Small-size packaged coherent communication optical module with EDFA (erbium-doped fiber amplifier) and fiber coiling method

Abstract

The invention relates to the technical field of optical communication, in particular to a small-size packaged coherent communication optical module with an EDFA (erbium-doped fiber amplifier) and a fiber coiling method, and the optical module comprises an upper cover plate, a circuit board, an optical port assembly and a lower cover plate, the optical module further comprises a front-side fiber bundling plate and a back-side fiber bundling plate, the front-side fiber bundling plate is fixedly arranged on the front side of the circuit board, and the back-side fiber bundling plate is fixedly arranged on the back side of the circuit board. The circuit board is provided with an EDFA module. By arranging the front fiber bundling plate and the back fiber bundling plate on the two sides of the circuit board, optical fibers on the front side and the back side of the circuit board can be coiled into the front fiber bundling plate and the back fiber bundling plate respectively, the length of the coiled optical fibers is increased, and long-distance communication of the optical module is achieved.

Description

Technical Field

[0001] The present invention relates to the field of optical communication technologies, and particularly to a small-size packaged coherent optical communication module with an EDFA and a fiber coiling method. Background Art

[0002] Coherent optical communication is an optical transmission system that uses local oscillator light for coherent detection. Due to its high receiving sensitivity, large communication capacity, long relay distance, etc., it is used in occasions such as long-distance transmission in backbone networks, interconnection of data centers, and metropolitan area networks. It can detect all information such as the amplitude (power), frequency, phase, and polarization state of optical signals. It has higher spectral efficiency and larger single-channel bandwidth. Currently, the packaging forms adopted by pluggable coherent optical communication modules are mainly the Quad Small Form Factor Pluggable-Double Density (abbreviated as QSFP-DD) and the Octal Small Form-factor Pluggable (abbreviated as OSFP) packaging forms. However, the optical modules in the above two packaging forms have a small volume, and the layout of optical devices inside the optical module is tight, and it is impossible to coil in more optical fibers. Therefore, they only support short-distance communication. In scenarios that require long-distance transmission, additional relay devices or amplifiers may be needed to compensate for the attenuation of optical signals.

[0003] In view of this, overcoming the defects of the existing technology is an urgent problem to be solved in this technical field. Summary of the Invention

[0004] The technical problem to be solved by the present invention is that the internal space of the existing optical modules adopting the QSFP-DD and OSFP packaging forms is narrow, it is impossible to coil in more optical fibers, and only short-distance communication is supported.

[0005] The present invention adopts the following technical solutions:

[0006] In a first aspect, the present invention provides a small-size packaged coherent optical communication module with an EDFA, including: an upper cover plate 1, a circuit board 2, an optical port assembly 4, a lower cover plate 5, a front fiber coiling plate 6, and a rear fiber coiling plate 7; the circuit board 2, the optical port assembly 4, the front fiber coiling plate 6, and the rear fiber coiling plate 7 are located in the space formed by the upper cover plate 1 and the lower cover plate 5;

[0007] The front fiber coiling plate 6 is fixedly arranged on the front of the circuit board 2, and the rear fiber coiling plate 7 is fixedly arranged on the rear of the circuit board 2; an EDFA module 20 is arranged on the circuit board 2, and the EDFA module 20 includes a plurality of optical devices, and the optical devices are arranged on the front or rear of the circuit board 2;

[0008] The fiber optic cables of the optical devices located on the front side of the circuit board 2 are wound within the front fiber bundling board 6, and the fiber optic cables of the optical devices located on the back side of the circuit board 2 are wound within the back fiber bundling board 7; a preset number of the fiber optic cables wound within the front fiber bundling board 6 are led out to be connected to the optical port assembly 4.

[0009] Preferably, first notches 210 are provided on both sides of the circuit board 2;

[0010] The first notches 210 are used for leading out the fiber optic cables to facilitate fusing the fiber optic cables on the front and back sides of the circuit board 2 together.

[0011] Preferably, fixing protrusions 60 are provided at the bottom of the front fiber bundling board 6, and the fixing protrusions 60 are fixedly connected to the circuit board 2 by one of gluing or welding;

[0012] Mounting feet 70 are provided at the four corners of the bottom of the back fiber bundling board 7, a first preset area 211 is provided on the circuit board 2, the first preset area 211 is provided at both ends of the first notch 210, and the mounting feet 70 are fixedly connected to the first preset area 211 by one of gluing or welding.

[0013] Preferably, a second notch 71 matching the first notch 210 is provided in the area of the back fiber bundling board 7 above the first notch 210, and the second notch 71 is used for fusing the fiber optic cables on the front and back sides of the circuit board 2.

[0014] Preferably, the EDFA module 20 includes a wavelength division multiplexer 200, a pump light source 201, a tunable filter 202, and a variable optical attenuator 203 provided on the back side of the circuit board 2, and a splitting photodetector 204 provided on the front side of the circuit board 2; a digital processor 22, a coherent silicon optical device 23, and a tunable laser 24 are further provided on the front side of the circuit board 2; the fiber optic cables of the wavelength division multiplexer 200, the pump light source 201, the tunable filter 202, and the variable optical attenuator 203 are wound within the back fiber bundling board 7, and the fiber optic cables of the coherent silicon optical device 23, the splitting photodetector 204, and the tunable laser 24 are wound within the front fiber bundling board 6;

[0015] The front fiber bundling board 6 is arranged around the digital processor 22, and the tunable laser 24 is electrically connected to a second preset area 212 on the back side of the circuit board 2 through a flexible circuit board 240.

[0016] Preferably, the EDFA module 20 further includes a device mounting block 25, which is fixedly connected to the circuit board 2 by one of gluing or welding; the device mounting block 25 is provided with a first mounting position 250, a second mounting position 251, a third mounting position 252 and a fourth mounting position 253. The wavelength division multiplexer 200 is installed in the first mounting position 250, the pump light source 201 is installed in the second mounting position 251, the tunable filter 202 is installed in the third mounting position 252, and the variable optical attenuator 203 is installed in the fourth mounting position 253.

[0017] Preferably, the front end of the second mounting position 251 is in a hollowed-out shape for realizing the electrical connection between the pump light source 201 and the circuit board 2; the bottom of the third mounting position 252 is integrally in a hollowed-out shape to enable the tunable filter 202 to abut against the circuit board 2, so as to reduce the mounting height of the tunable filter 202.

[0018] Preferably, the optical module further includes a pull ring assembly 3. The pull ring assembly 3 includes a pull ring unit 30. The pull ring unit 30 includes two fixed arms 300 and a connecting handle 301. The two fixed arms 300 are respectively fixedly connected to the connecting handle 301. The two fixed arms 300 are respectively arranged on the sides of the upper cover plate 1 and the lower cover plate 5. The pull ring unit 30 is slidably connected to the lower cover plate 5.

[0019] Preferably, the pull ring assembly 3 further includes a spring 31 and a fixing pin 32. One end of the lower cover plate 5 close to the fixed arm 300 is provided with a receiving step 50. The fixing pin 32 is fixedly arranged on the receiving step 50. One end of the fixed arm 300 is processed with a spring hook 3000. One end of the spring 31 is fixedly sleeved with the fixing pin 32, and the other end is fixedly sleeved with the spring hook 3000; the spring 31, the fixing pin 32, the receiving step 50 and the spring hook 3000 are all symmetrically arranged.

[0020] Preferably, corresponding to the position of the spring hook 3000, the lower cover plate 5 is provided with an avoidance step 51, and the avoidance step 51 is used to prevent the spring hook 3000 from being blocked during the movement.

