Infrared temperature measurement method, device and equipment and storage medium

Abstract

The invention relates to the technical field of infrared temperature measurement, and provides an infrared temperature measurement method, device and equipment and a storage medium, and the method comprises the steps: photographing an object to be subjected to temperature measurement, and obtaining a current pixel value of the object to be subjected to temperature measurement according to a photographing result; and obtaining a target temperature of the object to be subjected to temperature measurement based on the current pixel value and a preset mapping relation table, wherein the preset mapping relation table is obtained by constructing sample pixel values corresponding to black bodies of different sample temperatures. The shooting result of the object to be subjected to temperature measurement is analyzed, the current pixel value of the object to be subjected to temperature measurement is determined, and the target temperature of the object to be subjected to temperature measurement is obtained by constructing the obtained preset mapping relation table based on the current pixel value and the sample pixel values corresponding to the blackbodies of different sample temperatures. Therefore, a black body does not need to be installed in the temperature measurement environment where the object to be subjected to temperature measurement is located, so that the steps are simple when the object to be subjected to temperature measurement is subjected to infrared temperature measurement.

Description

Technical Field

[0001] This application relates to the field of infrared temperature measurement, and particularly to an infrared temperature measurement method, device, equipment, and storage medium. Background Art

[0002] With the rapid development of modern industry and the increasing demand for outdoor environmental monitoring, the importance of precise temperature measurement technology has become increasingly prominent in various fields. Whether it is equipment monitoring and product quality control in the industrial production process, or meteorological observation and disaster warning in the outdoor environment, efficient and accurate temperature measurement is indispensable.

[0003] When measuring the temperature of an object to be measured currently, it is necessary to prepare a black body in advance, place the black body in the temperature measurement environment where the object to be measured is located, and then collect infrared radiation signals of the black body and the object to be measured respectively based on an infrared camera. By comparing the pixel values of the black body at different temperatures with the pixel values of the object to be measured, the temperature of the object to be measured is determined. Since the black body needs to be precisely installed in the temperature measurement environment and the position is fixed, the installation difficulty is increased. In complex environments (such as outdoors or industrial sites), the installation and maintenance of the black body are more difficult, resulting in more complex steps for infrared temperature measurement of the object to be measured. Summary of the Invention

[0004] The main purpose of this application is to provide an infrared temperature measurement method, device, equipment, and storage medium, aiming to solve the technical problem that the installation and maintenance of the black body in the prior art are more difficult, resulting in more complex steps for measuring the temperature of the object to be measured.

[0005] To achieve the above purpose, this application proposes an infrared temperature measurement method, and the method includes:

[0006] Take a picture of the object to be measured, and obtain the current pixel value of the object to be measured according to the shooting result;

[0007] Obtain the target temperature of the object to be measured based on the current pixel value and a preset mapping relationship table, and the preset mapping relationship table is constructed by sample pixel values corresponding to black bodies at different sample temperatures.

[0008] In one embodiment, the step of obtaining the target temperature of the object to be measured based on the current pixel value and the preset mapping relationship table includes:

[0009] Obtain the current environmental parameters of the temperature measurement environment where the object to be measured is located;

[0010] Obtain a target temperature relation formula from a preset mapping relation table based on the current environmental parameters and the current pixel value, where the preset mapping relation table is constructed by sample pixel values corresponding to blackbodies at different temperatures and sample environmental parameters of the measurement temperature environments where each of the blackbodies is located;

[0011] Obtain the target temperature of the object to be measured according to the current environmental parameters, the current pixel value, and the target temperature relation formula.

[0012] In one embodiment, before the step of photographing the object to be measured, it includes:

[0013] Photograph blackbodies at several sample temperatures under different sample environmental parameters, and obtain the sample pixel values corresponding to the blackbodies at each of the sample temperatures in each of the sample environments;

[0014] Determine temperature parameters according to each of the sample pixel values and each of the sample temperatures, and construct a temperature relation formula according to the mapping relations between each of the sample environmental parameters, each of the sample pixel values, and each of the temperature parameters;

[0015] Classify each of the temperature relation formulas based on each of the sample environmental parameters to obtain a set of temperature relation formulas, and construct a preset mapping relation table based on the set of temperature relation formulas.

[0016] In one embodiment, the step of determining temperature parameters according to each of the sample pixel values and each of the sample temperatures includes:

[0017] Sort each of the sample temperatures to obtain adjacent sample temperatures, and obtain a first difference according to the adjacent sample temperatures;

[0018] Obtain adjacent sample pixel values corresponding to adjacent sample temperatures under different environmental parameters, obtain a second difference based on the adjacent sample pixel values, and obtain a first temperature parameter based on the first difference and the second difference;

[0019] Obtain a third difference according to each of the adjacent sample temperatures and the adjacent sample pixel values corresponding to each of the adjacent sample temperatures, and obtain a second temperature parameter according to the second difference and the third difference;

[0020] Take each of the first temperature parameters and each of the second temperature parameters as temperature parameters.

[0021] In one embodiment, the step of constructing a temperature relation formula according to the mapping relations between each of the sample environmental parameters, each of the sample pixel values, and each of the temperature parameters includes:

[0022] Construct a first temperature relationship based on each of the sample environmental parameters and the mapping relationship between each of the sample pixel values and each first temperature parameter corresponding to the sample environmental parameters;

[0023] Construct a second temperature relationship based on each of the sample environmental parameters and the mapping relationship between each of the sample pixel values and each second temperature parameter corresponding to the sample environmental parameters;

[0024] Use each of the first temperature relationships and each of the second temperature relationships as the temperature relationships.

[0025] In one embodiment, the step of obtaining the target temperature of the object to be temperature-measured according to the current environmental parameter, the current pixel value, and the target temperature relationship includes:

[0026] Determine a target first temperature parameter and a target second temperature parameter based on the target temperature relationship and the current environmental parameter;

[0027] Obtain the target temperature of the object to be temperature-measured according to the current pixel value, the target first temperature parameter, and the target second temperature parameter.

[0028] In one embodiment, the step of obtaining the target temperature of the object to be temperature-measured according to the current pixel value, the target first environmental parameter, and the target second environmental parameter includes:

[0029] Obtain the target temperature of the object to be temperature-measured through a preset temperature formula according to the current pixel value, the target first environmental parameter, and the target second temperature parameter;

[0030] The preset temperature formula is:

[0031] R = k(i)(j)*AD + b(i)(j);

[0032] Wherein, R is the target temperature, k(i)(j) is the target first temperature parameter, b(i)(j) is the target second temperature parameter, and AD is the current pixel value.

