A computer hardware stress test tooling

Abstract

The present invention relates to the technical field of computer hardware stress testing, and discloses a computer hardware stress testing tooling, including a device main body. A computer motherboard is installed inside the device main body. The stress testing component includes a support panel installed inside the device main body. A hydraulic rod is fixed to the left side of the bottom of the support panel. Two groups of connecting rods are symmetrically fixed to the right side of the bottom of the support panel. A test head replacement box is fixed to the bottom of the two groups of connecting rods. A circular groove is opened inside the test head replacement box. A test head mounting plate is fixed to the inner wall of the circular groove. A number of special-shaped grooves are equidistantly opened at the bottom of the test head mounting plate. A special-shaped magnet is fixed to the inner wall of each special-shaped groove. Two groups of test probes are symmetrically fixed to both ends of the number of special-shaped magnets. Compared with the prior art, the present application can quickly perform pressure detection on the contact heads of the computer motherboard, and at the same time quickly replace different test heads, improving the detection efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of computer hardware stress testing, and specifically to a computer hardware stress testing tooling. Background Art

[0002] Computer hardware stress testing aims to evaluate the performance and stability of hardware under extreme or long-term loads to ensure its reliability.

[0003] When performing stress testing on existing computer motherboards, most rely on manual inspection of corresponding sockets. This manual inspection method has many drawbacks. Firstly, the operation process is too cumbersome, and the inspection personnel need to constantly switch the inspection plugs of various sockets, which not only consumes a lot of time and energy, but also is prone to operation errors, reducing the inspection efficiency. Secondly, during the inspection process, the inspection method is too single, and it is impossible to accurately conduct a comprehensive inspection of the sockets of the computer motherboard, and some potential problems may be overlooked. At the same time, manual inspection cannot detect whether the plugging and unplugging pressure of the socket will affect the motherboard. In actual operation, improper plugging and unplugging pressure may cause damage to the motherboard, affecting the normal use and service life of the computer. Therefore, we propose a computer hardware stress testing tooling. Summary of the Invention

[0004] In view of the deficiencies of the prior art, the present invention provides a computer hardware stress testing tooling, which has the advantages of not requiring manual switching of inspection plugs for various sockets, being able to accurately conduct a full-range inspection of the sockets of the computer motherboard, and being able to detect whether the plugging and unplugging pressure will affect the motherboard, etc., and solves a series of problems in the prior art such as the need for manual switching of inspection plugs at various interfaces, difficulty in accurately inspecting the sockets of the computer motherboard, and difficulty in detecting the impact of plugging and unplugging on the motherboard.

[0005] To achieve the above object, the present invention provides the following technical solution: A computer hardware stress testing tooling, including,

[0006] A device main body, four groups of first support columns are symmetrically fixed at the four corners of the bottom of the device main body, and a computer motherboard is installed inside the device main body;

[0007] Pressure test component, which is used to detect different sockets on a computer motherboard. The pressure test component includes a support panel installed inside the device body. A hydraulic rod is fixed to the left bottom of the support panel. Two groups of connecting rods are symmetrically fixed to the right bottom of the support panel. A test head replacement box is fixed to the bottom of the two groups of connecting rods. A circular groove is opened inside the test head replacement box. A test head mounting plate is fixed to the inner wall of the circular groove. A number of special-shaped grooves are equidistantly opened at the bottom of the test head mounting plate. A special-shaped magnetic block is fixed to the inner wall of each special-shaped groove. Two groups of test probes are symmetrically fixed to both ends of a number of the special-shaped magnetic blocks;

[0008] It should be noted that when the test head is inserted into the socket of the computer motherboard, the contact pressure, is generated by the deformation of the elastic structure inside the socket. According to Hooke's law, the contact pressure can be expressed as: , where k is the equivalent stiffness coefficient (N / mm) of the elastic structure of the socket, which is related to the socket material (such as the elastic modulus E, cross-sectional area A, and effective length L of the metal spring piece), ;

[0009] The elastic deformation displacement (mm) when the test head is inserted;

[0010] is the pre-tightening force (N) at the initial contact, which is determined by the socket structure tolerance;

[0011] Temperature control component, which is used to adjust the temperature inside the device body;

[0012] Displacement component, which is used to drive the pressure test component to move;

[0013] Clamping component, which is used to fix the computer motherboard.