[0021] Preferably, the two fixing arms 300 tend to clamp inwardly near the ends. The fixing arm 300 includes a first horizontal plane 3001, a second horizontal plane 3002, and a transition inclined plane 3003. The two ends of the transition inclined plane 3003 are respectively fixedly connected to the first horizontal plane 3001 and the second horizontal plane 3002. The distance between the second horizontal planes 3002 of the two fixing arms 300 is less than the distance between the first horizontal planes 3001. First receiving grooves 10 are provided on both sides of the upper cover plate 1, and second receiving grooves 52 are provided on both sides of the lower cover plate 5. The bottoms of the first receiving grooves 10 and the second receiving grooves 52 match the shape of the fixing arm 300.

[0022] A coupling protrusion 3004 is provided at the end of the second horizontal plane 3002. A coupling groove 53 is provided on the side wall of the lower cover plate 5. The coupling groove 53 communicates with the second receiving groove 52. The coupling groove 53 is used to receive the coupling protrusion 3004.

[0023] Preferably, a limiting protrusion 3005 is provided at the top of the end of the second horizontal plane 3002, and a limiting groove 100 is provided at the top of the first receiving groove 10. The limiting protrusion 3005 is slidably connected to the limiting groove 100.

[0024] Preferably, a receiving position 54 is provided at one end of the lower cover plate 5 close to the connection handle 301. The receiving position 54 is used to install the optical port assembly 4. The optical port assembly 4 includes an optical port adapter 40 and a connector base 41. The optical port adapter 40 and the connector base 41 are relatively fixedly arranged. The connector base 41 is arranged in the receiving position 54. The connector base 41 is fixedly connected to the lower cover plate 5.

[0025] A positioning protrusion 540 is fixedly provided at the bottom of the receiving position 54. A positioning through hole 410 is provided at the bottom of the connector base 41. The positioning protrusion 540 is located in the positioning through hole 410.

[0026] Preferably, the optical port assembly 4 further includes an optical port pressing plate 42. The optical port pressing plate 42 covers the upper part of the tail of the optical port adapter 40 and cooperates with the connector base 41 to fix the optical port adapter 40. The optical port pressing plate 42 is fixedly connected to the connector base 41 and the lower cover plate 5 by bolts.

[0027] Preferably, mounting wing plates 411 are provided on both sides of the connector seat 41, and a travel limit plate 412 is provided at the front end of the connector seat 41. The mounting wing plates 411 and the travel limit plate 412 are integrally formed, and a through hole 4110 is provided on the mounting wing plates 411 for accommodating the fixing pin 32 of the pull ring assembly 3, and the travel limit plate 412 is used to limit the moving distance of the pull ring unit 30.

[0028] Preferably, the tail of the connector seat 41 is provided with two first semi-annular grooves 413, the lower surface of the optical port pressure plate 42 is provided with two second semi-annular grooves 420, and the optical port adapter 40 is provided with an annular mounting plate 400, and the first semi-annular groove 413 and the second semi-annular groove 420 are used to install the annular mounting plate 400, so as to fix the optical port adapter 40 between the optical port pressure plate 42 and the connector seat 41.

[0029] Preferably, a first fiber stopper 61 is further provided on the upper surface of the front fiber bundle plate 6, and the first fiber stopper 61 is used to stop the optical fiber wound in the front fiber bundle plate 6. A fiber stopper protrusion 62 is provided on the first fiber stopper 61, and the fiber stopper protrusion 62 is used to further prevent the optical fiber from popping out.

[0030] Preferably, a closed enclosure 11 and two bosses 12 are provided at the rear of the lower surface of the upper cover plate 1 , and the bosses 12 are provided on both sides of the interior of the closed enclosure 11 .

[0031] Preferably, a label slot 55 is provided on the bottom surface of the lower cover plate 5 , and the label slot 55 and the reverse fiber bundle plate 7 are staggered to avoid regional spatial overlap and interference between the two.

[0032] In a second aspect, the present invention provides a fiber coiling method for a small-size packaged coherent communication optical module with EDFA, which is applicable to the small-size packaged coherent communication optical module with EDFA described in the first aspect, comprising:

[0033] Winding the optical fiber of the optical device located on the reverse side of the circuit board 2 in the reverse side fiber bundle plate 7;

[0034] Winding the optical fiber of the optical device located on the front side of the circuit board 2 in the front fiber bundle plate 6;

[0035] Pull out the optical fiber to be fused from the back fiber bundle plate 7, guide the optical fiber to be fused from the side of the circuit board 2 to the front of the circuit board 2, and fuse the optical fiber to be fused with the optical fiber to be fused on the front of the circuit board 2;

[0036] A preset number of optical fibers wound on the front fiber bundle plate 6 are led out to be connected to the optical port assembly 4 .

[0037] By arranging a front fiber bundling board 6 and a back fiber bundling board 7 on the circuit board 2, the optical fibers on the front and back of the circuit board 2 can be coiled into the front fiber bundling board 6 and the back fiber bundling board 7. During the fiber coiling process, the number of turns of the optical fiber coils wound in the front fiber bundling board 6 and the back fiber bundling board 7 can be arranged, so as to store, organize and protect the optical fibers, thereby accommodating more optical fibers and realizing long-distance communication inside the optical module. Brief Description of the Drawings

[0038] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the embodiments of the present invention will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0039] Figure 1 Schematic diagram of the structure of an optical communication system provided by an embodiment of the present invention;

[0040] Figure 2 Schematic diagram of the overall structure of a small-size packaged coherent optical communication module with an EDFA provided by an embodiment of the present invention;

[0041] Figure 3 Schematic diagram of a pull ring unit of a small-size packaged coherent optical communication module with an EDFA provided by an embodiment of the present invention;

[0042] Figure 4a Schematic diagram of an EDFA of a small-size packaged coherent optical communication module with an EDFA provided by an embodiment of the present invention;

[0043] Figure 4b Schematic diagram of a spectral splitting detector of an EDFA of a small-size packaged coherent optical communication module with an EDFA provided by an embodiment of the present invention;

[0044] Figure 5 Schematic diagram of a spring of a small-size packaged coherent optical communication module with an EDFA provided by an embodiment of the present invention;

[0045] Figure 6 Schematic diagram of a first accommodation groove and a second accommodation groove of a small-size packaged coherent optical communication module with an EDFA provided by an embodiment of the present invention;

[0046] Figure 7 Schematic diagram of a limiting groove of a small-size packaged coherent optical communication module with an EDFA provided by an embodiment of the present invention;

[0047] Figure 8It is a schematic diagram of the accommodation position of a small-size packaged coherent optical communication module with an EDFA provided by an embodiment of the present invention;

[0048] Figure 9 It is a schematic diagram of the optical port adapter of a small-size packaged coherent optical communication module with an EDFA provided by an embodiment of the present invention;

[0049] Figure 10 It is a schematic diagram of the positioning through holes of a small-size packaged coherent optical communication module with an EDFA provided by an embodiment of the present invention;

[0050] Figure 11 It is a schematic diagram of the first semi-circular groove of a small-size packaged coherent optical communication module with an EDFA provided by an embodiment of the present invention;

[0051] Figure 12 It is a schematic diagram of the second semi-circular groove of a small-size packaged coherent optical communication module with an EDFA provided by an embodiment of the present invention;

[0052] Figure 13 It is a schematic diagram of the avoidance inclined plane of a small-size packaged coherent optical communication module with an EDFA provided by an embodiment of the present invention;

[0053] Figure 14 It is a schematic diagram of the first notch of a small-size packaged coherent optical communication module with an EDFA provided by an embodiment of the present invention;

[0054] Figure 15 It is a schematic diagram of the front fiber bundling board of a small-size packaged coherent optical communication module with an EDFA provided by an embodiment of the present invention;

