Digital die cutting equipment
By designing digital die-cutting equipment, the negative pressure device and cooling device are used to solve the problem of heat deformation of paper during laser cutting, and the stability of paper during cutting and the accuracy of cutting path is achieved.
Patent Information
- Application Number
- CN202510562367.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-30
- Publication Date
- 2025-06-17
- Estimated Expiration
- 2045-04-30
AI Technical Summary
When cutting multi-layer paper or composite sheets with a laser die-cutter, the heat generated by the laser on the thickness of paper may be transferred to the weak paper through heat, causing the thin paper to overheat and cause the layer penetration problems such as deformation, burns or burns.
A digital die-cutting device is designed, including a placement platform, a negative pressure device and a cooling device. The first and second ducts in honeycomb shape are arranged on the platform, the negative pressure device absorbs paper through the first duct, and the cooling device conveys air conditioning through the second duct. The device secures the paper through tension control and negative pressure, ensuring that the cooling airflow directly contacts the paper surface and takes away the heat generated during laser cutting.
It effectively avoids the paper displacement or warping due to heat expansion, air flow disturbance or laser beam during the cutting process, ensuring the accurate and consistent cutting path, and improving cutting quality and equipment stability.
Smart Images

Figure CN120156957A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of die-cutting equipment, and particularly to a digital die-cutting equipment. Background Art
[0002] In modern industrial production, composite papers are widely used, especially in the fields of packaging, printing, and decoration. These composite papers are usually composed of two or more layers of different types of papers laminated together by adhesives or hot pressing processes to meet specific performance requirements. For example, packaging papers are composed of multiple layers of kraft paper and corrugated paper and are widely used in the manufacture of cartons and packaging boxes. During the production of these composite boards, precise cutting of their surfaces is usually required to meet product design and functional requirements. Laser die-cutting machines, inheriting the characteristics of high precision and non-contact processing, have become the main equipment for cutting composite boards.
[0003] Laser die-cutting machines use high-energy laser beams to cut composite boards. Although they can achieve processing of complex patterns and fine cuts, the following problems may occur during the cutting process: The high temperature generated during laser cutting is likely to cause paper deformation, charring, or burning through, affecting the cutting quality. Specifically, due to the hierarchical structure of composite boards and the characteristics of different materials, papers of different materials have different heat absorption capabilities. When the laser acts on the thick paper, the generated heat may be transferred to the thin paper through heat conduction. If the thin paper has poor heat radiation, the heat may not be effectively absorbed, resulting in overheating of the thin paper and problems such as deformation, charring, or burning through the layers. Secondly, the thin paper will deform due to thermal expansion or air flow during laser cutting, resulting in warping of the thin paper during the cutting process, which is likely to affect the cutting accuracy and even further affect the product quality. Summary of the Invention
[0004] The purpose of the present invention is to provide a digital die-cutting equipment to solve the problem that when using a laser die-cutting machine to cut multi-layer papers or composite boards, when the laser acts on the thick paper, the generated heat may be transferred to the thin paper through heat conduction. If the thin paper has poor heat radiation, the heat may not be effectively absorbed, resulting in overheating of the thin paper and problems such as deformation, charring, or burning through the layers. The specific technical solution is as follows:
[0005] A digital die-cutting device includes a placement platform, a negative pressure device, and a cooling device. The placement platform includes a number of first pipes and second pipes. The first pipes and the second pipes are arranged side by side to form a honeycomb shape. The paper to be processed is laid flat on the placement platform and covers the first pipes and the second pipes. An air outlet is provided on the side of the end of the second pipe. The negative pressure device is connected to the first pipe, and the cooling device is connected to the second pipe. The cooling device is used to convey cold air into the second pipe, and the amount of cold air conveyed by the cooling device per unit time is greater than the amount of cold air overflowing from the outlet hole. The negative pressure device creates a negative pressure state in the first pipe and adsorbs the paper, and the adsorption force formed in the first pipe is greater than the acting force of the cold air on the paper.
[0006] As an improvement of the above technical solution, it further includes an unwinding mechanism, a placement platform, a laser generator, and a winding mechanism. The paper sent out by the unwinding mechanism is recycled by the winding mechanism after being processed by the laser generator. The placement platform is arranged below the laser generator and is located between the unwinding mechanism and the winding mechanism.
[0007] As an improvement of the above technical solution, the digital die-cutting device further includes a deviation correction mechanism. The deviation correction mechanism is arranged between the unwinding mechanism and the placement platform, and the paper is wound around the deviation correction mechanism.
