A polishing device for semiconductor surfaces

Abstract

This invention discloses a polishing device for semiconductor surfaces, relating to the field of semiconductor polishing technology. It includes a device body, an adjustment device, and a cooling device. The top of the device body has a processing groove, and a lifting device is fixedly mounted on the top of the device body. An installation plate is fixedly mounted on the output end of the lifting device. A driving device is fixedly mounted on the top of the installation plate, and a grinding plate is fixedly mounted on the output end of the driving device. A polishing plate is fixedly mounted on the output end of the rotating device. The adjustment device includes a storage frame and a control assembly. The control assembly includes a baffle, a partition plate, a limiting plate, a sliding plate, a discharge pipe, a contact plate, a trapezoidal block, a sealing frame, a sealing plate, a bending rod, a cover plate, and a rotating plate. The storage frame is fixedly mounted on the top of the installation plate. This invention improves the efficiency of semiconductor polishing.

Description

Technical Field

[0001] This invention relates to the field of semiconductor polishing technology, specifically to a polishing device for semiconductor surfaces. Background Technology

[0002] Semiconductor polishing is an important process step in semiconductor manufacturing, used to smooth and clean the surface of semiconductor materials. Its main purpose is to remove defects, roughness, and contaminants from the material surface to improve device performance and reliability.

[0003] Patent publication number CN211220177U relates to a polishing device for semiconductor wafer production, specifically in the field of polishing equipment technology. The device includes a main body with a movable rod fixedly mounted on its top surface. A polishing head is integrally formed at the bottom end of the movable rod, and a polishing disc is fixedly mounted on the top end of the polishing head. A support device is fixedly mounted at the bottom end of the main body, and a worktable is fixedly mounted on the top end of the support device. A connecting plate is adhered to the surface of the support device, and a support rod is integrally formed on the surface of the connecting plate. This patent incorporates an automatic liquid-adding device, which periodically drips polishing liquid onto the surface of the semiconductor crystal during polishing. This eliminates the need for the operator to be distracted by adding polishing liquid, allowing them to focus solely on polishing the semiconductor crystal. This improves the processing quality of the semiconductor crystals produced by the device and enhances its practicality.

[0004] In the aforementioned patent, by setting up an automatic liquid-adding device, the polishing liquid is dripped onto the surface of the semiconductor crystal at regular intervals while the operator is polishing it. This eliminates the need for the operator to be distracted by adding polishing liquid, allowing them to focus solely on polishing the semiconductor crystal and increasing the processing quality of the semiconductor crystal produced by the device. However, polishing the semiconductor requires spraying polishing liquid, and after polishing, excess polishing liquid and waste residue on the semiconductor surface need to be removed promptly. The inability to remove excess polishing liquid and waste residue on the semiconductor surface in a timely manner will affect the efficiency of semiconductor polishing.

[0005] Therefore, it is necessary to design a polishing device for semiconductor surfaces that can improve the efficiency of semiconductor polishing. Summary of the Invention

[0006] The purpose of this invention is to provide a polishing apparatus for semiconductor surfaces to solve the problems mentioned in the background art.