[0055] Figure 16 It is a schematic diagram of the boss of a small-size packaged coherent optical communication module with an EDFA provided by an embodiment of the present invention;

[0056] Figure 17 It is a schematic diagram of the reverse fiber bundling board of a small-size packaged coherent optical communication module with an EDFA provided by an embodiment of the present invention;

[0057] Figure 18 It is a schematic diagram of the first preset area of a small-size packaged coherent optical communication module with an EDFA provided by an embodiment of the present invention;

[0058] Figure 19 It is a schematic diagram of the label slot of a small-size packaged coherent optical communication module with an EDFA provided by an embodiment of the present invention;

[0059] Figure 20 It is a schematic diagram of the EDFA on the PCB of a small-size packaged coherent optical communication module with an EDFA provided by an embodiment of the present invention;

[0060] Figure 21 It is a schematic diagram of the optical devices on the front side of the circuit board of a small-size packaged coherent communication optical module with an EDFA provided by an embodiment of the present invention;

[0061] Figure 22 It is a schematic diagram of the second preset area of a small-size packaged coherent communication optical module with an EDFA provided by an embodiment of the present invention;

[0062] Figure 23 It is a schematic diagram of the device mounting block of a small-size packaged coherent communication optical module with an EDFA provided by an embodiment of the present invention;

[0063] Figure 24 It is a schematic diagram of the avoidance recess of a small-size packaged coherent communication optical module with an EDFA provided by an embodiment of the present invention;

[0064] Figure 25 It is a schematic diagram of the reverse fiber coiling of a small-size packaged coherent communication optical module with an EDFA provided by an embodiment of the present invention;

[0065] Figure 26 It is a schematic diagram of the front fiber coiling of a small-size packaged coherent communication optical module with an EDFA provided by an embodiment of the present invention;

[0066] Figure 27 It is a schematic diagram of the partition of a small-size packaged coherent communication optical module with an EDFA provided by an embodiment of the present invention;

[0067] Figure 28 It is a schematic flow diagram of the fiber coiling method of a small-size packaged coherent communication optical module with an EDFA provided by an embodiment of the present invention.

[0068] Among them, the reference numerals are:

[0069] 1 - Upper cover plate, 10 - First receiving groove, 100 - Limiting groove, 11 - Enclosing fence, 12 - Boss, 13 - Heat dissipation grid, 2 - Circuit board, 20 - EDFA module, 200 - Wavelength division multiplexer, 201 - Pump light source, 202 - Tunable filter, 203 - Variable optical attenuator, 204 - Spectral splitting detector, 210 - First notch, 211 - First preset area, 212 - Second preset area, 22 - Digital processor, 23 - Coherent silicon optical device, 24 - Tunable laser, 25 - Device mounting block, 250 - First mounting position, 251 - Second mounting position, 252 - Third mounting position, 253 - Fourth mounting position, 254 - Avoidance groove, 3 - Pull ring assembly, 30 - Pull ring unit, 300 - Fixed arm, 3000 - Spring hook, 3001 - First horizontal plane, 3002 - Second horizontal plane, 3003 - Transition inclined plane, 3004 - Coupling protrusion, 3005 - Limiting protrusion, 301 - Connecting handle, 31 - Spring, 32 - Fixed pin, 4 - Optical port assembly, 40 - Optical port adapter, 400 - Ring-shaped mounting plate, 41 - Connector seat, 410 - Positioning through hole, 411 - Mounting wing plate, 412 - Stroke limiting plate, 413 - First semi-circular groove, 42 - Optical port pressing plate, 420 - Second semi-circular groove, 5 - Lower cover plate, 50 - Receiving step, 51 - Avoidance step, 52 - Second receiving groove, 53 - Coupling groove, 54 - Receiving position, 540 - Positioning protrusion, 55 - Label slot, 6 - Front fiber bundling plate, 60 - Fixed protrusion, 61 - First fiber blocking plate, 62 - Fiber blocking protrusion, 7 - Rear fiber bundling plate, 70 - Mounting foot, 71 - Second notch. Detailed implementation manners

[0070] In order to make the objectives, technical solutions and advantages of the present invention clearer and more understandable, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0071] Unless otherwise required by the context, throughout the specification and claims, the term "comprising" is interpreted in an open, inclusive sense, i.e., "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "examples", "specific examples", or "some examples", etc., are intended to indicate that specific features, structures, materials, or characteristics related to the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representations of the above terms are not necessarily referring to the same embodiment or example. In addition, the specific features, structures, materials, or characteristics may be included in any one or more embodiments or examples in any appropriate manner, that is, although they may be carried in the above-mentioned embodiments or examples due to reasons such as the order of appearance and position, etc., but it does not limit that they can be carried by one embodiment or example in a combined manner.

[0072] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. These terms are only used for the convenience of describing the present disclosure and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present disclosure.

[0073] In the description of the present invention, the terms "first" and "second" are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the embodiments of the present disclosure, unless otherwise specified, the meaning of "a plurality" is two or more. In addition, for example, for the same type of nouns in the description, the method of adding "A" and "B" at the end is used to describe them as two independent individuals. In this case, the features defined with "A" and "B" are only used for the purpose of distinguishing similar individuals and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features.

[0074] In the description of some embodiments, the expressions "coupled", "coupled to" and "connected" and their derivatives may be used. For example, in the description of some embodiments, the term "connected" may be used to indicate that two or more components have direct physical contact or electrical contact with each other. Another example is that in the description of some embodiments, the term "coupled to" may be used to indicate that two or more components have direct physical contact or electrical contact. However, the term "connected" or "coupled" may also mean that two or more components do not have direct contact with each other, but still cooperate or interact with each other, such as "optical path coupling", "wireless connection", etc. The embodiments disclosed herein are not necessarily limited to the content of the present invention.

[0075] In the description of the present invention, the expression "A and / or B" (where A and B are used to formally represent specific feature contents) includes the following three combinations: only A, only B, and the combination of A and B.

[0076] As used in the present invention, "about", "substantially" or "approximately" includes the stated value and the average value within an acceptable deviation range of the specific value, where the acceptable deviation range is determined by those of ordinary skill in the art considering the measurement being discussed and the errors associated with the measurement of the specific quantity (i.e., the limitations of the measurement system).

[0077] In addition, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0078] Before introducing the specific solutions of the present invention, one of the scenarios applicable to the optical module provided by the embodiments of the present invention will be introduced first.

[0079] Figure 1 It is a connection relationship diagram of an optical communication system. As Figure 1 shown, the optical communication system mainly includes a remote server 1000, a local information processing device 2000, an optical network terminal 3000, an optical module 4000, an optical fiber 1001, and a network cable 1002.

[0080] One end of the optical fiber 1001 is connected to the remote server 1000, and the other end is connected to the optical network terminal 3000 through the optical module 4000. The optical fiber 1001 itself can support long-distance signal transmission. For example, the optical fiber 1001 can support signal transmission of (6 kilometers to 8 kilometers). On this basis, if a repeater is used, theoretically ultra-long-distance transmission can be achieved. Therefore, in a general optical communication system, the distance between the remote server 1000 and the optical network terminal 3000 can usually reach several kilometers, dozens of kilometers, or hundreds of kilometers.

[0081] One end of the network cable 1002 is connected to the local information processing device 2000, and the other end is connected to the optical network terminal 3000. The local information processing device 2000 can be any one or several of the following devices: router, switch, computer, mobile phone, tablet computer, television, etc.

[0082] The physical distance between the remote server 1000 and the optical network terminal 3000 is greater than the physical distance between the local information processing device 2000 and the optical network terminal 3000. The connection between the local information processing device 2000 and the remote server 1000 is completed by the optical fiber 1001 and the network cable 1002; while the connection between the optical fiber 1001 and the network cable 1002 is completed by the optical module 4000 and the optical network terminal 3000.