[0008] As an improvement of the above technical solution, the digital die-cutting device further includes a dust collector. The dust collector is arranged between the deviation corrector and the placement platform, and the paper is wound around the dust collector.
[0009] As an improvement of the above technical solution, a recycling mechanism is provided between the placement platform and the winding mechanism. The recycling mechanism includes a peeling roller. A tape is wound around the peeling roller. The peeling roller is arranged close to the transmission path of the paper. By rotating the peeling roller, the tape is adhesively bonded to or separated from the paper continuously.
[0010] As an improvement of the above technical solution, the recycling mechanism further includes a blocking plate. The peeling roller is arranged below the placement platform. The paper between the placement platform and the peeling roller is arranged to slope downward. The blocking plate is arranged between the placement platform and the peeling roller and is arranged close to the top surface of the paper. The distance between the blocking plate and the paper is less than 1 mm.
[0011] As an improvement of the above technical solution, the recycling mechanism further includes a tape roll and a recycling roller. The tape roll pulls out the tape and winds it around the peeling roller, and the recycling roller is used to recycle the tape.
[0012] As one of the improvements of the above technical solution, the digital die-cutting equipment also includes a displacement mechanism, which includes a transverse slide rail and a longitudinal slide rail. The longitudinal slide rail is slidably connected to the transverse slide rail, and the laser generator is slidably connected to the longitudinal slide rail.
[0013] The beneficial effects of the present invention are as follows: the unwinding mechanism and the rewinding mechanism not only feed and recycle paper, but also ensure that the paper remains stable and closely adheres to the top surface of the placement platform during the entire process through tension control, which can effectively prevent the paper from slipping, wrinkling or uneven stretching during the cutting process, thereby ensuring the stability of the equipment for cutting quality; the suction force generated by the negative pressure device can fix the paper tightly on the placement platform, preventing the paper from being displaced or warped due to heat expansion, airflow disturbance or laser beam action during the laser cutting process. In this way, the paper can maintain a stable position during the entire cutting process, ensuring that the cutting path is accurate and consistent; the cooling device can evenly deliver cold air to the surface of the paper. Since the paper has been completely fixed on the platform, the cooling airflow can directly contact the surface of the paper and take away the heat generated during the laser cutting process.
[0014] Additional aspects and advantages of the present invention will be given in part in the description below, and in part will become apparent from the description below, or will be understood through the practice of the present invention. Of course, it is not necessary to achieve all of the advantages described above at the same time to implement any product or method of the present application. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.
[0016] Figure 1 It is a structural schematic diagram of the present invention.
[0017] Figure 2 It is a structural schematic diagram of a placement platform of the present invention.
[0018] Figure 3 It is another structural schematic diagram of the placement platform of the present invention.
[0019] Figure 4 It is a structural schematic diagram of the branch pipeline of the present invention.
[0020] Figure 5 It is a schematic structural diagram of the second pipeline of the present invention.
[0021] In the figure: unwind mechanism 1, placement platform 2, winding mechanism 3, laser generator 4, negative pressure device 5, cooling device 6, first pipeline 7, second pipeline 8, branch pipeline 9, solenoid valve 10, deviation rectifying mechanism 11, dust collector 12, peeling roller 131, recovery roller 132, tape roll 133, blocking plate 134, tape 135, first opening 21, second opening 22, horizontal slide rail 41, vertical slide rail 42. Detailed implementation mode
[0022] Next, the technical solutions in the embodiments of the present invention will be described clearly and completely. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.
[0023] Please refer to Figures 1 - 5 , in the embodiment of the present invention, a digital die-cutting device includes an unwind mechanism 1, a placement platform 2, a laser generator 4 and a winding mechanism 3. The paper sent out by the unwind mechanism 1 is recycled by the winding mechanism 3 after being processed by the laser generator 4. The unwind mechanism 1 and the winding mechanism 3 traction the paper to lean against the top surface of the placement platform 2;
[0024] Among them, the functions of the unwind mechanism 1 and the winding mechanism 3 are not only to feed and recycle the paper, but more importantly, to ensure that the paper remains stable and closely adheres to the top surface of the placement platform 2 throughout the process through tension control. By adjusting and controlling the tension, it is possible to effectively avoid slippage, wrinkles or uneven stretching of the paper during the cutting process, thereby ensuring the equipment stability of the cutting quality.
