Photo interrupter assembly, photo interrupter, and method for manufacturing photo interrupter

Abstract

The invention discloses a photo interrupter assembly, a photo interrupter and a manufacturing method of the photo interrupter. The photo interrupter assembly includes an optoelectronic device and a housing. The photoelectric device comprises a device main body and a pin part which are connected with each other. The device body is provided with a signal portion for transmitting or receiving an optical signal. The housing covers the device main body and is provided with a combination structure and an opening through which an optical signal passes. The combination structure is used for being assembled with another combination structure of another photo interrupter assembly. Therefore, according to the photo interrupter assembly, the photo interrupter and the manufacturing method of the photo interrupter provided by the invention, the photo interrupter assembly which is confirmed to be invalid after being tested before being combined into a finished product can be disassembled by the combination structure of the shell, and a normal photo interrupter assembly is assembled with another photo interrupter assembly, so that the loss cost is reduced.

Description

Technical Field

[0001] The present invention relates to a component device, and more particularly to a photointerrupter component and a photointerrupter. Background Art

[0002] A photointerrupter is a photoelectric sensor mainly used to detect the presence or position of an object. It usually consists of a light-emitting component and a receiving component facing each other with a certain spacing therebetween. When an object enters the spacing and blocks the receiving component from receiving light, the output signal of the receiving component will change, thereby detecting the presence of the object.

[0003] In the existing manufacturing process of photointerrupters, an inner shell is first injection-molded inside a mold to encapsulate the light-emitting or receiving component to form the light-emitting or receiving component, and then a light-shielding outer shell provided with corresponding openings is respectively sleeved thereon. The outer shell is integrally formed. Only after the entire photointerrupter is formed can the functional test be carried out.

[0004] However, since the inner shell and the outer shell are made of materials with different physical properties respectively, for example, there are differences in the coefficient of thermal expansion (CTE) between the outer shell and the inner shell. Therefore, when the existing photointerrupter is reflow soldered to a circuit board, the temperature in the heating furnace causes a difference in the thermal expansion rates of the two materials, which may cause a gap between the inner and outer shells, resulting in a large change amplitude in the emitted or received optical signal, not meeting the set requirement specifications or factory specifications, and being classified as a defective finished product. At the same time, in the existing photointerrupter, the functional test can only be carried out after the overall formation. Therefore, the defective finished products after testing need to be discarded as a whole, increasing the consumption cost. In addition, the injection molding process inside the mold requires pre-making a mold, and the molds used for optical products require high precision, so that every time a design change is made, the cost of making the mold also becomes a cost that cannot be ignored. However, in response to the increasing changes in more and more terminal products, as well as the improvement of optical data interpretation technology and the change of optical signal algorithms, the customized demand for photointerrupters is gradually increasing. However, the existing photointerrupters can only produce finished products with the same specifications, and limited by the premise that the cost needs to be amortized after mold opening, the processing base quantity is high and the processing freedom is low, making it difficult to quickly and flexibly adjust according to the demand.

[0005] Therefore, how to improve through structural design and process design to reduce the overall consumption cost of the photointerrupter and improve the processing freedom of the photointerrupter to overcome the foregoing defects has become one of the important issues to be solved in the industry. Summary of the Invention

[0006] The technical problem to be solved by the present invention is to provide an optical shutter assembly, an optical shutter, and a manufacturing method of an optical shutter in view of the deficiencies of the prior art, so that the optical shutter can be tested before being assembled into a finished product, and the failed optical shutter assembly can be disassembled from the coupling structure of the housing, and a normal optical shutter assembly can be assembled with another optical shutter assembly to reduce the loss cost.

[0007] To solve the above technical problem, one of the technical solutions adopted by the present invention is to provide an optical shutter assembly, which includes an optoelectronic device and a housing. The optoelectronic device includes a device main body and a pin portion connected to each other. The device main body is provided with a signal portion for transmitting or receiving an optical signal. The housing covers the device main body. The housing has a coupling structure and at least one opening for the optical signal to pass through. The coupling structure is used to be assembled with another coupling structure of another optical shutter assembly.

[0008] To solve the above technical problem, another technical solution adopted by the present invention is to provide an optical shutter, which includes a transmitting module and a receiving module. The transmitting module includes a transmitter and a first housing. The transmitter includes a transmitter main body and a first pin portion connected to each other. The transmitter main body is used for transmitting an optical signal. The first housing covers the transmitter main body. The first housing has a first coupling structure and at least one first opening for the optical signal to pass through. The receiving module includes a receiver and a second housing. The receiver includes a receiver main body and a second pin portion connected to each other. The receiver main body is used for receiving an optical signal. The second housing covers the receiver main body. The second housing has a second coupling structure and at least one second opening for the optical signal to pass through. Among them, the first coupling structure is assembled to the second coupling structure to form a blocking groove between the transmitter main body and the receiver main body.

[0009] To solve the above technical problem, another technical solution adopted by the present invention is to provide a manufacturing method of an optical shutter, which includes: providing a transmitter, the transmitter includes a transmitter main body and a first pin portion connected to each other, and the transmitter main body is used for transmitting an optical signal; forming a first housing to cover the transmitter main body, the first housing has a first coupling structure and at least one first opening for the optical signal to pass through; providing a receiver, the receiver includes a receiver main body and a second pin portion connected to each other, and the receiver main body is used for receiving an optical signal; forming a second housing to cover the receiver main body, the second housing has a second coupling structure and at least one second opening for the optical signal to pass through; and assembling the first coupling structure and the second coupling structure to form a blocking groove between the transmitter main body and the receiver main body.

[0010] One of the beneficial effects of the present invention is that for the light interrupter component, the light interrupter, and the manufacturing method of the light interrupter provided by the present invention, through the technical solutions of "the housing of the device body covering the optoelectronic device has a coupling structure" and "the light interrupter is assembled by the coupling structures of the corresponding light interrupter components", the failed light interrupter component can be disassembled from the coupling structure of the housing and reassembled with another light interrupter component to reduce the consumption cost.

[0011] Another beneficial effect of the present invention is that for the light interrupter component provided by the present invention, the groove is formed by cutting the housing and correspondingly forms an opening for the optical signal to pass through. Therefore, the optical emission / reception position, size, angle, light input / output amount, and the number of openings can all be adjusted according to requirements. Thus, it is possible to avoid the high costs caused by having to re-open the mold when the optical effect is found to be unqualified after the assembly of the housing manufactured by in-mold injection molding. Moreover, the processing freedom can be improved, and the time and cost can be significantly reduced when the design is changed.

[0012] To further understand the features and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, the provided drawings are only for reference and illustration and are not used to limit the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a flowchart of the manufacturing method of the light interrupter of the present invention.

[0014] Figure 2 For Figure 1 It is a flowchart of step S22 of the manufacturing method of the light interrupter.

[0015] Figure 3 For Figure 1 It is a flowchart of step S32 of the manufacturing method of the light interrupter.

[0016] Figure 4 It is an exploded view of the components of the light interrupter according to the first embodiment of the present invention.

[0017] Figure 5 It is a schematic diagram of the light interrupter according to the first embodiment of the present invention.