[0014] Preferably, a test head mounting plate is fixed to the bottom of the test head replacement box. A second rotating shaft is rotatably connected to the center of the bottom of the test head mounting plate. The top of the second rotating shaft is fixed to the test head mounting plate. A third motor is fixed to the bottom of the test head mounting plate. The output end of the third motor is fixed to the second rotating shaft. A test head is fixed to the bottom of each of a number of the special-shaped magnetic blocks. A circular through-hole is opened at the top of the test head replacement box near the hydraulic rod. A magnetic block is fixed to the output end of the hydraulic rod. The magnetic block is adapted to the circular through-hole. The magnetic block and the special-shaped magnetic block attract each other;

[0015] When the test head continuously applies pressure until the socket breaks, the maximum bearing pressure is determined by the tensile strength of the material: .

[0016] Preferably, the displacement assembly includes two groups of second fixing blocks symmetrically fixed on the inner wall of the top of the equipment main body. A second threaded rod is rotatably connected to the facing surfaces of the two groups of second fixing blocks. A second threaded block is threadedly connected to the outer wall of the second threaded rod. A second motor is fixed to the outer wall of the second fixing block on the right side. The output end of the second motor is fixedly connected to the second threaded rod. A U-shaped frame is fixedly connected to the front outer wall of the second threaded block. A third threaded rod is rotatably connected to the facing surfaces of the U-shaped frame. A third threaded block is threadedly connected to the outer wall of the third threaded rod. The bottom of the third threaded block is fixedly connected to the support panel. A fourth motor is fixedly connected to the front outer wall of the U-shaped frame. The output end of the fourth motor is connected to the third threaded rod.

[0017] Preferably, four groups of second support columns are symmetrically fixed to the bottom of the inner wall of the equipment main body. The tops of the four groups of second support columns are all fixedly connected to the same bottom plate. The clamping assembly includes a second bevel gear rotatably connected to the bottom of the bottom plate. Four groups of first fixing blocks are symmetrically fixedly connected to the periphery of the top of the bottom plate. A first threaded rod is rotatably connected to each of the four groups of first fixing blocks on the side close to the second bevel gear. A first threaded block is threadedly connected to the outer wall of each of the four groups of first threaded rods. A first bevel gear is fixedly connected to each of the four groups of first threaded rods at the end close to the second bevel gear. The four groups of first bevel gears are all meshed with the second bevel gear. A first rotating shaft is coaxially fixedly connected to the bottom of the second bevel gear. A... is fixedly connected to the bottom of the inner wall of the equipment main body close to the first rotating shaft.

[0018] Preferably, the bottom of the computer main board is in contact with the top of the bottom plate. Rectangular through grooves are formed in the top of the bottom plate close to the first threaded rods. An L-shaped clamping plate is fixedly connected to the top of each of the four groups of first threaded rods. A spring is fixedly connected to each of the four groups of L-shaped clamping plates on the side close to the computer main board. A silica gel block is fixedly connected to the end of the spring away from the L-shaped clamping plate.

[0019] Preferably, a number of temperature sensors are equidistantly fixed to the left and right sides of the inner wall of the equipment main body. Two groups of door panels are symmetrically rotatably connected to the front outer wall of the equipment main body. Handles are fixedly connected to the front outer walls of the two groups of door panels.

