R, T glass or mixtures thereof, preferably C or E glass. C glass contains alkaline components and has high acid resistance. E glass contains little alkali and thus has high stability in resins and no electrical conductivity.
[0110] The glass flakes as Component A2 preferably comprise or consist of glass flakes having C glass or E glass. Suitable glass flakes (C) having E or C glass are commercially available from Nippon Sheet Glass Co., Ltd. (NSG) as commercially available. E-glass flakes are particularly effective in preventing warping and improving the dimensional accuracy of precision parts made of thermoplastic polymers. Glass flakes are also commercially available from NSG, with an average thickness of 0.4 to 1 micron, suitable for fine and thin molded products. In some embodiments, the glass flakes can be granular. For example, granular glass flakes having E glass are commercially available from Nippon Sheet Glass Co., Ltd. (NSG).
[0111] Mica in the form of plate-like fillers (such as those from Imerys ) has obtained good results. For example, the phlogopite mica product 200-HK is a plate-like mineral with an average particle size of 60 microns.
[0112] The non-fiber fillers (Component A2) usable in the present invention are preferably not electrically conductive.
[0113] Preferably, the non-fiber fillers (Component A2) have an average particle size distribution (also referred to as d 50 ) ranging from 1 to 300 μm, preferably from 10 to 200 μm, preferably from 10 to 180 μm, as measured by electron microscopy or laser scattering in isopropanol.
[0114] Component A2 preferably can be selected from the group consisting of mica, metal-coated mica, glass flakes, wollastonite, talc, and any combination thereof.
[0115] The non-fiber fillers (Component A2) are preferably not functionalized with at least one of the following: sulfonic group, phosphino group, carboxyl group (e.g., carboxylic acid group), amino group, hydroxyl group, or thiol group.
[0116] The non-fiber fillers (Component A2) do not include organically modified mica, such as mica modified with C 12-C 36 alkyl or C 5 -C 30 Organic phosphate or ammonium salt organic-modified mica substituted with an aromatic group.
[0117] When the flaky filler is present in the polyarylether composition (C), the average thickness of the flakes can be from 0.1 to 5 μm, preferably from 0.2 to 2 μm, more preferably from 0.5 to 1.5 μm as measured by electron microscopy.
[0118] The non-fiber filler (component A2) is more than 10 wt.%, preferably at least 15 wt.%, more preferably at least 20 wt.%, still more preferably at least 30 wt.%, and / or at most 50 wt.%, preferably at most 40 wt.%, more preferably at most 35 wt.% based on the total weight of the polyarylether composition (C).
[0119] Furthermore, no pretreatment for combining component A1 with component A2 is required before blending. For example, it is not necessary to coat component A1 onto component A2.
[0120] Where component A1 and component A2 are present in the polyarylether composition (C), the weight of the PAEK polymer is at least 30 wt.%, or at least 40 wt.%, or at least 50 wt.% and / or at most 90 wt.%, preferably at most 80 wt.%, more preferably at most 70 wt.% based on the total weight of the polyarylether composition (C).
[0121] Where component A1 and component A2 are present in the polyarylether composition (C), the PAEK polymer is preferably not crosslinked with component A1 and / or component A2. In particular, there is no connection between the PAEK polymer and component A2.
[0122] Optional other polymers
[0123] The polyarylether composition (C) may further comprise at least one poly(biphenylene ether sulfone) (hereinafter referred to as "component A3") and / or at least one polyether sulfone (hereinafter referred to as "component A4").
[0124] For the purposes of the present invention, poly(biphenylene ether sulfone) is intended to mean a condensation polymer in which at least 50 mol.%, at least 60 mol.%, at least 70 mol%, at least 80 mol.%, at least 90 mol.%, at least 95 mol.%, or at least 99 mol.% of the repeating units are repeating units (R2) selected from the following:
[0125]
[0126]
[0127] and
[0128]
[0129] Using the repeating unit of formula (2) in the repeating unit (R2) generally provides the best overall cost-property balance and the highest level of toughness. For the purposes of the present invention, a polyphenylsulfone (PPSU) polymer is intended to mean any condensation polymer in which at least 50 mol% of the repeating units are repeating units (R2) having formula (2).