[0007] To solve the above-mentioned technical problems, the present invention provides the following technical solution: a polishing device for semiconductor surfaces, comprising a device body, an adjustment device, and a cooling device, wherein a processing groove is provided on the top of the device body, a lifting device is fixedly installed on the top of the device body, a mounting plate is fixedly installed on the output end of the lifting device, a driving device is fixedly installed on the top of the mounting plate, a grinding plate is fixedly installed on the output end of the driving device, and a polishing plate is fixedly installed on the output end of the rotating device; wherein the adjustment device comprises a storage frame and a control component, the control component comprising a baffle, a partition plate, a limiting plate, a sliding plate, a discharge pipe, a contact plate, a trapezoidal block, a sealing frame, a sealing plate, a bending rod, a cover plate, and a rotating plate, the storage frame is fixedly installed on the top of the mounting plate, the baffle is fixedly installed inside the storage frame, and the partition plate is fixedly installed on the top of the baffle. The limiting plate is slidably installed at the bottom of the baffle, the sliding plate is fixedly installed on the surface of the limiting plate, the discharge pipe is fixedly installed at the bottom of the storage frame, the contact plate is fixedly installed at the top of the device body, the surface of the contact plate has through holes and notches, the trapezoidal block is rotatably installed at the top of the through holes, the sealing frame is fixedly installed on the surface of the contact plate, the sealing plate is slidably installed on the inner wall of the sealing frame, the bending rod is fixedly installed on the top of the sealing plate, the surface of the sealing frame has ventilation ports, the cover plate is rotatably installed on the outer wall of the sealing frame, the surface of the cover plate has exhaust ports. The cooling device includes an elastic telescopic rod and a heat exchange assembly, the heat exchange assembly is located inside the device body, the right side of the partition plate stores water, and the left side of the partition plate stores polishing fluid, so that polishing fluid and water can be added in time, and foreign matter and polishing fluid on the semiconductor surface can be removed in time.

[0008] According to the above technical solution, a rotating plate is rotatably installed on the top of the grinding plate, the discharge pipe is fixedly inserted through the rotating plate, and a discharge port is opened at the bottom of the grinding plate. The rotating plate allows polishing liquid and water to be sprayed directly from the bottom of the grinding plate, thereby improving the effect of polishing liquid use.

[0009] According to the above technical solution, a first spring is provided between the limiting plate and the baffle, a first spiral spring is provided between the trapezoidal block and the through hole, a second spring is provided between the sealing plate and the sealing frame, and a second spiral spring is provided between the cover plate and the sealing frame. The limiting plate can be reset by the first spring.

[0010] According to the above technical solution, the elastic telescopic rod is fixedly installed at the bottom of the mounting plate, and an inclined plate is fixedly installed on the inner wall of the device body. The heat exchange assembly includes a sliding rod, a triangular block, a heat insulation frame, a heat-conducting plate, a piston plate, a contact rod, and a jet plate. The sliding rod slides through the device body, the triangular block is fixedly installed at the top of the sliding rod, the heat insulation frame is fixedly installed at the bottom of the inclined plate, the heat-conducting plate is fixedly installed through the top of the heat insulation frame, the piston plate is slidably installed inside the heat insulation frame, the contact rod is fixedly installed at the bottom of the piston plate, and the jet plate is fixedly installed on the surface of the heat-conducting plate. When the triangular block moves to the right, it will contact the contact rod, causing the inclined surface of the triangular block to push the contact rod and the piston plate to move in a limited position. When the piston plate moves upward, it will squeeze the gas inside the heat insulation frame and spray it out from the jet plate. The piston plate will squeeze the high-temperature gas inside the heat insulation frame and spray it out from the jet plate. The gas from the jet plate can be dried by the polishing plate to avoid the surface of the polishing plate being affected by liquid, thus preventing the removal of foreign objects.

[0011] According to the above technical solution, a fixed rod is fixedly installed at the free end of the elastic telescopic rod, and a protrusion is fixedly installed on the surface of the polishing plate. When the contact rod vibrates, it will drive the piston plate to vibrate. The vibration of the piston plate can achieve the effect of cooling the polishing plate through the air flow effect inside the insulation frame and the heat-conducting plate.

[0012] According to the above technical solution, a No. 3 spring is provided between the piston plate and the heat insulation frame, and the heat-conducting plate is in contact with the polishing plate. The heat-conducting plate can dissipate heat from the polishing plate.

[0013] According to the above technical solution, it also includes a switching device and a lifting device; the lifting device includes a circular block and a loosening component, the loosening component is disposed on the top of the device body, and the switching device is disposed inside the device body. The switching device includes a guide plate and a collection component. The guide plate is fixedly installed inside the device body. The collection component has a collection frame and a flipping plate on its surface. The collection frame is fixedly installed on the top of the device body. The flipping plate is rotatably installed inside the device body via a rotating shaft. When the flipping plate rotates, it can switch the collection frame so that the collection frame on the right can collect the polishing fluid. This can avoid the impact of water and polishing fluid mixing during collection on polishing fluid recovery, which would increase the cost of semiconductor polishing.