[0033] In addition, to achieve the above object, the present application also proposes an infrared temperature measurement device, and the device includes:

[0034] A data acquisition module, configured to photograph the object to be temperature-measured and obtain the current pixel value of the object to be temperature-measured according to the photographing result;

[0035] A temperature acquisition module, configured to obtain the target temperature of the object to be temperature-measured based on the current pixel value and a preset mapping relationship table, and the preset mapping relationship table is constructed by using the sample pixel values corresponding to blackbodies at different sample temperatures.

[0036] In addition, to achieve the above object, the present application further provides an infrared temperature measurement device, which includes: a memory, a processor, and a computer program stored on the memory and executable on the processor, and the computer program is configured to implement the steps of the infrared temperature measurement method as described above.

[0037] In addition, to achieve the above object, the present application further provides a storage medium, which is a computer-readable storage medium, and a computer program is stored on the storage medium, and when the computer program is executed by a processor, it implements the steps of the infrared temperature measurement method as described above.

[0038] The present application provides an infrared temperature measurement method, device, equipment and storage medium. The method includes: photographing an object to be temperature measured, and obtaining the current pixel value of the object to be temperature measured according to the photographing result; obtaining the target temperature of the object to be temperature measured based on the current pixel value and a preset mapping relation table, and the preset mapping relation table is constructed by sample pixel values corresponding to blackbodies at different sample temperatures. The present application analyzes the photographing result of the object to be temperature measured to determine the current pixel value of the object to be temperature measured, and obtains the target temperature of the object to be temperature measured based on the current pixel value and the preset mapping relation table constructed by sample pixel values corresponding to blackbodies at different sample temperatures. Since in the present application, the target temperature of the object to be measured is directly obtained through the current pixel value of the object to be temperature measured and the preset mapping relation table, without installing a blackbody in the temperature measurement environment where the object to be temperature measured is located, and determining the target temperature of the object to be temperature measured by comparing the pixel values of the blackbody at different temperatures with the pixel values of the object to be temperature measured, the steps for infrared temperature measurement of the object to be temperature measured are simple. Description of the Drawings

[0039] The drawings here are incorporated into the specification and form a part of this specification, showing embodiments consistent with the present application, and are used together with the specification to explain the principles of the present application.

[0040] To more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, for those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0041] Figure 1 It is a flowchart of the first embodiment of the infrared temperature measurement method proposed in this embodiment;

[0042] Figure 2 It is a flowchart of the second embodiment of the infrared temperature measurement method proposed in this embodiment;

[0043] Figure 3 It is a flowchart of the third embodiment of the infrared temperature measurement method proposed in this embodiment;

[0044] Figure 4 The figure of the infrared temperature measurement device provided for this embodiment;

[0045] Figure 5 It is a schematic structural diagram of an infrared temperature measurement device suitable for implementing this embodiment.

[0046] The realization of the purpose of this application, functional features and advantages will be further described with reference to the embodiments and the accompanying drawings. Specific embodiments

[0047] It should be understood that the specific embodiments described herein are only used to explain the technical solutions of this application and are not used to limit this application.

[0048] Next, the technical solutions in the embodiments of this application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of this application. Obviously, the described embodiments are only a part of the embodiments of this application, rather than all the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of this application.

[0049] It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of this application are only used to explain the relative position relationship and movement conditions between components in a specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indications will also change accordingly.

[0050] It can be understood that with the rapid development of modern industry and the increasing demand for outdoor environmental monitoring, the importance of precise temperature measurement technology in various fields has become increasingly prominent. Whether it is equipment monitoring and product quality control in the industrial production process, or meteorological observation and disaster warning in the outdoor environment, efficient and accurate temperature measurement is indispensable.

[0051] When measuring the temperature of an object to be measured, it is necessary to prepare a black body in advance, place the black body in the temperature measurement environment where the object to be measured is located, and then collect the infrared radiation signals of the black body and the object to be measured respectively based on an infrared camera. By comparing the pixel values of the black body at different temperatures with the pixel values of the object to be measured, the temperature of the object to be measured is determined. Since the black body needs to be precisely installed in the temperature measurement environment and the position is fixed, the installation difficulty is increased. In complex environments (such as outdoors or industrial sites), the installation and maintenance of the black body are more difficult, resulting in more complex steps for infrared temperature measurement of the object to be measured.

[0052] Therefore, in order to solve the technical problem that the installation and maintenance of the black body in the prior art are difficult, resulting in complicated temperature measurement steps for the temperature measurement object, this embodiment proposes an infrared temperature measurement method, device, equipment and storage medium. By analyzing the shooting results of the temperature measurement object, the current pixel value of the temperature measurement object is determined, and the target temperature of the temperature measurement object is obtained by constructing a preset mapping relationship table based on the current pixel value and the sample pixel value corresponding to the black body of different sample temperatures. Since the target temperature of the temperature measurement object is directly obtained by the current pixel value of the temperature measurement object and the preset mapping relationship table in this embodiment, there is no need to install a black body in the temperature measurement environment where the temperature measurement object is located. The target temperature of the temperature measurement object is determined by comparing the pixel value of the black body at different temperatures with the pixel value of the temperature measurement object, so that the steps for infrared temperature measurement of the temperature measurement object are simple.

[0053] For ease of understanding, the following combination Figures 1 to 5 The infrared temperature measurement method provided in the embodiment of the present application and the infrared temperature measurement method, device, equipment and storage medium provided in the following embodiments are specifically introduced.

[0054] The present application embodiment provides an infrared temperature measurement method, referring to Figure 1 , Figure 1 This is a flow chart of the first embodiment of the infrared temperature measurement method proposed in this embodiment.

[0055] like Figure 1 As shown, the method includes:

[0056] Step S10: photographing the object to be measured, and obtaining the current pixel value of the object to be measured according to the photographing result.

[0057] It should be noted that the execution subject of this embodiment can be a computing service device with infrared temperature measurement, network communication and program running functions, such as a tablet computer, a personal computer, a mobile phone, etc., or an electronic device capable of realizing the above functions, etc. The following takes an infrared temperature measurement device (hereinafter referred to as the device) as an example to illustrate this embodiment and the following embodiments.