[0018] Figure 6 It is a schematic diagram of the first sub-housing of the light interrupter according to the first embodiment of the present invention without the cutting process.

[0019] Figure 7 It is an exploded view of the components of a single light interrupter component according to the first embodiment of the present invention.

[0020] Figure 8 It is a schematic diagram of a single light interrupter component according to the first embodiment of the present invention.

[0021] Figure 9 Explosion schematic diagram of a single optical interrupter component according to the second embodiment of the present invention.

[0022] Figure 10 Explosion schematic diagram of a single optical interrupter component according to the third embodiment of the present invention.

[0023] Figure 11 Explosion schematic diagram of a single optical interrupter component according to the fourth embodiment of the present invention. Detailed implementation manners

[0024] The following are specific embodiments to illustrate the implementation manners of the present invention regarding "optical interrupter component, optical interrupter, and manufacturing method of optical interrupter". Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. Additionally, the drawings of the present invention are only for simple schematic illustration and are not drawn according to actual dimensions, which is stated in advance. The following implementation manners will further detail the related technical content of the present invention, but the disclosed content is not used to limit the protection scope of the present invention. In addition, the term "or" used herein should, depending on the actual situation, may include any one or a combination of more of the associated listed items.

[0025] Figure 1 Flowchart of the manufacturing method of the optical interrupter according to the embodiment of the present invention. Figure 2 For Figure 1 Flowchart of step S22 in the manufacturing method of the optical interrupter. Figure 3 For Figure 1 Flowchart of step S32 in the manufacturing method of the optical interrupter. Figure 4 Explosion schematic diagram of the optical interrupter according to the first embodiment of the present invention. The component numbers described in the manufacturing method can be referred to Figure 4 .

[0026] Refer to Figure 1 As shown, the embodiment of the present invention provides a manufacturing method of an optical interrupter, which includes the following steps:

[0027] Step S20: Provide a transmitter 20. Please refer to Figure 4, the emitter 20 includes an interconnected emitter body 200 and a first pin portion 210. The emitter body 200 is configured to emit an optical signal. One side of the emitter body 200 is electrically connected to the first pin portion 210, which can be used to supply power to the emitter body 200 to generate an optical signal. The first pin portion 210 includes two pins 212. The pins 212 are slender in appearance and extend away from the emitter body 200 from one side of the emitter body 200.

[0028] Step S22: Form a first housing 22 to enclose the emitter body 200.

[0029] The first housing 22 is formed on each surface of the emitter body 200 to enclose the entire emitter body 200. The appearance of the first housing 22 can be, for example, a cuboid. And on one of the surfaces of the first housing 22 (for example, the first surface S1), at least one first opening OP1 for the optical signal to pass through and a first coupling structure 220 are formed. In addition, the first housing 22 is composed of multiple layers of housings arranged from the inside out. For example, it may include a first sub-housing 230 and a second sub-housing 240.

[0030] Please refer to Figure 2 , the first sub-housing 230 and the second sub-housing 240 can be formed by an encapsulation device, and the step S22 of forming the first housing 22 further includes the following steps:

[0031] Step S221: Form a first sub-housing 230 to enclose the emitter body 200. In this step, the first sub-housing 230 can be formed on the surface of the emitter body 200 to enclose the entire emitter body 200 therein. The appearance of the first sub-housing 230 can be, for example, a cuboid, and on one of its surfaces (for example, the third surface S3), a first protruding structure 232 is provided.

[0032] In an embodiment of the present invention, the first protruding structure 232 is a first cylinder arranged along a first extension direction D1 and is located on the third surface S3 of the first sub-housing 230, where the first extension direction D1 is parallel or perpendicular to one of the edges of the third surface S3. Furthermore, both the first sub-housing 230 and the first protruding structure 232 can be made of a material that allows the optical signal emitted by the emitter body 200 to penetrate, for example, epoxy resin, and the first sub-housing 230 and the first protruding structure 232 can be formed separately or integrally.

[0033] In this step, as Figure 6 shown, Figure 6Schematic diagram of the first sub-housing of the optical shutter according to the first embodiment of the present invention without undergoing a cutting process. The cross-sectional area of the first protruding structure 232 obtained by a virtual plane parallel to the third surface S3 has a gradual change characteristic. For example, it can gradually decrease along the direction away from the emitter body 200. Thereby, in the subsequent process of forming the first opening OP1, the size of the first opening OP1 can be flexibly adjusted by adjusting the cutting depth.

[0034] Step S222: Form a second sub-housing 240 to cover the first sub-housing 230.

[0035] In this step, the second sub-housing 240 can be formed on the surface of the first sub-housing 230 to integrally cover the first sub-housing 230 therein. The appearance of the second sub-housing 240 can have a morphology similar to that of the first sub-housing 230. For example, a cuboid, or a cuboid with a different length-width ratio relationship from the first sub-housing 230.

[0036] Continuing the description of the first housing 22 in the above text, the second sub-housing 240 serves as the outer housing of the first housing 22. A first opening OP1 for allowing an optical signal to pass through and a first coupling structure 220 are formed on the first surface S1, and the first surface S1 can correspond to the third surface S3. Moreover, the first sub-housing 230 and the second sub-housing 240 have different optical characteristics. The second sub-housing 240 can be formed of, for example, a light-shielding material that does not allow the optical signal emitted by the emitter body 200 to pass through.

[0037] More specifically, the number of the first openings OP1 can be one or more, and can be formed in the second sub-housing 240 and correspond to at least a part of the first protruding structure 232 for allowing the optical signal to pass through. Moreover, a first coupling structure 220 is provided on the first surface S1 of the second sub-housing 240.

[0038] The first coupling structure 220 extends from the normal direction of the first surface S1 to form a bump, and this bump can be used to form a comb structure for assembly in subsequent steps. In this step, the first opening OP1 and the first coupling structure 220 can be formed simultaneously, or the first coupling structure 220 can be formed first and then the first opening OP1. The process sequence of the present invention is not limited to this. In other embodiments, the first opening OP1 and the first coupling structure 220 can be formed on different surfaces of the second sub-housing 240, rather than being limited to the shown first surface S1.

[0039] On the other hand, the first opening OP1 of the present invention can be formed in various ways. For example, a cutting process or an injection molding process can be used. Taking the cutting process as an example, one or more first grooves 242 are cut on the first surface S1 of the second sub-shell 240. The first grooves 242 are arranged along the third extension direction D3, and the third extension direction D3 of the first grooves 242 is perpendicular to the first extension direction D1 of the first protruding structure 232. Therefore, the first grooves 242 pass through the first protruding structure 232 to form the first opening OP1. The first opening OP1 is located at the bottom of each first groove 242, and a part of the first opening OP1 has a morphology complementary to that of the first protruding structure 232. It should be noted that the size of the first opening OP1 can be flexibly adjusted by adjusting the depth of each first groove 242 formed by cutting, or the width of each first groove 242 in the first extension direction D1 can be adjusted by changing the thickness dimension of the cutting tool to flexibly adjust the size of the first opening OP1.