[0014] According to the above technical solution, a No. 3 spiral spring is provided between the rotating shaft and the device body, and an elastic plate is fixedly installed on the right side of the slide rod. The elastic plate is in contact with the flip plate, and the elastic force of the elastic plate will push the flip plate to rotate, so that the elastic plate will not be affected by the slide rod, and the vibration of the slide rod will not affect the flip plate.

[0015] According to the above technical solution, the circular block is slidably mounted on the top of the polishing plate. The release assembly includes an inclined block, a pressing rod, and an arc-shaped scraper. A groove is formed on the surface of the circular block. The inclined block is fixedly mounted inside the groove. The pressing rod is fixedly mounted inside the processing groove. A sliding groove is formed at the bottom of the polishing plate. The arc-shaped scraper is rotatably mounted inside the sliding groove. When the circular block moves, it will intermittently release the contact with the semiconductor. At the same time, the circular block cannot restrict the arc-shaped scraper, so as to avoid the semiconductor and the circular block contacting each other not being polished, which will affect the overall polishing effect of the semiconductor.

[0016] According to the above technical solution, a No. 4 spring is provided between the circular block and the polishing plate, and a torsion spring is provided between the arc-shaped scraper and the slide groove. The No. 4 spring can drive the circular block to reset.

[0017] Compared with the prior art, the beneficial effects achieved by the present invention are:

[0018] (1) In the polishing equipment for semiconductor surfaces, when the slide moves on the surface of the contact plate, the trapezoidal block and the contact plate can drive the limiting plate to move. When the limiting plate moves, the sprayed polishing liquid and water can be adjusted so that the polishing plate can automatically spray polishing liquid when it moves downward and automatically spray water when it moves upward. This can remove foreign objects and polishing liquid from the semiconductor surface in time, thus facilitating the polishing of the semiconductor and improving the efficiency of semiconductor polishing. At the same time, the polishing liquid can be discharged from the bottom of the polishing plate to improve the effect of polishing liquid use.

[0019] (2) In this polishing equipment for semiconductor surfaces, when the mounting plate moves downward, the elastic telescopic rod moves. When the elastic telescopic rod moves downward, it pushes the sliding rod to move through the triangular block. When the triangular block moves, it pushes the contact rod and piston plate to move upward, so that the piston plate squeezes the high-temperature gas inside the heat insulation frame and sprays it out from the jet plate. The gas from the jet plate can dry the polishing plate and prevent the surface of the polishing plate from being affected by the removal of foreign objects. At the same time, the protrusion pushes the free end of the elastic telescopic rod to shake up and down, so that the triangular block pushes the piston plate to shake up and down, thereby allowing the gas inside the heat-conducting plate to flow, thereby improving the cooling effect of the heat-conducting plate.

[0020] (3) When the slide bar moves, it will push the flip plate to rotate. When the flip plate rotates, it will adjust the direction of the flow of the flip plate so that the collection frame can collect the polishing liquid and water separately. This can avoid the impact of water and polishing liquid being mixed during collection, which would affect the recovery of polishing liquid and thus increase the cost of polishing semiconductors.

[0021] (4) In the polishing equipment for semiconductor surfaces, when the rotating device drives the polishing plate to rotate, the extrusion rod will contact the inclined block, causing the extrusion rod to push the extrusion rod and the circular block to move, causing the circular block to intermittently release the clamping of the semiconductor, causing the arc scraper to rotate to the outside of the polishing plate under the action of the torsion spring, so that the arc scraper can polish the edge of the semiconductor, avoiding the fact that the part of the semiconductor that contacts the circular block cannot be polished, which will affect the overall polishing effect of the semiconductor. Attached Figure Description

[0022] The accompanying drawings are provided to further illustrate the invention and form part of the specification. They are used in conjunction with embodiments of the invention to explain the invention and do not constitute a limitation thereof. In the drawings:

[0023] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0024] Figure 2 This is a schematic diagram of the interior of the storage frame of the present invention;

[0025] Figure 3 This is a schematic diagram of the interior of the sealing frame of the present invention;

[0026] Figure 4 This is a schematic cross-sectional view of the grinding plate of the present invention;

[0027] Figure 5 This is a schematic cross-sectional view of the device body of the present invention;

[0028] Figure 6 This is a schematic diagram of the cross-section of the insulation frame of the present invention;

[0029] Figure 7 This is a schematic diagram showing the positions of the circular block and the inclined block of the present invention.