[0020] Preferably, the temperature control assembly includes an air duct fixed to the top of the equipment main body. A cylindrical fixing block is fixedly connected to the top of the air duct. A heating rod is fixedly connected to the inner wall of the cylindrical fixing block. A fan is fixedly connected to the inner wall of the cylindrical fixing block close to the heating rod. A back plate is fixedly connected to the top of the cylindrical fixing block. A heating box is fixedly connected to the right outer wall of the cylindrical fixing block. The heating box is fixedly connected to the heating rod.

[0021] Preferably, two groups of air vents are symmetrically arranged at the top of the inner wall of the equipment main body, and the tops of the two groups of air vents are connected to the air ducts in a penetrating manner.

[0022] Compared with the prior art, the present invention provides a computer hardware pressure test tooling, which has the following beneficial effects:

[0023] 1. In this computer hardware pressure test tooling, by setting up the equipment main body, pressure test components, etc., during use, place the computer motherboard on the top of the bottom plate, and then fix it through the clamping components. After fixing, start the hydraulic rod. Through the displacement of the hydraulic rod, the magnetic block and the special-shaped magnetic block are mutually attached, and the test head is in contact with the detection port of the computer motherboard to perform pressure detection on the detection port of the computer motherboard. At the same time, the two groups of test probes can accurately detect the changes in the electrical performance inside the detection port. By analyzing the changes in electrical parameters, it can be judged whether the contact point is normal. In addition, by starting the third motor, different test heads can be replaced to contact and detect the detection port of the computer motherboard. Through the above design, it can quickly perform pressure detection on the contact heads of the computer motherboard and quickly replace different test heads, improving the detection efficiency.

[0024] 2. In this computer hardware pressure test tooling, by setting up the equipment main body, temperature control components, etc., during use, several groups of temperature sensors inside the equipment main body continuously monitor the temperature inside the equipment main body, and adjust the temperature inside the equipment main body through the heating box, so that the computer motherboard to be detected can simulate the pressure it bears in the actual use environment, improving the detection efficiency. Through the above design, it can control the temperature inside the equipment main body and improve the detection efficiency.

[0025] 3. In this computer hardware pressure test tooling, by setting up the equipment main body, displacement components and clamping components, etc., during use, place the computer motherboard on the top of the bottom plate. By starting the first motor, the four groups of L-shaped clamping plates gradually fix the computer motherboard. When fixing, the silica gel blocks inside the L-shaped clamping plates will automatically adjust according to the size of the computer motherboard, so as to ensure that the computer motherboard is firmly fixed. Then start the second motor and the third motor, so that the pressure test components can perform pressure detection on the sockets of the computer motherboard one by one. Through the above design, it can quickly fix the computer motherboard. Description of the Drawings

[0026] Figure 1 It is a three-dimensional structural schematic diagram of the present invention;

[0027] Figure 2 It is a structural schematic diagram of the interior of the equipment main body of the present invention;

[0028] Figure 3 It is a structural schematic diagram of the pressure test component of the present invention;

[0029] Figure 4 For the present invention Figure 3 Schematic diagram of the enlarged structure at position B in the present invention;

[0030] Figure 5 Schematic diagram of the partial structure of the pressure test component of the present invention;

[0031] Figure 6 Schematic diagram of the clamping component structure of the present invention;

[0032] Figure 7 Schematic diagram of the partial structure of the clamping component of the present invention;

[0033] Figure 8 For the present invention Figure 7 Schematic diagram of the enlarged structure at position A in the present invention;

[0034] Figure 9 Schematic diagram of the displacement component structure of the present invention;

[0035] Figure 10 Schematic diagram of the partial structure of the displacement component of the present invention;

[0036] Figure 11 Schematic diagram of the temperature control component structure of the present invention.