[0025] Preferably, the digital die-cutting device further includes a displacement mechanism. The displacement mechanism includes a horizontal slide rail 41 and a vertical slide rail 42. The vertical slide rail 42 is slidably connected to the horizontal slide rail 41, and the laser generator 4 is slidably connected to the vertical slide rail 42. The position of the laser generator 4 is adjusted by setting the displacement mechanism, and the laser generator 4 is moved along a predetermined trajectory by driving the horizontal slide rail 41 and the vertical slide rail 42;
[0026] In the present invention, the tension control of the paper is coordinated with the placement platform 2. Specifically, a plurality of first openings 21 and second openings 22 are provided on the top surface of the placement platform 2, and the plurality of first openings 21 and the plurality of second openings 22 are alternately arranged to form a honeycomb shape; further included are a negative pressure device 5 and a cooling device 6. The negative pressure device 5 is communicated with the first openings 21, and the cooling device 6 is communicated with the second openings 22. It can be understood that during the laser cutting process of the paper, the paper is prone to warping, moving, or deforming due to heat, especially in the cutting of thin-layer or multi-layer papers. These problems not only affect the cutting quality but also increase the equipment maintenance and production costs. Therefore, the presence of the cutting platform provided with the negative pressure device 5 and the cooling device 6 can effectively solve these problems and improve the overall performance of the equipment. Among them, the first openings 21 and the second openings 22 are arranged in a honeycomb structure, which can evenly distribute the negative pressure and cooling, keep the paper flat during the cutting process, and minimize the thermal expansion effect caused by laser cutting to the greatest extent;
[0027] By controlling the tension of the paper, the paper is made to adhere to the top surface of the placement platform 2. Furthermore, when the paper is flatly laid on the top surface of the placement platform 2, by starting the negative pressure device 5, a negative pressure environment is formed in the first openings 21, further enhancing the fixing force of the paper. Specifically, the negative pressure device 5 firmly adsorbs the paper on the placement platform 2 by generating a negative pressure suction force. The suction force generated by the negative pressure device 5 can firmly fix the paper on the placement platform 2, preventing the paper from displacing or warping during the laser cutting process due to heat expansion, air flow disturbance, or the action of the laser beam. In this way, the paper can maintain a stable position throughout the cutting process, ensuring that the cutting path is accurate and consistent.
[0028] In some embodiments, when the paper is firmly fixed on the placement platform 2 by the negative pressure device 5, the cold air of the cooling device 6 can act on the paper more effectively, avoiding the leakage or waste of the cold air. The cooling device 6 is connected to the second openings 22 on the placement platform 2 to evenly deliver the cold air to the surface of the paper. Since the paper has been completely fixed on the platform, the cooling air flow can directly contact the surface of the paper, taking away the heat generated during the laser cutting process. Preferably, the cooling device 6 is a cold air generator, and the cold air generated by the cold air generator is a dry gas. Using this embodiment can ensure the efficient utilization of the cooling air flow, avoid the loss of cold air, improve the cooling efficiency, and at the same time reduce the temperature fluctuation caused by uneven cold air, thereby ensuring the cutting quality.
[0029] Regarding the cooling device 6, in the laser cutting technology, a high-energy laser beam irradiates the surface of the paper, which causes the local temperature of the paper to rise sharply. Due to the high temperature of the laser beam, the paper will melt, evaporate or carbonize in the cutting area. These heats will not only affect the cutting effect, but also may have a negative impact on the paper itself. For example, overheating: excessive heat accumulation may cause the paper to overheat, resulting in phenomena such as charring, discoloration or even burning; thermal expansion: when the heat is concentrated on the surface of the paper, the local expansion of the paper may cause the deviation of the cutting path, affecting the cutting accuracy; temperature non-uniformity: the non-uniform distribution of heat accumulation will cause the temperature difference between the surface and the bottom layer of the paper, resulting in warping and deformation of the paper, further affecting the cutting quality. Therefore, by setting the cooling device 6, the above situations can be avoided or alleviated.