[0030] In the diagram: 1. Device body; 2. Lifting device; 31. Mounting plate; 32. Drive device; 33. Grinding plate; 34. Rotating device; 35. Polishing plate; 4. Control components; 41. Storage frame; 42. Baffle; 43. Divider plate; 44. Limiting plate; 45. Slide plate; 46. Discharge pipe; 47. Contact plate; 48. Trapezoidal block; 49. Sealing frame; 410. Sealing plate; 411. Bending rod; 412. Cover plate; 413. Rotating... 5. Plate; 51. Heat exchange assembly; 52. Protrusion; 53. Elastic telescopic rod; 54. Slide rod; 55. Triangular block; 56. Insulation frame; 57. Heat conduction plate; 58. Piston plate; 59. Contact rod; 510. Jet plate; 6. Fixing rod; 61. Collection assembly; 62. Inclined plate; 63. Guide plate; 64. Collection frame; 75. Flipping plate; 76. Release assembly; 77. Circular block; 78. Inclined block; 79. Extrusion rod; 70. Arc-shaped scraper. Detailed Implementation

[0031] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. Example

[0032] Please see Figure 1-6 This embodiment provides a polishing device for semiconductor surfaces, including a device body 1, an adjustment device, and a cooling device. The top of the device body 1 has a processing groove, and a lifting device 2 is fixedly mounted on the top of the device body 1. A mounting plate 31 is fixedly mounted on the output end of the lifting device 2, and a driving device 32 is fixedly mounted on the top of the mounting plate 31. A polishing plate 33 is fixedly mounted on the output end of the driving device 32, and a polishing plate 35 is fixedly mounted on the output end of a rotating device 34. The adjustment device includes a storage frame 41 and a control component 4. The control component 4 includes a baffle 42, a partition plate 43, a limiting plate 44, a sliding plate 45, a discharge pipe 46, a contact plate 47, a trapezoidal block 48, a sealing frame 49, a sealing plate 410, a bending rod 411, a cover plate 412, and a rotating plate 413. The storage frame 41 is fixedly mounted on the top of the mounting plate 31, the baffle 42 is fixedly mounted inside the storage frame 41, and the partition plate 43 is fixedly mounted on the top of the baffle 42. A limiting plate 44 is slidably installed at the bottom of a baffle 42, a sliding plate 45 is fixedly installed on the surface of the limiting plate 44, a discharge pipe 46 is fixedly installed at the bottom of a storage frame 41, a contact plate 47 is fixedly installed at the top of the device body 1, and a through hole and a notch are provided on the surface of the contact plate 47. A trapezoidal block 48 is rotatably installed at the top of the through hole, a sealing frame 49 is fixedly installed on the surface of the contact plate 47, a sealing plate 410 is slidably installed on the inner wall of the sealing frame 49, a bending rod 411 is fixedly installed at the top of the sealing plate 410, and a vent is provided on the surface of the sealing frame 49. A cover plate 412 is rotatably installed on the outer wall of the sealing frame 49, and an exhaust port is provided on the surface of the cover plate 412. The cooling device includes an elastic telescopic rod 52 and a heat exchange component 5, which is located inside the device body 1. Water is stored on the right side of the partition plate 43, and polishing liquid is stored on the left side of the partition plate 43, so that polishing liquid and water can be added in time, and foreign matter and polishing liquid on the semiconductor surface can be removed in time.