[0037] In the figure: 1, equipment main body; 2, pressure test component; 3, temperature control component; 4, displacement component; 5, clamping component; 6, first support column; 7, door panel; 8, handle; 9, second support column; 10, bottom plate; 11, rectangular through groove; 12, computer main board; 13, silicone block; 14, L-shaped clamping plate; 15, spring; 16, first fixing block; 17, first threaded rod; 18, first threaded block; 19, first bevel gear; 20, second bevel gear; 21, first rotating shaft; 22, first motor; 23, temperature sensor; 24, second fixing block; 25, second threaded rod; 26, second threaded block; 27, second motor; 28, air outlet; 29, third threaded rod; 30, third threaded block; 31, U-shaped frame; 32, support panel; 33, test head replacement box; 34, test head mounting plate; 35, third motor; 36, connecting rod; 37, hydraulic rod; 38, magnetic block; 39, circular groove; 40, special-shaped groove; 41, second rotating shaft; 42, special-shaped magnetic block; 43, test probe; 44, test head; 45, circular through hole; 46, heating rod; 47, fan; 48, back plate; 49, air duct; 50, heating box; 51, fourth motor. Detailed implementation manners

[0038] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts belong to the scope of protection of the present invention.

[0039] As introduced in the background art, there are deficiencies in the prior art. To solve the above technical problems, the present application proposes a computer hardware stress test tooling.

[0040] In a typical implementation manner of the present application, as Figure 1-10 shown, such a computer hardware stress test tooling includes a device main body 1. Four groups of first support columns 6 are symmetrically fixed at the four corners of the bottom of the device main body 1, and a computer motherboard 12 is installed inside the device main body 1;

[0041] Before performing a stress test on the computer motherboard 12, it should be noted that the computer motherboard 12 is pre-placed on the top of the bottom plate 10. Before performing the stress detection, the computer motherboard 12 is first powered on. If the computer motherboard 12 can be used normally, the stress test continues; otherwise, the stress test is not required. Then, before the test, it should be noted that the test is divided into the following types:

[0042] 1. When performing a stress test on the detection port on the computer motherboard 12, first detect the detection head through the test head 44 to see whether the detected detection socket can work normally and the maximum stress range when the test head 44 is inserted into the detected port. The purpose is to detect whether the detection port meets the subsequent daily use;

[0043] 2. After inserting the test head 44 into the detected socket, continue to apply pressure until the outside of the detected socket breaks. The purpose is to detect the maximum pressure value that the detected object can withstand;

[0044] 3. After inserting the test head 44 into the detected socket and continuing to apply pressure, the outer surface of the detected socket is intact, but the internal circuit is damaged. At this time, the test probes 43 on both sides of the test head 44 can be used for detection. The purpose is to detect the maximum pressure that the internal circuit of the detected port can withstand during subsequent use;

[0045] 4. Insert the test head 44 into the detected socket and then pull it out. The purpose is to detect the resistance value between the detected port and the test head 44. By judging the resistance value, it can be seen whether the detected port meets the subsequent normal use. If the resistance value is too large, the insertion force will be too large, affecting normal use. If the resistance value is too small, it will fall off or the like during subsequent use;

[0046] Note that when the test head is inserted into the socket of the computer motherboard, the contact pressure is generated by the deformation of the elastic structure inside the socket. According to Hooke's law, the contact pressure can be expressed as: , where k is the equivalent stiffness coefficient of the elastic structure of the socket (N / mm), which is related to the socket material (such as the elastic modulus E, cross-sectional area A, and effective length L of the metal shrapnel) ;

[0047] the elastic deformation displacement (mm) when the test head is inserted;

[0048] is the pre-tightening force (N) at the initial contact, which is determined by the socket structure tolerance;

[0049] When the test head continuously applies pressure until the socket breaks, the maximum bearing pressure is determined by the tensile strength of the material: ;

[0050] Secondly, the insertion and extraction resistance is jointly determined by the friction force and surface energy effect of the contact surface, and the Coulomb friction model is adopted: . , k, and The parameter definitions in the formula are as shown in Table 1 below:

[0051] Table 1

[0052]