[0040] As Figure 4 shown, after the cutting process, on the second sub-shell 240, the first groove 242 includes three first sub-grooves 242-1, 242-2, 242-3, which have different groove depths or groove widths respectively. For example, the depths of the three first sub-grooves are 242-1 < 242-2 < 242-3 in sequence. The first protruding structure 232 also has three recesses 232-1, 232-2, 232-3 corresponding to the three first sub-grooves 242-1, 242-2, 242-3, and their recess depths are 232-1 < 232-2 < 232-3 in sequence. Similarly, the first opening OP1 corresponding to the first groove 242 includes three first sub-openings OP1-1, OP1-2, OP1-3, and the three first sub-grooves 242-1, 242-2, 242-3 respectively correspond to the three first sub-openings OP1-1, OP1-2, OP1-3. Therefore, the three first sub-openings OP1-1, OP1-2, OP1-3 have different opening areas, and the area sizes are OP1-1 < OP1-2 < OP1-3 in sequence.

[0041] Please refer back to Figure 1, the manufacturing method of the light interrupter enters step S30: providing a receiver 30. In this step, the receiver 30 may include a receiver body 300 and a second pin portion 310 connected to each other. The receiver body 300 is used to receive an optical signal. One side of the receiver body 300 is electrically connected to the second pin portion 310. The receiver body 300 receives the optical signal generated by the corresponding transmitter body 200 and outputs the optical signal or the electrical signal converted from the optical signal to an external component, such as a controller, through the second pin portion 310. The second pin portion 310 includes two pins 312. Each pin 312 has an elongated appearance and extends away from the receiver body 300 from one side of the receiver body 300.

[0042] Step S32: forming a second housing 32 to cover the receiver body 300. In this step, the second housing 32 is formed on each surface of the receiver body 300 to cover the entire receiver body 300. The appearance of the second housing 32 may be, for example, a cuboid. And at least one second opening OP2 for the optical signal to pass through and a second engaging structure 320 are formed on one surface (for example, the second surface S2) of the second housing 32. In addition, the second housing 32 is composed of multiple layers of housings arranged from the inside to the outside. For example, it may include a third sub-housing 330 and a fourth sub-housing 340.

[0043] Please refer to Figure 2 , the third sub-housing 330 and the fourth sub-housing 340 can be formed by an encapsulation device. And step S32 of forming the second housing 32 further includes the following steps:

[0044] Step S321: forming a third sub-housing 330 to cover the receiver body 300.

[0045] In this step, the third sub-housing 330 can be formed on the surface of the receiver body 300 to cover the entire receiver body 300 therein. The appearance of the third sub-housing 330 may be, for example, a cuboid, and a second protruding structure 332 is provided on one surface (for example, the fourth surface S4).

[0046] In an embodiment of the present invention, the second protruding structure 332 is a second cylinder arranged along the second extension direction D2 and is located on the fourth surface S4 of the third sub-housing 330. Among them, the second extension direction D2 is parallel or perpendicular to one edge of the fourth surface S4. Furthermore, the third sub-housing 330 can be made of a material that allows the optical signal to penetrate, such as epoxy resin, and the third sub-housing 330 and the first protruding structure 332 can be formed separately or integrally.

[0047] In this step, the cross-sectional area of the second protruding structure 332 obtained by a virtual plane parallel to the fourth surface S4 has a gradient characteristic. For example, it can gradually decrease along the direction away from the receiver body 300. Thereby, in the subsequent process of forming the second opening OP2, the size of the second opening OP2 can be flexibly adjusted by adjusting the cutting depth.

[0048] Step S322: Form a fourth sub-shell 340 to cover the third sub-shell 330.

[0049] In this step, the fourth sub-shell 340 can be formed on the surface of the third sub-shell 330 to integrally cover the third sub-shell 330 therein. The appearance of the fourth sub-shell 340 can have a morphology similar to that of the third sub-shell 330. For example, a cuboid, or a cuboid with a different length-width ratio from the third sub-shell 330.

[0050] Continuing the description of the second shell 32 in the above text, the fourth sub-shell 340, as the outer shell of the second shell 32, has a second opening OP2 and a second bonding structure 320 provided on the second surface S2 for the optical signal to pass through, and the second surface S2 can correspond to the fourth surface S4. Moreover, the third sub-shell 330 and the fourth sub-shell 340 have different optical characteristics. The fourth sub-shell 340 can be formed of, for example, a light-shielding material that does not allow the optical signal emitted by the transmitter body 200 to pass through.

[0051] More specifically, the number of the second openings OP2 can be one or more, and can be formed in the fourth sub-shell 340 and correspond to at least a part of the second protruding structure 332 for the optical signal to pass through. Moreover, there is a second bonding structure 320 on the second surface S2 of the fourth sub-shell 340.

[0052] The second coupling structure 320 extends from the normal direction of the second surface S2 to form two bumps, and the recessed portion formed between the two bumps can be used to form a comb structure for assembly in subsequent steps. In this step, the second opening OP2 and the second coupling structure 320 can be formed simultaneously, or the second coupling structure 320 can be formed first and then the second opening OP2. The process sequence of the present invention is not limited to this. In other embodiments, the second opening OP2 and the second coupling structure 320 can be formed on different surfaces of the fourth sub-shell 340, rather than being limited to the second surface S2 shown. On the other hand, the second opening OP2 of the present invention can be formed in various ways. For example, a cutting process or an injection molding process can be used. Taking the cutting process as an example, one or more second grooves 342 are formed on the second surface S2 of the fourth sub-shell 340. The second grooves 342 are arranged along the fourth extension direction D4, and the fourth extension direction D4 of the second grooves 342 is perpendicular to the second extension direction D2 of the second protruding structure 332. Therefore, the second grooves 342 pass through the second protruding structure 332 to form the second opening OP2. The second opening OP2 is located at the bottom of each second groove 342, and a part of the second opening OP2 has a morphology complementary to the second protruding structure 332. It should be noted that the size of the second opening OP2 can be flexibly adjusted by adjusting the depth of the second grooves 342 formed by cutting, and the width of each second groove 342 in the second extension direction D2 can also be adjusted by changing the thickness dimension of the cutting tool to flexibly adjust the size of the first opening OP2.

[0053] As Figure 4 shown, after the cutting process, on the third sub-shell 330, the second grooves 342 include three second sub-grooves 342-1, 342-2, 342-3, which have different groove depths or groove widths respectively. The depths of the three second sub-grooves are 342-1 < 342-2 < 342-3 in sequence. The second protruding structure 332 also has three recessed portions 332-1, 332-2, 332-3 corresponding to the three second sub-grooves 342-1, 342-2, 342-3, and their recessed depths are 332-1 < 332-2 < 332-3 in sequence. Similarly, the second opening OP2 corresponding to the second grooves 342 includes three second sub-openings OP2-1, OP2-2, OP2-3, which respectively correspond to the three second sub-grooves 342-1, 342-2, 342-3. Therefore, the three second sub-openings OP2-1, OP2-2, OP2-3 have different opening areas, and the area sizes are OP2-1 < OP2-2 < OP2-3 in sequence. The operation principle of the subsequent light shutter with openings of multiple different areas will be further described.