[0130] Poly(biphenyl ether sulfone) (component A3) notably can be a homopolymer, a random, alternating or block copolymer.
[0131] When poly(biphenyl ether sulfone) (component A3) is a copolymer, its repeating units notably can consist of (i) repeating units (R2) having at least two different formulas selected from formulas (2) to (6), or (ii) repeating units (R2) having one or more of formulas (2) to (6) (especially repeating units having formula (2)) and repeating units (R2*) (different from repeating units (R2)), such as:
[0132]
[0133] and
[0134]
[0135] Preferably, more than 70 mol%, more preferably more than 85 mol% of the repeating units of poly(biphenyl ether sulfone) (component A3) are repeating units (R2) having formula (2). Even more preferably, substantially all of the repeating units of poly(biphenyl ether sulfone) (component A3) are repeating units (R2) having formula (2). Most preferably, all of the repeating units of poly(biphenyl ether sulfone) (component A3) are repeating units (R2) having formula (2).
[0136] When poly(biphenyl ether sulfone) (component A3) is a polyphenylsulfone homopolymer, i.e., a polymer in which substantially all (if not all) of the repeating units are those having formula (2), excellent results are generally obtained. Polyphenylsulfone from Solvay Specialty Polymers USA, L.L.C. Polyphenylsulfone is an example of a polyphenylsulfone homopolymer (PPSU).
[0137] Poly(arylene ether sulfone) (Component A3) can be prepared by any method. Methods well known in the art are those described in U.S. Patent Nos. 3,634,355; 4,008,203; 4,108,837 and 4,175,175, the entire contents of which are incorporated herein by reference.
[0138] The polyarylether composition (C) can contain one and only one poly(arylene ether sulfone) (Component A3). Alternatively, it can contain two, three, or even more than three poly(arylene ether sulfone) (Component A3).
[0139] For the purposes of the present invention, polyethersulfone (Component A4) denotes any polymer comprising at least 50 mol.%, at least 60 mol.%, at least 70 mol.%, at least 80 mol.%, at least 90 mol.%, at least 95 mol.%, or at least 99 mol.% of repeating units (R PES ) having the formula (J):
[0140]
[0141] mol.% is based on the total number of moles of repeating units in the polyethersulfone polymer.
[0142] The polyethersulfone polymer can be prepared by known methods, such as the condensation of bisphenol S and dichlorodiphenyl sulfone, and is notably available from Solvay Specialty Polymers USA, Inc. as PESU.
[0143] When poly(arylene ether sulfone) (Component A3) and / or polyethersulfone (Component A4) are present in the polyarylether composition (C), the weight of the PAEK polymer is at least 50 wt.%, preferably at least 60 wt.%, more preferably at least 70 wt.% and / or at most 90 wt.%, preferably at most 80 wt.%, based on the combined weight of the PAEK polymer and Component A3 / Component A4 in the polyarylether composition (C).
[0144] The polyarylether composition (C) may further comprise a polymer carrier different from the PAEK polymer present in the polyarylether composition (C). Generally, the polymer carrier may be selected from polyaryletherketone polymers, such as those comprising greater than 50 wt.% of repeating units (R1) having any one of formulas (I) to (XXI) described herein, but may also include poly(biphenyl ether sulfone) or polyethersulfone or consist thereof. The polymer carrier preferably comprises greater than 50 wt.% of repeating units (R1) having formula (VII). When such a polymer carrier different from the PAEK polymer is present in the polyarylether composition (C), the weight of the PAEK polymer is at least 50 wt.%, preferably at least 60 wt.%, more preferably at least 70 wt.% and / or at most 95 wt.%, preferably at most 90 wt.%, based on the combined weight of the PAEK polymer and the polymer carrier in the polyarylether composition (C).