[0058] It should be noted that the above-mentioned device in this embodiment also includes an infrared camera, and the above-mentioned device can use the infrared camera to photograph the object to be measured. The above-mentioned object to be measured can be an object that needs to be measured. The above-mentioned current pixel value can be the grayscale value or intensity value of each pixel in the infrared image. In a specific implementation, the above-mentioned device uses an infrared camera to photograph the object to be measured, captures its infrared radiation signal and converts it into a digital image. Among them, each pixel in the image represents the thermal radiation intensity of a certain area on the surface of the object, which is presented in the form of a pixel value.

[0059] Step S20: Obtain the target temperature of the object to be temperature - measured based on the current pixel value and a preset mapping relation table, where the preset mapping relation table is constructed by sample pixel values corresponding to blackbodies at different sample temperatures.

[0060] It should be noted that the above - mentioned preset mapping relation table can be a table constructed by sample pixel values corresponding to blackbodies at different sample temperatures. The above - mentioned target temperature can be the actual temperature of the object to be temperature - measured calculated through the mapping relation. The above - mentioned blackbody can be an idealized object that can completely absorb and emit infrared radiation, and its emissivity is close to 1. In infrared temperature measurement, the blackbody is often used as a standard reference object. The above - mentioned sample temperature can be the current temperature of the blackbody when the blackbody is photographed, and the above - mentioned sample pixel value can be the pixel value corresponding to the above - mentioned blackbody at the above - mentioned sample temperature.

[0061] In a specific implementation, when the above - mentioned device photographs the object to be temperature - measured through the above - mentioned infrared camera and obtains the current pixel value of the object to be temperature - measured according to the photographing result, the device will obtain the temperature of the object to be temperature - measured from the preset mapping relation table based on the current pixel value as the target temperature.

[0062] Furthermore, considering the influence of the temperature - measurement environment where the object to be temperature - measured is located on infrared temperature measurement, under the same environmental parameters, there are certain differences in the corresponding relationship between the temperature of the object to be temperature - measured and the pixel value. And since the corresponding relationship between the sample temperature, sample pixel value, and sample environmental parameters of the blackbody considers more parameters when the environmental parameters are added, resulting in a large amount of data, this embodiment also considers using a mapping formula to represent the mapping relationship between the sample temperature, sample pixel value, and sample environmental parameters. Therefore, the step of obtaining the target temperature of the object to be temperature - measured based on the current pixel value and the preset mapping relation table includes:

[0063] Step S21: Obtain the current environmental parameters of the temperature - measurement environment where the object to be temperature - measured is located.

[0064] It should be noted that the above - mentioned temperature - measurement environment can be the environment where the above - mentioned object to be temperature - measured is located, and the above - mentioned current environmental parameters can be the environmental parameters of the above - mentioned temperature - measurement environment, such as environmental temperature and environmental humidity. In this embodiment, since an infrared camera is used to photograph the object to be temperature - measured to obtain the current pixel value, the influence of the core temperature of the infrared camera on the current pixel value also needs to be considered. Therefore, the above - mentioned current environmental parameters also include the core temperature.

[0065] In a specific implementation, the above - mentioned device can directly obtain the current environmental parameters of the temperature - measurement environment through connected temperature and humidity sensors, or the user can manually input the environmental parameters according to the actual situation. This embodiment does not impose any restrictions.

[0066] Step S22: Obtain a target temperature relation formula from a preset mapping relation table based on the current environmental parameters and the current pixel value. The preset mapping relation table is constructed by using the sample pixel values corresponding to blackbodies at different temperatures and the sample environmental parameters of the temperature measurement environments where each of the blackbodies is located.

[0067] It should be noted that the above-mentioned preset mapping relation table is constructed by using the sample pixel values corresponding to blackbodies at different temperatures and the sample environmental parameters of the temperature measurement environments where each of the blackbodies is located. The temperatures of these blackbodies are accurately set to different values, and the above device will record the pixel values of each blackbody under different environmental parameters. The above target temperature relation formula can be a temperature relation formula selected from the preset mapping relation table and matching the current environmental parameters.

[0068] In specific implementation, the above device first obtains the current pixel value of the object to be measured, and simultaneously measures the temperature, humidity, and the temperature of the infrared camera module of the current environment. Then, the above device searches for the relation formula closest to the current conditions in the preset mapping relation table according to these parameters.

[0069] Step S23: Obtain the target temperature of the object to be measured based on the current environmental parameters, the current pixel value, and the target temperature relation formula.

[0070] In specific implementation, after the above device obtains the current pixel value and the current environmental parameters (such as environmental temperature, humidity, and the temperature of the infrared camera module) of the object to be measured, it selects the target temperature relation formula that best matches the current environment through the preset mapping relation table. The device substitutes the current pixel value into this relation formula and combines the correction coefficient of the environmental parameters to calculate the actual temperature of the object to be measured.

[0071] For the sake of easy understanding, the following is illustrated by way of example, but no specific limitation is imposed on this embodiment. Suppose in an industrial site, the above device needs to measure the surface temperature of a high-temperature furnace. The device first obtains the current pixel value of the furnace surface as 200, and simultaneously measures that the current environmental temperature is 35 °C, the humidity is 55%, and the temperature of the infrared camera module is 40 °C. According to these parameters, the device selects the corresponding relation formula from the preset mapping relation table, for example: T = k * AD + b, where k and b are coefficients related to the current environmental parameters, and AD is the current pixel value. The device substitutes the pixel value 200 into the formula and calculates that the target temperature is 850 °C. This method not only improves the temperature measurement accuracy but also reduces the dependence on the blackbody, and is especially suitable for rapid temperature monitoring in complex environments.

[0072] Based on the first embodiment, in the second embodiment, the content that is the same as or similar to the above-mentioned embodiment one can be referred to the above introduction and will not be elaborated hereinafter. On this basis, please refer to Figure 2 , Figure 2The flowchart of the second embodiment of the infrared temperature measurement method proposed in this embodiment. Further, in order to obtain the preset mapping relationship table, before the step of photographing the object to be temperature measured, it includes:

[0073] Step S01: Photograph the blackbody with several sample temperatures under different sample environmental parameters, and obtain the sample pixel values corresponding to the blackbody with each sample temperature in each sample environment;

[0074] It should be noted that the above blackbody can be a standard blackbody with a known temperature used in the training process to provide an accurate temperature reference. The temperature of the blackbody is set to different values to cover the temperature range that the object to be temperature measured may appear. The above sample temperature can be the temperature value set for the blackbody, and the above sample environmental parameters can be the environmental conditions set during the training process, such as the sample environmental temperature, sample environmental humidity, and sample movement mechanism temperature, etc., to simulate various situations that may be encountered in the actual temperature measurement environment. The above sample pixel value can be the intensity value of each pixel point in the image when the infrared camera photographs the blackbody, reflecting the thermal radiation intensity of the blackbody under different temperatures and environmental conditions.