[0054] In addition, it should be particularly noted that the aforementioned first coupling structure 220 extends from the normal direction of the first surface S1 to form a bump, and the second coupling structure 320 extends from the normal direction of the second surface S2 to form two bumps, so as to form a comb structure for assembly in subsequent steps. The function of forming the comb structure is to enable the first coupling structure 220 and the second coupling structure 320 to be assembled with each other. That is to say, the configurations of the first coupling structure 220 and the second coupling structure 320 of the present invention can be exchanged with each other. In addition, the comb structure can also be changed according to needs to form any complementary structure for mutual assembly, or be formed into other coupling structures not listed one by one in the present invention.

[0055] Please refer back to Figure 1 , and the manufacturing method of the optical shutter enters step S40:

[0056] Step S40: Assemble the first coupling structure 220 and the second coupling structure 320 to form a blocking groove G between the transmitter body 200 and the receiver body 300.

[0057] As described above, the comb structures of the first coupling structure 220 and the second coupling structure 320 are complementary to each other. For example, the bumps of the first coupling structure 220 correspond to the recessed parts of the second coupling structure 320. After combining the complementary comb structures, a spacing is formed between the transmitter body 200 and the receiver body 300 and is defined as the blocking groove G, as Figure 5 shown. Figure 5 is a schematic diagram of the optical shutter according to the first embodiment of the present invention. When there is no blocking object in the blocking groove G, the optical signal will be emitted through the first opening OP1 to the second opening OP2. As described above, the first opening OP1 and the second opening OP2 of the present invention can be in a state with multiple sub-openings. Among them, the three first sub-openings OP1-1, OP1-2, and OP1-3 respectively face the three second sub-openings OP2-1, OP2-2, and OP2-3. When a blocking object enters the blocking groove G, it is possible to judge the position where the blocking object enters the blocking groove G by judging whether signals are still detected at different positions of the sub-openings.

[0058] First Embodiment

[0059] Figure 7 is an exploded view of the single optical shutter component according to the first embodiment of the present invention. Figure 8 is a schematic diagram of the single optical shutter component according to the first embodiment of the present invention.

[0060] The first embodiment of the present invention is formed based on the aforementioned method for manufacturing the light blocker PI. However, the implementation manner of the present invention is not limited to the light blocker PI composed of a pair of light blocker components 1, and can be presented by a single light blocker component 1. The light blocker component 1 includes an optoelectronic device 10 and a housing 12. The optoelectronic device 10 is composed of a device main body 100 and a pin portion 110.

[0061] When observed from a top-down perspective, the outer shape of the light blocker component 1 is a cuboid and a plurality of slender structures extending from one side of the cuboid. Next, each component of the light blocker component 1 will be described in sequence from the inside out. The overall outer shape of the optoelectronic device 10 is strip-shaped, and the device main body 100 is disposed at one end of the optoelectronic device 10, and the pin portion 110 is disposed at the other end. A signal portion 111 is provided in the device main body 100, which can be used to transmit or receive optical signals. One side of the device main body 100 is electrically connected to the pin portion 110, which can be used to supply power to the device main body 100 to generate optical signals, or output the electrical signals generated by the optical signals received by the device main body 100 to external components. The pin portion 110 may include a plurality of pins 112. The appearance of the pins 112 is slender and extends away from the device main body 100 from one side of the cuboid.

[0062] Next, the housing 12 is located on each surface of the device main body 100 and covers the entire device main body 100. Its appearance can be, for example, a cuboid. And on one of the surfaces of the housing 12 (for example, the first surface S1), there is at least one opening OP and a coupling structure 120. In addition, the housing 12 is composed of multiple layers of housing arranged from the inside out. For example, it may include a first sub-housing 130 and a second sub-housing 140.

[0063] The first sub-housing 130 is disposed on the surface of the device main body 100 to cover the entire device main body 100 therein. The appearance of the first sub-housing 130 can be, for example, a cuboid, and a protruding structure 132 is provided on one of its surfaces (for example, the second surface S2).

[0064] In the embodiment of the present invention, the protruding structure 132 is a cylinder disposed along a first extension direction D1 and is located on the second surface S2 of the first sub-housing 130, where the first extension direction D1 is parallel or perpendicular to one edge of the second surface S2. Furthermore, the first sub-housing 130 can be made of a material that allows the optical signals emitted by the device main body 100 to penetrate. Among them, the material can be a polymer compound material, for example, epoxy resin.

[0065] The cross-sectional area of the protruding structure 132 obtained by a virtual plane parallel to the second surface S2 has a gradient characteristic. For example, it can gradually decrease along the direction away from the device main body 100. Thereby, in the subsequent process of forming the opening OP, the size of the opening OP can be flexibly adjusted by adjusting the cutting depth or width.

[0066] The second sub - housing 140 is disposed on the surface of the first sub - housing 130 to entirely enclose the first sub - housing 130 therein. The appearance of the second sub - housing 140 may have a morphology similar to that of the first sub - housing 130. For example, a cuboid, or a cuboid with a different length - width ratio from the first sub - housing 130.

[0067] Continuing the description of the housing 12 in the above text, the second sub - housing 140, as the outer housing of the housing 12, has an opening OP for providing optical signals to pass through and a coupling structure 120 formed on the first surface S1, and the first surface S1 may correspond to the second surface S2. Moreover, the first sub - housing 130 and the second sub - housing 140 have different optical properties. The second sub - housing 140 may be formed of a light - shielding material, for example, which does not allow the optical signals emitted or received by the device body 100 to pass through. Among them, the light - shielding material is a polymer compound material doped with a dye. For example, an epoxy resin doped with a dye can be used to block the optical signals within a predetermined wavelength range. For example, when the optical signal is infrared light, a light - shielding material that can block optical signals with a wavelength less than 1000 nm is selected.

[0068] Examples of the inner shell and outer shell materials used in existing optical shutters through injection molding process are shown in Table 1. The inner shell uses epoxy resin A, while the outer shell uses epoxy resin B doped with dye. Epoxy resin A and epoxy resin B have different physical properties. The physical properties can be, for example, the coefficient of thermal expansion (CTE), where the unit of the coefficient of thermal expansion is ppm / °C. At different glass transition temperatures Tg, the coefficients of thermal expansion Alpha1 and Alpha2 of the inner shell and the outer shell, where Alpha1 is the coefficient of thermal expansion of the material below the glass transition temperature Tg, and Alpha2 is the coefficient of thermal expansion of the material above the glass transition temperature Tg. For example, when the processing temperature is less than 125°C, the difference in the coefficient of thermal expansion CTE Alpha1 between epoxy resin A and epoxy resin B reaches 7 times; when 125°C ≤ processing temperature < 270°C, the difference between CTE Alpha2 of epoxy resin A and CTE Alpha1 of epoxy resin B reaches 18 times. When high-temperature processing methods such as reflow soldering are implemented, the temperature in the heating furnace generally reaches above 200°C. Due to the large difference in the thermal expansion rates of epoxy resin A and epoxy resin B, the difference in the expansion amplitudes of the inner shell and the outer shell is significant, resulting in gaps at the interface between the inner shell and the outer shell, and causing unexpected changes in the optical signals emitted or received by the finished product. In particular, it should be noted that the types and additives of epoxy resins will affect various physical properties. Table 1 aims to illustrate that for existing optical shutters to meet the process requirements, different epoxy resins are selected for the inner shell and the outer shell. Different epoxy resins may have different expansion amplitudes due to differences in physical properties and generate gaps during high-temperature processing. Therefore, any epoxy resin A' and epoxy resin B' with physical properties different from those listed in Table 1 still apply to the foregoing description.