[0083] The optical module 4000 includes an optical port and an electrical port. The optical port is configured to be connected to the optical fiber 1001, so that the optical module 4000 establishes a bidirectional optical signal connection with the optical fiber 1001; the electrical port is configured to be connected to the optical network terminal 3000, so that the optical module 4000 establishes a bidirectional electrical signal connection with the optical network terminal 3000. The optical module 4000 can realize the mutual conversion between optical signals and electrical signals, so that a connection is established between the optical fiber 1001 and the optical network terminal 3000. For example, the optical signal from the optical fiber 1001 is converted into an electrical signal by the optical module 4000 and then input into the optical network terminal 3000, and the electrical signal from the optical network terminal 3000 is converted into an optical signal by the optical module 4000 and input into the optical fiber 1001.

[0084] The optical network terminal 3000 includes a housing that is roughly rectangular, and an optical module interface 3001 and a network cable interface 3002 arranged on the housing. The optical module interface 3001 is configured to access the optical module 4000, so that the optical network terminal 3000 establishes a bidirectional electrical signal connection with the optical module 4000. The network cable interface 3002 is configured to access the network cable 1002, so that the optical network terminal 3000 establishes a bidirectional electrical signal connection with the network cable 1002. The optical module 4000 and the network cable 1002 are connected through the optical network terminal 3000. For example, the optical network terminal 3000 transmits the electrical signal from the optical module 4000 to the network cable 1002, and transmits the signal from the network cable 1002 to the optical module 4000, and the optical network terminal 3000 can monitor the operation of the optical module 4000. The optical network terminal 3000 can be an optical line terminal (Optical Line Terminal, abbreviated as: OLT) and the like.

[0085] The remote server 1000 establishes a bidirectional signal transmission channel with the local information processing device 2000 through the optical fiber 1001, the optical module 4000, the optical network terminal 3000 and the network cable 1002.

[0086] The existing optical module 4000 mainly adopts QSFP-DD and OSFP packaging forms. The optical modules of the above two packaging forms are small in size, and the layout of optical devices inside the optical module is tight, and it is impossible to wind in more optical fibers. Therefore, it only supports short-distance communication. In scenarios where long-distance transmission is required, additional relay equipment or amplifiers may be required to compensate for the attenuation of optical signals.

[0087] In order to solve this problem, the embodiment of the present invention improves the structure of the optical module so that the optical module can be wound with more optical fibers to increase the communication distance. The specific structure of the optical module is shown in the following embodiment.

[0088] Embodiment 1:

[0089] Embodiment 1 of the present invention provides a small-sized packaged coherent optical communication module with an EDFA, as follows Figure 2 , Figure 3 and Figure 4a shown, including: an upper cover plate 1, a circuit board 2, an optical port assembly 4, a lower cover plate 5, a front fiber bundling board 6 and a back fiber bundling board 7; the circuit board 2, the optical port assembly 4, the front fiber bundling board 6 and the back fiber bundling board 7 are located in the space formed by the upper cover plate 1 and the lower cover plate 5.

[0090] The front fiber bundling board 6 is fixedly arranged on the front side of the circuit board 2, and the back fiber bundling board 7 is fixedly arranged on the back side of the circuit board 2; an erbium-doped fiber amplifier (EDFA) module 20 is arranged on the circuit board 2, and the EDFA module 20 includes a plurality of optical devices, and the optical devices are arranged on the front side or the back side of the circuit board 2.

[0091] The optical fibers of the optical devices located on the front side of the circuit board 2 are coiled in the front fiber bundling board 6, and the optical fibers of the optical devices located on the back side of the circuit board 2 are coiled in the back fiber bundling board 7; a preset number of the coiled fibers in the front fiber bundling board 6 are led out to be connected to the optical port assembly 4. Among them, the preset number is determined according to the actual situation, and the preset number can be 2 or other data, and specifically can be determined according to the number of ports of the optical port assembly.

[0092] In one embodiment, the circuit board 2 includes circuit traces, electronic components and chips, and the electronic components and chips are connected together according to the circuit design through the circuit traces to achieve functions such as power supply, electrical signal transmission and grounding. The electronic components can include, for example, capacitors, resistors, triodes, metal-oxide-semiconductor field-effect transistors (MOSFETs for short). The chips can include, for example, a microcontroller unit (MCU for short), a limiting amplifier, a clock and data recovery chip (CDR for short), a power management chip, a digital signal processing (DSP for short) chip, etc.

[0093] The circuit board 2 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also play a bearing role, such as the rigid circuit board can stably carry the chips; the rigid circuit board can also be inserted into the electrical connectors in the optical network terminal.

[0094] The circuit board 2 further includes a gold finger formed on its end surface, and the gold finger is composed of a plurality of independent pins. The circuit board 2 is inserted into the cage of the optical network terminal, and is conductively connected to the electrical connector in the cage through the gold finger. The gold finger can be provided only on one side surface of the circuit board 2, or can be provided on the upper and lower side surfaces of the circuit board 2 to adapt to the occasion with a large demand for the number of pins. The gold finger is configured to establish an electrical connection with the optical network terminal to achieve power supply, grounding, I2C signal transmission, data signal transmission, etc. Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in cooperation with rigid circuit boards as a supplement to the rigid circuit boards.

[0095] In one embodiment, as Figure 4a and Figure 4b shown, the EDFA module 20 includes a wavelength division multiplexer 200, a pump light source 201, a tunable filter 202, and a variable optical attenuator 203 provided on the reverse side of the circuit board 2, and a splitting photodetector 204 provided on the front side of the circuit board 2; a digital processor 22, a coherent silicon optical device 23, and a tunable laser 24 are also provided on the front side of the circuit board 2; the optical fibers of the wavelength division multiplexer 200, the pump light source 201, the tunable filter 202, and the variable optical attenuator 203 are wound in the reverse side fiber bundling board 7, and the optical fibers of the coherent silicon optical device 23, the splitting photodetector 204, and the tunable laser 24 are wound in the front side fiber bundling board 6; finally, two optical fibers wound in the front side fiber bundling board 6 are collectively led out to be connected to the optical port assembly 4. The front side fiber bundling board 6 is arranged around the digital processor 22. As Figure 21 and Figure 22 shown, the tunable laser 24 is electrically connected to a second preset area 212 on the reverse side of the circuit board 2 through a flexible circuit board 240.

[0096] In this embodiment, by providing the front side fiber bundling board 6 and the reverse side fiber bundling board 7 on the circuit board 2, the optical fibers on the front side and the reverse side of the circuit board 2 can be wound into the front side fiber bundling board 6 and the reverse side fiber bundling board 7. During the fiber winding process, the number of turns of the optical fibers wound in the front side fiber bundling board 6 and the reverse side fiber bundling board 7 can be arranged to collect, organize, and protect the optical fibers, thereby accommodating more optical fibers and realizing long-distance communication inside the optical module.

[0097] In one embodiment, continue to refer to Figure 2 and Figure 3 , the optical module further includes a pull ring assembly 3, and the circuit board 2 and the optical port assembly 4 are arranged between the upper cover plate 1 and the lower cover plate 5; wherein, a heat dissipation grid 13 is provided on the upper surface of the upper cover plate 1 for dissipating heat from the optical module; as Figure 3 and Figure 4aAs shown, the pull-ring assembly 3 includes a pull-ring unit 30. The pull-ring unit 30 includes two fixed arms 300 and a connecting handle 301. The two fixed arms 300 are respectively fixedly connected to the connecting handle 301. The two fixed arms 300 are respectively arranged on the sides of the upper cover plate 1 and the lower cover plate 5. The pull-ring unit 30 is slidably connected to the lower cover plate 5. The pull-ring assembly 3 is mainly used to release the locking relationship between the optical module and Figure 1 the optical network terminal 3000 in

[0098] In the existing pull-ring assemblies of optical modules, most of them adopt the spring-back structure of a compression spring to install and remove the optical module. When removing the optical module from the optical network terminal, the connecting handle of the pull-ring assembly is pulled to remove the optical module from the optical network terminal.