[0075] In addition, it should be noted that in order to simulate various temperature measurement environments that the object to be temperature measured may be in during actual measurement, in this embodiment, the blackbody can be placed in a high and low temperature chamber, and the high and low temperature chamber can be set to simulate various possible temperature measurement environments. The above high and low temperature chamber can be an environmental simulation device with precise temperature and humidity control functions, capable of operating according to a preset temperature and humidity curve, covering environmental conditions from low temperature (such as -40°C) to high temperature (such as +150°C) and different humidities (such as 10% - 90%RH). In this way, the high and low temperature chamber provides a diverse training environment for the blackbody, ensuring that the device can collect accurate sample pixel values under various conditions, thereby constructing a preset mapping relationship table applicable to different scenarios.

[0076] In specific implementation, the above device places the blackbody in the high and low temperature chamber, sets different environmental parameters such as temperature and humidity, photographs the blackbody, and records the pixel values of the blackbody at different temperatures as sample pixel values.

[0077] Step S02: Determine the temperature parameter according to each sample pixel value and each sample temperature, and construct a temperature relationship formula according to the mapping relationship between each sample environmental parameter and each sample pixel value and each temperature parameter;

[0078] It should be noted that the above temperature parameters can be parameters calculated from sample pixel values and sample temperatures, which are used to describe the quantitative relationship between pixel values and temperatures and are the basis for constructing the temperature relationship formula. In specific implementation, when the above device constructs the temperature relationship formula, it first determines the temperature parameters according to each sample pixel value and the corresponding sample temperature. These parameters reflect the quantitative relationship between pixel values and temperatures. Subsequently, the device combines the sample environmental parameters (such as temperature, humidity, etc.) and the mapping relationship between the sample pixel values and the temperature parameters to construct the temperature relationship formula. Through mathematical modeling, it is ensured that under different environmental conditions, the above device can quickly and accurately calculate the target temperature according to the current pixel value and environmental parameters. For example, in the laboratory, the device takes pictures of blackbodies at different temperatures and records their pixel values under different environmental conditions. By analyzing these data, the above device can determine the temperature parameters and construct the temperature relationship formula. When actually measuring the temperature, the above device can select an appropriate relationship formula according to the current environmental parameters, combine the current pixel value to calculate the target temperature, so as to achieve high-precision temperature measurement.

[0079] Further, in order to obtain accurate temperature parameters and make the target temperature more accurate, the step of determining the temperature parameters according to each of the sample pixel values and each of the sample temperatures includes:

[0080] Step S021: Sort each of the sample temperatures to obtain adjacent sample temperatures, and obtain a first difference according to the adjacent sample temperatures;

[0081] It should be noted that the above adjacent sample temperatures can be the sample temperatures sorted from small to large. The above first difference can be the difference between two adjacent sample temperatures.

[0082] Step S022: Obtain the adjacent sample pixel values corresponding to the adjacent sample temperatures under different environmental parameters, obtain a second difference based on the adjacent sample pixel values, and obtain a first temperature parameter based on the first difference and the second difference;

[0083] It should be noted that each sample temperature under each of the above sample environmental parameters corresponds to a sample pixel value. The above adjacent sample pixel values can be the sample pixel values corresponding to the sample temperatures sorted from small to large under the same sample environmental parameter, and the adjacent sample pixel values correspond one-to-one with the above adjacent sample temperatures. For example, under the first sample environmental parameter, the sample temperatures include: T1 = 20°C, T2 = 10°C, T3 = 30°C. Among them, the pixel value corresponding to T1 is AD1, the pixel value corresponding to T2 is AD2, and the pixel value corresponding to T3 is AD3. Then, the adjacent sample temperatures obtained by sorting from small to large are T1, T1, T3, and the obtained adjacent sample pixel values are AD2, AD1, AD3. And the first differences are: T1 - T2, T3 - T1, and the second differences are AD1 - AD2, AD3 - AD1.

[0084] Step S023: Obtain a third difference according to each of the adjacent sample temperatures and the adjacent sample pixel values corresponding to each of the adjacent sample temperatures, and obtain a second temperature parameter according to the second difference and the third difference;

[0085] It should be noted that the above third difference can be the difference between the products of the adjacent sample temperatures and the sample pixel values corresponding to the sample temperatures. For example, the above adjacent sample temperatures are T1, T1, T3, and the obtained adjacent sample pixel values are AD2, AD1, AD3. Then the third differences are: T1 * AD1 - T2 * AD2, T3 * AD3 - T1 * AD1.

[0086] Step S024: Use each of the first temperature parameters and each of the second temperature parameters as temperature parameters.

[0087] It should be noted that the above first temperature parameter can be the quotient of the first difference and the second difference, and the above second temperature parameter can be the quotient of the third difference and the second difference. Thus, the calculation formula for the above first temperature parameter k(i - 1)(j) is:

[0088]

[0089] Wherein, i is the serial number of several sample temperatures arranged from small to large (i = 2, 3,...., n), j is several sample environmental parameters (j = 1, 2, 3,..., n), k(i - 1)(j) is the temperature parameter corresponding to the adjacent sample temperatures t(i) and t(i - 1) when the sample environmental parameter is j. Among them, AD(i)(j) is the sample pixel value corresponding to the blackbody temperature t(i) when the environmental parameter is j, and AD(i - 1)(j) is the sample pixel value corresponding to the blackbody temperature t(i - 1) when the environmental parameter is j. During the actual test process, when the environmental parameter corresponding to the temperature measurement environment where the object to be temperature - measured is located is j, and the current pixel value falls within the range between AD(i - 1)(j) and AD(i)(j), k(i - 1)(j) is used as the first temperature parameter for calculation to obtain the target temperature.