[0069] Table 1

[0070]

[0071] Examples of the materials used in the first sub-shell 130 and the second sub-shell 140 formed by potting in the present invention are shown in Table 2. After the first sub-shell 130 is formed by the potting process, the second sub-shell 140 is formed again by the potting process. Therefore, the interface between the two is not obvious after the two potting processes are completed. The first sub-shell 130 and the second sub-shell 140 of the present invention are made of the same or similar materials. For example, the first sub-shell 130 uses epoxy resin C, and the second sub-shell 140 also uses epoxy resin C doped with dye. Since there is almost no difference in CTE between the two, their expansion rates are the same or almost the same in a high-temperature processing environment, thus avoiding the generation of gaps at the interface between the two and reducing the possibility of causing unexpected changes in the optical signals emitted or received by the product.

[0072] Table 2

[0073]

[0074] More specifically, the number of the openings OP1 can be one or more, and can be formed in the second sub-shell 140 and correspond to at least a part of the protruding structure 132 for an optical signal to pass through. Moreover, a bonding structure 120 is provided on the first surface S1 of the second sub-shell 140.

[0075] The bonding structure 120 of the optical shutter component 1 and the bonding structure 120' of another optical shutter component 1' form a comb structure that is complementary to each other. Since the shape of the bonding structure 120 of the optical shutter component 1 is different from the shape of the bonding structure 120' of another optical shutter component 1', the present invention can avoid assembling two optical shutter components 1 with the same function, thereby improving the production yield of the optical shutter PI.

[0076] The present invention can form the opening OP in various ways. For example, a cutting process or an injection molding process can be used. Taking the cutting process as an example, one or more grooves 142 are cut on the first surface S1 of the second sub-shell 140. The extending direction of each groove 142 is perpendicular to the extending direction of the protruding structure 132. Therefore, the groove 142 passes through the protruding structure 132 to form the opening OP. The opening OP is located at the bottom of each groove 142, and a part of the opening OP has a topography complementary to the protruding structure 132. Since the groove 142 is formed by the cutting process, when the optical shutter component 1 needs to change the number, size or position of the opening OP due to different requirements, the housing 12 can still be made using the same mold, and only the parameters of the cutting process need to be adjusted to obtain a plurality of openings OP with different numbers, sizes or positions. Therefore, the optical shutter component 1 of the present invention can save the production time and cost of a new mold.

[0077] Viewed from the side view angle of the light interrupter component 1, the cross-sectional area of the protruding structure 132 gradually decreases along the direction away from the device main body 100, such that the depth of the groove 142 is proportional to the size of the top area A of the opening OP. Here, the depth of the groove 142 refers to the predetermined distance d between the bottom of the groove 142 and the first surface S1. That is to say, the size of the top area A of the opening OP is proportional to the predetermined distance d. In the present invention, multiple predetermined distances d can be the same or different. The protruding structure 132 in this embodiment is a triangular prism, and the shape of the opening at the bottom of the groove 142 is a rectangle, that is, the top area A is a rectangular area. Since the optoelectronic device 10 emits or receives optical signals through the top area A in the opening OP, when the predetermined distance d is larger, the top area A of the opening OP is larger, and the energy of the optical signal passing through the opening OP is larger. Since the sensitivity of the light interrupter component 1 of the present invention is determined by the size of the opening OP, the controller (not shown in the figure) of the light interrupter component 1 can be designed to activate the corresponding electrical signal according to the energy threshold or time length of the received optical signal.

[0078] The operating principle of the light interrupter component 1 is to detect changes in optical signals. In the light interrupter component 1, an opening OP for providing the passage of optical signals is provided on the housing 12, so that the optical signals have directivity. When two corresponding light interrupter components 1 and 1' are connected, the light interrupter component 1 receives the optical signals emitted by the other light interrupter component 1', which can be used to confirm whether there is an object blocking the blocking groove G between the two opposite light interrupter components 1.

[0079] In addition, the pin portion 110 of the optoelectronic device 10 includes a plurality of pins 112. Viewed from the perspective of a top-down perspective, one end of the plurality of pins 112 is connected to the device main body 100, and the other end extends in the direction away from the device main body 100. And the device main body 100 includes at least one optoelectronic component electrically connected to the plurality of pins 112, and the optoelectronic component is the signal portion 111. The pin portion 112 has a metal part as the main body. The pin portion 110 of the present invention has two pins 112, and on the device main body 100 connected to one pin 112, there is a chip for emitting or receiving optical signals.

[0080] Figure 4 It is an exploded schematic diagram of the components of the light interrupter according to the first embodiment of the present invention. Figure 5 It is a schematic diagram of the light interrupter according to the first embodiment of the present invention. The light interrupter PI of the first embodiment of the present invention includes a transmitting module 2 and a receiving module 3. The transmitting module 2 includes a transmitter 20 and a first housing 22, and the receiving module 3 includes a receiver 30 and a second housing 32. The component features of the transmitting module 2 and the receiving module 3 have been described in the foregoing manufacturing method of the light interrupter, and will not be elaborated here.

[0081] The light blocker PI of the present invention is composed of a transmitting module 2 and a receiving module 3, and the first coupling structure 220 of the transmitting module 2 is coupled to the second coupling structure 320 at the receiving module 3 end. Specifically, the first coupling structure 220 at the transmitting module 2 end is located on the first surface S1 of the second sub-housing 240 and is a comb structure. The second coupling structure 320 at the receiving module 3 end is located on the second surface S2 of the fourth sub-housing 340 and is another comb structure complementary to the comb structure of the second sub-housing 240.

[0082] Regarding the actuation mechanism of the light blocker PI of the present invention, in the normal state of the light blocker PI, the first opening OP1 of the transmitting module 2 faces the second opening OP2 of the receiving module 3. That is, when there is no shielding object in the shielding groove, the receiver body 300 detects the optical signal emitted by the transmitting module 2 and transmits the optical signal or the electrical signal converted from the optical signal to the controller (not shown) of the light blocker PI. The controller receives the signal and determines that the light blocker PI is in a normal state. On the contrary, when a shielding object appears in the shielding groove, causing the receiver body 300 not to receive the optical signal, and the controller does not receive the electrical signal converted from the optical signal within a specific time interval, it is determined that the light blocker PI is in a state with a shielding object. The emitter assembly of the transmitting module 2 of the present invention can be, for example, an infrared emitter or a laser emitter, and the receiver assembly of the receiving module 3 can be, for example, a phototransistor or a photodiode, but the present invention is not limited thereto. Specifically, in the normal state of the light blocker PI, the emitter assembly emits an optical signal such as infrared rays that penetrate the first sub-housing 230 and are emitted to the outside of the transmitting module 2 through the first opening OP1 corresponding to the first protruding structure 232. The optical signal enters the receiving module 3 through the second opening OP2 and the second protruding structure 332, penetrates the third sub-housing 330, and is received by the receiver body 300, and the optical signal or the electrical signal converted from the optical signal is transmitted to the controller.