[0053] As a preferred implementation manner in this embodiment, four groups of second support columns 9 are symmetrically fixed at the bottom of the inner wall of the device main body 1, and the tops of the four groups of second support columns 9 are fixedly connected to the same bottom plate 10. The clamping assembly 5 includes a second bevel gear 20 rotatably connected to the bottom of the bottom plate 10. Four groups of first fixing blocks 16 are symmetrically fixedly connected to the periphery of the top of the bottom plate 10. A first threaded rod 17 is rotatably connected to one side of each of the four groups of first fixing blocks 16 close to the second bevel gear 20. A first threaded block 18 is threadedly connected to the outer wall of each of the four groups of first threaded rods 17. A first bevel gear 19 is fixedly connected to one end of each of the four groups of first threaded rods 17 close to the second bevel gear 20. The four groups of first bevel gears 19 are all meshed with the second bevel gear 20. A first rotating shaft 21 is coaxially fixedly connected to the bottom of the second bevel gear 20. A first motor 22 is fixedly connected to the bottom of the inner wall of the device main body 1 near the first rotating shaft 21. The output end of the first motor 22 is fixedly connected to the first rotating shaft 21. The bottom of the computer main board 12 is in contact with the top of the bottom plate 10. Rectangular through grooves 11 are formed in the top of the bottom plate 10 near the first threaded rods 17. An L-shaped clamping plate 14 is fixedly connected to the top of each of the four groups of first threaded rods 17. A spring 15 is fixedly connected to one side of each of the four groups of L-shaped clamping plates 14 close to the computer main board 12. One end of the spring 15 away from the L-shaped clamping plate 14 is fixedly connected to a silica gel block 13. The displacement assembly 4 includes two groups of second fixing blocks 24 symmetrically fixed to the inner wall of the top of the device main body 1. A second threaded rod 25 is rotatably connected to the opposite sides of the two groups of second fixing blocks 24. A second threaded block 26 is threadedly connected to the outer wall of the second threaded rod 25. A second motor 27 is fixed to the outer wall of the second fixing block 24 on the right side. The output end of the second motor 27 is fixedly connected to the second threaded rod 25. A U-shaped frame 31 is fixedly connected to the front outer wall of the second threaded block 26. A third threaded rod 29 is rotatably connected to the opposite sides of the U-shaped frame 31. A third threaded block 30 is threadedly connected to the outer wall of the third threaded rod 29. The bottom of the third threaded block 30 is fixedly connected to a support panel 32. A fourth motor 51 is fixedly connected to the front outer wall of the U-shaped frame 31. The output end of the fourth motor 51 is connected to the third threaded rod 29;

[0054] When in use, place the computer motherboard 12 on top of the bottom plate 10, start the first motor 22, and drive the second bevel gear 20 to rotate through the first motor 22. At this time, the second bevel gear 20 will synchronously cause the four first rotating shafts 21 to rotate. It should be noted that the four first rotating shafts 21 rotate synchronously. When the four first rotating shafts 21 rotate synchronously, at this time, it will simultaneously drive the four L-shaped clamping plates 14 to slide towards the computer motherboard 12. It should be noted that the sizes of the computer motherboards 12 are different. Therefore, when fixing the computer motherboard 12, the silica gel blocks 13 inside the L-shaped clamping plates 14 will successively contact the sides of the computer motherboard. The silica gel block 13 that makes the first contact will continue to compress the spring 15 as the L-shaped clamping plate 14 moves until the four silica gel blocks 13 completely fix the computer motherboard 12. It should be mentioned that the deformation range of the spring 15 satisfies the displacement distance of the silica gel block 13. When the computer motherboard 12 is fixed, start the second motor 27 and the U-shaped frame 31 at this time, and drive the second threaded block 26 to move through the second motor 27 and drive the third threaded block 30 to move through the U-shaped frame 31 to achieve the horizontal and vertical displacement of the pressure test component 2. The main purpose of this design is to facilitate the pressure test component 2 to completely detect the detection port of the computer motherboard 12. It should be noted that the lengths of the third threaded rod 29 and the second threaded rod 25 satisfy the limit detection distance of the pressure test component 2, so as to improve the detection efficiency.