[0090] Similarly, the calculation formula for the above - mentioned second temperature parameter b(i - 1)(j) is:

[0091]

[0092] Wherein, i is the serial number of several sample temperatures arranged from small to large (i = 2, 3,....n), j is several sample environmental parameters (j = 1, 2, 3,..., n), b(i - 1)(j) is the temperature parameter corresponding to the adjacent sample temperatures t(i) and t(i - 1) when the sample environmental parameter is j. Among them, AD(i)(j) is the sample pixel value corresponding to the blackbody temperature t(i) when the environmental parameter is j, and AD(i - 1)(j) is the sample pixel value corresponding to the blackbody temperature t(i - 1) when the environmental parameter is j. During the actual test process, when the environmental parameter corresponding to the temperature measurement environment where the object to be temperature - measured is located is j, and the current pixel value falls within the range between AD(i - 1)(j) and AD(i)(j), b(i - 1)(j) is used as the second temperature parameter for calculation to obtain the target temperature.

[0093] In addition, it should be noted that, in order to facilitate obtaining adjacent sample temperatures sorted from small to large, in this embodiment, several blackbodies can also be obtained, the temperatures of each blackbody are set from small to large, and they are placed in the same high - low temperature chamber for shooting, so as to obtain the sample pixel values corresponding to different sample - temperature blackbodies under the same environmental parameter.

[0094] Furthermore, in order to obtain the temperature relationship formula, the step of constructing the temperature relationship formula according to the mapping relationship between each of the sample environmental parameters, each of the sample pixel values, and each of the temperature parameters includes:

[0095] Step S025: Construct a first temperature relationship based on each of the sample environmental parameters and the mapping relationship between each of the sample pixel values and each of the first temperature parameters corresponding to the sample environmental parameters;

[0096] Step S026: Construct a second temperature relationship based on each of the sample environmental parameters and the mapping relationship between each of the sample pixel values and each of the second temperature parameters corresponding to the sample environmental parameters;

[0097] Step S027: Use each of the first temperature relationships and each of the second temperature relationships as the temperature relationships.

[0098] It should be noted that the above first temperature relationship can be a relationship constructed based on the mapping relationship between the sample environmental parameters and the above first temperature parameters. The above second temperature relationship can be a relationship constructed based on the sample environmental parameters and the above second temperature parameters. In a specific implementation, the above device fits experimental data and models the relationships between environmental parameters (such as temperature and humidity) and the first temperature parameter and the second temperature parameter as mathematical formulas respectively.

[0099] For ease of understanding, the following is illustrated by way of example, but the specific embodiment is not limited. First, place n blackbodies and an infrared camera together in a high and low temperature chamber. The temperatures of the n blackbodies are set to t1, t2, t3,..., tn in sequence, with the temperatures increasing in sequence. Start the high and low temperature chamber. After the movement mechanism stabilizes, construct a table to save the AD values of the blackbodies, and at the same time save the movement mechanism temperature fpa, the environmental temperature tem, and the humidity information h. Calculate the parameters k(i - 1)(j), b(i - 1)(j), and the calculation formulas are the above first temperature parameter calculation formulas, where i = 2, 3,..., n; j = 1, 2, 3,..., n.

[0100] The calculation of k and the environmental temperature, movement mechanism temperature, and humidity satisfies:

[0101] k(1) = g(1)(fpa, tem, h), k(2) = g(2)(fpa, tem, h),..., k(n - 1) = g(n - 1)(fpa, tem, h), where k(1) is the set of parameters k when i = 2, that is, k(1) includes: k(1)(1), k(1)(2), k(1)(3),..., k(1)(n). Similarly, k(2) and k(n - 1) are the sets of parameters k when i = 3 and i = n respectively.

[0102] The calculation of b and the environmental temperature, movement mechanism temperature, and humidity satisfies:

[0103] b(1) = f(1)(fpa, tem, h), b(2) = f(2)(fpa, tem, h),..., b(n - 1) = f(n - 1)(fpa, tem, h), where b(1) is the set of parameter b when i = 2, that is, b(1) includes: b(1)(1), b(1)(2), b(1)(3),..., b(1)(n). Similarly, b(2) and b(n - 1) are the sets of parameter b when i = 3 and i = n respectively.

[0104] Step S03: Classify each of the temperature relational expressions based on each of the sample environmental parameters to obtain a set of temperature relational expressions, and construct a preset mapping relation table based on the set of temperature relational expressions.

[0105] It should be noted that the above set of temperature relational expressions can be a set obtained by classifying the above temperature relational expressions according to the above sample environmental parameters. Specifically, the above device first divides the temperature relational expressions into multiple subsets according to the sample environmental parameters (such as environmental temperature range, humidity range, etc.), and each subset corresponds to a specific environmental condition interval.

[0106] In one example, the above device can divide the temperature relational expressions according to the sample environmental temperature in the sample environmental parameters. The following is an example for illustration, but it does not specifically limit this embodiment. Referring to the previous example, after obtaining k(n - 1) = g(n - 1)(fpa, tem, h) and b(n - 1) = f(n - 1)(fpa, tem, h), based on the above sample environmental temperature, i.e., tem, the relational expressions are divided into several sets, including:

[0107]

[0108]

[0109] Among them, the above tem(1), tem(2), tem(3),..., tem(i) are different sample environmental temperatures. In the above set, the relational expressions are further divided according to the sample pixel values corresponding to the black bodies of different sample temperatures.

[0110] Based on the first embodiment and the second embodiment, in the third embodiment, the same or similar content as in the above-mentioned first embodiment and the second embodiment can be referred to the above introduction and will not be repeated hereinafter. On this basis, please refer to Figure 3 , Figure 3The flowchart of the third embodiment of the infrared temperature measurement method proposed in this embodiment. Further, in order to determine the target temperature according to the first temperature parameter, the second temperature parameter, and the current pixel value, the step of obtaining the target temperature of the object to be measured according to the current environmental parameter, the current pixel value, and the target temperature relationship formula includes:

[0111] Step S231: Determine the target first temperature parameter and the target second temperature parameter based on the target temperature relationship formula and the current environmental parameter;

[0112] Step S232: Obtain the target temperature of the object to be measured according to the current pixel value, the target first temperature parameter, and the target second temperature parameter.