[0083] Second Embodiment

[0084] Figure 8 It is an exploded schematic diagram of the components of a single light blocker assembly according to the second embodiment of the present invention.

[0085] The second embodiment of the present invention is formed based on the manufacturing method of the aforementioned light blocker PI. Hereinafter, the implementation manner will be described with a single light blocker assembly 6. The light blocker assembly 6 includes an optoelectronic device 60 and a housing 62.

[0086] When observed from a top-down perspective, the optoelectronic device 60 is composed of a device main body 600 and a pin portion 610. The pin portion 610 is connected to one side of the device main body 600. The device main body 600 is provided with a signal portion 611 for transmitting or receiving optical signals. The housing 62 covers the entire device main body 600, and the housing 62 has a plurality of sixth openings OP6 for allowing optical signals to pass through. A coupling structure 620 is provided on the first surface S6-1 of the light shutter assembly 6 for coupling with another coupling structure 620' (not shown in the figure) of another light shutter assembly 6'.

[0087] The housing 62 includes a first sub-housing 630 covering the device main body 600 and a second sub-housing 640 covering the first sub-housing 630. In this embodiment, the first extension direction D1 is parallel to the length direction of the pin portion 610. The protruding structure 632 is a semi-cylindrical body along the first extension direction D1 and is located on the second surface S6-2 of the first sub-housing 630, and the cross-sectional area obtained by the virtual plane parallel to the second surface S6-2 of the protruding structure 632 has a gradient characteristic.

[0088] On the first surface S6-1 of the second sub-housing 640, there are a plurality of grooves 642, and a plurality of openings OP6 are located at the bottoms of the corresponding grooves 642. When observing the first surface S6-1 of the first sub-housing 630 facing the openings OP6 from a top-down perspective, the extension direction of the protruding structure 632 is perpendicular to the extension direction of each groove 642, and the plurality of openings OP6 of the plurality of grooves 642 are arranged along a predetermined direction, and the predetermined direction is perpendicular to the extension direction of each groove 642.

[0089] When observed from the side view angle of the light shutter assembly 6, a part of each opening OP6 has a morphology complementary to the protruding structure 632, that is, each opening OP6 is filled by the protruding structure 632.

[0090] The depth of the groove 642 is a predetermined distance d6 between the bottom of the groove 642 and the first surface S6-1. Since the cross-sectional area of the protruding structure 632 gradually decreases along the direction away from the device main body 600, the top area A of the opening OP corresponding to the bottom of the groove 642 is proportional to the predetermined distance d6. Specifically, the opening shape corresponding to the protruding structure 632 at the bottom of the groove 642 is a rectangle, and the shape of the opening OP6 connecting the two side edges at the bottom is a semi-circle, and the top area A is the rectangle area.

[0091] The optoelectronic device 60 includes a device body 600 and a pin portion 610. The device body 600 is provided with a signal portion 611 for transmitting or receiving optical signals. The pin portion 610 includes three first pins 612. The device body 600 includes two signal portions 611 electrically connected to one of the first pins 612. The two signal portions 611 are arranged side by side on the die bonding plane of the first pin 612 and are respectively electrically connected to the other two first pins 612. The three first pins 612 have a metal part as the main body, and the signal portion 611 is an optoelectronic component for receiving light or emitting light, such as an infrared emitter, a laser emitter, a phototransistor, or a photodiode and other optoelectronic components. The number of optoelectronic components and corresponding pins provided in the present invention is not limited to two.

[0092] This embodiment illustrates that the protruding structure can be any column with a gradient characteristic, such as a triangular prism, a semi-cylindrical body, an arc-shaped column, etc., so that the top area of the opening can be flexibly adjusted according to the depth of the groove to meet various design requirements.

[0093] The third embodiment

[0094] Figure 10 It is an exploded view of a single optical interrupter component according to the third embodiment of the present invention.

[0095] The third embodiment of the present invention is also formed based on the foregoing manufacturing method of the optical interrupter PI. The following describes the implementation manner with a single optical interrupter component 7. The optical interrupter component 7 includes an optoelectronic device 70 and a housing 72.

[0096] Viewed from a top-down perspective, the optoelectronic device part and the bonding structure of the third embodiment are the same as those of the first embodiment and will not be elaborated here. The housing 72 includes a first sub-housing 730 and a second sub-housing 740 covering the first sub-housing 730. The protruding structure 732 is a triangular prism along the third extension direction D3 and is located on the second surface S7-2 of the first sub-housing 730. The third extension direction D3 is perpendicular to the long side of the second surface S7-2, and the cross-sectional area of the protruding structure 732 gradually decreases along the direction away from the device body 700.

[0097] And there is at least one groove 742 on the first surface S7-1 of the second sub-housing 740. Viewed from a top-down angle, for the first surface S7-1 of the first sub-housing 730 facing the opening OP7, the extension direction of the protruding structure 732 is perpendicular to the extension direction of each groove 742. The groove 742 of this embodiment extends parallel to the extension direction of the pin 712. The groove 742 extends vertically from the top surface of the second sub-housing 740 to be close to the bonding structure 720, that is, one end of the groove 742 is connected to the external space and the other end is closed.

[0098] This embodiment illustrates that the extending directions of the protruding structure and the groove can be flexibly adjusted to meet various design requirements.

[0099] Fourth Embodiment

[0100] Figure 11 FIG. is an exploded view of a single light blocker component of the light blocker according to the fourth embodiment of the present invention.

[0101] The fourth embodiment of the present invention is also formed based on the foregoing manufacturing method of the light blocker PI. The state of the first sub-shell 830 without a protruding structure is illustrated by a single light blocker component 8.

[0102] The optoelectronic device 80 and the bonding structure 820 of the fourth embodiment are the same as those of the first embodiment and will not be described in detail herein. The light blocker component 8 includes an optoelectronic device 80 and a housing 82. The housing 82 includes a first sub-shell 830 and a second sub-shell 840 covering the first sub-shell 830. A groove 842 is formed on the first surface S8-1 of the second sub-shell 840. An opening OP8 is formed at the bottom of the groove 842, and the opening OP8 exposes a part of the second surface S8-2. In this embodiment, the first sub-shell 830 can completely cut off the protruding structure formed in other embodiments through a cutting process, and after forming the second sub-shell 840 on all surfaces of the first sub-shell through a potting process, a groove 842 is formed on the first surface S8-1 of the second sub-shell through a cutting process. An opening OP8 is formed at the bottom of the groove 842, and the opening OP8 exposes a part of the second surface S8-2. The first sub-shell 830 of this embodiment can also form the first sub-shell 830 with a second surface S8-2 through a potting process, and cut an opening OP8 on the first surface S8-1 of the second sub-shell 840 through a cutting process to expose a part of the second surface S8-2. One end of the groove 842 formed on the second sub-shell 840 through the foregoing cutting process is closed, and the other end is connected to the external space. In addition, this embodiment can also be formed by a double potting process. First, the first sub-shell 830 with a second surface S8-2 is formed through a potting process, and then the second sub-shell 840 that generally covers the first sub-shell and has an opening OP8 is formed through a potting process. The opening OP8 exposes a part of the second surface S8-2. One end of the groove 842 formed on the second sub-shell 840 through the double potting process is closed, and the other end can be set to be closed or connected to the external space according to requirements. The foregoing forming method can maximize the size of the groove 842. In this case, the first sub-shell 830 in the light blocker component 8 of the present invention does not have a protruding structure.