[0033] A rotating plate 413 is rotatably mounted on the top of the grinding plate 33, and a discharge pipe 46 is fixedly inserted through the rotating plate 413. A discharge port is opened at the bottom of the grinding plate 33. The polishing liquid and water can be sprayed directly from the bottom of the grinding plate 33 through the rotating plate 413, thereby improving the effect of the polishing liquid.

[0034] A first spring is provided between the limiting plate 44 and the baffle 42, a first spiral spring is provided between the trapezoidal block 48 and the through hole, a second spring is provided between the sealing plate 410 and the sealing frame 49, and a second spiral spring is provided between the cover plate 412 and the sealing frame 49. The first spring can drive the limiting plate 44 to reset.

[0035] The elastic telescopic rod 52 is fixedly installed at the bottom of the mounting plate 31. An inclined plate 61 is fixedly installed on the inner wall of the device body 1. The heat exchange assembly 5 includes a sliding rod 53, a triangular block 54, an insulation frame 55, a heat-conducting plate 56, a piston plate 57, a contact rod 58, and a jet plate 59. The sliding rod 53 slides through the device body 1. The triangular block 54 is fixedly installed at the top of the sliding rod 53. The insulation frame 55 is fixedly installed at the bottom of the inclined plate 61. The heat-conducting plate 56 is fixedly installed through the top of the insulation frame 55. The piston plate 57 slides inside the insulation frame 55. The contact rod 58 is fixedly installed at the bottom of the piston plate 57. The jet plate 59 is fixedly installed on the surface of the heat-conducting plate 56. When rod 52 moves downward, the bottom of elastic telescopic rod 52 will contact the inclined surface of triangular block 54, causing elastic telescopic rod 52 to move downward and push triangular block 54 and slide rod 53 to the right. When triangular block 54 moves to the right, it will contact rod 58, causing the inclined surface of triangular block 54 to push contact rod 58 and piston plate 57 to move in a limited position. When piston plate 57 moves upward, it will squeeze the gas inside insulation frame 55 and spray it out from jet plate 59. Piston plate 57 will squeeze the high-temperature gas inside insulation frame 55 and spray it out from jet plate 59. The gas from jet plate 59 can dry polishing plate 35, preventing liquid on the surface of polishing plate 35 from affecting the effect of foreign object removal.

[0036] A fixed rod 510 is fixedly installed at the free end of the elastic telescopic rod 52, and a protrusion 51 is fixedly installed on the surface of the polishing plate 33. The protrusion 51 will push the fixed rod 510 and the free end of the elastic telescopic rod 52 to shake downward intermittently. When the elastic telescopic rod 52 shakes up and down, it will push the triangular block 54 and the contact rod 58 to shake. When the contact rod 58 shakes, it will drive the piston plate 57 to shake. The shaking of the piston plate 57 can achieve the effect of cooling the polishing plate 35 through the air flow effect inside the insulation frame 55 and the heat-conducting plate 56.

[0037] A No. 3 spring is provided between the piston plate 57 and the insulation frame 55. The heat conduction plate 56 is in contact with the polishing plate 35, and the heat conduction plate 56 can dissipate heat from the polishing plate 35.