[0145] One or more optional additives
[0146] In some embodiments, the polyarylether composition (C) according to the present invention comprises additives selected from the group consisting of: ultraviolet (“UV”) stabilizers, heat stabilizers, pigments, dyes, flame retardants, impact modifiers, lubricants, nucleating agents, antioxidants, processing aids, and any combination of one or more thereof.
[0147] In some embodiments in which the polyarylether composition (C) comprises optional additives, the total concentration of the additives does not exceed 15 wt.%, does not exceed 10 wt.%, does not exceed 5 wt.%, does not exceed 1 wt.%, does not exceed 0.5 wt.%, does not exceed 0.4 wt.%, does not exceed 0.3 wt.%, does not exceed 0.2 wt.%, or does not exceed 0.1 wt.%.
[0148] One or more pigments may be particularly desired additives in the polyarylether composition (C) to produce white, black or colored articles. The pigments may be black pigments such as carbon black, white pigments such as zinc oxide, zinc sulfide, lithopone, antimony white, and titanium dioxide (rutile or anatase type, preferably rutile type), and / or colored pigments. The pigments are generally present in an amount from 0 to 6 wt%, preferably from 0.05 to 5 wt% and particularly from 0.1 to 3 wt% based on the total weight of the polyarylether composition (C).
[0149] Antioxidants may be particularly desired additives in the polyarylether composition (C). The antioxidants may improve the thermal stability and light stability of the polyarylether composition (C). For example, an antioxidant that is a heat stabilizer may improve the thermal stability of the composition during manufacture (or in a high heat application environment) by, for example, enabling the polymer to be processed at high temperatures while helping to prevent polymer degradation.
[0150] Method for preparing a polyarylether composition (C)
[0151] The polyarylether composition (C) according to the present invention can be prepared by methods well known in the art.
[0152] For example, the polyarylether composition (C) is prepared by melt-blending at least one PAEK polymer, at least one conductive carbon nanofiller (component A1), at least one non-fibrous filler (component A2), and any optional components or additives. Any suitable melt-blending method can be used to combine the components of the polyarylether composition (C). For example, all components can be fed into a melt mixer, such as a single-screw extruder or a twin-screw extruder, a stirrer, a single-screw or twin-screw kneader, or a Banbury mixer. These components can be added all at once to the melt mixer, or added stepwise in batches. When adding the components stepwise in batches, a part of the components is added first, and then melt-blended with the remaining parts of the subsequently added components until a well-mixed composition is obtained.
[0153] Since the carbon nanofiller (component A1) may be difficult to handle due to its nanostructure, component A1 can be first dispersed into a polymer carrier to form a nanofiller masterbatch ("MB"). Then the PAEK polymer, the nanofiller MB (containing component A1), at least one non-fibrous filler (component A2), and any optional additives are fed into a melt mixer. The polymer carrier in the MB is preferably the same as the PAEK polymer in the polyarylether composition (C) but can be different from the PAEK polymer. Generally, the polymer carrier is selected from polyaryletherketone polymers, such as those containing greater than 50 wt.% of the repeating units (R1) having any one of formulas (I) to (XXI) described herein, but can also include poly(biphenyl ether sulfone) or polyethersulfone or consist thereof. The polymer carrier is preferably the same as the PAEK polymer used in the polyarylether composition (C), and both the polymer carrier and the PAEK polymer contain greater than 50 wt.% of the repeating unit of formula (VII).
[0154] Article
[0155] As previously mentioned, the present invention further relates to an article, preferably a molded article, comprising the polyarylether composition (C) or made therefrom.
[0156] The polyarylether composition (C) as detailed above can be processed by conventional melt processing techniques to provide molded articles, which notably include extrusion molding, injection molding, and compression molding.
[0157] Such an article has a value measured according to ASTM D257 from 1·10 +5from Ω.cm to 5·10 +12 volume resistivity of Ω.cm.
[0158] It has been found that the article has at least 10 6 and at most 10 9 surface resistivity of Ω / sq.
[0159] Volume resistivity is the resistance to leakage current through the bulk of an insulating material. Surface resistivity is the resistance to leakage current along the surface of an insulating material.