[0103] Advantages of the Embodiment

[0104] One of the beneficial effects of the present invention is that the light blocker component, the light blocker, and the manufacturing method of the light blocker provided by the present invention can, through the technical solutions of "the housing of the device body covering the optoelectronic device has a coupling structure" and "the light blocker is assembled by the coupling structures of the corresponding light blocker components", disassemble the failed light blocker component from the coupling structure of the housing and reassemble another light blocker component to reduce the consumption cost.

[0105] Furthermore, when the test result shows that one of the light blocker components fails, due to the coupling structure of the light blocker component of the present invention, only the failed light blocker component needs to be separated and removed, and the remaining light blocker components are re-docked with another new light blocker component. Therefore, the coupling structure of the light blocker component can significantly reduce the consumption cost caused by defective products.

[0106] Furthermore, since the shape of the first coupling structure of the transmitting module is different from the shape of the second coupling structure of the receiving module end, the assembly of the same functional modules can be avoided, and the production yield of the light blocker can be improved.

[0107] Furthermore, since the groove is formed by cutting the housing and an opening for the optical signal to pass through is correspondingly formed, the optical emission / reception position, size, angle, light input / output amount, and the number of openings of the light blocker can all be adjusted according to requirements, improving the processing freedom and significantly reducing the time and cost.

[0108] The content disclosed above is only the preferred feasible embodiment of the present invention, and does not limit the protection scope of the claims of the present invention. Therefore, all equivalent technical changes made by using the content of the specification and drawings of the present invention are included in the protection scope of the claims of the present invention.

Claims

1. A photointerrupter assembly, characterized in that: The photointerrupter assembly comprises: An optoelectronic device comprises a device body and a pin portion connected to each other, wherein the device body is provided with a signal portion for transmitting or receiving an optical signal; and A shell covers the device body, the shell has a combination structure and at least one opening for the optical signal to pass through, the combination structure is used to be assembled with another combination structure of another photointerrupter component.

2. The photointerrupter assembly according to claim 1, wherein: The housing comprises: a first sub-shell, covering the device body and having a protruding structure; and A second sub-shell covers the first sub-shell, at least one of the openings is disposed in the second sub-shell and corresponds to at least a portion of the protruding structure, wherein the first sub-shell and the second sub-shell have different optical properties for the optical signal.

3. The photointerrupter assembly according to claim 2, characterized in that: A cross-sectional area of ​​the protruding structure gradually decreases along a direction away from the device body.

4. The photointerrupter assembly according to claim 3, characterized in that: A first surface of the second subshell is provided with at least one groove, at least one opening is located at the bottom of at least one groove, a portion of at least one opening has a shape complementary to the protruding structure, and the combining structure is located on the first surface and is a comb structure.

5. The photointerrupter assembly according to claim 4, characterized in that: When at least one of the grooves is plural, the bottoms of the grooves are spaced from the first surface by different or same predetermined distances, and the top areas of the openings corresponding to the grooves are proportional to the corresponding predetermined distances.

6. The photointerrupter assembly according to claim 4, characterized in that: When the number of at least one of the grooves is plural, the openings of the plurality of grooves are arranged in parallel along a predetermined direction.

7. The photointerrupter assembly according to claim 4, wherein: The protruding structure is a column arranged along a first extending direction and is located on a second surface of the first sub-shell, and the first extending direction is parallel or perpendicular to one edge of the second surface.

8. The photointerrupter assembly according to claim 7, wherein: The first surface corresponds to the second surface, and at least one of the grooves is arranged along a second extension direction, and the second extension direction is perpendicular to the first extension direction.

9. The photointerrupter assembly according to claim 2, wherein: The first sub-housing allows the optical signal to penetrate therethrough, and the second sub-housing does not allow the optical signal to penetrate therethrough.

10. The photointerrupter assembly according to claim 2, wherein: The thermal expansion coefficients of the first sub-shell and the second sub-shell are within a predetermined range.

11. The photointerrupter assembly according to claim 2, wherein: The second subshell includes a polymer compound material doped with a dye, and the second subshell blocks the optical signal within a predetermined wavelength range from passing through.

12. The photointerrupter assembly according to claim 1, wherein: The pin portion includes a plurality of pins, and the device body includes at least one optoelectronic component electrically connected to the plurality of pins.

13. A photointerrupter, characterized in that: The photointerrupter comprises: A transmitting module, comprising: A transmitter, comprising a transmitter body and a first pin portion connected to each other, wherein the transmitter body is used to transmit an optical signal; and a first shell, covering the transmitter body, the first shell having a first combining structure and at least one first opening for providing the optical signal to pass through; and A receiving module, comprising: a receiver, comprising a receiver body and a second pin portion connected to each other, wherein the receiver body is used to receive the optical signal; and a second shell, covering the receiver body, the second shell having a second coupling structure and at least one second opening for the optical signal to pass through; The first combining structure is assembled to the second combining structure to form a blocking groove between the transmitter body and the receiver body.

14. The photointerrupter according to claim 13, wherein: The first housing comprises: a first sub-shell, covering the transmitter body and having a first protruding structure; and a second sub-shell covering the first sub-shell, wherein at least one first opening is disposed in the second sub-shell and corresponds to at least a portion of the first protruding structure; and Wherein, the second housing comprises: a third sub-shell, covering the receiver body and having a second protruding structure; and a fourth sub-shell covering the third sub-shell, wherein at least one second opening is disposed in the fourth sub-shell and corresponds to at least a portion of the second protruding structure; The first sub-shell and the second sub-shell have different optical properties, and the third sub-shell and the fourth sub-shell have different optical properties.

15. The photointerrupter according to claim 14, wherein: The cross-sectional area of ​​the first protruding structure gradually decreases along a direction away from the transmitter body, and the cross-sectional area of ​​the second protruding structure gradually decreases along a direction away from the receiver body.

16. The photointerrupter according to claim 15, characterized in that A first surface of the second sub-shell is provided with at least one first groove, at least one first opening is located at the bottom of at least one first groove, and a portion of at least one first opening has a shape complementary to the first protruding structure, and the first combining structure is located on the first surface and is a comb-tooth structure; as well as A second surface of the fourth sub-shell is provided with at least one second groove, at least one second opening is located at the bottom of at least one second groove, and a portion of at least one second opening has a morphology complementary to the second protruding structure, and the second combining structure is located on the second surface and is another comb tooth structure complementary to the comb tooth structure.

17. The photointerrupter according to claim 16, wherein: When the number of at least one first groove and at least one second groove is multiple, the bottoms of the multiple first grooves and the multiple second grooves are respectively separated from the first surface and the second surface by multiple first predetermined distances and multiple second predetermined distances, the sizes of the multiple first predetermined distances are the same or different from each other, the sizes of the multiple second predetermined distances are the same or different from each other, and the top area size of the multiple first openings corresponding to the multiple first grooves is proportional to the first predetermined distance, and the top area size of the multiple second openings corresponding to the multiple second grooves is proportional to the second predetermined distance.