[0038] In the first embodiment, the lifting device 2 moves the mounting plate 31 downwards. This downward movement of the mounting plate 31 moves the storage frame 41 and the baffle 42 downwards. The downward movement of the baffle 42 moves the limiting plate 44 and the sliding plate 45 downwards. As the sliding plate 45 moves downwards, it rotates with the trapezoidal block 48 into the through hole. As the sliding plate 45 continues to move downwards, it reaches the notch position of the contact plate 47. Under the action of the first spring, it pushes the limiting plate 44 and the sliding plate 45 towards the contact plate 47. When the limiting plate 44 moves to the right, it contacts the partition plate 43. The seal on the left side allows the polishing liquid on the left side of the partition plate 43 to be discharged from the left side of the partition plate 43. The discharged polishing liquid will enter the bottom of the rotating plate 413 through the discharge pipe 46. The polishing liquid entering the bottom of the rotating plate 413 will be discharged through the discharge port at the bottom of the grinding plate 33. When the lifting device 2 moves the mounting plate 31 upward, the mounting plate 31 will move the storage frame 41 and the baffle 42 upward. The baffle 42 moving downward will move the limiting plate 44 and the sliding plate 45 upward. When the sliding plate 45 moves upward, it will contact the bending rod 411, causing the sliding plate 45 to push the bending rod 411 upward. When rod 411 moves upward, it drives sealing plate 410 to move upward. As sealing plate 410 moves upward, it compresses the gas inside sealing frame 49, causing it to be ejected from the vent. The gas ejected from the vent blows cover plate 412 upward, preventing cover plate 412 from obstructing the vent's exhaust. After slide plate 45 disengages from bending rod 411, spring number two drives bending rod 411 and sealing plate 410 downward. Under gravity, cover plate 412 adheres to the surfaces of sealing frame 49 and the vent, limiting the speed of air intake into sealing frame 49 via the exhaust port on cover plate 412. 10 and the bending rod 411 can only move slowly downwards. When the bending rod 411 moves upwards, it will restrict the trapezoidal block 48 from moving into the through hole. When the slide plate 45 moves upwards, the inclined surface of the trapezoidal block 48 will push the slide plate 45 and the limiting plate 44 to move to the left. When the limiting plate 44 moves to the left, it will seal the left side of the partition plate 43. At the same time, the limiting plate 44 will open the right side of the partition plate 43, so that the right side of the partition plate 43 will drain water. When the lifting device 2 drives the driving device 32 and the polishing plate 33 to move upwards, the polishing liquid and foreign matter on the semiconductor surface of the polishing plate 35 can be removed in time.

[0039] When the mounting plate 31 moves downward, it will cause the elastic telescopic rod 52 to move downward. When the elastic telescopic rod 52 moves downward, its bottom will contact the inclined surface of the triangular block 54. This downward movement of the elastic telescopic rod 52 will push the triangular block 54 and the sliding rod 53 to move to the right. When the triangular block 54 moves to the right, it will contact the contact rod 58. This will cause the inclined surface of the triangular block 54 to push the contact rod 58 and the piston plate 57 to move in a limited position. When the piston plate 57 moves upward, it will compress the gas inside the insulation frame 55 and spray it out from the jet plate 59. When the drive device 32 drives the grinding plate 33 to rotate, the grinding plate 33 will drive the protrusion 51 to rotate. When the protrusion 51 rotates, it will intermittently contact the fixed rod 510, causing the protrusion 51 to push the fixed rod 510 and the free end of the elastic telescopic rod 52 to vibrate intermittently downward. When the elastic telescopic rod 52 vibrates up and down, it will push the triangular block 54 and the contact rod 58 to vibrate. When the contact rod 58 vibrates, it will drive the piston plate 57 to vibrate. The vibration of the piston plate 57 can be achieved through the airflow effect inside the insulation frame 55 and the heat-conducting plate 56. Example

[0040] Please see Figure 1-7 Based on Embodiment 1, this embodiment further includes a switching device and a lifting device. The lifting device includes a circular block 71 and a releasing component 7. The releasing component 7 is disposed on the top of the device body 1. The switching device is disposed inside the device body 1. The switching device includes a guide plate 62 and a collection component 6. The guide plate 62 is fixedly installed inside the device body 1. The collection component 6 has a collection frame 63 and a flipping plate 64 on its surface. The collection frame 63 is fixedly installed on the top of the device body 1. The flipping plate 64 is rotatably installed inside the device body 1 via a rotating shaft. When the flipping plate 64 rotates, it can switch the collection frame 63 so that the collection frame 63 on the right can collect the polishing liquid. This avoids the impact of water and polishing liquid mixing during collection, which would affect the recovery of the polishing liquid and increase the cost of semiconductor polishing.

[0041] A No. 3 spiral spring is installed between the rotating shaft and the device body 1. An elastic plate is fixedly installed on the right side of the slide rod 53. The elastic plate is in contact with the flip plate 64. The elastic plate will push the flip plate 64 to rotate through the elastic force, so that the elastic plate will not be affected by the effect achieved by the slide rod 53, and the vibration of the slide rod 53 will not affect the flip plate 64.