[0055] Further, in the above solution, the pressure test component 2 is used to detect different sockets on the computer motherboard 12. The pressure test component 2 includes a support panel 32 installed inside the device body 1. A hydraulic rod 37 is fixed to the left side of the bottom of the support panel 32. Two connecting rods 36 are symmetrically fixed to the right side of the bottom of the support panel 32. A test head replacement box 33 is fixed to the bottoms of the two connecting rods 36. A circular groove 39 is opened inside the test head replacement box 33. A test head mounting plate 34 is fixed to the inner wall of the circular groove 39. A number of special-shaped grooves 40 are equidistantly opened at the bottom of the test head mounting plate 34. A special-shaped magnet 42 is fixed to the inner wall of each special-shaped groove 40. Two test probes 43 are symmetrically fixed to both ends of each of the number of special-shaped magnets 42. A bottom plate is fixed to the bottom of the test head replacement box 33. A second rotating shaft 41 is rotatably connected to the center of the bottom of the bottom plate. The top of the second rotating shaft 41 is fixed to the test head mounting plate 34. A third motor 35 is fixed to the bottom of the bottom plate. The output end of the third motor 35 is fixed to the second rotating shaft 41. A test head 44 is fixed to the bottom of each of the number of special-shaped magnets 42. A circular through-hole 45 is opened at the top of the test head replacement box 33 near the hydraulic rod 37. A magnet 38 is fixed to the output end of the hydraulic rod 37. The magnet 38 is adapted to the circular through-hole 45. The magnet 38 and the special-shaped magnet 42 attract each other;

[0056] Specifically, after fixing the computer motherboard 12, the displacement component 4 drives the pressure test component 2 to move. When reaching the detected port, at this time, the displacement component 4 stops displacement, and the hydraulic rod 37 is randomly started. A magnetic block 38 is sleeved on the bottom output end of the hydraulic rod 37, and the magnetic block 38 attracts several groups of special-shaped magnetic blocks 42 on the surface of the test head mounting plate 34. It should be noted that several groups of special-shaped magnetic blocks 42 are adsorbed on the inner wall of the special-shaped groove 40, and the inner wall of the special-shaped groove 40 is made of a material that can be adsorbed by the special-shaped magnetic blocks 42. At the same time, two test probes 43 are arranged on both sides of the special-shaped magnetic blocks 42. The two test probes 43 can detect the electrical performance changes of the contacts at the detected port. By analyzing the changes in these parameters, it can be judged whether the contact can work normally within the specified pressure range. When a detected port is detected, at this time, the hydraulic rod 37 is started to drive the test head 44 away from the detected port until the test head 44 is adsorbed on the test head mounting plate 34. At this time, the third motor 35 is started to make the test head mounting plate 34 rotate. While rotating, the magnetic block 38 is separated from the special-shaped magnetic blocks 42. When the next test head 44 reaches the position of 38, the third motor 35 will stop. At this time, the hydraulic rod 37 will be started again to make the magnetic block 38 attract and contact with the special-shaped magnetic blocks 42, driving the test head 44 to perform a pressure test on the new detected port. In this way, it will continue until all the detected ports on the computer motherboard 12 are detected. At this time, all the devices will stop. Then, the computer motherboard 12 is taken out, and the pressure detection is completed;

[0057] It should be mentioned that according to the magnetic circuit theory, the adsorption force between opposite magnetic blocks can be approximated as: ;

[0058] Relationship between contact resistance and pressure: According to Holm contact theory, contact resistance decreases as the contact pressure increases, . and The parameter definitions in the formula are as shown in Table 2 below:

[0059] Table 2

[0060]