18. The photointerrupter according to claim 16, wherein: When there are multiple at least one first groove and multiple at least one second groove, multiple first openings corresponding to multiple first grooves are arranged in parallel in a predetermined direction, and multiple second openings corresponding to multiple second grooves are also arranged in parallel in the predetermined direction.

19. The photointerrupter according to claim 16, wherein: The first protruding structure is a first column arranged along a first extension direction, located on a third surface of the first sub-shell, and the first extension direction is parallel or perpendicular to one edge of the third surface; as well as The second protruding structure is a second column arranged along a second extending direction, located on a fourth surface of the third sub-housing, and the second extending direction is parallel or perpendicular to one edge of the fourth surface.

20. The photointerrupter according to claim 19, wherein: The first surface corresponds to the third surface, and at least one of the first grooves is arranged along a third extension direction; and The second surface corresponds to the fourth surface, and at least one of the second grooves is arranged along a fourth extension direction; The third extension direction is perpendicular to the first extension direction, and the fourth extension direction is perpendicular to the second extension direction.

21. The photointerrupter according to claim 14, wherein: The first sub-housing and the third sub-housing allow the optical signal to pass through, and the second sub-housing and the fourth sub-housing do not allow the optical signal to pass through.

22. The photointerrupter according to claim 14, wherein: The thermal expansion coefficients of the first sub-shell and the second sub-shell are within a first predetermined range, and the thermal expansion coefficients of the third sub-shell and the fourth sub-shell are within a second predetermined range.

23. The photointerrupter according to claim 14, wherein: The second subshell and the fourth subshell include a polymer compound material doped with a dye, and the second subshell and the fourth subshell block the passage of the optical signal within a predetermined wavelength range.

24. The photointerrupter according to claim 13, wherein: The first pin portion includes a plurality of first pins, and the transmitter body includes at least one transmitter component electrically connected to the plurality of first pins; The second pin portion includes a plurality of second pins, and the receiver body includes at least one receiver component electrically connected to the plurality of second pins.

25. A method for manufacturing a photointerrupter, characterized in that: The manufacturing method of the photointerrupter comprises: A transmitter is provided, comprising a transmitter body and a first pin portion connected to each other, wherein the transmitter body is used to transmit an optical signal; and Forming a first shell to cover the transmitter body, wherein the first shell has a first combining structure and at least one first opening for the optical signal to pass through; and Providing a receiver, comprising a receiver body and a second pin portion connected to each other, wherein the receiver body is used to receive the optical signal; forming a second shell to cover the receiver body, wherein the second shell has a second coupling structure and at least one second opening for the optical signal to pass through; and The first combining structure and the second combining structure are assembled and connected to form a blocking groove between the transmitter body and the receiver body.

26. The method for manufacturing a photointerrupter according to claim 25, wherein: The first shell and the second shell are formed respectively by an encapsulation device, wherein the step of forming the first shell includes: forming a first sub-shell, covering the transmitter body and having a first protruding structure; and forming a second sub-shell covering the first sub-shell, wherein at least one of the first openings is disposed in the second sub-shell and corresponds to at least a portion of the first protruding structure; The step of forming the second shell includes: forming a third sub-shell, covering the receiver body and having a second protruding structure; and forming a fourth sub-shell covering the third sub-shell, wherein at least one second opening is disposed in the third sub-shell and corresponds to at least a portion of the second protruding structure; The first sub-shell and the second sub-shell have different optical properties, and the third sub-shell and the fourth sub-shell have different optical properties.

27. The method for manufacturing a photointerrupter according to claim 26, wherein: The cross-sectional area of ​​the first protruding structure gradually decreases along a direction away from the transmitter body, and the cross-sectional area of ​​the second protruding structure gradually decreases along a direction away from the receiver body.

28. The method for manufacturing a photointerrupter according to claim 27, wherein: A first surface of the second sub-shell is provided with at least one first groove, at least one first opening is located at the bottom of at least one first groove, and a portion of at least one first opening has a shape complementary to the first protruding structure, and the first combining structure is located on the first surface and is a comb-tooth structure; as well as A second surface of the fourth sub-shell is provided with at least one second groove, at least one second opening is located at the bottom of at least one second groove, and a portion of at least one second opening has a morphology complementary to the second protruding structure, and the second combining structure is located on the second surface and is another comb tooth structure complementary to the comb tooth structure.

29. The method for manufacturing a photointerrupter according to claim 28, wherein: When the number of at least one first groove and at least one second groove is multiple, the bottoms of the multiple first grooves and the multiple second grooves are respectively separated from the first surface and the second surface by multiple first predetermined distances and multiple second predetermined distances, the sizes of the multiple first predetermined distances are the same or different from each other, the sizes of the multiple second predetermined distances are the same or different from each other, and the top area size of the multiple first openings corresponding to the multiple first grooves is proportional to the first predetermined distance, and the top area size of the multiple second openings corresponding to the multiple second grooves is proportional to the second predetermined distance.

30. The method for manufacturing a photointerrupter according to claim 28, wherein: When there are multiple at least one first groove and multiple at least one second groove, multiple first openings corresponding to multiple first grooves are arranged in parallel in a predetermined direction, and multiple second openings corresponding to multiple second grooves are also arranged in parallel in the predetermined direction.

31. The method for manufacturing a photointerrupter according to claim 28, wherein: The first protruding structure is a first column arranged along a first extension direction, located on a third surface of the first sub-shell, and the first extension direction is parallel or perpendicular to one edge of the third surface; as well as The second protruding structure is a second column arranged along a second extending direction, located on a fourth surface of the third sub-housing, and the second extending direction is parallel or perpendicular to one edge of the fourth surface.

32. The method for manufacturing a photointerrupter according to claim 31, wherein: The first surface corresponds to the third surface, and at least one of the first grooves is arranged along a third extension direction; and The second surface corresponds to the fourth surface, and at least one of the second grooves is arranged along a fourth extension direction; The third extension direction is perpendicular to the first extension direction, and the fourth extension direction is perpendicular to the second extension direction.

33. The method for manufacturing a photointerrupter according to claim 26, wherein: The first sub-housing and the third sub-housing allow the optical signal to pass through, and the second sub-housing and the fourth sub-housing do not allow the optical signal to pass through.

34. The method for manufacturing a photointerrupter according to claim 26, wherein: The thermal expansion coefficients of the first sub-shell and the second sub-shell are within a first predetermined range, and the thermal expansion coefficients of the third sub-shell and the fourth sub-shell are within a second predetermined range.

35. The method for manufacturing a photointerrupter according to claim 26, wherein: The second subshell and the fourth subshell include a polymer compound material doped with a dye, and the second subshell and the fourth subshell block the passage of the optical signal within a predetermined wavelength range.

36. The method for manufacturing a photointerrupter according to claim 25, wherein: The first pin portion includes a plurality of first pins, and the transmitter body includes at least one transmitter component electrically connected to the plurality of first pins; The second pin portion includes a plurality of second pins, and the receiver body includes at least one receiver component electrically connected to the plurality of second pins.

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