[0113] In a specific implementation, when the above device obtains the current environmental parameter of the temperature measurement environment where the object to be measured is located, it can select the corresponding set of temperature relationship formulas based on the environmental temperature in the current environmental parameter, and determine the temperature relationship formula to be used according to the current pixel value of the object to be measured. Finally, determine the first temperature parameter and the second temperature parameter based on this temperature relationship formula, and finally determine the target temperature based on this first temperature parameter, second temperature parameter, and current pixel value.

[0114] Further, the step of obtaining the target temperature of the object to be measured according to the current pixel value, the target first environmental parameter, and the target second environmental parameter includes:

[0115] Obtain the target temperature of the object to be measured through a preset temperature formula according to the current pixel value, the target first environmental parameter, and the target second temperature parameter;

[0116] The preset temperature formula is:

[0117] R = k(i - 1)(j)*AD + b(i - 1)(j);

[0118] Where, R is the target temperature, k(i - 1)(j) is the target first temperature parameter, b(i - 1)(j) is the target second temperature parameter, and AD is the current pixel value.

[0119] For ease of understanding, the following is illustrated by an example, but it does not specifically limit this embodiment. Assume that the current environmental parameters obtained by the above device are the core temperature fpa1, the environmental temperature tem1, and the humidity information h1, and the current pixel value is AD, where AD(1)(1) < AD < AD(2)(1). Then, based on the environmental temperature in the above current environmental parameter, the following two sets of relationship formulas are determined to be used:

[0120]

[0121] Based on AD(1)(1) < AD < AD(2)(1), determine g(fpa, tem, h) = g(1)(fpa1, tem1, h1) and f(fpa, tem, h) = f(1)(fpa1, tem1, h1). Since k(1) = g(1)(fpa, tem, h) and b(1) = f(1)(fpa, tem, h), determine that the first temperature parameter is k(1)(1) and the second temperature parameter is b(1)(1). Thus, it can be known that the target temperature R = k(1)(1) * AD + b(1)(1).

[0122] The first embodiment of an infrared temperature measurement device is also provided in this embodiment. Please refer to Figure 4 , Figure 4 which is the infrared temperature measurement device diagram provided in this embodiment. The infrared temperature measurement device includes:

[0123] A data acquisition module, configured to photograph an object to be temperature-measured and obtain the current pixel value of the object to be temperature-measured according to the photographing result;

[0124] A temperature acquisition module, configured to obtain the target temperature of the object to be temperature-measured based on the current pixel value and a preset mapping relation table, where the preset mapping relation table is constructed by sample pixel values corresponding to blackbodies at different sample temperatures;

[0125] The temperature acquisition module is further configured to obtain the current environmental parameter of the temperature measurement environment where the object to be temperature-measured is located; obtain a target temperature relation formula from the preset mapping relation table based on the current environmental parameter and the current pixel value, where the preset mapping relation table is constructed by sample pixel values corresponding to blackbodies at different temperatures and sample environmental parameters of each blackbody in the temperature measurement environment where each blackbody is located; and obtain the target temperature of the object to be temperature-measured according to the current environmental parameter, the current pixel value, and the target temperature relation formula.

[0126] Based on the first embodiment of the above infrared temperature measurement model deployment device of the present application, a second embodiment of the infrared temperature measurement model deployment device of the present application is proposed.

[0127] In this embodiment, the temperature acquisition module is further configured to photograph blackbodies at several sample temperatures under different sample environmental parameters to obtain sample pixel values corresponding to the blackbodies at each sample temperature in each sample environment; determine temperature parameters according to each sample pixel value and each sample temperature, and construct a temperature relation formula according to the mapping relation between each sample environmental parameter and each sample pixel value and each temperature parameter; classify each temperature relation formula based on each sample environmental parameter to obtain a set of temperature relation formulas, and construct a preset mapping relation table based on the set of temperature relation formulas;

[0128] The temperature acquisition module is further configured to sort the sample temperatures to obtain adjacent sample temperatures, and obtain a first difference based on the adjacent sample temperatures; acquire adjacent sample pixel values corresponding to the adjacent sample temperatures under different environmental parameters, obtain a second difference based on the adjacent sample pixel values, and obtain a first temperature parameter based on the first difference and the second difference; obtain a third difference according to the adjacent sample temperatures and the adjacent sample pixel values corresponding to the adjacent sample temperatures, and obtain a second temperature parameter according to the second difference and the third difference; use the first temperature parameters and the second temperature parameters as temperature parameters.

[0129] The temperature acquisition module is further configured to construct a first temperature relationship based on the mapping relationship between the sample environmental parameters and the first temperature parameters corresponding to the sample pixel values and the sample environmental parameters; construct a second temperature relationship based on the mapping relationship between the sample environmental parameters and the second temperature parameters corresponding to the sample pixel values and the sample environmental parameters; use the first temperature relationships and the second temperature relationships as temperature relationships.

[0130] Referring to the first embodiment of the infrared temperature measurement device and the second embodiment of the infrared temperature measurement device, this embodiment also proposes a third embodiment of the infrared temperature measurement device. For the same or similar content as the first embodiment of the infrared temperature measurement device and the second embodiment of the infrared temperature measurement device, reference can be made to the above introduction and will not be elaborated hereinafter.

[0131] The temperature acquisition module is further configured to determine a target first temperature parameter and a target second temperature parameter based on the target temperature relationship and the current environmental parameters; obtain the target temperature of the object to be temperature-measured according to the current pixel value, the target first temperature parameter, and the target second temperature parameter.

[0132] The power prediction module is further configured to obtain the target temperature of the object to be temperature-measured through a preset temperature formula according to the current pixel value, the target first environmental parameter, and the target second temperature parameter; the preset temperature formula is:

[0133] R = k(i - 1)(j) * AD + b(i - 1)(j);

[0134] wherein, R is the target temperature, k(i - 1)(j) is the target first temperature parameter, b(i - 1)(j) is the target second temperature parameter, and AD is the current pixel value.

[0135] The infrared temperature measurement device provided in this embodiment adopts the infrared temperature measurement method in the above embodiment, and can solve the technical problem that the installation and maintenance of the black body in the prior art are relatively difficult, resulting in a more complex temperature measurement step for the temperature measurement object. Compared with the prior art, the beneficial effects of the infrared temperature measurement device provided in this embodiment are the same as those of the infrared temperature measurement method provided in the above embodiment, and other technical features in the infrared temperature measurement device are the same as those disclosed in the above embodiment method, which will not be elaborated here.