[0042] The circular block 71 is slidably mounted on the top of the polishing plate 35. The release assembly 7 includes an inclined block 72, a pressing rod 73, and an arc-shaped scraper 74. The surface of the circular block 71 has a groove. The inclined block 72 is fixedly mounted inside the groove. The pressing rod 73 is fixedly mounted inside the processing groove. The bottom of the polishing plate 33 has a sliding groove. The arc-shaped scraper 74 is rotatably mounted inside the sliding groove. The pressing rod 73 will push the inclined block 72 and the pressing rod 73 to move. When the circular block 71 moves, it will intermittently release the contact with the semiconductor. At the same time, the circular block 71 cannot restrict the arc-shaped scraper 74, so as to avoid the semiconductor and the circular block 71 contacting each other not being polished, which will affect the overall polishing effect of the semiconductor.

[0043] A No. 4 spring is provided between the circular block 71 and the polishing plate 35, and a torsion spring is provided between the arc-shaped scraper 74 and the slide groove. The No. 4 spring can drive the circular block 71 to reset.

[0044] In the second embodiment, when the slide bar 53 moves to the right, it will drive the elastic plate to move to the right. When the elastic plate moves to the right, it will push the flip plate 64 to rotate. The liquid discharged from the processing tank can be collected through the inclined plate 61 and the guide plate 62. When the flip plate 64 rotates, the collection frame 63 can be switched so that the collection frame 63 on the right can collect the polishing liquid.

[0045] When the rotating device 34 drives the polishing plate 35 to rotate, the rotation of the polishing plate 35 will drive the circular block 71 to rotate. When the circular block 71 rotates, it will drive the tilting block 72 to rotate. When the tilting block 72 rotates, the pressing rod 73 will contact the inclined surface of the tilting block 72, causing the pressing rod 73 to push the tilting block 72 and the pressing rod 73 to move. When the circular block 71 moves, it will intermittently release the contact with the semiconductor. At the same time, the circular block 71 cannot restrict the arc-shaped scraper 74. Under the action of the torsion spring, it will drive the arc-shaped scraper 74 to move intermittently to the outside of the groove.

[0046] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0047] Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A polishing apparatus for semiconductor surfaces, comprising an apparatus body (1), characterized in that: It also includes regulating devices, cooling devices, and lifting devices; The device body (1) has a processing groove on its top, a lifting device (2) is fixedly installed on the top of the device body (1), an installation plate (31) is fixedly installed on the output end of the lifting device (2), a driving device (32) is fixedly installed on the top of the installation plate (31), a grinding plate (33) is fixedly installed on the output end of the driving device (32), a rotating device (34) is fixedly installed at the bottom of the inner cavity of the device body (1), the output end of the rotating device (34) passes through the device body (1), and a polishing plate (35) is fixedly installed on the output end of the rotating device (34). The adjusting device includes a storage frame (41) and a control component (4). The control component (4) includes a baffle (42), a partition plate (43), a limiting plate (44), a sliding plate (45), a discharge pipe (46), a contact plate (47), a trapezoidal block (48), a sealing frame (49), a sealing plate (410), a bending rod (411), a cover plate (412), and a rotating plate (413). The storage frame (41) is fixedly installed on the top of the mounting plate (31). The baffle (42) is fixedly installed inside the storage frame (41). The partition plate (43) is fixedly installed on the top of the baffle (42). The limiting plate (44) is slidably installed on the bottom of the baffle (42). The sliding plate (45) is fixedly installed on the bottom of the baffle (42). On the surface of the limiting plate (44), the discharge pipe (46) is fixedly installed at the bottom of the storage frame (41), the contact plate (47) is fixedly installed at the top of the device body (1), the surface of the contact plate (47) is provided with through holes and notches, the trapezoidal block (48) is rotatably installed at the top of the through holes, the sealing frame (49) is fixedly installed on the surface of the contact plate (47), the sealing plate (410) is slidably installed on the inner wall of the sealing frame (49), the bending rod (411) is fixedly installed on the top of the sealing plate (410), the surface of the sealing frame (49) is provided with ventilation ports, the cover plate (412) is rotatably installed on the outer wall of the sealing frame (49), and the surface of the cover plate (412) is provided with exhaust ports; The cooling device includes an elastic telescopic rod (52) and a heat exchange component (5), which is located inside the device body (1). The lifting device includes a circular block (71) and a release component (7), which is located on the top of the device body (1).