[0099] As Figure 5 shown, the pull-ring assembly 3 further includes a spring 31 and a fixed pin 32. One end of the lower cover plate 5 close to the fixed arm 300 is provided with a receiving step 50. The fixed pin 32 is fixedly arranged on the receiving step 50. One end of the fixed arm 300 is processed with a spring hook 3000. One end of the spring 31 is fixedly sleeved with the fixed pin 32, and the other end is fixedly sleeved with the spring hook 3000. The spring 31, the fixed pin 32, the receiving step 50, and the spring hook 3000 are all symmetrically arranged.

[0100] In one embodiment, a circular groove can be provided on the receiving step 50, and the fixed pin 32 is fixed in the circular groove. When the connecting handle 301 is pulled, the spring hook 3000 will also move accordingly. Therefore, in order to prevent the spring hook 3000 from being blocked during the movement, a relief step 51 is provided on the lower cover plate 5 corresponding to the position of the spring hook 3000. The relief step 51 is used to prevent the spring hook 3000 from being blocked during the movement. Among them, the relief step 51 is arranged close to the connecting handle 301, and the height of the relief step 51 is lower than that of the receiving step 50.

[0101] When installing the pull-ring unit 30 on the upper cover plate 1 and the lower cover plate 5, the two fixed arms 300 need to be in close contact with the sides of the upper cover plate 1 and the lower cover plate 5. Based on this, as Figure 6As shown, the two fixed arms 300 tend to clamp inward near the ends. The fixed arm 300 includes a first horizontal plane 3001, a second horizontal plane 3002, and a transition inclined plane 3003. The two ends of the transition inclined plane 3003 are fixedly connected to the first horizontal plane 3001 and the second horizontal plane 3002 respectively. The distance between the second horizontal planes 3002 of the two fixed arms 300 is less than the distance between the first horizontal planes 3001. On both sides of the upper cover plate 1, there are first receiving grooves 10, and on both sides of the lower cover plate 5, there are second receiving grooves 52. The bottoms of the first receiving grooves 10 and the second receiving grooves 52 match the shape of the fixed arms 300. At the same time, in order to further limit the two fixed arms 300 and prevent the fixed arms 300 from disengaging from the first receiving groove 10 and the second receiving groove 52 due to vibration in the environment or when pulling the pull ring unit 30, a coupling protrusion 3004 is provided at the end of the second horizontal plane 3002, and a coupling groove 53 is provided on the side wall of the lower cover plate 5. The coupling groove 53 communicates with the second receiving groove 52, and the coupling groove 53 is used to accommodate the coupling protrusion 3004.

[0102] To limit the moving stroke distance of the pull ring unit 30 and prevent the spring 31 from being overstretched and damaged, as Figure 6 and Figure 7 shown, a limiting protrusion 3005 is provided at the top of the end of the second horizontal plane 3002, and a limiting groove 100 is provided at the top of the first receiving groove 10. The limiting protrusion 3005 is slidably connected to the limiting groove 100.

[0103] When the optical module is in a static placement state, the springs 31 on both sides of the module are in a stretched state. At this time, the stretching amount of the spring 31 is small. Its main purpose is to make the fixed arm 300 closely abut against the side walls of the first receiving groove 10 and the second receiving groove 52 through the pulling force of the spring 31. When the optical module is pulled out from the optical network terminal, the connection handle 301 is pulled. Through the action of the pull spring hook 3000 and the fixed pin 32 fixed on the lower cover plate 5, the stretching degree of the spring 31 increases to a stroke that meets the unlocking requirement (this stroke is about 2.0 mm in both QSFP-DD or OSFP packaged modules), and the optical module is pulled out from the optical network terminal. After the optical module is pulled out, the stretching amount of the spring 31 will return to the above-mentioned static placement state, that is, the fixed arm 300 closely abuts against the side walls of the first receiving groove 10 and the second receiving groove 52.

[0104] In the foregoing solution, it is mentioned that the optical port assembly 4 is disposed between the upper cover plate 1 and the lower cover plate 5, specifically including, as Figure 8 、 Figure 9 and Figure 10As shown, one end of the lower cover plate 5 close to the connection handle 301 is provided with a receiving position 54 for installing the optical port assembly 4. The optical port assembly 4 includes an optical port adapter 40 and a connector base 41. The optical port adapter 40 is fixedly arranged opposite to the connector base 41. The connector base 41 is arranged in the receiving position 54 and is fixedly connected to the lower cover plate 5. Moreover, a positioning protrusion 540 is fixedly arranged at the bottom of the receiving position 54, and a positioning through hole 410 is arranged at the bottom of the connector base 41, and the positioning protrusion 540 is located in the positioning through hole 410. Among them, the number of the optical port adapters 40 is two, one is a transmitting port and the other is a receiving port.

[0105] To prevent the optical port assembly 4 from coming out and to facilitate the maintenance and installation of the optical port assembly 4, as Figure 8 and Figure 9 shown, the optical port assembly 4 further includes an optical port pressing plate 42. The optical port pressing plate 42 covers above the tail of the optical port adapter 40 and cooperates with the connector base 41 to fix the optical port adapter 40. The optical port pressing plate 42 is fixedly connected to the connector base 41 and the lower cover plate 5 by bolts. In one embodiment, as Figure 9 、 Figure 11 and Figure 12 shown, two first semi-circular grooves 413 are arranged at the tail of the connector base 41, two second semi-circular grooves 420 are arranged on the lower surface of the optical port pressing plate 42, and an annular mounting plate 400 is arranged on the optical port adapter 40. The first semi-circular grooves 413 and the second semi-circular grooves 420 are used to install the annular mounting plate 400 to fix the optical port adapter 40 between the optical port pressing plate 42 and the connector base 41.

[0106] Compared with the stroke limiting method in the foregoing solution, in which a limiting protrusion 3005 is arranged at the top of the end of the second horizontal plane 3002 of the fixed arm 300 and a limiting groove 100 is arranged at the top of the first receiving groove 10, and the limiting protrusion 3005 is slidably connected with the limiting groove 100, the embodiment of the present invention further provides another stroke limiting method for the pull ring unit 30, as Figure 12As shown in the figure, mounting wing plates 411 are provided on both sides of the connector base 41, and a travel limit plate 412 is provided at the front end of the connector base 41. The mounting wing plates 411 and the travel limit plate 412 are integrally formed. Through holes 4110 are provided on the mounting wing plates 411, and the through holes 4110 are used to accommodate the fixing pins 32 of the pull ring assembly 3. The travel limit plate 412 is used to limit the moving distance of the pull ring unit 30. Among them, the fixing pins 32 pass through the through holes 4110 and are fixed on the fixing step 50. When the spring hook 3000 moves to the travel limit plate 412, the travel limit plate 412 restricts the spring hook 3000 from continuing to move, thereby restricting the moving distance of the pull ring unit 30. In addition to the above structure, as Figure 13 shown, avoiding inclined surfaces 4120 are provided on both sides of the front end of the connector base 41, and the avoiding inclined surfaces 4120 are matched with the connecting inclined surfaces 3010 at the connection between the fixing arm 300 and the connecting handle 301.

[0107] The above mainly introduces the structure of the pull ring assembly 3 of the optical module. The following specifically introduces the structure related to fiber coiling.