[0160] It has also been found that the article has a flow molding shrinkage rate or transverse molding shrinkage rate of at most 1.0%, at most 0.9%, at most 0.8%, or at most 0.7%, preferably from 0.1% to 0.6%, more preferably from 0.2% to 0.5%, based on Method ASTM D955.
[0161] As used herein, the term "molding shrinkage" refers to the shrinkage of a polymer upon cooling after its molding process. It is typically used to properly process injection molding so that the final part dimensions are as desired. Flow molding shrinkage refers to the molding shrinkage in the flow direction. Transverse molding shrinkage (or cross-flow molding shrinkage) refers to the molding shrinkage in the transverse (cross-flow) direction.
[0162] The molded article of the present invention is preferably selected from the group consisting of: (i) extruded profiles, preferably selected from the group consisting of rods, plates, pipe fittings, pipes, or profiles; and (ii) injection molded articles.
[0163] According to certain embodiments, the molded article is in the form of a substantially two-dimensional article, such as a part in which one dimension (thickness or height) is significantly smaller than the other two characteristic dimensions (width and length), such as films, sheaths, and sheets.
[0164] According to other embodiments, the molded article is provided as a three-dimensional part, such as substantially extending in three dimensions of space in a similar manner, including in the form of a part having a complex geometry, such as having concave or convex portions, and may include undercuts, inserts, etc.
[0165] The polyarylether composition (C) can be used to manufacture electrostatic dissipation articles, such as but not limited to substrate carriers. Substrate carriers can include but are not limited to wafer carriers, reticle pods, shippers, chip trays, test sockets, head trays (for reading and / or writing); fluid pipes, chemical containers, etc.
[0166] The molded article may include, but is not limited to, some or all of a photomask carrier as shown in U.S. Patent Nos. 6,513,654 and 6,216,873; a disk transporter as shown in U.S. Patent Nos. 4,557,382 and 5,253,755; a chip tray as shown in U.S. Patent No. 6,857,524; a wafer carrier as shown in U.S. Patent No. 6,848,578; each of these references being incorporated herein by reference in its entirety.
[0167] According to certain embodiments, a molded article made from the polyarylether composition (C) detailed above is provided as one or more parts of an electrostatic discharge (ESD) protection device, which may be designed, for example, to connect to a semiconductor wafer intended for chip manufacturing.
[0168] Examples
[0169] The present invention will now be described with reference to the following examples, which are for illustrative purposes only and are not intended to limit the scope of the invention. As used in the examples, "E" represents an example embodiment of the present invention, and "CE" represents a comparative example.
[0170] Materials
[0171] ● PEEK: from Solvay Specialty Polymers KT-890P
[0172] ● Component A1: MWCNT: multi-walled carbon nanotubes from Mitsubishi Gas Chemical Co. NC7000; having an average diameter of 9.5 nanometers, an average length of 1.5 micrometers, a BET surface area of 250 - 300 m 2 / g and a volume resistivity of 1·10 -4 Ω.cm
[0173] o CNT masterbatch (CNT MB): 10 wt% of NC7000 in 90 wt% KT-890P PEEK
[0174] ● Component A2:
[0175] o Mica in the form of plates: from Imerys 200-HKo glass flakes: very thin E-glass flakes MEG160FY-M03 from Nippon Sheet Glass Co., having an average length of 160 micrometers (flat surface) and a thickness of 0.7 micrometers.
[0176] Testing method
[0177] ● Tensile properties - ISO 527
[0178] The tensile modulus, tensile strength, and elongation at break are measured on 5 injection - molded ISO 1a type tensile specimens (total length = 170 mm, gauge length = 50 mm, test section width = 10 mm, and thickness = 4 mm).
[0179] ● Impact strength - ISO 180
[0180] The notched and unnotched Izod impact strength properties (in kJ / m 2 2) are measured using 10 injection - molded ISO 1A type bars (length 80 ± 2 mm, width 10 ± 0.2 mm, thickness 4 ± 0.2 mm).