[0061] In this embodiment, the temperature control component 3 includes an air duct 49 fixed to the top of the device main body 1. A cylindrical fixing block is fixedly connected to the top of the air duct 49. A heating rod 46 is fixedly connected to the inner wall of the cylindrical fixing block. A fan 47 is fixedly connected to the inner wall of the cylindrical fixing block near the heating rod 46. A back plate 48 is fixedly connected to the top of the cylindrical fixing block. A heating box 50 is fixedly connected to the outer wall on the right side of the cylindrical fixing block. The heating box 50 is fixedly connected to the heating rod 46. Two groups of air outlets 28 are symmetrically opened at the top of the inner wall of the device main body 1. The tops of the two groups of air outlets 28 are connected to the air duct 49 in a through manner;

[0062] During the detection process, the temperature sensor 23 will continuously monitor the temperature inside the device main body 1 and adjust the temperature inside the device main body 1 by heating the heating rod 46 through the heating box 50, so as to simulate the pressure range that the computer motherboard 12 has to withstand in a normal environment.

[0063] The working principle of the present invention: After the computer motherboard 12 is fixed, the displacement component 4 drives the pressure test component 2 to move. When reaching the detected port, at this time, the displacement component 4 stops moving, and the hydraulic rod 37 is randomly started. A magnetic block 38 is sleeved on the bottom output end of the hydraulic rod 37. The magnetic block 38 attracts several groups of special-shaped magnetic blocks 42 on the surface of the test head mounting plate 34. It should be noted that several groups of special-shaped magnetic blocks 42 are adsorbed on the inner wall of the special-shaped groove 40. The inner wall of the special-shaped groove 40 is made of a material that can be adsorbed by the special-shaped magnetic blocks 42. At the same time, two groups of test probes 43 are arranged on both sides of the special-shaped magnetic blocks 42. The two groups of test probes 43 can detect the change in the electrical performance of the contacts at the detected port. By analyzing the changes in these parameters, it can be judged whether the contact can work normally within the specified pressure range. When a detected port is detected, at this time, the hydraulic rod 37 is started to drive the test head 44 to disengage from the detected port until the test head 44 is adsorbed on the test head mounting plate 34. At this time, the third motor 35 is started to make the test head mounting plate 34 rotate. While rotating, the magnetic block 38 disengages from the special-shaped magnetic blocks 42. When the next test head 44 reaches the position of 38, the third motor 35 will stop. At this time, the hydraulic rod 37 will be started again to make the magnetic block 38 attract and contact the special-shaped magnetic blocks 42, driving the test head 44 to perform a pressure test on a new detected port, and so on, until all the detected ports on the computer motherboard 12 are detected. At this time, all the devices will stop. At this time, the computer motherboard 12 is taken out, and the pressure detection is completed.

[0064] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A computer hardware stress test tooling, characterized in that: including, a device main body, four groups of first support columns are symmetrically fixed at the four corners of the bottom of the device main body, and a computer main board is installed inside the device main body; a pressure test component for detecting different sockets on the computer main board, the pressure test component includes a support panel installed inside the device main body, a hydraulic rod is fixed to the left side of the bottom of the support panel, two groups of connecting rods are symmetrically fixed to the right side of the bottom of the support panel, a test head replacement box is fixed to the bottom of the two groups of connecting rods, a circular groove is opened inside the test head replacement box, a test head mounting plate is fixed to the inner wall of the circular groove, a number of special-shaped grooves are equidistantly opened at the bottom of the test head mounting plate, a special-shaped magnet is fixed to the inner wall of each special-shaped groove, and two groups of test probes are symmetrically fixed to both ends of a number of the special-shaped magnets; a temperature control component for adjusting the temperature inside the device main body; a displacement component for driving the pressure test component to move; a clamping component for fixing the computer main board; a test head mounting plate is fixed to the bottom of the test head replacement box, a second rotating shaft is rotatably connected to the center of the bottom of the test head mounting plate, the top of the second rotating shaft is fixed to the test head mounting plate, a third motor is fixed to the bottom of the test head mounting plate, the output end of the third motor is fixed to the second rotating shaft, a test head is fixed to the bottom of each of a number of the special-shaped magnets, a circular through hole is opened at the top of the test head replacement box near the hydraulic rod, a magnet is fixed to the output end of the hydraulic rod, the magnet is adapted to the circular through hole, and the magnet and the special-shaped magnet attract each other.