[0108] When performing the operation of coiling the optical fiber on the optical device on the circuit board 2, the optical fiber of the optical device on the reverse side of the circuit board 2 needs to be led out for fusion splicing with the optical device on the front side. Therefore, in order to facilitate the fusion splicing operation of the optical fiber, as Figure 14 shown, first notches 210 are provided on both sides of the circuit board 2; the first notches 210 are used for leading out the optical fiber, so as to facilitate the fusion splicing of the optical fibers located on the front and back sides of the circuit board 2. For the front fiber coiling board 6, as Figure 15 shown, the front fiber coiling board 6 is in a C shape, and a fixing protrusion 60 is provided at the bottom of the front fiber coiling board 6. The fixing protrusion 60 is fixedly connected to the circuit board 2 by one of gluing or welding; specifically, a first fiber stopping board 61 is further provided on the upper surface of the front fiber coiling board 6. The first fiber stopping board 61 is used to stop the optical fiber wound inside the front fiber coiling board 6, and a fiber stopping protrusion 62 is provided on the first fiber stopping board 61. The fiber stopping protrusion 62 is used to further prevent the optical fiber from popping out; among them, the thickness of the front fiber coiling board 6 is not greater than 0.3 mm, and the processing methods include but are not limited to bending, flexible natural bending, cutting or forming by die processing, etc. Among them, as Figure 16 shown, a closed enclosure 11 and two bosses 12 are provided at the tail of the lower surface of the upper cover plate 1. The bosses 12 are arranged on both sides inside the closed enclosure 11. The front fiber coiling board 6 is limited between the two bosses 12. When the upper cover plate 1 and the lower cover plate 5 are assembled, buckled and bolted, the side wall of the front fiber coiling board 6 can ensure that the bolt will not touch the optical fiber, thereby avoiding damaging or breaking the optical fiber.

[0109] For the reverse fiber coiling board 7, asFigure 17 and Figure 18 As shown, mounting feet 70 are provided at the four corners of the bottom of the reverse fiber bundle board 7, and a first preset area 211 is provided on the circuit board 2. The first preset area 211 is provided at both ends of the first notch 210, and the mounting feet 70 are fixedly connected to the first preset area 211 by gluing or welding. The size of the first preset area 211 may be 3mm×1mm. Specifically, in one embodiment, the reverse fiber bundle board 7 is C-shaped, and a second notch 71 matching the first notch 210 is provided on the reverse fiber bundle board 7, and the second notch 71 is used to fuse the optical fibers on the front and back sides of the circuit board 2. In addition, as Figure 19 As shown, a label slot 55 is disposed on the bottom surface of the lower cover plate 5 , and the label slot 55 is staggered with the position of the reverse fiber bundle plate 7 to avoid regional spatial overlap and interference between the two. Figure 19 FIG. 1 is a schematic diagram showing the projection of the reverse fiber bundle plate 7 on the lower cover plate 5 .

[0110] like Figure 20 and Figure 21 As shown, the EDFA module 20 includes a wavelength division multiplexer 200, a pump light source 201, a tunable filter 202, a variable optical attenuator 203 and a spectroscopic detector 204. The front of the circuit board 2 is provided with a digital processor 22, a coherent silicon optical device 23, an adjustable laser 24 and the spectroscopic detector 204; the digital processor 22 is electrically connected to the circuit board 2, and the front fiber bundle board 6 is arranged around the digital processor 22, as shown in FIG. Figure 22As shown, the tunable laser 24 is fixedly connected to the upper cover plate 1, and the tunable laser 24 is electrically connected to the second preset area 212 on the reverse side of the circuit board 2 through a flexible circuit board 240; wherein, the wavelength division multiplexer 200 and the variable optical attenuator 203 are only fiber-connected, and the pump light source 201 and the tunable filter 202 are both fiber-connected and electrically connected. The optical fibers of the coherent silicon optical device 23, the optical splitter detector 204, and the tunable laser 24 are coiled in the front fiber bundling plate 6 and are fiber-connected to the optical devices on the reverse side of the circuit board 2 through the first notch 210; the optical fibers coiled in the front fiber bundling plate 6 finally lead out two optical fibers in total to be connected to the optical port adapter 40 of the optical port assembly 4. Among them, there is a certain gap between the tunable laser 24 and the circuit board 2 for the coiled optical fiber to pass under the laser. The wavelength division multiplexer 200, the pump light source 201, the tunable filter 202, and the variable optical attenuator 203 are arranged on the reverse side of the circuit board 2, and the optical fibers of the wavelength division multiplexer 200, the pump light source 201, the tunable filter 202, and the variable optical attenuator 203 are coiled in the reverse fiber bundling plate 7 and are fiber-connected to the optical devices on the front side of the circuit board 2 through the first notch 210. Specifically, in the actual operation process, the optical fibers of the optical devices on the reverse side of the circuit board 2 are first coiled, and finally one optical fiber is led out to be fusion-spliced with the optical fiber on the front side of the circuit board 2.

[0111] In order to be able to install and fix the wavelength division multiplexer 200, the pump light source 201, the tunable filter 202, and the variable optical attenuator 203, avoid the situation of unstable connection in a vibrating environment, and realize the positioning of the optical devices, as Figure 22 and Figure 23 shown, the EDFA module 20 further includes a device mounting block 25, and the device mounting block 25 is fixedly connected to the circuit board 2 by one of gluing or welding; the device mounting block 25 is provided with a first mounting position 250, a second mounting position 251, a third mounting position 252, and a fourth mounting position 253. The wavelength division multiplexer 200 is installed in the first mounting position 250, the pump light source 201 is installed in the second mounting position 251, the tunable filter 202 is installed in the third mounting position 252, and the variable optical attenuator 203 is installed in the fourth mounting position 253. Among them, as Figure 24As shown, a relief groove 254 is provided at the front end of the mounting block, and the relief groove 254 is used to accommodate a part of the optical port adapter 40 structure. The front end of the second mounting position 251 is in a hollowed-out form for realizing the electrical connection between the pump light source 201 and the circuit board 2; the bottom of the third mounting position 252 is in a hollowed-out form as a whole to enable the tunable filter 202 to be in contact with the circuit board 2, so as to reduce the mounting height of the tunable filter 202.

[0112] The reverse side of the circuit board 2 is the area where the optical module EDFA module 20 amplifies the gain function. Limited by the internal space and optical path of the module, the wavelength division multiplexer 200, pump light source 201, tunable filter 202, and variable optical attenuator 203 of the EDFA module 20 are all distributed on the lower layer. The fiber output diameters of the above devices vary from 80μm to 125μm. They are distributed together to form a relatively complete functional unit, which is convenient for optical path connection, device fusion splicing, repair and maintenance, etc. As Figure 25 shown, within a space of approximately 20mm × 13mm × 2mm (the illustrated elliptical fiber coiling area), there are no less than 20 turns of optical fibers, including erbium fibers, fusion rods, and the optical fibers of each optical device. The front side of the circuit board 2 is mainly the fusion splicing between the coherent silicon optical device 23, the tunable laser 24, and the optical port adapter 40 optical fibers. Since the sizes of these optical devices on the upper layer are relatively large, the optical fiber channels are distributed in the limited space on both sides of the devices. This is also the reason why the front fiber bundling board 6 is in a C shape. As Figure 26 shown, the fiber coiling path of the upper-layer optical fibers has a larger perimeter for one turn and relatively fewer coiling turns than the lower layer.