[0181] ● Molding shrinkage - ISO 294 (ASTM D955)
[0182] The molding shrinkage (molding shrinkage (%) in the flow direction and molding shrinkage (%) in the transverse direction) is measured on 5 injection - molded substrates with dimensions of 60 mm width by 60 mm length by 2 mm thickness.
[0183] ● Volume and surface resistivity - ASTM D257
[0184] The volume and surface resistivity are measured on 5 injection - molded substrates with dimensions of 4”×4”×1 / 8” (length × width × thickness) or 60 mm×60 mm×2 mm (length × width × thickness).
[0185] Example 1
[0186] The resin and filler are fed into a ZSK - 26 mm co - rotating twin - screw extruder using a gravity feeder, and the gravity feeder is adjusted for each run to achieve the target blend ratio in Table 1. All blending and controlled compounding conditions are shown in Table 2. The set points on the extruder are the same for all runs.
[0187] Then the composition prepared by injection molding according to ASTM D3641 is used to provide molded articles.
[0188] Table 1
[0189]
[0190]
[0191] Table 2
[0192]
[0193] Example 2
[0194] The three components for preparing Sample E2 are listed in Table 1. The compositions and molded articles of Example 2 were prepared in the same manner as in Example 1.
[0195] Comparative Example 3
[0196] The two components (PEEK, A1) for preparing Sample CE3 are listed in Table 1.
[0197] The compositions and molded articles of Comparative Example 3 were prepared in the same manner as in Example 1.
[0198] As shown by the results in Table 3, the compositions (E1 and E2) according to the present invention are effective in improving the volume and surface resistivity of the articles and render the articles suitable for ESD applications. In contrast, Sample CE3 having only MWCNT has poor volume and surface resistivity, beyond the range suitable for ESD applications.
[0199] Furthermore, compared to CE3 having much higher flow and transverse molding shrinkage rates (1.5% and 1.6% respectively), the compositions (E1 and E2) according to the present invention optimize the molding shrinkage rate of the articles, reducing the molding shrinkage rate to 0.5% or 0.6%.
[0200] Table 3
[0201]
[0202] *x-flow represents the transverse shrinkage rate.
[0203] The disclosures of all patent applications and publications cited herein are incorporated herein by reference to the extent that they provide exemplary, procedural, or other detailed supplementation to those presented herein. If the disclosures of any patents, patent applications, and publications incorporated herein by reference conflict with the description of the present application to the extent that it may result in unclear terms, then this description should prevail. Any incorporation of documents by reference is limited such that no subject matter contrary to the explicit disclosure herein is incorporated.
[0204] While the preferred embodiments of the present invention have been shown and described, those skilled in the art can make modifications thereto without departing from the teachings of the present invention. The embodiments described herein are merely exemplary and non-limiting. Various changes and modifications of the compositions, articles, and methods are possible and are within the scope of the present invention. Accordingly, the scope of protection is not limited by the description presented above, but is only limited by the following claims, which scope includes all equivalents of the subject matter of the claims. Each claim is incorporated into the specification as an embodiment of the present invention. Thus, the claims are a further description and an addition to the preferred embodiments of the present invention.
Claims
1. A polyarylether composition (C), comprising: at least one poly(aryl ether ketone) polymer (PAEK polymer), at least one electrically conductive carbon nanofiller (component A1), and at least one non-fibrous filler (component A2).
2. The polyarylether composition (C) according to claim 1, wherein, The PAEK polymer comprises repeating units represented by any one of the following formulas (I) to (V) in an amount greater than 50 wt.%, at least 60 wt.%, at least 70 wt.%, at least 80 wt.%, at least 90 wt.%, at least 95 wt.%, at least 99 wt.%, based on the total weight of the repeating units in the PAEK polymer (R PAEK ): where: - Ar is independently a divalent aromatic group selected from the group consisting of phenylene, biphenylene or naphthylene, - X is independently O, C(=O) or a direct bond, - n is an integer from 0 to 3, - b, c, d and e are 0 or 1, - a is an integer from 1 to 4, and - preferably, when b is 1, d is 0.