[0136] This embodiment provides an infrared temperature measurement device, which includes: at least one processor; and a memory communicatively connected to the at least one processor; wherein, the memory stores instructions executable by the at least one processor, and the instructions are executed by the at least one processor to enable the at least one processor to execute the infrared temperature measurement method in the first embodiment above.

[0137] Next, refer to Figure 5 , Figure 5 FIG. is a schematic structural diagram suitable for implementing the infrared temperature measurement device of this embodiment. The infrared temperature measurement device in the embodiments of the present application may include, but is not limited to, mobile terminals such as mobile phones, laptop computers, digital broadcast receivers, PDAs (Personal Digital Assistants), PADs (Portable Application Descriptions), PMPs (Portable Media Players), vehicle-mounted terminals (such as vehicle-mounted navigation terminals), etc., and fixed terminals such as digital TVs and desktop computers. Figure 5 The illustrated infrared temperature measurement device is only an example and should not impose any limitation on the functions and usage scope of the embodiments of the present application.

[0138] As Figure 5As shown, the infrared temperature measurement device may include a processing device 1001 (such as a central processing unit, a graphics processing unit, etc.), which can perform various appropriate actions and processes according to a program stored in a read-only memory (ROM: Read Only Memory) 1002 or a program loaded from a storage device 1003 into a random access memory (RAM: Random Access Memory) 1004. In the RAM 1004, various programs and data required for the operation of the infrared temperature measurement device are also stored. The processing device 1001, the ROM 1002, and the RAM 1004 are connected to each other through a bus 1005. An input / output (I / O) interface 1006 is also connected to the bus. Generally, the following systems can be connected to the I / O interface 1006: an input device 1007 including, for example, a touch screen, a touchpad, a keyboard, a mouse, an image sensor, a microphone, an accelerometer, a gyroscope, etc.; an output device 1008 including, for example, a liquid crystal display (LCD: Liquid Crystal Display), a speaker, a vibrator, etc.; a storage device 1003 including, for example, a magnetic tape, a hard disk, etc.; and a communication device 1009. The communication device 1009 can allow the infrared temperature measurement device to communicate with other devices wirelessly or wiredly to exchange data. Although the figure shows an infrared temperature measurement device having various systems, it should be understood that it is not required to implement or have all the shown systems. More or fewer systems can be alternatively implemented or had.

[0139] Specifically, according to this embodiment, the process described above with reference to the flowchart can be implemented as a computer software program. For example, this embodiment includes a computer program product, which includes a computer program carried on a computer-readable medium, and the computer program contains program codes for executing the method shown in the flowchart. In such an embodiment, the computer program can be downloaded and installed from a network through the communication device, or installed from the storage device 1003, or installed from the ROM 1002. When the computer program is executed by the processing device 1001, the above functions defined in the method of the disclosed embodiment of this embodiment are executed.

[0140] The infrared temperature measurement device provided in this embodiment adopts the infrared temperature measurement method in the above embodiment, and can solve the technical problem that the installation and maintenance of a blackbody in the prior art are relatively difficult, resulting in a relatively complex temperature measurement step for the temperature measurement object. Compared with the prior art, the beneficial effects of the infrared temperature measurement device provided in this embodiment are the same as those of the infrared temperature measurement method provided in the above embodiment, and other technical features in this infrared temperature measurement device are the same as those disclosed in the method of the previous embodiment, and will not be elaborated here.

[0141] It should be understood that the various parts disclosed in this embodiment can be implemented by hardware, software, firmware, or a combination thereof. In the description of the above embodiments, specific features, structures, materials, or characteristics can be combined in a suitable manner in any one or more embodiments or examples.

[0142] As described above, the above is only the specific implementation manner of this embodiment, but the protection scope of this embodiment is not limited thereto. Any person skilled in the art within the technical scope disclosed in this embodiment can easily think of changes or substitutions, which should all be covered within the protection scope of this embodiment. Therefore, the protection scope of this embodiment should be subject to the protection scope of the claims.

[0143] This embodiment provides a computer-readable storage medium having computer-readable program instructions (i.e., computer programs) stored thereon, and the computer-readable program instructions are used to execute the infrared temperature measurement method in the above embodiments.

[0144] The computer-readable storage medium provided in this embodiment can be, for example, a USB flash drive, but is not limited to electrical, magnetic, optical, electromagnetic, infrared, or semiconductor systems, devices, or any combination of the above. More specific examples of computer-readable storage media can include, but are not limited to: electrical connections with one or more wires, portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM) or flash memory, optical fibers, portable compact disk read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination of the above. In this embodiment, the computer-readable storage medium can be any tangible medium that contains or stores a program, and this program can be used by or combined with an instruction execution system, device, or device. The program code contained on the computer-readable storage medium can be transmitted by any appropriate medium, including but not limited to: wires, optical cables, RF (Radio Frequency), etc., or any suitable combination of the above.

[0145] The above computer-readable storage medium can be included in the infrared temperature measurement device; it can also exist separately without being assembled into the infrared temperature measurement device.

[0146] The above computer-readable storage medium carries one or more programs. When the above one or more programs are executed by the infrared temperature measurement device, the infrared temperature measurement device is caused to: perform infrared temperature measurement.

[0147] Computer program code for performing the operations of this embodiment can be written in one or more programming languages or combinations thereof. The above-mentioned programming languages include object-oriented programming languages such as Java, Small talk, C++, and also include conventional procedural programming languages such as the "C" language or similar programming languages. The program code can be executed entirely on the user's computer, partially on the user's computer, executed as an independent software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In the case of a remote computer, the remote computer can be connected to the user's computer through any type of network, including a local area network (LAN) or a wide area network (WAN), or it can be connected to an external computer (for example, by using an Internet service provider to connect through the Internet).

[0148] The flowcharts and block diagrams in the accompanying drawings illustrate the possible architectures, functions, and operations of the systems, methods, and computer program products according to various embodiments of this embodiment. In this regard, each block in the flowchart or block diagram may represent a module, a program segment, or a part of code that contains one or more executable instructions for implementing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the blocks may occur in a different order than that marked in the accompanying drawings. For example, two consecutively represented blocks may actually be executed substantially in parallel, and they may sometimes be executed in the reverse order, depending on the functions involved. It should also be noted that each block in the block diagram and / or flowchart, and the combination of blocks in the block diagram and / or flowchart, can be implemented by a dedicated hardware-based system for performing the specified functions or operations, or can be implemented by a combination of dedicated hardware and computer instructions.