[0113] Combining the above solutions, it is not difficult to see that in the embodiment of the present invention, the main length direction of the optical module is divided into four areas A, B, C, and D, as Figure 27As shown, such a partition setting can maximize the utilization of the limited structural space size while meeting the size requirements of the Microsoft Services Agreement (abbreviated as MSA). Specifically, Area A is located at the very front end of the optical module. This area is the space area for the optical port adapter required in the actual application scenario of the optical module described in the embodiments of the present invention. The structural space on the side of this area is fully utilized and left for the unlocking and rebounding structure of the pull ring assembly 3; Area B is the area where the connector seat 41 fixes the optical port adapter 40, and it is also the area for the assembly positioning and fixing of the upper cover plate 1 and the lower cover plate 5 of the optical module; Area C is a complete rectangular area, which is basically flush with the tail of the optical port adapter 40. Area C is used to place the circuit board 2 for the layout of various optoelectronic components; Area D is located at the tail end of the optical module and is used to limit the circuit board 2. The above four-module structure partitions of A, B, C, and D can leave the maximum space for the circuit board 2 for layout, thereby making the hardware layout of the product more relaxed, conducive to the optimization of hardware and electrical performance, and the smooth realization of the space requirements of multiple optical devices with the EDFA function.

[0114] Embodiment 2:

[0115] Based on the solution provided by the above embodiment, the embodiment of the present invention also provides a fiber coiling method for a small-size packaged coherent communication optical module with an EDFA, which is applicable to the small-size packaged coherent communication optical module with an EDFA described in the above solution, as Figure 28 shown, including:

[0116] In step S1, the optical fibers of the optical devices located on the reverse side of the circuit board 2 are coiled in the reverse side fiber bundling plate 7.

[0117] The optical devices on the reverse side of the circuit board 2 mainly realize the optical module EDFA amplification gain function. Due to the internal space and optical path limitations of the module, the wavelength division multiplexer 200, pump light source 201, tunable filter 202, and variable optical attenuator 203 of the EDFA module are all distributed on the lower layer. The fiber output diameters of these optical devices vary from 80μm to 125μm. They are distributed together to form a relatively complete functional unit, which is convenient for optical path connection, device fusion splicing, repair and maintenance, etc. In a space of about 20mm×13mm×2mm ( Figure 25 the elliptical fiber coiling area shown), there are no less than 20 turns of optical fibers distributed, including erbium fibers, fusion rods, and the optical fibers of each device.

[0118] In step S2, the optical fibers of the optical devices located on the front side of the circuit board 2 are coiled in the front side fiber bundling plate 6.

[0119] For the front side fiber bundling plate 6, as Figure 15As shown, the front fiber bundling board 6 is in a C shape. A first fiber blocking board 61 is further provided on the upper surface of the front fiber bundling board 6. The first fiber blocking board 61 is used to block the optical fiber wound inside the front fiber bundling board 6. A fiber blocking protrusion 62 is provided on the first fiber blocking board 61. The fiber blocking protrusion 62 is used to further prevent the optical fiber from popping out, so that a longer optical fiber can be coiled.

[0120] On the front side of the circuit board 2, mainly the fusion splicing is between the coherent silicon optical device, the tunable laser, and the optical port adapter optical fiber. The sizes of these optical devices are relatively large, and the optical fiber channels are distributed in the limited space on both sides of the device. The circumferential length of one turn of the optical fiber coiling on the front side of the circuit board 2 is larger than that on the back side of the circuit board 2, and the number of coiling turns is relatively fewer.

[0121] In step S3, the optical fiber to be fusion spliced is pulled out from the back fiber bundling board 7, guided from the side of the circuit board 2 to the front side of the circuit board 2, and the optical fiber to be fusion spliced is fusion spliced with the optical fiber to be fusion spliced on the front side of the circuit board 2.

[0122] In step S4, a preset number of optical fibers coiled on the front fiber bundling board 6 are led out to be connected to the optical port assembly 4.

[0123] Among them, in the above steps S1 - S3, the method of fusion splicing multiple optical fibers and finally leading out one or two optical fibers can be to add an optical coupler in the optical device to combine the optical signals of multiple input optical fibers into one output optical fiber, or use a wavelength division multiplexer for the combination of optical signals, or use a fusion splicing method such as a fusion splicing rod to fuse multiple optical fibers. The above methods for combining optical signals are well-known techniques to those skilled in the art and will not be elaborated here.

[0124] In this embodiment, only the QSFP-DD package form is taken as an example to display and describe the structure. The package form and the pull ring unlocking method of OSFP are similar to those of QSFP-DD, and the two only differ in the length, width, and height dimensions, which are also within the scope of protection of this invention.

[0125] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A small-size packaged coherent communication optical module with EDFA, characterized in that: include: An upper cover plate (1), a circuit board (2), an optical port assembly (4), a lower cover plate (5), a front fiber bundle plate (6) and a rear fiber bundle plate (7); the circuit board (2), the optical port assembly (4), the front fiber bundle plate (6) and the rear fiber bundle plate (7) are located in a space formed by the upper cover plate (1) and the lower cover plate (5); The front fiber bundle plate (6) is fixedly arranged on the front side of the circuit board (2), and the back fiber bundle plate (7) is fixedly arranged on the back side of the circuit board (2); an EDFA module (20) is arranged on the circuit board (2), and the EDFA module (20) includes a plurality of optical devices, and the optical devices are arranged on the front side or the back side of the circuit board (2); The optical fibers of the optical devices located on the front side of the circuit board (2) are coiled in the front fiber bundle plate (6), and the optical fibers of the optical devices located on the back side of the circuit board (2) are coiled in the back fiber bundle plate (7); a preset number of optical fibers coiled in the front fiber bundle plate (6) are led out to be connected to the optical port assembly (4).

2. The small-size packaged coherent communication optical module with EDFA according to claim 1, characterized in that: First notches (210) are provided on both sides of the circuit board (2); The first notch (210) is used for leading out optical fibers, so as to facilitate fusing the optical fibers located on the front and back sides of the circuit board (2) together.

3. The small-size packaged coherent communication optical module with EDFA according to claim 2, characterized in that: A fixing protrusion (60) is provided at the bottom of the front fiberboard (6), and the fixing protrusion (60) is fixedly connected to the circuit board (2) by means of gluing or welding; Mounting feet (70) are arranged at the four corners of the bottom of the reverse fiber bundle board (7), and a first preset area (211) is arranged on the circuit board (2), the first preset area (211) is arranged at two ends of the first notch (210), and the mounting feet (70) and the first preset area (211) are fixedly connected by one of gluing or welding.

4. The small-size packaged coherent communication optical module with EDFA according to claim 3, characterized in that: The reverse fiber bundle plate (7) is provided with a second notch (71) matching the first notch (210), and the second notch (71) is used to fuse the optical fibers on the front and back sides of the circuit board (2).

5. The small-size packaged coherent communication optical module with EDFA according to claim 1, characterized in that: The EDFA module (20) comprises a wavelength division multiplexer (200), a pump light source (201), a tunable filter (202) and a variable optical attenuator (203) arranged on the back side of the circuit board (2), and a spectroscopic detector (204) arranged on the front side of the circuit board (2); a digital processor (22), a coherent silicon optical device (23) and an adjustable laser (24) are also arranged on the front side of the circuit board (2); the optical fibers of the wavelength division multiplexer (200), the pump light source (201), the tunable filter (202) and the variable optical attenuator (203) are coiled in the back side fiber bundle plate (7), and the optical fibers of the coherent silicon optical device (23), the spectroscopic detector (204) and the adjustable laser (24) are coiled in the front side fiber bundle plate (6); The front fiber bundle plate (6) is arranged around the digital processor (22), and the tunable laser (24) is electrically connected to a second preset area (212) on the back side of the circuit board (2) via a flexible circuit board (240).