2. The polishing apparatus for semiconductor surfaces according to claim 1, characterized in that: A rotating plate (413) is rotatably mounted on the top of the grinding plate (33), the discharge pipe (46) is fixedly inserted through the rotating plate (413), and a discharge port is provided at the bottom of the grinding plate (33).

3. The polishing apparatus for semiconductor surfaces according to claim 2, characterized in that: A first spring is provided between the limiting plate (44) and the baffle (42), a first spiral spring is provided between the trapezoidal block (48) and the through hole, a second spring is provided between the sealing plate (410) and the sealing frame (49), and a second spiral spring is provided between the cover plate (412) and the sealing frame (49).

4. The polishing apparatus for semiconductor surfaces according to claim 3, characterized in that: The elastic telescopic rod (52) is fixedly installed at the bottom of the mounting plate (31). An inclined plate (61) is fixedly installed on the inner wall of the device body (1). The heat exchange assembly (5) includes a slide rod (53), a triangular block (54), a heat insulation frame (55), a heat-conducting plate (56), a piston plate (57), a contact rod (58), and a jet plate (59). The slide rod (53) slides through the device body (1). The triangular block (54) is fixedly installed at the top of the slide rod (53). The heat insulation frame (55) is fixedly installed at the bottom of the inclined plate (61). The heat-conducting plate (56) is fixedly installed through the top of the heat insulation frame (55). The piston plate (57) slides inside the heat insulation frame (55). The contact rod (58) is fixedly installed at the bottom of the piston plate (57). The jet plate (59) is fixedly installed on the surface of the heat-conducting plate (56).

5. A polishing apparatus for semiconductor surfaces according to claim 4, characterized in that: A fixing rod (510) is fixedly installed at the free end of the elastic telescopic rod (52), and a protrusion (51) is fixedly installed on the surface of the grinding plate (33).

6. The polishing apparatus for semiconductor surfaces according to claim 5, characterized in that: A No. 3 spring is provided between the piston plate (57) and the heat insulation frame (55), and the heat conduction plate (56) is in contact with the polishing plate (35).

7. A polishing apparatus for semiconductor surfaces according to claim 6, characterized in that: The device body (1) is equipped with a switching device inside. The switching device includes a guide plate (62) and a collection component (6). The guide plate (62) is fixedly installed inside the device body (1). The collection component (6) has a collection frame (63) and a flip plate (64) on its surface. The collection frame (63) is fixedly installed on the top of the device body (1). The flip plate (64) is rotatably installed inside the device body (1) via a rotating shaft.

8. A polishing apparatus for semiconductor surfaces according to claim 7, characterized in that: A No. 3 spiral spring is provided between the rotating shaft and the device body (1), and an elastic plate is fixedly installed on the right side of the slide rod (53), and the elastic plate is in contact with the flip plate (64).

9. A polishing apparatus for semiconductor surfaces according to claim 8, characterized in that: The circular block (71) is slidably mounted on the top of the polishing plate (35). The release assembly (7) includes an inclined block (72), a pressing rod (73), and an arc-shaped scraper (74). The surface of the circular block (71) is provided with a groove. The inclined block (72) is fixedly mounted inside the groove. The pressing rod (73) is fixedly mounted inside the processing groove. The bottom of the polishing plate (33) is provided with a sliding groove. The arc-shaped scraper (74) is rotatably mounted inside the sliding groove.

10. A polishing apparatus for semiconductor surfaces according to claim 9, characterized in that: A No. 4 spring is provided between the circular block (71) and the polishing plate (35), and a torsion spring is provided between the arc-shaped scraper (74) and the groove.

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