[0149] The modules described in this embodiment can be implemented in software or in hardware. Among them, the name of the module does not constitute a limitation on the unit itself in some cases.

[0150] The readable storage medium provided in this embodiment is a computer-readable storage medium. The computer-readable storage medium stores computer-readable program instructions (i.e., computer programs) for performing the above-mentioned infrared temperature measurement method, aiming at the technical problem that the installation and maintenance of blackbodies in the prior art are relatively difficult, resulting in a relatively complex temperature measurement step for the temperature measurement object. Compared with the prior art, the beneficial effects of the computer-readable storage medium provided in this embodiment are the same as those of the infrared temperature measurement method provided in the above embodiment, and will not be elaborated here.

[0151] This embodiment also provides a computer program product, including a computer program which, when executed by a processor, implements the steps of the infrared temperature measurement method as described above.

[0152] The computer program product provided by this embodiment can solve the technical problem that the installation and maintenance of a black body in the prior art are relatively difficult, resulting in a relatively complex temperature measurement step for the object to be measured. Compared with the prior art, the beneficial effects of the computer program product provided by this embodiment are the same as those of the infrared temperature measurement method provided by the above embodiment, and will not be elaborated here.

[0153] The above are only partial embodiments, and thus do not limit the patent scope of this embodiment. Any equivalent structural transformation made under the technical concept of this application by using the content of the specification and drawings of this application, or any direct / indirect application in other related technical fields, is included in the patent protection scope of this application.

Claims

1. An infrared temperature measurement method, characterized in that: The method comprises: Taking a picture of the object to be measured, and obtaining a current pixel value of the object to be measured according to the picture taking result; The target temperature of the object to be measured is obtained based on the current pixel value and a preset mapping relationship table, wherein the preset mapping relationship table is constructed by obtaining sample pixel values ​​corresponding to black bodies of different sample temperatures.

2. The method according to claim 1, characterized in that The step of obtaining the target temperature of the object to be measured based on the current pixel value and a preset mapping relationship table includes: Obtaining current environmental parameters of the temperature measurement environment in which the object to be temperature measured is located; Based on the current environmental parameters and the current pixel value, a target temperature relationship equation is obtained from a preset mapping relationship table, wherein the preset mapping relationship table is constructed by using sample pixel values ​​corresponding to black bodies of different temperatures and sample environmental parameters of the temperature measurement environment in which each black body is located; The target temperature of the object to be measured is obtained according to the current environmental parameters, the current pixel value and the target temperature relationship.

3. The method according to claim 2, characterized in that Before the step of photographing the object to be measured, the method includes: Shooting a plurality of black bodies at sample temperatures under different sample environment parameters to obtain sample pixel values ​​corresponding to the black bodies at each sample temperature under each sample environment; Determine a temperature parameter according to each of the sample pixel values ​​and each of the sample temperatures, and construct a temperature relationship equation according to each of the sample environment parameters and a mapping relationship between each of the sample pixel values ​​and each of the temperature parameters; The temperature relationship equations are classified based on the sample environment parameters to obtain a temperature relationship equation set, and a preset mapping relationship table is constructed based on the temperature relationship equation set.

4. The method according to claim 3, characterized in that The step of determining the temperature parameter according to each of the sample pixel values ​​and each of the sample temperatures comprises: Sort the sample temperatures to obtain adjacent sample temperatures, and obtain a first difference value according to the adjacent sample temperatures; Acquire adjacent sample pixel values ​​corresponding to adjacent sample temperatures under different environmental parameters, obtain a second difference based on the adjacent sample pixel values, and obtain a first temperature parameter based on the first difference and the second difference; Obtaining a third difference according to each of the adjacent sample temperatures and the adjacent sample pixel values ​​corresponding to each of the adjacent sample temperatures, and obtaining a second temperature parameter according to the second difference and the third difference; Each of the first temperature parameters and each of the second temperature parameters are used as temperature parameters.

5. The method according to claim 4, characterized in that The step of constructing a temperature relationship equation according to the mapping relationship between each of the sample environment parameters and each of the sample pixel values ​​and each of the temperature parameters comprises: Constructing a first temperature relationship equation based on the sample environment parameters and the mapping relationship between the sample pixel values ​​and the first temperature parameters corresponding to the sample environment parameters; Constructing a second temperature relationship equation according to the sample environment parameters and the mapping relationship between the sample pixel values ​​and the second temperature parameters corresponding to the sample environment parameters; Each of the first temperature relationship equations and each of the second temperature relationship equations are referred to as temperature relationship equations.

6. The method according to claim 4, characterized in that The step of obtaining the target temperature of the object to be measured according to the current environmental parameter, the current pixel value and the target temperature relationship includes: Determine a target first temperature parameter and a target second temperature parameter based on a target temperature relationship expression and current environmental parameters; The target temperature of the object to be measured is obtained according to the current pixel value, the target first temperature parameter and the target second temperature parameter.

7. The method according to claim 6, characterized in that The step of obtaining the target temperature of the object to be measured according to the current pixel value, the target first environmental parameter and the target second environmental parameter comprises: Obtaining the target temperature of the object to be measured by a preset temperature formula according to the current pixel value, the target first environmental parameter and the target second temperature parameter; The preset temperature formula is: R = k(i-1)(j)*AD+b(i-1)(j); Wherein, R is the target temperature, k(i-1)(j) is the target first temperature parameter, b(i-1)(j) is the target second temperature parameter, and AD is the current pixel value.

8. An infrared temperature measuring device, characterized in that: The device comprises: A data acquisition module is used to photograph the object to be measured and obtain the current pixel value of the object to be measured according to the photographing result; The temperature acquisition module is used to obtain the target temperature of the object to be measured based on the current pixel value and a preset mapping relationship table, wherein the preset mapping relationship table is constructed by constructing sample pixel values ​​corresponding to black bodies of different sample temperatures.

9. An infrared temperature measuring device, characterized in that: The device comprises: a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the computer program is configured to implement the steps of the infrared temperature measurement method according to any one of claims 1 to 6.

10. A storage medium, characterized in that: The storage medium is a computer-readable storage medium, and a computer program is stored on the storage medium. When the computer program is executed by a processor, the steps of the infrared temperature measurement method according to any one of claims 1 to 6 are implemented.

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