6. The small-size packaged coherent communication optical module with EDFA according to claim 5, characterized in that: The EDFA module (20) further comprises a device mounting block (25), wherein the device mounting block (25) is fixedly connected to the circuit board (2) by means of gluing or welding; a first mounting position (250), a second mounting position (251), a third mounting position (252) and a fourth mounting position (253) are arranged on the device mounting block (25); the wavelength division multiplexer (200) is mounted in the first mounting position (250), the pump light source (201) is mounted in the second mounting position (251), the tunable filter (202) is mounted in the third mounting position (252), and the variable optical attenuator (203) is mounted in the fourth mounting position (253).

7. The small-size packaged coherent communication optical module with EDFA according to claim 6, characterized in that: The front end of the second mounting position (251) is in a hollowed-out shape, and is used to realize the electrical connection between the pump light source (201) and the circuit board (2); the bottom of the third mounting position (252) is in a hollowed-out shape as a whole, and is used to make the tunable filter (202) abut against the circuit board (2), so as to reduce the installation height of the tunable filter (202).

8. The small-size packaged coherent communication optical module with EDFA according to claim 1, characterized in that: The optical module further comprises a pull ring assembly (3), the pull ring assembly (3) comprises a pull ring unit (30), the pull ring unit (30) comprises two fixed arms (300) and a connecting handle (301), the two fixed arms (300) are respectively fixedly connected to the connecting handle (301), the two fixed arms (300) are respectively arranged on the side surfaces of the upper cover plate (1) and the lower cover plate (5), and the pull ring unit (30) is elastically connected to the lower cover plate (5).

9. The small-size packaged coherent communication optical module with EDFA according to claim 8, characterized in that: The pull ring assembly (3) also includes a spring (31) and a fixing pin (32); an accommodating step (50) is provided at one end of the lower cover plate (5) close to the fixing arm (300); the fixing pin (32) is fixedly arranged on the accommodating step (50); a tension spring hook (3000) is processed and arranged at one end of the fixing arm (300); one end of the spring (31) is sleeved and fixed to the fixing pin (32), and the other end is sleeved and fixed to the tension spring hook (3000); the spring (31), the fixing pin (32), the accommodating step (50) and the tension spring hook (3000) are all symmetrically arranged.

10. The small-size packaged coherent communication optical module with EDFA according to claim 9, characterized in that: Corresponding to the position of the tension spring hook (3000), an avoidance step (51) is provided on the lower cover plate (5), and the avoidance step (51) is used to prevent the tension spring hook (3000) from being blocked during the movement.

11. The small-size packaged coherent communication optical module with EDFA according to claim 8, characterized in that: The two fixed arms (300) have a tendency to clamp inward near the ends, and the fixed arms (300) include a first horizontal plane (3001), a second horizontal plane (3002) and a transition slope (3003), and the two ends of the transition slope (3003) are respectively fixedly connected to the first horizontal plane (3001) and the second horizontal plane (3002), and the distance between the second horizontal planes (3002) of the two fixed arms (300) is smaller than the distance between the first horizontal planes (3001); first accommodating grooves (10) are provided on both sides of the upper cover plate (1), and second accommodating grooves (52) are provided on both sides of the lower cover plate (5), and the bottoms of the first accommodating grooves (10) and the second accommodating grooves (52) match the shape of the fixed arms (300); A coupling protrusion (3004) is provided at the end of the second horizontal surface (3002), and a coupling groove (53) is provided on the side wall of the lower cover plate (5), wherein the coupling groove (53) is connected to the second receiving groove (52), and the coupling groove (53) is used to receive the coupling protrusion (3004).

12. The small-size packaged coherent communication optical module with EDFA according to claim 11, characterized in that: A limiting protrusion (3005) is provided at the top of the end of the second horizontal surface (3002), and a limiting groove (100) is provided at the top of the first accommodating groove (10), and the limiting protrusion (3005) is slidably connected to the limiting groove (100).

13. The small-size packaged coherent communication optical module with EDFA according to claim 8, characterized in that: An accommodating position (54) is provided at one end of the lower cover plate (5) close to the connecting handle (301), and the accommodating position (54) is used to install the optical port assembly (4), the optical port assembly (4) comprises an optical port adapter (40) and a connector seat (41), the optical port adapter (40) and the connector seat (41) are relatively fixedly arranged, the connector seat (41) is arranged in the accommodating position (54), and the connector seat (41) is fixedly connected to the lower cover plate (5); A positioning protrusion (540) is fixedly provided at the bottom of the accommodation position (54), a positioning through hole (410) is provided at the bottom of the connector seat (41), and the positioning protrusion (540) is located in the positioning through hole (410).

14. The small-size packaged coherent communication optical module with EDFA according to claim 13, characterized in that: The optical port assembly (4) also includes an optical port pressure plate (42), which covers the upper part of the tail of the optical port adapter (40) and cooperates with the connector seat (41) to fix the optical port adapter (40). The optical port pressure plate (42) is fixedly connected to the connector seat (41) and the lower cover plate (5) by bolts.

15. The small-size packaged coherent communication optical module with EDFA according to claim 14, characterized in that: Mounting wing plates (411) are arranged on both sides of the connector seat (41), and a travel limit plate (412) is arranged at the front end of the connector seat (41); the mounting wing plates (411) and the travel limit plate (412) are integrally formed; a through hole (4110) is arranged on the mounting wing plates (411) for accommodating a fixing pin (32) of the pull ring assembly (3); and the travel limit plate (412) is used to limit the moving distance of the pull ring unit (30).

16. The small-size packaged coherent communication optical module with EDFA according to claim 14, characterized in that: The tail of the connector seat (41) is provided with two first semi-annular grooves (413), the lower surface of the optical port pressure plate (42) is provided with two second semi-annular grooves (420), and the optical port adapter (40) is provided with an annular mounting plate (400), and the first semi-annular groove (413) and the second semi-annular groove (420) are used to install the annular mounting plate (400), so as to fix the optical port adapter (40) between the optical port pressure plate (42) and the connector seat (41).

17. The small-size packaged coherent communication optical module with EDFA according to any one of claims 1 to 16, characterized in that: The upper surface of the front fiber bundle plate (6) is also provided with a first fiber stop plate (61), and the first fiber stop plate (61) is used to stop the optical fiber wound in the front fiber bundle plate (6). The first fiber stop plate (61) is provided with a fiber stop protrusion (62), and the fiber stop protrusion (62) is used to further prevent the optical fiber from popping out.

18. The small-size packaged coherent communication optical module with EDFA according to any one of claims 1 to 16, characterized in that: A closed enclosure (11) and two bosses (12) are provided at the rear of the lower surface of the upper cover plate (1), and the bosses (12) are provided on both sides of the interior of the closed enclosure (11).

19. The small-size packaged coherent communication optical module with EDFA according to any one of claims 1 to 16, characterized in that: The bottom surface of the lower cover plate (5) is provided with a label slot (55), and the label slot (55) and the reverse fiber bundle plate (7) are staggered to avoid regional spatial overlap and interference between the two.

20. A fiber coiling method for a small-size packaged coherent communication optical module with EDFA, applicable to the small-size packaged coherent communication optical module with EDFA according to any one of claims 1 to 19, characterized in that: include: Winding the optical fiber of the optical device located on the reverse side of the circuit board (2) in the reverse side fiber bundle plate (7); Winding the optical fiber of the optical device located on the front side of the circuit board (2) in the front fiber bundle plate (6); Pulling out the optical fiber to be fused from the back fiber bundle plate (7), guiding the optical fiber to be fused from the side of the circuit board (2) to the front of the circuit board (2), and fusing the optical fiber to be fused with the optical fiber to be fused on the front of the circuit board (2); A preset number of optical fibers coiled on the front fiber bundle plate (6) are led out to be connected to the optical port assembly (4).

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