[0030] During the laser cutting process, the contact area between the laser beam and the paper is very small, and the heat hardly diffuses in the surrounding area. Therefore, only the cutting area needs to be cooled, and the other areas of the paper do not have the effect of high temperature, and the temperature change is small. For this reason, the present invention also provides some embodiments: a first pipeline 7 is connected between the negative pressure device 5 and the first opening 21, and the negative pressure device 5 is used to generate negative pressure in the first opening 21 to make the paper closely adhere to the placement platform 2. A second pipeline 8 is connected between the cooling device 6 and the second opening 22. An air outlet hole is provided on the side surface of the end of the second pipeline 8. The amount of cold air transported by the cooling device 6 per unit time is greater than the amount of cold air overflowing outside the outlet hole. The negative pressure device 5 makes the first pipeline 7 in a negative pressure state and adsorbs the paper. The adsorption force formed in the first pipeline 7 is greater than the acting force exerted by the cold air on the paper. The cooling device 6 is used to transport cold air into the second opening 22. Among them, each second opening 22 is connected with a branch pipeline 9, and a solenoid valve 10 for controlling the branch pipeline 9 is connected to the branch pipeline 9. A plurality of branch pipelines 9 are respectively connected to the second pipeline 8. It can be understood that since the laser generator 4 operates after setting the cutting route, therefore, the cold air transportation method can be optimized. For example, only the solenoid valve 10 of the branch pipeline 9 close to the cutting route is opened to make efficient use of the cold air. Preferably, the ratio of the adsorption force and the amount of cold air can also be adjusted according to the cutting route. Taking the first pipeline 7 and the second pipeline 8 far from the cutting route as an example, the numerical ratio of the amount of cold air input into the first pipeline 7 to the adsorption force of the second pipeline 8 is 1:1, while the numerical ratio of the amount of cold air input into the first pipeline 7 close to the cutting route to the adsorption force of the second pipeline 8 is 1:1.25 (while considering the increase in the cold air input amount and the cold air outflow amount of the air outlet hole).
[0031] In some embodiments, the digital die-cutting device further includes a deviation rectifying mechanism 11 and a dust remover 12. The deviation rectifying mechanism 11 is disposed between the unwinding mechanism 1 and the placement platform 2, and the paper is wound around the deviation rectifying mechanism 11. The dust remover 12 is disposed between the deviation rectifier and the placement platform 2, and the paper is wound around the dust remover 12. Among them, the deviation rectifying mechanism 11 is a conventional deviation rectifying device, while the dust remover 12 is similar to a vacuum cleaner. The dust remover 12 will remove dust from both sides of the paper. It can be understood that the paper needs to be smoothly conveyed during the laser cutting process. Especially during long-term cutting operations, the paper may shift due to uneven tension, equipment vibration or improper operation, resulting in a decrease in cutting accuracy, seriously affecting the cutting quality and production efficiency. In addition, in mass production, the deviation of the paper may affect the quality of the entire batch of products, resulting in inconsistent dimensions and cutting errors, thereby increasing production costs and rework rates. Therefore, it is necessary to set up a deviation rectifying mechanism 11 to keep the paper in an accurate position; if there are dust and impurities on the paper, it may absorb or scatter the laser. When the laser beam irradiates, these particles will partially absorb or scatter the laser, thereby reducing the energy transfer efficiency of the laser. This will result in uneven cutting depth, uneven cutting lines, and even possible cutting failure in some areas. Therefore, it is necessary to set up a corresponding dust remover 12 before laser cutting to remove dust and ensure the smooth progress of cutting.
[0032] During the laser cutting process, the energy of the laser beam causes the cutting part of the paper to rapidly heat up and melt or vaporize. Usually, there will be some tiny debris or scattered substances around the cutting area. Although laser cutting is an accurate cutting method, due to factors such as the fiber structure, thickness and composition of the paper, the debris generated during the cutting process is inevitable;
[0033] For dealing with small debris, the present invention provides some embodiments. A recycling mechanism is provided between the placement platform 2 and the winding mechanism 3. The recycling mechanism includes a stripping roller 131, and a tape 135 is wound around the stripping roller 131. The stripping roller is disposed close to the transmission path of the paper. By rotating the stripping roller 131, the tape 135 is adhesively bonded to or separated from the paper continuously. Preferably, the recycling mechanism further includes a tape roll 133 and a recycling roller 132. The tape roll 133 pulls out the tape 135 and winds it around the stripping roller 131. The recycling roller 132 is used to recycle the tape 135. Among them, the tape 135 wound around the stripping roller 131 has a certain viscosity and can effectively adhere to the debris and particles remaining on the paper surface. Specifically, the rotational movement of the stripping roller ensures the continuous contact and separation between the tape 135 and the paper, so that the debris, particles and other substances on the paper surface can be adhered to the tape 135 and taken away with the movement of the tape 135. The viscosity of the tape 135 can be adjusted according to actual needs. A tape 135 with stronger viscosity can be selected to remove the debris that is difficult to strip, or a tape 135 with moderate viscosity can be selected to ensure the effective recycling of the debris without damaging the paper surface;
[0034] For processing debris with a larger area, the present invention also provides some embodiments. The recycling mechanism further includes a blocking plate 134. The peeling roller 131 is arranged lower than the placement platform 2. The paper between the placement platform 2 and the peeling roller 131 is arranged to slope downward. The blocking plate 134 is arranged between the placement platform 2 and the peeling roller 131 and is arranged close to the top surface of the paper. The distance between the blocking plate 134 and the paper is less than 1 mm. The recycling mechanism further includes a tape roll 133 and a recycling roller 132. The tape roll 133 pulls out a tape 135 and winds it around the peeling roller 131. The recycling roller 132 is used to recycle the tape 135. The purpose of setting the blocking plate 134 is to intercept larger debris in advance. It can be understood that larger debris on the paper may cover smaller debris. If the larger debris is adhered by the tape 135 on the peeling roller 131, the tape 135 on the peeling roller 131 will not be able to adhere to the smaller debris under the larger debris. Therefore, it is necessary to design the blocking plate 134 to intercept or collect larger debris in advance. Arranging the peeling roller 131 lower than the placement platform 2 can make the paper pulled out from the platform slope downward. Under the action of gravity, the larger debris will also automatically fall until it lands on the blocking plate 134. The purpose of limiting the distance between the blocking plate 134 and the paper to less than 1 mm is that the thickness of most papers is relatively thin. Only by arranging the blocking plate 134 close to the paper can the interception effect be achieved. Preferably, the blocking plate 134 can be arranged on a sliding mechanism, so that the position of the blocking plate 134 can be flexibly adjusted as needed. By adopting the solution of the above embodiments, it is possible to avoid omissions in the entire recycling process and affect subsequent processing procedures, and improve product quality.