3. The polyarylether composition (C) according to claim 1 or 2, wherein, the at least one electrically conductive carbon nanofiller (component A1) is selected from the group consisting of carbon nanotubes, surface-modified carbon nanotubes, carbon nanostructures and any combination thereof, the carbon nanotubes or surface-modified carbon nanotubes are selected from the group consisting of single-walled carbon nanotubes, double-walled carbon nanotubes, multi-walled carbon nanotubes, strips thereof, and any combination thereof, preferably selected from multi-walled carbon nanotubes, and the carbon nanostructure is chemically crosslinked carbon nanotubes.
4. The polyarylether composition (C) according to claim 3, wherein, the surface-modified carbon nanotubes are amino-grafted carbon nanotubes.
5. The polyarylether composition (C) according to any one of claims 1 to 4, wherein, component A1 does not include hollow carbon nanospheres.
6. The polyarylether composition (C) according to any one of claims 1 to 5, wherein, the polyarylether composition (C) comprises at least 1 wt.%, preferably at least 1.5 wt.%, or more preferably at least 2 wt.%, and / or at most 10 wt.%, preferably at most 5 wt.%, more preferably at most 4 wt.% of component A1 based on the total weight of the polyarylether composition (C).
7. The polyarylether composition (C) according to any one of claims 1 to 6, wherein, component A2 is selected from the group consisting of mica, metal-coated mica, glass flakes, wollastonite, talc, and any combination thereof.
8. The polyarylether composition (C) according to any one of claims 1 to 7, wherein, component A2 is in the form of plates or flakes.
9. The polyarylether composition (C) according to any one of claims 1 to 8, wherein, component A2 is non-conductive.
10. The polyarylether composition (C) according to any one of claims 1 to 9, wherein, the polyarylether composition (C) comprises more than 10 wt.%, preferably at least 15 wt.%, more preferably at least 20 wt.%, still more preferably at least 30 wt.%, and / or at most 50 wt.%, preferably at most 40 wt.%, more preferably at most 35 wt.% of component A2 based on the total weight of the polyarylether composition (C).
11. The polyarylether composition (C) according to any one of claims 1 to 10, wherein, the PAEK polymer is not crosslinked with component A1 and / or component A2.
12. The polyarylether composition (C) according to any one of claims 1 to 11, comprising: · at least 40 wt.% to less than 89 wt.% of said at least one PAEK polymer, · at least 1 wt.% and at most 10 wt.% of component A1, and · greater than 10 wt.% and at most 50 wt.% of component A2, wherein said wt.% is based on the total weight of the composition (C).
13. A method for preparing a polyarylether composition (C) according to any one of claims 1 to 12, the method comprising melt-blending the PAEK polymer, the conductive carbon nano-filler (component A1), the at least one non-fibrous filler (component A2), and any optional component or additive.
14. The method for preparing a polyarylether composition (C) according to claim 13, wherein, component A1 is first dispersed in a polymer carrier to form a nano-filler masterbatch ("MB"), and then the PAEK polymer, the nano-filler MB, the at least one non-fibrous filler (component A2), and any optional component or additive are fed into a melt mixer.
15. A molded article suitable for electrostatic discharge applications, comprising the polyarylether composition (C) according to any one of claims 1 to 12 or made therefrom, said article having a volume resistivity measured according to ASTM D257 from 1·10 +5 Ω.cm to 5·10 +12 Ω.cm.
16. The molded article according to claim 15, having at least 10 6 and at most 10 9 Ω / sq surface resistivity and having a flow molding shrinkage or transverse molding shrinkage of at most 1.0%, at most 0.9%, at most 0.8%, or at most 0.7%, preferably from 0.1% to 0.6% based on method ASTM D955.
17. The molded article according to claim 15 or 16, which is a substrate carrier selected from the group consisting of a wafer carrier, a photomask cassette, a transporter, a chip tray, a test socket, a head tray, a fluid conduit, and a chemical container.
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