2. The computer hardware stress test tooling according to claim 1, characterized in that: The displacement component includes two groups of second fixing blocks symmetrically fixed to the inner wall of the top of the device main body, a second threaded rod is rotatably connected to the opposite side of the two groups of second fixing blocks, a second threaded block is threadedly connected to the outer wall of the second threaded rod, a second motor is fixed to the outer wall of the second fixing block on the right side, the output end of the second motor is fixed to the second threaded rod, a U-shaped frame is fixedly connected to the front side outer wall of the second threaded block, a third threaded rod is rotatably connected to the opposite side of the U-shaped frame, a third threaded block is threadedly connected to the outer wall of the third threaded rod, the bottom of the third threaded block is fixed to the support panel, and a fourth motor is fixedly connected to the front side outer wall of the U-shaped frame, and the output end of the fourth motor is connected to the third threaded rod.

3. A computer hardware stress test tooling according to claim 1, characterized in that: Four groups of second support columns are symmetrically fixed at the bottom of the inner wall of the equipment main body. The tops of the four groups of second support columns are fixedly connected to the same bottom plate. The clamping assembly includes a second bevel gear rotatably connected to the bottom of the bottom plate. Four groups of first fixing blocks are symmetrically fixedly connected to the periphery of the top of the bottom plate. A first threaded rod is rotatably connected to one side of each of the four groups of first fixing blocks close to the second bevel gear. A first threaded block is threadedly connected to the outer wall of each of the four groups of first threaded rods. One end of each of the four groups of first threaded rods close to the second bevel gear is fixedly connected to a first bevel gear. The four groups of first bevel gears are all meshed with the second bevel gear. The bottom of the second bevel gear is coaxially fixedly connected to a first rotating shaft. A first motor is fixedly connected to the bottom of the inner wall of the equipment main body near the first rotating shaft. The output end of the first motor is fixedly connected to the first rotating shaft.

4. A computer hardware stress test tooling according to claim 3, characterized in that: The bottom of the computer main board is attached to the top of the bottom plate. Rectangular through grooves are formed in the top of the bottom plate near the first threaded rods. An L-shaped clamping plate is fixedly connected to the top of each of the four groups of first threaded rods. A spring is fixedly connected to one side of each of the four groups of L-shaped clamping plates close to the computer main board. One end of the spring away from the L-shaped clamping plate is fixedly connected to a silica gel block.

5. A computer hardware stress test tooling according to claim 1, characterized in that: A number of temperature sensors are equidistantly fixed on the left and right sides of the inner wall of the equipment main body. Two groups of door panels are symmetrically rotatably connected to the front outer wall of the equipment main body. Handles are fixedly connected to the front outer walls of the two groups of door panels.

6. The computer hardware stress test tooling according to claim 1, wherein: The temperature control assembly includes an air duct fixed to the top of the equipment main body. A cylindrical fixing block is fixedly connected to the top of the air duct. A heating rod is fixedly connected to the inner wall of the cylindrical fixing block. A fan is fixedly connected to the inner wall of the cylindrical fixing block near the heating rod. A back plate is fixedly connected to the top of the cylindrical fixing block. A heating box is fixedly connected to the right outer wall of the cylindrical fixing block. The heating box is fixedly connected to the heating rod.

7. The computer hardware stress test tooling according to claim 6, characterized in that: Two groups of air vents are symmetrically formed in the top of the inner wall of the equipment main body. The tops of the two groups of air vents are connected to the air duct in a through manner.

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