[0035] For those skilled in the art, it is obvious that the present invention is not limited to the details of the above exemplary embodiments, and without departing from the spirit or basic characteristics of the present invention, the present invention can be implemented in other specific forms. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting. The scope of the present invention is defined by the appended claims rather than the above description. Therefore, it is intended to include all changes falling within the meaning and scope of the equivalent elements of the claims in the present invention.
Claims
1. A digital die-cutting device, characterized in that: It includes a placement platform, a negative pressure device and a cooling device. The placement platform includes a plurality of first pipes and second pipes. The first pipes and the second pipes are arranged side by side to form a honeycomb shape. The paper to be processed is laid flat on the placement platform and covers the first pipes and the second pipes. An air outlet is provided on the end side of the second pipe. The negative pressure device is connected to the first pipe, and the cooling device is connected to the second pipe. The cooling device is used to transport cold air to the second pipe, and the amount of cold air transported by the cooling device per unit time is greater than the amount of cold air overflowing from the outlet hole. The negative pressure device forms a negative pressure state in the first pipe and adsorbs the paper. The adsorption force formed in the first pipe is greater than the force applied by the cold air to the paper.
2. A digital die-cutting device according to claim 1, characterized in that: It also includes an unwinding mechanism, a placement platform, a laser generator and a rewinding mechanism. The paper fed by the unwinding mechanism is recovered by the rewinding mechanism after being processed by the laser generator. The placement platform is arranged below the laser generator and the placement platform is located between the unwinding mechanism and the rewinding mechanism.
3. The digital die-cutting device according to claim 1, characterized in that: The digital die-cutting device further comprises a deviation correction mechanism, which is arranged between the unwinding mechanism and the placing platform, and the paper is passed through the deviation correction mechanism.
4. A digital die-cutting device according to claim 1, characterized in that: The digital die-cutting equipment also includes a dust collector, which is arranged between the deviation corrector and the placement platform, and the paper is passed through the dust collector.
5. The digital die-cutting device according to claim 1, characterized in that: A recycling mechanism is provided between the placement platform and the winding mechanism, and the recycling mechanism includes a peeling roller, on which a tape is wound, and the peeling roller is arranged close to the transmission path of the paper. The tape and the paper are continuously bonded or separated by rotating the peeling roller.
6. A digital die-cutting device according to claim 5, characterized in that: The recycling mechanism also includes a blocking plate, the peeling roller is arranged lower than the placing platform, the paper between the placing platform and the peeling roller is arranged to be inclined downward, the blocking plate is arranged between the placing platform and the peeling roller, and the blocking plate is arranged close to the top surface of the paper, and the distance between the blocking plate and the paper is less than 1 mm.
7. A digital die-cutting device according to claim 6, characterized in that: The recycling mechanism also includes a tape roll and a recycling roller. The tape roll pulls out the tape and passes it around the stripping roller. The recycling roller is used to recycle the tape.
8. The digital die-cutting device according to claim 1, characterized in that: The digital die-cutting device also includes a displacement mechanism, which includes a transverse slide rail and a longitudinal slide rail. The longitudinal slide rail is slidably connected to the transverse slide rail, and the laser generator is slidably connected to the longitudinal slide rail.
Citation Information
Patent Citations
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